Light-emitting device and light-emitting system comprising same

Abstract

According to one aspect of the present invention, a light-emitting device can be provided, the light-emitting device comprising: a substrate; a light-emitting element disposed on the substrate so as to generate light; a molding layer disposed on the substrate so as to cover the light-emitting element; and a plurality of wavelength conversion particles disposed on the molding layer, wherein the molding layer includes: a first molding region disposed directly above the light-emitting element; and a second molding region disposed on the side of the light-emitting element, and the density of the wavelength conversion particles in the first molding region is greater than the density of the wavelength conversion particles in the second molding region.

Description

Light-emitting device and light-emitting system including the same

[0001] The present invention relates to a light-emitting device and a light-emitting system including the same.

[0002] Recently, Light Emitting Diodes (LEDs) are being widely used. LEDs utilize the properties of compound semiconductors to convert electrical signals into forms of light such as infrared, visible light, and ultraviolet light.

[0003] As the light efficiency of light-emitting diodes increases, light-emitting devices are being applied in various fields, including display devices, lighting fixtures, and vehicles.

[0004] Recently, there has been an increasing need for light-emitting devices that emit light capable of displaying various information.

[0005] Embodiments of the present invention aim to provide a light-emitting device capable of forming three-dimensional images such as shapes, characters, and images, and a light-emitting system including the same.

[0006] In addition, embodiments of the present invention aim to provide a light-emitting device with improved light extraction efficiency and a light-emitting system including the same.

[0007] In addition, embodiments of the present invention aim to provide a light-emitting device with improved contrast ratio and a light-emitting system including the same.

[0008] In addition, embodiments of the present invention aim to provide a light-emitting device with improved reliability and a light-emitting system including the same.

[0009] In addition, embodiments of the present invention aim to provide a light-emitting device with improved image distortion and a light-emitting system including the same.

[0010] In addition, embodiments of the present invention aim to provide a light-emitting device with improved color accuracy and a light-emitting system including the same.

[0011] In addition, embodiments of the present invention aim to provide a light-emitting device with improved surface quality and a light-emitting system including the same.

[0012] According to one aspect of the present invention, a light-emitting device may be provided, comprising: a substrate; a light-emitting element disposed on the substrate and emitting light; a molding layer disposed on the substrate and covering the light-emitting element; and a plurality of wavelength-converting particles disposed on the molding layer, wherein the molding layer comprises a first molding region disposed directly above the light-emitting element; and a second molding region disposed to the side of the light-emitting element, and wherein the density of the wavelength-converting particles in the first molding region is greater than the density of the wavelength-converting particles in the second molding region.

[0013] In addition, a light-emitting device may be provided, wherein the first molding region is an area from the upper surface of the light-emitting element to the upper surface of the molding layer.

[0014] Additionally, a light-emitting device may be provided in which the light-emitting element and the first molding region are formed in a plurality and arranged spaced apart from each other in one direction, and the second molding region is disposed between the plurality of first molding regions.

[0015] Additionally, a light-emitting device may be provided in which the second molding region is positioned such that the surface of the molding layer is placed on the upper surface of the second molding region, and the first molding region and the second molding region have the same thickness.

[0016] Additionally, a light-emitting device may be provided in which the density of the wavelength-converting particles is calculated by the number of wavelength-converting particles disposed on the cut surface or the area of ​​the wavelength-converting particles on the cut surface when the molding layer is cut in a direction passing through the plurality of light-emitting elements arranged in one direction perpendicular to the substrate to form a cut surface.

[0017] Additionally, a light-emitting device may be provided in which the first molding region is arranged to contact the upper surface of the light-emitting element and the upper surface of the molding layer, and the thickness of the second molding region is greater than the thickness of the first molding region.

[0018] Additionally, a light-emitting device may be provided, wherein the second molding region is positioned such that the surface of the molding layer is placed on the upper surface of the second molding region, and the molding layer further includes a third molding region positioned below the second molding region, and the density of the wavelength-converting particles in the third molding region is smaller than the density of the wavelength-converting particles in the first molding region.

[0019] In addition, a light-emitting device may be provided in which the thickness of the third molding region is the same as the thickness of the first molding region.

[0020] Additionally, a light-emitting device may be provided, comprising an electrode pad disposed between the substrate and the light-emitting element, electrically connected to the light-emitting element, and covered by the molding layer, wherein the outer side of the electrode pad is disposed further outward than the side of the light-emitting element, and the molding layer comprises a virtual line extending from the outer side of the electrode pad to the edge of the upper surface of the light-emitting element, a side of the light-emitting element, and a fourth molding region enclosed by the upper surface of the electrode pad, and the density of the wavelength-converting particles in the fourth molding region is greater than the density of the wavelength-converting particles in the second molding region.

[0021] Additionally, a light-emitting device may be provided, comprising: a substrate; a plurality of light-emitting elements disposed on the substrate and generating light; a molding layer disposed on the substrate and covering the plurality of light-emitting elements; and a plurality of wavelength-converting particles disposed on the molding layer, wherein the molding layer comprises: a first molding layer covering the plurality of light-emitting elements and through which light generated from the plurality of light-emitting elements is transmitted; and a second molding layer laminated on the first molding layer and having a lower light transmittance than that of the first molding layer, and wherein the plurality of wavelength-converting particles are disposed on one or more of the first molding layer and the second molding layer.

[0022] Additionally, the molding layer comprises a first molding region disposed directly above the light-emitting element; and a second molding region disposed to the side of the light-emitting element, wherein a portion of the first molding layer and a portion of the second molding layer are disposed within the first molding region, and another portion of the first molding layer and another portion of the second molding layer are disposed within the second molding region, and the density of the wavelength-converting particles in the first molding region is greater than the density of the wavelength-converting particles in the second molding region. A light-emitting device may be provided.

[0023] In addition, a light-emitting device may be provided in which the first molding layer included in the first molding region is formed convexly upward.

[0024] Additionally, a light-emitting device may be provided in which the thickness of any part of the second molding layer in the first molding region is smaller than the thickness of the other part of the second molding layer in the second molding region.

[0025] Additionally, a light-emitting device may be provided in which the light transmittance in the second molding layer disposed within the first molding region is greater than the light transmittance in the second molding layer disposed within the second molding region.

[0026] In addition, a light-emitting device may be provided in which the thickness of the first molding layer is greater than the thickness of the second molding layer.

[0027] Additionally, a light-emitting device may be provided, comprising: a substrate; a light-emitting element disposed on the substrate and emitting light; a reflective layer disposed on the substrate and disposed to the side of the light-emitting element and reflecting light toward the light-emitting element; a molding layer covering the upper side of the reflective layer and the light-emitting element; and a plurality of wavelength-converting particles disposed on the molding layer, wherein the molding layer comprises a first molding region disposed directly above the light-emitting element; and a second molding region disposed directly above the reflective layer, and wherein the density of the wavelength-converting particles in the first molding region is greater than the density of the wavelength-converting particles in the second molding region.

[0028] Additionally, a light-emitting device may be provided, comprising: a reflection area disposed on the side of the light-emitting element and reflecting light toward the light-emitting element; and an absorption layer that covers the reflection area and is disposed on the lower side of the molding layer and absorbs light.

[0029] In addition, a light-emitting device may be provided in which the thickness of the reflection area is greater than the thickness of the absorption layer.

[0030] In addition, a light-emitting device may be provided in which the reflectance of the reflection area is greater than the reflectance of the molding layer.

[0031] In addition, a light-emitting device may be provided in which the light-emitting elements are formed in multiple numbers, and the lower surface of the molding layer is bent downward so as to be positioned lower than the upper portion of the multiple light-emitting elements between the multiple light-emitting elements.

[0032] In one embodiment of the present invention, the density of wavelength-converting particles in the region directly above the light-emitting element can be formed to be greater than the density in other regions of the molding layer, so the wavelength of light generated from the light-emitting element can be efficiently changed.

[0033] In addition, one embodiment of the present invention has the effect that the density of wavelength-converting particles in the region directly above the light-emitting element can be formed to be greater than the density in other regions of the molding layer, thereby enabling distinct brightness ratio and contrast.

[0034] In addition, one embodiment of the present invention has the effect of clearly forming a contrast ratio and contrast because the light transmittance of the molding layer located directly above a plurality of light-emitting elements can be formed high, and the light transmittance of the molding layer located between the plurality of light-emitting elements can be formed low.

[0035] In addition, since the reflective layer can reduce light interference between a plurality of light-emitting elements, the effect is that the contrast ratio and contrast can be clearly formed.

[0036] In addition, since the reflective layer can reflect light toward the light-emitting element, the light extraction efficiency can be increased in one embodiment of the present invention.

[0037] In addition, since light can be absorbed in the light-absorbing layer, the light between adjacent light-emitting elements can be prevented from mixing with each other, and the color distinction between light-emitting elements can be made clearer.

[0038] FIG. 1 is a perspective view of a first example of a light-emitting system including a light-emitting device according to a first embodiment of the present invention.

[0039] FIG. 2 is a perspective view of a second example of a light-emitting system including a light-emitting device according to a first embodiment of the present invention.

[0040] FIG. 3 is a drawing showing the appearance of a light-emitting device according to the first embodiment of the present invention.

[0041] FIG. 4 is a drawing showing the appearance of a light-emitting device according to a second embodiment of the present invention.

[0042] FIG. 5 is a drawing showing the appearance of a light-emitting device according to a third embodiment of the present invention.

[0043] FIG. 6 is a drawing showing the appearance of a light-emitting device according to the fourth embodiment of the present invention.

[0044] In the following description, numerous specific details are described for the purpose of explanation and to provide a complete understanding of the various embodiments or implementations of the present disclosure. As used herein, “Embodiments” and “Implementations” are interchangeable terms indicating non-limiting examples of devices or methods utilizing one or more of the concepts of the invention disclosed herein. However, it will be apparent that various embodiments may be implemented without utilizing these specific details or by utilizing one or more equivalent arrangements. In other examples, known structures and devices are illustrated in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, while various embodiments may differ from one another, they do not need to be exclusive. For example, specific shapes, configurations, and characteristics of an embodiment may be used or implemented in other embodiments without departing from the scope of the concept of the invention.

[0045] Unless otherwise specified, the illustrated embodiments should be understood as providing exemplary features of varying details in some ways in which the concept of the present invention can actually be realized. Therefore, unless otherwise specified, features, components, modules, layers, membranes, panels, regions and / or modes of various embodiments (hereinafter referred to individually or collectively as “elements”) may be combined, separated, interchanged, and / or rearranged differently without departing from the scope of the concept of the present invention.

[0046] The use of cross-hatching and / or shading in the attached drawings is generally provided to clarify the boundaries between adjacent elements. As such, the presence or absence of cross-hatching or shading, unless otherwise specified, does not imply or indicate any preference or requirement regarding the specific material, material properties, dimensions, proportions, commonalities between the exemplified elements, or any other features, attributes, and characteristics of the elements. Additionally, in the attached drawings, the size and relative size of the elements may be exaggerated for clarity and / or illustrative purposes. When embodiments are implemented differently, specific process sequences may be performed differently from the described order. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the described order. Also, the same reference numerals indicate the same elements.

[0047] When an element such as a layer is referred to as being "on", "connected to," or "coupled to" another element or layer, said element may be directly on, connected to, or coupled to the other element or layer, or an interposed element or layer may exist. However, when an element or layer is referred to as being "directly on", "directly connected to," or "directly coupled to" another element or layer, no interposed element or layer exists. To this end, the term "connected" may refer to a physical, electrical, and / or fluid connection with or without an interposed element. Furthermore, the DR1-axis, DR2-axis, and DR3-axis are not limited to the three axes of an orthogonal coordinate system, such as the x, y, and z axes, and may be interpreted in a broader sense. For example, the DR1-axis, DR2-axis, and DR3-axis may be perpendicular to each other, or they may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “one or more of X, Y, and Z” and “one or more selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed articles.

[0048] Although terms such as “first,” “second,” etc., may be used herein to describe various forms of elements, these elements shall not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be named the second element without departing from the teachings of the present disclosure.

[0049] Spatially relative terms such as “below,” “under,” “immediately below,” “lower,” “above,” “upper,” “upper,” “higher,” and “side” (e.g., as in “side wall”) may be used for descriptive purposes and thereby to describe the relationship between one element and another element(s) as illustrated in the drawings. Spatially relative terms are intended to include different orientations of the device in use, operation, and / or manufacture in addition to the orientations illustrated in the drawings. For example, if the device in the drawings is inverted, the element described as “below” or “under” another element or feature will be oriented “above” the other element or feature. Therefore, the exemplary term “below” may include both upper and lower orientations. Additionally, the device may be oriented differently (e.g., rotated 90° or oriented in a different orientation), and thus, spatially relative descriptors used herein may also be interpreted accordingly.

[0050] The technical terms used in this specification are intended to describe specific embodiments and are not limiting. The singular form used in this specification also includes the plural form unless the context clearly indicates otherwise. Additionally, the terms “comprising,” “comprising,” “comprising,” and / or “comprising” used in this specification specify the presence of the mentioned features, integers, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Furthermore, the terms “substantially,” “about,” and other similar terms used in this specification are used to indicate approximation rather than degree, and are used to describe inherent deviations of measured, calculated, and / or provided values ​​that may be recognized by a person of ordinary knowledge in the art.

[0051] Various embodiments are described below with reference to cross-sectional and / or exploded drawings, which are schematic examples of idealized embodiments and / or intermediate structures. As such, variations from the shapes in the drawings may be expected, for example, as a result of manufacturing techniques and / or tolerances. Therefore, the embodiments disclosed herein should not be interpreted as being limited to the shapes of specific illustrated regions, but should be interpreted to include, for example, deviations in shape resulting from manufacturing. In this way, the regions illustrated in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and thus are not intended to have a limiting meaning.

[0052] As is customary in the art, some embodiments may be illustrated and described in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits, such as logic circuits, discrete components, microprocessors, wiring circuits, memory elements, and wiring connections, formed using semiconductor-based manufacturing technology or other manufacturing technology. Where blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and may optionally be driven by firmware and / or software. Additionally, each block, unit, and / or module may be implemented by dedicated hardware, or as a combination of dedicated hardware for performing some functions and a processor for performing other functions (e.g., one or more programmed processors and associated circuits). Additionally, each of the blocks, units, and / or modules of some embodiments may be physically separated into two or more interacting and individual blocks, units, and / or modules without departing from the scope of the concept of the present invention. Additionally, the blocks, units, and / or modules of some embodiments may be physically combined into more complex blocks, units, and / or modules without departing from the scope of the concept of the present invention.

[0053] Unless otherwise defined, all terms used herein (including technical or scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with that meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this specification.

[0054] Hereinafter, a light-emitting device (10) according to the first embodiment of the present invention and a light-emitting system (1) including the same will be described.

[0055] The light-emitting system (1) may be a display device of FIG. 1 or a vehicle lamp of FIG. 2, but is not limited thereto. The light-emitting system (1) may include a light-emitting device (10) and a frame (20). Additionally, depending on the size of the light-emitting system (1), it may include a plurality of light-emitting devices (10).

[0056] The light-emitting system (1) of FIG. 1 is a display device and may include one or more light-emitting devices (10) including a plurality of light-emitting elements (200) to be described later. The light-emitting system (1) can display information and output various visual content.

[0057] A frame (20) may be placed on the outside of the light-emitting system (1). Electrical wiring may be added to a portion of the frame (20) so that the light-emitting system (1) is electrically connected to an external power source and the operation of the light-emitting system (1) can be controlled according to an electrical signal. Additionally, the light-emitting system (1) can be controlled according to an external signal and operated in various ways.

[0058] The frame (20) can serve to reinforce the strength of the light-emitting system (1) and may be made of a material with higher strength than the substrate (100) of the light-emitting device (10) described later. This frame (20) may also be utilized as a structural support connecting different light-emitting devices (10). Various materials may be used for the frame (20) depending on mechanical strength, processability, etc. For example, the frame (20) may include metal materials such as aluminum, stainless steel, copper, etc. As another example, the frame (20) may include polymer materials such as polycarbonate, acrylic, polyamide, ABS, carbon fiber reinforced plastic, glass fiber reinforced plastic, ceramic.

[0059] Additionally, the frame (20) may be manufactured in a form that surrounds the light-emitting device (10) to reinforce the strength of the light-emitting system (1), but is not limited thereto. The frame (20) may also be placed on only one side of the light-emitting device (10) to reduce the area of ​​the light-emitting system (1).

[0060] Additionally, the light-emitting system (1) may further include a diffusion plate and a plurality of optical sheets. A display panel may be disposed on one side of the optical sheet. The display panel is not particularly limited. For example, the display panel may be a liquid crystal display panel including a liquid crystal layer. Additionally, a gate driving PCB that supplies a driving signal to a gate line and a data driving PCB that supplies a driving signal to a data line may be provided at the edge of the display panel.

[0061] The light-emitting system (1) can be configured not only as a display device but also as a vehicle light source. The light-emitting system (1) of the present invention can improve the chromatic aberration of the vehicle light source by varying the density of wavelength-converting particles (400) for each region, which will be described later. In particular, in a light-emitting system (1) that requires region-specific driving, such as a smart headlamp, it is possible to reduce cross-talk for each projection region and realize a clear projection image.

[0062] Additionally, the light-emitting device (10) can display characters, symbols, images, or video. Additionally, the light-emitting device (10) can be mounted on a vehicle. In other words, the light-emitting device (10) can be included in a taillight, headlight, grille lamp, rear lamp, tail lamp, interior light, etc. Additionally, the light-emitting device (10) can reduce light interference between a plurality of light-emitting elements (200) and minimize interference between driving areas to have a distinct contrast ratio and can realize a high-quality display device with distinct contrast.

[0063] Referring further to FIG. 3, the light-emitting device (10) may include a substrate (100), a light-emitting element (200), an electrode pad (300), a wavelength-converting particle (400), and a molding layer (500).

[0064] A plurality of light-emitting elements (200), electrode pads (300), and a molding layer (500) may be disposed on the substrate (100). For example, the substrate (100) may be a printed circuit board (PCB) substrate on which an electrical circuit is printed. Additionally, the substrate (100) may be a thin-film transistor (TFT) backplane. The substrate (100) may include an alloy composed of one or more of Cu, Zn, Au, Ni, Al, Mg, Cd, Be, W, Mo, Si, Ag, and Fe, or a portion thereof, which has thermal conductivity, thereby increasing thermal and electrical conductivity. However, this is merely an example, and the substrate (100) may include one or more insulating materials such as FR1, CEM-1, FR-4, PMMA, PCT, and PPA, thereby preventing short circuits between each circuit. Here, FR1 is a material in which copper foil and laminate paper are laminated, and CEM-1 is a material in which copper foil, glass fiber fabric, laminate paper, and glass fiber fabric are sequentially laminated. Additionally, FR-4 is a material in which copper foil and glass fiber fabric or glass fiber fabric are laminated. Furthermore, the substrate (100) may include ceramics such as alumina (Al2O3), aluminum nitride (AlN), and ZTA (Zirconia Toughened Alumina).

[0065] A light-emitting element (200) can generate light. A plurality of light-emitting elements (200) may be formed and spaced apart from each other in one direction and placed on a substrate (100). These plurality of light-emitting elements (200) are electrically connected to an electrical circuit of the substrate (100) and can generate light by receiving electricity from the outside through the electrical circuit. For example, a plurality of light-emitting elements (200) may be arranged in N rows and M columns, each generating light. The number of rows N and the number of columns M of the plurality of light-emitting elements (200) may be the same or different. The plurality of light-emitting elements (200) may generate light of different colors or light of the same color. For example, each light-emitting element (200) may generate blue, green, red, white light, UV light, etc.

[0066] Each of the plurality of light-emitting elements (200) may include a first conductivity type semiconductor layer (210), an active layer (220), a second conductivity type semiconductor layer (230), and a transparent layer (240).

[0067] The first conductivity semiconductor layer (210) is a semiconductor layer having opposite polarity to the second conductivity semiconductor layer (230). The first conductivity semiconductor layer (210) may contain p-type impurities (e.g., Mg, Sr, Ba). In this case, the first conductivity semiconductor layer (210) may be a p-type semiconductor layer. However, this is merely an example, and the first conductivity semiconductor layer (210) may contain n-type impurities.

[0068] The active layer (220) can be laminated onto the first conductive semiconductor layer (210). In other words, the active layer (220) can be located between the first conductive semiconductor layer (210) and the second conductive semiconductor layer (230). Additionally, the first conductive semiconductor layer (210) and the active layer (220) may form a mesa. Furthermore, the active layer (220) can be positioned above the center of the light-emitting element (200). Due to this active layer (220), the vertical length of the first conductive semiconductor layer (210) can be formed to be greater than the vertical length of the second conductive semiconductor layer (230).

[0069] The second conductivity semiconductor layer (230) may be laminated onto the active layer (220). The second conductivity semiconductor layer (230) may contain n-type impurities (e.g., Si, Ge, Sn), and in this case, the second conductivity semiconductor layer (230) may be an n-type semiconductor layer. However, this is merely an example, and the second conductivity semiconductor layer (230) may contain p-type impurities. Light generated in the active layer (220) may pass through the second conductivity semiconductor layer (230) and be emitted to the outside.

[0070] The transparent layer (240) may be laminated onto the second conductive semiconductor layer (230). The transparent layer (240) may be an insulating or conductive substrate, or an insulating or conductive substrate joined by bonding. Additionally, the transparent layer (240) may be an insulating or conductive substrate for growing the first conductive semiconductor layer (210), the active layer (220), and the second conductive semiconductor layer (230). For example, the transparent layer (240) may include one or more of a silicon carbide substrate, a silicon substrate, a gallium nitride substrate, an aluminum nitride substrate, a sapphire substrate, and an insulation patterned sapphire substrate (IPSS).

[0071] The electrode pad (300) is positioned between the substrate (100) and a plurality of light-emitting elements (200) and can be electrically connected to each of the light-emitting elements (200). When viewed from above, the outer side of the electrode pad (300) may be positioned further outward than the side of the light-emitting element (200). Such an electrode pad (300) may include a first electrode pad (310) and a second electrode pad (320).

[0072] The first electrode pad (310) is disposed on a substrate and can be electrically connected to the first conductive semiconductor layer (210). The outer side of the first electrode pad (310) can be disposed further outward than one side of the light-emitting element (200) when viewed from the top.

[0073] The second electrode pad (320) is disposed on the substrate so as to be spaced apart from the first electrode pad (310) in one direction and can be electrically connected to the second conductive semiconductor layer (230). The outer side of the first electrode pad (310) may be disposed further outward than the other side opposite to one side of the light-emitting element (200) when viewed from the top.

[0074] The wavelength conversion particle (400) can absorb light emitted from the light-emitting element (200) and excite it into light of a different wavelength. The wavelength conversion particle (400) may include phosphor particles, quantum dots, organic dyes, etc. The wavelength conversion particle (400) may be placed in the molding layer (500). For example, the wavelength-converting particle (400) may be a fluoride-based phosphor represented by (Ba, Sr, Ca)2SiO4:Eu2+, YAG((Y, Gd)3(Al, Ga)5O12:Ce3+) series phosphor, TAG((Tb, Gd)3(Al, Ga)5O12:Ce3+) series phosphor, (Ba, Sr, Ca)3SiO5:Eu2+, (Ba, Sr, Ca)MgSi2O6:Eu2+, Mn2+, (Ba, Sr, Ca)3MgSi2O8:Eu2+, Mn2+, and (Ba, Sr, Ca)MgSiO4:Eu2+, Mn2+, or A2MF6:Mn4+, where A can be Li, Na, K, Ba, Rb, Cs, Mg, Ca, Se, or Zn. There is, and M may be one or more selected from the group consisting of Ti, Si, Zr, Sn, or Ge. Such wavelength-converting particles (400) can emit excitation light such as green, yellow, blue, red, or white. The excitation light can emit a peak wavelength in a wavelength range longer than the peak wavelength of the light emitted from the light-emitting element (200). In addition, the excitation light can have a full width at half maximum wider than the wavelength emitted from the light-emitting element (200). Through this, light of a wide color gamut can be expressed.

[0075] The molding layer (500) is placed on the substrate (100) and can cover a plurality of light-emitting elements (200) and electrode pads (300). The molding layer (500) can be made of silicone resins such as methyl silicone and phenyl silicone, as well as organic materials such as fluoropolymer, epoxy, polyphthalamide (PPA), polybutylene terephthalate (PBT), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and fluoropolymer. In addition, it can be made of inorganic-based transparent materials such as ceramic or glass.

[0076] Additionally, the molding layer (500) can be made of various thermosetting resins, such as epoxy, polyimide, phenolic resin, and silicone, including materials in A-stage, B-stage, and C-stage states. The A-stage is a state where the resin is in a liquid state and has complete fluidity, making it suitable for initial mixing and molding operations. The B-stage is a partially cured state where the material has some strength and allows for additional molding or lamination. The C-stage is a fully cured state where further molding is impossible but provides very high mechanical strength and stability. Through this, the molding layer (500) can prevent external impact on the product, enhance mechanical strength, increase environmental reliability, and contribute to reducing process difficulty.

[0077] Additionally, wavelength conversion particles (400) may be disposed in the molding layer (500). The density of wavelength conversion particles (400) disposed in the molding layer (500) can be calculated by the number of wavelength conversion particles (400) disposed in the cut surface or the area of ​​the wavelength conversion particles (400) in the cut surface when the molding layer (500) is cut in a direction passing through the center of each of the plurality of light-emitting elements (200) arranged in one direction perpendicular to the substrate (100) to form a cut surface. The molding layer (500) may include a first molding region (500a), a second molding region (500b), a third molding region (500c), and a fourth molding region (500d).

[0078] The first molding region (500a) may be a region positioned directly above each of the plurality of light-emitting elements (200). A plurality of wavelength-converting particles (400) may be positioned in the first molding region (500a). The lower surface of the first molding region (500a) may be the lower surface of the molding layer (500) located on the upper surface of the light-emitting element (200), and the upper surface of the first molding region (500a) may be the upper surface of the molding layer (500). In other words, the first molding region (500a) may be a region extending from the upper surface of the light-emitting element (200) to the upper surface of the molding layer (500). The density of wavelength-converting particles (400) in the first molding region (500a) can be formed to be greater than the density of wavelength-converting particles (400) in the second molding region (500b), the third molding region (500c), and the fourth molding region (500d). The density of wavelength-converting particles (400) in the first molding region (500a) can be calculated as the number of wavelength-converting particles (400) placed on the first cut surface or the area of ​​the wavelength-converting particles (400) relative to the total area of ​​the first cut surface when the first molding region (500a) is cut in a direction passing through at least two cross-sections of a plurality of light-emitting elements (200) arranged in one direction perpendicular to the substrate (100) to form the first cut surface of the first molding region (500a). The density of the wavelength-converting particles (400) in the first molding region (500a) may be 20% to 30% relative to the total area of ​​the first cross-section.

[0079] The wavelength-converting particle (400) placed in the first molding region (500a) can be placed closer to the upper surface of the light-emitting element (200) than to the upper surface of the molding layer (500).

[0080] The second molding region (500b) may be disposed in a lateral region between a plurality of light-emitting elements (200). Additionally, the second molding region (500b) may be disposed between a plurality of first molding regions (500a). The thickness of this second molding region (500b) may be formed differently from the thickness of the first molding region (500a). In other words, the thickness of the second molding region (500b) may be formed to be greater than the thickness of the first molding region (500a). Furthermore, the lower surface of the second molding region (500b) may be disposed further below the lower surface of the transparent layer (240) of the light-emitting element (200), but is not limited thereto. In another embodiment, the thickness of the second molding region (500b) and the thickness of the first molding region (500a) may be formed to be the same. The upper surface of the second molding region (500b) may be the upper surface of the molding layer (500). Additionally, the lower surface of the second molding region (500b) may be the upper surface of the third molding region (500c). In other words, the second molding region (500b) may be the area from the upper surface of the third molding region (500c) to the upper surface of the molding layer (500). However, it is not limited thereto, and the lower surface of the second molding region (500b) may be spaced apart from the upper surface of the third molding region (500c).

[0081] The density of wavelength-converting particles (400) in the second molding region (500b) may be formed to be smaller than the density of wavelength-converting particles (400) in the first molding region (500a). The density of wavelength-converting particles (400) in the second molding region (500b) may be calculated as the number of wavelength-converting particles (400) placed on the second cut surface or the area of ​​wavelength-converting particles (400) relative to the total area of ​​the second cut surface when the second molding region (500b) is cut in a direction passing through at least two cross-sections of a plurality of light-emitting elements (200) arranged in one direction perpendicular to the substrate (100) to form a second cut surface of the second molding region (500b). The density of wavelength-converting particles (400) in the second molding region (500b) may be 10% to 20% relative to the total area of ​​the second cut surface.

[0082] The third molding region (500c) may be positioned between a plurality of light-emitting elements (200) and positioned lower than the second molding region (500b). The upper side of the third molding region (500c) may be positioned in an area that is one-third the height of the light-emitting element (200). The upper side of the third molding region (500c) may be positioned lower than the upper surface of the transparent layer (240). The upper side of the third molding region (500c) may be in contact with the lower side of the second molding region (500b). Additionally, the lower surface of the third molding region (500c) may be positioned on the upper surface of the electrode pad (300). In other words, the third molding region (500c) may be an area from the upper surface of the electrode pad (300) to the lower surface of the second molding region (500b). However, this is not limited thereto, and the upper side of the third molding area (500c) and the lower side of the second molding area (500b) may be spaced apart from each other.

[0083] The thickness of the third molding region (500c) may be the same as the thickness of the first molding region (500a). The density of the wavelength-converting particles (400) in this third molding region (500c) may be smaller than the density of the wavelength-converting particles (400) in the first molding region (500a). Through the wavelength-converting particles (400) in the third molding region (500c), the excitation efficiency of the light emitted from the upper surface of the light-emitting element (200) can be increased compared to the excitation efficiency of the light emitted from the side of the light-emitting element (200), thereby reducing chromatic aberration. The density of wavelength-converting particles (400) in the third molding region (500c) can be calculated as the number of wavelength-converting particles (400) disposed on the third cut surface or the area of ​​the wavelength-converting particles (400) relative to the total area of ​​the third cut surface when the third molding region (500c) is cut in a direction passing through at least two cross-sections of a plurality of light-emitting elements (200) arranged in one direction perpendicular to the substrate (100) to form a third cut surface of the third molding region (500c). The density of wavelength-converting particles (400) in the third molding region (500c) may be 10% to 20% relative to the total area of ​​the third cut surface.

[0084] Additionally, the density of the wavelength-converting particles (400) in the third molding region (500c) may be equal to or smaller than the density of the wavelength-converting particles (400) in the second molding region (500b). Through the wavelength-converting particles (400) in the third molding region (500c), the excitation efficiency of the light emitted to the side of the light-emitting element (200) can be adjusted to reduce chromatic aberration.

[0085] The fourth molding region (500d) may be an area enclosed by a virtual line extending to the edge of the upper surface of the electrode pad (300) and the light-emitting element (200), the side of the light-emitting element (200), and the upper surface of the electrode pad (300). For example, the fourth molding region (500d) may be an area formed by a virtual first virtual line connecting one side of the upper surface of the light-emitting element (200) and the outer side of the first electrode pad (310), and the upper surface of the first electrode pad (310) and one side of the light-emitting element (200). As another example, the fourth molding region (500d) may be an area formed by a virtual second virtual line connecting the other side opposite to one side of the upper surface of the light-emitting element (200) and the outer side of the second electrode pad (320), and the upper surface of the second electrode pad (320) and the other side opposite to one side of the light-emitting element (200). At least a portion of the fourth molding region (500d) may overlap with the third molding region (500c).

[0086] The density of wavelength-converting particles (400) in this fourth molding region (500d) can be formed to be greater than the density of wavelength-converting particles (400) in one or more of the second molding region (500b) and the third molding region (500c). Through the wavelength-converting particles (400) in the fourth molding region (500d), the excitation efficiency of light emitted to a side region close to the light-emitting element (200) can be adjusted to improve chromatic aberration. The density of wavelength-converting particles (400) in the fourth molding region (500d) can be calculated as the number of wavelength-converting particles (400) disposed on the fourth cut surface or the area of ​​the wavelength-converting particles (400) relative to the total area of ​​the fourth cut surface when the fourth molding region (500d) is cut in a direction passing through at least two cross-sections of a plurality of light-emitting elements (200) arranged in one direction perpendicular to the substrate (100) to form a fourth cut surface of the fourth molding region (500d). The density of wavelength-converting particles (400) in the fourth molding region (500d) may be 10% to 20% relative to the total area of ​​the fourth cut surface.

[0087] Hereinafter, the operation and effects of a light-emitting device (10) and a light-emitting system (1) including the same according to the first embodiment of the present invention will be described.

[0088] Light generated from the light-emitting element (200) of the light-emitting device (10) according to the first embodiment of the present invention can be absorbed by the wavelength-converting particle (400). The wavelength-converting particle (400) can emit the absorbed light as light of a different wavelength. The light emitted from the wavelength-converting particle (400) can pass through the molding layer (500) and be emitted to the outside.

[0089] Since the density of wavelength-converting particles (400) in the region directly above the light-emitting element (200) of the molding layer (500) of the light-emitting device (10) can be formed to be greater than the density in other regions of the molding layer (500), the wavelength of light generated from the light-emitting element (200) can be efficiently changed.

[0090] In addition, since the density of wavelength-converting particles (400) in the region directly above the light-emitting element (200) can be formed to be greater than the density in other regions of the molding layer (500), the contrast ratio and contrast of the light emitted from the wavelength-converting particles (400) can be increased.

[0091] Hereinafter, with reference to FIG. 4, a light-emitting device (10) according to a second embodiment of the present invention will be described. In describing the second embodiment, there is a difference in that the molding layer (500) includes a first molding layer (510) and a second molding layer (520), and this difference will be explained mainly.

[0092] The wavelength-converting particles (400) may be placed in one or more of the first molding layer (510) and the second molding layer (520).

[0093] A first molding layer (510) is disposed on a substrate (100) and can cover a plurality of light-emitting elements (200) and a plurality of electrode pads (300). An area of ​​the first molding layer (510) disposed directly above a plurality of light-emitting elements (200) may be included in a first molding area (500a). An area of ​​the first molding layer (510) may be included in a second molding area (500b) disposed between a plurality of first molding areas (500a). An area of ​​the first molding layer (510) disposed below a second molding area (500b) may be included in a third molding area (500c). Additionally, at least a portion of an area of ​​the first molding layer (510) disposed on the side of a light-emitting element (200) may be included in a fourth molding area (500d).

[0094] The thickness of the first molding layer (510) may be formed to be greater than the thickness of the second molding layer (520). At least a portion of the upper surface of the first molding layer (510) may be formed to be convex upward. In other words, the upper surface of the first molding layer (510) located in the first molding region (500a) may be formed to be convex upward. The distance between the upper surface of the first molding layer (510) in the first molding region (500a) and the upper surface of the second molding layer (520) may be smaller than the distance between the upper surface of the first molding layer (510) and the upper surface of the second molding layer (520) in the second molding region (500b). Through this first molding layer (510), the optical path can be adjusted.

[0095] The second molding layer (520) may be laminated onto the first molding layer (510). The second molding layer (520) may have a lower light transmittance than the first molding layer (510). Additionally, the second molding layer (520) may absorb light. The color of the second molding layer (520) may be black. Among the second molding layer (520), a plurality of areas positioned directly above it may be included in the first molding area (500a). Among the second molding layer (520), an area positioned between the plurality of first molding areas (500a) may be included in the second molding area (500b). The thickness of the second molding layer (520) in the first molding area (500a) may be smaller than the thickness of the second molding layer (520) in the second molding area (500b). Through the first molding area (500a), the contrast can be increased while reducing the decrease in light intensity.

[0096] The lower surface of the second molding layer (520) may be positioned higher than the lower side of the first molding region (500a). At least a portion of the lower surface of the second molding layer (520) in the second molding region (500b) may be formed convexly downward. The light emitted between the light-emitting elements (200) can be adjusted by the lower surface of the second molding layer (520), thereby increasing color purity.

[0097] The transmittance of light passing through the second molding layer (520) included in the first molding region (500a) may be greater than the transmittance of light passing through the second molding layer (520) included in the second molding region (500b). With such transmittance, the decrease in light intensity can be reduced while increasing contrast.

[0098] Hereinafter, the operation and effect of the light-emitting device (10) according to the second embodiment of the present invention will be described.

[0099] Light emitted from the wavelength conversion particle (400) of the light-emitting device (10) according to the second embodiment of the present invention can sequentially penetrate the first molding layer (510) and the second molding layer (520).

[0100] Due to this molding layer (500), the light transmittance in the first molding region (500a) can be formed to be greater than the light transmittance in the second molding region (500b), so the contrast ratio and contrast of the light-emitting device (10) can be increased.

[0101] Hereinafter, with reference to FIG. 5, a light-emitting device (10) according to a third embodiment of the present invention will be described. In describing the third embodiment, there is a difference in that the light-emitting device (10) further includes a reflective layer (600), and this difference will be explained mainly.

[0102] A reflective layer (600) is disposed on a substrate (100) such that it is positioned to the side of a plurality of light-emitting elements (200), and can reflect light irradiated laterally from the plurality of light-emitting elements (200) toward the plurality of light-emitting elements (200). For example, the reflective layer (600) can be positioned between the plurality of light-emitting elements (200). Additionally, the reflective layer (600) can be formed in multiple layers and positioned on the outside of the plurality of light-emitting elements (200). Light can be reflected from the side of the reflective layer (600). Therefore, light irradiated laterally by the reflective layer (600) can be reflected upward, thereby increasing light extraction efficiency, and since light can be absorbed from the upper side, contrast can be increased. The upper surface of the reflective layer (600) may be bent downward so as to be positioned lower than the lower surface of the plurality of light-emitting elements (200) between the plurality of light-emitting elements (200). The reflective layer (600) may be formed such that its thickness decreases toward the center. The thickness of the reflective layer (600) may increase toward the light-emitting elements (200) from the center.

[0103] Additionally, the reflective layer (600) is positioned to contact one or more sides of a plurality of light-emitting elements (200) so as to reflect light toward one or more of the plurality of light-emitting elements (200). For example, the color of the reflective layer (600) may be white. The reflectance of the reflective layer (600) may be formed to be greater than the reflectance of the transparent layer (240). Light reflected from such a reflective layer (600) may pass through the light-emitting elements (200). The reflective layer (600) may include acrylic, silicone, epoxy-based materials, fillers to increase reflectivity, etc. The filler may include one or more of TiO2, Al₂O₃, and SiO2. Additionally, the filler may include high-reflection polymers (PTFE, PMMA), magnesium oxide (MgO), etc. Additionally, the reflective layer (600) may include a hollow filler containing an air layer inside the filler to increase light extraction efficiency by diversifying the path of side light. When a hollow filler is included, the density of the reflective layer (600) may be lower than the density of other regions. Additionally, the reflective layer (600) may include carbon.

[0104] Additionally, the reflective layer (600) may be configured such that the color of the reflective layer (600) viewed from above and the color of the reflective layer (600) viewed from the side are different. The brightness of the reflective layer (600) viewed from above may be lower than the brightness of the reflective layer viewed from the side. The color of the reflective layer (600) viewed from above may be black. Light may be absorbed from the upper side of the reflective layer (600). Additionally, the color of the reflective layer (600) viewed from the side may be transparent or white. Through such a reflective layer (600), both light extraction efficiency and contrast can be improved.

[0105] Hereinafter, the operation and effect of the light-emitting device (10) according to the third embodiment of the present invention will be described.

[0106] Light generated from a plurality of light-emitting elements (200) according to the third embodiment of the present invention may be irradiated upward or irradiated sideways. A reflective layer (600) is disposed on the side of a plurality of light-emitting elements (200) and can reflect light irradiated sideways toward the light-emitting elements (200). The light reflected from this reflective layer (600) can pass through the light-emitting elements (200) and the molding layer (500), and its wavelength may be changed by wavelength-converting particles (400).

[0107] With this reflective layer (600), light interference between multiple light-emitting elements (200) can be reduced, so that a contrast ratio and contrast can be clearly formed.

[0108] In addition, since the reflective layer (600) can reflect light toward the light-emitting element (200), the light extraction efficiency can be increased.

[0109] Hereinafter, with reference to FIG. 6, a light-emitting device (10) according to the fourth embodiment of the present invention will be described. In describing the fourth embodiment, there is a difference in that the light-emitting device (10) further includes an absorption layer (700), and this difference will be explained mainly.

[0110] The light-absorbing layer (700) can absorb light. The light-absorbing layer (700) can be positioned above the reflection layer (600) to cover the reflection layer (600). The thickness of the light-absorbing layer (700) can also be formed to be smaller than the thickness of the reflection layer (600). In other words, the area of ​​the side of the light-emitting element (200) that is in contact with the reflection layer (600) can be formed to be larger than the area of ​​the side of the light-emitting element (200) that is in contact with the light-absorbing layer (700). The light-absorbing layer (700) can be extended along the upper surface shape of the reflection layer (600).

[0111] This light-absorbing layer (700) can prevent the reflection layer (600) from being exposed when viewed from above. The color of the light-absorbing layer (700) may be black. For example, the light-absorbing layer (700) may be laminated to the reflection layer (600). In other words, the light-absorbing layer (700) and the reflection layer (600) may be separated into distinct layers. Thus, since light can be refracted by the interface between the light-absorbing layer (700) and the reflection layer (600), the amount of light re-incident into the interior of the reflection layer (600) may be increased, and the emission of light to the outside through the reflection layer (600) may be prevented. As another example, the light-absorbing layer (700) and the reflection layer (600) may be formed integrally. Thus, the bonding strength between the light-absorbing layer (700) and the reflection layer (600) may be increased.

[0112] Additionally, the light-absorbing layer (700) may contain carbon. The carbon content of the reflecting layer (600) may be smaller than the carbon content of the light-absorbing layer (700). Alternatively, the weight percentage (wt%) of carbon in the reflecting layer (600) may be smaller than the weight percentage (wt%) of carbon in the light-absorbing layer (700). Alternatively, the atomic percentage (at%) of carbon in the reflecting layer (600) may be smaller than the atomic percentage (at%) of carbon in the light-absorbing layer (700). Therefore, the difference in transmittance and reflectance between the light-absorbing layer (700) and the reflecting layer (600) may be large. Through this, the difficulty of design can be reduced by easily controlling reflection and absorption by region.

[0113] Hereinafter, the operation and effect of the light-emitting device (10) according to the fourth embodiment of the present invention will be described.

[0114] Since light can be absorbed in the light absorption layer (700), the mixing of light between adjacent light-emitting elements (200) can be prevented, and the color distinction between light-emitting elements (200) can be made clearer.

[0115] Although the embodiments of the present invention have been described above as specific embodiments, they are merely examples and the present invention is not limited thereto, but should be interpreted as having the broadest scope in accordance with the technical concept disclosed in this specification. Those skilled in the art may implement patterns of shapes not specified by combining or substituting the disclosed embodiments, and this also does not deviate from the scope of the present invention. Furthermore, those skilled in the art may easily modify or alter the disclosed embodiments based on this specification, and it is evident that such modifications or alterations also fall within the scope of the rights of the present invention.

Claims

1. Substrate; A light-emitting element disposed on the above substrate and generating light; A molding layer disposed on the substrate and covering the light-emitting element; and It includes a plurality of wavelength-converting particles disposed in the molding layer, and The above molding layer A first molding region disposed directly above the light-emitting element; and It includes a second molding region disposed on the side of the light-emitting element, and The density of the wavelength-converting particles in the first molding region is greater than the density of the wavelength-converting particles in the second molding region. Light-emitting device.

2. In Paragraph 1, The first molding region is a region from the upper surface of the light-emitting element to the upper surface of the molding layer, Light-emitting device.

3. In Paragraph 1, The light-emitting element and the first molding region are formed in a plurality and arranged spaced apart from each other in one direction, and The second molding region is disposed between the plurality of first molding regions, Light-emitting device.

4. In Paragraph 3, The second molding region is positioned so that the surface of the molding layer is placed on the upper surface of the second molding region, and The first molding region and the second molding region have the same thickness. Light-emitting device.

5. In Paragraph 3, The density of the above wavelength-converting particles is, When a cut surface is formed by cutting the molding layer in a direction passing through the plurality of light-emitting elements arranged in one direction perpendicular to the substrate, the number of wavelength-converting particles disposed on the cut surface or the area of ​​the wavelength-converting particles on the cut surface is calculated. Light-emitting device.

6. In Paragraph 1, The first molding region is positioned to contact the upper surface of the light-emitting element and the upper surface of the molding layer, and the thickness of the second molding region is greater than the thickness of the first molding region. Light-emitting device.

7. In Paragraph 1, The second molding region is positioned so that the surface of the molding layer is placed on the upper surface of the second molding region, and The above molding layer It further includes a third molding area positioned below the second molding area, and The density of the wavelength-converting particles in the third molding region is smaller than the density of the wavelength-converting particles in the first molding region. Light-emitting device.

8. In Paragraph 7, The thickness of the third molding region is the same as the thickness of the first molding region. Light-emitting device.

9. In Paragraph 1, It further includes an electrode pad disposed between the substrate and the light-emitting element, electrically connected to the light-emitting element, and covered by the molding layer. The outer side of the electrode pad is positioned further outward than the side of the light-emitting element, and The above molding layer is, It includes a virtual line extending from the outer side of the electrode pad to the edge of the upper surface of the light-emitting element, a side of the light-emitting element, and a fourth molding region enclosed by the upper surface of the electrode pad. The density of the wavelength-converting particles in the fourth molding region is greater than the density of the wavelength-converting particles in the second molding region. Light-emitting device.

10. Substrate; A plurality of light-emitting elements disposed on the above substrate and generating light; A molding layer disposed on the substrate and covering the plurality of light-emitting elements; and It includes a plurality of wavelength-converting particles disposed in the molding layer, and The above molding layer A first molding layer that covers the plurality of light-emitting elements and transmits light generated from the plurality of light-emitting elements; and It includes a second molding layer laminated to the first molding layer and having a lower light transmittance than the first molding layer, The plurality of wavelength-converting particles are disposed in one or more of the first molding layer and the second molding layer, Light-emitting device.

11. In Paragraph 10, The above molding layer A first molding region disposed directly above the light-emitting element; and It includes a second molding region disposed on the side of the light-emitting element, and A portion of the first molding layer and a portion of the second molding layer are disposed within the first molding region, and Another part of the first molding layer and another part of the second molding layer are disposed within the second molding region, and The density of the wavelength-converting particles in the first molding region is greater than the density of the wavelength-converting particles in the second molding region. Light-emitting device.

12. In Paragraph 11, The first molding layer included in the first molding region is formed convexly upward, Light-emitting device.

13. In Paragraph 11, The thickness of any part of the second molding layer in the first molding region is smaller than the thickness of the other part of the second molding layer in the second molding region. Light-emitting device.

14. In Paragraph 11, The light transmittance in the second molding layer disposed within the first molding region is greater than the light transmittance in the second molding layer disposed within the second molding region, Light-emitting device.

15. In Paragraph 10, The thickness of the first molding layer is greater than the thickness of the second molding layer. Light-emitting device.

16. Substrate; A light-emitting element disposed on the above substrate and generating light; A reflective layer disposed on the substrate and positioned to the side of the light-emitting element to reflect light toward the light-emitting element; A molding layer covering the upper side of the reflection layer and the light-emitting element; and It includes a plurality of wavelength-converting particles disposed in the molding layer, and The above molding layer is, A first molding region disposed directly above the light-emitting element; and It includes a second molding region positioned directly above the reflection layer, and The density of the wavelength-converting particles in the first molding region is greater than the density of the wavelength-converting particles in the second molding region. Light-emitting device.

17. In Paragraph 16, The above reflective layer A reflection region disposed on the side of the light-emitting element and reflecting light toward the light-emitting element; and A light-absorbing layer that covers the reflection area and is positioned below the molding layer to absorb light, comprising Light-emitting device.

18. In Paragraph 17, The thickness of the reflection area is greater than the thickness of the absorption layer. Light-emitting device.

19. In Paragraph 17, The reflectance of the above reflection area is greater than the reflectance of the above molding layer, Light-emitting device.

20. In Paragraph 16, The above light-emitting element is formed in multiple numbers, and The lower surface of the above-mentioned molding layer is, Bent downward so as to be positioned lower than the upper portion of the plurality of light-emitting elements between the plurality of light-emitting elements, Light-emitting device.

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