Aqueous ammonia neutralizes sulfuric acid in copolymer fibers, resolving poor hydrolytic stability caused by imidazole functionality.
A cleaning agent removes plasma residues using diluted hydrofluoric acid and an acid solution.
Non-aqueous ammonia-activated siloxane composition protects high aspect ratio structures during chemical rinse and spin dry processes.
Branch pipe extraction with potentiometry measures silicon concentration in phosphoric acid, preventing deposition from temperature drops.
Small thermal mass chambers transition cleaning fluid to supercritical CO2, eliminating capillary forces that cause line stiction in high aspect ratio features.
A photoresist stripper composition uses glycol ether solvents and amines to remove polymer resist layers from substrates.
A poly alpha glucan derivative with specific glycosidic linkages acts as a rheology modifier and emulsion stabilizer.
A cleaning liquid containing a solvent, organic acid, and chelating compound removes metal residues from substrates.