Optically Investigating Flaws/Contamination TRIZ Cases

A 3D measurement device uses a reflective optical modulator to project striped patterns for spatial analysis.

Illumination module scans samples using multiple spaced-apart beams with varying optical properties.

Imaging devices analyze pre-applied collar shapes to prevent faulty installations and reduce material waste.

A polarized light inspection system captures backlit images of unordered parisons to identify internal defects.

A lighting device uses a lens and diaphragm to focus inspection light onto an object surface.

A high-frequency dynamically focused oblique laser illumination system adjusts beam direction incidence angle to maintain focus on the wafer surface.

Optical imaging systems analyze machine surfaces to locate defects, preventing equipment damage and ensuring electrochemical cell production integrity.

A thermal imaging device captures udder temperature variations to identify subclinical mastitis in lactating animals.

A spatial filter array modifies incident light transmission regions to optimize illumination patterns for semiconductor substrate inspection.

A rectifying plate blocks turbulent airflow toward the substrate, preventing foreign matter adhesion during high-speed rotation.

A test container uses detection means to distinguish itself from filled product containers during automated inspection.

Sub-aperture scanning and 3D stitching resolve inspection subjectivity by providing quantitative defect data for high-power laser systems.

Segmenting spectral ranges across multiple imaging units resolves the contradiction between measurement precision and device complexity.

Segmented inspection workflow addresses diffracted light interference to improve phase defect detection sensitivity.

Spectral measurement devices generate transmittance data for machine fluids to enable precise origin identification.

CCD camera captures UV-fluorescent defect images on monitoring elements for automated rating.

Micro-optics compensate for projection lens aberrations to relax stringent optical tolerances.

Embedded scattering centers and optimized 1040 nm light improve signal-to-noise ratio for non-destructive lens thickness profiling.

A multispectral scanning device combines visible, near-infrared, and X-ray data to generate coherent images of food products.

Photoelastic imaging converts invisible annealing stresses into visible color patterns, enabling precise evaluation of residual stress distribution.

A yarn quality assessment method transforms reflected RGB signals into an L*a*b* color space for precise defect detection.

A liquid surface inspection device uses ring lighting and a camera to capture color information from the liquid surface.

Orthogonal polarizing plates block external light to resolve detection accuracy trade-offs during fuel cell failure confirmation.

A signal synthesizing section combines detection signals from multiple detectors to analyze semiconductor wafer defects without hardware changes.

Automated optical measurement detects defective regions in sealed areas, preventing moisture ingress errors during curing.

Segmenting the wafer into multiple regions allows concurrent inspection by independent heads, resolving the bottleneck of slow single-head scanning speeds.

Rectangular pixels match anamorphic reduction rates to maintain light reception area and prevent signal-to-noise ratio deterioration during inspection.

A THz measuring apparatus pivots individual sensors to align axes perpendicular to the measurement object surface.

Automated defect detection replaces visual inspection by mapping pinholes and point defects on optical filters using dual-spectrum photodetector arrays.

A continuous scan measuring apparatus uses two independent carrier stages to fix objects during optical scanning.

A sulphite sensor uses voltage pulses and multivariate analysis to measure concentration in absorption liquids.

A multi-wavelength laser inspection device rotates glass containers to detect internal defects via critical angle reflection.

Light sources positioned below the half-height line reflect energy off the punt to eliminate absorption and refraction errors during diameter measurement.

A hide grading system uses an LED light table and RFID readers to capture high-resolution images for accurate classification.

A fluorescence inspection system detects surface luminescence from a test object moving freely along a flight path.

A semiconductor inspection method uses multiple light irradiation steps with different scan ranges to detect defective portions on the device.

Unequal length mounting elements cancel spindle thermal expansion movements, reducing defect location errors from 50 microns to under 5 microns.

Dual beams with independent angles of incidence separate top and bottom surface signals on fragile glass samples.

Direct optical measurement of corrugation immersion depth replaces indirect methods to guarantee 100% sealing tightness in pharmaceutical packaging.

Distinct red and green light sources highlight perimeter defects on toroidal objects, reducing false negatives caused by uniform illumination.

Automated optical scanning replaces tedious manual adjustments to detect surface oxidation, wear, and broken pins within two minutes.

A spatial filter shields scattered light near the objective lens outer edge to suppress image elongation in dark field microscopy.

A semiconductor inspection tool selects wavelength ranges based on absorber material presence to optimize signal detection.

A combined intensity map merges reflected and transmitted light data to isolate spatially varying degradation signatures from the reticle pattern.

Optical scanning system uses dual-wavelength beams and a compound ellipsoidal collector to direct scattered radiation toward a detector.

Real-time optical inspection detects printing errors before final sealing, preventing defective product output.

Multi-modal optical scanning detects coating and substrate defects, reducing manual labor hours.

Actuated line scanning maintains normal incidence angles to resolve depth of focus limits and image shading on curved semiconductor wafer edges.