Optically Investigating Flaws/Contamination TRIZ Cases

Infrared intensity patterns reveal whether a scratch on a transparent conductive film stays in the top coat or reaches the conductive layer.

A single optical sensor inspects preforms in multiple orientations, reducing test setup complexity while maintaining complete quality checks.

Interferometric 3D surface maps are corrected using thin-film thickness and refractive index data to improve semiconductor height accuracy.

A linear gripping, lifting, and rotating layout inspects liquid-filled flexible bags faster and with less floor space than manual or carousel systems.

Total internal reflection in a constant-profile lens boosts line-illumination light yield while cutting long-profile deformation and cost.

A linear-transmittance IR filter derives semiconductor emission wavelength data without filter changes, improving resolution and inspection speed.

Dual visible and infrared imaging inspects rotating cylindrical containers for surface defects and detached glass particles in one pass.

Projected light patterns and reflected-image analysis reveal pellicle wrinkles and contamination before EUV lithography, helping protect wafer yield.

Millimeter-wave and terahertz scanning detects resonant or absorbed signals from charged surface particles for contactless real-time visualization.

Edge-mounted light sources and photosensors detect weakened optical paths to locate display panel fragments with less hardware and space.

Fluorescent solution, UV lamps, and visible-light imaging reveal concrete microcrack initiation in real time across multiple crack locations.

Multi-angle cameras and combined coaxial and ambient lighting improve defect detection on prismatic can edges and inner and outer surfaces.

Customizable inspection areas let print checks stay strict where defects matter and lenient elsewhere, reducing waste and re-checks.

Optical diffraction from light beams parallel to the substrate surface improves edge defect detection accuracy and inspection efficiency.

Multiple semi-spherical reflectors let an inspection camera calculate 3D light-source positions for more accurate lighting calibration and defect imaging.

Spectral ellipsometry and clustered sampling cut wafer inspection time while preserving accurate characteristic prediction across vulnerable positions.

Convergent sidewall lighting and surrounding cameras inspect cap slits with high contrast, improving accuracy without slowing production.

Paired opposing cameras, angled lighting, and mirrors improve detection of edge, outer, and inner defects on prismatic battery cans.

A mirror or beam splitter redirects viewing through the container bottom, overcoming meniscus blind spots in low-fill liquid inspection.

A pericentric optical layout captures both end and lateral surfaces of cylindrical objects on one sensor, avoiding multiple cameras and correction.

Integrated light-energy control keeps optical housing temperature stable when emission timing changes or light stops and resumes.

Close-range laser scattering and image processing measure dust and debris on moving surfaces in confined spaces without bulky camera optics.

Polarized optical inspection boosts seal-edge contrast on filled film bags, enabling in-process defect detection and separation of leaking pouches.

A compact cart-based vial inspection layout spins each vial in place for stationary camera imaging, cutting turret complexity, cost, and footprint.

Alternating active and inactive TDI pixel rows buffer and accumulate charge for multi-optical-mode defect imaging with higher SNR.

Combining pulse analysis from particulate sensors with chemical, environmental, and remote context data enables specific pollutant identification.

Time-spaced low-intensity pulses from optical delay loops cut sample damage and speckle contrast while preserving fast inspection accuracy.

A rotating panel with adjustable lighting and tilt recreates tunnel conditions to compare cameras and stabilize image quality analysis.

A compact laser sensor uses image processing to measure contaminant levels accurately in confined spaces with movement and vibration.

Combining THz and MMW imaging with real-time processing improves container screening accuracy for hidden items and tampering.

Optical reflection feedback tracks film removal inside a vacuum chamber, helping stop cleaning at the right time to avoid delamination and contamination.

A rotating camera with lidar-guided focus and lighting captures clear inner-surface images to detect wear and damage without manual inspection.

Dual-frequency comb illumination converts spectral overlay signals into RF data, enabling precise intra-field wafer measurements with fast throughput.

Visual wear-detecting sections in rotary valve seal sheets reveal remaining thickness during use, helping prevent unplanned shutdowns.

Machine learning links inline and offline wafer measurements to rank normality and abnormality levels, improving tool tuning and maintenance decisions.

A common optical path aligns focus across multiple sensors, improving ultrafine mask defect detection despite shallow focal depth.

A movable reflector lets one laser triangulation setup capture inner and outer tyre 3D images quickly, cutting space, cost, and cycle time.

By locating defect candidates in 3D from multi-angle images, this case improves piston crown inspection even when some views miss defects.

Pump-probe laser thermoreflectance maps wafer conductive paths, exposing open, resistive, and short defects faster than e-beam inspection.

Automated camera paths and AI contamination detection enable fast, consistent pre-filling cleanliness checks inside mobile transport tanks.

Selective interferometry calibrates white light triangulation to correct virtual penetration errors in bump height measurement.

A separate inspection light checks the ToF camera cover for dirt, scratches, droplets, or fog to preserve ranging accuracy.

A 360-degree light-permeable casing and omnidirectional camera cut pipe inspection time by eliminating precise maneuvering and external cables.

Shaped multi-angle illumination matches 3D part contours to boost contrast on shallow defects and improve line-scan inspection.

A modeled overlap volume shapes the coupling mirror aperture to pass brightfield light while preserving darkfield signal under alignment tolerances.

Filtering first- and second-harmonic infrared laser signals removes ripples and noise for more accurate gas concentration inversion underground.

Multiple driving options reveal the lowest defect count in primary and redundant LEDs, helping accept usable panels without sacrificing reliability.

Localized deformation maps correct incidence and azimuth angle errors from bow, warp, and chuck imprinting for more reliable metrology.

A conversion member turns long actuator travel into fine EUV camera adjustment, enabling precise mask inspection under vacuum and pressure load.

Magnetic posture adjustment and coaxial alignment let vision modules inspect tiny pogo pins faster and more accurately than manual handling.