Semiconductor device mounting device and mounting method

Abstract

The present disclosure relates to a semiconductor device patch device and a patch method. The device includes a patch assembly, and the patch assembly includes a patch head. The patch head includes: a patch tool for bonding semiconductor devices; a patch head driving mechanism, which is used to drive the patch tool in a horizontal plane to align the patch position of the semiconductor device relative to the substrate when the semiconductor device is kept above the patch position. The patch assembly includes a patch assembly driver, which is used to vertically drive the patch head to pick up the semiconductor device and bond the semiconductor device at the bonding position. The device includes a camera assembly, which includes: an alignment camera, which is used to capture a reference view of the semiconductor device and the bonding position, and a camera assembly driving mechanism, which is used to drive the alignment camera to position the alignment camera between the patch tool and the patch position. Based on the reference view, the semiconductor device is aligned relative to the bonding position.

Description

[0001] This application claims priority from Singapore application No.10201807813V, with a priority date of September 11, 2018. Technical Field

[0002] The present disclosure relates to bonding of semiconductor devices, such as semiconductor components, wafers or dies. More specifically, the present disclosure describes various embodiments of an apparatus and method for bonding semiconductor devices, such as semiconductor components, wafers or dies, i.e., an apparatus and method for bonding semiconductor components, wafers or dies. Background Art

[0003] The semiconductor wafer is cut and separated into a number of dies, and each die is then mounted on a substrate (also known as a support surface, support plate, carrier, bottom plate, substrate, substrate wafer, panel, etc.) for subsequent processing. The above mounting is achieved by a chip mounting process. In the subsequent process, a plastic encapsulation layer is formed around the dies arranged on the substrate and electrical connections are formed on the active surface of the dies.

[0004] In a typical die bonding process, each die is individually picked up from the wafer by a bonding tool and then transferred to a base plate for bonding the die to the substrate.

[0005] In order to increase the output, the speed of patching needs to reach a certain level. However, a fast patching speed will come at the cost of loss of accuracy. In the prior art, a high-speed patching device often has a low patching accuracy. Similarly, a patching device with a high patching accuracy often has a slower patching speed. Summary of the invention

[0006] The first aspect of the present invention provides a device for patch. The patch device comprises:

[0007] (a) a rack assembly;

[0008] (b) a base assembly for supporting a set of substrates;

[0009] (c) a wafer feeder assembly for placing a die to be bonded at a bonding position on the substrate;

[0010] (d) a set of patch assemblies connected to the frame assembly and located above the base assembly, each of the patch assemblies comprising:

[0011] (i) a set of tile headers, each of which comprises:

[0012] a die bonding tool for bonding the die; and

[0013] a chip head driving mechanism, used for driving the chip placement tool in a horizontal plane to align the die with a corresponding chip placement position on the substrate and keep the die above the corresponding chip placement position; and

[0014] (ii) a chip assembly driver for vertically driving the chip head to pick up the die from the chip feeder assembly and attach the die to a corresponding chip position; and

[0015] (e) a pair of vision assemblies connected to the frame assembly, each of the vision assemblies comprising:

[0016] (i) a pair of alignment cameras for capturing a reference view of the plurality of dies and their corresponding patch locations; and

[0017] (ii) a visual component driving mechanism, used to drive the alignment camera to between the patch tool and the corresponding patch position;

[0018] Wherein, the bare die and its corresponding patch position are aligned according to the corresponding reference view.

[0019] The second aspect of the present invention provides a semiconductor device chip bonding method. The method includes: supporting at least one substrate on a base component, which is located below at least one chip bonding component and includes two or more chip bonding heads; supplying the plurality of semiconductor devices to the two or more chip bonding heads, thereby simultaneously bonding at the bonding position of the at least one substrate; vertically driving each chip bonding head, thereby using the chip bonding tool of the chip bonding head to simultaneously pick up the supplied semiconductor devices; driving a pair of alignment cameras between the chip bonding tool and the chip bonding position; using the alignment camera to capture a reference view of each semiconductor device and the chip bonding position; based on the reference view, driving the chip bonding tool in a horizontal plane to align the semiconductor device with its corresponding chip bonding position, while the semiconductor device is maintained above the bonding position; and vertically driving the chip bonding head to make the chip bonding tool bond the semiconductor device at the chip bonding position.

[0020] The advantage of this application is that

[0021] (1) Using multiple placement heads, with visual components and film feeder components working simultaneously, and combining the movement mode of each component to increase the placement rate;

[0022] (2) the vision component is configured so that, before bonding the semiconductor device to the substrate, the semiconductor device can be aligned with its corresponding bonding position based on the reference view captured by the vision component;

[0023] (3) The alignment operation is performed while the semiconductor device is held over the corresponding bonding position, so only a small movement of the bonding tool holding the semiconductor device is required, and the small movement can be completed very quickly.

[0024] (4) The wafer feeder assembly runs quickly over a long distance from the semiconductor device source to the placement position; the placement assembly only runs a vertical distance after position correction by the vision assembly to increase the placement speed and reduce placement errors.

[0025] The technical solution in this application increases the total production volume without compromising the accuracy of the position of the semiconductor device bonded on the substrate, so that the bonded substrate has higher quality and better reliability. The chip bonding device in this application can make the chip bonding speed exceed 8000 UPH (unit per hour), and the chip bonding accuracy can reach an error of less than 3μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figures 1A to 1C is an illustration of a front view and a side view of a die bonding device according to some embodiments of the present disclosure.

[0027] Figure 2A and Figure 2B is an illustration of a front view of a die bonding device according to some other embodiments of the present disclosure.

[0028] Figure 3A and Figure 3B is an illustration of a front view of a die bonding device according to some other embodiments of the present disclosure.

[0029] 4A to 4D is an illustration of a front view and a side view of a die bonding apparatus including a die feeder assembly according to some embodiments of the present disclosure.

[0030] Figure 5A is a flow chart illustrating a die bonding method according to an embodiment of the present disclosure.

[0031] Figure 5B is an illustration of a side view of an apparatus for various steps of a method for die bonding according to an embodiment of the present disclosure.

[0032] Fig. 6A and Figure 6B is an illustration of a top view of a substrate for die bonding according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0033] Various features, aspects, and advantages of the present disclosure will become more apparent from the following detailed description of embodiments of the present disclosure, given by way of non-limiting example only, and the accompanying drawings.

[0034] For the purpose of brevity and clarity, the description of the embodiments of the present disclosure relates to devices and methods for bare die bonding according to the accompanying drawings. Although various aspects of the present disclosure will be described in conjunction with the embodiments provided herein, it should be understood that they are not intended to limit the present disclosure to these embodiments. On the contrary, the present disclosure is intended to cover alternatives, modifications and equivalents of the embodiments described herein, which are included within the scope of the present disclosure as defined by the appended claims. In addition, in the following detailed description, specific details are set forth in order to provide a thorough understanding of the present disclosure. However, a person of ordinary skill in the art (i.e., a person skilled in the art) will recognize that the present disclosure can be practiced without specific details, and / or multiple details resulting from a combination of aspects of a particular embodiment. In many cases, well-known systems, methods, processes, and components are not described in detail so as not to unnecessarily obscure various aspects of the embodiments of the present disclosure.

[0035] In embodiments of the present disclosure, description of a given element in a corresponding descriptive material or consideration or use of a particular element number in a particular figure may include the same, equivalent, or similar element or element number identified in the corresponding descriptive material or another number or descriptive material associated therewith.

[0036] References to "an embodiment / example", "another embodiment / example", "some embodiments / examples", "some other embodiments / examples", etc. indicate that the embodiment / example so described may include a particular feature, structure, characteristic, property, element, or limitation, but not every embodiment / example must include that particular feature, structure, characteristic, property, element, or limitation. Furthermore, repeated use of the phrase "in an embodiment / example" or "in another embodiment / example" does not necessarily refer to the same embodiment / example.

[0037] The terms "comprise", "include", "have", etc. do not exclude the presence of other features / elements / steps than those listed in the embodiments. The description of certain features / elements / steps in mutually different embodiments does not mean that the combination of these features / elements / steps cannot be used in the embodiments.

[0038] As used herein, the terms "one" and "an" are defined as one or more than one. Unless otherwise stated, the use of " / " in the figures or related text should be understood to mean "and / or". The term "set" is defined as a non-empty finite organization of elements that mathematically exhibit at least one cardinality (for example, a set as defined herein can correspond to a unit, a singlet or a single element set, or a plurality of element sets), according to known mathematical definitions. The description of a specific numerical value or a range of values ​​herein should be understood to include or be a narration of an approximate numerical value or range of values. As used herein, the terms "first", "second", "third", "fourth", etc. are used only as marks or identifiers and are not intended to impose numerical requirements on their related terms. As used herein, the term "each other" represents the mutual relationship between two or more elements.

[0039] In a representative or exemplary embodiment of the present application, a patch device 100 is included, such as Figure 1A and Figure 1B The chip bonding device 100 comprises: a frame assembly 110 ; a base assembly 120 for supporting a group of one or more substrates 122 ; and a chip feeder assembly 130 for providing the bare chip 102 at a bonding position on the substrate 122 .

[0040] The patch device 100 further includes a group of one or more patch components 140, which are connected to the frame component 110 and are located above the base component 120. Each patch component 140 includes a group of one or more patch heads 150 and a patch component driver 142 for vertically driving the patch head 150. The patch component driver 142 is a Z-axis driver, which vertically drives or moves the patch head 150 to pick up the bare chip 102 provided from the chip feeder component 130, and attaches the bare chip 102 to the corresponding attachment position on the substrate 122.

[0041] The rack assembly 110 is configured to drive the patch assembly 140 in a horizontal plane, so as to position the patch head 150 above the continuous patch positions on the substrate 122. The term "horizontal plane" refers to planar motion along a horizontal plane, i.e., an XY plane. For example, the rack assembly 110 includes a rack drive mechanism, such as an XY moving table for moving along an X-axis and a Y-axis, which is configured to make the patch assembly 140 move along a horizontal XY plane. The rack drive mechanism moves the patch assembly 140, such as moving along the X-axis, to adjust the space between the patch assemblies 140 and between the patch heads 150. The patch assembly 140 is continuously driven to position the patch head 150 above the patch position, so that all the bare chips 102 are respectively attached to the corresponding patch positions on the substrate 122.

[0042] Each of the above-mentioned patch heads 150 includes a patch tool 152 for holding the bare die 102; and a patch head driving mechanism 154 for driving the above-mentioned patch tool 152. Specifically, the above-mentioned patch head driving mechanism 154 is configured to drive or move the above-mentioned patch tool 152 in a horizontal plane so that the bare die 102 is aligned with the corresponding patch position on the above-mentioned substrate 122, and the bare die 102 is kept above the corresponding patch position. More specifically, the driving of the patch tool 152 includes making the above-mentioned patch tool 152 perform planar and / or angular motion along the horizontal XY plane. In some embodiments, the above-mentioned patch head driving mechanism 154 includes an X-axis driver, a Y-axis driver and an angle θ driver, which are used to perform planar motion along the horizontal XY plane and / or angular motion around the bonding axis of the above-mentioned bonding head 150.

[0043] The chip bonding device 100 further includes a set of one or more camera assemblies 160 (vision assembly) connected to the rack assembly 110. Each camera assembly 160 includes a pair of alignment cameras 170 for obtaining a reference view of the corresponding bonding position on the die 102 and the substrate 122.

[0044] The alignment camera 170 includes an upward-looking camera 172 and a downward-looking camera 174. The upward-looking camera 172 is configured to obtain a reference view or image of the die 102 held by the bonding tool 152 by vertically looking upward. The downward-looking camera 174 is configured to capture a reference view or image of a corresponding bonding position on the substrate 122 by vertically looking downward on the substrate 122, wherein the die 102 is bonded to the bonding position. Based on the corresponding reference view, the die 102 can be aligned with the corresponding bonding position.

[0045] Each of the camera assemblies 160 may further include a camera assembly driving mechanism 162 for driving the alignment camera 170 so that the alignment camera 170 is positioned between the bonding tool 152 and the corresponding bonding position on the substrate 122, such as Figure 1C As shown. The driving of the alignment camera 170 includes planar motion along the horizontal XY plane. In some embodiments, the camera assembly driving mechanism 162 includes an X-axis driver and a Y-axis driver for performing planar motion. Optionally, the camera assembly driving mechanism 162 includes a Z-axis driver for vertically driving the alignment camera 170, for example, focusing on the bonding position of the die 102 and the substrate 122. Each of the upward-looking camera 172 and the downward-looking camera 174 can be driven independently of each other, so that they can respectively achieve optimal focusing on the die 102 and the bonding position. Further optionally, the camera assembly driving mechanism 162 includes an angle θ driver for angular motion along the horizontal XY plane.

[0046] like Figure 1A As shown, in some embodiments, the patch device 100 includes a first patch component 140a, a second patch component 140b, a third patch component 140c and a fourth patch component 140d. Each patch component 140a-d includes:

[0047] The corresponding patch heads 150a-d and the corresponding patch assembly drivers 142a-d for actuating the corresponding patch heads 150a-d. Thus, each patch head 150a-d can be actuated individually and independently by the corresponding patch assembly drivers 142a-d. Each patch head 150a-d has its own independent patch head drive mechanism 154 for driving the corresponding patch tool 152 in the horizontal plane to align the bare die 102.

[0048] In such Figure 2A In some embodiments shown, the patch device 100 includes a first patch assembly 140a and a second patch assembly 140b. The first patch assembly 140a includes a first patch head 150a, a second patch head 150b, and a first patch assembly driver 142a for a separate vertically actuated patch head 150ab. The second patch assembly 140b includes a third patch head 150c, a fourth patch head 150d, and a second patch assembly driver 142b for a separate vertically actuated patch head 150cd. The overall drive of the patch head 150 means that for each patch assembly 140, multiple patch heads 150 of the patch assembly 140 can be actuated simultaneously with each other. However, each patch head 150a-d has its own independent patch head drive mechanism 154 for actuating the corresponding patch tool 152 in the horizontal plane to align the die 102.

[0049] In some embodiments, the patch device 100 includes a single patch assembly 140. The patch assembly 140 includes four patch heads 150 and a patch assembly driver 142 for vertically actuating the patch heads 150. Therefore, all the patch heads 150 can be actuated simultaneously with each other. However, each patch head 150 has its own independent patch head drive mechanism 154 for driving the corresponding patch tool 152 in a horizontal plane to align the bare die 102.

[0050] like Figure 1A and Figure 2AAs shown, in some embodiments, the patch device 100 includes a first patch head 150a, a second patch head 150b, a third patch head 150c and a fourth patch head 150d. The patch device 100 also includes a first camera assembly 160a, a second camera assembly 160b, a third camera assembly 160c and a fourth camera assembly 160d. Each patch head 150a-d is paired with a camera assembly 160a-d respectively. The camera assembly driving mechanism 162 of each camera assembly 160a-d is configured to drive the corresponding alignment camera 170 to place the alignment camera 170 below the corresponding patch head 150a-d. In addition, the rack assembly 110 is configured to drive the alignment camera 170 in a horizontal plane to follow the corresponding bonding head 150. That is, the camera assembly 160a-d as a visual assembly is used to align the bare die 102 picked up by the patch head to the at least one substrate at the same time.

[0051] In some embodiments, Figure 2B As shown, the patch device 100 includes a first patch component 140a and a second patch component 140b. The first patch component 140a includes a first patch head 150a and a second patch head 150b. The second patch component 140b includes a third patch head 150c and a fourth patch head 150d. The patch device 100 also includes a first camera component 160a and a second camera component 160b. Each patch component 140ab is paired with a camera component 160ab respectively. The camera component driving mechanism 162 of each camera component 160ab is configured to drive the corresponding alignment camera 170 to place the alignment camera 170 sequentially below the corresponding patch head 150a-d of the corresponding patch component 140ab. That is, the first camera component 160a and the second camera component 160b as a visual component simultaneously align the bare chip 102 picked up by the first patch head 150a and the third patch head 150c respectively with the substrate 122. The first camera assembly 160a and the second camera assembly 160b simultaneously align the dies 102 picked up by the second mounting head 150b and the fourth mounting head 150d to the substrate 122, respectively.

[0052] As described above, each of the bonding heads 150 has an independent bonding head drive mechanism 154. In some embodiments, each bonding head drive mechanism 154 drives the corresponding bonding tool 152 independently of the other parts. In other embodiments, all bonding head drive mechanisms 154 drive the corresponding bonding tools 152 simultaneously in unison with each other. This can be referred to as collective or integrated alignment of all the bare dies 102 held by the bonding tools 152 of the bonding heads 150. Figure 3A and Figure 3B As shown, the alignment and bonding of the die 102 are performed simultaneously and in accordance with each other. Similarly, the picking up of the die 102 by the die bonding tool 152 can also be performed simultaneously and in accordance with each other.

[0053] The patch tool 152 of the patch head 150 may include, but is not limited to, vacuum suction, clamping, or other means known to those skilled in the art to pick up the die 102. The patch tool 152 is detachably connected to the patch head 150, and the patch tool 152 can be easily replaced to match the die 102 of different sizes. The patch head drive mechanism 154 can be configured to retract the patch tool 152 into the patch head 150 so as to terminate the process or operation of die bonding after all the die 102 are bonded to the substrate 122. Optionally, each patch head 150 includes a force control unit configured to control the impact force when the patch 102 is placed on the substrate 122. For example, the force control unit has a flexible or elastic element to reduce the impact force when the die 102 is bonded to the substrate 122. The force control unit can be configured to perform the retraction of the bonding tool 152.

[0054] In such Figure 4A and Figure 4B In some embodiments shown, the feeder assembly 130 includes a set of one or more feeder units 132 that can be driven or moved between one or more die sources and the die attach head 150. The feeder assembly 130 includes a drive mechanism for driving the feeder units 132. Each die source contains a set of one or more wafers, wherein the die 102 is picked up by the feeder unit 132. In one example, there is only one die source for providing die 102 to all die attach heads 150. In another example, there is a first die source located on one side of the device 100 and a second die source located on the opposite side of the device 100. The first die source provides the die 102 to the die attach head 150ab, and the second die source provides the die 102 to the die attach head 150cd. By using more than one die source, the die 102 can be provided to more than one die attach head 150 at the same time, so that more die 102 can be attached to the substrate 102 faster, thereby increasing the overall yield.

[0055] In such Figure 4A In some embodiments shown, the device 100 includes: a first chip feeder unit 132a, a second chip feeder unit 132b, a third chip feeder unit 132c and a fourth chip feeder unit 132d. Each of the chip heads 150a-d is paired with one of the chip feeder units 132a-d respectively. Each of the chip feeder units 132a-d is configured to individually provide the bare die 102 to the corresponding chip head 150a-d.

[0056] In such Figure 4CIn some embodiments shown, the device 100 includes: a first patch component 140a, a second patch component 140b, a first chip feeder unit 132a and a second chip feeder unit 132b. Each patch component 140ab is paired with a chip feeder unit 132ab respectively. Each chip feeder unit 132ab is configured to provide the bare chip 102 as a whole to the corresponding patch head 150a-d of the corresponding patch component 140ab. Each chip feeder unit 132ab includes a conversion tool 134, which is configured to arrange the bare chip 102 on the chip feeder unit 132ab to achieve the overall feeding of the bare chip 102. Specifically, the conversion tool 134 arranges the bare chip 102 on the chip feeder unit 132ab based on the spacing of the corresponding patch component 140ab. The spacing of the patch component 140 refers to the distance between the patch heads 150 of the patch component 140. Therefore, the conversion tool 134 separates the dies 102 at the die feeder unit 132 according to the distance between the respective die heads 150 , so that the dies 102 can be simultaneously and accurately fed to the die heads 150 .

[0057] In such Figure 4D In some embodiments shown, the device 100 includes: a first chip feeder unit 132a, a second chip feeder unit 132b and a third chip feeder unit 132c. The first chip feeder 150a is paired with the first chip feeder unit 132a, and the second chip feeder 150b is paired with the second chip feeder unit 132b. The first chip feeder unit 132a is configured to supply the die 102 individually to the first chip feeder 150a, and the second chip feeder unit 132b is configured to supply the die 102 individually to the second chip feeder 150b. The second chip assembly 140b has a third chip feeder 150c and a fourth chip feeder 150d, which are paired with the third chip feeder unit 132c. The third chip feeder unit 132c includes the conversion tool 134 and is configured to provide the die 102 as a whole to the chip feeder 150cd.

[0058] In a representative or exemplary embodiment of the present application, there is also a method 200 for die bonding performed by the apparatus 100. Figure 5A The method 200 is described, which may employ various previous embodiments of attaching the die 102 to the substrate 122 . Figure 5B A side view 300 of the apparatus 100 is shown illustrating various steps in the method 200 .

[0059] The method 200 includes step 210 of supporting the substrate 122 on the base assembly 120 and being located below the die placement assembly 140 including the die placement head 150. The method 200 includes step 220 of supplying the die 102 to the die placement head 150 so as to attach the die 102 to the die placement position on the substrate 122. As shown in the side view 310, the feeder unit 132 of the feeder assembly 130 is located below the die placement head 150 for supplying the die 102 to the die placement head 150.

[0060] The method 200 includes step 230 of vertically driving the chip head 150 to enable the chip tool 152 of the chip head 150 to pick up the supplied die 102. Specifically, the chip assembly driver 142 moves the chip head 150 vertically downward to pick up the die 102. For example, the chip tool 152 includes a chuck that uses vacuum suction to pick up the die 102. As shown in the side view 320, the die 102 is picked up by the chip tool 152, and the chip feeder unit 132 is driven away from the chip head 150.

[0061] The method 200 includes step 240, which drives a pair of alignment cameras 170 to position the alignment cameras 170 between the patch tool 152 and the substrate 122. Specifically, the camera assembly drive mechanism 162 moves the alignment camera 170 so that the upward camera 172 and the downward camera 174 are located between the patch tool 152 and the patch position of the substrate 122. It is worth noting that the upward camera 172 and the downward camera 174 are positioned so that the die 102 and the patch position are within the corresponding field of view. As shown in the side view 330, the upward camera 172 is positioned to look vertically upward to observe the patch 102 held by the patch tool 152, and the downward camera 174 is positioned to look vertically downward to observe the bonding position on the substrate 122.

[0062] The method 200 includes step 250 of capturing a reference view of the die 102 and the patch location on the substrate 122 using a pair of alignment cameras 170. Specifically, the upward-looking camera 172 captures a reference view of the die 102; and the downward-looking camera 174 captures a reference view of the patch location on the substrate 122. The reference view may include a demarcation pattern of the die 102 and the patch location on the substrate 122. The demarcation pattern may take the form of a fiducial mark on the die 102, for example, at a corner of the die 102 and at a corner of the patch location on the substrate 122. The demarcation pattern or fiducial mark

[0063] It may be a cross-shaped pattern indicating the center and patch location of the die 102. These demarcation patterns allow the upward camera 172 and the downward camera 174 to locate the center and horizontal angle orientation of the die 102 and the patch location on the substrate 122 relative to the optical axis of the upward camera 172 and the downward camera 174, respectively. The demarcation patterns may be formed by a marking process, such as ink marking and laser marking. An example of the ink marking is pad printing, which transfers an ink pattern to the die 102 and the substrate 122. An example of laser marking is laser engraving or etching to physically form reference marks on the die 102 and the substrate 122.

[0064] The method 200 includes step 260, when the die 102 is held above the patch position, driving the patch tool 152 in a horizontal plane to align the die 102 relative to the patch position of the substrate 122 based on the reference view. The alignment includes calculating the alignment offset between the die 102 and the patch position based on the reference view. The alignment also includes calculating the planar and / or angular movement of the patch tool 152 along the horizontal plane (XY plane) based on the alignment offset. The patch tool 152 is driven by the patch head drive mechanism 154 to perform the planar and / or angular movement. The driving of the patch tool 152 aligns the die 102 with the patch position on the substrate 122 by correcting the misalignment along one or more of the X-axis, the Y-axis and the angle θ. During the misalignment correction, since the die 102 has been positioned and held above the patch position, the driving of the patch tool 152 is very small and difficult to detect by the naked eye, typically in the micrometer range. As shown in the side view 340 , the alignment camera 170 is driven away from the bonding head 150 , and the bonding tool 152 is driven to align the die 102 relative to the bonding location on the substrate 122 .

[0065] In some embodiments, the upward camera 172 and the downward camera 174 are axially aligned with each other. Specifically, the optical axes of the upward camera 172 and the downward camera 174 are perpendicular and collinear, so that the offset distance between the optical axes is zero. In some other embodiments, the optical axes of the upward camera 172 and the downward camera 174 are perpendicular and parallel, so that there is a non-zero offset distance between the optical axes. It should be understood that a calibration step can be performed before performing the die bonding method 200. As will be readily understood by those skilled in the art, the calibration step can use a transparent block such as a glass block, which contains reference marks for optical axis alignment.

[0066] The position (X-axis and Y-axis) and orientation (angle θ) of the die 102 can be calculated from its reference view relative to the optical axis of the overhead camera 172. Similarly, the position (X-axis and Y-axis) and orientation (angle θ) of the patch position of the substrate 122 can be calculated from its reference view relative to the optical axis of the overhead camera 174. Since any offset distance between the optical axes is known, the alignment offset used to drive the patch tool 152 can be calculated to correct the position of the die 102 to the position of the patch position on the substrate 122.

[0067] The method 200 includes step 270: vertically driving the chip head 150 so that the chip placement tool 152 is bonded to the die 102 at the chip placement position. Specifically, the chip placement component driver 142 drives the chip placement head 150 to move vertically downward to place and bond the die 102 at the bonding position. For example, when the die 102 is placed in contact with the bonding position, the clamp of the chip placement tool 152 releases the vacuum suction to release and bond the die 102. As shown in the side view 350, the chip placement head 150 is driven vertically downward to the bonding position where the die 102 is bonded to the substrate 122. In addition, there may be other chip placement heads 150, which simultaneously bond other die 102 to the corresponding bonding positions of the substrate 122, thereby increasing the total output.

[0068] As shown in the side view 360, after the die 102 is bonded, the patch head 150 is driven vertically upward. The feeder unit 132 takes out a new die 102 from the die source and transfers the new die 102 to the patch head 150. The rack assembly 110 drives the patch assembly 140 horizontally and plane-wise to move the patch head 150 above the next bonding position of the substrate. The new die 102 is picked up by the patch tool 152. The rack assembly 110 drives the alignment camera 170 horizontally and plane-wise to follow the patch head 150 to align the new die 102. Subsequently, the new die 102 is aligned and bonded in the next bonding position in a similar manner to the method 200 and the side view 300. It should be understood that the patch assembly 140 is continuously driven to continuously position the patch head 150 above the patch position, and finally all the die 102 are bonded to the corresponding bonding position of the substrate 122. Similarly, the alignment camera 170 is also continuously driven to follow the placement head 150 .

[0069] In some embodiments, the chip bonding device 100 includes four chip bonding heads 150-a first chip bonding head 150a, a second chip bonding head 150b, a third chip bonding head 150c and a fourth chip bonding head 150d-for bonding the die 102 to a group of one or more substrates 122. These (individual) substrates 122 are supported by the base assembly 120. Each substrate 122 is affixed or laminated with an adhesive layer to allow the die 102 to be bonded to the substrate 122. When the die 102 is placed and bonded to the corresponding bonding position of the substrate 122, the laminated adhesive layer helps to improve the stability of the die 102 aligned and placed on the substrate 122, so that the alignment misalignment at the impact point on the substrate 122 is minimized, and the position accuracy of the die 102 at its bonding position is improved. The laminated adhesive layer includes but is not limited to polyester film paper or thin sheet. It should be understood that the laminated adhesive layer material can be any type of laminated material / strip used in semiconductor processing equipment known to those skilled in the art.

[0070] In such Fig. 6A In some embodiments shown, four separate substrates 122a-d are supported on a base assembly 120. Each substrate 122a-d has a series of bonding positions 124, and four bonding heads are configured such that each bonding head 150a-d corresponds to one substrate 122a-d. Since each bonding head 150a-d is configured to bond a die 102 at a bonding position 124 of a corresponding one of the substrates 122a-d, all the die 102 can be bonded to all the substrates 122a-d more quickly, thereby increasing overall production throughput. Although Fig. 6A Four substrates 122a - d are shown, but it should be understood that the base assembly 120 may support any number of substrates 122 , and any number of placement heads 150 may be used to correspond to any number of substrates 122 .

[0071] In such Figure 6B In some embodiments shown, a single substrate 122 is supported on a base assembly 120. The substrate 122 is divided into four regions 126a-d, and each substrate region 126a-d has a series of patch positions 124. Four patch heads 150a-d are configured to correspond to the corresponding substrate regions 126a-d. The substrate 122 has an array of patch positions 124 with 6 rows and 12 columns. The first patch head 150a corresponds to the first substrate region 126a (1st to 3rd columns), the second patch head 150b corresponds to the second substrate region 126b (4th to 6th columns), the third patch head 150c corresponds to the third substrate region 126c (7th to 9th columns), and the fourth patch head 150d corresponds to the fourth substrate region 126d (10th to 12th columns).

[0072] Before bonding the die 102 to the substrate 122, the processor of the bonding device 100 determines the pitch of the substrate 122. The pitch of the substrate 122 refers to the distance between the columns of the bonding positions 124. The processor then determines the pitch of the bonding assembly 140, in particular the distance between the bonding heads 150a-d. The pitch of the substrate 122 can be referred to as the unit pitch, and the pitch of the bonding assembly 140 can be referred to as the runtime pitch. For example, the unit pitch is 20 mm, so the runtime pitch is 60 mm, because each bonding head 150a-d corresponds to three columns of bonding positions 124. The corresponding bonding head drive mechanism 154d of the bonding head 150a-d drives the corresponding bonding head 150a-d horizontally along the X-axis to adjust the distance between each bonding tool 152 according to the runtime pitch. Reference Figure 6B , the first patch header 150a is located in the 1st column, the second patch header 150b is located in the 4th column, the third patch header 150c is located in the 7th column, and the fourth patch header 150d is located in the 10th column.

[0073] In some embodiments, the patch position 124 of the substrate 122 has an array of 11 columns. The first to third patch heads 150a-c target the first to third substrate areas 126a-c (1st to 9th columns), but the fourth patch head 150d targets the fourth substrate area 126d, which includes two columns (10th and 11th columns) instead of 3 columns. The unit spacing remains unchanged at 20 millimeters (mm), and the run time spacing also remains unchanged at 60 millimeters (mm). It should be understood that the run time spacing can be different according to the number of columns of the patch position 124 on the substrate 122 and the allocation of the number of columns to the patch head 150. For example, having the same number of patch heads 150 but fewer columns can reduce the run time spacing. Similarly, having the same number of columns but fewer patch heads 150 can increase the run time spacing. The run time spacing of the patch assembly 140 can be dynamically updated by the processor based on a plurality of consecutive substrates 122.

[0074] As described in various embodiments herein, compared with existing devices, the patch device 100 and method 200 can perform die bonding at high speed while having high bonding accuracy. After the patch tool 152 picks up the die 102, a reference view or image of the die 102 and its corresponding bonding position on the substrate 122 is obtained. The feeder assembly 130 obtains the die 102 from the die source (e.g., wafer) at high speed and sends it to the patch head 150. Since the feeder unit 132 needs to move between the die source and the patch head 150, the distance moved during this period is relatively large, and this distance is about tens of centimeters to several meters. Therefore, the feeder assembly 130 greatly improves the patch rate with high-speed movement. The high-speed movement of the feeder unit 132 sacrifices accuracy, and when the die 102 is picked up by the patch tool 152, an alignment error between the die 102 and the corresponding patch position is caused. The alignment error is corrected by the cooperation of the alignment cameras 170 , in particular, using the upward-looking camera 172 to correspond to the die 102 to be bonded and using the downward-looking camera 174 to correspond to the bonding position.

[0075] Camera 170 captures reference views of die 102 and patch position, and calculates misalignment or alignment offset that needs to be corrected. The alignment offset can be along one or more of the X-axis, Y-axis and angle θ. The alignment offset is usually micrometer-level. In this way, the drive of the patch tool 152 by the patch head drive mechanism 154 is very small and can be completed very quickly. Due to the tiny movement of the patch tool 152, there will be minimal or even no residual vibration after the correction is completed, so the accuracy of its position is improved when the die 102 is attached to the patch position. In addition, since the mass of the patch tool 152 is smaller than that of the patch assembly 140, it is possible to achieve more fine control of the drive of the patch tool 152, thereby improving the accuracy of the position.

[0076] Therefore, the apparatus 100 and method 200 can achieve faster and more efficient die bonding because the misalignment of the die can be corrected more quickly. This increases the overall throughput without compromising the accuracy of the position of the bonded die 102 on the substrate 122. The bonded substrate 122 produced by the apparatus 100 and method 200 also has better quality and reliability. In order to further increase the overall throughput, the apparatus 100 can be configured to have more bonding components 140 and / or bonding heads 150, each of which can independently perform the alignment operation of the die 102.

[0077] In the foregoing detailed description, embodiments of the present disclosure relating to apparatus and methods for die bonding are described with reference to the provided drawings. The description of various embodiments herein is not intended to refer to or be limited to specific or particular representations of the present disclosure, but is intended only to illustrate non-limiting embodiments of the present disclosure. The present disclosure is intended to solve at least one of the above-mentioned problems and issues associated with the prior art. Although only some embodiments of the present disclosure are disclosed herein, it is apparent to a person of ordinary skill in the art in view of the present disclosure that various changes and / or modifications may be made to the disclosed embodiments without departing from the scope of the present disclosure. Therefore, the scope of the present disclosure, as well as the scope of the following claims, is not limited to the embodiments described herein.

Claims

1. A semiconductor device chip mounting device, comprising: (a) a frame assembly, the frame assembly comprising a frame drive mechanism; (b) a base assembly for supporting at least one substrate; (c) a wafer feeder assembly, used to transfer semiconductor devices to be bonded to the wafer bonding assembly; (d) at least one patch assembly, connected to the frame assembly and located above the base assembly, the at least one patch assembly being configured to move the plurality of semiconductor devices in a horizontal plane and vertically; the at least one patch assembly comprising two or more patch heads and a patch assembly driver for simultaneously picking up the plurality of semiconductor devices and simultaneously bonding the plurality of semiconductor devices to the at least one substrate; wherein the frame driving mechanism moves and positions the two or more patch heads in a horizontal plane, the patch assembly driver moves and positions the two or more patch heads in a vertical direction, the two or more patch heads being configured to simultaneously pick up and move the plurality of semiconductor devices in a horizontal plane along an X-axis and a Y-axis and in a vertical direction, and simultaneously bond the plurality of semiconductor devices at respective patch positions on the at least one substrate; and (e) at least one vision component connected to the rack assembly and moved simultaneously with the two or more patch heads, for simultaneously aligning a plurality of semiconductor devices to the at least one substrate; the at least one vision component includes at least one pair of alignment cameras, each pair of alignment cameras includes an upward-looking camera and a downward-looking camera, the upward-looking camera is configured to vertically observe a target field of view upward and capture an upward reference view of a corresponding one of a plurality of semiconductor devices picked up by a corresponding one of the two or more patch heads, the downward-looking camera is axially aligned with the upward-looking camera, and is used to vertically observe the target field of view downward and capture a downward reference view of a corresponding patch position on the at least one substrate, wherein the plurality of semiconductor devices are aligned by slightly shifting portions of the two or more patch heads relative to their respective patch positions based on the upward reference view and the downward reference view captured by each pair of alignment cameras, thereby simultaneously aligning the plurality of semiconductor devices to correct alignment offsets with the corresponding patch positions on the at least one substrate.

2. The semiconductor device mounting device according to claim 1, wherein Each of the patch headers comprises: a die attach tool for attaching bare die; as well as A patch head driving mechanism is used to drive the patch tool in a horizontal plane so that the bare die is aligned with the corresponding patch position on the substrate when the bare die is held above the corresponding patch position.

3. The semiconductor device mounting device according to claim 1, wherein Each of said visual components further comprises: A visual component driving mechanism, used for driving the alignment camera to between the patch tool of the patch head and the corresponding patch position; The semiconductor device is aligned with the corresponding patch position through the corresponding reference view.

4. The semiconductor device mounting device according to claim 3, wherein For each placement head, the driving of the placement tool includes planar movement and / or angular movement of the placement tool in a horizontal plane.

5. The semiconductor device mounting device according to claim 3, wherein Each patch head is paired with a vision component, and the vision component driving mechanism is configured to drive the alignment camera to the bottom of its corresponding patch head.

6. The semiconductor device mounting device according to claim 3, wherein Each patch component is paired with a vision component, and the vision component driving mechanism is configured to continuously drive the alignment camera to below the patch head of its corresponding patch component.

7. The semiconductor device mounting device according to claim 3, wherein Each patch assembly includes a plurality of patch heads, and the plurality of patch heads can be driven vertically as a whole.

8. The semiconductor device mounting device according to claim 3, wherein Each placement head includes a force control unit configured to control the impact force of placing the semiconductor device on the substrate.

9. The semiconductor device mounting device according to claim 2, wherein The placement head driving mechanism is also configured to retract the placement tool.

10. The semiconductor device mounting device according to claim 3, wherein The feeder assembly includes a set of feeder units that are driven between one or more semiconductor device sources and the placement head.

11. The semiconductor device mounting device according to claim 10, wherein Each of the die bonding heads is paired with a die feeder unit configured to individually feed semiconductor devices to the die bonding head.

12. The semiconductor device mounting device according to claim 10, wherein Each chip assembly is paired with a chip feeder unit configured to feed the semiconductor device integrally to a chip head of the chip assembly.

13. The semiconductor device mounting device according to claim 12, wherein Each feeder unit includes a conversion tool configured to arrange the semiconductor devices on the feeder unit according to the pitch of the corresponding patch components.

14. The semiconductor device mounting apparatus according to claim 3, wherein The rack assembly is configured as: The patch assembly is driven in a horizontal plane to continuously position the patch head above the patch position on the substrate; and the alignment camera is driven in a horizontal plane to follow the corresponding patch head.

15. The semiconductor device mounting apparatus according to claim 3, wherein The patch tool is detachably connected to the patch head.

16. A mechanism for aligning a plurality of semiconductor devices, comprising: (a) at least one patch assembly positioned on at least one substrate; wherein the at least one patch assembly comprises two or more patch heads and a patch assembly driver for simultaneously picking up the plurality of semiconductor devices and simultaneously bonding the plurality of semiconductor devices to the at least one substrate; wherein the rack drive mechanism moves and positions the two or more patch heads in a horizontal plane, the patch assembly driver moves and positions the two or more patch heads in a vertical direction, the two or more patch heads are configured to simultaneously pick up and move the plurality of semiconductor devices in a horizontal plane along an X-axis and a Y-axis and in a vertical direction, and simultaneously bond the plurality of semiconductor devices at respective patch positions on the at least one substrate; and (b) at least one vision component connected to the rack assembly and moved simultaneously with the two or more placement heads, for providing reference views of the plurality of semiconductor devices and the at least one substrate, the at least one vision component comprising at least one pair of alignment cameras, each pair of alignment cameras comprising an upward-looking camera and a downward-looking camera, the upward-looking camera being configured to vertically observe a target field of view upward and capture an upward reference view of a corresponding one of the plurality of semiconductor devices picked up by a corresponding one of the two or more placement heads, the downward-looking camera being axially aligned with the upward-looking camera, for vertically observing the target field of view downward and capturing a downward reference view of a corresponding placement position on the at least one substrate, wherein the plurality of semiconductor devices are aligned by slightly shifting portions of the two or more placement heads relative to their respective placement positions based on the upward reference views and downward reference views captured by each pair of alignment cameras, thereby simultaneously aligning the plurality of semiconductor devices to correct alignment offsets with the corresponding placement positions on the at least one substrate; Wherein, by moving the plurality of semiconductor devices horizontally and vertically, the patch assembly aligns the plurality of semiconductor devices with the at least one substrate according to the reference view.

17. A semiconductor device chip mounting method, the method comprising: At least one substrate is supported on a base assembly, the at least one substrate is located below at least one patch assembly, the at least one patch assembly includes two or more patch heads and a patch assembly driver; The two or more bonding heads are configured to simultaneously pick up and move a plurality of semiconductor devices in a horizontal plane along an X-axis and a Y-axis and in a vertical direction, and to simultaneously bond the plurality of semiconductor devices at respective bonding locations on the at least one substrate; Supplying a plurality of semiconductor devices to the two or more bonding heads for simultaneously picking up the plurality of semiconductor devices and simultaneously bonding the plurality of semiconductor devices to the at least one substrate, thereby simultaneously bonding at bonding positions of the at least one substrate; The two or more chip mounting heads are moved and positioned in a horizontal plane by a rack driving mechanism, and each chip mounting head is vertically driven by the chip mounting assembly driver to move and position the two or more chip mounting heads so as to simultaneously pick up the supplied semiconductor devices using the chip mounting tools of the chip mounting heads; Driving a pair of alignment cameras to between the patch tool and the patch position; The alignment camera is used to capture a reference view of each semiconductor device and patch position; the alignment camera includes an upward-looking camera and a downward-looking camera, the upward-looking camera is configured to vertically observe the target field of view upward and capture an upward reference view of a corresponding semiconductor device among a plurality of semiconductor devices picked up by a corresponding one of the two or more patch heads, and the downward-looking camera is axially aligned with the upward-looking camera, and is used to vertically observe the target field of view downward and capture a downward reference view of the corresponding patch position on the at least one substrate; Simultaneously aligning the plurality of semiconductor devices to correct alignment offsets with corresponding bonding positions on the at least one substrate by slightly moving portions of two or more bonding heads relative to respective bonding positions based on upward reference views and downward reference views captured by respective pairs of alignment cameras, and driving the bonding tool in a horizontal plane to align the semiconductor devices to their corresponding bonding positions while the semiconductor devices are held above the bonding positions based on the reference views; as well as The bonding head is driven vertically to enable the bonding tool to bond the semiconductor device at a bonding position.

18. The semiconductor device mounting method according to claim 17, wherein The aligning includes calculating an alignment offset between the semiconductor device and a patch location based on the reference view.

19. The semiconductor device mounting method according to claim 17, wherein The reference view includes a demarcation pattern of the semiconductor device and patch locations.

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