Resin material supply device, resin molding device, and method for manufacturing resin molded product

Abstract

The present invention provides a resin material supply device, a resin molding device, and a method for manufacturing a resin molded product that can control the supply amount of resin material with high precision. The resin material supply device includes: a resin material supply unit that supplies resin material; a first resin material conveying unit that supplies resin material from the resin material supply unit; a second resin material conveying unit that conveys the resin material conveyed by the first resin material conveying unit to a molding die; and a control unit that adjusts the supply amount of resin material from the resin material supply unit at a certain time based on the supply amount of resin material from the resin material supply unit at a time before the certain time when the resin material supplied to one of the second resin material conveying units is divided into multiple times and supplied from the resin material supply unit to the first resin material conveying unit.

Description

Technical Field

[0001] The present invention relates to a resin material supply device, a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] Patent document 1 discloses a resin material supply device, which supplies the resin material supplied from a resin supply mechanism to a large resin holding tray via a small resin holding tray. In the resin material supply device, the large resin holding tray is pre-divided into a plurality of partitions. The small resin holding tray that receives the resin material from the resin supply mechanism supplies the resin material to a partition of the large resin holding tray. The small resin holding tray repeatedly receives the resin material from the resin supply mechanism and supplies the resin material to the large resin holding tray according to the number of partitions. After the resin material is supplied to the large resin holding tray as a whole in the manner described above, the resin material is transported to the mold cavity of the forming mold via the large resin holding tray.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent No. 6039750 Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] In the technology described in Patent Document 1, in order to supply the resin material to the forming mold, the resin material is supplied multiple times from one resin supply mechanism to a small resin holding tray. In this case, if an error occurs in the supply amount of the resin material supplied by the resin supply mechanism, there is a risk that the error will accumulate and increase depending on the number of times the resin material is supplied by the resin supply mechanism.

[0008] The present invention is made in view of the above situation, and the problem to be solved is to provide a resin material supply device, a resin molding device and a method for manufacturing a resin molded product that can control the supply amount of the resin material with high accuracy.

[0009] [Technical means to solve the problem]

[0010] The problem to be solved by the present invention is as described above. In order to solve the above problem, the resin material supply device of the present invention includes: a resin material supply unit for supplying resin material; a first resin material conveying unit for supplying resin material from the resin material supply unit; a second resin material conveying unit for conveying the resin material conveyed by the first resin material conveying unit to a forming mold; and a control unit for adjusting the supply amount of the resin material from the resin material supply unit at a certain time based on the supply amount of the resin material from the resin material supply unit at a time before the certain time, when the resin material supplied to one of the second resin material conveying units is divided into multiple times and supplied from the resin material supply unit to the first resin material conveying unit.

[0011] Furthermore, the resin molding device of the present invention includes the resin material supplying device.

[0012] Furthermore, a method for manufacturing a resin molded product according to the present invention manufactures a resin molded product using the resin molding apparatus.

[0013] [Effects of the Invention]

[0014] According to the present invention, the supply amount of the resin material can be controlled with high accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic plan view showing the overall structure of a resin molding apparatus according to one embodiment of the present invention.

[0016] Figure 2 This is a front view showing a state where the resin material storage device is installed in the resin supply module.

[0017] Figure 3 It is a front view showing the resin material storage device.

[0018] Figure 4 It is a side view showing the resin material storage device.

[0019] Figure 5 It is a side sectional view showing the structure of a small tray, a large tray and a diffusion plate.

[0020] Figure 6 It is a plan view showing the structure of a small tray and a large tray.

[0021] Figure 7 (a) is a plan view showing the moving trajectory of the material trough relative to the small tray. Figure 7 (b) is a plan view showing a state where the resin material is supplied to half of the tray. Figure 7 (c) is a plan view showing a state where the small tray is reversed. Figure 7(d) is a plan view showing a state where the resin material is supplied to the entire area of ​​the small tray.

[0022] Figure 8 This is a diagram showing an example of the result of supplying the resin material (target supply amount, actual supply amount).

[0023] Fig. 9 This is a flowchart showing the processing contents for setting the target supply amount based on the previous supply amount of the resin material.

[0024] Fig.10 It is a timing chart showing an example of supply of the resin material in the first stage and the second stage.

[0025] Fig.11 1 is a flowchart showing the content of the process for supplying the resin material in the first stage.

[0026] Fig.12 1 is a flowchart showing the content of the process for supplying the resin material in the second stage.

[0027] Fig.13 (a) is a timing chart showing an example in which the output cycle of the second stage is changed. Fig.13 (b) is a timing diagram showing an example in which the output cycle and command output of the second stage are changed. Fig.13 (c) is a timing chart showing an example in which the time width of the second-stage command output is changed.

[0028] [Explanation of Symbols]

[0029] 1: Resin molding device

[0030] 10: Substrate loading and unloading module

[0031] 11: Move-in department

[0032] 12: Moving out department

[0033] 13: Inspection Department

[0034] 14: Arm mechanism

[0035] 14a: Attach hands

[0036] 14b: Arm

[0037] 14c: Driving unit

[0038] 20: Baseboard transfer module

[0039] 21: Loader

[0040] 22: Uninstaller

[0041] 30: Forming module

[0042] 31: Forming die (lower die)

[0043] 31a: Diffuser

[0044] 40: Resin supply module (resin material supply device)

[0045] 40a, 161: Frame

[0046] 41: Small tray (first resin material conveying unit)

[0047] 41a: Resin holding portion

[0048] 41b: Bezel

[0049] 41c, 41d: Slit

[0050] 42: Small pallet transport mechanism

[0051] 43: Large tray (second resin material conveying unit)

[0052] 43a: Frame member

[0053] 43b, 111, 131: Storage

[0054] 43c: Slot

[0055] 44: Large pallet transport mechanism

[0056] 50: Control Department

[0057] 100: Resin material storage device

[0058] 110: Stocker

[0059] 112, 132: Supply Department

[0060] 112a, 132a: Supply port

[0061] 120: First vibration part

[0062] 130: Tank (resin material supply unit)

[0063] 140: Second vibration unit

[0064] 150: Weight scale

[0065] 160: Allocator

[0066] 164: Actuator

[0067] B, D, F, L, R, U: Arrow

[0068] Lr: rail

[0069] P: Substrate

[0070] S: Start position

[0071] S101~S111, S201~S206, S211~S214: Steps

[0072] t1, t2, t3: time

[0073] T1, T2: output cycle

[0074] Td1, Td2: time width

[0075] Y1, Y2: size. DETAILED DESCRIPTION

[0076] In the following, the directions indicated by arrows U, D, F, B, L, and R in the drawings are respectively defined as upward, downward, forward, backward, left, and right directions for explanation.

[0077] First, use Figure 1 The structure of the resin molding device 1 of this embodiment is described. The resin molding device 1 performs resin sealing on electronic parts such as semiconductor chips to manufacture resin molded products. In particular, in this embodiment, a resin molding device 1 that adopts a compression molding method (compression method) in which the resin material in the mold cavity is compressed and molded is illustrated. Furthermore, in this embodiment, it is assumed that a granular resin material is used, but as the resin material, not only a granular material but also a material in any form such as a powder or liquid can be used.

[0078] The resin forming device 1 includes a substrate carrying in and out module 10, a substrate delivery module 20, a forming module 30, a resin supply module 40 and a control unit 50 as components. Each component can be loaded and unloaded relative to other components and can be replaced. In addition, for example, the forming module 30 can be one or more than three, etc., to increase or decrease each component.

[0079] The substrate loading and unloading module 10 loads in a substrate P equipped with electronic components, and unloads a substrate P sealed with resin. In this embodiment, it is assumed that a relatively large substrate P is used. For example, the substrate P is formed into a rectangular plate with a side of more than 450 mm, more than 500 mm, or more than 600 mm. The substrate loading and unloading module 10 mainly includes: a loading unit 11, a unloading unit 12, an inspection unit 13, and an arm mechanism 14.

[0080] The carrying-in section 11 is a section where substrates P that are not sealed with resin are placed. The carrying-out section 12 is a section where substrates P that are sealed with resin are placed. The carrying-in section 11 and the carrying-out section 12 can store a plurality of substrates P, respectively.

[0081] The inspection section 13 is a part that inspects the resin-sealed substrate P. The inspection section 13 includes a placement section on which the resin-sealed substrate P is placed, an inspection mechanism (not shown) that inspects the substrate P, and the like.

[0082] The arm mechanism 14 moves the substrate P. The arm mechanism 14 includes a suction hand 14a for suctioning the substrate P, an arm 14b for mounting the suction hand 14a, a driving unit 14c for appropriately rotating or moving the arm 14b, and the like.

[0083] The substrate delivery module 20 is a part that delivers the substrate P between the substrate loading / unloading module 10 and a forming module 30 described later. The substrate delivery module 20 mainly includes a loader 21 and an unloader 22 .

[0084] The loader 21 receives the substrate P that is not resin-sealed from the arm mechanism 14 and transports it to the forming mold 31 of the forming module 30 described later. The unloader 22 receives the substrate P that is resin-sealed from the forming mold 31 described later and transports it to the substrate loading and unloading module 10. The loader 21 and the unloader 22 can move along the guide rail Lr extending in the left-right direction. In the present embodiment, the loader 21 and the unloader 22 are connected to each other in a manner that they can move integrally.

[0085] The forming module 30 uses the resin material supplied from the resin supply module 40 described later to perform resin sealing on the electronic parts mounted on the substrate P. In the present embodiment, two forming modules 30 are arranged. By using two forming modules 30 to perform resin sealing on the substrate P in parallel, the manufacturing efficiency of the resin molded product can be improved. The forming module 30 mainly includes a forming mold 31, a mold clamping mechanism (not shown), etc.

[0086] The forming mold 31 uses a molten resin material to compress and mold the substrate P. The forming mold 31 includes a pair of upper and lower molds (an upper mold and a lower mold). A concave mold cavity (not shown) for accommodating the resin material is formed in the lower mold. In addition, a heater (not shown) for melting the resin material is provided in the forming mold 31.

[0087] The resin supply module 40 supplies resin material to the molding die 31 of the molding module 30. The resin supply module 40 mainly includes a resin material storage device 100, a small tray 41, a small tray conveying mechanism 42, a large tray 43, and a large tray conveying mechanism 44.

[0088] The resin material storage device 100 stores the resin material and supplies the resin material to the small tray 41 described later. Two resin material storage devices 100 are arranged in a left-right manner. The two resin material storage devices 100 can supply the resin material to the two small trays 41 in parallel. In addition, the detailed structure of the resin material storage device 100 will be described later.

[0089] The small tray 41 supplies the resin material received from the resin material storage device 100 to a large tray 43 described later. The small tray 41 can hold the resin material on the upper surface. The small tray 41 is formed so that the size in a plan view is about one-fourth of the size of the large tray 43 described later.

[0090] The small tray conveying mechanism 42 conveys the small tray 41 to an appropriate position. The small tray conveying mechanism 42 can convey the small tray 41 between the resin material storage device 100 and the large tray 43 so that the small tray 41 can reciprocate.

[0091] The large tray 43 supplies the resin material received from the small tray 41 to the forming mold 31 of the forming module 30. The large tray 43 can hold the resin material on the upper surface. The large tray 43 is formed in a planar shape (for example, a rectangular shape) corresponding to the planar shape of the cavity of the forming mold 31.

[0092] The large tray conveying mechanism 44 conveys the large tray 43 to an appropriate position. The large tray conveying mechanism 44 is movable along a guide rail Lr extending in the left-right direction.

[0093] Furthermore, the resin supply module 40 is an embodiment of the resin material supply device of the present invention. In addition, the small tray 41 and the large tray 43 are respectively an embodiment of the first resin material conveying unit and the second resin material conveying unit of the present invention. The detailed structure of the small tray 41 and the large tray 43 will be described later.

[0094] The control unit 50 controls the operation of each module of the resin molding apparatus 1. The control unit 50 controls the operation of the substrate loading and unloading module 10, the substrate delivery module 20, the molding module 30, and the resin supply module 40. In addition, the control unit 50 can be used to arbitrarily change (adjust) the operation of each module.

[0095] Next, an outline of the operation (a molding method of a resin molded product, a manufacturing method of a resin molded product) of the resin molding apparatus 1 configured as described above will be described.

[0096] First, the substrate P which is not resin-sealed and is arranged in the loading section 11 is transported to the loader 21 by the arm mechanism 14 .

[0097] Next, the loader 21 moves along the guide rail Lr to transport the substrate P to one of the forming modules 30 . The substrate P transported to the forming module 30 is sucked and held by the upper mold of the forming mold 31 .

[0098] Next, a release film is disposed so as to cover the lower mold of the forming mold 31 .

[0099] Next, the resin material is supplied from the resin supply module 40 to the molding die 31 of the molding module 30. Here, in the resin supply module 40, the resin material supplied in advance from the resin material storage device 100 is supplied to the large tray 43 via the small tray 41. Since the small tray 41 is formed in a manner to be about a quarter of the size of the large tray 43, the resin material is supplied to the entire large tray 43 substantially uniformly using a total of four small trays 41.

[0100] The large tray conveying mechanism 44 moves along the guide rail Lr to convey the large tray 43 holding the resin material to the forming mold 31 of the forming module 30. Thereafter, the resin material on the large tray 43 is supplied to the cavity of the forming mold 31 (lower mold). After supplying the resin material to the forming mold 31, the large tray conveying mechanism 44 returns to the resin supply module 40.

[0101] Next, the resin material is melted by the heater of the forming mold 31. Thereafter, the lower mold and the upper mold are relatively close to each other (mold closing) by the mold closing mechanism, and the electronic parts of the substrate P are immersed in the resin material. In this state, appropriate pressure is applied to the resin material. By hardening the resin material in the above state, a substrate P with electronic parts sealed by resin can be obtained.

[0102] Then, the lower mold and the upper mold are relatively separated (opened) by the mold clamping mechanism. In addition, the unloader 22 moves along the guide rail Lr to receive the substrate P with the electronic components sealed with resin from the forming mold 31. At this time, the loader 21 that moves with the unloader 22 can be used to place a new substrate P on the forming mold 31. Thereafter, the unloader 22 moves along the guide rail Lr and returns to the substrate transfer module 20.

[0103] Next, the substrate P held by the unloader 22 is conveyed to the inspection unit 13 by the arm mechanism 14. In the inspection unit 13, the substrate P in which the electronic components are sealed with resin is inspected.

[0104] Next, the substrate P after the inspection is completed is conveyed to the unloading section 12 by the arm mechanism 14. The substrate P arranged in the unloading section 12 is appropriately unloaded to the outside.

[0105] As described above, a resin molded product can be manufactured by resin-sealing the electronic components mounted on the substrate P. Furthermore, although the description is omitted in the above-mentioned operation description, in the resin molding device 1 of the present embodiment, the substrate P can be resin-sealed in parallel using two molding modules 30. Specifically, when resin sealing (melting of the resin material, or pressing of the substrate P, etc.) is performed using one of the molding modules 30, the resin material can be supplied to the other molding module 30, or the substrate P can be resin-sealed. In this way, a resin molded product (a substrate P with electronic components sealed with resin) can be manufactured efficiently.

[0106] Below, use Figures 2 to 8 The resin material storage device 100 of the resin supply module 40 will be described in detail.

[0107] like Figure 2 As shown, the resin material storage device 100 is arranged in two on the left and right sides in the frame 40a of the resin supply module 40. The two resin material storage devices 100 include substantially the same structure except that they are arranged substantially symmetrically on the left and right sides. Therefore, the structure of one (right) resin material storage device 100 is specifically described below, and the description of the structure of the other (left) resin material storage device 100 is omitted.

[0108] like Figure 3 and Figure 4 As shown, the resin material storage device 100 mainly includes: a storage container 110, a first vibration part 120, a material trough 130, a second vibration part 140, a weighing meter 150 and a dispenser 160. Figure 3 and Figure 4 In FIG. 1 , the resin material stored in the hopper 110 and the tank 130 is indicated by hatching.

[0109] The stocker 110 stores the resin material and supplies it to a material tank 130 described later. The stocker 110 mainly includes a storage portion 111 and a supply portion 112 .

[0110] The storage part 111 is a part for storing resin material. The storage part 111 is formed in a hollow shape so that the resin material can be stored inside. An opening (not shown) for supplying the resin material to the inside is formed at the upper part of the storage part 111. The resin material is supplied (replenished) to the storage part 111 at an appropriate time.

[0111] The supply section 112 is a part that supplies the resin material stored in the storage section 111 to the material tank 130 described later. The supply section 112 is formed in a hollow shape so that the resin material can move inside. The supply section 112 is formed in a manner extending from the lower part of one side of the storage section 111 to the upper part of the distributor 160 described later. Near the front end (left end) of the supply section 112, a supply port 112a is provided for discharging the resin material inside the supply section 112 downward.

[0112] The first vibrating unit 120 is used to discharge the resin from the hopper 110. The first vibrating unit 120 is provided at the lower portion of the hopper 110 and can vibrate the hopper 110. The first vibrating unit 120 can move the resin material in the storage portion 111 to the supply portion 112 by vibrating the hopper 110, and discharge the resin material downward from the supply port 112a.

[0113] The material tank 130 stores the resin material and supplies it to the small tray 41. The material tank 130 is an embodiment of the resin material supply unit of the present invention. Figure 3 As shown, two troughs 130 are arranged side by side below the stocker 110 (in a plan view, at positions symmetrical to each other with the supply port 112a of the stocker 110 interposed therebetween). The trough 130 mainly includes a storage portion 131 and a supply portion 132.

[0114] The storage part 131 is a part for storing the resin material. The storage part 131 is formed in a hollow shape so that the resin material can be stored inside. An opening (not shown) for supplying the resin material to the inside is formed at the upper part of the storage part 131.

[0115] The supply portion 132 is a portion that supplies the resin material stored in the storage portion 131 to the small tray 41. The supply portion 132 is formed in a hollow shape so that the resin material can move inside. The supply portion 132 is formed in a manner extending from the lower portion of one side of the storage portion 131 in a single direction (rearward). A supply port 132a for discharging the resin material inside the supply portion 132 downward is provided near the front end portion (rear end portion) of the supply portion 132.

[0116] Furthermore, the two material tanks 130 are arranged at positions close to each other to some extent so that the resin material can be simultaneously supplied to one small tray 41. Specifically, the two material tanks 130 (especially the supply port 132a) are arranged in a manner that the interval in the left-right direction becomes approximately half of the left-right width of the small tray 41.

[0117] Figure 4 The second vibrating part 140 shown is used to discharge the resin from the trough 130. The second vibrating part 140 is disposed at the lower part of the trough 130 and can vibrate the trough 130. The second vibrating part 140 can move the resin material in the storage part 131 to the supply part 132 by vibrating the trough 130, and discharge it downward from the supply port 132a.

[0118] The weight meter 150 is used to measure the weight of the resin material stored in the tank 130. The weight meter 150 is provided at the lower portion of the second vibrating portion 140 and can measure the weight of the tank 130 and the second vibrating portion 140. Since the weights of the tank 130 and the second vibrating portion 140 are known, the weight of the resin material stored in the tank 130 can be measured by subtracting the weights of the tank 130 and the second vibrating portion 140 from the measured value of the weight meter 150.

[0119] The second vibrating part 140 and the weight meter 150 are respectively disposed on the two material troughs 130 .

[0120] Figure 3 and Figure 4The distributor 160 shown is used to distribute the resin material supplied from the stocker 110 to the two material tanks 130. The distributor 160 is arranged below the supply port 112a of the stocker 110. The distributor 160 mainly includes a frame 161 and an actuator 164.

[0121] A flow path of the resin material is formed in the frame 161. The actuator 164 can switch the flow path of the resin material flowing in the frame 161 by appropriately operating a switching member (not shown) arranged in the frame 161. The actuator 164 can distribute the resin material supplied from the top (supply port 112a of the storage container 110) to any one of the left and right pair of material tanks 130 arranged below by switching the flow path of the resin material.

[0122] Next, use Figure 5 and Figure 6 The small tray 41 and the large tray 43 that supply the resin material received from the resin material storage device 100 to the molding module 30 will be described in detail. Figure 5 and Figure 6 This is a schematic diagram for explaining the structure of each component, and the relative positional relationship of each component shown in the figure is different from the actual positional relationship. Figure 5 and Figure 6 In other figures, the shape of the small tray 41 is simplified and shown.

[0123] The small tray 41 mainly includes a resin holding portion 41 a and a baffle 41 b .

[0124] The resin holding portion 41a is a portion for holding a resin material. The resin holding portion 41a is formed in a substantially square plate shape in a plan view. The resin holding portion 41a is provided with a plurality of slits 41c extending horizontally arranged in a front-rear manner.

[0125] The baffle 41b is a portion that can block the slit 41c of the resin retaining portion 41a from below. The baffle 41b is formed into a plate-like shape that is approximately square when viewed from above. The baffle 41b is formed with a slit 41d in a manner corresponding to the slit 41c of the resin retaining portion 41a. That is, the slit 41d of the baffle 41b is formed in a manner that extends left and right and is arranged in a plurality of front and back. In addition, the front and rear intervals of the slits 41d of the baffle 41b are formed in a manner that is the same as the front and rear intervals of the slits 41c of the resin retaining portion 41a. The baffle 41b is arranged below the resin retaining portion 41a. The baffle 41b can be moved relative to the resin retaining portion 41a in the front and back directions by a moving mechanism not shown in the figure.

[0126] like Figure 5As shown, when the slit 41d of the baffle plate 41b and the slit 41c of the resin holding portion 41a are not facing each other up and down, the slit 41c of the resin holding portion 41a is blocked from below by the baffle plate 41b. In this state, the resin material can be held on the upper surface of the small tray 41 (specifically, in the slit 41c of the resin holding portion 41a). In addition, by moving the baffle plate 41b so that the slit 41c of the resin holding portion 41a and the slit 41d of the baffle plate 41b face each other, the resin material held in the slit 41c of the resin holding portion 41a can be discharged downward. The resin material discharged from the small tray 41 is supplied to the storage portion 43b of the large tray 43 described later.

[0127] The large tray 43 mainly includes a frame member 43 a and a storage portion 43 b .

[0128] The frame member 43a is a member that supports the storage portion 43b. The frame member 43a is formed in a substantially square frame shape in a plan view. That is, the frame member 43a is formed so that a substantially central portion is opened in a plan view.

[0129] The storage portion 43b is a portion for storing resin material. The storage portion 43b is formed into a roughly cylindrical shape. The storage portion 43b is arranged on the inner side (opening portion) of the frame member 43a with the length direction facing left and right. The left and right ends of the storage portion 43b can be supported rotatably relative to the frame member 43a. A groove 43c capable of storing resin material is formed on the side of the storage portion 43b. The groove 43c is formed in a manner extending along the length direction of the storage portion 43b. The storage portion 43b is arranged in a plurality of front and back arrangements. The front and rear intervals (pitch) between adjacent storage portions 43b are formed in a manner that is the same as the front and rear intervals (pitch) of the slit 41c of the small tray 41. The storage portion 43b can be rotated at an arbitrary angle relative to the frame member 43a by a driving mechanism not shown in the figure.

[0130] like Figure 5 As shown, when the groove 43c of the storage portion 43b faces upward, the resin material can be stored in the groove 43c. In addition, by rotating the storage portion 43b so that the groove 43c faces downward, the resin material stored in the groove 43c can be discharged downward.

[0131] Here, the left-right length of the slit 41c of the small tray 41 is formed so as to be approximately half of the left-right length of the storage section 43b (groove 43c) of the large tray 43. In addition, the number of the slits 41c of the small tray 41 is formed so as to be half of the number of the storage sections 43b of the large tray 43. In this way, the size of the small tray 41 when viewed from above is formed so as to be approximately one-fourth of the size of the large tray 43. Therefore, in order to supply the resin material to the entire storage section 43b of the large tray 43 using the small tray 41, a total of four small trays 41 are required.

[0132] Next, the operation of the resin supply module 40 configured as described above (operation for supplying the resin material from the tank 130 to the forming mold 31 via the small tray 41 and the large tray 43 ) will be described.

[0133] When the weight of the resin material stored in the tank 130 is detected by the weight meter 150 to be lower than a predetermined value, the control unit 50 controls the operation of the first vibrating unit 120 and the dispenser 160 to supply the resin material to the tank 130 .

[0134] Specifically, the first vibrating part 120 operates to discharge the resin material from the supply port 112a of the hopper 110. The resin material is appropriately distributed by the dispenser 160 and supplied to the trough 130 where the weight of the resin material is lower than a predetermined value. Thus, the trough 130 always contains the resin material with a weight greater than the predetermined value.

[0135] The resin material stored in the left and right tanks 130 as described above is supplied to the large tray 43 via the small tray 41. This will be described in detail below.

[0136] like Figure 7 As shown in (a), when the resin material is supplied to the small tray 41, the small tray conveying mechanism 42 (see Figure 1 ), the small tray 41 before being supplied with the resin material moves to the lower side of the two material tanks 130. At this time, the position of the small tray 41 is adjusted so that the supply ports 132a of the two material tanks 130 are located just above the specified starting position S.

[0137] Next, the second vibration unit 140 operates to supply the resin material from the supply ports 132a of the two material troughs 130 to the small tray 41. In addition, simultaneously with the operation of the second vibration unit 140, the small tray 41 starts to move in the horizontal direction. Specifically, the small tray 41 is appropriately moved forward and backward and left and right by the small tray conveying mechanism 42. The small tray conveying mechanism 42 moves the small tray 41 so that the supply ports 132a of the two material troughs 130 pass through an area of ​​half (the front half) of the small tray 41. In addition, the small tray conveying mechanism 42 moves the small tray 41 so that the supply ports 132a of the two material troughs 130 eventually return to directly above the starting position S. Figure 7 (a) shows an example of relative movement trajectories of the two material troughs 130 with respect to the small tray 41.

[0138] When the supply ports 132 a of the two material troughs 130 return to just above the start position S, the second vibrating unit 140 stops, and the supply of the resin material from the material troughs 130 to the small tray 41 stops.

[0139] In this way, the resin material is supplied to the half (front half) area of ​​the small tray 41 (see Figure 7 (b)). Figure 7 (a)~ Figure 7 In (d), the area supplied with the resin material is shown by shadow. Furthermore, by supplying the resin material once using the material tank 130 (supplying the resin material from the operation of the second vibration part 140 to the stop), the weight of the resin material supplied to the small tray 41 is controlled so as to reach a preset target value (target supply amount). Specifically, by appropriately controlling the operation of the second vibration part 140 and the small tray conveying mechanism 42, the target supply amount of the resin material is supplied to the small tray 41.

[0140] Next, the front-to-back direction of the small tray 41 is reversed by the small tray conveying mechanism 42 (see Figure 7 (c)), supplying resin material from the two material troughs 130 to the remaining half of the area of ​​the small tray 41 to which the resin material is not supplied (refer to Figure 7 In this case, also along Figure 7 The small tray 41 is moved along the moving trajectory shown in (a), and the resin material is supplied from the material tank 130 to the small tray 41. In this way, when the resin material is supplied to the small tray 41, the front and rear directions of the small tray 41 are reversed and the resin material is supplied twice.

[0141] In the present embodiment, by adopting a structure in which the resin material is supplied to one small tray 41 using a plurality of (two) material tanks 130 , it is possible to shorten the supply time of the resin material to the small tray 41 .

[0142] Furthermore, as in the present embodiment, when a single material trough 130 is used instead of a plurality of material troughs 130 to shorten the supply time of the resin material to the small tray 41, a method of increasing the flow rate of the resin material supplied from the material trough 130 to the small tray 41 is also considered. However, this sometimes requires the enlargement of the material trough 130, which is not preferred. In addition, there is a risk that the accuracy of controlling the supply amount of the resin material (for example, the measurement accuracy of the weight meter 150, or the accuracy of the flow rate of the resin material using the material trough 130) will decrease, which is also not preferred. In contrast, in the present embodiment, by using a plurality of material troughs 130, the enlargement of each material trough 130 and the decrease in the accuracy of controlling the supply amount of the resin material are suppressed.

[0143] Furthermore, in the present embodiment, two resin material storage devices 100 (see Figure 1 and Figure 2). Thus, the resin material can be supplied to the two small trays 41 in parallel, so that the supply time of the resin material to the large tray 43 and the forming mold 31 can be shortened, and the efficiency of manufacturing the resin molded product using the resin molding device 1 can be improved.

[0144] The resin material supplied to the small tray 41 in the above manner is supplied to the cavity of the molding die 31 via the large tray 43. Specifically, the small tray 41 holding the resin material is moved to the upper side of the large tray 43 by the small tray conveying mechanism 42 (see Figure 5 ). Thereafter, by moving the baffle 41b of the small tray 41 relative to the resin holding portion 41a, the slit 41c of the resin holding portion 41a is opened, and the resin material is supplied from the small tray 41 to the large tray 43. The resin material supplied to the large tray 43 is stored in the groove 43c of the storage portion 43b.

[0145] Here, as described above, the small tray 41 is formed to be about a quarter of the size of the large tray 43. Figure 6 As shown, the four regions (see Figure 6 The resin material is supplied from the small tray 41 (shown in double-dashed lines). That is, the resin material is supplied from a total of four small trays 41 to the large tray 43.

[0146] The resin material is supplied from a total of four small trays 41, and the resin material is stored in the entire area of ​​the large tray 43. The large tray 43 storing the resin material is transported to the top of the forming mold 31 of the forming module 30 by the large tray transport mechanism 44. Thereafter, the storage portion 43b of the large tray 43 is turned upside down, and the resin material is supplied from the large tray 43 to the cavity of the forming mold 31.

[0147] At this time, a mold is placed between the large tray 43 and the cavity of the forming mold 31. Figure 5 The diffuser plate 31a is as shown. A plurality of through holes are provided in the diffuser plate 31a. In addition, the diffuser plate 31a can be vibrated by a driving mechanism not shown. The resin material dropped from the large tray 43 is diffused by the vibrating diffuser plate 31a. Thus, the resin material in the mold cavity of the forming mold 31 can be made uniform.

[0148] Next, an example of control for improving the accuracy of the resin supply amount by the resin material storage device 100 configured as described above will be described.

[0149] As described above, in this embodiment, a plurality of material tanks 130 are provided for one small tray 41. Thus, the resin material storage device 100 uses two material tanks 130 to supply the resin material to one small tray 41 (see Figure 7 (a)~ Figure 7(d)). In addition, the resin molding device 1 includes two resin material storage devices 100 (refer to Figure 2 ). That is, the resin molding device 1 of the present embodiment can use four material tanks 130 to supply the resin material to the two small trays 41 at the same time.

[0150] In addition, in this embodiment, a plurality of (for example, four) small trays 41 are provided with respect to a large tray 43. Thus, the resin material is supplied from a total of four small trays 41 to the large tray 43 (see Figure 6 ). In addition, the resin material storage device 100 supplies the resin material to the small tray 41 in two batches (see Figure 7 (a)~ Figure 7 (d)).

[0151] If we summarize these, Figure 8 As shown, in this embodiment, when supplying resin material to a large tray 43, four material tanks 130 (in Figure 8 In order to distinguish the four material tanks 130, they are marked as material tank (1) to material tank (4)) and supply the resin material to the small tray 41 four times respectively.

[0152] In this way, if multiple troughs 130 are used to supply the resin material multiple times, the errors in the supply amount of the resin material will accumulate, and there is a possibility that the total supply amount of the resin material supplied to the large tray 43 is greatly different from the target value (target total supply amount). Therefore, in this embodiment, when the resin material stored in the trough 130 is supplied to the large tray 43 via the small tray 41 as described above, control is performed to minimize the error in the total supply amount of the resin material. Figures 7 to 12 , the specific processing content in the control is described. Furthermore, Figure 8 The numerical values ​​shown are values ​​set for convenience in order to explain the present control, and do not limit the values ​​when the present control is actually performed.

[0153] exist Fig. 9 In step S101 shown, the control unit 50 substitutes a value of 1 into the variable N. Note that the variable N in this embodiment is used to grasp the number of times the resin material is supplied from the tank 130 to the small tray 41. After performing the process of step S101, the control unit 50 proceeds to step S102.

[0154] In step S102, the control unit 50 sets a target value (target supply amount) of the weight of the resin material initially (first time) supplied from the trough 130 to the small tray 41. Various methods can be used as a method of setting the first target supply amount.

[0155] In this embodiment, the control unit 50 divides the target total supply amount of the resin material supplied by four times of resin supply using the four material tanks 130 (the target value of the weight of the resin material to be supplied to a large tray 43) by the total number of times the resin is supplied from the material tank 130 to the small tray 41, thereby calculating the average value of the supply amount each time (the average supply amount), and sets the average value as the first target supply amount. Figure 8 In the example shown, the target total supply amount is 160.0 g, and the total number of times the resin is supplied by the tank 130 is 16. Therefore, the first target supply amount of each tank 130 is 10.0 g. After performing the process of step S102, the control unit 50 proceeds to step S103.

[0156] In step S103, the control unit 50 outputs a control signal (command value) to the second vibration unit 140 to supply the resin material from the trough 130 to the small tray 41. The control unit 50 controls the second vibration unit 140 to supply the set target supply amount of the resin material to the small tray 41. Fig.10 As shown, the control unit 50 continuously supplies the resin material to the small tray 41 during the first period (first stage), and intermittently supplies the resin material to the small tray 41 during the second period (second stage) after the first period. In this way, by combining the continuous supply of the resin material with the intermittent supply, the resin material can be supplied quickly and with high precision. Furthermore, the details of the processing in step S103 will be described later. After performing the processing of step S103, the control unit 50 transfers to step S104.

[0157] In step S104, the control unit 50 stops supplying the resin from the material tank 130. Furthermore, through the processing of steps S103 and S104, the control unit 50 controls the second vibration unit 140 to supply the target supply amount of the resin material to the small tray 41, but in fact there is a possibility of a slight error. Figure 8 In the example shown, if attention is paid to the first resin supply by tank (1) and tank (2), it can be seen that an error has occurred with respect to the target supply amount. After performing the process of step S104, the control unit 50 proceeds to step S105.

[0158] In step S105, the control unit 50 determines whether the variable N is an odd number. The process of step S105 is a process for determining the action (step S106 or step S107) of the small tray 41. When the control unit 50 determines that the variable N is an odd number, the process proceeds to step S106. On the other hand, when the control unit 50 determines that the variable N is not an odd number, the process proceeds to step S107.

[0159] In step S106, the control unit 50 rotates (reverses) the small tray 41. In this way, when the variable N is an odd number (yes in step S105), Figure 7 As shown in (b), the resin material is supplied to a half area of ​​the small tray 41, so the control unit 50 rotates (reverses) the small tray 41 to achieve a state in which the resin material can be supplied to the remaining half area.

[0160] On the other hand, in step S107, the control unit 50 transports the small tray 41 to the large tray 43 and supplies the resin material to the large tray 43. In this way, when the variable N is an even number (No in step S105), Figure 7 As shown in (d) , the resin material is supplied to the entire area of ​​the small tray 41 , so the control unit 50 supplies the resin material from the small tray 41 to the large tray 43 .

[0161] After performing the process of step S106 or step S107 , the control unit 50 proceeds to step S108 .

[0162] In step S108, the control unit 50 determines whether the variable N is 4. The process of step S108 is a process for determining whether the resin supply to the large tray 43 is completed. If the variable N is 4, it can be determined that four times of resin supply from each tank 130 have been completed (refer to Figure 8 ), that is, the resin supply to one large tray 43 is completed. Furthermore, in the present embodiment, each trough 130 supplies the resin to one large tray 43 four times, so in step S108, it is determined whether the variable N is 4, but the value used for the determination is not limited to 4, and can be arbitrarily set according to the required number of times the resin material is supplied to the large tray 43.

[0163] When the control unit 50 determines that the variable N is 4, the control unit 50 ends the present control. On the other hand, when the control unit 50 determines that the variable N is not 4, the process proceeds to step S109.

[0164] In step S109, the control unit 50 stores the amount of resin material (supply amount) actually supplied to the small tray 41 in step S103. The supply amount of the resin material to the small tray 41 can be determined by measuring the change (reduction) in the weight of the resin material stored in the material tank 130 using the weight meter 150. After performing the process of step S109, the control unit 50 transfers to step S110.

[0165] In step S110, the control unit 50 substitutes the value of N+1 into the variable N. That is, the control unit 50 increases the value of the variable N by 1. After performing the process of step S110, the control unit 50 proceeds to step S111.

[0166] In step S111, the control unit 50 sets the target supply amount for the Nth time. The control unit 50 sets (adjusts) the target supply amount so as to eliminate the error generated in the supply of the resin material last time (N-1th time). Specifically, the control unit 50 calculates the value (difference) obtained by subtracting the actual supply amount last time from the target supply amount last time, and adds it to the target supply amount (average supply amount) for the first time, thereby calculating the target supply amount for this time (Nth time).

[0167] For example, in Figure 8 In the example shown, the first target supply amount of the material tank (1) is 10.0 g, while the actual supply amount is 10.1 g. Therefore, the control unit 50 calculates the difference (-0.1 g) and adds it to the first target supply amount, thereby determining the second target supply amount to be 9.9 g. In the second resin supply using the material tank (1), if the resin material of the target supply amount set in this way can be supplied, the average of the first and second supply amounts is 10.0 g. That is, the error generated in the first supply of the resin material can be eliminated.

[0168] After performing the process of step S111 , the control unit 50 proceeds to step S103 to supply the target supply amount of the resin material to the small tray 41 .

[0169] Thus, the control unit 50 sets the target supply amount based on the supply amount of the resin material last time (step S111) in the second and subsequent resin supplies, and supplies the resin (step S103). The control unit 50 repeats the above process until N=4 in step S108 (i.e., the resin is supplied four times from each tank 130).

[0170] exist Figure 8 2 shows an example of the result of the target supply amount set by the control unit 50 up to the fourth time and the actual supply amount. In this way, when supplying the resin material each time after the second time, by correcting the control of the target supply amount of the resin material performed by each material tank 130, the error relative to the target total supply amount can be suppressed to a small value.

[0171] Furthermore, in the present embodiment, an example is shown in which the target supply amount of each time (after the second time) is adjusted based on the difference between the target supply amount of the resin material last time and the actual supply amount, but the present invention is not limited to this. For example, instead of adjusting the target supply amount of the resin material after the second time each time as in the present embodiment, it is also possible to adjust only the target supply amount of the resin material for the fourth time based on the supply amount of the resin material from the first to the third time. In this case, the target supply amount for the fourth time can be adjusted based on the difference between the total of the target supply amount of the resin material from the first to the third time and the total of the actual supply amount. In this way, the present invention can adjust the supply amount of the resin material based on the supply amount of the resin material before the last time.

[0172] In addition, in the present embodiment, an example is shown in which the target supply amount of this time is calculated by adding the difference between the target supply amount of the last resin material and the actual supply amount and the target supply amount of the first time (average supply amount), but the present invention is not limited to this, and the calculation method of the target supply amount can be set arbitrarily. For example, not only the difference between the target supply amount and the actual supply amount of the resin material can be considered to calculate the target supply amount, but also the tendency of the error can be considered. Specifically, in each supply of the resin material, the tendency of the error of the material tank 130 (such as an error of X% to Y% relative to the target supply amount) can also be learned, and the target supply amount that eliminates the tendency can be calculated.

[0173] Furthermore, in this embodiment, Fig. 9 In the process of step S103, the continuous supply of the resin material and the intermittent supply are combined to supply the resin material with high precision. The control of step S103 will be described in detail below.

[0174] like Fig.10 As shown, the control unit 50 controls the size of the command value given to the second vibration unit 140 so that in the first stage, the supply speed (supply amount per unit time) of the resin material becomes constant. The vibration intensity of the second vibration unit 140 varies according to the size of the command value. The size of the command value is calculated sequentially based on the deviation between the target value of the supply speed and the actual value of the supply speed. For example, the size of the command value is calculated sequentially through feedback control using the target value of the supply speed and the actual value of the supply speed as input. As a typical example of feedback control, proportional integral differential (PID) control can be used. Furthermore, in Fig.10 In order to simplify the description, the command value is shown in a substantially straight line.

[0175] The resin supply in the first stage (time t1 to time t2) ends at the time point when the measured value of the supply amount of the resin material reaches the end judgment value which is a predetermined amount less than the target amount. That is, at the end time point of the first stage, the command value is updated to zero. The end judgment value for ending the first stage is set within the following range: after the vibration of the second vibration part 140 stops, the supply amount of the resin material does not exceed the target amount by using the resin material ejected from the supply port 132a of the material tank 130 (that is, the inflow after the vibration stops).

[0176] In this way, in the first stage, the second vibrating part 140 is continuously vibrated, so that the resin material is continuously discharged from the supply port 132 a of the trough 130 .

[0177] In the second stage (time t2 to time t3) after the first stage, the control unit 50 intermittently discharges the resin material from the material tank 130 in such a manner that the supply amount of the resin material reaches the target amount. The second stage corresponds to an adjustment period for achieving high precision of the supply amount. Specifically, the control unit 50 intermittently gives a command value of a predetermined size to the second vibration unit 140. That is, the control unit 50 gives a pulse-shaped command value to the second vibration unit 140 in the second stage.

[0178] Here, the control unit 50 may also determine the size of the command value in the second stage based on the size of the command value given to the second vibration unit 140 in the first stage (the vibration intensity generated by the trough 130). Specifically, the size of the command value in the second stage may be made substantially consistent with the size of the command value immediately before the end of the first stage.

[0179] In addition, the magnitude of the command value in the second stage can be appropriately set to a value that does not cause problems in actual use. For example, the magnitude of the command value in the second stage can be set to -50% to +10% relative to the magnitude of the command value immediately before the end of the first stage. More specifically, it can be set to two values ​​selected from -50%, -45%, -40%, -35%, -30%, -25%, -20%, -15%, -10%, -9%, -8%, -7%, -6%, -5%, -4%, -3%, -2%, -1%, 0%, +1%, +2%, +3%, +4%, +5%, +6%, +7%, +8%, +9%, +10%, or at least one value selected from these values.

[0180] By making the size of the instruction value of the second stage roughly consistent with the size of the instruction value just before the end of the first stage and maintaining the continuity of the size of the instruction value between the first stage and the second stage, the distribution state of the resin material remaining in the material tank 130 serving as the powder and particle supply path can be maintained, thereby allowing the resin material to be continuously discharged even when the next supply of resin material starts.

[0181] Below, use Figures 10 to 12 , for the first stage ( Fig.11 Steps S201 to S206) and the second stage ( Fig.12 The specific processing contents in steps S211 to S214 are described.

[0182] First, use Fig.11 The processing contents of the first stage are described.

[0183] In step S201, the control unit 50 determines an initial value of the command value, that is, a command initial value. After performing the process of step S201, the control unit 50 proceeds to step S202.

[0184] In step S202, the control unit 50 outputs the command initial value as the command value within the predetermined initial operation time. In this way, by fixing the command value to the command initial value within the initial operation time, the initial discharge supply speed of the resin material can be stabilized. After performing the processing of step S202, the control unit 50 transfers to step S203.

[0185] In step S203, the control unit 50 calculates the command value based on the target value of the supply speed and the actual value of the supply speed. After performing the process of step S203, the control unit 50 proceeds to step S204.

[0186] In step S204, the control unit 50 updates the output command value to the command value calculated in step S203. After performing the process of step S204, the control unit 50 proceeds to step S205.

[0187] In step S205, the control unit 50 determines whether the supply amount of the resin material has reached the end determination value. If the control unit 50 determines that the supply amount of the resin material has reached the end determination value, the control unit 50 transfers to step S206. On the other hand, if the control unit 50 determines that the supply amount of the resin material has not reached the end determination value, the control unit 50 transfers to step S203 again.

[0188] In step S206, the control unit 50 stops outputting the command value. Thus, the processing in the first stage ends. After performing the processing in step S206, the control unit 50 transfers to Fig.12 Step S211 (second stage).

[0189] Thus, in the first stage, the processing from step S203 to step S205 is repeated, thereby performing feedback control so that the supply speed of the resin material becomes constant, and the resin material is continuously supplied (refer to Fig.10 ).

[0190] Next, use Fig.12 The processing contents of the second stage are described.

[0191] In step S211, the control unit 50 determines the size of the command value used in the second stage. For example, the control unit 50 may set the size of the command value immediately before the end of the first stage as the size of the command value used in the second stage. After performing the process of step S211, the control unit 50 transfers to step S212.

[0192] In step S212, the control unit 50 determines whether the supply amount of the resin material has reached the target supply amount. If the control unit 50 determines that the supply amount of the resin material has reached the target supply amount, the control ends the control. On the other hand, if the control unit 50 determines that the supply amount of the resin material has not reached the target supply amount, the control proceeds to step S213.

[0193] In step S213, the control unit 50 determines whether the output cycle of the command output has arrived. If the control unit 50 determines that the output cycle of the command output has arrived, the process proceeds to step S214. On the other hand, if the control unit 50 determines that the output cycle of the command output has not arrived, the process proceeds to step S213 again.

[0194] In step S214, the control unit 50 outputs the command value of the magnitude determined in step S211 over a predetermined time width. After executing the process of step S214, the control unit 50 again proceeds to step S212.

[0195] Thus, in the second stage, the control unit 50 repeatedly performs the processing from step S212 to step S214, thereby outputting a pulse-shaped command value. Thus, the resin material can be intermittently supplied until the supply amount of the resin material reaches the target supply amount (refer to Fig.10 ).

[0196] Furthermore, the output cycle of the pulse-shaped command value (refer to step S213) or the time width (or duty ratio) of the output command value (refer to step S214) can be predetermined.

[0197] Thus, in the first stage, by continuously supplying the resin material, the resin can be supplied quickly, thereby shortening the resin supply time. In addition, in the second stage, by intermittently supplying the resin material, the supply amount of the resin material can be highly accurate.

[0198] Furthermore, in this embodiment, an example is shown in which a pulse-shaped command value is output with a certain output cycle and time width in the second stage, but the present invention is not limited to this. For example, in the second stage, as the supply amount of the resin material approaches the target supply amount, the supply amount per unit time may be reduced. In this way, the supply amount of the resin material can be further accurately controlled.

[0199] As an example, in Fig.13 (a)~ Fig.13 (c) shows an example in which the second stage is divided into two sections (a first sub-stage and a second sub-stage) and the command value output in each sub-stage is made different.

[0200] Furthermore, the transition condition from the first sub-stage to the second sub-stage can be set arbitrarily. For example, the difference between the target supply amount and the actual supply amount becoming less than a specified value can be used as a transition condition. In addition, the second stage can be divided into more intervals (three or more sub-stages) instead of two intervals.

[0201] exist Fig.13 In the example shown in (a), the output cycle T2 of the second sub-stage is made longer than the output cycle T1 of the first sub-stage. Thus, the resin supply amount per unit time in the second sub-stage can be made smaller than that in the first sub-stage.

[0202] exist Fig.13 In the example shown in (b), it is shown that Fig.13 The example shown in (a) of FIG. 1 changes the output cycle in the same manner and makes the magnitude Y2 of the command output of the second sub-stage smaller than the magnitude Y1 of the command output of the first sub-stage. Thus, the resin supply amount per unit time in the second sub-stage can be further reduced than that in the first sub-stage.

[0203] exist Fig.13 In the example shown in (c), the time width Td2 of the command output of the second sub-stage is made shorter than the time width Td1 of the command output of the first sub-stage. Thus, the resin supply amount per unit time in the second sub-stage can be made smaller than that in the first sub-stage.

[0204] Thus, in the resin molding device 1 of the present embodiment, by combining the continuous supply and the intermittent supply of the resin material (see Figures 10 to 13 (c)) can realize the high precision of the supply amount of the resin material each time, and at the same time, the resin material supply amount can be adjusted by further eliminating the error of the previous resin supply (refer to Figure 8 and Fig. 9 ), achieving high precision in the total supply amount of resin material to a large tray 43.

[0205] As described above, the resin material supply device (resin supply module 40) of this embodiment includes:

[0206] A resin material supply unit (tank 130) for supplying resin material;

[0207] a first resin material conveying section (small tray 41) for supplying the resin material from the resin material supplying section;

[0208] A second resin material conveying unit (large tray 43) conveys the resin material conveyed by the first resin material conveying unit to the forming mold 31; and

[0209] The control unit 50, when dividing the resin material supplied to a second resin material conveying unit and supplying it from the resin material supply unit to the first resin material conveying unit multiple times, adjusts the supply amount of the resin material from the resin material supply unit at a certain time based on the supply amount of the resin material from the resin material supply unit at a time before the certain time.

[0210] By configuring in this way, the supply amount of the resin material can be controlled with high precision. That is, by adjusting the supply amount of the resin material from the material tank 130 to the small tray 41 based on the supply amount before the last time, the error generated before the last time can be eliminated, thereby the total supply amount of the resin material supplied to the large tray 43 can be controlled with high precision.

[0211] In addition, a plurality of the first resin material conveying parts (small tray 41 ) are provided for one second resin material conveying part (large tray 43 ).

[0212] By configuring in this way, the amount of resin material supplied can be controlled with high accuracy even in a structure where errors are easily accumulated. That is, by providing a plurality of small trays 41, the resin material can be supplied quickly. On the contrary, there is a concern that the error will increase due to the accumulation of errors, but by adjusting the amount of resin material supplied as in the present application, the increase of errors can be suppressed.

[0213] In addition, a plurality of the resin material supplying parts (tanks 130 ) are provided for one first resin material conveying part (small tray 41 ).

[0214] By configuring in this way, the supply amount of the resin material can be controlled with high accuracy even in a structure where errors are easily accumulated. That is, by providing a plurality of material tanks 130, the resin material can be supplied quickly. On the contrary, there is a concern that the error will increase due to the accumulation of errors, but by adjusting the supply amount of the resin material as in the present application, the increase of the error can be suppressed.

[0215] In addition, when the resin material is supplied from the resin material supply unit (material trough 130) to the first resin material conveying unit (small tray 41), the control unit 50 rotates the first resin material conveying unit and supplies the resin material to different areas in the first resin material conveying unit in multiple times.

[0216] By configuring in this way, the resin material can be evenly distributed and the supply amount of the resin material can be controlled with high precision. That is, by dividing the small tray 41 into a plurality of areas for supplying the resin material, the resin material in the small tray 41 can be evenly distributed, and the resin material can be adjusted to eliminate errors by utilizing the multiple supply of the resin material.

[0217] In addition, the control unit 50 controls the resin material supply unit so that, among the resin material supplied once from the resin material supply unit (material trough 130) to the first resin material conveying unit (small tray 41), the resin material is intermittently supplied to the first resin material conveying unit after the resin material is continuously supplied to the first resin material conveying unit.

[0218] This configuration allows the supply amount of the resin material to be controlled with higher accuracy. That is, by intermittently supplying the resin material, the supply of the resin material once can be made more accurate, and the total supply amount of the resin material supplied to the large tray 43 can be controlled with higher accuracy.

[0219] Furthermore, the resin molding device 1 of the present embodiment includes the resin material supply device (resin supply module 40 ).

[0220] With this configuration, the amount of resin material supplied can be controlled with high accuracy.

[0221] In addition, the method for manufacturing a resin molded product according to the present embodiment manufactures a resin molded product using the resin molding apparatus 1 described above.

[0222] With this configuration, the amount of resin material supplied can be controlled with high accuracy.

[0223] As mentioned above, although embodiment of this invention was described, this invention is not limited to this embodiment, It can change suitably within the range of the technical idea of ​​the invention described in a claim.

[0224] For example, in the present embodiment, a compression-type resin molding apparatus 1 is exemplified, but the present invention is not limited thereto, and other types (for example, a conveying type that transfers molten resin into a cavity and hardens it, etc.) may be employed.

[0225] The components (substrate loading and unloading module 10, etc.) used in the resin molding apparatus 1 of this embodiment are examples and can be properly installed, unloaded or replaced. For example, the substrate loading and unloading module 10 may not be provided, and the operator may load and unload the substrate P manually.

[0226] In addition, in this embodiment, although the rectangular plate-shaped substrate P is illustrated, the present invention is not limited to this, and substrates P of other various shapes (for example, a circular plate shape, etc.) can be used.

[0227] In addition, the structures of the small tray 41 and the large tray 43 shown in this embodiment are just examples, and can be changed to appropriate structures capable of conveying resin materials.

[0228] In addition, in the present embodiment, the resin material storage device 100 including two material tanks 130 (resin material supplying parts) for one small tray 41 is illustrated, but the present invention is not limited thereto, and the number of the material tanks 130 is not limited.

[0229] In addition, in the present embodiment, the resin material storage device 100 including four small trays 41 for one large tray 43 is exemplified, but the present invention is not limited thereto, and the number of small trays 41 is not limited thereto.

[0230] Furthermore, the resin molding apparatus 1 of the present embodiment includes two resin material storage devices 100 , but the present invention is not limited thereto, and may include one or three or more resin material storage devices 100 .

[0231] In addition, in the present embodiment, a single control unit 50 is used to control the operation of each module, but the present invention is not limited thereto, and a plurality of control units 50 may be provided. For example, a control unit 50 may be provided for each module or each device so that the operations of each module, etc. are linked to each other and each module is controlled individually.

Claims

1. A resin material supply device, comprising: Two hoppers for storing resin materials; Four resin material supplying parts for supplying resin material; two first resin material conveying sections for supplying resin material from the four resin material supplying sections; a second resin material conveying section for conveying the resin material conveyed by the first resin material conveying section to the forming mold; as well as The control unit adjusts the supply amount of the resin material from the resin material supply unit at a certain time based on the supply amount of the resin material from the resin material supply unit at a time before the certain time, when the resin material supplied to the second resin material conveying unit is divided into multiple times and supplied from the resin material supply unit to the first resin material conveying unit. Distribute and supply the resin material from one of the hoppers to the two resin material supplying parts, distributing and supplying the resin material from another of the hoppers to the remaining two of the resin material supplying parts, The four resin material supplying parts are respectively provided with a weight meter. When the two first resin material conveying parts are moved in the horizontal direction, the resin material is simultaneously supplied from the four resin material supplying parts to the two first resin material conveying parts. The two first resin material conveying sections respectively supply resin material to different areas in one second resin material conveying section, Repeating the operation of supplying the resin material from the four resin material supplying parts to the two first resin material conveying parts, and the operation of supplying the resin material from the two first resin material conveying parts to the one second resin material conveying part, In the operation of supplying the resin material from the four resin material supplying parts to the two first resin material conveying parts, the control part adjusts the supply amount based on the measurement of the weight scales respectively provided at the four resin material supplying parts.

2. The resin material supply device according to claim 1, wherein: When the resin material is supplied from the resin material supply unit to the first resin material conveying unit, the control unit rotates the first resin material conveying unit and supplies the resin material to different regions in the first resin material conveying unit in a plurality of times.

3. The resin material supply device according to claim 1 or 2, wherein: The control unit controls the resin material supply unit so that, among the resin material supplied once from the resin material supply unit to the first resin material conveying unit, the resin material is intermittently supplied to the first resin material conveying unit after the resin material is continuously supplied to the first resin material conveying unit.

4. A resin molding device comprising the resin material supply device according to any one of claims 1 to 3.

5. A method for manufacturing a resin molded product, comprising manufacturing the resin molded product using the resin molding apparatus according to claim 4.

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