A method for drawing wafer map

Abstract

The present invention relates to a method for drawing a wafer map. The commonly used office software EXCEL is adopted and VBA programming technology is used to realize automatic drawing of the wafer map, and the tube core coordinates are extracted according to the drawn wafer map. Then, the tested data is filled into the just drawn wafer map according to the tube core coordinates. The engineering and technical personnel can make intuitive analysis of the wafer MAP diagram according to the input screening conditions.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device chip manufacturing, and in particular to a method for drawing a wafer map. Background Art

[0002] In the semiconductor chip manufacturing process, engineering and technical personnel will adjust process parameters or conduct some process tests according to product parameter standards, and they need to make judgments on the adjusted results. Currently, the widely used data analysis software is MINTAB, SPSS and JMP, etc. These analysis software only analyze the frequency and causal relationship of the data, and lack analysis of the distribution of wafer data. Summary of the invention

[0003] In order to overcome the shortcomings of the prior art, the present invention provides a method for drawing a wafer map, which adopts the common office software EXCEL and uses VBA programming technology to realize automatic drawing of the wafer map.

[0004] In order to achieve the above object, the technical solution adopted by the present invention is:

[0005] A method for drawing a wafer map, comprising:

[0006] First, according to the arrangement rules of the wafers on the chip, the number of wafers in the edge area of ​​the chip is manually input into the EXCEL table. The number entered from the flat edge of the chip is used as the benchmark, and if the number of wafers in the next row is more than that in the previous row, a value of 1 / 2 of the increased number is entered; if the number of wafers in the next row is the same as that in the previous row, 0 is entered; if the number of wafers in the next row is less than that in the previous row, a value of -1 / 2 of the decreased number is entered, and finally a column of data is formed;

[0007] Run the VBA program again. The program will automatically draw a wafer map starting from the flat edge of the chip in a row-by-row scanning manner based on the wafer quantity data entered in the previous step, and mark the actual position of the wafer on the map with a specified color.

[0008] After the wafer map is drawn, run the VBA program again to return the die coordinate data of each wafer on the map according to the cell color marked in the previous step;

[0009] Finally, paste the corresponding coordinates of the data to be analyzed using the wafer map into the EXCEL table, run the compiled VBA program, and the program automatically fills the data into the drawn wafer map;

[0010] The technicians input the data filtering conditions according to their personal analysis requirements and run the prepared VBA program. The program analyzes the data on the wafer map in a scanning manner according to the input filtering conditions and colors them in different colors according to the filtering conditions.

[0011] Preferably, the flat edge position is a positioning edge of the chip.

[0012] Preferably, the VBA program is provided with a screening module, and different data types are defined with corresponding colors.

[0013] The beneficial effects of the present invention are:

[0014] The present invention adopts the common office software EXCEL and VBA programming technology to realize the automatic drawing of wafer maps, and extracts the tube core coordinates according to the drawn wafer maps, and then fills the tested data into the just drawn wafer maps according to the tube core coordinates. Engineering technicians can make intuitive analysis of the wafer MAP diagram according to the input screening conditions. This method is simple, the generated map is intuitive and takes into account the screening function, providing technicians with better technical support for data analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a flow chart of the method of the present invention;

[0016] Figure 2 A schematic diagram of an embodiment. DETAILED DESCRIPTION

[0017] The design scheme is described in detail below with reference to the accompanying drawings.

[0018] like Figure 1 As shown, the wafer map is drawn according to the process. First, the number of wafers in the edge area of ​​the chip is manually input into the EXCEL table according to the arrangement rules of the wafers on the chip. The number entered starting from the flat edge position of the chip is used as the reference. The flat edge position is the positioning edge of the chip. Row by row, if the number of wafers in the next row is more than that in the previous row, a value of 1 / 2 of the increased number is entered. If the number of wafers in the next row is the same as that in the previous row, 0 is entered. If the number of wafers in the next row is less than that in the previous row, a value of -1 / 2 of the decreased number is entered, and finally a column of data is formed;

[0019] Run the VBA program again. The program will automatically draw a wafer map starting from the flat edge of the chip in a row-by-row scanning manner based on the wafer quantity data entered in the previous step, and mark the actual position of the wafer on the map with a specified color.

[0020] After the wafer map is drawn, run the VBA program again to return the die coordinate data of each wafer on the map according to the cell color marked in the previous step;

[0021] Finally, paste the corresponding coordinates of the data to be analyzed using the wafer map into the EXCEL table, run the compiled VBA program, and the program automatically fills the data into the drawn wafer map;

[0022] The technicians input the filtering conditions for the data according to their personal analysis requirements and run the compiled VBA program. The VBA program has a filtering module. Different data types have corresponding colors defined. The program analyzes the data on the wafer map in a scanning manner according to the input filtering conditions and colors them with different colors according to the filtering conditions.

[0023] Example

[0024] like Figure 2 As shown, open the Excel table. First, according to the arrangement rules of the wafers on the chip, manually enter the number of wafers in the edge area of ​​the chip into the EXCEL table, and start drawing the map from the positioning edge position. If there are 14 wafers in the first row of graphics, use the yellow grid to directly paint 24 wafers. The number is used as the benchmark. The number in the next row is 4 more than the first row. Enter 2 in the table corresponding to this row, and so on. When entering the lower half of the chip, the number of wafers decreases, then enter a value of -1 / 2 of the number reduced relative to the previous row. If the number of wafers in the next row is the same as the number of wafers in the previous row, enter 0. Finally, a column of data consisting of positive and negative values ​​and 0 is formed. Run the compiled VBA program, and the program will automatically draw a wafer map starting from the flat edge of the chip in a row-by-row scanning manner based on this column of wafer quantity data, and mark the map with colors to form a table with colors. The shape of the spectrum. At this time, each colored table represents a coordinate. Run the VBA program, and according to the cell color marked in the previous step, return the core coordinate data of each wafer on the spectrum and present it on the EXCEL table. Paste the data that need to be analyzed by wafer spectrum into the EXCEL table in turn according to the corresponding coordinates. Run the compiled VBA program, and the program automatically fills the data into the drawn wafer spectrum, so that each wafer spectrum has a corresponding analysis data. The technician enters the filtering conditions for the data according to personal analysis requirements and runs the compiled VBA program. The VBA program has a filtering module. Different data types are defined with corresponding colors. The program analyzes the data on the wafer spectrum in a scanning manner according to the input filtering conditions and colors them with different colors according to the filtering conditions. At this time, the entire wafer spectrum is presented in the Excel table.

Claims

1. A method for drawing a wafer map, characterized in that: include: First, according to the arrangement rules of the wafers on the chip, the number of wafers in the edge area of ​​the chip is manually input into the EXCEL table. The number entered from the flat edge of the chip is used as the benchmark, and if the number of wafers in the next row is more than that in the previous row, a value of 1 / 2 of the increased number is entered; if the number of wafers in the next row is the same as that in the previous row, 0 is entered; if the number of wafers in the next row is less than that in the previous row, a value of -1 / 2 of the decreased number is entered, and finally a column of data is formed; Run the VBA program again. The program will automatically draw a wafer map starting from the flat edge of the chip in a row-by-row scanning manner based on the wafer quantity data entered in the previous step, and mark the actual position of the wafer on the map with a specified color. After the wafer map is drawn, run the VBA program again to return the die coordinate data of each wafer on the map according to the cell color marked in the previous step; Finally, paste the corresponding coordinates of the data to be analyzed using the wafer map into the EXCEL table, run the compiled VBA program, and the program automatically fills the data into the drawn wafer map; The technicians input the data filtering conditions according to their personal analysis requirements and run the prepared VBA program. The program analyzes the data on the wafer map in a scanning manner according to the input filtering conditions and colors them in different colors according to the filtering conditions.

2. The method for drawing a wafer map according to claim 1, characterized in that: The flat edge position is the positioning edge of the chip.

3. The method for drawing a wafer map according to claim 1, characterized in that: The VBA program is provided with a filter module, and different data types are defined with corresponding colors.

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