An immersion lithography device

By introducing a positioning mechanism, a draining component, and a drying component into the immersion lithography equipment, the problems of inconvenient silicon wafer positioning and difficult drying after lithography are solved, thereby improving the stability and efficiency of silicon wafer immersion lithography.

CN115981105BActive Publication Date: 2025-10-31JIANGSU ETERN OPTOELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202211610866.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-14
Publication Date
2025-10-31
Estimated Expiration
2042-12-14

AI Technical Summary

Technical Problem

Traditional immersion lithography equipment is inconvenient for placing, positioning, and retrieving silicon wafers, and the drying process after lithography is troublesome, which affects processing efficiency.

Method used

An immersion lithography device was designed, comprising a placement frame, a positioning mechanism, a drain assembly, and a drying assembly. The positioning mechanism stably clamps the silicon wafer, the drain assembly facilitates draining, and the drying assembly enables rapid drying.

Benefits of technology

It improves the stability and efficiency of silicon wafer immersion lithography, simplifies the drying process of silicon wafers after lithography, and facilitates subsequent processing.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses an immersion lithography apparatus, specifically relating to the field of lithography equipment technology. It includes a placement frame, a positioning mechanism at the bottom of the placement frame, a support base fixedly mounted at the bottom of the positioning mechanism, a motor on one side of the positioning mechanism, a draining component in the middle of the placement frame and positioning mechanism, and a drying component on one side of the placement frame. This invention, by setting up a placement frame and positioning mechanism in conjunction with the draining component, clamps and positions the silicon wafer, thereby improving the stability of subsequent immersion lithography. It also allows for heat conduction cooling of the liquid medium within the placement frame, preventing bubbles from forming during lithography and affecting the quality of the immersion lithography. Furthermore, after lithography, the positioning is released, and the liquid medium within the placement frame is drained, facilitating subsequent drying and unloading of the silicon wafer.
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Description

Technical Field

[0001] This invention relates to the field of photolithography equipment technology, specifically to an immersion photolithography device. Background Technology

[0002] Photolithography is a process that transfers patterns from a mask onto photoresist on a silicon wafer through exposure. Compared to traditional photolithography equipment, immersion photolithography equipment has unique advantages. In traditional photolithography equipment, the light beam hits the photoresist directly during exposure, while in immersion photolithography equipment, a liquid medium is added between the light source and the photoresist. The light beam is refracted through the liquid medium before hitting the photoresist. The refracted light beam becomes thinner, which effectively improves the resolution of the pattern on the photoresist surface. More complex patterns can also be transferred to the photoresist on the silicon wafer surface using this method.

[0003] Traditional immersion lithography equipment still has some problems in practical use: because immersion lithography equipment requires immersing silicon wafers in a liquid medium for lithography, the placement, positioning and removal of silicon wafers are not convenient, and after the silicon wafers are lithographically completed, they need to be dried separately, which is quite troublesome. Therefore, we propose an immersion lithography equipment to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide an immersion lithography apparatus to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an immersion lithography apparatus, comprising a placement frame, a positioning mechanism at the bottom of the placement frame, a support base fixedly installed at the bottom end of the positioning mechanism, a motor on one side of the positioning mechanism, a draining assembly in the middle of the placement frame and the positioning mechanism, and a drying assembly on one side of the placement frame.

[0006] Preferably, the positioning mechanism includes a rotating outer frame, on the outer top of which a plurality of sliding frames are integrally formed in a circular array. The sliding frames are fixedly installed at the bottom end of the outer frame and at the top end of the support base. Each sliding frame has a sliding block slidably engaged with a sliding block. The rotating outer frame has a rotatably engaged drive ring that cooperates with the sliding blocks. The upper surface of the drive ring is integrally formed with a planar threaded protrusion. The lower surfaces of the plurality of sliding blocks have planar threaded grooves that cooperate with the planar threaded protrusion, and the planar threaded protrusion is movably engaged in the planar threaded groove.

[0007] Preferably, each of the multiple sliding blocks has a connecting rod vertically mounted on its opposite ends, and a positioning frame is fixedly mounted on the top opposite sides of each of the multiple connecting rods. A sliding frame corresponding to the positioning frame is integrally formed on the outer frame of the storage container. The positioning frame is slidably engaged in the corresponding sliding frame. The side of the positioning frame away from the connecting rod extends into the outer frame of the storage container. A positioning block is fixedly mounted on the top of each opposite side of the multiple positioning frames. A sealing sleeve is fixedly mounted between the opposite sides of the multiple sliding frames and the outer wall of the positioning frame.

[0008] Preferably, a protective sleeve is fixedly fitted on the outer side of the positioning block.

[0009] Preferably, the bottom of the rotating outer frame is provided with an annular groove, in which a toothed ring is movably engaged. The toothed ring is fixedly sleeved on the outside of the drive ring. A frame is fixedly installed on one side of the motor. The frame is fixedly installed at the bottom end of the rotating outer frame. A drive gear is fixedly installed at the drive end of the motor. The drive gear and the toothed ring are meshed together.

[0010] Preferably, the bottom center of the outer frame of the storage container is provided with a drainage groove corresponding to the drainage assembly. The drainage assembly includes a drainage outer ring and a drainage retaining post. The drainage outer ring is fixedly engaged in the drainage groove, and the drainage retaining post is movably engaged in the middle of the drainage outer ring. A limiting protrusion is integrally formed on the outer side of the drainage retaining post. A limiting longitudinal groove that cooperates with the limiting protrusion is provided on the inner side of the drainage outer ring. The limiting protrusion is slidably engaged in the corresponding limiting longitudinal groove. Multiple drainage grooves are evenly distributed on the outer side of the drainage outer ring. A sealing plate is fixedly installed on the top of the drainage retaining post. The outer diameter of the sealing plate is larger than the outer diameter of the drainage outer ring. A sealing gasket is provided on the lower surface of the sealing plate. The sealing gasket is in contact with the inner lower wall of the outer frame of the storage container.

[0011] Preferably, the drainage assembly further includes a drainage outer tube, and a sealing groove corresponding to the drainage outer tube is provided at the bottom center of the outer frame. The top of the drainage outer tube is slidably engaged in the sealing groove. An outer frame is integrally formed on the outer side of the drainage outer tube, and the outer frame is fixedly installed on the inner side of the drive ring. An inner frame is integrally formed on the inner side of the drainage outer tube, and an inner screw is integrally formed in the middle of the inner frame. A screw that cooperates with the inner screw is coaxially fixedly installed at the bottom of the drainage pin, and the screw is threaded in the inner screw.

[0012] Preferably, the drive ring and the inner screw cylinder are arranged coaxially.

[0013] Preferably, the drying assembly includes a drying top frame and a drying bottom frame, both of which are hollow structures and arc-shaped structures. The drying top and bottom frames are symmetrically distributed about the positioning frame, with their inner opposite ends being inclined. A nozzle is fixedly mounted on the inner opposite ends of both the drying top and bottom frames. A connecting tube is integrally formed on the outer side of both the drying top and bottom frames, and the connecting tube is fixedly attached to the outer frame of the storage container. The side of the connecting tube away from the drying top frame extends outward from the outer side of the storage container. A connector is integrally formed on the side of the connecting tube away from the drying top frame, and a connecting main pipe is fixedly installed between the two connectors.

[0014] Preferably, a cooling cavity is provided in the outer frame of the storage container, an inlet pipe is fixedly fastened to the top outer side of the outer frame of the storage container, and a drain pipe is fixedly fastened to the bottom outer side of the outer frame of the storage container.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] 1. By setting up an outer frame and positioning mechanism, and using a drain assembly, the silicon wafer is clamped and positioned, thereby improving the stability of subsequent immersion lithography. It can also conduct heat to cool the liquid medium in the outer frame, preventing bubbles from forming during lithography and affecting the quality of immersion lithography. After lithography, the positioning is released and the liquid medium in the outer frame is drained, which facilitates the drying and unloading of the silicon wafer after lithography.

[0017] 2. By setting up a drying component, after the silicon wafer immersion lithography is completed and the liquid medium in the outer frame of the placement is emptied, the drying air mechanism is turned on. The drying air enters the corresponding drying top frame and drying bottom frame through the connecting main pipe, connector, and connecting clamp pipe, and is sprayed at an angle onto the upper and lower surfaces of the silicon wafer through multiple nozzles. The silicon wafer on the positioning frame is directly and synchronously dried at an angle on the upper and lower surfaces, which facilitates the subsequent processing of the silicon wafer. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the present invention.

[0020] Figure 2This is a schematic diagram showing the structural connection between the outer frame and the positioning mechanism in this invention.

[0021] Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle.

[0022] Figure 4 For the present invention Figure 2 Enlarged view at point B in the middle.

[0023] Figure 5 This is a schematic diagram showing the structural connection between the outer frame of the storage container and the drainage assembly in this invention.

[0024] Figure 6 For the present invention Figure 5 Enlarged view at point C in the middle.

[0025] Figure 7 This is a schematic diagram showing the structural connection between the outer frame and the drying component in this invention.

[0026] Figure 8 This is another structural connection diagram of the outer frame and the drying component in this invention.

[0027] In the diagram: 1. Outer frame; 2. Positioning mechanism; 3. Support base; 4. Motor; 41. Frame; 5. Drainage assembly; 6. Drying assembly; 11. Inlet pipe; 12. Drainage pipe; 21. Rotating outer frame; 22. Sliding frame; 23. Sliding block; 24. Drive ring; 25. Connecting rod; 26. Positioning frame; 27. Sliding frame; 28. Positioning block; 281. Protective sleeve; 29. ​​Sealing sleeve; 211. Ring groove; 210. Gear ring; 2101. Drive gear; 101. Drainage channel; 102. Sealing slot; 103. Cooling chamber; 51. Outer drainage ring; 511. Limiting longitudinal groove; 512. Drainage channel; 52. Drainage retaining post; 521. Limiting protrusion; 53. Sealing plate; 54. Sealing gasket; 55. Outer drainage pipe; 551. Outer frame; 56. Inner frame; 57. Inner screw barrel; 58. Screw; 61. Drying top frame; 62. Drying bottom frame; 63. Nozzle; 64. Connecting retaining pipe; 65. Connector; 66. Connecting main pipe. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Example: Figure 1-8As shown, the present invention provides an immersion lithography device, including a placement frame 1, a positioning mechanism 2 at the bottom of the placement frame 1, a support base 3 fixedly installed at the bottom end of the positioning mechanism 2, a motor 4 on one side of the positioning mechanism 2, a draining component 5 in the middle of the placement frame 1 and the positioning mechanism 2, and a drying component 6 on one side of the placement frame 1.

[0030] The positioning mechanism 2 includes a rotating outer frame 21. Multiple sliding frames 22 arranged in a ring array are integrally formed on the top outer side of the rotating outer frame 21. The sliding frames 22 are fixedly installed at the bottom end of the outer frame 1 and at the top end of the support base 3. Sliding sliders 23 are slidably engaged within each sliding frame 22. A drive ring 24, cooperating with the sliding sliders 23, is rotatably engaged within the rotating outer frame 21. A planar threaded protrusion is integrally formed on the upper surface of the drive ring 24. Planar threaded grooves, cooperating with the planar threaded protrusions, are formed on the lower surfaces of the multiple sliding sliders 23, and the planar threaded protrusions are movably engaged within the planar threaded grooves. An annular groove 211 is formed at the bottom of the rotating outer frame 21, and a toothed ring 210 is movably engaged within the annular groove 211. The toothed ring 210 is fixedly sleeved within the drive ring 24. On the outer side of the rotating ring 24, a frame 41 is fixedly installed on one side of the motor 4. The frame 41 is fixedly installed at the bottom of the rotating outer frame 21. A drive gear 2101 is fixedly installed on the drive end of the motor 4. The drive gear 2101 and the toothed ring 210 are meshed together. In use, the motor 4 is controlled and turned on to drive the drive gear 2101 to drive the toothed ring 210 to rotate, thereby driving the drive ring 24 to rotate stably. With the help of the planar thread protrusion and the planar thread groove, multiple sliding blocks 23 are simultaneously driven to slide towards each other. Conversely, the motor 4 is controlled and turned on to drive the drive gear 2101 to drive the toothed ring 210 to rotate in the opposite direction, thereby driving the drive ring 24 to rotate stably in the opposite direction. With the help of the planar thread protrusion and the planar thread groove, multiple sliding blocks 23 are simultaneously driven to slide in opposite directions.

[0031] Multiple sliding blocks 23 are vertically mounted with connecting rods 25 at their opposite ends. Positioning frames 26 are fixedly mounted on opposite sides of the top of the connecting rods 25. A sliding frame 27 corresponding to the positioning frame 26 is integrally formed on the outer frame 1. The positioning frame 26 is slidably engaged in the corresponding sliding frame 27. The side of the positioning frame 26 away from the connecting rod 25 extends into the outer frame 1. The multiple sliding blocks 23 slide towards each other, driving the connecting rods 25 to slide towards each other, thereby causing the multiple positioning frames 26 to slide towards each other in the corresponding sliding frame 27. The top ends of the opposite sides of the multiple positioning frames 26 are fixedly mounted with... A positioning block 28 is provided, and a sealing sleeve 29 is fixedly installed between the opposite sides of multiple sliding frames 27 and the outer wall of the positioning frame 26. A protective sleeve 281 is fixedly fitted on the outside of the positioning block 28. In use, the silicon wafer is placed between multiple positioning blocks 28 and placed on the upper surface of multiple positioning frames 26. The multiple positioning frames 26 slide towards each other in the corresponding sliding frames 27, which drives the multiple positioning blocks 28 to move towards each other until the protective sleeve 281 contacts the silicon wafer, thereby clamping and positioning the silicon wafer, thereby improving the stability of subsequent silicon wafer immersion lithography, and thus improving the quality and effect of silicon wafer lithography.

[0032] The bottom center of the outer frame 1 has a drainage groove 101 corresponding to the drainage assembly 5. The drainage assembly 5 includes a drainage outer ring 51 and a drainage retainer 52. The drainage outer ring 51 is fixedly engaged in the drainage groove 101, and the drainage retainer 52 is movably engaged in the middle of the drainage outer ring 51. The outer side of the drainage retainer 52 has an integrally formed limiting protrusion 521. The inner side of the drainage outer ring 51 has a limiting longitudinal groove 511 that cooperates with the limiting protrusion 521. The limiting protrusion 521 is slidably engaged in the corresponding limiting longitudinal groove 511. By setting the limiting protrusion 521 and cooperating with the limiting longitudinal groove 511, the limiting protrusion 521 is slidably engaged in the corresponding limiting longitudinal groove 511, which facilitates the vertical sliding of the drainage retainer 52 in the drainage outer ring 51. The outer side of the drainage outer ring 51 has a plurality of evenly distributed drainage grooves 512 for drainage. A sealing plate 53 is fixedly installed at the top of the locking post 52. The outer diameter of the sealing plate 53 is larger than the outer diameter of the drain outer ring 51. A sealing gasket 54 is provided on the lower surface of the sealing plate 53. The sealing gasket 54 contacts the inner lower wall of the outer frame 1. By setting the sealing plate 53, the outer diameter of the sealing plate 53 is larger than the outer diameter of the drain outer ring 51, and the sealing gasket 54 is provided on the lower surface of the sealing plate 53. The sealing gasket 54 contacts the inner lower wall of the outer frame 1, which blocks multiple drain grooves 512 to prevent the liquid medium in the outer frame 1 from flowing out. When the driving drain locking post 52 slides vertically upward in the drain outer ring 51, it drives the sealing plate 53 and the sealing gasket 54 to move upward. The sealing gasket 54 is separated from the inner lower wall of the outer frame 1. At this time, the liquid medium in the outer frame 1 can be discharged through multiple drain grooves 512, which facilitates the drying and unloading of the silicon wafer after photolithography.

[0033] The drainage assembly 5 also includes a drainage outer tube 55. A sealing groove 102 corresponding to the drainage outer tube 55 is provided at the bottom center of the outer frame 1. The top of the drainage outer tube 55 is slidably engaged in the sealing groove 102, sealing the bottom of the outer frame 1 when the drainage outer tube 55 rotates. An outer frame 551 is integrally formed on the outer side of the drainage outer tube 55. The outer frame 551 is fixedly installed on the inner side of the drive ring 24. An inner frame 56 is integrally formed on the inner side of the drainage outer tube 55. An inner screw cylinder 57 is integrally formed in the middle of the inner frame 56. The drive ring 24 and the inner screw cylinder 57 are coaxially arranged. A screw 58 that works with the inner screw cylinder 57 is coaxially fixedly installed at the bottom of the drainage pin 52. The screw 58 is threaded into the inner screw cylinder 57. In use, the drive ring 24 rotates in the opposite direction, driving the outer frame. 551, drain outer pipe 55, inner frame 56, and inner screw barrel 57 rotate synchronously in opposite directions, in conjunction with screw 58, which is threaded into the inner screw barrel 57. The drive screw 58 synchronously drives the drive drain clamp 52 to slide vertically upward in the drain outer ring 51. Conversely, while the drive ring 24 rotates, it drives the outer frame 551, drain outer pipe 55, inner frame 56, and inner screw barrel 57 to rotate synchronously, in conjunction with screw 58, which is threaded into the inner screw barrel 57. The drive screw 58 synchronously drives the drive drain clamp 52 to slide vertically downward in the drain outer ring 51. The sealing plate 53 and sealing gasket 54 move downward, and the sealing gasket 54 contacts the inner lower wall of the outer frame 1, sealing multiple drain grooves 512 to prevent the liquid medium in the outer frame 1 from flowing out.

[0034] The drying assembly 6 includes a top drying frame 61 and a bottom drying frame 62. Both the top drying frame 61 and the bottom drying frame 62 are hollow structures and are arc-shaped. The top drying frame 61 and the bottom drying frame 62 are symmetrically distributed vertically about the positioning frame 26. The inner sides of the opposite ends of the top drying frame 61 and the bottom drying frame 62 are inclined structures. Multiple evenly distributed nozzles 63 are fixedly clamped on the inner sides of the opposite ends of the top drying frame 61 and the bottom drying frame 62. A connecting tube 64 is integrally formed on the outer side of the top drying frame 61 and the bottom drying frame 62. The connecting tube 64 is fixedly clamped in the outer frame 1. The connecting tube 64 is away from the top drying frame 61. One side extends outward from the outer side of the outer frame 1. The connecting tube 64 is integrally formed with a connector 65 on the side away from the drying top frame 61. A connecting main tube 66 is fixedly installed between the two connectors 65. Before use, the end of the connecting main tube 66 is connected to the output end of the drying air mechanism. After the silicon wafer immersion photolithography is completed and the liquid medium in the outer frame 1 is drained, the drying air mechanism is turned on. The drying air enters the corresponding drying top frame 61 and drying bottom frame 62 through the connecting main tube 66, connector 65, and connecting tube 64, and is sprayed at an angle to the upper and lower surfaces of the silicon wafer through multiple nozzles 63. The silicon wafer on the positioning frame 26 is directly and synchronously dried at an angle to the upper and lower surfaces, which is convenient for the subsequent processing of the silicon wafer.

[0035] A cooling chamber 103 is provided in the outer frame 1. An inlet pipe 11 is fixedly attached to the top of the outer side of the outer frame 1, and a drain pipe 12 is fixedly attached to the bottom of the outer side of the outer frame 1. Before use, the ends of the inlet pipe 11 and the drain pipe 12 are connected to the output end and the input end of the cooling liquid circulation mechanism, respectively. The cooling liquid circulation mechanism is turned on, and the cooling liquid is input into the cooling chamber 103 through the inlet pipe 11 and flows back into the cooling liquid circulation mechanism through the drain pipe 12, thereby realizing the circulation of the cooling liquid in the cooling chamber 103. This allows for heat conduction cooling of the liquid medium in the outer frame 1, preventing bubbles from forming during photolithography and affecting the quality of silicon wafer immersion photolithography.

[0036] Working principle: Before use, connect the ends of the inlet pipe 11 and the outlet pipe 12 to the output and input ends of the coolant circulation mechanism, respectively, and connect the end of the main pipe 66 to the output end of the drying air mechanism.

[0037] Subsequently, immersion lithography is performed on the silicon wafer. The silicon wafer is placed between multiple positioning blocks 28 and on the upper surface of multiple positioning frames 26. The motor 4 is controlled and activated to drive the drive gear 2101 to drive the gear ring 210 to rotate, thereby driving the drive ring 24 to rotate stably. Using planar threaded protrusions and planar threaded grooves, multiple sliding blocks 23 are simultaneously driven to slide towards each other, and the connecting rods 25 are driven to slide towards each other. This causes the multiple positioning frames 26 to slide towards each other in their corresponding sliding frames 27, and the multiple positioning blocks 28 to move towards each other until the protective sleeve 281 contacts the silicon wafer. The silicon wafer is clamped and positioned to improve the stability of subsequent silicon wafer immersion lithography. While the drive ring 24 rotates, it drives the outer frame 551, the drain outer tube 55, the inner frame 56, and the inner screw cylinder 57 to rotate synchronously. The screw 58 is used in conjunction with the screw, which is threaded in the inner screw cylinder 57. The drive screw 58 drives the drive drain clamp 52 to slide vertically downward in the drain outer ring 51. The sealing plate 53 and the sealing gasket 54 move down, and the sealing gasket 54 contacts the inner lower wall of the outer frame 1 to seal the multiple drain grooves 512 and prevent the liquid medium in the outer frame 1 from flowing out.

[0038] Subsequently, a liquid medium is introduced into the outer frame 1, and the silicon wafer is immersed in the liquid medium. Other photolithography mechanisms are used to perform immersion photolithography on the silicon wafer. At the same time, the coolant circulation mechanism is activated. The coolant is introduced into the cooling chamber 103 through the inlet pipe 11 and flows back into the coolant circulation mechanism through the outlet pipe 12, realizing the circulation of the coolant in the cooling chamber 103. This allows for heat conduction cooling of the liquid medium in the outer frame 1, preventing bubbles from forming due to the rising temperature of the liquid medium during photolithography, which would affect the quality of the immersion photolithography on the silicon wafer.

[0039] After the immersion lithography process on the silicon wafer is completed, the motor 4 is controlled and turned on to drive the drive gear 2101 to drive the gear ring 210 to rotate in the opposite direction, thereby driving the drive ring 24 to rotate stably in the opposite direction. This, combined with the planar threaded protrusions and planar threaded grooves, synchronously drives multiple locking sliders 23 to slide in opposite directions, and drives the connecting rod 25 to slide in opposite directions. This causes multiple positioning frames 26 to slide in opposite directions within their corresponding sliding frames 27, and causes multiple positioning blocks 28 to move in opposite directions, releasing the silicon wafer from clamping and positioning, but the silicon wafer still rests on the surface of the multiple positioning frames 26. When the drive ring 24 rotates in the opposite direction, it drives the outer frame 551, the drain outer pipe 55, the inner frame 56, and the inner screw barrel 57 to rotate in the opposite direction synchronously. The screw 58 is used in conjunction with the screw, which is threaded in the inner screw barrel 57. The drive screw 58 drives the drive drain clamp 52 to slide vertically upward in the drain outer ring 51, which drives the sealing plate 53 and the sealing gasket 54 to move upward. The sealing gasket 54 is separated from the inner lower wall of the outer frame 1. At this time, the liquid medium in the outer frame 1 can be discharged into the drain outer pipe 55 for collection through multiple drain grooves 512.

[0040] Until the liquid medium in the outer frame 1 is emptied, the drying air mechanism is turned on. The drying air enters the corresponding drying top frame 61 and drying bottom frame 62 through the connecting main pipe 66, connector 65, and connecting clamp pipe 64, and is sprayed at an angle onto the upper and lower surfaces of the silicon wafer through multiple nozzles 63. The silicon wafer on the positioning frame 26 is directly dried at an angle on the upper and lower surfaces simultaneously, which makes it easier to remove the dried silicon wafer and facilitates the subsequent processing of the silicon wafer.

[0041] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An immersion lithography apparatus, comprising a housing frame (1), characterized in that: The bottom of the outer frame (1) is provided with a positioning mechanism (2), and a support base (3) is fixedly installed at the bottom end of the positioning mechanism (2). A motor (4) is provided on one side of the positioning mechanism (2). A drain assembly (5) is provided in the middle of the outer frame (1) and the positioning mechanism (2). A drying assembly (6) is provided on one side of the outer frame (1). The positioning mechanism (2) includes a rotating outer frame (21). The outer top of the rotating outer frame (21) is integrally formed with a plurality of sliding frames (22) arranged in a ring array. The sliding frames (22) are fixedly installed at the bottom end of the outer frame (1) and at the top end of the support base (3). Each sliding frame (22) is slidably fitted with a sliding block (23). The rotating outer frame (21) is rotatably fitted with a drive ring (24) that works with the sliding block (23). The upper surface of the drive ring (24) is integrally formed with a planar threaded protrusion. The lower surface of the plurality of sliding blocks (23) is provided with a planar threaded groove that works with the planar threaded protrusion, and the planar threaded protrusion is movably fitted into the planar threaded groove. The bottom center of the outer frame (1) is provided with a drainage groove (101) corresponding to the drainage assembly (5). The drainage assembly (5) includes a drainage outer ring (51) and a drainage retaining post (52). The drainage outer ring (51) is fixedly engaged in the drainage groove (101), and the drainage retaining post (52) is movably engaged in the middle of the drainage outer ring (51). The outer side of the drainage retaining post (52) is integrally formed with a limiting protrusion (521), and the inner side of the drainage outer ring (51) is provided with a groove that matches the limiting protrusion (521). The limiting groove (511) is used in combination. The limiting protrusion (521) is slidably engaged in the corresponding limiting groove (511). The outer side of the draining outer ring (51) is provided with a plurality of evenly distributed draining grooves (512). The top of the draining pin (52) is fixedly installed with a sealing plate (53). The outer diameter of the sealing plate (53) is larger than the outer diameter of the draining outer ring (51). The lower surface of the sealing plate (53) is provided with a sealing gasket (54). The sealing gasket (54) is in contact with the inner lower wall of the outer frame (1). The drainage assembly (5) also includes a drainage outer tube (55). A sealing groove (102) corresponding to the drainage outer tube (55) is provided at the bottom center of the outer frame (1). The top of the drainage outer tube (55) is slidably engaged in the sealing groove (102). An outer frame (551) is integrally formed on the outer side of the drainage outer tube (55). The outer frame (551) is fixedly installed on the inner side of the drive ring (24). An inner frame (56) is integrally formed on the inner side of the drainage outer tube (55). An inner screw cylinder (57) is integrally formed in the middle of the inner frame (56). A screw (58) that works with the inner screw cylinder (57) is coaxially fixedly installed at the bottom end of the drainage pin (52). The screw (58) is threadedly installed in the inner screw cylinder (57).

2. The immersion lithography apparatus according to claim 1, characterized in that: Each of the multiple sliding blocks (23) has a connecting rod (25) vertically mounted on its opposite ends. Each of the multiple connecting rods (25) has a positioning frame (26) fixedly mounted on its top opposite sides. The outer frame (1) of the storage is integrally formed with a sliding frame (27) corresponding to the positioning frame (26). The positioning frame (26) is slidably engaged in the corresponding sliding frame (27). The side of the positioning frame (26) away from the connecting rod (25) extends into the outer frame (1). Each of the multiple positioning frames (26) has a positioning block (28) fixedly mounted on its opposite top end. A sealing sleeve (29) is fixedly mounted between the opposite sides of the multiple sliding frames (27) and the outer wall of the positioning frame (26).

3. The immersion lithography apparatus according to claim 2, characterized in that: The outer side of the positioning block (28) is fixedly fitted with a protective sleeve (281).

4. The immersion lithography apparatus according to claim 1, characterized in that: The bottom of the rotating outer frame (21) is provided with an annular groove (211), and a toothed ring (210) is movably engaged in the annular groove (211). The toothed ring (210) is fixedly sleeved on the outside of the drive ring (24). A frame (41) is fixedly installed on one side of the motor (4). The frame (41) is fixedly installed at the bottom end of the rotating outer frame (21). A drive gear (2101) is fixedly installed at the drive end of the motor (4). The drive gear (2101) and the toothed ring (210) are meshed and connected.

5. The immersion lithography apparatus according to claim 1, characterized in that: The drive ring (24) and the inner screw (57) are coaxially arranged.

6. The immersion lithography apparatus according to claim 2, characterized in that: The drying assembly (6) includes a drying top frame (61) and a drying bottom frame (62). Both the drying top frame (61) and the drying bottom frame (62) are hollow structures and arc-shaped structures. The drying top frame (61) and the drying bottom frame (62) are symmetrically distributed vertically about the positioning frame (26). The inner sides of the opposite ends of the drying top frame (61) and the drying bottom frame (62) are inclined structures. A nozzle (63) is fixedly mounted on each of the drying top frame (61) and drying bottom frame (62). A connecting tube (64) is integrally formed on the outer side of each of the drying top frame (61). The connecting tube (64) is fixedly mounted in the outer frame (1). The side of the connecting tube (64) away from the drying top frame (61) extends out of the outer frame (1). A connector (65) is integrally formed on the side of the connecting tube (64) away from the drying top frame (61). A connecting main pipe (66) is fixedly installed between the two connectors (65).

7. The immersion lithography apparatus according to claim 1, characterized in that: A cooling chamber (103) is provided in the outer frame (1), an inlet pipe (11) is fixedly fastened to the top of the outer side of the outer frame (1), and a drain pipe (12) is fixedly fastened to the bottom of the outer side of the outer frame (1).

Citation Information

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