Device for cooling GPU chips and reducing noise using high-pressure cold air gap

Abstract

The present invention relates to a device for cooling GPU chips using a high-pressure cold air interstitial method, and relates to a device that efficiently cools and reduces noise using a high-pressure cold air flow. A pneumatic pump is connected to a high-pressure cold air storage tank, which is connected to the air inlet of a GPU box to blow high-pressure cold air. A gas pressure sensor is installed within the high-pressure cold air storage tank, and a tracheal pressure valve is installed on the gas outlet pipe of the storage tank. The tracheal pressure valve is connected to an automatic controller via electrical wires. The automatic controller is connected to the gas pressure sensor and a power automatic switch via electrical wires. Advantages: Using the tracheal pressure valve as an interstitial air supply component, this device uses a high-pressure cold air interstitial method to cool GPU chips, solving the problem of fog and dew in the GPU box. High-pressure cold air at 10°C to 17°C can be used, significantly reducing noise in the computer room without fans, achieving faster cooling and improving computing efficiency, saving cooling energy, and increasing computing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation for computer servers, and in particular to a noise reduction device that uses high-pressure cold airflow to efficiently cool a GPU and can reduce the number of fans or eliminate the need for fans. Background Art

[0002] Currently, there are two main methods for cooling the GPU (or CPU, circuit board, etc.) of computer servers: air cooling and liquid cooling.

[0003] Regarding the air cooling method, fan exhaust continuously extracts indoor cold air from the environment outside the computer room cabinet outside the chassis to dissipate heat for GPUs above 40℃. The disadvantages are low energy efficiency, high cost, and loud fan noise for cooling indoor cold air. The reasons are: first, if the temperature in the computer room is 10℃, a large amount of space in the computer room will be meaninglessly cooled, consuming a lot of energy. In addition, the temperature difference between operators entering and leaving the computer room is large, making them prone to illness. Second, if the temperature in the computer room is 35℃, the cooling effect on the GPU will be very poor, and over-temperature shutdown may easily occur, and even damage to the GPU and other heat-generating components may occur. Third, if the temperature in the computer room is 25℃, the temperature difference between the cold air of 25℃ and the GPU of 40℃ is small, and the fan needs to run at full power to generate fast airflow, which makes the computer room noisy, affects the operators, and causes vibration that damages the server.

[0004] Regarding the liquid cooling evaporative cooling method, this equipment is complex and costly. If a coolant leak occurs, the coolant will damage the GPU and circuit board.

[0005] Regarding the coolant immersion cooling method, this coolant is expensive, the equipment is complicated, it is inconvenient to remove it from the immersion liquid for repair, the cost is higher, and the application range is narrow.

[0006] Inspur Electronic Information Industry Co., Ltd.'s Chinese patent 201610058267.5, "A novel heat dissipation method for integrated high-density GPUs," discloses a novel heat dissipation method for integrated high-density GPUs. The specific implementation process is as follows: first, the server system is divided into two independent heat dissipation spaces, upper and lower, through boards. The GPU graphics card is placed in the upper space, and the switching chip is placed in the lower space. Both independent spaces are cooled by cooling fans provided at the rear of the server chassis. The upper GPU graphics card is subjected to partitioned heat dissipation, and the gaps between the front-row GPU graphics cards are connected to the corresponding gaps between the rear-row GPU graphics cards through air ducts. Compared with the prior art, this novel heat dissipation method for integrated high-density GPUs solves the heat dissipation of the rear GPU graphics card through a layered architecture and isolated heat dissipation design, while ensuring the heat dissipation of the switching chip, thereby ensuring optimal heat dissipation of the entire server system. Utilizing independent air ducts, the graphics card can be highly integrated, and has a wide range of applications, and can be applied to the heat dissipation design of all electronic products. This patent solves the problem of uniform heat dissipation for multiple GPU graphics cards in different positions in a chassis, but the air-cooled gas used for heat dissipation is still the computer room gas. Generally, the permissible temperature range of the gas in a Class C computer room is 10 to 35°C. The lower the temperature, for example, if the computer room environment is 10°C, a large amount of space will be meaninglessly consumed with a large amount of energy. If the computer room environment is 35°C, the heat dissipation effect on the GPU will be very poor, and it is easy to cause over-temperature shutdown, or even damage the GPU chip and other heat-generating components.

[0007] Inspur Electronic Information Industry Co., Ltd. 201510901883.8 "A New Server Heat Dissipation Design Method for High-Density Integrated Graphics Cards" The present invention discloses a new server heat dissipation design method for high-density integrated graphics cards, which belongs to the server heat dissipation design method. The technical problem to be solved by the present invention is how to meet the heat dissipation of high-power GPU cards while ensuring the heat dissipation of high-power switching chips. The technical solution is: including the following steps: 1. Position of graphics cards: high-power graphics cards are placed in the system, half in the front row and the other half in the back row; the front and back rows of graphics cards are at the same height, and the front and back rows of graphics cards are staggered; 2. Heat dissipation channels: including two independent air ducts, channel A and channel B; 3. The switching module is placed in the 1U space of the server chassis system: separated from the upper 3U space.

[0008] State Grid Heilongjiang Electric Power Co., Ltd. Information and Communication Company 201910689432.0 "Circulating Liquid Cooling Server Node Chassis" In response to the problem that the existing chassis of the whole machine air path cannot be completely sealed and dust is easily entered, the present invention provides a circulating liquid cooling server node chassis, which belongs to the field of processing heat dissipation technology. The radiator of the present invention is fixed on the outer casing, and the outer casing and the radiator form a sealed space. The CPU heat exchanger, GPU heat exchanger, liquid pump and liquid tank are arranged in the space; the liquid tank is filled with coolant, and the radiator has a plurality of heat dissipation fins, and the heat dissipation fins are hollow structures. The coolant flows in a serpentine shape in the plurality of heat dissipation fins, and conducts heat to the fins. The coolant flows from the liquid tank, CPU heat exchanger, radiator, GPU heat exchanger and then flows into the liquid tank to form a circulating liquid; the CPU heat exchanger is in close contact with the CPU main circuit board of the server, and conducts the heat generated by the CPU to the coolant; the GPU heat exchanger is in close contact with the GPU circuit board of the server, and conducts the heat generated by the GPU circuit board to the coolant. This patent uses circulating cooling liquid in a heat exchanger to dissipate heat from the GPU and circuit board, but this arrangement is complex and costly. If a coolant leak occurs, the coolant will damage the GPU and circuit board. Summary of the Invention

[0009] The purpose of the present invention is to provide a device for cooling and reducing noise of GPU chips, etc. by using a high-pressure cold air gap method, which efficiently utilizes refrigeration energy, reduces noise in the computer room, keeps GPU chips, etc. clean, has a lower operating temperature of GPU chips, etc., and has stronger actual computing power of GPU chips, etc.

[0010] The GPU chip and the like mentioned in the present invention refer to the GPU chip, CPU chip, and the heat sink on the chip. For the sake of simplicity, the term GPU chip is used instead.

[0011] GPU refers to GPU chips or CPU chips, which are computing units that generate heat. For the sake of simplicity, the simple word GPU is used instead.

[0012] The GPU box 4 refers to a box body in which a GPU chip or a CPU chip is installed, and has an air inlet and an air outlet.

[0013] High-pressure cold air refers to the same concept as high-pressure cold gas, high-pressure cooling gas, and high-pressure cooling gas; different terms are used for convenience in different contexts. High-pressure cold air refers to a pressure greater than one atmosphere to slightly less than the pressure of a typical household pressure cooker, allowing the gas to reach GPU chips and other devices at a velocity of 5 to 40 meters per second. The pressure varies depending on the size and length of the gas piping from the high-pressure cold air storage tank to the GPU chips, as well as the bends caused by the actual installation of the piping. Therefore, high pressure specifically refers to a variable pressure range of 105 kPa to 150 kPa. Cold air is the refrigerant gas output by refrigeration equipment, which is 10 to 17 degrees Celsius below ambient room temperature. Compared to the negative pressure of existing fan exhaust, the high-pressure cold air in this invention refers to refrigerant gas with positive pressure. Existing technologies limit fan power in GPU boxes and computer chassis due to noise and vibration issues. However, the present invention utilizes positive air pressure, which can be generated by an air pump located outside the computer room. This air pump's power is not limited, allowing the air pressure to exceed that generated by the fan, thus providing a higher pressure and faster airflow than the fan. The key aspect of the present invention is that the high-pressure, fast airflow generated by the air pump replaces the low-pressure, slow airflow of the GPU box and computer chassis fans.

[0014] The present invention is designed as follows: the present invention uses an air pressure pump 1 that can be placed outside the computer room to generate air pressure. The air pressure pump 1 has unlimited power and can provide a high air pressure greater than the air pressure of a fan and a faster air flow speed. The high air pressure can effectively dispel dew, and then the GPU chip and the like can be cooled at a lower gas temperature than the current fan cooling method. The lower gas temperature improves the cooling efficiency, better protects the GPU chip and the like, and improves the GPU chip computing power. The use of the air pressure pump 1 to generate a high-pressure, fast air flow to replace the low-pressure, slow air flow of the fan in the GPU box 4 and the chassis is an important inventive point of the present invention. The use of high-pressure gas can eliminate dew, and the gas used for heat dissipation can use a gas temperature of 10°C to 17°C, which is lower than the fan cooling method.

[0015] The commonly used computer room temperature for existing fan cooling is room temperature or around 25°C, because this temperature range is more energy-efficient for the fan's continuous exhaust operation. However, the disadvantage is that the temperature difference between around 25°C and heat-generating components such as GPU chips is small, resulting in low heat dissipation efficiency, low energy utilization for cooling, high cooling costs, and loud fan noise. Especially when the GPU chip has a heavy workload and high temperature, the fan dissipates heat slowly, the cooling effect is poor, and the GPU chip continues to heat up, reducing computing power, and easily shutting down or damaging the GPU chip.

[0016] The present invention solves the problem of heat dissipation with lower cold air: To solve the problem of a small temperature difference between the heat dissipating gas temperature and the GPU chip, the present invention uses a high-pressure gap method to blow out 10°C-17°C cold air directly to cool the GPU chip, etc., thereby increasing the temperature difference between the cold air and the GPU chip and other heating elements, improving heat dissipation efficiency, increasing the energy utilization rate of refrigeration, reducing cooling costs, eliminating the need for fans or using low-power fans, and achieving low noise. The refrigeration equipment is placed outside the computer room so that its noise does not affect the computer room. In particular, it can reduce the operating temperature of the GPU chip, etc., prevent downtime, increase the life of the GPU chip, etc., and enhance computing power.

[0017] The existing fan cooling does not use 10℃-17℃, and the reason for the temperature selection defect is: the existing fan cooling is to continuously discharge gas, and the negative pressure generated by the fan is very low, which cannot generate high-speed airflow around GPU chips, etc., resulting in poor heat dissipation effect. The drawn-in cooling gas is the same temperature as the air in the computer room. If the room computer uses 10℃-17℃, the low temperature of a large amount of space in the computer room will waste cooling energy. Continuously discharging 10℃-17℃ gas causes a large amount of cooling energy to be discharged without being fully utilized, resulting in the computer room temperature being too low and the GPU chips, etc. failing to fully utilize the cooling energy of the airflow. Therefore, the fan cooling room computer now does not use a cooling temperature of 10℃-17℃, while the national standard GB2887-89 stipulates that the GPU chip ambient temperature is Class A 22±2℃.

[0018] The reason for selecting the temperature range of 10°C-17°C for the cooling gas in the present invention is as follows: First, regarding energy conservation and noise reduction, the present invention uses a high-pressure gap method to supply cold air, and 10°C-17°C cold air can be used for cooling, because the computer room is at room temperature, not high-pressure cold air. When the high-pressure cold air is only blown on the GPU chips, etc., the temperature difference is greater than the gas cooled by the current fan, and the temperature can be cooled more quickly. After the temperature reaches the rated value, the blowing can be stopped, and the 10°C-17°C cold air retained in the GPU box and the chassis can be fully utilized to continue cooling the newly generated heat of the GPU chips, thereby fully utilizing the energy for cooling; the refrigerator can be placed outside the computer room, so the computer room is quiet, so the present invention can reduce the overall energy consumption for cooling GPU chips, etc., reduce cooling costs, optimize the operating temperature of GPU chips, etc., enhance computing power, and make very low noise. The second reason is regarding the issue of preventing dew and fog. Existing technology stipulates that the national standard GB2887-89 for fan cooling technology specifies that the ambient temperature for GPU chips is 22±2°C for Class A, 15-30°C for Class B, and 10-35°C for Class C. When the ambient humidity is 45%-65% for Class A, the maximum dew point temperature suitable for data centers is 17°C. This standard stipulates a minimum temperature of 10°C, so the cooling gas used in the present invention has a minimum temperature of 10°C and a maximum temperature of 17°C, meaning the cooling gas is kept between 10°C and 17°C. The present invention uses high-pressure cooling air, which has a flow rate far greater than that of cooling air generated by fans in existing technologies. Therefore, the high-pressure cooling air can dispel dew and fog. Therefore, the present invention can use a high-temperature limit of 17°C, using low-temperature gas above 10°C and below 17°C to cool GPU chips and other components. Because the high-pressure cooling air can readily dispel dew and fog, the present invention can achieve dew and fog-prone temperatures of 10°C-17°C, which is not suitable for existing fan cooling. The reason why the lower limit temperature of the cooling air in the present invention is 10°C is that the existing technology stipulates that the lower limit of cooling is 10°C. If the normal operating temperature of an actual specific GPU chip, etc. is lower than 10°C, such as 5°C, then the technology provided by the present invention can use the high-pressure cooling air temperature lower limit of 5°C, because the present invention solves the problem of fog and dew generated by 5°C cooling air.

[0019] The reason for selecting a high pressure range of 105 kPa to 150 kPa for the cooling gas in the present invention is that the selection of the high pressure and temperature of the cooling gas in the present invention is related to factors such as the length and diameter of the gas storage box outlet pipe 8 and the equalizing box outlet pipe 19, as well as the heat generation of the GPU chip. The pressure range is selected between 105 kPa and 150 kPa, with the lower pressure value being greater than one atmosphere (100 kPa). After the GPU chip or the like cools to its rated low temperature, a small airflow can be used to compensate for the heat generated by the GPU chip or the like. The upper pressure limit is lower than that of a household pressure cooker for safety reasons, so the high pressure limit is 150 kPa. The temperature of the GPU chip or the like is reduced to different levels during different time periods when the high-pressure cooling gas is blown toward the GPU chip or the like. A specific pressure value within the 105 kPa to 150 kPa range can also be selected for different time periods. That is, when the temperature of the GPU chip or the like varies, the pressure at that time can be selected to be a specific value within the 105 kPa to 150 kPa range.

[0020] The inventive point of the present invention is: first, high-pressure cooling gas that can generate faster airflow than that of a general GPU box fan or chassis fan is used to cool the GPU chip, etc. Since the high-pressure gas is blown onto the GPU in the GPU box 4 or the GPU heat sink 27, it not only quickly cools down, but also blows out any mist and dew previously in the GPU box 4. The mist and dew can be blown out of the GPU box 4, solving the mist and dew problem. The high-pressure gas can then be cooled to a lower temperature of 10°C-17°C, which cannot be used for fan cooling, and becomes a high-pressure gas cooler that can be used only in the present invention. Since the high-pressure air cooler blown in first cools down the GPU and the heat sink 27 by 10°C-17°C, there is still a large amount of cooling energy in the GPU box 4 that can be retained and utilized. Therefore, the blowing of the compressed air cooler can be stopped, so that the cooling gas is blown out in an intermittent manner with cold air sometimes coming out and sometimes not, or the flow rate is sometimes large and sometimes small in an intermittent manner to provide a cooling method for the compressed air cooler. In short, it is a method of cooling the GPU chip and the like in a high-pressure cold air intermittent manner, because the high pressure causes the cooling gas to flow at high speed to remove mist and dew; and fans can be omitted, used less, or used intermittently, and the refrigeration equipment can be placed outside the computer room, thereby greatly reducing the noise in the computer room.

[0021] In short, the present invention solves the fog and dew problem with forward high-pressure cold air, greatly reduces noise without a fan, and can provide cold air in a gap manner to fully utilize the cold air and save refrigeration energy. After solving the fog and dew problem, low-temperature 10°C-17°C cold air can be used to cool it down quickly. The GPU chip can operate in a temperature environment lower than that of the fan cooling method, better protecting the GPU chip, etc., thereby improving the computing efficiency of the GPU chip; it also achieves the invention's purpose of energy saving, noise reduction and improved computing efficiency.

[0022] Content of the present invention is:

[0023] A device for cooling and reducing noise of a GPU chip by using a high-pressure cold air gap method includes an air pressure pump 1, a high-pressure cold air storage box 2, a GPU chip and a heat sink 3, and an automatic controller 13. The GPU chip and the heat sink 3 are arranged in a GPU box 4, and the GPU box 4 has an air inlet 5 and an air outlet 6. The device is characterized by:

[0024] The air outlet of the air pressure pump 1 is connected to the air inlet of the high-pressure cold air storage box 2 through a pump outlet pipe 7, and the air outlet of the high-pressure cold air storage box 2 is connected to the air inlet 5 of the GPU box 4 through an air storage box outlet pipe 8;

[0025] A power switch 11 is provided on the power line 10 connected to the air pressure pump 1;

[0026] A gas pressure sensor 9 is provided in the high pressure cold gas storage tank 2;

[0027] The air outlet pipe 8 of the air storage box is provided with a tracheal air pressure valve 15;

[0028] The automatic controller 13 is connected to the gas pressure sensor 9 and the power switch 11 with electric wires.

[0029] In order to prevent the high-pressure cold gas from flowing back, a one-way valve 14 is provided on the pump outlet pipe 7 so that the gas can only flow from the air pressure pump 1 to the high-pressure cold gas storage box 2.

[0030] The one-way valve 14 prevents the high-pressure cold gas stored in the high-pressure cold gas storage tank 2 from flowing back into the air pressure pump 1 after the air pressure pump 1 stops working.

[0031] Automatic controller 13 is connected to tracheal pressure valve 15 via electrical wiring. Tracheal pressure valve 15 physically controls the intermittent output of high-pressure cold gas from high-pressure cold gas storage tank 2. Opening, micro-opening, and closing of tracheal pressure valve 15 are controlled by automatic controller 13. Automatic controller 13 can be set to a fixed time or utilize chip temperature sensor 16 as a source of control information.

[0032] For the normal temperature refrigeration control circuit, using the air pipe air pressure valve 15 to set a rated gas pressure or a rated time for outputting high-pressure cold gas is crucial. The gas pressure sensor 9 is primarily used to set the rated gas pressure within the high-pressure cold gas storage tank 2, particularly the maximum rated gas pressure. This is achieved by using the pressure information from the gas pressure sensor 9 to control the power switch 11 of the air pressure pump 1 via the automatic controller 13, thereby ensuring that the pressure within the high-pressure cold gas storage tank 2 does not exceed the rated pressure. Setting the rated pressure or rated time allows for intermittent or fluctuating flow of pressurized, rapidly flowing cooling gas to be directed toward the GPU chip and heat sink 3, rapidly removing any high-temperature gas trapped near the GPU chip and heat sink 3 and achieving rapid cooling of the GPU chip and heat sink 3. For the same amount of energy, using a lower-temperature cooling gas (10°C) to direct the cooling effect toward the GPU chip and heat sink 3 and the surrounding high-temperature gas is superior to the dispersed cooling effect achieved by continuously using a fan to draw in 25°C ambient temperature. In other words, the cooling method of blowing low-temperature gas according to the present invention achieves better cooling and is more energy-efficient than existing cooling methods that use fans to draw in higher-temperature gas. Intermittently opening the air pipe pressure valve 15 eliminates the need for continuous operation of the GPU fan and chassis fan, significantly reducing noise in the computer room. Because the air pressure pump 1 can be located outside the room, only a subtle, low-frequency, intermittent airflow sound is heard inside the room, rather than the loud, high-frequency, even resonant, or even metallic frictional, continuous fan noise. Therefore, using this device to intermittently apply high-pressure cold air to the GPU chip and radiator 3 achieves better cooling, saves cooling energy, and reduces noise in the room.

[0033] The automatic control method is as follows: the air pressure pump 1 pressurizes cold air into the high-pressure cold air storage tank 2. The chip temperature sensor 16 controls the opening, micro-opening, and closing of the air pipe pressure valve 15 through the automatic controller 13 to control the amount and timing of the high-pressure cold air in the high-pressure cold air storage tank 2 to the GPU chip and the radiator 3. The high-pressure cold air is discharged in an intermittent manner to control the temperature of the GPU chip and the radiator 3 within the set range. The specific method is as follows:

[0034] When the temperature of the chip temperature sensor 16 reaches the high temperature setting value, the chip temperature sensor 16 causes the automatic controller 13 to drive the air pipe pressure valve 15 to open, and the air tank outlet pipe 8 releases a large amount of high-pressure cold air to the GPU chip and radiator 3 in the GPU box 4, quickly cooling the GPU chip and radiator 3.

[0035] When the chip temperature sensor 16 is lowered to the rated low temperature setting value, the chip temperature sensor 16 causes the automatic controller 13 to drive the tracheal air pressure valve 15 to open slightly, and the air tank outlet pipe 8 releases a small amount of cold air to the GPU chip and radiator 3 in the GPU box 4 to maintain the GPU chip and radiator 3; or when the chip temperature sensor 16 is lowered to the low temperature setting value, the chip temperature sensor 16 causes the automatic controller 13 to drive the tracheal air pressure valve 15 to close, and the GPU chip and radiator 3 slowly heat up again.

[0036] The preferred pressure of high-pressure cold air during use is 105kPa-150kPa, and the temperature is 10°C-17°C. Regarding the selection of air pressure and airflow: The GPU chip and the heat sink attached to it are cooled by cooling air. A specific air flow rate of 5m / s-40m / s can be selected based on the cooling air flow rate. The cooling air pressure in the high-pressure cold air storage tank 2 is also selected based on the cooling air flow rate and wind speed requirements. Generally, the air pressure in the high-pressure cold air storage tank 2 is within the range of 105kPa-150kPa, which provides sufficient pressure and safety.

[0037] The arrangement of the trachea pressure valve 15 on the air outlet pipe 8 of the air storage box is a key technical setting for providing high-pressure cold air in a gap manner. The gap manner provides high-pressure cold air so that the temperature of the cold air can be lower than the indoor room temperature of the machine room cabinet or the air temperature of 17°C-35°C in the existing fan continuous exhaust manner. The present invention preferably provides a cooling effect of 10°C-17°C of high-pressure cold air, which is significantly better than the existing fan room temperature of 17°C-35°C. Moreover, the gap manner provides high-pressure cold air, which can fully utilize the energy of the 10°C-17°C air temperature in the box or chassis during the gap inflation period, instead of the current technology of continuous exhaust that wastes cold air energy. The existing continuous exhaust makes it impossible to fully utilize the energy of room cooling.

[0038] Regarding the temperature setting and advantages of intermittent low temperature: Because the present invention uses high-pressure intermittent blowing of cooling gas, the temperature of the high-pressure cold gas can be selected at 10℃-17℃, which is much lower than the room temperature of the cabinet or 17℃-35℃ in the existing fan continuous exhaust method. The fan continuous exhaust can only use the higher "room temperature or 17℃-35℃". If the low temperature of 10℃-17℃ is used, the low-temperature gas continuously discharged by the fan will waste too much energy. Therefore, if you want to use the 10℃-17℃ low-temperature cooling gas with better cooling efficiency for GPU cooling, To avoid wasting energy, the only way is to use the present invention to blow cooling gas through the gaps. When the temperature of power-consuming components such as GPU chips rises to a rated high temperature, such as 50°C-65°C, a large amount of low-temperature cooling gas at 10°C-17°C is blown in. After the temperature of the GPU chips and other power-consuming components drops to 10°C-17°C, the blowing of the low-temperature cooling gas at 10°C-17°C or a small amount of low-temperature cooling gas is stopped. When the temperature of the GPU chips rises again to 50°C-65°C, a large amount of low-temperature cooling gas at 10°C-17°C is blown in again to drop the temperature of the GPU chips and other power-consuming components back to 10°C-17°C. When a large amount of low-temperature cooling gas at 10°C-17°C is blown in, the temperature difference between the cooling gas and the GPU chips is large, and the temperature drops faster than that of room-temperature air from a fan. Therefore, the present invention uses cooling gas to cool GPU chips and other components with higher energy efficiency and saves more energy. The GPU chips and other components have a longer low-temperature working time, and the computing power of the GPU chips is also higher. The cooling gas blowing method can also blow away dust and water mist at any time, and there will be no crystallized water to damage the GPU chip, etc., so that it can use low-temperature cooling gas at 10℃-17℃ lower than the fan method.

[0039] The intermittent mode of the energy-saving method provides high-pressure cooling air: when the temperature of the chip temperature sensor 16 reaches the high-temperature set value, the gas tank outlet pipe 8 releases a large amount of high-pressure cooling gas with a pressure of 130KPa-150KPa, a gas flow rate of 20m / s-40m / s, and a temperature of 10℃-17℃;

[0040] When the temperature of the chip temperature sensor 16 reaches the low temperature setting value, the tracheal air pressure valve 15 opens slightly, and the air storage tank outlet pipe 8 releases a small amount of high-pressure cold air with a pressure of 105KPa-130KPa, a gas flow rate of 5m / s-20m / s, and a temperature of 10℃-17℃; or when the temperature of the chip temperature sensor 16 reaches the low temperature setting value, the tracheal air pressure valve 15 closes and no high-pressure cold air is released.

[0041] The present invention focuses on intermittent high-pressure cold air cooling: The intermittent cooling method uses a tracheal air pressure valve 15 or the like to blow in high-pressure cold air. When the temperature of the high-pressure cold air blown in for intermittent cooling is 10°C-17°C, gas at a lower temperature below 10°C can also be used to cool the GPU chip and radiator 3, resulting in faster cooling and extending the interval between the lowest temperature and the highest temperature at which cooling is initiated. However, gas at temperatures below 10°C quickly produces water mist, and a high-pressure airflow of 130kPa-150kPa may be difficult to completely remove the water mist, so this is not recommended. After the high-pressure cold air cools the GPU chip and radiator 3 to 10°C-17°C, the high-pressure cold air is stopped or blown in small amounts. This allows the GPU chip and radiator 3 to heat up to 50°C-60°C, which takes some time. During this time, the 10°C-17°C cold air energy in the GPU box 4 is fully utilized, reducing energy consumption for cooling and saving cooling costs.

[0042] The prior art uses continuous fan exhaust, using room temperature or a constant 25°C gas for heat dissipation. The heat dissipation gas is continuously drawn out by the fan, resulting in a high heat dissipation gas temperature. The temperature difference between the heat dissipation gas and the GPU chip and the heat sink 3 is small, resulting in low cooling efficiency and wasted energy used to produce the heat dissipation fan and the cooling gas. If the prior art uses a low temperature of 15°C for heat dissipation, although the temperature difference between the heat dissipation gas and the GPU chip and the heat sink 3 can be increased, the energy used to produce the 15°C heat dissipation gas is consumed in a large amount of unused space in the computer room, and the gas is continuously drawn out by the fan, further wasting energy. If the prior art uses a high temperature of 40°C for heat dissipation, the temperature difference between the heat dissipation gas and the GPU chip and the heat sink 3 is too small, resulting in poor cooling effect and being unusable and meaningless. Therefore, the intermittent high-pressure cold air cooling method used in the present invention is a highly efficient and energy-saving method.

[0043] To connect the GPU operating temperature to the heat sink for automatic heat dissipation, a chip temperature sensor 16 is provided on the GPU chip and the heat sink 3. Chip temperature sensor 16 is connected to automatic controller 13 via a wire. In practice, chip temperature sensor 16 is built into the GPU chip and generally does not need to be installed separately.

[0044] In order to reduce humidity and defogging in an emergency, a humidity sensor 17 is provided in the GPU box 4, and the humidity sensor 17 is connected to the automatic controller 13 by an electric wire. When the wet fog or dew signal emitted by the humidity sensor 17 exceeds the permitted value, the device of the present invention automatically starts the emergency dehumidification and defogging working mode.

[0045] Emergency dehumidification and mist control circuit: The operating environment of GPU chips and other components has specified temperature and humidity ranges. National Standard B2887-89 stipulates that the maximum dew point temperature is 17°C under Class A humidity conditions of 45% to 65%. Within this humidity range, the chip temperature sensor 16 uses a temperature rating of 10°C to 45°C. When the temperature of the chip temperature sensor 16 reaches 45°C, high-pressure cold air at a temperature of 10°C to 17°C is blown into the GPU box 4 to cool it down. When the temperature drops to 10°C, the high-pressure cold air flow is stopped. When the temperature of the chip temperature sensor 16 reaches 45°C again, high-pressure cold air is blown in to cool it down again, forming a cycle of cooling, stopping, and then restarting. During this cooling and stopping cycle, any dew generated within the GPU box 4 will be driven out by the next influx of high-pressure cold air, preventing it from lingering inside for long periods. Therefore, under ambient humidity conditions of 45% to 65%, the present invention does not cause dew to affect GPU chips, etc. However, under the exceptionally unfavorable conditions of ambient humidity exceeding 85%, the duration and amount of dew generated within the GPU box 4 may be prolonged, and the amount may also increase. This long-term occurrence may be detrimental to the GPU chips, etc. To address this prolonged and increased dew generation problem, the present invention provides an internal humidity sensor 17 within the GPU box 4. The internal humidity sensor 17 uses dew generation data, which indicates the duration and amount of dew generation, to control the closure of the tracheal pressure valve 15 via the automatic controller 13. This dew data allows the tracheal pressure valve 15 to be opened in advance before the temperature of the chip temperature sensor 16 reaches 45°C, forcing the dew within the GPU box 4 with high-pressure cold air. This allows for emergency dehumidification and dew removal under exceptionally unfavorable conditions of ambient humidity exceeding 85%, protecting the GPU chips, etc., from dew.

[0046] The GPU chip radiator has a structure with two air flow channels, fast and slow: a plurality of vertical heat dissipation columns 24 are erected on the heat dissipation plate 23 of the GPU chip and the radiator 3, and many vertical heat dissipation columns 24 are arranged into multiple rows of corrugated curves 25, and many corrugated curves 25 are provided on the GPU chip and the radiator 3.

[0047] The GPU chip and the many vertical heat dissipation columns 24 of the radiator 3 are arranged side by side to form a plurality of corrugated curves 25 , and the gap distance between adjacent corrugated curves 25 is greater than the gap distance between adjacent vertical heat dissipation columns 24 in the same corrugated curve 25 .

[0048] Many corrugated curves 25 form two types of fast and slow airflow channels, primary and secondary, to dissipate heat evenly and quickly: a group of corrugated curves 25 consisting of a plurality of upright heat dissipation columns 24, each consisting of two types of primary and secondary airflow channels, is arranged on the heat sink 27 of multiple GPU chips and the radiator 3. The gaps between adjacent corrugated curves 25 are wider and serve as primary airflow channels, and the gaps between adjacent upright heat dissipation columns 24 in a corrugated curve 25 are narrower and serve as secondary airflow channels. The width of the primary airflow channel is greater than that of the secondary airflow channel. When the high-pressure cold gas output by the air storage box outlet pipe 8 or the equalizing box outlet pipe 19 blows onto the group of corrugated curves 25, there is a primary airflow channel, which allows the high-pressure cold gas to pass through the group of corrugated curves 25 from front to back. Because there is a secondary airflow channel to generate gas vortexes, the cooling time of the high-pressure cold gas retained in the upright heat dissipation columns 24 is prolonged.

[0049] The structure of the corrugated curve 25: The GPU chip and the heat sink 3 are provided with a plurality of vertical heat dissipation columns 24, which are arranged into a plurality of rows of corrugated curves 25. The GPU chip and the heat sink 3 are provided with a plurality of corrugated curves 25; the GPU chip and the heat sink 3 are provided with a plurality of vertical heat dissipation columns 24 which are arranged side by side into a plurality of corrugated curves 25, and the gap between adjacent corrugated curves 25 is greater than the gap between adjacent vertical heat dissipation columns 24 in the same corrugated curve 25. The gap distance between the adjacent corrugated curves 25 is the main channel of the cold air, and the flow line of the air outlet pipe 8 of the air storage box or the air outlet pipe 19 of the equalizing box is consistent with the channel direction of the opening section of the main channel of the cold air between the multiple corrugated curves 25; the crest and trough spacing 30 width of the corrugated curve 25 close to the air storage box outlet pipe 8 or close to the air outlet pipe 19 of the equalizing box is greater than the crest and trough spacing 30 width of the corrugated curve 25 away from the air storage box outlet pipe 8 or away from the air outlet pipe 19 of the equalizing box.

[0050] The groups of corrugated curves 25 on the GPU chip and the radiator 3 have primary and secondary air flow channels, so that high-pressure cold gas can flow through all the groups of corrugated curves 25, and use the high air pressure to flush away the hot gas and mist stagnant in the groups of corrugated curves 25. The vortex can also be used to extend the cooling time of the vertical heat dissipation columns 24 by the high-pressure cold gas, accelerate the cooling of the vertical heat dissipation columns 24, make full use of the low-temperature gas blown out of the pipe mouth first, make full use of the refrigeration energy, and reduce the cooling cost.

[0051] If a motherboard is equipped with multiple GPU chips, and the multiple GPU chips and the radiator 3 share a heat sink 23, a plurality of heat sink fins 27 are vertically provided on the heat sink 23 with gaps 26 between them, and a reciprocating windshield 28 that can move back and forth is provided above the multiple heat sink fins 27; a support frame 29 for fixing the reciprocating windshield 28 is provided in the gaps 26 between the heat sink fins 27, or is provided on a slide rail additionally provided on the heat sink 23, or is provided on a slide rail additionally provided on the heat sink 23.

[0052] The heat sink 23 is arranged in an inclined manner, or the slide rail on the heat sink 23 is arranged in an inclined manner.

[0053] The reciprocating windshield 28 is a floating distribution device that ensures that all parts of the elongated heat sink 27 can obtain the lowest cooling air: a reciprocating windshield 28 that can reciprocate with the pressure change of the high-pressure cold gas is set on the heat sink 27 shared by multiple GPU chips and the radiator 3. The pressure change from the beginning to the end of a high-pressure cold gas blowing cycle causes the reciprocating windshield 28 to block the high-pressure cold gas flow at different positions of the heat sink 27. The high-pressure cold gas has the opportunity to generate gas vortices at various parts of the elongated heat sink 27, so that the heat dissipation at various parts of the elongated heat sink 27 is uniform.

[0054] The reciprocating windshield 28 generates a vortex airflow. The function is: because the reciprocating windshield 28 blocks the high-pressure cold gas airflow at different positions of the heat sink 27, at any blocking position, the high-pressure cold gas changes from a straight airflow to a vortex airflow. The vortex airflow increases the cooling residence time of the airflow at that position, preventing the high-pressure cold gas from leaving the heat sink 27 quickly, thereby enhancing the heat dissipation effect of the heat sink 27 at that position.

[0055] The inventive significance of the reciprocating windshield 28's structural design, which is movable above the heat sink 27 but does not enclose the heat sink 27, is that this open structure can also maximize the time that high-pressure cold gas remains on the heat sink 27 in the presence of high pressure, allowing it to remain on the heat sink 27 in a vortex-like manner. When high-pressure cold gas is flowing in, the reciprocating windshield 28 allows the high-pressure cold gas to extend the time it cools the GPU chip and heat sink 3 at each location, using its high pressure to remove as much high-temperature air from the heat sink 27 above the GPU chip and heat sink 3 as possible, achieving rapid cooling. Furthermore, when high-pressure cold gas is not flowing in, the reciprocating windshield 28 does not block heat dissipation from the heat sink 27 and the flow of hot and cold gases. Therefore, when high-pressure cold gas first contacts the object being cooled, the reciprocating windshield 28 slows its diffusion, prolongs its contact time, and fully utilizes the high pressure of the high-pressure cold gas to remove any trapped heat. Furthermore, when high-pressure cold gas is not flowing in, the reciprocating windshield 28 allows the heat sink 27 to rapidly circulate hot and cold gases without obstruction, fully utilizing cooling energy and reducing cooling costs.

[0056] Rectangular gas distribution box: When the air storage box outlet pipe 8 outputs cooling gas to multiple GPU boxes 4 simultaneously, the cooling gas outputted by the air storage box outlet pipe 8 needs to be evenly distributed. Also included is a gas distribution box 18, the air inlet of which is connected to the air storage box outlet pipe 8. The gas distribution box 18 has multiple air outlets, each of which is connected to the air inlet 5 of the GPU box 4 via an air distribution box outlet pipe 19, or is connected to a flat trumpet-shaped air outlet pipe 20 provided in the GPU box 4. The gas distribution box 18 contains an inclined multi-porous gas distribution plate 21. The multi-porous gas distribution plate 21 is provided with air leakage holes 22 of varying sizes. The air guide area of ​​the air leakage holes 22 near the air inlet of the gas distribution box 18 is smaller than that of the air leakage holes 22 away from the air inlet of the gas distribution box 18.

[0057] A structure for quickly and evenly distributing the gas in an air storage box outlet pipe 8 to multiple air pipes: using a gas equalizing box 18 and multiple equalizing box outlet pipes 19, the high-pressure cold gas in an air storage box outlet pipe 8 in the gas equalizing box 18 is evenly dispersed and input to multiple GPU boxes 4 or multiple GPU chips and radiators 3; each gas equalizing box 18 is connected to multiple equalizing box outlet pipes 19, each equalizing box outlet pipe 19 enters the air inlet 5 on a GPU box 4, and inputs the high-pressure cold gas into the GPU box 4, or each equalizing box outlet pipe 19 is directly aimed at a GPU chip and radiator 3 to blow out the high-pressure cold gas.

[0058] Because the high-pressure cold air is blown out intermittently in the gas balancing box 18, the air pressure in the gas balancing box 18 changes cyclically. Every time the high-pressure cold air storage box 2 starts to output high-pressure gas to the gas balancing box 18, the gas balancing box 18 is always in a low-pressure state. In order to quickly enable each balancing box outlet pipe 19 in the gas balancing box 18 to obtain the same air pressure and air flow, a porous gas balancing plate 21 needs to be set in the gas balancing box 18 as a pressure and airflow rapid balancing device.

[0059] The function of the gas balancing box 18 is to reduce the number of gas storage box outlet pipes 8. In a computer room with a large number of cabinets, one cabinet can use only one gas storage box outlet pipe 8 and one gas balancing box 18, and be equipped with multiple balancing box outlet pipes 19, so that the computer room is neat and orderly. Otherwise, there are too many gas storage box outlet pipes 8 and they are too messy, making it impossible to clean up faults and difficult to repair. At the same time, each GPU box 4 or each GPU chip and radiator 3 in the same cabinet can obtain high-pressure cooling gas with the same pressure, the same flow rate and the same temperature.

[0060] The porous gas balancing plate 21 is used to make the air leakage holes 22 near the gas storage tank outlet pipe 8 smaller and the air leakage holes 22 far from the gas storage tank outlet pipe 8 larger because the air leakage holes 22 near the gas storage tank outlet pipe 8 are smaller in area but have higher air pressure, while the air leakage holes 22 far from the gas storage tank outlet pipe 8 are larger in area but have lower air pressure. This ensures that both the near and far balancing box outlet pipes 19 receive an even flow of high-pressure cold gas from the gas storage tank outlet pipe 8. The porous gas balancing plate 21 is preferably tilted, with the position near the gas storage tank outlet pipe 8 higher and the position far from the gas storage tank outlet pipe 8 lower. This facilitates the automatic flow of high-pressure cold gas to the balancing box outlet pipe 19 far from the gas storage tank outlet pipe 8, ensuring that both the near and far balancing box outlet pipes 19 receive an even flow of high-pressure cold gas from the gas storage tank outlet pipe 8.

[0061] The small beam of cooling gas discharged from the pipe outlet is evenly diffused into an air flow beam of the same size as the GPU chip and the radiator 3: the small opening end of the flat trumpet-shaped air outlet pipe 20 is connected to the averaging box air outlet pipe 19, and the large opening end of the flat trumpet-shaped air outlet pipe 20 is aligned with the GPU chip and the radiator 3; a plurality of radially distributed gas averaging strip protrusions 32 are provided on the inner wall of the flat trumpet-shaped air outlet pipe 20, and the radial concentrated end thereof is located at one end close to the averaging box air outlet pipe 19; the plurality of gas averaging strip protrusions 32 radially distributed on the inner wall of the flat trumpet-shaped air outlet pipe 20 evenly distribute the gas discharged from the averaging box air outlet pipe 19 at the large opening end of the flat trumpet-shaped air outlet pipe 20 and blow it toward the GPU chip and the radiator 3.

[0062] In order to ensure that the center and edge positions of the GPU chip and the radiator 3 can obtain the same flow of cooling gas, a plurality of gas balancing strip protrusions 32 are radially distributed on the inner wall of the flat trumpet-shaped outlet pipe 20, so that the highly concentrated cooling gas output by the balancing box outlet pipe 19 is evenly dispersed to various positions of the GPU chip and the radiator 3, making the heat dissipation of the GPU chip and the radiator 3 more uniform.

[0063] Spherical Gas Distribution Box: When the gas tank outlet pipe 8 outputs cooling gas to multiple GPU boxes 4 simultaneously, the cooling gas output from the gas tank outlet pipe 8 needs to be evenly distributed. The gas distribution box 18 is a spherical shell formed by two or more removably sealed parts. Multiple distribution box outlet pipes 19 are evenly distributed outside the spherical shell and communicate with the interior of the spherical shell. One or more gas distribution cone protrusions 31 are provided inside the gas distribution box 18 of the spherical shell. The top of each gas distribution cone protrusion 31 is close to the opening of the gas tank outlet pipe 8 in the gas distribution box 18, and the bottom of each gas distribution cone protrusion 31 is fixedly connected to the inner wall of the gas distribution box 18, so that all distribution box outlet pipes 19 connected to the gas distribution box 18 can receive cooling gas with the same pressure and flow rate.

[0064] The spherical shell of the gas distribution box 18 can reduce the distance between the openings of the multiple distribution box outlet pipes 19 and the gas storage box outlet pipe 8 within the gas distribution box 18, thereby improving gas distribution efficiency. The gas distribution cone protrusion 31 uses the cone's inclined surface to quickly and evenly distribute the columnar gas input from the gas storage box outlet pipe 8 into the gas distribution box 18 to each distribution box outlet pipe 19. The spherical shell has a larger surface area per unit volume for connecting the distribution box outlet pipes 19. This structure can minimize the internal volume of the spherical shell gas distribution box 18, thereby shortening the time it takes for the gas to rise from low pressure to high pressure within the gas distribution box 18. This allows the multiple distribution box outlet pipes 19 connected to a gas distribution box 18 to quickly obtain cooling gas with the same pressure and flow rate, evenly dissipating heat for different GPU chips and heat sinks 3.

[0065] Advantages of the present invention: Using the device of the present invention to generate high-pressure cold air to cool GPU chips and other components offers the following advantages: Using forward high-pressure cold air eliminates the problem of fog and dew in the GPU box. The high-pressure generated gas flow rate of 20-40 m / s is greater than the fan airflow velocity, eliminating the need for fans and significantly reducing noise in the computer room. Using 10-17°C high-pressure cold air allows for intermittent cooling, fully utilizing the cooling air and conserving refrigeration energy. Resolving the fog and dew problem allows for faster cooling of GPU chips and other components using low-temperature 10-17°C cold air, which is lower than fan air temperature and better protects the GPU chips, ensuring that the operating temperature of the GPU chips and other components does not exceed the upper temperature, thereby improving the GPU chip's computing efficiency. This provides both energy savings and noise reduction, as well as improved computing efficiency. Using the device of the present invention with high-pressure cold air enables intermittent cooling of the GPU chips and radiator, saving heat dissipation energy, improving computing efficiency, reducing computing power costs, and reducing computer room noise. The air pipe pressure valve is a key component that controls the temperature and humidity of the high-pressure cold air storage box to determine whether cooling air is supplied to the GPU chips and radiator, and is the final component for achieving intermittent cooling air output.

[0066] The chip temperature sensor is used to control the automatic controller, and the automatic controller is used to control the air pipe pressure valve and the air pressure pump to achieve automatic clearance of high-pressure cold air to eliminate heat dissipation to GPU chips, etc.

[0067] The function of the gas equalizing box is to reduce the number of gas outlet pipes of the gas storage box and the equalizing box, making the computer room neat and orderly, and ensuring that each GPU chip and radiator obtains high-pressure cooling gas with the same pressure, flow rate and temperature.

[0068] The corrugated curve and reciprocating wind shield can generate vortexes to extend the cooling time of the high-pressure cold gas on the GPU chip and the radiator, reduce diffusion, and quickly cool down. It fully utilizes the lowest temperature gas blown in first, fully utilizes the refrigeration energy, and reduces cooling costs.

[0069] The emergency dehumidification and mist removal control circuit can dehumidify and drive out mist and dew under special adverse conditions where the ambient humidity is above 85%, protecting GPU chips and other devices from the effects of mist and dew. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] Figure 1 This is a schematic diagram of the overall structure of the high-pressure cold air storage box of the present invention directly cooling the GPU chip and the like in a GPU box;

[0071] Figure 2 This is a schematic diagram of the overall structure of the high-pressure cold air storage box of the present invention, which cools down the GPU chips and the like in multiple GPU boxes through a gas equalization box;

[0072] Figure 3 It is a schematic diagram of the three-dimensional structure of the air flow of a cut-away gas distribution box and multiple GPU boxes of the present invention;

[0073] Figure 4 It is a schematic diagram of the three-dimensional structure of the GPU chip and multiple vertical heat dissipation columns in the GPU box of the present invention;

[0074] Figure 5 It is a schematic diagram of two corrugated curve structures composed of multiple vertical heat dissipation columns of the present invention;

[0075] Figure 6 It is a structural diagram of a plurality of vertical heat dissipation columns of the present invention, which are composed of a plurality of corrugated curves and an air outlet pipe of an evenly distributed box;

[0076] Figure 7 This is a schematic diagram of the three-dimensional structure of a heat sink with multiple GPU chips sharing a heat sink. The heat sink is provided with a reciprocating windshield plate that receives high-pressure cooling gas blown out of an outlet pipe of a distribution box to dissipate heat from the GPU chips and the heat sink. The reciprocating windshield plate reciprocates in response to changes in air pressure, blocking the high-pressure cooling gas, thereby generating eddy currents in the high-pressure cooling gas. The high-pressure cooling gas is then extended into the gaps between the multiple heat sinks, thereby improving the utilization rate of the high-pressure cooling gas.

[0077] Figure 8 This is a schematic diagram of a three-dimensional structure in which a reciprocating windshield is provided in the gaps between multiple heat sinks on a GPU chip of the present invention;

[0078] Figure 9 This is a schematic structural diagram of a reciprocating windshield according to the present invention, in which a support frame is arranged in a gap between heat sinks and the reciprocating windshield moves back and forth due to changes in air pressure;

[0079] Figure 10 Schematic diagram of the cross-sectional structure of the spherical gas distribution box of the present invention;

[0080] Figure 11 It is a structural schematic diagram of the flat trumpet-shaped air outlet pipe of the present invention.

[0081] In the figure, 1 is an air pressure pump, 2 is a high-pressure cold air storage box, 3 is a GPU chip and radiator, 4 is a GPU box, 5 is an air inlet, 6 is an air outlet, 7 is a pump outlet pipe, 8 is an air storage box outlet pipe, 9 is a gas pressure sensor, 10 is a power cord, 11 is an air pump electric source switch, 13 is an automatic controller, 14 is a one-way valve, 15 is an air pipe pressure valve, 16 is a chip temperature sensor, 17 is a humidity sensor in the box, 18 is a gas balancing box, 19 is an balancing box outlet pipe, 20 is a flat trumpet-shaped outlet pipe, 21 is a porous gas balancing plate, 22 is an air leakage hole, 23 is a heat dissipation plate, 24 is an upright heat dissipation column, 25 is a corrugated curve, 26 is a gap, 27 is a heat sink, 28 is a reciprocating wind shield, 29 is a support frame, 30 is the distance between the peak and the trough, 31 is a gas balancing cone convex, and 32 is a gas balancing strip convex. DETAILED DESCRIPTION

[0082] Example 1: A device for manually cooling and reducing the noise of a GPU chip using a high-pressure cold air gap. Figure 1 ,

[0083] A device for cooling and reducing noise of a GPU chip by using a high-pressure cold air gap method includes an air pressure pump 1, a high-pressure cold air storage box 2, a GPU chip and a heat sink 3, and an automatic controller 13. The GPU chip and the heat sink 3 are arranged in a GPU box 4, and the GPU box 4 has an air inlet 5 and an air outlet 6.

[0084] The air outlet of the air pressure pump 1 is connected to the air inlet of the high-pressure cold air storage box 2 through a pump outlet pipe 7, and the air outlet of the high-pressure cold air storage box 2 is connected to the air inlet 5 of the GPU box 4 through an air storage box outlet pipe 8;

[0085] A power switch 11 is provided on the power line 10 connected to the air pressure pump 1;

[0086] A gas pressure sensor 9 is provided in the high pressure cold gas storage tank 2;

[0087] The air outlet pipe 8 of the air storage box is provided with a tracheal air pressure valve 15;

[0088] Automatic controller 13 is connected to gas pressure sensor 9 and power switch 11 by wires. Using gas pressure sensor 9 to control automatic controller 13, which in turn controls tracheal pressure valve 15 and power switch 11, automatically controls the output gas within the rated high pressure range, providing conditions for intermittent removal of heat dissipation gas.

[0089] The air pipe pressure valve 15 can be selected to have a valve that gradually changes from small to large, so that after the GPU chip and the radiator 3 are cooled to the rated value, it can not be completely closed, and a small gap is left to let out a small amount of cooling gas to compensate for part of the heat consumed by the subsequent heating of the GPU chip and the radiator 3, thereby extending the time for the GPU chip and the radiator 3 to reach the high temperature rated value again.

[0090] Parameter setting: When the GPU chip and the radiator 3 reach the high temperature rating of 45°C or 65°C, the automatic controller 13 is manually operated to open the air pipe pressure valve 15 to release cooling gas to dissipate heat from the GPU chip and the radiator 3. The high-pressure cooling air used in the present invention has a pressure of 105KPa-150KPa, a temperature of 10°C-17°C, and a gas flow rate of 5m / s-40m / s.

[0091] Example 2: Device for cooling and reducing noise of GPU chips using high-pressure cold air gaps with automatic temperature and humidity control

[0092] like Figure 2 ,

[0093] This embodiment is the same as the embodiment 1, except that the following design is added based on the structure of the embodiment 1:

[0094] A one-way valve 14 is provided on the pump outlet pipe 7 so that gas can only flow from the air pressure pump 1 to the high-pressure cold air storage tank 2.

[0095] The automatic controller 13 is connected to the tracheal air pressure valve 15 by an electric wire.

[0096] The GPU chip and the heat sink 3 are provided with a chip temperature sensor 16 , which is connected to the automatic controller 13 via an electric wire.

[0097] An internal humidity sensor 17 is provided in the GPU box 4 , and the internal humidity sensor 17 is connected to the automatic controller 13 via an electric wire.

[0098] The one-way valve 14 is used to prevent the cooling gas in the high-pressure cold air storage tank 2 from flowing back into the air pressure pump 1.

[0099] The tracheal pressure valve 15 is a process-controllable solenoid valve with controllable opening, closing, and retention, capable of opening and closing in small increments. This valve is used to control the flow of cooling gas to the GPU chip and heat sink 3 at varying times, maintaining a set rated pressure between 105 kPa and 150 kPa.

[0100] The chip temperature sensor 16 is actually built into the GPU chip and generally does not need to be set up again. The only thing to do is to connect the chip temperature sensor 16 pins of the GPU chip to the automatic controller 13 with wires so that the temperature electrical signal of the chip temperature sensor 16 can be received by the automatic controller 13.

[0101] An internal humidity sensor 17 is installed within the GPU box 4. This internal humidity sensor 17 is connected to the automatic controller 13 via an electrical wire, forming a control circuit for outputting high-pressure cold gas at an emergency rated gas pressure or rated time to remove dew and fog. For example, when the internal humidity sensor 17 senses that the relative humidity within the GPU box 4 has reached or exceeded 70%, the automatic controller 13 switches on the power switch 11, causing the air pressure pump 1 to increase the cooling air pressure to 150 kPa in the high-pressure cold air storage tank 2. Furthermore, the automatic controller 13 maintains the tracheal pressure valve 15 in the open position. When the internal humidity sensor 17 senses that the relative humidity within the GPU box 4 has reached or fallen below 40%, the automatic controller 13 switches off the power switch 11 and returns the tracheal pressure valve 15 to the normal state described in Example 1.

[0102] Example 3: A device for cooling and reducing noise of GPU chips using a high-pressure cold air gap with a rectangular gas distribution box

[0103] like Figure 2 、 3 ,

[0104] This embodiment is the same as embodiment 2, except that the following design is added to the structure of embodiment 2: it also includes a gas equalizing box 18, the air inlet of the gas equalizing box 18 is connected to the air outlet pipe 8 of the gas storage box, and the gas equalizing box 18 has multiple air outlets. Each air outlet of the gas equalizing box 18 is connected to the air inlet 5 of the GPU box 4 through the equalizing box air outlet pipe 19, or the equalizing box air outlet pipe 19 is connected to the flat trumpet-shaped air outlet pipe 20 provided in the GPU box 4; there is an inclined porous gas equalizing plate 21 in the gas equalizing box 18; the porous gas equalizing plate 21 is provided with leakage holes 22 of different sizes, and the air guide area of ​​the leakage hole 22 close to the air inlet of the gas equalizing box 18 is smaller than the area away from the air inlet of the gas equalizing box 18.

[0105] In order to make the gas distribution box 18 better distribute the gas from the gas storage box outlet pipe 8 to the multiple distribution box outlet pipes 19 through the gas distribution box 18, a porous gas distribution plate 21 is added to the gas distribution box 18 as a gas distribution device. The gas distribution device can be the following porous gas distribution plate 21. The specific structure is as follows:

[0106] An inclined, porous gas distribution plate 21 is provided within the gas distribution box 18. The porous gas distribution plate 21 is provided with air leakage holes 22 of varying sizes. The air leakage holes 22 located closer to the air inlet of the gas distribution box 18 are smaller in area than those located further away from the air inlet. The size distribution of the air leakage holes 22 on the porous gas distribution plate 21 ensures uniform distribution of high-pressure cold air within the gas distribution box 18.

[0107] The tilted arrangement of the porous gas distributing plate 21 means that the portion of the porous gas distributing plate 21 close to the gas outlet pipe 8 of the gas storage box should be positioned higher, and the portion far from the gas outlet pipe 8 of the gas storage box should be positioned lower, so that the gas in the gas distributing box 18 of the gas outlet pipe 8 of the gas storage box can automatically flow to the far portion, and equal amounts of gas can be obtained at the far and near portions.

[0108] The air storage tank outlet pipe 8 is connected to a one-inlet and multiple-outlet gas equalizing box 18, and the high-pressure cold air in the air storage tank outlet pipe 8 is evenly inserted into multiple GPU boxes 4 through multiple equalizing box outlet pipes 19 using a gas equalizing box 18, so that each GPU box 4 can obtain high-pressure cold air with the same air pressure, airflow and temperature.

[0109] Example 4: A device for cooling and reducing noise of GPU chips using a high-pressure cold air gap with a spherical gas distribution box

[0110] like Figure 2 、 10 ,

[0111] This embodiment is the same as embodiment 2, except that the following design is added based on the structure of embodiment 2:

[0112] The air storage tank outlet pipe 8 is simply connected to a spherical gas distribution box 18 with one inlet and multiple outlets. The spherical gas distribution box 18 is used to evenly distribute the high-pressure cold air in the air storage tank outlet pipe 8 to multiple GPU boxes 4 through multiple distribution box outlet pipes 19, so that each GPU box 4 can obtain high-pressure cold air with the same air pressure, airflow, and temperature. The specific structure is as follows:

[0113] The gas distributing box 18 is a spherical shell formed by two parts that are removably sealed and connected. Multiple distributing box outlet pipes 19 are evenly distributed outside the spherical shell and communicate with the inside of the spherical shell. One or more gas distributing cone convexities 31 are provided in the gas distributing box 18 of the spherical shell. The top of the gas distributing cone convexity 31 is close to the opening of the gas storage tank outlet pipe 8 in the gas distributing box 18, and the bottom of the gas distributing cone convexity 31 is fixedly connected to the inner wall of the gas distributing box 18, so that all the distributing box outlet pipes 19 connected to the gas distributing box 18 can obtain cooling gas with the same pressure and flow rate.

[0114] The gas-distributing box 18 is a spherical shell formed by removably sealingly connecting an upper hemispherical shell and a lower hemispherical shell. The center of the upper hemispherical shell is connected to the gas tank outlet pipe 8. A centrally located gas-distributing cone 31 is fixedly positioned within the lower hemispherical shell, facing the gas tank outlet pipe 8. Several more gas-distributing cones 31 may be positioned within the gas tank outlet pipe 8, each of which is shorter and smaller than the central gas-distributing cone 31. The contact rings between the upper and lower hemispherical shells are sealed with a rubber ring. Fasteners or bolts secure the two halves together, ensuring they can withstand the high pressure of the high-pressure cooling gas within the shell without leaking.

[0115] The cone top angle of the gas-dividing cone convex 31 is selected to be 15-30 degrees, which is determined by the ratio of the length of the gas-dividing cone convex 31 to the diameter of the spherical gas-dividing box 18. The longer the gas-dividing cone convex 31 is, the smaller the cone top angle of the gas-dividing cone convex 31 is.

[0116] Example 5: The radiator is a device with a corrugated curved heat dissipation column structure that uses a high-pressure cold air gap to cool down the GPU chip and reduce noise.

[0117] like Figure 2 、 4 , 5, 6, 10, 11,

[0118] This embodiment is the same as embodiment 4, except that the following design is added on the basis of the structure of embodiment 4: a group of corrugated curves 25 consisting of a plurality of upright heat dissipation columns 24 with primary and secondary air flow channels is provided on the heat sink 27 of the multiple GPU chips and the radiator 3. The gap distance between adjacent corrugated curves 25 is the primary air flow channel, and the gap distance between adjacent upright heat dissipation columns 24 in a corrugated curve 25 is the secondary air flow channel. The width of the primary air flow channel is greater than the width of the secondary air flow channel. When the high-pressure cold gas output by the air storage box outlet pipe 8 or the equalizing box outlet pipe 19 blows onto the group of corrugated curves 25, there is a primary air flow channel so that the high-pressure cold gas can pass through the group of corrugated curves 25 from front to back. Because there is a secondary air flow channel to generate gas vortex, the cooling time of the high-pressure cold gas staying in the upright heat dissipation columns 24 is prolonged.

[0119] A plurality of vertical heat dissipation columns 24 are vertically provided on the heat dissipation plate 23 of the GPU chip and the radiator 3 . Many vertical heat dissipation columns 24 are arranged into a plurality of rows of corrugated curves 25 . The GPU chip and the radiator 3 are provided with a plurality of corrugated curves 25 .

[0120] The GPU chip and the many vertical heat dissipation columns 24 of the radiator 3 are arranged side by side to form a plurality of corrugated curves 25 , and the gap distance between adjacent corrugated curves 25 is greater than the gap distance between adjacent vertical heat dissipation columns 24 in the same corrugated curve 25 .

[0121] The heat dissipation column 24 is made of copper, has a height of 30.0 mm and a diameter of 1.0 mm. The width of the primary airflow channel between two adjacent corrugated curves 25 is 1.5 mm, and the width of the secondary airflow channel between two adjacent heat dissipation columns 24 is 0.5 mm.

[0122] A flat trumpet-shaped air outlet pipe 20 is provided in the GPU box 4, the small opening end of the flat trumpet-shaped air outlet pipe 20 is connected to the equalizing box air outlet pipe 19, and the large opening end of the flat trumpet-shaped air outlet pipe 20 is aligned with the GPU chip and the radiator 3; a plurality of radially distributed gas equalizing strip protrusions 32 are provided on the inner wall of the flat trumpet-shaped air outlet pipe 20, and the radial concentrated end thereof is located at one end close to the equalizing box air outlet pipe 19; the plurality of gas equalizing strip protrusions 32 radially distributed on the inner wall of the flat trumpet-shaped air outlet pipe 20 evenly distribute the gas released from the equalizing box air outlet pipe 19 at the large opening end of the flat trumpet-shaped air outlet pipe 20 and blow it toward the GPU chip and the radiator 3.

[0123] Example 6: A device for cooling and reducing noise of a GPU chip using a high-pressure cold air gap method with a radiator having a reciprocating windshield structure

[0124] like Figure 2 、 7 ,8,9,10,11,

[0125] This embodiment is the same as the embodiment 4, except that the following design is added based on the structure of the embodiment 4:

[0126] Multiple GPU chips and the radiator 3 share a heat sink 23. Multiple heat sink fins 27 are erected on the heat sink 23 with gaps 26 between them. A reciprocating windshield 28 that can move back and forth is provided above the multiple heat sink fins 27. A support frame 29 for fixing the reciprocating windshield 28 is provided in the gaps 26 between the heat sink fins 27, or is provided on a slide rail additionally provided on the heat sink 23, or is provided on a slide rail additionally provided on the heat sink 23.

[0127] The heat sink 23 is arranged in an inclined manner, or the slide rail on the heat sink 23 is arranged in an inclined manner. In short, the support frame 29 is arranged on the inclined slide rail. When the high-pressure cold gas blows against the reciprocating windshield 28, the reciprocating windshield 28 moves upward; when the high-pressure cold gas does not blow against the reciprocating windshield 28, the reciprocating windshield 28 moves downward. The pressure of the high-pressure cold gas changes in an intermittent cycle, and the reciprocating windshield 28 moves up and down in a reciprocating manner. The reciprocating movement of the reciprocating windshield 28 evenly distributes the high-pressure cold gas on the sliding heat sink 27.

[0128] A flat trumpet-shaped air outlet pipe 20 is provided in the GPU box 4, the small opening end of the flat trumpet-shaped air outlet pipe 20 is connected to the equalizing box air outlet pipe 19, and the large opening end of the flat trumpet-shaped air outlet pipe 20 is aligned with the GPU chip and the radiator 3; a plurality of radially distributed gas equalizing strip protrusions 32 are provided on the inner wall of the flat trumpet-shaped air outlet pipe 20, and the radial concentrated end thereof is located at one end close to the equalizing box air outlet pipe 19; the plurality of gas equalizing strip protrusions 32 radially distributed on the inner wall of the flat trumpet-shaped air outlet pipe 20 evenly distribute the gas released from the equalizing box air outlet pipe 19 at the large opening end of the flat trumpet-shaped air outlet pipe 20 and blow it toward the GPU chip and the radiator 3.

Claims

1. A device for cooling and reducing noise of a GPU chip by using a high-pressure cold air gap method, comprising an air pressure pump (1), a high-pressure cold air storage box (2), a GPU chip and a radiator (3), and an automatic controller (13), wherein the GPU chip and the radiator (3) are arranged in a GPU box (4), and the GPU box (4) has an air inlet (5) and an air outlet (6); characterized in that: The air outlet of the air pressure pump (1) is connected to the air inlet of the high-pressure cold air storage box (2) through a pump air outlet pipe (7), and the air outlet of the high-pressure cold air storage box (2) is connected to the air inlet of the air inlet hole (5) of the GPU box (4) through an air storage box air outlet pipe (8); A power switch (11) is provided on a power line (10) connected to the air pressure pump (1); A gas pressure sensor (9) is provided in the high-pressure cold gas storage box (2); A tracheal pressure valve (15) is provided on the air outlet pipe (8) of the air storage box; The automatic controller (13) is connected to the gas pressure sensor (9) and the power switch (11) with electric wires; A plurality of vertical heat dissipation columns (24) are vertically provided on the heat dissipation plate (23) of the GPU chip and the heat sink (3), and a plurality of vertical heat dissipation columns (24) are arranged into a plurality of rows of corrugated curves (25). A plurality of corrugated curves (25) are provided on the GPU chip and the heat sink (3); A plurality of GPU chips and radiators (3) share a heat sink (23); a plurality of heat sinks (27) are erected on the heat sink (23) and have gaps (26) therebetween; a reciprocating windshield (28) is provided above the plurality of heat sinks (27); a support frame (29) for fixing the reciprocating windshield (28) is provided in the gaps (26) between the heat sinks (27), or is provided on a slide rail additionally provided on the heat sink (23); or is provided on a slide rail additionally provided on the heat sink (23); The invention also includes a gas distribution box (18), the air inlet of the gas distribution box (18) is connected to the air outlet pipe (8) of the gas storage box, and the gas distribution box (18) has multiple air outlets. Each air outlet of the gas distribution box (18) is connected to the air inlet (5) of the GPU box (4) through the distribution box air outlet pipe (19), or the distribution box air outlet pipe (19) is connected to the flat trumpet-shaped air outlet pipe (20) provided in the GPU box (4).

2. The device for cooling and reducing noise of a GPU chip using a high-pressure cold air gap method according to claim 1, characterized in that: A one-way valve (14) is provided on the pump outlet pipe (7) so that gas can only flow from the air pressure pump (1) to the high-pressure cold air storage tank (2).

3. The device for cooling and reducing noise of a GPU chip using a high-pressure cold air gap method according to claim 1, characterized in that: The automatic controller (13) is connected to the tracheal air pressure valve (15) with an electric wire.

4. The device for cooling and reducing noise of a GPU chip using a high-pressure cold air gap method according to claim 1, characterized in that: A chip temperature sensor (16) is provided on the GPU chip and the heat sink (3), and the chip temperature sensor (16) is connected to the automatic controller (13) via an electric wire.

5. The device for cooling and reducing noise of a GPU chip using a high-pressure cold air gap method according to claim 1, characterized in that: An internal humidity sensor (17) is provided in the GPU box (4), and the internal humidity sensor (17) is connected to the automatic controller (13) via an electric wire.

6. The device for cooling and reducing noise of a GPU chip using a high-pressure cold air gap method according to claim 1, characterized in that: The GPU chip and the plurality of vertical heat dissipation columns (24) of the heat sink (3) are arranged side by side to form a plurality of corrugated curves (25), and the gap distance between adjacent corrugated curves (25) is greater than the gap distance between adjacent vertical heat dissipation columns (24) in the same corrugated curve (25).

7. The device for cooling and reducing noise of a GPU chip using a high-pressure cold air gap method according to claim 1, characterized in that: The heat dissipation plate (23) is arranged in an inclined manner, or the slide rail on the heat dissipation plate (23) is arranged in an inclined manner.

8. The device for cooling and reducing noise of a GPU chip using a high-pressure cold air gap method according to claim 1, characterized in that: The gas distribution box (18) is provided with a tilted porous gas distribution plate (21).

9. The device for cooling and reducing noise of a GPU chip by using a high-pressure cold air gap method according to claim 8, characterized in that: The porous gas distribution plate (21) is provided with air leakage holes (22) of different sizes, and the air guide area of ​​the air leakage hole (22) close to the air inlet of the gas distribution box (18) is smaller than the area of ​​the air inlet far from the gas distribution box (18).

10. The device for cooling GPU chips and reducing noise by using a high-pressure cold air gap method according to claim 1, characterized in that: The small opening end of the flat trumpet-shaped air outlet pipe (20) is connected to the air outlet pipe (19) of the equalizing box, and the large opening end of the flat trumpet-shaped air outlet pipe (20) is aligned with the GPU chip and the heat sink (3); a plurality of radially distributed gas equalizing strip protrusions (32) are provided on the inner wall of the flat trumpet-shaped air outlet pipe (20), and the radially concentrated end thereof is located near one end of the air outlet pipe (19) of the equalizing box; the plurality of radially distributed gas equalizing strip protrusions (32) on the inner wall of the flat trumpet-shaped air outlet pipe (20) evenly distribute the gas released from the air outlet pipe (19) of the equalizing box at the large opening end of the flat trumpet-shaped air outlet pipe (20) and blow it toward the GPU chip and the heat sink (3).

11. The device for cooling and reducing noise of a GPU chip using a high-pressure cold air gap method according to claim 1, characterized in that: The gas distribution box (18) is a spherical shell formed by two or more parts connected in a removable sealed manner. A plurality of distribution box outlet pipes (19) are evenly distributed outside the spherical shell and communicate with the inside of the spherical shell. One or more gas distribution cone convexities (31) are provided in the gas distribution box (18) of the spherical shell. The top of the gas distribution cone convexity (31) is close to the opening of the gas storage box outlet pipe (8) in the gas distribution box (18). The bottom of the gas distribution cone convexity (31) is fixedly connected to the inner wall of the gas distribution box (18), so that all the distribution box outlet pipes (19) connected to the gas distribution box (18) can obtain gas with the same pressure and flow rate.

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