Atomizing core, atomizing structure and electronic atomizing device

Abstract

Embodiments of the present application provide an atomizing core, an atomizing structure and an electronic atomizing device to solve the problem of low atomizing efficiency of the existing heating type atomizing core, which needs to forcibly evaporate the liquid by increasing the heating power, so that the atomizing sheet is locally overheated to burn the organic matter in the liquid, generating harmful aerosol. The atomizing core comprises a tubular glass substrate provided with an array of through holes and a resistive heating film layer attached to the outer periphery of the tubular glass substrate. Compared with the existing heating type atomizing core adopting a sintering process to form a contracted through hole structure, the atomizing core adopts an expanded through hole structure formed by a laser-induced etching process, which increases the volume space of the through hole inner cavity, and also increases the volume space of the substrate tube cavity as a liquid storage space, effectively improving the liquid storage capacity of the atomizing core. During atomization, the liquid in the substrate tube cavity is first preheated, and then only a small amount of heat is needed to quickly evaporate the preheated liquid into fine mist droplets, effectively improving the atomizing efficiency.

Description

Technical Field

[0001] This invention relates to the field of electronic atomization technology, and in particular to an atomizing core, atomizing structure, and electronic atomization device. Background Technology

[0002] Electro-atomization is the process of converting liquid into fine droplets using an electronic atomizing device and then delivering these droplets to a recipient via a droplet delivery system. Electronic atomizing devices are widely used in medical, industrial, and consumer applications. In consumer applications, these include, but are not limited to, air purification, air conditioning humidification, aroma diffusion, cooking techniques, and electronic cigarettes.

[0003] The electronic atomizing device includes a liquid storage tank, an atomizing structure connected to the liquid storage tank, a spray nozzle connected to the atomizing structure, a control board electrically connected to the atomizing structure, and a power supply electrically connected to both the atomizing structure and the control board. The liquid storage tank stores the liquid; the atomizing structure converts the liquid into fine droplets; the spray nozzle outputs the fine droplets; the control board controls and manages the device's various functions and parameters; and the power supply provides power to the device.

[0004] The atomizing core in an atomizing structure is the core component for achieving liquid atomization. Common atomizing cores include high-frequency vibration atomizing cores and heated atomizing cores. High-frequency vibration atomizing cores consist of a piezoelectric crystal resonator and a liquid channel; when energized, the piezoelectric crystal vibrates at high frequency, causing the liquid within the liquid channel to break into fine droplets due to intense vibration; high-frequency vibration atomizing cores are widely used in medical nebulizers. Heated atomizing cores consist of an atomizing plate with a liquid channel and an electric heating element; when energized, the electric heating element rapidly heats and evaporates the liquid, forming fine droplets; heated atomizing cores are commonly found in electronic atomization devices such as e-cigarettes. The radial dimension of the through-hole corresponding to the liquid channel in the atomizing core is on the micrometer scale.

[0005] Because ceramic materials have good mechanical strength and corrosion resistance, the atomizing plates of heated atomizing cores are usually porous atomizing plates made of ceramic materials.

[0006] However, in the process of implementing the technical solutions in the embodiments of the present invention, the inventors discovered that existing heated atomizing cores have at least the following technical problems:

[0007] Existing heated atomizing cores use a sheet-like porous ceramic atomizing plate as the atomizing carrier, with the internal space of multiple shrinkage pores formed by the sintering process on the ceramic atomizing plate serving as the liquid storage space and liquid channel. During use, to improve atomization efficiency, the heating power needs to be increased to forcibly evaporate the liquid. This can lead to localized overheating of the atomizing plate, causing the organic matter in the liquid to burn and produce harmful aerosols. Furthermore, while increasing the heating power can improve atomization efficiency, it shortens the lifespan of the heating element and reduces the overall lifespan of the electronic atomizing device. Summary of the Invention

[0008] In view of this, the purpose of this invention is to provide an atomizing core, an atomizing structure, and an electronic atomizing device to solve the defects of existing heated atomizing cores, which have low atomization efficiency, require increased heating power to forcibly evaporate the liquid, resulting in local overheating of the atomizing plate and burning of organic matter in the liquid, producing harmful aerosols. This invention changes the atomizing carrier from a crystalline, sheet-like porous ceramic substrate to an amorphous, tubular glass substrate. Correspondingly, the through-hole structure is changed from a shrinking through-hole structure formed by sintering to an expanding through-hole structure formed by laser-induced etching. This increases the volume of the through-hole cavity and also increases the volume of the tubular glass substrate cavity as a liquid storage space, thereby effectively improving the liquid storage capacity of the atomizing core. Furthermore, by attaching a resistance heating film to the outer periphery of the tubular glass substrate, when the film is energized, its heating surface preheats the liquid within the tubular glass substrate cavity. The heated liquid flows through the through-holes of the through-hole array to the liquid heating surface of the resistance heating film, requiring only a small amount of heat to quickly and uniformly evaporate and form fine droplets, thus effectively improving atomization efficiency.

[0009] To achieve the above objectives, the technical solutions adopted in the embodiments of the present invention are as follows:

[0010] In a first aspect, embodiments of the present invention provide an atomizing core for use in an electronic atomizing device; the atomizing core includes:

[0011] A tubular glass substrate; the tubular glass substrate has an array of through holes formed by laser-induced etching process, and the tubular cavity of the tubular glass substrate and the multiple through holes of the through hole array form a liquid channel;

[0012] A resistance heating film layer; the resistance heating film layer is attached to the outer periphery of the tubular glass substrate; a film electrode area is provided on the resistance heating film layer.

[0013] Optionally, the through-hole spacing of the through-hole array is 10 to 30 micrometers, the through-hole diameter is 10 to 50 micrometers, and the cross-sectional area of ​​the tubular glass substrate is greater than the sum of the cross-sectional areas of the inner cavities of the multiple through-holes in the through-hole array.

[0014] Optionally, the cross-sectional shape of the tubular glass substrate is one of a circle, a square, or a rectangle.

[0015] Optionally, the tubular glass substrate is made of RoHS compliant glass.

[0016] Optionally, the RoHS compliant glass is one of the following: high silica glass, borosilicate glass, quartz glass, aluminosilicate glass, or soda-lime glass.

[0017] Optionally, the resistance heating film is a metal film applied using a physical vapor deposition process.

[0018] Secondly, this invention provides an atomizing structure for use in an electronic atomizing device; the atomizing structure includes:

[0019] The encapsulation housing has a closed structure at the lower end and an open structure at the upper end; the lower end of the encapsulation housing is provided with a flexible electrode mounting hole.

[0020] The aforementioned atomizing core; the atomizing core is used to heat and evaporate liquid into fine mist droplets; the atomizing core is disposed inside the packaging shell, and a mist droplet receiving cavity is formed between the atomizing core and the packaging shell;

[0021] An elastic electrode; the elastic electrode is disposed on the lower end of the encapsulation housing through the elastic electrode mounting hole; the elastic electrode is in corresponding contact with the electrode area of ​​the resistance heating film layer of the atomizing core; the elastic electrode is used to conduct power current to the resistance heating film layer;

[0022] The end cap; the end cap covers the opening structure of the encapsulation shell, sealing the encapsulation shell; the end cap has a liquid guiding hole that communicates with the cavity of the tubular glass substrate of the atomizing core; the liquid guiding hole is used to guide liquid into the cavity of the tubular glass substrate; the end cap on the outer periphery of the liquid guiding hole has an atomization outlet that communicates with the droplet collection cavity, and the fine droplets collected in the droplet collection cavity can be output from the atomization outlet.

[0023] Optionally, the atomizing structure further includes:

[0024] End cap sealing ring; the end cap sealing ring has an annular structure; the end cap sealing ring is sleeved on the upper end of the packaging shell and makes sealing contact with the end cap;

[0025] Electrode sealing gasket; the electrode sealing gasket is disposed in the lower part of the inner cavity of the packaging shell, and the elastic electrode is sleeved on the electrode sealing gasket;

[0026] Both the outer casing and the end cap are provided with matching snap-fit ​​structures; the end cap is detachably and fixedly connected to the upper end of the outer casing through the snap-fit ​​structures.

[0027] Thirdly, this invention provides an electronic atomizing device, the electronic atomizing device comprising:

[0028] Device housing; the device housing has a spray nozzle, and the inner cavity of the device housing is provided with an atomizing channel, which is connected to the spray nozzle so that fine mist droplets can be output through the spray nozzle;

[0029] The aforementioned atomizing structure; the atomizing structure is disposed in the inner cavity of the device housing, and is used to heat and evaporate the liquid into fine mist droplets, which are then collected in the mist droplet collection cavity of the atomizing structure; the atomizing outlet of the atomizing structure is connected to the atomizing channel, so that the fine mist droplets collected in the mist droplet collection cavity can be output through the atomizing channel and the spray nozzle;

[0030] Liquid storage tank; the liquid storage tank is disposed in the inner cavity of the device housing for storing liquid and for conveying liquid into the cavity of the tubular glass substrate of the atomizing structure;

[0031] Power supply; the power supply is electrically connected to the elastic electrode of the atomizing structure through electrode leads, and is used to supply power to the atomizing structure.

[0032] Based on the above technical solution, the atomizing core in the embodiment of the present invention uses a tubular glass substrate with a cavity as an atomizing carrier, the inner cavity space of the expanded through-hole formed by laser-induced etching of the through-hole array on the tubular glass substrate and the cavity space of the tubular glass substrate as a liquid storage space, and the resistance heating film layer attached to the outer periphery of the tubular glass substrate as a heating evaporation structure.

[0033] Compared to ceramic materials, which have a crystalline structure, glass materials have an amorphous structure and a certain degree of plasticity, allowing for the fabrication of micron-sized through-holes using laser-induced etching. Compared to sintering processes that create shrinking through-holes, laser-induced etching can not only create through-holes but also expand them, resulting in expanded through-holes. Expanded through-holes have larger structural dimensions and larger internal volumes, enabling them to store more liquid. In other words, compared to existing heated atomizing cores, the atomizing core of this technology not only has a larger internal volume of through-holes but also increases the volume of the tubular glass substrate cavity as a liquid storage space, thereby effectively increasing the liquid storage capacity of the atomizing core.

[0034] When the resistance heating film layer attached to the outer periphery of the tubular glass substrate is heated by electricity, its tube heating surface will preheat the liquid in the tubular glass substrate cavity. The liquid flowing to the heating surface of the resistance heating film layer through the through holes of the through hole array only needs a small amount of heat to evaporate quickly and evenly to form fine mist droplets, thereby effectively improving the atomization efficiency.

[0035] Therefore, compared with existing heated atomizing cores, the atomizing core in this embodiment of the invention not only has a larger liquid storage capacity but also a higher atomization efficiency. Without increasing the heating power, it can achieve rapid, efficient, and stable heating and evaporation of liquid to form fine droplets, thereby solving the technical problems existing in existing ceramic-based porous atomizing cores. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 A schematic structural diagram of the atomizing core in an embodiment of the present invention is shown;

[0038] Figure 2 A schematic structural diagram of the atomization structure in an embodiment of the present invention is shown;

[0039] Figure 3 A cross-sectional schematic diagram of the atomization structure in an embodiment of the present invention is shown;

[0040] Figure 4 A schematic structural diagram of an electronic atomizing device according to an embodiment of the present invention is shown;

[0041] Figure 5 A schematic diagram of an electronic atomizing device according to an embodiment of the present invention is shown.

[0042] The correspondence between the reference numerals and component names in the figures is as follows:

[0043] Atomizing structure 1, atomizing core 10, tubular glass substrate 100, through-hole array 1001, resistance heating film 101, film electrode area 1011, encapsulation shell 11, droplet collection cavity 12, end cap 13, liquid guiding hole 131, atomizing outlet 132, snap-fit ​​structure 14, elastic electrode 15, end cap sealing ring 16, electrode sealing gasket 17, electrode lead wire 18, device housing 2, spray nozzle 21, atomizing channel 3, liquid storage tank 4, power supply 5. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with practical applications and with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] The atomizing core, atomizing structure, and electronic atomizing device in the embodiments of the present invention can be widely used in fields such as medical and health care, beauty and skin care, e-cigarettes, indoor air purification, home cleaning, and industrial precision coating.

[0046] In the healthcare field, electronic nebulizers can be used for drug nebulization therapy, particularly suitable for patients with respiratory diseases such as asthma and chronic bronchitis. By converting medications into atomized particles, they can act more directly on the patient's respiratory tract, improving treatment effectiveness.

[0047] In the field of beauty and skincare, electronic atomizing devices can be used to turn liquid skincare products such as facial serums and masks into fine droplets, which can be sprayed onto the skin surface, making them easier for the skin to absorb and achieving excellent moisturizing and whitening effects.

[0048] In the field of e-cigarettes, the electronic atomizing device is the core component that atomizes liquid nicotine and other ingredients into e-liquid, allowing users to replace traditional tobacco by inhaling the vapor. Furthermore, e-cigarettes are often used as smoking cessation tools, helping smokers reduce their dependence on traditional cigarettes to some extent.

[0049] In the field of indoor air purification, electronic atomizing devices can be used to atomize and spray air-purifying liquids indoors, degrading indoor suspended particulate matter and purifying air quality.

[0050] In the field of home cleaning, it can be used to make cleaning liquid into fine droplets and spray them on home surfaces, which can effectively clean and disinfect.

[0051] In the field of industrial precision coating, electronic atomization devices can be used to atomize liquid coatings, enabling uniform and fine coating spraying on workpieces, improving coating quality and material utilization efficiency.

[0052] Existing heated atomizing cores use a sheet-like porous ceramic atomizing plate as the atomizing carrier, with the internal space of multiple through holes on the ceramic porous atomizing plate serving as the liquid storage space and liquid channel, and a heating element as the heating and evaporation structure. During use, to improve atomization efficiency, increased heating power is required to forcibly evaporate the liquid. This can lead to localized overheating of the atomizing plate, causing the organic matter in the liquid to burn and produce harmful aerosols.

[0053] In the process of implementing the technical solutions in the embodiments of the present invention, the inventors discovered that when using existing heated atomizing cores, it is necessary to increase the heating power to forcibly evaporate the liquid in order to improve the atomization efficiency. This is not because increasing the heating power is the only way to improve the atomization efficiency. The real reason is that the structure size of the through holes on the ceramic-based porous atomizing plate is small, and the liquid storage and liquid transport volume is small, which means that the liquid can only be forcibly evaporated by increasing the heating power, thereby burning the organic matter in the liquid.

[0054] The inventors also discovered in their research that if the size of the through-hole structure on the ceramic-based porous atomizing sheet could be increased, the corresponding liquid storage and transport capacity would significantly increase, thus improving atomization efficiency without increasing heating power. However, upon closer examination, the inventors found that existing ceramic-based porous atomizing sheets and their through-holes are manufactured using a sintering process. During sintering, the through-holes on the ceramic-based porous atomizing sheet shrink, further reducing the size of the through-hole structure. Improving the existing sintering process could not achieve the desired increase in through-hole size. The inventors then attempted to create through-holes on non-porous ceramic substrates through machining. However, after numerous experiments, they found that due to the brittleness, low impact resistance, and fragility of ceramic materials, sintered non-porous ceramic substrates could not be machined to create through-holes. The inventors then attempted to create through-holes on non-porous ceramic substrates using laser technology. However, after numerous experiments, they found that laser-based through-hole creation yielded millimeter-sized through-holes with noticeable cracks on the hole walls, making it impossible to obtain micron-sized through-holes. In order to obtain micron-sized through holes, the inventors began to try to prepare through holes by laser-induced etching on non-porous ceramic substrates. However, after many experiments, they found that the laser-induced etching method for preparing through holes was simply not feasible.

[0055] The inventors discovered that the reason why laser-induced etching is not feasible for creating through-holes on non-porous ceramic substrates is because ceramic materials have a crystalline structure, making it difficult to break their strong bonds using a laser. Based on this discovery, the inventors conceived the idea that if an amorphous material with a certain degree of plasticity could be found to fabricate an atomization carrier, then relatively weak chemical bonds could be easily severed by laser-induced etching, thus enabling the fabrication of micron-sized through-holes on the atomization carrier.

[0056] Based on the above understanding, the inventor provides an atomizing core, an atomizing structure, and an electronic atomizing device.

[0057] The technical solutions of the embodiments of the present invention will be described below with reference to the accompanying drawings and examples.

[0058] Figure 1 A schematic structural diagram of the atomizing core in an embodiment of the present invention is shown.

[0059] Now refer to Figure 1 As shown, this embodiment of the invention provides an atomizing core for use in electronic atomizing devices; the atomizing core includes:

[0060] A tubular glass substrate 100; a through-hole array 1001 is formed on the tubular glass substrate 100 by laser-induced etching process, and the tubular cavity of the tubular glass substrate 100 and the multiple through-hole cavities of the through-hole array 1001 form a liquid channel.

[0061] A resistance heating film layer 101 is attached to the outer periphery of the tubular glass substrate 100; a film electrode region 1011 is provided on the resistance heating film layer 101.

[0062] In this embodiment of the invention, the tubular glass substrate 100 is a tube made of amorphous glass material. Therefore, multiple through-holes can be formed on the tubular glass substrate 100 using a high-precision laser-induced etching process to create the through-hole array 1001. This achieves a high-density, uniform distribution of micro-pores on the outer peripheral wall of the tubular glass substrate 100. The spacing and diameter of the through-holes are precisely controllable to the micrometer level, which is beneficial for outputting a uniform and fine liquid that evenly covers the resistance heating film layer 101. Compared to the shrinking through-holes formed in a sintered sheet ceramic substrate, the through-holes formed in the tubular glass substrate 100 by laser-induced etching are expansion structures, significantly increasing the liquid volume of a single through-hole. Furthermore, the liquid channel of a porous atomizing sheet formed by sintering consists of multiple through-holes, while the liquid channel of the atomizing core in this embodiment includes not only the multiple through-holes of the through-hole array 1001 but also the cavity of the tubular glass substrate 100. The liquid channel is also the liquid storage space of the atomizing core. The liquid storage capacity of the atomizing core in this embodiment of the invention is significantly increased. This significant increase in liquid storage capacity is beneficial for prolonged liquid atomization.

[0063] In this embodiment of the invention, the resistance heating film layer 101 is attached to the outer periphery of the tubular glass substrate 100. The tubular glass substrate bonding surface of the resistance heating film layer 101 serves as the heating surface of the tube. By heating the tubular glass substrate 100, the liquid inside the tube cavity of the tubular glass substrate 100 and the liquid inside the through-hole cavity of the through-hole array 1001 can be uniformly preheated. The liquid contact surface of the resistance heating film layer 101 serves as the liquid heating surface. Compared with the traditional localized heating method used in existing atomizing cores, the preheated liquid flowing out through the micro-holes of the through-hole array 1001, which is uniformly distributed on the outer periphery of the tubular glass substrate 100, fully contacts the liquid heating surface of the resistance heating film layer 101. Only a small amount of heat is required to allow the preheated liquid to be rapidly and uniformly heated and evaporated on the liquid heating surface to form fine droplets. This improves atomization efficiency, eliminates localized overheating of the heating element, reduces the risk of scorching of organic matter in the liquid, and increases the service life of the atomizing core. The electrode region of the film layer is used for electrical connection to a power source to supply power to the resistive heating film layer 101.

[0064] In this embodiment of the invention, the structural dimensions of the through holes in the tubular glass substrate 100 and the through-hole array 1001 on it are determined according to the design requirements of the electronic atomization device. Based on the through-hole structural dimensions, multiple through holes are formed on the tubular glass substrate 100 by laser-induced etching. The multiple through holes are arranged in an array to form the through-hole array 1001. The resistance heating film layer 101 is attached to the outer periphery of the tubular glass substrate 100 by a bonding process. A film electrode region 1011 is formed on the resistance heating film layer 101 to form the atomization core.

[0065] In this embodiment of the invention, when the atomizing core is applied to an electronic atomizing device and put into use, liquid enters the cavity of the tubular glass substrate 100, the resistance heating film layer 101 is energized to heat the tubular glass substrate 100, and at the same time preheats the liquid in the cavity of the tubular glass substrate 100; when the liquid in the cavity of the tubular glass substrate 100 is filled to a certain amount, the preheated liquid at the inner wall of the tubular glass substrate 100 flows out through the through holes of the through hole array 1001 to the liquid heating surface of the resistance heating film layer 101 under the action of hydraulic pressure in the cavity, and the preheated liquid is rapidly heated and evaporated on the higher temperature liquid heating surface to form fine mist droplets. During use, the cavity of the tubular glass substrate 100 and the through holes of the through hole array 1001 are both used as liquid storage spaces. The liquid heating is divided into preheating in the cavity of the tubular glass substrate 100 and heating and evaporation on the liquid heating surface of the resistance heating film layer 101. This effectively improves the liquid storage capacity and atomization efficiency of the atomizing core. Thus, without increasing the heating power, the liquid can be heated and evaporated quickly, efficiently, and stably to form fine droplets.

[0066] In this embodiment of the invention, when the atomizing core is working, the liquid coverage rate of the liquid heating surface of the resistance heating film layer 101 is an important factor affecting the atomization quality and atomization efficiency. To improve the liquid coverage rate of the liquid heating surface, optionally, the through-hole spacing of the through-hole array 1001 is 10–30 micrometers, the through-hole diameter is 10–50 micrometers, and the cross-sectional area of ​​the tubular glass substrate 100 is greater than the sum of the cross-sectional areas of the multiple through-hole cavities of the through-hole array 1001.

[0067] If the cross-sectional area of ​​the tubular glass substrate 100 is greater than the sum of the cross-sectional areas of the multiple through holes in the through-hole array 1001, the liquid input of the tubular glass substrate 100 will be greater than the liquid output, and the tubular glass substrate 100 will be filled with liquid. In this way, the hydraulic pressure in the tubular cavity will be maintained at a high level, ensuring that the liquid stored in the cavity will be continuously, adequately, and stably output through the through holes of the through-hole array 1001. Consequently, the liquid heating surface of the resistance heating film layer 101 will be continuously covered by liquid, and the liquid will evaporate rapidly, uniformly, and continuously to form fine droplets. When the through-hole spacing of the through-hole array 1001 is 10–30 micrometers and the through-hole diameter is 10–50 micrometers, the microdroplets formed by the evaporation of the atomizing core are finer and more uniform.

[0068] In this embodiment of the invention, the uniformity of the through-hole array 1001 arrangement is also an important factor affecting the liquid coverage rate of the liquid heating surface. In order to enable the liquid to uniformly cover the liquid heating surface of the resistance heating film layer 101, the cross-sectional shape of the tubular glass substrate 100 can optionally be one of a circle, a square, or a rectangle.

[0069] If the tubular glass substrate 100 has a cross-sectional shape of circular, square, or rectangular, then forming the through-hole array 1001 by laser-induced etching is much simpler in operation. This allows for precise control over the hole location, size, and quality, resulting in a uniformly arranged through-hole array 1001. The liquid flowing from the uniformly arranged through-hole array 1001 will evenly coat the liquid heating surface and rapidly and uniformly heat and evaporate to form fine droplets, improving the atomization efficiency of the atomizing core. In specific implementations, a tubular glass substrate 100 with a square or rectangular cross-sectional shape is more suitable for processing the through-hole array.

[0070] In this embodiment of the invention, the fine droplets formed by the heating and evaporation of the atomizing core eventually enter the receiver or the environment. To avoid the presence of harmful substances such as lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers in the fine droplets formed by evaporation, the tubular glass substrate 100 may optionally be made of RoHS compliant glass.

[0071] RoHS stands for Restriction of Hazardous Substances Directive. It is a green environmental standard proposed by the European Union in 2003, requiring electronic and electrical products to restrict the use of hazardous substances such as lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBBBs), and polybrominated diphenyl ethers (PBDEs).

[0072] The tubular glass substrate 100 is made of RoHS-compliant glass material to avoid potential hazards to receptors and the environment. Specifically, RoHS-compliant glass can be one of the following: high-silica glass, borosilicate glass, quartz glass, aluminosilicate glass, or soda-lime glass.

[0073] In this embodiment of the invention, the resistance heating film 101 can specifically be one of a metal film, a metal oxide film, a silicon-based film, a carbon-based film, or a composite film. The materials of the metal film include, but are not limited to, aluminum, molybdenum, tungsten, and platinum. Metal films have the characteristics of good electrical conductivity and uniform heating. Furthermore, metal films, as resistance heating films, have advantages such as good electrical conductivity, high thermal stability, good oxidation resistance, long service life, good processing performance, and low cost.

[0074] In this embodiment of the invention, the method of attaching the resistance heating film 101 to the outer periphery of the tubular glass substrate 100 can be one of using conductive adhesive to attach the heating film 101 to the outer periphery of the tubular glass substrate 100, or using physical vapor deposition to directly deposit the resistance heating film 101 on the outer surface of the tubular glass substrate 100.

[0075] Optionally, the resistance heating film 101 is a metal film applied using a physical vapor deposition process.

[0076] The resistance heating film 101, fabricated using physical vapor deposition, has two advantages: firstly, a denser structure and stronger interfacial bonding with the tubular glass substrate 100; secondly, it allows for the formation of a uniform resistance heating film 101 on the outer wall of the tubular glass substrate 100, preventing localized over-thickness or under-thinness. This enables uniform preheating of the liquid within the liquid channel, allowing the preheated liquid to rapidly and uniformly evaporate and form fine droplets upon reaching the heating surface, further improving atomization efficiency and effect. Furthermore, using a metal film with excellent electrical conductivity as the resistance heating film 101 further enhances the efficiency of generating heat energy through current.

[0077] Specifically, the physical vapor deposition process can be one of magnetron sputtering, electron beam evaporation, or ion plating. The resistance heating film 101 formed by physical vapor deposition has a denser structure and stronger interfacial adhesion with the tubular glass substrate 100.

[0078] Figure 2 A schematic structural diagram of the atomization structure in an embodiment of the present invention is shown.

[0079] Figure 3 A cross-sectional schematic diagram of the atomization structure in an embodiment of the present invention is shown.

[0080] Now refer to Figure 2 In conjunction with Figure 3, this embodiment of the invention provides an atomizing structure for use in electronic atomizing devices; the atomizing structure includes:

[0081] The encapsulation housing 11 has a closed structure at the lower end and an open structure at the upper end; the lower end of the encapsulation housing 11 is provided with an elastic electrode mounting hole.

[0082] Atomizing core 10; the atomizing core 10 is used to heat and evaporate liquid into fine mist droplets; the atomizing core 10 is disposed inside the encapsulation shell 11, and a mist droplet receiving cavity 12 is formed between the atomizing core 10 and the encapsulation shell 11;

[0083] Elastic electrode 15; the elastic electrode 15 is disposed on the lower end housing of the encapsulation housing 11 through the elastic electrode mounting hole; the elastic electrode 15 is in corresponding contact with the film electrode area of ​​the resistance heating film layer of the atomizing core 10; the elastic electrode 15 is used to introduce power current to the resistance heating film layer;

[0084] The end cap 13 covers the opening structure of the encapsulation shell 11, sealing the encapsulation shell 11; the end cap 13 has a liquid guiding hole 131 that communicates with the cavity of the tubular glass substrate of the atomizing core 10; the liquid guiding hole 131 is used to guide liquid into the cavity of the tubular glass substrate; the end cap 13 on the outer periphery of the liquid guiding hole 131 has an atomization outlet 132 that communicates with the droplet collecting cavity 12, and the fine droplets collected in the droplet collecting cavity 12 can be output from the atomization outlet 132.

[0085] In this embodiment of the invention, the encapsulation shell 11 is manufactured using a molding process, for example, by injection molding of a chemically resistant engineering plastic. The encapsulation shell 11 manufactured using this molding process has a simple structure, good sealing performance, low cost, and is easy to mass-produce. The encapsulation shell 11 features a closed lower end and an open upper end design, facilitating the assembly of internal components while ensuring service life. An elastic electrode mounting hole is provided on the lower end of the encapsulation shell 11, enabling precise alignment between the elastic electrode 15 and the electrode area of ​​the resistance heating film layer of the atomizing core 10.

[0086] In this embodiment of the invention, the atomizing core 10 is built into the encapsulation shell 11, and a droplet collecting cavity 12 is formed between the atomizing core 10 and the encapsulation shell 11 for temporarily storing and uniformly mixing newly generated micro-droplets.

[0087] It should be understood that the atomizing core in the atomizing structure embodiment of the present invention is the atomizing core in the aforementioned atomizing core embodiment of the present invention. For the sake of convenience and brevity, the description of the atomizing core in the atomizing structure embodiment of the present invention can be referred to the relevant description in the atomizing core embodiment of the present invention, and will not be repeated here.

[0088] In this embodiment of the invention, the end cap 13 covers the opening structure of the encapsulation shell 11, sealing the encapsulation shell 11. The fixed connection between the end cap 13 and the encapsulation shell 11 can be a threaded connection or a detachable connection via a snap-fit ​​structure. The end cap 13 is provided with a liquid guiding hole 131 for continuously inputting liquid into the atomizing core 10; the end cap 13 is also provided with an atomization outlet 132, which communicates with the droplet collection chamber 12 to output the fine droplets generated by atomization.

[0089] In this embodiment of the invention, the elastic electrode 15 is made of a conductive elastic material, which has both good conductivity and elastic deformation capability, can adapt to thermal expansion and contraction, and can achieve reliable contact with the electrode area of ​​the resistance heating film layer of the atomizing core 10, so as to provide a stable and reliable heating current for the resistance heating film layer.

[0090] In this embodiment of the invention, the atomizing core 10 is built into the encapsulation shell 11, and a sealed droplet collecting cavity 12 is formed between the atomizing core 10 and the encapsulation shell 11; the end cap 13 covers the opening structure of the encapsulation shell 11, thereby sealing the encapsulation shell 11. The sealing forms a hydraulically driven liquid flow channel composed of the liquid guiding hole 131, the cavity of the tubular glass substrate, and the through holes of the through-hole array, and a gas flow channel composed of the droplet collecting cavity 12 and the atomization outlet 132; the elastic electrode 15 is electrically connected to the resistance heating film layer of the atomizing core 10, supplying power to achieve liquid atomization.

[0091] When the atomizing core 10 is applied to an electronic atomizing device and put into use, the resistance heating film is energized, and the liquid enters the cavity of the tubular glass substrate through the liquid guiding hole 131 of the end cap 13. The resistance heating film preheats the liquid in the cavity by heating the tubular glass substrate. When the hydraulic pressure generated by the liquid storage in the cavity of the tubular glass substrate and the through holes of the through hole array is sufficient to allow the preheated liquid to flow out from the through holes of the through hole array, the liquid flows to the liquid heating surface of the resistance heating film. The preheated liquid covers the liquid heating surface and makes full contact with the liquid heating surface. The preheated liquid is rapidly and uniformly heated and evaporated on the higher-temperature liquid heating surface to form fine mist droplets. The fine mist droplets are collected by the mist droplet collecting cavity 12. When the air pressure in the mist droplet collecting cavity 12 is sufficient to allow the fine mist droplets to overflow from the atomization outlet 132, the fine mist droplet airflow is output from the atomization outlet 132.

[0092] Since the atomizing core in the atomizing structure embodiment of the present invention is the atomizing core in the aforementioned atomizing core embodiment of the present invention, the atomizing structure in the embodiment of the present invention effectively improves the liquid storage capacity and atomizing efficiency of the atomizing core compared with the existing atomizing structure. Thus, without increasing the heating power, the liquid can be heated and evaporated quickly, efficiently, and stably to form fine mist droplets.

[0093] The liquid flow in the atomizing structure is based on hydraulic pressure, while the output of the fine droplets collected in the droplet collecting chamber from the atomizing outlet is based on air pressure. The sealing performance of the atomizing structure is a crucial factor affecting its internal hydraulic and air pressure.

[0094] To improve the sealing performance of the atomizing structure, the atomizing structure may optionally further include:

[0095] End cap sealing ring 16; the end cap sealing ring 16 has an annular structure; the end cap sealing ring 16 is sleeved on the upper end of the packaging shell 11 and is in sealing contact with the end cap 13;

[0096] Electrode sealing gasket 17; the electrode sealing gasket 17 is disposed in the lower part of the inner cavity of the encapsulation shell 11, and the elastic electrode sleeve 15 is disposed on the electrode sealing gasket 17;

[0097] Both the outer casing 11 and the end cap 13 are provided with matching snap-fit ​​structures 14; the end cap is detachably and fixedly connected to the upper end of the outer casing 11 through the snap-fit ​​structures 14.

[0098] In this embodiment of the invention, the end cap sealing ring 16 is used to seal the end cap 13 to the packaging shell 11 to prevent liquid leakage and to ensure that the droplet collecting cavity 12 containing the fine droplets maintains a high air pressure, thereby allowing the fine droplets collected in the droplet collecting cavity 12 to be output from the atomization outlet 132. The end cap sealing ring 16 is made of a common container sealing material, such as silicone rubber.

[0099] In this embodiment of the invention, the electrode sealing gasket 17 is used to achieve a sealed installation of the elastic electrode 15 to prevent liquid leakage from the mounting hole of the elastic electrode. The electrode sealing gasket 17 is made of a material that meets electrical insulation standards. The electrode sealing gasket 17 has insulation properties, which can shield the potential between the elastic electrode 15 and the encapsulation shell 11, and at the same time has a certain sealing effect.

[0100] In this embodiment of the invention, the mutually adaptable snap-fit ​​structure 14 on the encapsulation shell 11 and the end cap 13 is used to realize the detachable fixed connection between the end cap 13 and the encapsulation shell 11, which is beneficial to the maintenance of its internal components.

[0101] Figure 4 A schematic structural diagram of an electronic atomizing device according to an embodiment of the present invention is shown;

[0102] Figure 5 A schematic diagram of an electronic atomizing device according to an embodiment of the present invention is shown.

[0103] Now refer to Figure 4 In conjunction with Figure 5, this embodiment of the invention provides an electronic atomizing device, the electronic atomizing device comprising:

[0104] Device housing 2; the device housing is provided with a spray nozzle 21, and the inner cavity of the device housing 2 is provided with an atomizing channel 3, which is connected to the spray nozzle 21 so that fine mist droplets can be output through the spray nozzle 21;

[0105] Atomizing structure 1; the atomizing structure 1 is disposed in the inner cavity of the device housing 2, and is used to heat and evaporate the liquid into fine mist droplets, and collect them in the mist droplet collection cavity of the atomizing structure 1; the atomizing outlet of the atomizing structure 1 is connected to the atomizing channel 3, so that the fine mist droplets collected in the mist droplet collection cavity can be output through the atomizing channel 3 and the spray nozzle 21;

[0106] Liquid storage tank 4; The liquid storage tank 4 is disposed in the inner cavity of the device housing 2 and is used to store liquid and to deliver liquid to the tubular glass substrate of the atomizing structure 1.

[0107] Power supply 5; the power supply 5 is electrically connected to the elastic electrode of the atomizing structure 1 through electrode leads, and is used to supply power to the atomizing structure 1.

[0108] In this embodiment of the invention, the inner wall of the liquid storage tank 4 is made of an inert material to prevent the liquid from deteriorating.

[0109] In this embodiment of the invention, the power source 5 may specifically be a rechargeable battery to improve the portability of the electronic atomization device.

[0110] It should be understood that the atomization structure in the embodiment of the electronic atomization device of the present invention is the atomization structure in the aforementioned embodiment of the atomization structure of the present invention. For the sake of convenience and brevity, the description of the atomization structure in the embodiment of the electronic atomization device of the present invention can be referred to the relevant descriptions in the embodiment of the atomization structure of the present invention and the embodiment of the atomization core of the present invention, and will not be repeated here.

[0111] When the electronic atomizing device is in use, the liquid is stored in the liquid storage tank 4. The liquid is introduced from the liquid storage tank 4 into the cavity of the tubular glass substrate of the atomizing structure 1. After the power supply 5 supplies power to the atomizing structure 1, the atomizing structure 1 heats and evaporates the liquid into fine mist droplets, which are then collected in the mist droplet collection cavity of the atomizing structure 1. When the air pressure in the mist droplet collection cavity is higher than the external air pressure, the fine mist droplets are sequentially output to the outside of the electronic atomizing device through the atomizing outlet, atomizing channel 3, and spray nozzle 21.

[0112] Since the atomizing structure in the embodiment of the electronic atomizing device of the present invention is the same as that in the aforementioned embodiment of the atomizing structure of the present invention, and correspondingly, the atomizing core used in the atomizing structure is the same as that in the aforementioned embodiment of the atomizing core of the present invention, the electronic atomizing device in the embodiment of the present invention effectively improves the liquid storage capacity and atomizing efficiency of the atomizing core compared with the existing electronic atomizing devices. Thus, without increasing the heating power, it can achieve rapid, efficient, and stable heating and evaporation of liquid to form fine droplets.

Claims

1. An atomizing core, used in electronic atomizing devices; characterized in that, The atomizing core includes: A tubular glass substrate (100); a through-hole array (1001) is formed on the tubular glass substrate (100) by laser-induced etching process, and the tubular cavity of the tubular glass substrate (100) and the multiple through-hole cavities of the through-hole array (1001) form a liquid channel. Resistance heating film layer (101); the resistance heating film layer (101) is attached to the outer periphery of the tubular glass substrate (100); the resistance heating film layer (101) is a metal film layer attached by physical vapor deposition process, and a film electrode region (1011) is provided on the resistance heating film layer (101). The tubular glass substrate bonding surface of the resistance heating film layer (101) is the tube heating surface, which is used to preheat the liquid in the tube cavity of the tubular glass substrate (100) and the liquid in the through hole cavity of the through hole array (1001); the liquid contact surface of the resistance heating film layer (101) is the liquid heating surface, which is used to evaporate and heat the preheated liquid flowing out of the through hole array (1001) to form fine mist droplets.

2. The atomizing core according to claim 1, characterized in that, The through-hole array (1001) has a through-hole spacing of 10-30 micrometers and a through-hole diameter of 10-50 micrometers. The cross-sectional area of ​​the tubular glass substrate (100) is greater than the sum of the cross-sectional areas of the multiple through-hole cavities of the through-hole array (1001).

3. The atomizing core according to claim 1 or 2, characterized in that, The cross-sectional shape of the tubular glass substrate (100) is one of a circle, a square, or a rectangle.

4. The atomizing core according to claim 1 or 2, characterized in that, The tubular glass substrate (100) is made of RoHS compliant glass.

5. The atomizing core according to claim 4, characterized in that, Glass that complies with RoHS standards is one of the following: high silica glass, borosilicate glass, quartz glass, aluminosilicate glass, or soda-lime glass.

6. An atomizing structure, used in electronic atomizing devices; characterized in that, The atomization structure includes: Encapsulation shell (11); the lower end of the encapsulation shell (11) is a closed structure and the upper end is an open structure; the lower end of the encapsulation shell (11) is provided with an elastic electrode mounting hole; The atomizing core (10) according to any one of claims 1-5; the atomizing core (10) is used to heat and evaporate liquid into fine mist droplets; the atomizing core (10) is disposed inside the encapsulation shell (11), and a mist collection cavity (12) is formed between the atomizing core (10) and the encapsulation shell (11). Elastic electrode (15); the elastic electrode (15) is disposed on the lower end shell of the encapsulation shell (11) through the elastic electrode mounting hole; the elastic electrode (15) is in corresponding contact with the film electrode area of ​​the resistance heating film layer of the atomizing core (10); the elastic electrode (15) is used to introduce the power supply current to the resistance heating film layer; End cap (13); the end cap (13) covers the opening structure of the encapsulation shell (11) and seals the encapsulation shell (11); the end cap (13) has a liquid guiding hole (131) that communicates with the cavity of the tubular glass substrate of the atomizing core (10); the liquid guiding hole (131) is used to guide liquid into the cavity of the tubular glass substrate; the end cap (13) on the outer periphery of the liquid guiding hole (131) has an atomization outlet (132) that communicates with the droplet collection cavity (12), and the fine droplets collected in the droplet collection cavity (12) can be output from the atomization outlet (132).

7. The atomizing structure according to claim 6, characterized in that, The atomization structure also includes: End cap sealing ring (16); the end cap sealing ring (16) is an annular structure; the end cap sealing ring (16) is sleeved on the upper end of the packaging shell (11) and is in sealing contact with the end cap (13); Electrode sealing gasket (17); the electrode sealing gasket (17) is disposed in the lower part of the inner cavity of the encapsulation shell (11), and the elastic electrode (15) is sleeved on the electrode sealing gasket (17); Both the encapsulation shell (11) and the end cap (13) are provided with matching snap-fit ​​structures (14); the end cap (13) is detachably and fixedly connected to the upper end of the encapsulation shell (11) through the snap-fit ​​structure (14).

8. An electronic atomizing device, characterized in that, The electronic atomizing device includes: Device housing (2); The device housing (2) is provided with a spray port (21), and the inner cavity of the device housing (2) is provided with an atomizing channel (3), which is connected to the spray port (21) so that fine mist droplets can be output through the spray port (21); The atomizing structure (1) as described in claim 6 or 7; the atomizing structure (1) is disposed in the inner cavity of the device housing (2) for heating and evaporating liquid into fine mist droplets, and collecting them in the mist droplet collection cavity of the atomizing structure (1); the atomizing outlet of the atomizing structure (1) is connected to the atomizing channel (3) so that the fine mist droplets collected in the mist droplet collection cavity can be output through the atomizing channel (3) and the spray nozzle (21); Liquid storage chamber (4); The liquid storage chamber (4) is disposed in the inner cavity of the device housing (2) for storing liquid and for conveying liquid to the cavity of the tubular glass substrate of the atomizing structure (1); Power supply (5); the power supply (5) is electrically connected to the elastic electrode of the atomizing structure (1) through electrode leads, and is used to supply power to the atomizing structure (1).

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