A circuit board positioning tooling detection system based on artificial intelligence

Abstract

The present invention discloses a circuit board positioning tool detection system based on artificial intelligence, which specifically relates to the field of artificial intelligence, including a positioning tool detection device preparation module, a circuit board fixed detection area division module, a circuit board appearance data acquisition module, a circuit board appearance data analysis module, a circuit board component data acquisition module, a circuit board component data analysis module, a circuit board solder point data acquisition module, a circuit board solder point data analysis module, a comprehensive data analysis module, and a human-computer interaction module. The present invention divides the circuit board to be tested into equal areas through the detection area division module, collects data on the circuit board appearance, components and solder points that affect the quality of the circuit board through the data acquisition module, processes and analyzes the collected data through the data analysis module, and establishes a circuit board quality evaluation index through the comprehensive data analysis module, compares the circuit board quality index standard value constructed by the human-computer interaction module with the quality evaluation index, judges the quality of the circuit board, and generates a quality inspection report.

Description

Technical Field

[0001] The present invention relates to the field of artificial intelligence technology, and more specifically, to an artificial intelligence-based circuit board positioning tooling detection system. Background Art

[0002] Circuit board, also known as PCB board, is a fixed design board that connects electronic components, connectors and conductive lines. With the continuous development and upgrading of circuit board technology, the detection of circuit boards is becoming more and more important. The significance of circuit board detection system is to ensure the quality of circuit boards, improve production efficiency, reduce production costs, and enhance the market competitiveness of products. With the continuous improvement of technology and the continuous expansion of application fields, the application prospects of circuit board detection system will be broader.

[0003] The traditional circuit board positioning tooling inspection system combines mechanical, electronic, optical and computer technologies, and uses high-precision fixtures and advanced inspection equipment to accurately position and comprehensively inspect the circuit board. The traditional circuit board positioning tooling system includes a positioning module, a data acquisition module, and a data processing and analysis module. The positioning module can accurately locate the circuit position to be inspected, the data acquisition module is used to collect the components, solder joints and circuit data of the circuit board, and the data processing and analysis module can process and analyze the collected data; the use of high-precision positioning technology, image acquisition technology, and image processing and analysis technology can realize automated inspection, reduce manual intervention, and improve production efficiency. Through precise inspection and positioning, problems and defects on the circuit board can be discovered in time, ensuring that product quality meets quality standards, reducing rework and scrap caused by quality problems, and reducing production costs. Automated inspection reduces time costs and labor costs.

[0004] However, in actual use, it still has some shortcomings, such as inaccurate data type division. The factors affecting the circuit board include different types. The traditional circuit board positioning tooling detection system only collects and analyzes the data in a unified manner, and does not accurately divide the shape, components and solder joints of the circuit board; the data collection is not comprehensive enough. The traditional circuit board positioning tooling detection system only uses automatic detection technology to detect problems and defects on the circuit board, and does not detect and analyze specific problems on the circuit board. The data collection is not comprehensive enough; the defect reflection is not intuitive enough. The traditional circuit board positioning tooling detection system cannot intuitively reflect whether the circuit board meets the production standards, and has not established a comprehensive indicator to determine whether the bottle cap has defects. Relatively speaking, it cannot intuitively judge the quality of the circuit board. Summary of the invention

[0005] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a circuit board positioning tooling detection system based on artificial intelligence, which solves the problems raised in the above-mentioned background technology through the following scheme.

[0006] To achieve the above purpose, the present invention provides the following technical solution: a circuit board positioning tool detection system based on artificial intelligence. It includes:

[0007] Positioning tooling inspection device preparation module: used to check whether the power supply is connected before starting the test, ensure that the voltage is stable and meets the equipment requirements, check whether the test needle is displaced or damaged, and ensure that the test needle can accurately contact and test each point on the circuit board;

[0008] Circuit board fixed detection area determination module: used to accurately fix the circuit board to be tested, determine the area to be tested, and divide the detection area of ​​the circuit board to be tested into sub-detection areas by equal area division, which are marked as 1, 2...n in sequence;

[0009] Circuit board appearance data acquisition module: used to collect the appearance parameters of the target circuit board and pass the collected data to the circuit board appearance data analysis module;

[0010] Circuit board appearance data analysis module: including a circuit board appearance data analysis unit, used to process and analyze the data collected by the circuit board appearance data collection module, and transmit the results to the comprehensive data analysis module;

[0011] Circuit board component data acquisition module: used to collect the damage degree data of the circuit board to be tested and the degree of component misalignment, and transmit the collected data to the circuit board component data analysis module;

[0012] Circuit board component data analysis module: including a circuit board component data analysis unit, used to process and analyze the data collected by the circuit board component data acquisition module, and pass the analysis results to the comprehensive data analysis module;

[0013] Circuit board solder joint data acquisition module: used to collect solder joint status data of the circuit board to be tested, the solder joint status data of the circuit board to be tested includes the number of false solder joints, the number of cold solder joints, the number of short-circuit solder joints, and the number of solder ball defects, which are marked as S1, S2, S3, and S4 respectively, and the collected data is transmitted to the circuit board solder joint data analysis module;

[0014] Circuit board solder point data analysis module: including a circuit board solder point data analysis unit, used to process and analyze the data collected by the circuit board solder point data acquisition module, and transmit the analysis results to the comprehensive data analysis module;

[0015] Comprehensive data analysis module: including a comprehensive data analysis unit, used to process and analyze the appearance evaluation index, component evaluation index and solder point evaluation index obtained by the circuit board appearance data analysis module, the circuit board component data analysis module and the circuit board solder point data analysis module, and transmit the analysis results to the human-computer interaction module;

[0016] Human-computer interaction module: used to establish the standard value of the circuit board quality assessment index, and compare the standard value of the circuit board quality assessment index with the circuit board quality assessment index obtained by the comprehensive data analysis module, to determine whether the circuit board to be tested meets the production standards, and to generate a circuit board quality inspection report to be delivered to relevant staff.

[0017] Preferably, the appearance parameters of the target circuit board include size and shape deviation, blurred or missing silk screen, copper foil peel strength, number of scratches and cracks, number of pinholes, number of circuit breaks, marked as A1, A2, A3, A4, A5, and A6, respectively, wherein the size and shape deviation includes edge unevenness and board surface warping, marked as A e and A c , Blurred or missing silk screen includes blurred silk screen, missing silk screen, and misplaced silk screen, marked as A o , A l and A m .

[0018] Preferably, the circuit board appearance data analysis unit is used to establish a circuit board appearance data analysis model, import the appearance data collected by the circuit board appearance data collection module into the circuit board appearance data analysis model, and calculate the appearance evaluation index, which is specifically expressed as:

[0019] in Represents the appearance evaluation index of the circuit board to be tested, where A1 represents the average deviation of the size and shape of the circuit board to be tested, A ei A represents the edge roughness of the circuit board in the i-th sub-detection area. ci represents the board surface warpage of the circuit board in the i-th sub-detection area, where A2 represents the average degree of blur or missing silk screen on the circuit board under test. oi A represents the silk screen fuzziness of the circuit board in the i-th detection area. li A represents the silk screen missing degree of the circuit board in the i-th detection area. mi A represents the screen printing misalignment of the circuit board in the i-th detection area. 3i A represents the copper peeling degree of the circuit board in the i-th detection area. 4i A represents the number of scratches and cracks on the circuit board in the i-th detection area. 5iA represents the number of pinholes in the circuit board in the i-th detection area. 6i represents the number of circuit breaks in the circuit board in the i-th inspection area, δ1, δ2, δ3, δ4, δ5, and δ6 respectively represent the influence coefficients of size and shape deviation, blurred or missing silk screen, copper foil peeling strength, number of scratches and cracks, number of pinholes, and number of circuit breaks on the appearance evaluation value of the circuit board to be tested.

[0020] Preferably, the circuit board damage degree data includes electrostatic damage degree, overheating damage degree, and mechanical stress damage degree, which are marked as D1, D2, and D3 respectively. The overheating damage degree includes resistor damage and capacitor damage, which are marked as R and C respectively. The mechanical stress damage degree includes the number of bent component pins and the number of broken pins, which are marked as P1 and P2 respectively. The component misalignment degree is marked as M.

[0021] Preferably, the circuit board component data analysis unit is used to establish a circuit board component data analysis model, import the circuit board damage degree data and component misalignment degree collected by the circuit board component data collection module into the circuit board component data analysis model, and calculate the component evaluation index, which is specifically expressed as: Indicates the component evaluation index of the circuit board under test, D 1i Indicates the degree of electrostatic damage to the circuit board in the i-th detection area, D2 indicates the degree of overheating damage of the circuit board under test, R i represents the resistance value of the circuit board in the i-th detection area, C i represents the capacitance value of the circuit board in the i-th detection area, D3 represents the degree of mechanical stress damage of the circuit board under test, P 1i represents the number of bent pins of components on the circuit board in the i-th detection area, P 2i represents the number of broken pins of components on the circuit board in the i-th detection area, σ1, σ2, and σ3 represent the influence coefficients of electrostatic damage, overheating damage, and mechanical stress damage on the component evaluation index, respectively, M i It represents the degree of component misalignment of the circuit board in the i-th detection area, and σ4 represents the influence coefficient of the degree of component misalignment on the component evaluation index.

[0022] Preferably, the circuit board solder point data analysis unit is used to establish a circuit board solder point data analysis model, import the solder point condition data of the circuit board to be tested collected by the circuit board solder point data collection unit into the circuit board solder point data analysis model, and calculate the circuit board solder point evaluation index, which is specifically expressed as: , Indicates the solder joint evaluation index of the circuit board to be tested, S 1irepresents the number of cold solder joints on the circuit board in the i-th detection area, S 2i represents the number of cold solder joints on the circuit board in the i-th detection area, S 3i represents the number of short-circuit solder joints on the circuit board in the i-th detection area, S 4i represents the number of solder ball defects of the circuit board in the i-th inspection area, μ1, μ2, μ3, and μ4 respectively represent the number of false solder joints, the number of cold solder joints, the number of short-circuited solder joints, and the influence coefficient of the number of solder ball defects on the circuit board solder joint evaluation index.

[0023] Preferably, the comprehensive data analysis unit is used to establish a comprehensive data analysis model, import the appearance evaluation index, the component evaluation index and the solder joint evaluation index into the comprehensive data analysis model, and calculate the circuit board quality evaluation index, which is specifically expressed as: η represents the quality evaluation index of the circuit board to be tested, Indicates the appearance evaluation index of the circuit board to be tested. Indicates the standard value of the quality assessment index of the circuit board to be tested. Indicates the component evaluation index of the circuit board under test, Indicates the standard value of the component evaluation index of the circuit board to be tested. Indicates the solder joint evaluation index of the circuit board to be tested. represents the standard value of the solder joint evaluation index of the circuit board to be tested, ζ1, ζ2, and ζ3 represent the influence coefficients of the appearance evaluation index, component evaluation index and solder joint evaluation index on the circuit board quality evaluation index.

[0024] Preferably, the circuit board quality assessment index standard value is denoted as η * , when η≤η * When η≥η, it means that the quality evaluation index of the circuit board is less than the standard value of the circuit board quality evaluation index, indicating that the circuit board to be tested meets the production standard, and the next circuit board will continue to be tested; when η≥η * When , it means that the quality assessment index of the circuit board is greater than the standard value of the circuit board quality assessment index, indicating that the circuit board to be tested does not meet the production standards, a warning message is sent to the relevant staff, and a circuit board quality inspection report is generated.

[0025] Technical effects and advantages of the present invention:

[0026] 1. The present invention classifies and collects factors that affect the quality of circuit boards through a circuit board appearance data collection module, a circuit board component data collection module, and a circuit board solder joint data collection module, thereby ensuring the accuracy and integrity of the data. Different types of data have different collection methods and standards. Classifying and collecting data can improve the accuracy and pertinence of the analysis results, and can more intuitively see the impact of the circuit board appearance, components and solder joints on the quality of the circuit board;

[0027] 2. The present invention accurately collects and analyzes the factors affecting the quality of the circuit board through the collection module and the analysis module. The comprehensive collection of data provides strong data support for the subsequent analysis and evaluation of the quality of the circuit board, and provides a comprehensive, accurate and in-depth information foundation;

[0028] 3. The present invention processes and analyzes the collected data through a comprehensive data analysis module and a human-computer interaction module, comprehensively evaluates the quality of the circuit board by establishing a circuit board quality evaluation index, and determines whether the circuit board meets the production standard by comparing it with the standard value of the circuit board quality evaluation index. The human-computer interaction module automatically generates a quality inspection report to more intuitively display the quality of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] As attached Figure 1 The circuit board positioning tooling detection system shown in the figure is based on artificial intelligence, including a positioning tooling detection device preparation module, a circuit board fixed detection area determination module, a circuit board appearance data acquisition module, a circuit board appearance data analysis module, a circuit board component data acquisition module, a circuit board component data analysis module, a circuit board solder point data acquisition module, a circuit board solder point data analysis module, a comprehensive data analysis module, and a human-computer interaction module.

[0032] The output end of the positioning tool detection device preparation module is telegraphed connected to the input end of the circuit board fixed detection area determination module, the output end of the circuit board fixed detection area determination module is telegraphed connected to the circuit board appearance data acquisition module, the circuit board component data acquisition module, and the input end of the circuit board component data acquisition module respectively, the output end of the circuit board appearance data acquisition module is telegraphed connected to the input end of the circuit board appearance data analysis module, the output end of the circuit board component data acquisition module is telegraphed connected to the input end of the circuit board component data analysis module, the output end of the circuit board solder point data acquisition module is telegraphed connected to the input end of the circuit board solder point data analysis module, the output ends of the circuit board appearance data analysis module, the circuit board component data analysis module, and the circuit board solder point data analysis module are respectively telegraphed connected to the input end of the comprehensive data analysis module, and the output end of the comprehensive data analysis module is telegraphed connected to the input end of the human-computer interaction module.

[0033] The positioning tool detection device preparation module is used to check whether the power supply is connected before starting the test, ensure that the voltage is stable and meets the equipment requirements, check whether the test needle is displaced or damaged, and ensure that the test needle can accurately contact and test each point on the circuit board.

[0034] What needs to be specifically explained in this embodiment is that before testing whether the circuit board meets the quality standards, the circuit board positioning tooling detection system should first be subjected to a performance check to check whether it is in normal working condition and whether the calibration is accurate, so as to effectively avoid errors caused by the circuit board positioning tooling detection system, avoid equipment failure during the measurement process, and affect the work progress and measurement results, which can effectively improve work efficiency and reduce economic losses caused by equipment failure.

[0035] The circuit board fixed detection area determination module is used to accurately fix the circuit board to be tested, determine the detection area to be tested, and divide the detection area of ​​the circuit board to be tested into sub-detection areas by equal area division, which are marked as 1, 2...n in sequence.

[0036] What needs to be specifically explained in this embodiment is that the division of the area to be tested can comprehensively cover all parts and key elements of the circuit board. The detection area is divided by automated detection equipment. For example, the circuit board to be tested can be divided into 16 sub-detection areas according to one sixteenth of the total area of ​​the circuit board. By reasonably dividing the detection area, it can be ensured that the quality and performance of the circuit board can be comprehensively and accurately evaluated during the detection process.

[0037] The circuit board appearance data acquisition module is used to acquire appearance parameters of the target circuit board and transmit the acquired data to the circuit board appearance data analysis module.

[0038] The appearance parameters of the target circuit board include size and shape deviation, blurred or missing silk screen, copper foil peel strength, number of scratches and cracks, number of pinholes, number of circuit breaks, marked as A1, A2, A3, A4, A5, and A6, respectively, where size and shape deviation includes edge unevenness and board surface warping, marked as A e and A c , Blurred or missing silk screen includes blurred silk screen, missing silk screen, and misplaced silk screen, marked as A o , A l and A m .

[0039] What needs to be specifically explained in this embodiment is that an automatic optical inspection system (AOI) is used to automatically scan the surface of the PCB, capture images, and analyze the edge information and warping information in the image through an algorithm to determine the edge unevenness and board surface warping of the circuit board. This method has high precision, high speed, and can be operated automatically; an automatic optical inspection machine (AOI) is used to use a high-resolution camera and image processing technology to perform a comprehensive, fast, and accurate scan of the PCB, which can identify tiny silk screen defects, and automatically judge and classify them through software algorithms to detect the blurred or missing silk screen of the circuit board to be tested; a push test method is used to measure the copper foil peel strength of the circuit board to be tested; an automatic optical inspection machine (AOI) is used to detect the number of scratches, cracks, pinholes, and line breaks on the circuit board to be tested.

[0040] The circuit board appearance data analysis module includes a circuit board appearance data analysis unit, which is used to process and analyze the data collected by the circuit board appearance data collection module and transmit the results to the comprehensive data analysis module.

[0041] The circuit board appearance data analysis unit is used to establish a circuit board appearance data analysis model, import the appearance data collected by the circuit board appearance data collection module into the circuit board appearance data analysis model, and calculate the appearance evaluation index, which is specifically expressed as:

[0042] in Represents the appearance evaluation index of the circuit board to be tested, where A1 represents the average deviation of the size and shape of the circuit board to be tested, A ei A represents the edge roughness of the circuit board in the i-th sub-detection area. ci represents the board surface warpage of the circuit board in the i-th sub-detection area, where A2 represents the average degree of blur or missing silk screen on the circuit board under test. oi A represents the silk screen fuzziness of the circuit board in the i-th detection area. li A represents the silk screen missing degree of the circuit board in the i-th detection area.mi A represents the screen printing misalignment of the circuit board in the i-th detection area. 3i A represents the copper peeling degree of the circuit board in the i-th detection area. 4i A represents the number of scratches and cracks on the circuit board in the i-th detection area. 5i A represents the number of pinholes in the circuit board in the i-th detection area. 6i represents the number of circuit breaks in the circuit board in the i-th inspection area, δ1, δ2, δ3, δ4, δ5, and δ6 respectively represent the influence coefficients of size and shape deviation, blurred or missing silk screen, copper foil peeling strength, number of scratches and cracks, number of pinholes, and number of circuit breaks on the appearance evaluation value of the circuit board to be tested.

[0043] The circuit board component data acquisition module is used to collect data on the damage degree of the circuit board to be tested and the degree of component misalignment, and transmit the collected data to the circuit board component data analysis module.

[0044] The circuit board damage degree data includes the electrostatic damage degree, overheating damage degree, and mechanical stress damage degree, which are marked as D1, D2, and D3 respectively. The overheating damage degree includes resistor damage and capacitor damage, which are marked as R and C respectively. The mechanical stress damage degree includes the number of bent component pins and the number of broken pins, which are marked as P1 and P2 respectively. The component misalignment degree is marked as M.

[0045] What needs to be specifically explained in this embodiment is that an electrostatic detector and an electrostatic voltmeter are used to detect the degree of electrostatic damage of the circuit to be tested, which can quickly and accurately detect the voltage condition on the circuit board; a power-on test is used to detect whether the circuit board to be tested has overheating damage, observe the working state of the circuit board after power-on, and detect whether the values ​​of resistance and capacitance have changed and the performance has declined; an automated detection device is used to detect the number of bent pins and broken pins on the circuit board; an automatic optical inspection device (AOI) is used to detect whether the position, shape, and arrangement of components meet the production standards through image recognition technology, and the degree of misalignment of the circuit board to be tested is detected.

[0046] The circuit board component data analysis module includes a circuit board component data analysis unit, which is used to process and analyze the data collected by the circuit board component data collection module and transmit the analysis result to the comprehensive data analysis module.

[0047] The circuit board component data analysis unit is used to establish a circuit board component data analysis model, import the circuit board damage degree data and component misalignment degree collected by the circuit board component data collection module into the circuit board component data analysis model, and calculate the component evaluation index, which is specifically expressed as: Indicates the component evaluation index of the circuit board under test, D1i Indicates the degree of electrostatic damage to the circuit board in the i-th detection area, D2 indicates the degree of overheating damage of the circuit board under test, R i represents the resistance value of the circuit board in the i-th detection area, C i represents the capacitance value of the circuit board in the i-th detection area, D3 represents the degree of mechanical stress damage of the circuit board under test, P 1i represents the number of bent pins of components on the circuit board in the i-th detection area, P 2i represents the number of broken pins of components on the circuit board in the i-th detection area, σ1, σ2, and σ3 represent the influence coefficients of electrostatic damage, overheating damage, and mechanical stress damage on the component evaluation index, respectively, M i It represents the degree of component misalignment of the circuit board in the i-th detection area, and σ4 represents the influence coefficient of the degree of component misalignment on the component evaluation index.

[0048] The circuit board solder point data acquisition module is used to collect the solder point status data of the circuit board to be tested. The solder point status data of the circuit board to be tested includes the number of false solder joints, the number of cold solder joints, the number of short-circuit solder joints, and the number of solder ball defects, which are marked as S1, S2, S3, and S4 respectively, and the collected data is transmitted to the circuit board solder point data analysis module.

[0049] What needs to be specifically explained in this embodiment is that the X-ray detection method is used to detect the solder joint status data of the circuit board to be tested. By irradiating the circuit board with X-rays, the surface of the solder joint can be penetrated to check the connection status inside the solder joint. X-ray detection is particularly suitable for checking the welding quality of BGA (ball grid array) and tiny packaged components. It can detect problems such as false solder joints, cold solder joints, short circuits, etc. inside the solder joints.

[0050] The circuit board solder point data analysis module includes a circuit board solder point data analysis unit, which is used to process and analyze the data collected by the circuit board solder point data collection module and transmit the analysis results to the comprehensive data analysis module.

[0051] The circuit board solder point data analysis unit is used to establish a circuit board solder point data analysis model, import the solder point condition data of the circuit board to be tested collected by the circuit board solder point data collection unit into the circuit board solder point data analysis model, and calculate the circuit board solder point evaluation index, which is specifically expressed as: , Indicates the solder joint evaluation index of the circuit board to be tested, S 1i represents the number of cold solder joints on the circuit board in the i-th detection area, S 2i represents the number of cold solder joints on the circuit board in the i-th detection area, S 3i represents the number of short-circuit solder joints on the circuit board in the i-th detection area, S4i represents the number of solder ball defects of the circuit board in the i-th inspection area, μ1, μ2, μ3, and μ4 respectively represent the number of false solder joints, the number of cold solder joints, the number of short-circuited solder joints, and the influence coefficient of the number of solder ball defects on the circuit board solder joint evaluation index.

[0052] The comprehensive data analysis module includes a comprehensive data analysis unit, which is used to process and analyze the appearance evaluation index, component evaluation index and solder point evaluation index obtained by the circuit board appearance data analysis module, the circuit board component data analysis module, and the circuit board solder point data analysis module, and transmit the analysis results to the human-computer interaction module.

[0053] The comprehensive data analysis unit is used to establish a comprehensive data analysis model, import the appearance evaluation index, the component evaluation index and the solder joint evaluation index into the comprehensive data analysis model, and calculate the circuit board quality evaluation index, which is specifically expressed as: η represents the quality evaluation index of the circuit board to be tested, Indicates the appearance evaluation index of the circuit board to be tested. Indicates the standard value of the quality assessment index of the circuit board to be tested. Indicates the component evaluation index of the circuit board under test, Indicates the standard value of the component evaluation index of the circuit board to be tested. Indicates the solder joint evaluation index of the circuit board to be tested. represents the standard value of the solder joint evaluation index of the circuit board to be tested, ζ1, ζ2, and ζ3 represent the influence coefficients of the appearance evaluation index, component evaluation index and solder joint evaluation index on the circuit board quality evaluation index.

[0054] What needs to be specifically explained in this embodiment is to establish a comprehensive data analysis model for the circuit board to be tested. By comprehensively processing and analyzing the parameters after processing and analysis of the collected appearance data of the circuit board to be tested, the damage degree data of the circuit board to be tested, the component misalignment data, and the solder joint status data, a relationship between the circuit board quality index and each parameter is established, which is convenient for intuitively determining whether the circuit board to be tested meets the production standards, and providing effective data support for the generation of the human-computer interaction module quality inspection report.

[0055] The human-computer interaction module is used to establish a standard value of the circuit board quality assessment index, and compare the standard value of the circuit board quality assessment index with the circuit board quality assessment index obtained by the comprehensive data analysis module, determine whether the circuit board to be tested meets the production standards, and generate a circuit board quality inspection report to be delivered to relevant staff.

[0056] The standard value of the circuit board quality evaluation index is denoted as η * , when η≤η *When η≥η, it means that the quality evaluation index of the circuit board is less than the standard value of the circuit board quality evaluation index, indicating that the circuit board to be tested meets the production standard, and the next circuit board will continue to be tested; when η≥η * When the circuit board quality assessment index is greater than the standard value of the circuit board quality assessment index, it means that the circuit board to be tested does not meet the production standards, and an early warning message is sent to the relevant staff, and a circuit board quality inspection report is generated.

[0057] What needs to be specifically explained in this embodiment is that Jmeter is used to generate a test report, and the appearance parameters of the target circuit board, the damage degree data of the circuit board to be tested, the component misalignment data, and the solder joint condition data of the circuit board to be tested collected by the above module are imported into a tool for generating a test report, and the appearance evaluation index, component evaluation index, solder joint evaluation index, and circuit board quality evaluation index obtained by the above data analysis module are imported into a tool for generating a test report, and the tool will automatically generate a test report.

[0058] Secondly: In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

[0059] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board positioning tooling detection system based on artificial intelligence, characterized in that: include: Positioning tooling inspection device preparation module: used to check whether the power supply is connected before starting the test, ensure that the voltage is stable and meets the equipment requirements, check whether the test needle is displaced or damaged, and ensure that the test needle can accurately contact and test each point on the circuit board; Circuit board fixed detection area determination module: used to accurately fix the circuit board to be tested, determine the area to be tested, and divide the detection area of ​​the circuit board to be tested into sub-detection areas by equal area division, which are marked as 1, 2...n in sequence; Circuit board appearance data acquisition module: used to collect the appearance parameters of the target circuit board and pass the collected data to the circuit board appearance data analysis module; The appearance parameters of the target circuit board include size and shape deviation, blurred or missing silk screen, copper foil peel strength, number of scratches and cracks, number of pinholes, number of circuit breaks, marked as A1, A2, A3, A4, A5, and A6, respectively, where size and shape deviation includes edge unevenness and board surface warping, marked as A e and A c , Blurred or missing silk screen includes blurred silk screen, missing silk screen, and misplaced silk screen, marked as A o , A l and A m ; Circuit board appearance data analysis module: including a circuit board appearance data analysis unit, used to process and analyze the data collected by the circuit board appearance data collection module, and transmit the results to the comprehensive data analysis module; The circuit board appearance data analysis unit is used to establish a circuit board appearance data analysis model, import the appearance data collected by the circuit board appearance data collection module into the circuit board appearance data analysis model, and calculate the appearance evaluation index, which is specifically expressed as: in Represents the appearance evaluation index of the circuit board to be tested, where A1 represents the average deviation of the size and shape of the circuit board to be tested, A ei A represents the edge roughness of the circuit board in the i-th sub-detection area. ci represents the board surface warpage of the circuit board in the i-th sub-detection area, where A2 represents the average degree of blur or missing silk screen on the circuit board under test. oi A represents the silk screen fuzziness of the circuit board in the i-th detection area. li A represents the silk screen missing degree of the circuit board in the i-th detection area. mi A represents the screen printing misalignment of the circuit board in the i-th detection area. 3i A represents the copper peeling degree of the circuit board in the i-th detection area. 4i A represents the number of scratches and cracks on the circuit board in the i-th detection area. 5i A represents the number of pinholes in the circuit board in the i-th detection area. 6i represents the number of circuit breakages of the circuit board in the i-th inspection area, δ1, δ2, δ3, δ4, δ5, and δ6 represent the influence coefficients of size and shape deviation, blurred or missing silk screen, copper foil peeling strength, number of scratches and cracks, number of pinholes, and number of circuit breakages on the appearance evaluation value of the circuit board to be tested, respectively; Circuit board component data acquisition module: used to collect the damage degree data of the circuit board to be tested and the degree of component misalignment, and transmit the collected data to the circuit board component data analysis module; Circuit board component data analysis module: including a circuit board component data analysis unit, used to process and analyze the data collected by the circuit board component data acquisition module, and pass the analysis results to the comprehensive data analysis module; Circuit board solder joint data acquisition module: used to collect solder joint status data of the circuit board to be tested, the solder joint status data of the circuit board to be tested includes the number of false solder joints, the number of cold solder joints, the number of short-circuit solder joints, and the number of solder ball defects, which are marked as S1, S2, S3, and S4 respectively, and the collected data is transmitted to the circuit board solder joint data analysis module; Circuit board solder point data analysis module: including a circuit board solder point data analysis unit, used to process and analyze the data collected by the circuit board solder point data acquisition module, and transmit the analysis results to the comprehensive data analysis module; Comprehensive data analysis module: including a comprehensive data analysis unit, used to process and analyze the appearance evaluation index, component evaluation index and solder point evaluation index obtained by the circuit board appearance data analysis module, the circuit board component data analysis module and the circuit board solder point data analysis module, and transmit the analysis results to the human-computer interaction module; Human-computer interaction module: used to establish the standard value of the circuit board quality assessment index, and compare the standard value of the circuit board quality assessment index with the circuit board quality assessment index obtained by the comprehensive data analysis module, to determine whether the circuit board to be tested meets the production standards, and to generate a circuit board quality inspection report to be delivered to relevant staff.

2. According to the artificial intelligence-based circuit board positioning tooling detection system of claim 1, it is characterized by: The circuit board damage degree data includes the electrostatic damage degree, overheating damage degree, and mechanical stress damage degree, which are marked as D1, D2, and D3 respectively. The overheating damage degree includes resistor damage and capacitor damage, which are marked as R and C respectively. The mechanical stress damage degree includes the number of bent component pins and the number of broken pins, which are marked as P1 and P2 respectively. The component misalignment degree is marked as M.

3. According to the artificial intelligence-based circuit board positioning tooling detection system of claim 1, it is characterized by: The circuit board component data analysis unit is used to establish a circuit board component data analysis model, import the circuit board damage degree data and component misalignment degree collected by the circuit board component data collection module into the circuit board component data analysis model, and calculate the component evaluation index, which is specifically expressed as: Indicates the component evaluation index of the circuit board under test, D 1i Indicates the degree of electrostatic damage to the circuit board in the i-th detection area, D2 indicates the degree of overheating damage of the circuit board under test, R i represents the resistance value of the circuit board in the i-th detection area, C i represents the capacitance value of the circuit board in the i-th detection area, D3 represents the degree of mechanical stress damage of the circuit board under test, P 1i represents the number of bent pins of components on the circuit board in the i-th detection area, P 2i represents the number of broken pins of components on the circuit board in the i-th detection area, σ1, σ2, and σ3 represent the influence coefficients of electrostatic damage, overheating damage, and mechanical stress damage on the component evaluation index, respectively, M i It represents the degree of component misalignment of the circuit board in the i-th detection area, and σ4 represents the influence coefficient of the degree of component misalignment on the component evaluation index.

4. According to the artificial intelligence-based circuit board positioning tooling detection system of claim 1, it is characterized by: The circuit board solder point data analysis unit is used to establish a circuit board solder point data analysis model, import the solder point condition data of the circuit board to be tested collected by the circuit board solder point data collection unit into the circuit board solder point data analysis model, and calculate the circuit board solder point evaluation index, which is specifically expressed as: Indicates the solder joint evaluation index of the circuit board to be tested, S 1i S represents the number of cold solder joints on the circuit board in the i-th detection area. 2i represents the number of cold solder joints on the circuit board in the i-th detection area, S 3i represents the number of short-circuit solder joints on the circuit board in the i-th detection area, S 4i represents the number of solder ball defects of the circuit board in the i-th inspection area, μ1, μ2, μ3, and μ4 respectively represent the number of false solder joints, the number of cold solder joints, the number of short-circuited solder joints, and the influence coefficient of the number of solder ball defects on the circuit board solder joint evaluation index.

5. The circuit board positioning tooling detection system based on artificial intelligence according to claim 1 is characterized in that: The comprehensive data analysis unit is used to establish a comprehensive data analysis model, import the appearance evaluation index, the component evaluation index and the solder joint evaluation index into the comprehensive data analysis model, and calculate the circuit board quality evaluation index, which is specifically expressed as: η represents the quality evaluation index of the circuit board to be tested, Indicates the appearance evaluation index of the circuit board to be tested. Indicates the standard value of the quality assessment index of the circuit board to be tested. Indicates the component evaluation index of the circuit board under test, Indicates the standard value of the component evaluation index of the circuit board to be tested. Indicates the solder joint evaluation index of the circuit board to be tested. represents the standard value of the solder joint evaluation index of the circuit board to be tested, ζ1, ζ2, and ζ3 represent the influence coefficients of the appearance evaluation index, component evaluation index and solder joint evaluation index on the circuit board quality evaluation index.

6. The circuit board positioning tooling detection system based on artificial intelligence according to claim 1 is characterized in that: The standard value of the circuit board quality evaluation index is denoted as η * , when η≤η * When η≥η, it means that the quality evaluation index of the circuit board is less than the standard value of the circuit board quality evaluation index, indicating that the circuit board to be tested meets the production standard, and the next circuit board will continue to be tested; when η≥η * When the circuit board quality assessment index is greater than the standard value of the circuit board quality assessment index, it means that the circuit board to be tested does not meet the production standards, and an early warning message is sent to the relevant staff, and a circuit board quality inspection report is generated.

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