Engraver and cutting method
By combining infrared sensors and low-reflective components, the engraving machine automatically adjusts the cutter position, solving the problem of low efficiency in manual control of traditional engraving machines and achieving efficient and accurate cutting operations.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN JINGWEI LINE TECH CO LTD
- Filing Date
- 2024-08-28
- Publication Date
- 2026-07-24
AI Technical Summary
Traditional engraving machines rely on manual control, resulting in low cutting efficiency and a high risk of errors, which may damage the equipment or materials.
It employs infrared sensors and low-reflectivity components to work together. It detects the presence and position of the target material through infrared signals, the processor calculates the tool position and automatically adjusts it, and the trajectory module precisely moves the tool to directly above the material for cutting.
It improves the efficiency and accuracy of cutting operations, avoids damage to equipment and materials, and ensures that cutting is completed within the material boundaries.
Smart Images
Figure CN118809314B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of automated equipment technology, specifically to an engraving machine and a cutting method. Background Technology
[0002] In traditional engraving machine technology, such as Figure 1 Traditional cutting machines, as shown, typically rely on manual control by the user for material cutting. The engraving machine 100 includes a processor 110, a power supply 120, a trajectory module 130 with a built-in rotating cutter 131, and a cutting pad 140. When using the engraving machine, the user needs to precisely move the tip of the rotating cutter 131 directly above the material to be cut by pressing control buttons or icons on the touchscreen before proceeding with the cutting operation. This method is not only inefficient but also prone to errors. If the user forgets to move the tip of the rotating cutter 131 above the material, it may directly cut the cutting pad 140, damaging it. If the tip is positioned too deep into the material, it may cut beyond the material edge, damaging the cutting pad or impacting the machine edge, affecting the equipment's lifespan and cutting quality.
[0003] To solve the above problems, a cutting machine that can automatically adjust the position of the cutting tool is needed. Summary of the Invention
[0004] This application provides an engraving machine and a cutting method that can automatically adjust the tool position, thereby improving the efficiency and accuracy of the cutting operation.
[0005] On one hand, embodiments of this application provide an engraving machine, including: A processor is used to control the operation of the engraving machine; A power supply for providing power to the engraving machine; A trajectory module, which has a built-in rotating cutter for performing cutting operations; The blade support strip is used to support the target material in order to cooperate with the rotating blade for cutting; Infrared sensors are used to emit infrared signals and receive reflected signals from target materials. A low-reflectivity component is disposed within the working area of the engraving machine to prevent the infrared signal from being reflected when there is no target material on the low-reflectivity component; The processor is configured to, when determining the presence of target material on the weak reflective component based on the reflected signal received from the infrared sensor, calculate the distance and position information between the rotating cutter and the target material based on the reflected signal, and issue control commands based on the distance and position information; The trajectory module is used to move the rotary cutter directly above the target material according to the control command and to perform a cutting operation.
[0006] On the other hand, this application provides a cutting method applied to an engraving machine. The engraving machine includes a processor, a power supply, a trajectory module, a blade support, an infrared sensor, and a low-reflectivity component. The processor controls the operation of the engraving machine; the power supply provides power to the engraving machine; the trajectory module has a built-in rotating blade for performing cutting operations; the blade support supports the target material to cooperate with the rotating blade for cutting; the infrared sensor emits infrared signals and receives reflected signals from the target material; the low-reflectivity component is disposed within the working area of the engraving machine to prevent reflection of the infrared signals when no target material is present on the low-reflectivity component; the method includes: when the processor determines that target material is present on the low-reflectivity component based on the reflected signal received from the infrared sensor, it calculates the distance and position information between the rotating blade and the target material based on the reflected signal; the processor issues a control command based on the distance and position information; the trajectory module moves the rotating blade directly above the target material according to the control command and performs the cutting operation.
[0007] This application provides an engraving machine and a cutting method. The engraving machine includes a processor, a power supply, a trajectory module, a blade support, an infrared sensor, and a low-reflectivity component. The processor controls the operation of the engraving machine; the power supply provides power to the engraving machine; the trajectory module has a built-in rotating blade for performing the cutting operation; the blade support supports the target material to cooperate with the rotating blade for cutting; the infrared sensor emits infrared signals and receives reflected signals from the target material; the low-reflectivity component is disposed within the working area of the engraving machine to prevent the reflection of infrared signals when there is no target material on the low-reflectivity component; wherein, the processor determines the presence of target material on the low-reflectivity component based on the reflected signals received from the infrared sensor, calculates the distance and position information between the rotating blade and the target material based on the reflected signals, and issues control commands based on the distance and position information; the trajectory module moves the rotating blade directly above the target material according to the control commands and performs the cutting operation. This application embodiment utilizes the collaborative work of an infrared sensor and a low-reflectivity component to detect the presence and position of a target material (such as paper) within the working area of the engraving machine in real time. Based on the received reflection signal, the processor accurately calculates the distance and position information between the rotating cutter and the target material, and automatically adjusts the trajectory module accordingly to precisely move the rotating cutter directly above the target material, thereby achieving automatic cutter position adjustment and improving the efficiency and accuracy of the cutting operation. Attached Figure Description
[0008] Figure 1 This is a schematic diagram of the structure of a conventional cutting machine provided in an embodiment of this application.
[0009] Figure 2 This is a schematic diagram of the engraving machine provided in an embodiment of this application.
[0010] Figure 3 This is a flowchart illustrating the cutting method provided in an embodiment of this application. Detailed Implementation
[0011] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0012] The following sections provide detailed descriptions of each example. It should be noted that the order in which the embodiments are described is not intended to limit the priority of the embodiments.
[0013] This application provides an engraving machine. Please refer to [link / reference]. Figure 2 , Figure 2 This is a schematic diagram of the structure of an engraving machine provided in an embodiment of this application. The engraving machine 200 may include: The processor 210 controls the operation of the engraving machine 200. As the core control unit of the engraving machine 200, the processor 210 is responsible for receiving and processing the reflected signals from the infrared sensor 250. Based on the processing results, the processor 210 can determine whether the target material 270 is present on the low-reflectivity component 260, and further calculate the precise distance and position information between the rotating cutter 231 and the target material 270. Based on this information, the processor 210 issues control commands to adjust the positions of the trajectory module 230 and the rotating cutter 231.
[0014] Power supply 220 provides power to the engraving machine 200. Power supply 220 (VDD) provides stable and reliable power support to the engraving machine 200, ensuring that all components can function properly.
[0015] The trajectory module 230 has a built-in rotary cutter 231 for performing cutting operations. The trajectory module 230 can precisely adjust the position of the rotary cutter 230 according to the control commands issued by the processor 210, ensuring that it maintains the optimal positional relationship with the target material 270 at all times during the cutting process.
[0016] The cutter support strip 240 is used to support the target material 270 for cutting in conjunction with the rotating cutter 231. The cutter support strip 240 ensures the stability and accuracy of the cutting operation. It is located below the rotating cutter 231 to withstand the reaction force during the cutting process and prevent material deformation or damage.
[0017] Infrared sensor 250 is used to emit infrared signals and receive reflected signals from target material 270.
[0018] The low reflectivity component 260 is disposed in the working area of the engraving machine 200 and is used to prevent the reflection of infrared signals when the target material 270 is not present on the low reflectivity component 260.
[0019] For example, the low-reflectivity component 260 is typically made of materials with low reflectivity or high absorption of infrared light, such as black rubber, special plastics, or metals coated with special coatings. These materials effectively reduce direct reflection of infrared light and may also absorb or scatter most of the incident infrared light. To further reduce reflectivity, the surface of the low-reflectivity component 260 may undergo special treatments, such as applying matte paint, etching microstructures, or using special light-absorbing materials. These treatments increase surface roughness, causing more scattering and absorption of infrared light upon contact with the surface, thereby further reducing the reflected signal.
[0020] For example, the low-reflectivity component 260 can be designed in various shapes to meet different application scenarios, such as grooves (low-reflectivity grooves), strips (low-reflectivity strips), or other geometries, to facilitate integration into the working area of the engraving machine 200. Its surface may also contain microstructures or textures to further enhance the absorption or scattering of infrared light.
[0021] For example, the low-reflective component 260 can be directly fixed to the work platform of the engraving machine 200, such as in combination with the cutter pad 240, becoming part of the work area. This design not only simplifies the installation process but also ensures the stability and durability of the component.
[0022] In this design, the infrared sensor 250 emits an infrared signal. When the infrared signal encounters the weak reflective component 260, where the target material 270 is absent, it is not reflected. The infrared signal can be absorbed or scattered by the weak reflective component 260, preventing the infrared sensor 250 from receiving the reflected signal. In other words, when the infrared signal encounters the weak reflective component 260, due to its material properties, the infrared signal is either absorbed or scattered, thus the infrared sensor 250 cannot receive sufficient reflected signal.
[0023] In this design, infrared sensor 250 emits infrared signals. When these signals encounter the target material 270 placed on the low-reflectivity component 260, they are reflected. The reflected signal is received by infrared sensor 250 and transmitted to processor 210 for processing. In this way, the engraving machine 200 can detect the presence and location of the material in real time. Specifically, when the target material 270 is placed on the low-reflectivity component 260, due to the different reflectivity of the material compared to the component, the infrared signal is reflected back to infrared sensor 250. This differential reflection allows infrared sensor 250 to detect the presence or absence of the target material 270, and then transmits the information to processor 210 for further processing, such as material positioning.
[0024] The processor 210 is used to determine the presence of target material 270 on the weak reflective component 260 based on the reflection signal received from the infrared sensor 250, calculate the distance and position information between the rotating cutter 231 and the target material 270 based on the reflection signal, and issue control commands based on the distance and position information. The trajectory module 230 is used to move the rotary cutter 231 directly above the target material 270 according to control commands and perform the cutting operation.
[0025] For example, when the target material 270 is placed within the working area of the engraving machine 200 and above the low-reflective component 260, the infrared signal emitted by the infrared sensor 250 is reflected back to the infrared sensor 250 by the target material 270. After receiving the reflected signal, the processor 210 processes it to determine that the target material 270 exists on the low-reflective component 260 and calculates the precise distance and position information of the rotating cutter 231 to the target material 270 above the cutter pad 240. Based on the calculation results, the processor 210 issues a control command, and the trajectory module 230 adjusts the position of the rotating cutter 231 to be directly above the target material 270 according to the control command. Once the rotating cutter 231 reaches the designated position, the engraving machine 200 performs the cutting operation to complete the precise cutting of the material.
[0026] The target material can be anything besides paper, but can also be a variety of materials with different physical properties. These materials are usually selected based on application requirements and cutting processes. For example, target materials can include, but are not limited to: paper, plastic film, fabric, leather, cardboard and paperboard, composite materials (such as aluminum composite panels, PVC panels, etc.), foam materials, magnetic materials, etc.
[0027] In the engraving machine provided in this application embodiment, the trajectory module 230 can be designed as a component with high flexibility and precise control capabilities, one specific implementation of which is a trajectory carriage. As a concrete application of the trajectory module, the trajectory carriage can not only move freely according to the control commands issued by the processor 210, but also maintain high-precision position control in complex cutting tasks. Through integrated motors, transmission devices, and guiding devices, the trajectory carriage can achieve multi-directional, high-precision displacement control within the working area of the engraving machine 200. When the processor 210 calculates the distance and position information between the rotating cutter 231 and the backing strip 240 based on the reflected signal received by the infrared sensor 250, it generates corresponding control commands and sends them to the trajectory carriage via a communication interface. Upon receiving the control commands, the control system within the trajectory carriage parses the command content and drives the motor. The motor transmits power to the moving parts of the trajectory carriage through the transmission device, causing it to move according to the direction and distance required by the command, and adjusting the position of the rotating cutter 231 directly above the target material 270. Meanwhile, the guiding device ensures the stability and accuracy of the track carriage during movement, preventing cutting errors caused by deviation or shaking. Through the flexible movement and precise control of the track carriage, the engraving machine 200 can achieve efficient and accurate cutting of target materials.
[0028] In some embodiments, the processor 210 is used to calculate the distance between the rotating cutter 231 and the target material 270 based on the different intensities of the reflected signal.
[0029] For example, infrared sensor 250 emits infrared signals to the low-reflectivity component 260 (such as a low-reflectivity groove or low-reflectivity strip) on the blade pad 240. When the target material 270 (such as paper) is present below the rotating blade 231, the infrared signal will be reflected back to infrared sensor 250 by the target material 270.
[0030] The intensity of the reflected signal is related to the distance between the rotating tool 231 and the target material 270. Generally, the closer the distance, the stronger the reflected signal; the farther the distance, the weaker the reflected signal. This relationship can be described by physical models (such as the law of reflection of light and attenuation models). The processor 210 receives the reflected signal sent by the infrared sensor 250 and processes it (such as filtering, amplification, digitization, etc.) to extract effective data reflecting the signal intensity. The processor 210 provides an algorithm, either built-in or externally, that calculates the precise distance between the rotating tool 231 and the target material 270 (or to the tool holder 240) based on the intensity of the reflected signal and a preset or experimentally calibrated distance-intensity relationship model.
[0031] In some embodiments, the processor 210 is further configured to calculate the edge distance information of the target material 270 based on the position information or edge distance information of the reflected signal and the pre-set weak reflective component 260.
[0032] For example, during system initialization or configuration, processor 210 can store or receive position information and / or margin information about the low-reflectivity component 260, which can be width information (left and right margins) and length information (top and bottom margins). This information can be physical dimensions, coordinate positions, or offsets relative to a reference point.
[0033] Infrared sensor 250 emits infrared signals to low-reflectivity component 260. When target material 270 (such as paper) is placed on low-reflectivity component 260, part of the infrared signal is reflected back to infrared sensor 250. Processor 210 receives these reflected signals.
[0034] The processor 210 processes the received reflected signal and extracts feature information related to the target material 270, such as signal strength, phase, and time delay.
[0035] Then, using the pre-set position and / or edge distance information of the weak reflective component 260, as well as the characteristic information in the reflected signal (such as signal strength, time delay, phase difference, etc.), the processor 210 can calculate the specific edge distance information of the target material 270 through an algorithm. This calculation process may involve at least one of the following techniques: geometric relationships, signal attenuation models, time difference measurement, etc.
[0036] The margin information helps the engraving machine 200 accurately control the cutting path, ensuring that the cutting operation does not exceed the material boundary, thus avoiding material waste or equipment damage. Through this intelligent computing function of the processor 210, the engraving machine 200 can achieve more precise and efficient material cutting operations.
[0037] In some embodiments, the processor 210 is further configured to automatically adjust the cutting path of the rotary cutter 231 based on the edge distance information of the target material 270 during the cutting process. This cutting path ensures that the rotary cutter 231 remains within the effective area indicated by the edge distance information of the target material 270 during the cutting process and does not exceed the material's boundary. This adjustment can be a fine-tuning based on real-time feedback or a larger adjustment based on a preset program.
[0038] For example, after determining the location information of the target material 270, the processor 210 can further combine the location information of the low-reflectivity component 260 and the known location of the backing strip 240 to calculate the precise distance between the rotating cutter 231 and the backing strip 240, as well as the accurate position of the cutter relative to the backing strip 240. This precise distance and position information ensures that the rotating cutter 231 will not accidentally cut the backing strip 240 during the cutting process, thus avoiding damage to the backing strip.
[0039] Then, based on the calculated distance and position information between the rotating cutter 231 and the target material 270, as well as the distance and position information between the rotating cutter 231 and the pad strip 240, the processor 210 can automatically adjust the position of the trajectory module (including the rotating cutter 231) and the position of the rotating cutter 231 to ensure that the rotating cutter 230 always stays directly above the target material 270 during the cutting process, while ensuring that the cutter will not accidentally cut the pad strip 240, thus achieving precise cutting.
[0040] In some embodiments, the processor 210 is further configured to adjust the position of the trajectory module 230 when the position offset of the target material 270 is determined based on the position information of the target material 270, so as to ensure that the rotary cutter 231 is positioned directly above the target material 270.
[0041] For example, the processor 210, acting as the control center, receives and analyzes reflected signals from the infrared sensor 250 to acquire the position information of the target material 270 in real time. When a positional shift of the target material 270 is detected, the processor 210 calculates the distance and direction that the trajectory module 230 needs to adjust based on the shift and sends corresponding control commands to the trajectory module 230. Upon receiving the control commands, the trajectory module 230 adjusts its position via a transmission device, thereby moving the rotating cutter 231 until it is precisely positioned directly above the target material 270. This process achieves automatic detection and correction of the target material 270's positional shift, ensuring the accuracy and stability of the cutting operation.
[0042] In some embodiments, the processor 210 is further configured to issue a warning signal when it determines that the target material 270 is not present on the weak reflective component 260, so as to prompt the placement of the target material 270.
[0043] For example, the processor 210 detects the presence of target material 270 on the low-reflectivity component 260 by receiving and analyzing reflected signals from the infrared sensor 250. When the characteristics of the reflected signal (such as signal strength, phase difference, or time delay) do not meet a preset threshold or pattern, such as when the signal strength of the reflected signal is lower than the intensity threshold, it indicates that no target material 270 has been detected on the low-reflectivity component 260, and the processor 210 immediately recognizes this state. Subsequently, the processor 210 can generate and issue a warning signal according to preset program logic. This warning signal can be conveyed to the user in various ways, such as displaying a warning message on the display screen of the engraving machine 200, issuing an audible alarm, or activating other types of warning devices. In this way, the processor 210 can promptly remind the user and prompt the user to place the target material 270 on the low-reflectivity component 260 to ensure the smooth progress of subsequent cutting operations.
[0044] In some embodiments, the processor 210 is also configured to continuously detect changes in the position of the target material 270 during the cutting process, and if the target material 270 is detected to move or change position, the position of the trajectory module 230 is automatically adjusted.
[0045] For example, the processor 210 continuously emits infrared signals to the low-reflectivity component 260 via the infrared sensor 250, and receives signals reflected back from the target material 270 on the low-reflectivity component 260 in real time. The position information of the target material is determined based on the reflected signals. During the cutting process, the processor 210 continuously analyzes these reflected signals to monitor whether the position of the target material 270 changes.
[0046] If the processor 210 detects a significant change in the characteristics of the reflected signal (such as signal strength, phase difference, or time delay) that exceeds a preset tolerance range, the processor 210 determines that the target material 270 has moved or changed position. Once the position change is confirmed, the processor 210 immediately initiates a position adjustment mechanism.
[0047] For example, the processor 210 calculates the new position of the target material 270 based on the change in the reflected signal, and determines the distance and direction that the trajectory module 230 needs to move. Then, the processor 210 sends corresponding control commands to the trajectory module 230, driving the trajectory module 230 to adjust its position via a transmission device.
[0048] During the adjustment process, the processor 210 continues to receive and analyze reflected signals to ensure that the trajectory module 230 can move accurately to the new target position. Once the trajectory module 230 is in place, the processor 210 repositions the rotary cutter 231 to ensure that it continues cutting operations at the new target material position.
[0049] In this way, the processor 210 can continuously detect changes in the position of the target material 270 during the cutting process and automatically adjust the position of the trajectory module 230, thereby improving the flexibility and accuracy of the cutting operation.
[0050] In some embodiments, the processor 210 is also configured to automatically adjust the position of the trajectory module 230 according to the cutting path information of the target material 270 after the cutting is completed, so as to perform the next cutting operation.
[0051] For example, after cutting, the processor 210 plans the position of the trajectory module 230 for the next cutting operation based on the previously stored or calculated cutting path information of the target material 270. This information may include the starting point, ending point, shape, and size of the cutting path. The processor 210 processes this information using an internal algorithm to calculate the target position that the trajectory module 230 needs to move to. Then, the processor 210 sends control commands to the trajectory module 230, driving it to the designated position via a motor or other transmission device. Once the trajectory module 230 reaches the target position, the processor 210 is ready to control the rotating cutter 231 for the next cutting operation. In this way, the processor 210 achieves the function of automatically adjusting the position of the trajectory module 230 after cutting, improving the automation level and operating efficiency of the engraving machine 200.
[0052] In some embodiments, the processor 210 is also configured to identify the type and thickness of the target material 270 based on the reflected signal, so as to adjust the cutting depth of the rotary cutter 231 according to the type and thickness.
[0053] For example, by analyzing the reflected signal received from the infrared sensor 250, the processor 210 can not only detect the presence and location of the target material 270, but also further identify the type and thickness of the target material 270. Different types of materials and materials of different thicknesses will exhibit different characteristics when reflecting infrared signals, such as signal strength, frequency response, or phase difference.
[0054] The processor 210 internally stores preset algorithms and models, which are trained and optimized based on the reflection characteristics of known material types. When the processor receives a reflected signal, it compares the characteristics of this signal with the stored algorithms and models, identifying the type and thickness of the target material through a complex calculation and matching process. Once the type and thickness of the target material are determined, the processor 210 adjusts the cutting depth of the rotating cutter 231 based on this information. For thinner or more fragile materials, the processor may reduce the cutting depth to avoid damage; while for thicker or harder materials, the processor will increase the cutting depth to ensure a thorough cut.
[0055] In some embodiments, the processor 210 is also configured to detect wear data of the rotary tool 231 during the cutting process, and issue a prompt signal to replace the rotary tool 231 when the wear data reaches a predetermined wear threshold.
[0056] For example, the processor 210 can monitor wear data of the rotating tool 231 through integrated or connected sensors (which may be sensors that directly measure the wear of the rotating tool 231, or sensors that infer wear through indirect parameters). These sensors can measure wear-related parameters such as tool vibration, rotational speed changes, decreased cutting efficiency, or increased temperature.
[0057] The processor 210 periodically or in real-time receives wear data from these sensors and analyzes and processes this data using preset algorithms. These algorithms, based on experimental data or empirical models, can identify the characteristics of the wear degree of the rotating cutter 231. As the cutting operation proceeds, the wear of the rotating cutter 231 gradually accumulates. When the wear data analyzed by the processor 210 reaches or exceeds a preset wear threshold, it determines that the rotating cutter 231 has reached the point where it needs to be replaced. Subsequently, the processor 210 issues a prompt signal to replace the rotating cutter 231. This prompt signal can be conveyed to the user in various ways, such as displaying a warning message on the engraving machine's screen, issuing an audible alarm, or sending it to the user's mobile device via a network.
[0058] In some embodiments, the processor 210 is also used to record cutting data for each cutting operation, including cutting time, cutting speed and cutting position, so as to perform data analysis and fault diagnosis based on the cutting data.
[0059] For example, during each cutting operation, the processor 210 records relevant cutting data in real time, including but not limited to cutting time, cutting speed, and cutting position. This data is collected by sensors (such as time recorders, speed sensors, and position sensors) and transmitted directly or indirectly to the processor.
[0060] The processor 210 may be equipped with internal storage units (such as RAM, ROM, or external memory) to store this cutting data. As the cutting operation proceeds, the processor 210 continuously adds newly generated cutting data to the storage units to form a complete cutting record.
[0061] After the cutting operation is completed, or as needed, the processor 210 can further process and analyze the stored cutting data. These analyses may include, but are not limited to: calculating the average cutting speed, analyzing the consistency of the cutting position, and identifying abnormal cutting conditions. Through these data analyses, users can understand the detailed situation of the cutting process, evaluate the cutting effect, and optimize cutting parameters or perform fault diagnosis accordingly. Furthermore, the processor 210 can also upload this cutting data to a host computer or cloud server for more in-depth data mining and analysis. The host computer or cloud server can utilize more powerful computing capabilities and professional analysis tools to process large amounts of cutting data, thereby discovering potential fault modes, predicting equipment lifespan, or optimizing the cutting process.
[0062] In some embodiments, the processor 210 is also configured to connect to an external device via a wireless communication module, receive cutting instructions sent by the external device, and control the movement of the trajectory module 230 according to the cutting instructions.
[0063] For example, the processor 210 may have a built-in or external wireless communication module (such as Wi-Fi, Bluetooth, etc.), enabling it to communicate wirelessly with external devices (such as computers, smartphones, tablets, etc.). These external devices can act as operating terminals or control systems, sending cutting commands to the processor 210. When an external device is ready to execute a cutting task, the user inputs or selects the corresponding cutting parameters (such as cutting path, cutting speed, cutting depth, etc.) through the operating interface, and these parameters are compiled into cutting commands. Subsequently, the external device sends these cutting commands to the processor 210 via the wireless communication module.
[0064] After receiving the cutting command, the processor 210 first parses and verifies it to ensure its validity and correctness. Once the verification is successful, the processor 210 controls the trajectory module 230 to perform corresponding actions according to the content of the cutting command. These actions may include adjusting the position of the trajectory module, controlling the start and stop of the rotary tool, and adjusting the cutting speed.
[0065] This application provides an engraving machine 200, which includes a processor 210, a power supply 220, a trajectory module 230, a cutting pad 240, an infrared sensor 250, and a low-reflection component 260. The processor 210 controls the operation of the engraving machine 200; the power supply 220 provides power to the engraving machine 200; the trajectory module 230 has a built-in rotating cutter 231 for performing cutting operations; the cutting pad 240 supports the target material 270 to cooperate with the rotating cutter 231 for cutting; and the infrared sensor 250 emits infrared signals and receives signals from the target material 270. Reflected signal; The weak reflective component 260 is disposed in the working area of the engraving machine 200 to prevent the reflection of infrared signals when there is no target material 270 on the weak reflective component 260; wherein, the processor 210 is used to determine the presence of target material 270 on the weak reflective component 260 based on the reflected signal received from the infrared sensor 250, calculate the distance and position information between the rotating cutter 231 and the target material 270 based on the reflected signal, and issue control commands based on the distance and position information; the trajectory module 230 is used to move the rotating cutter 231 to directly above the target material 270 according to the control commands and perform the cutting operation. This embodiment of the application utilizes the coordinated operation of the infrared sensor 250 and the low-reflectivity component 260 to detect the presence and position of the target material 270 (such as paper) within the working area of the engraving machine 200 in real time. Based on the received reflected signals, the processor 210 accurately calculates the distance and position information between the rotating cutter 231 and the target material 270, and automatically adjusts the trajectory module 230 accordingly to precisely move the rotating cutter 231 directly above the target material 270, thereby achieving automatic adjustment of the cutter position and improving the efficiency and accuracy of the cutting operation.
[0066] Each unit or module in the aforementioned engraving machine can be implemented entirely or partially through software, hardware, or a combination thereof. These units or modules can be embedded in or independent of the processor in a computer device in hardware form, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each unit or module.
[0067] The engraving machine 200 can be integrated into a terminal or server that has storage and a processor and thus computing power, or the engraving machine 200 can be the terminal or server.
[0068] Please see Figure 3 , Figure 3 This is a schematic flowchart illustrating the cutting method provided in an embodiment of this application. This method can be applied to... Figure 2The engraving machine 200 shown includes a processor, a power supply, a trajectory module, a cutting pad, an infrared sensor, and a low-reflectivity component. The processor controls the operation of the engraving machine; the power supply provides power to the engraving machine; the trajectory module has a built-in rotating blade for performing cutting operations; the cutting pad supports the target material to cooperate with the rotating blade for cutting; the infrared sensor emits infrared signals and receives reflected signals from the target material; the low-reflectivity component is disposed within the working area of the engraving machine to prevent the reflection of infrared signals when no target material is present on the low-reflectivity component; the method may include the following steps 110 to 130: Step 110: When the processor determines that there is target material on the weak reflective component based on the reflection signal received from the infrared sensor, it calculates the distance and position information between the rotating cutter and the target material based on the reflection signal.
[0069] Step 120: The processor issues control commands based on the distance and position information.
[0070] Step 130: The trajectory module moves the rotating cutter to directly above the target material according to the control command and performs a cutting operation.
[0071] In some embodiments, calculating the distance from the rotating tool to the target material based on the reflected signal includes: calculating the distance from the rotating tool to the target material based on the different intensities of the reflected signal.
[0072] In some embodiments, the method further includes: the processor calculating the edge distance information of the target material based on the reflection signal and the position information or edge distance information of the pre-set weak reflective component.
[0073] In some embodiments, the method further includes: when the processor determines the position offset of the target material based on the position information of the target material, adjusting the position of the trajectory module to ensure that the rotating cutter is positioned directly above the target material.
[0074] In some embodiments, the method further includes: when the processor determines that there is no target material on the low-reflectivity component, issuing a warning signal to prompt the placement of the target material.
[0075] In some embodiments, the method further includes: the processor continuously detects changes in the position of the target material during the cutting process; if the movement or position change of the target material is detected, the position of the trajectory module is automatically adjusted.
[0076] In some embodiments, the method further includes: after the cutting is completed, the processor automatically adjusts the position of the trajectory module according to the cutting path information of the target material so as to perform the next cutting operation.
[0077] In some embodiments, the method further includes: the processor identifying the type and thickness of the target material based on the reflected signal, so as to adjust the cutting depth of the rotary tool according to the type and thickness.
[0078] In some embodiments, the method further includes: the processor detecting wear data of the rotary tool during the cutting process, and issuing a prompt signal to replace the rotary tool when the wear data reaches a predetermined wear threshold.
[0079] In some embodiments, the method further includes: the processor recording cutting data for each cutting operation, the cutting data including cutting time, cutting speed and cutting position, so as to perform data analysis and fault diagnosis based on the cutting data.
[0080] In some embodiments, the method further includes: the processor connecting to an external device via a wireless communication module, receiving cutting instructions sent by the external device, and controlling the movement of the trajectory module according to the cutting instructions.
[0081] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working process of the method described above can be referred to the specific implementation method in the aforementioned engraving machine embodiments, and will not be repeated here.
[0082] All of the above technical solutions can be combined in any way to form optional embodiments of this application, and will not be described in detail here.
[0083] This application provides a cutting method applied to a lettering machine. The lettering machine includes a processor, a power supply, a trajectory module, a blade support, an infrared sensor, and a low-reflectivity component. The processor controls the operation of the lettering machine; the power supply provides power to the lettering machine; the trajectory module has a built-in rotating blade for performing the cutting operation; the blade support supports the target material to cooperate with the rotating blade for cutting; the infrared sensor emits infrared signals and receives reflected signals from the target material; the low-reflectivity component is located within the working area of the lettering machine to prevent the reflection of infrared signals when there is no target material on the low-reflectivity component; when the processor determines that there is target material on the low-reflectivity component based on the reflected signals received from the infrared sensor, it calculates the distance and position information between the rotating blade and the target material based on the reflected signals; the processor issues control commands based on the distance and position information; the trajectory module moves the rotating blade directly above the target material according to the control commands and performs the cutting operation. This application embodiment utilizes the collaborative work of an infrared sensor and a low-reflectivity component to detect the presence and position of a target material (such as paper) within the working area of the engraving machine in real time. Based on the received reflection signal, the processor accurately calculates the distance and position information between the rotating cutter and the target material, and automatically adjusts the trajectory module accordingly to precisely move the rotating cutter directly above the target material, thereby achieving automatic cutter position adjustment and improving the efficiency and accuracy of the cutting operation.
[0084] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0085] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.
[0086] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0087] In addition, the functional units in this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.
[0088] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer or a server) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.
[0089] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A lettering engraving machine, characterized in that, include: A processor is used to control the operation of the engraving machine; A power supply for providing power to the engraving machine; A trajectory module, which has a built-in rotating cutter for performing cutting operations; The blade support strip is used to support the target material in order to cooperate with the rotating blade for cutting; Infrared sensors are used to emit infrared signals and receive reflected signals from target materials. A low-reflectivity component is disposed within the working area of the engraving machine to prevent the infrared signal from being reflected when there is no target material on the low-reflectivity component; The processor is configured to, when determining the presence of target material on the weak reflective component based on the reflected signal received from the infrared sensor, calculate the distance and position information between the rotating cutter and the target material based on the reflected signal, and issue control commands based on the distance and position information; The trajectory module is used to move the rotary cutter directly above the target material according to the control command and perform a cutting operation.
2. The engraving machine according to claim 1, characterized in that, The processor is used to calculate the distance between the rotating cutter and the target material based on the different intensities of the reflected signal.
3. The engraving machine according to claim 1, characterized in that, The processor is also used to calculate the edge distance information of the target material based on the reflection signal and the position information or edge distance information of the pre-set weak reflective component.
4. The engraving machine according to claim 1, characterized in that, The processor is also configured to adjust the position of the trajectory module when determining the position offset of the target material based on the position information of the target material, so as to ensure that the rotating cutter is positioned directly above the target material.
5. The engraving machine according to claim 1, characterized in that, The processor is also configured to issue a warning signal when it determines that the target material is not present on the low-reflectivity component, in order to prompt the placement of the target material.
6. The engraving machine according to claim 1, characterized in that, The processor is also used to continuously detect changes in the position of the target material during the cutting process. If the movement or position change of the target material is detected, the position of the trajectory module is automatically adjusted.
7. The engraving machine according to claim 1, characterized in that, The processor is also used to automatically adjust the position of the trajectory module according to the cutting path information of the target material after the cutting is completed, so as to perform the next cutting operation.
8. The engraving machine according to claim 1, characterized in that, The processor is also configured to identify the type and thickness of the target material based on the reflected signal, so as to adjust the cutting depth of the rotary tool according to the type and thickness.
9. The engraving machine according to claim 1, characterized in that, The processor is also used to detect wear data of the rotary tool during the cutting process, and when the wear data reaches a predetermined wear threshold, it issues a prompt signal to replace the rotary tool.
10. A cutting method, characterized in that, An application is made in a lettering machine, which includes a processor, a power supply, a trajectory module, a cutting pad, an infrared sensor, and a low-reflectivity component. The processor controls the operation of the lettering machine; the power supply provides power to the lettering machine; the trajectory module has a built-in rotating cutter for performing cutting operations; the cutting pad supports the target material to cooperate with the rotating cutter for cutting; the infrared sensor emits infrared signals and receives reflected signals from the target material; the low-reflectivity component is disposed within the working area of the lettering machine to prevent reflection of the infrared signal when no target material is present on the low-reflectivity component; the method includes: When the processor determines that there is target material on the weak reflective component based on the reflected signal received from the infrared sensor, it calculates the distance and position information between the rotating cutter and the target material based on the reflected signal. The processor issues control commands based on the distance and position information; The trajectory module moves the rotating cutter directly above the target material according to the control command and performs a cutting operation.