Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof and a display device.The display panel comprises a substrate, a plurality of light-emitting devices and at least one isolation structure, the light-emitting devices and the isolation structure are located on one side of the substrate, the light-emitting devices are arranged into multiple groups, each group comprises at least two light-emitting devices, the light-emitting devices in the same group have the same light emitting color, and the light-emitting devices in the same group have the same light emitting color. The at least one isolation structure defines a plurality of isolation openings, and the light-emitting devices in the same group are located in the same isolation opening. In the display panel, when the light-emitting devices are prepared in batches based on the first isolation structure, partial areas of the group where the light-emitting devices are located are not limited by the isolation structure, so that the light-emitting devices can be directly connected with an external circuit, and the risk that the driving impedance is too large due to poor connection between the light-emitting devices and the first isolation structure is reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin film electroluminescent device. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] However, current electronic display products are limited by their own structural design and cannot be used in scenarios such as light reflection. Summary of the invention

[0004] A first aspect of the present disclosure provides a display panel, which includes a substrate and a plurality of light-emitting devices and at least one isolation structure located on one side of the substrate, wherein the light-emitting devices are arranged into a plurality of groups, each group having at least two light-emitting devices arranged therein, and the light-emitting devices in the same group have the same light output color, and the at least one isolation structure defines a plurality of isolation openings, wherein the light-emitting devices in the same group are located in the same isolation opening.

[0005] In the above scheme, while the light-emitting devices are prepared in batches based on the isolation structure, part of the area of ​​the group where the light-emitting devices are located is not restricted by the isolation structure, so that it can be directly connected to the external circuit (such as the common electrode line described below) to reduce the risk of excessive driving impedance due to poor connection between the light-emitting devices and the isolation structure.

[0006] In a specific embodiment of the first aspect of the present disclosure, the light-emitting device includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence on a substrate, and the second electrodes of the light-emitting devices in the same group are contact-connected to form an integrated film layer.

[0007] Optionally, the first electrodes of the light emitting devices in the same group are spaced apart from each other.

[0008] Optionally, the light-emitting functional layers of the light-emitting devices in the same group are contact-connected to form an integrated film layer.

[0009] In a specific embodiment of the first aspect of the present disclosure, the light-emitting devices are arranged in multiple columns, and each group of light-emitting devices is arranged in one column. The at least one isolation structure includes at least one first isolation structure, and the first isolation structure is located between each column to separate the light-emitting devices in different columns. In this way, while the light-emitting devices are prepared in batches based on the first isolation structure, the end of the column where the light-emitting device is located is not restricted by the first isolation structure, so that it can be directly connected to an external circuit (such as the common electrode line described below), so as to reduce the risk of excessive driving impedance due to poor connection between the light-emitting device and the first isolation structure.

[0010] Optionally, the substrate comprises a common electrode line, and in each column of light emitting devices, a second electrode of at least one of the two light emitting devices located at both ends of the column is connected to the common electrode line.

[0011] In the above scheme, the common electrode line can directly supply power (such as negative voltage) to each column of the light-emitting device without being connected to the common electrode line through the first isolation structure, so there is no need to consider the impedance problem caused by poor connection between the light-emitting device and the first isolation structure.

[0012] In a specific embodiment of the first aspect of the present disclosure, the display panel also includes a first packaging layer located on the side of the isolation structure and the light-emitting device facing away from the substrate, the first packaging layer includes packaging units corresponding to different columns of light-emitting devices, the packaging units cover the isolation openings, and the light-emitting devices in the same column are covered by the same packaging unit.

[0013] In the above solution, in the process of preparing the light-emitting devices in batches based on the first isolation structure, the encapsulation unit is formed along with the light-emitting devices, so as to encapsulate and protect the formed light-emitting devices.

[0014] In a specific embodiment of the first aspect of the present disclosure, the isolation structure is arranged in a plurality of strips, and the plurality of isolation structures include at least two second isolation structures, and the extension direction of the second isolation structure intersects with the extension direction of the first isolation structure so as to be respectively connected to the end portions of the first isolation structure so that the positive projection of the edge of the isolation opening on the substrate is a closed ring.

[0015] In the above solution, the first isolation structure and the second isolation structure together enclose a closed isolation opening, so that the packaging unit has a higher packaging thickness around the isolation opening, so as to improve the packaging effect of the light-emitting device.

[0016] In a specific embodiment of the first aspect of the present disclosure, the edge of the packaging unit extends to the side of the isolation structure away from the substrate, and on the side of the isolation structure away from the substrate, the edge portion of the packaging unit is spaced from the isolation structure to form a suspended portion.

[0017] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a second encapsulation layer covering the first encapsulation layer and the isolation structure, the second encapsulation layer is a planarization layer, and fills at least a portion of the gap between the suspended portion and the isolation structure. In the process of preparing the light-emitting device and the encapsulation unit by dry etching and wet etching, the edge of the encapsulation unit will be suspended, and the second encapsulation layer fills the gap below the suspended portion, so that the suspended portion of the encapsulation unit can be supported to reduce the risk of damage to the edge of the encapsulation unit.

[0018] In another specific embodiment of the first aspect of the present disclosure, the display panel further comprises a filling portion, which fills at least a portion of the gap between the suspended portion and the isolation structure. In this way, the light-emitting device and the packaging unit can be prepared by dry etching to retain the filling portion so as to support the suspended portion of the packaging unit. In addition, this method can support the suspended portion of the packaging unit that has been formed in the preparation process of each batch of light-emitting devices and packaging units, thereby further reducing the risk of damage to the edge of the packaging unit.

[0019] Optionally, for the filling part and the light-emitting device corresponding to the same packaging unit, the filling part is in the same layer and made of the same material as the light-emitting functional layer and the second electrode of the light-emitting device.

[0020] In a specific embodiment of the first aspect of the present disclosure, the substrate further includes a plurality of signal lines in the same layer and made of the same material as the common electrode lines. Since the signal lines are arranged in the substrate, they can have a higher design thickness and conductivity. The common electrode lines are prepared at the same time as the signal lines, which can not only simplify the preparation process of the display panel, but also reduce the voltage drop generated on the entire circuit when driving the light-emitting device, thereby improving the display effect of the display panel and reducing power consumption.

[0021] Optionally, the substrate further includes a planar layer, the planar layer is located between the first electrode and the signal line, a via is provided in the planar layer, and the common electrode line and the second electrode are connected through the via.

[0022] Optionally, the signal line includes a power line or a data line.

[0023] Optionally, the signal line and the common electrode line include a first conductive layer, a second conductive layer and a third conductive layer sequentially stacked on the first conductive layer, and both the first conductive layer and the third conductive layer are connected to the second conductive layer.

[0024] Optionally, the materials of the first conductive layer, the second conductive layer and the third conductive layer are molybdenum, aluminum, and molybdenum, respectively, or titanium, aluminum, and titanium, respectively.

[0025] In a specific embodiment of the first aspect of the present disclosure, the isolation structure includes a support portion and a crown portion, the support portion is located between the substrate and the crown portion, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate. In this way, the width of the crown portion is greater than the width of the support portion, thereby improving the isolation effect of the isolation structure.

[0026] In a specific embodiment of the first aspect of the present disclosure, the support portion is a conductive structure, and the second electrode is connected to the side wall of the support portion. The setting of the support portion does not need to consider light transmission, so it can have a larger design thickness (greater than the second electrode), that is, the square resistance of the support portion is smaller than the square resistance of the second electrode. In this solution, the support portion can be connected to the second electrode of the light-emitting device to share a common potential, thereby reducing the voltage drop generated on the second electrode.

[0027] Optionally, the crown is a conductive structure, so that the voltage drop generated on the second electrode can be further reduced.

[0028] Optionally, the isolation structure further includes a bottom, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the bottom on the substrate, the bottom is a conductive structure, and the second electrode is connected to a portion of the surface of the bottom facing away from the substrate that is not covered by the support portion. Compared with the side wall of the support portion, the second electrode is more easily deposited on the surface area of ​​the bottom facing away from the substrate, thereby reducing the impedance at the connection between the second electrode and the isolation structure.

[0029] Optionally, an orthographic projection of the bottom portion on the base plate is located within an orthographic projection of the crown portion on the base plate.

[0030] In a specific embodiment of the first aspect of the present disclosure, when the support portion is a conductive structure, the display panel further includes a pixel defining layer, the pixel defining layer is located between the isolation structure and the substrate and defines a plurality of pixel openings corresponding to the light-emitting devices, the pixel openings are connected to the isolation openings, and the light-emitting function layer and the second electrode of the light-emitting device are partially located in the pixel openings. The pixel defining layer can separate the conductive isolation structure and the first electrode of the light-emitting device, so that the gap of the light-emitting device can have a smaller design size, so as to increase the pixel density PPI of the display panel.

[0031] Optionally, the pixel defining layer is an inorganic film layer. In the process of preparing the light-emitting device based on the isolation structure, the pixel defining layer does not need to be thick enough to accommodate the light-emitting device, which is conducive to the thin and light design of the display panel; in addition, the pixel defining layer as an inorganic film layer can have a high bonding strength with the isolation structure and the first electrode to reduce the risk of the isolation structure and the first electrode falling off; in addition, the inorganic film layer has a high density and can more effectively block the intrusion of water, oxygen, etc., thereby improving the packaging effect of the display panel.

[0032] Optionally, an edge of the first electrode is located between the pixel defining layer and the substrate, and an orthographic projection of the pixel opening on the substrate is located within an orthographic projection of the first electrode on the substrate.

[0033] In another specific embodiment of the first aspect of the present disclosure, the support portion and the crown portion are insulating structures, and the orthographic projection of the gap between the first electrodes of adjacent light-emitting devices located in different columns on the substrate is located within the orthographic projection of the first isolation structure on the substrate.

[0034] In the above solution, the gap size between the light emitting areas of adjacent light emitting devices is no longer limited by the spacing distance between the first isolation structure and the first electrode of the light emitting device, so that the display panel can have a higher pixel density PPI.

[0035] Optionally, the material of the support portion includes silicon nitride.

[0036] Optionally, the material of the crown comprises silicon oxide.

[0037] In a specific embodiment of the first aspect of the present disclosure, when the support portion and the crown portion are insulating structures, the display panel also includes a pixel defining layer, which is located between the isolation structure and the substrate, and defines a plurality of clearance openings and a plurality of pixel openings corresponding to the light-emitting devices, respectively. The first isolation structure is located in the clearance opening, the pixel opening is connected to the isolation opening, and the light-emitting functional layer of the light-emitting device and part of the second electrode are located in the pixel opening.

[0038] In the above solution, the setting of the opening can reduce the setting height of the isolation structure, so as to reduce the influence of the isolation structure on the light output angle of the light emitting device, thereby improving the viewing angle of the display panel.

[0039] In a specific embodiment of the first aspect of the present disclosure, when the support portion and the crown portion are insulating structures, the display panel also includes an auxiliary electrode, which is located on the side of the first isolation structure away from the substrate and is connected to the second electrode, and the orthographic projection of the auxiliary electrode on the substrate is located at the orthographic projection of the gap between adjacent light-emitting devices on the substrate.

[0040] In the above scheme, the auxiliary electrode is connected in parallel with the second electrode of the light emitting device, thereby reducing the voltage drop on the second electrode when driving the light emitting device, thereby improving the display effect of the display panel while reducing power consumption, so that the display panel can be applied to medium and large sizes.

[0041] Optionally, the orthographic projection of at least part of the auxiliary electrode on the substrate coincides with the orthographic projection of the isolation structure on the substrate, or the orthographic projection of at least part of the auxiliary electrode on the substrate is located within the orthographic projection of the isolation structure on the substrate. In this way, the auxiliary electrode can be set to have a relatively high thickness, and is not limited by the material, so that a material with high conductivity can be selected to have a smaller square resistance, thereby further reducing the voltage drop generated on the second electrode when driving the light-emitting device.

[0042] Optionally, an extension direction of a portion of the auxiliary electrode intersects with an extension direction of the first isolation structure, so as to connect the second electrodes of the light emitting devices of each column in parallel.

[0043] Optionally, the auxiliary electrode includes a first auxiliary conductive layer, a second auxiliary conductive layer and a third auxiliary conductive layer stacked in sequence.

[0044] Optionally, the materials of the first auxiliary conductive layer, the second auxiliary conductive layer and the third auxiliary conductive layer are molybdenum, aluminum, and molybdenum, respectively, or titanium, aluminum, and titanium, respectively.

[0045] In a specific embodiment of the first aspect of the present disclosure, the display panel also includes a first packaging layer located on the side of the isolation structure and the light-emitting device away from the substrate, the first packaging layer includes packaging units corresponding to different columns of light-emitting devices, and at least part of the auxiliary electrode is located in the gap between adjacent packaging units.

[0046] Optionally, at least a portion of the auxiliary electrode is located on a side of the encapsulation unit away from the substrate, so that the arrangement of the auxiliary electrode will not affect the preparation process of the light-emitting device and the first encapsulation layer.

[0047] Optionally, the packaging unit includes a packaging opening, the orthographic projections of the packaging openings on the substrate are located in the same column and the gaps between adjacent light-emitting devices are within the orthographic projections on the substrate, and the auxiliary electrode is connected to the second electrode of the light-emitting device through the packaging opening.

[0048] In a specific embodiment of the first aspect of the present disclosure, the light-emitting devices are arranged into multiple columns and classified into multiple first-category light-emitting devices, multiple second-category light-emitting devices, and multiple third-category light-emitting devices, and the light-emitting colors of the first-category light-emitting devices, the second-category light-emitting devices, and the third-category light-emitting devices are different.

[0049] In a specific embodiment of the first aspect of the present disclosure, along a direction perpendicular to the column direction, the column where the first type of light emitting devices are located, the column where the second type of light emitting devices are located, and the column where the third type of light emitting devices are located are repeatedly arranged in sequence.

[0050] In a specific embodiment of the first aspect of the present disclosure, the light-emitting devices are arranged in a matrix of multiple rows and columns, and in each row, the first type of light-emitting devices, the second type of light-emitting devices and the third type of light-emitting devices are repeatedly arranged in sequence.

[0051] Optionally, the orthographic projection of the first isolation structure on the substrate is in the shape of a straight line segment parallel to the extension direction of the column.

[0052] In another specific embodiment of the first aspect of the present disclosure, for adjacent columns of second-type light-emitting devices and columns of third-type light-emitting devices, the second-type light-emitting devices and the third-type light-emitting devices are alternately arranged along the column direction and in a direction perpendicular to the column.

[0053] Optionally, the first type of light-emitting devices, the second type of light-emitting devices and the third type of light-emitting devices are arranged in multiple rows and columns, the second type of light-emitting devices and the third type of light-emitting devices that are adjacent and located in different columns are located in different rows, and the first type of light-emitting devices that are adjacent and located in the same column are arranged in the same row with the second type of light-emitting devices and the third type of light-emitting devices that are adjacent and located in different columns.

[0054] Optionally, the orthographic projection of the first isolation structure on the substrate is in the shape of a broken line segment parallel to the extension direction of the column.

[0055] In another specific embodiment of the first aspect of the present disclosure, adjacent columns of second-type light-emitting devices overlap with columns of third-type light-emitting devices, and the second-type light-emitting devices and third-type light-emitting devices in adjacent columns are alternately arranged along the column direction.

[0056] Optionally, the first type of light-emitting devices, the second type of light-emitting devices and the third type of light-emitting devices are arranged in multiple rows and columns, the second type of light-emitting devices and the third type of light-emitting devices adjacent to each other and located in the same column are located in different rows, and the first type of light-emitting devices adjacent to each other in the same column are arranged in the same row with the second type of light-emitting devices and the third type of light-emitting devices adjacent to each other and located in the same column.

[0057] Optionally, the orthographic projection of the first isolation structure on the substrate is in the shape of a broken line segment parallel to the extension direction of the column.

[0058] In a specific embodiment of the first aspect of the present disclosure, the light emission wavelengths of the second type of light emitting devices, the first type of light emitting devices and the third type of light emitting devices decrease in sequence.

[0059] The second aspect of the present disclosure provides a method for preparing a display panel, the method comprising: providing a substrate and forming at least one isolation structure on the substrate, wherein the isolation structure defines a plurality of isolation openings; preparing a plurality of light-emitting devices based on the isolation structure, wherein the plurality of light-emitting devices are arranged into a plurality of groups, and the light-emitting devices in the same group have the same light-emitting color and are formed in the same isolation opening. In the preparation method, while preparing the light-emitting devices in batches based on the isolation structure, the ends of the columns where the light-emitting devices are located are not restricted by the isolation structure, so that they can be directly connected to an external circuit (such as the common electrode line described below), so as to reduce the risk of excessive driving impedance due to poor connection between the light-emitting devices and the isolation structure.

[0060] In a specific embodiment of the second aspect of the present disclosure, preparing a plurality of light-emitting devices based on an isolation structure includes: before forming the isolation structure, forming a plurality of first electrodes spaced apart from each other on a substrate, wherein each isolation opening exposes the plurality of first electrodes; after forming the isolation structure, forming a light-emitting functional material film layer, a conductive material film layer and a packaging material film layer covering the isolation opening and the isolation structure; forming a photoresist layer on the packaging material film layer, and exposing and developing the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening; etching the light-emitting functional material film layer, the conductive material film layer and the packaging material film layer based on the photoresist pattern, wherein the remaining portion of the light-emitting functional material film layer is formed as a light-emitting functional layer, and the remaining portion of the conductive material film layer is formed as a light-emitting functional layer. The remaining part is formed as a second electrode, the remaining part of the packaging material film layer is formed as a packaging unit, the light-emitting functional layer in the isolation opening covered with the photoresist pattern, the first electrode and the second electrode constitute a light-emitting device, wherein a plurality of light-emitting devices emitting the same color are formed in each isolation opening covered with the photoresist pattern, the second electrodes of the light-emitting devices in the same isolation opening are contacted and connected to form an integrated film layer, and the light-emitting functional layers of the light-emitting devices in the same isolation opening are contacted and connected to form an integrated film layer; the remaining photoresist pattern is removed; the above steps are repeated to form a light-emitting device emitting other colors of light in the isolation opening where no light-emitting device is formed, and a packaging unit is formed on the light-emitting device, and all the packaging units constitute a first packaging layer.

[0061] In a specific embodiment of the second aspect of the present disclosure, the preparation method also includes: after forming the light-emitting device and the first packaging layer, performing a composition process on the first packaging layer to form a packaging opening in the packaging unit, wherein the orthographic projection of the packaging opening on the substrate is located in the same column and the gap between adjacent light-emitting devices is within the orthographic projection on the substrate; forming an auxiliary conductive material film layer covering the packaging opening, the isolation structure and the first packaging layer; performing a composition process on the auxiliary conductive material film layer to form an auxiliary electrode, wherein the auxiliary electrode is connected to the second electrode of the light-emitting device through the packaging opening.

[0062] A third aspect of the present disclosure provides a display device, which includes the display panel in the first aspect or the display panel obtained by the preparation method of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 A schematic diagram of a planar structure of a display panel provided in one embodiment of the present disclosure.

[0064] Figure 2 for Figure 1 The shown diagram is an enlarged view of a region S1 of a display panel under one design.

[0065] Figure 3Afor Figure 2 The display panel is shown in a cross-sectional view along line M1 - N1 .

[0066] Figure 3B for Figure 2 The shown diagram is a cross-sectional view of a display panel along M2 - N2 in one design.

[0067] Figure 4A for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0068] Figure 4B For the corresponding Figure 2 and Figure 4A A cross-sectional view of the display panel along M2-N2.

[0069] Figure 5A for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0070] Figure 5B For the corresponding Figure 2 and Figure 5A A cross-sectional view of the display panel along M2-N2.

[0071] Figure 6 for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0072] Fig. 7A for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0073] Figure 7B For the corresponding Figure 2 and Fig. 7A A cross-sectional view of the display panel along M2-N2.

[0074] Figure 8 for Figure 1 The shown diagram is an enlarged view of a region S1 of a display panel under another design.

[0075] Fig.9A for Figure 8 The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0076] Fig. 9B For the corresponding Figure 8 and Fig.9A A cross-sectional view of the display panel along M2-N2.

[0077] Fig.10 for Figure 1 The shown diagram is an enlarged view of a region S1 of a display panel under another design.

[0078] Fig.11 for Figure 1 The shown diagram is an enlarged view of a region S1 of a display panel under another design.

[0079] Fig. 12A The present invention provides a flow chart of a method for preparing a display panel according to an embodiment of the present invention.

[0080] Fig. 12B A flow chart of another method for preparing a display panel provided in an embodiment of the present disclosure.

[0081] Fig. 12C A flow chart of another method for preparing a display panel provided in an embodiment of the present disclosure.

[0082] FIG. 13A to FIG. 13I For forming a method according to an embodiment of the present disclosure Figure 3A A process diagram of a method for preparing a display panel is shown.

[0083] FIG. 14A to FIG. 14C For forming a method according to an embodiment of the present disclosure Figure 3A A process diagram of another method for preparing a display panel is shown.

[0084] Fig.15 A schematic diagram of the positional relationship between a partial film layer of a display panel and an evaporation source during evaporation provided by an embodiment of the present disclosure.

[0085] Description of reference numerals:

[0086] 10-display panel; 11-display area; 12-frame area; 100-substrate; 101-via hole; 102-package opening; 111-common electrode line; 112-signal line; 120-flat layer; 200-light-emitting device; 210-first electrode; 220-light-emitting functional layer; 221-first functional layer; 222-light-emitting layer; 223-second functional layer; 230-second electrode; 240-auxiliary electrode; 300-isolation structure; 300a-first isolation structure; 300b-second isolation structure; 3 01-isolation opening; 302-pixel opening; 303-giving way opening; 310-supporting part; 310a-first material layer; 320-crown; 320a-second material layer; 330-pixel defining layer; 330a-pixel defining material layer; 340-bottom; 400-packaging structure; 410-first packaging layer; 410a-first packaging film; 411-packaging unit; 411a-suspended part; 420-second packaging layer; 430-third packaging layer; 440-filling part; 500-photoresist pattern. DETAILED DESCRIPTION

[0087] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0088] In some scenarios, some functional film layers in the light-emitting device are formed by evaporation, and there are multiple functional film layers in each light-emitting device, and the material composition of some functional film layers (such as light-emitting layers) in the light-emitting devices that emit different light is different. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by alignment accuracy errors, sufficient space (and safety margin related to alignment errors) needs to be reserved between different light-emitting devices to ensure that the position of the actual light-emitting area of ​​the light-emitting device can have a certain overlap rate with the designed position (design area), which is equivalent to compressing the design area of ​​the light-emitting area of ​​the light-emitting device, which not only limits the light-emitting area of ​​the light-emitting device, but also prevents the arrangement density of the light-emitting device from being further increased, making it difficult to further improve the PPI (pixel density) of the display panel.

[0089] In the embodiment of the present disclosure, an isolation structure is provided at the gap between the light-emitting devices to separate the functional film layers of the adjacent light-emitting devices. Thus, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel without using a mask plate to prepare the functional film layer of each light-emitting device separately. The process does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting devices can be designed to be smaller in size to increase the PPI (the principle of which can be referred to in the following and FIG. 13A to FIG. 13I (See also the relevant description in the relevant embodiments).

[0090] It should be noted that when a light-emitting device is prepared based on the above-mentioned isolation structure, the light-emitting device will overlap with the isolation structure, and thus be connected to an external circuit through the isolation structure. However, while the isolation structure plays a role of isolation, its connection strength with the light-emitting device will be limited, so that the impedance at the connection between the isolation structure and the light-emitting device is high, which will cause excessive voltage drop when driving the light-emitting device, making it difficult to improve the display effect, and will also increase power consumption.

[0091] At least one embodiment of the present disclosure provides a display panel and a method for preparing the same, and a display device, to at least solve the above technical problems. The display panel includes a substrate, a plurality of light-emitting devices located on one side of the substrate, and at least one isolation structure. The light-emitting devices are arranged into a plurality of groups, each group is arranged with at least two light-emitting devices, and the light-emitting devices in the same group have the same light-emitting color. The at least one isolation structure defines a plurality of isolation openings, and the light-emitting devices in the same group are located in the same isolation opening. In the display panel, while the light-emitting devices are prepared in batches based on the isolation structure, a part of the area of ​​the group where the light-emitting devices are located is not restricted by the isolation structure, so that it can be directly connected to an external circuit (such as the common electrode line described below), so as to reduce the risk of excessive driving impedance due to poor connection between the light-emitting devices and the isolation structure.

[0092] The structure of the display panel in at least one embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. In addition, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationship of the relevant structures in the display panel, and in the spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the surface where the substrate is located, and the Z-axis is perpendicular to the surface where the substrate is located.

[0093] like Figure 1 , Figure 2 , Figure 3A and Figure 3B As shown, the plane area of ​​the display panel 10 can be divided into a display area 11 and a border area 12 surrounding the display area 11. Sub-pixels (which may be called sub-pixels, etc.) may be arranged in the display area 11, such as R, G, and B sub-pixels. The physical structure of the sub-pixel may be a light-emitting device in the following embodiments. Adjacent sub-pixels with different colors of emitted light constitute a pixel (which may be called a pixel unit, a large pixel, etc.). The arrangement density of the pixel in the display area 11 represents the pixel density PPI. It should be noted that in some embodiments of the present disclosure, some of the wiring in the border area 12 (such as the common electrode lines and signal lines mentioned in the following embodiments) can be arranged in the display area 11, so that the border area 12 can be designed as a single-sided border.

[0094] The physical structure of the display panel 10 may include a substrate 100 and a plurality of light-emitting devices 200 and a plurality of isolation structures 300 located on the substrate 100. The light-emitting devices 200 are located in the display area 11 and are arranged into a plurality of groups. At least two light-emitting devices 200 are arranged in each group. The light-emitting devices 200 in the same group have the same light emission color. The at least one isolation structure 300 defines a plurality of isolation openings 301. The light-emitting devices 200 in the same group are located in the same isolation opening 301, and the light-emitting devices 200 in different groups are located in different isolation openings 301. The light-emitting devices 200 with different light emission colors are formed in a certain order.

[0095] In at least one embodiment of the present disclosure, the light-emitting devices 200 are arranged in multiple columns, and each group of light-emitting devices 200 is arranged in one column. The at least one isolation structure 300 includes at least one first isolation structure 300aa. The first isolation structure 300aa is located between the columns to separate the light-emitting devices 200 in different columns. In this way, while the light-emitting devices 200 are prepared in batches based on the first isolation structure 300aa, the ends of the column where the light-emitting devices 200 are located are not restricted by the first isolation structure 300aa, so that they can be directly connected to an external circuit (such as the common electrode line described below) to reduce the risk of excessive driving impedance due to poor connection between the light-emitting devices 200 and the first isolation structure 300aa. Specifically, the light-emitting devices 200 are arranged in at least multiple columns (such as Figure 2 In the five columns L1 to L5 shown in FIG. 1 , one column corresponds to one group, the light emitting devices 200 in the same column have the same light emission color, and the adjacent isolation structures 300 define isolation openings 301 corresponding to the light emitting devices 200 in different columns, and the light emitting devices 200 in the same column are located in the same isolation opening 301. For example, Figure 2 , Figure 3A and Figure 3B As shown, the light emitting devices 200 in column L1 and the light emitting devices 200 in column L2 have different light emitting colors, all the light emitting devices 200 in column L1 are located in one isolation opening 301, and all the light emitting devices 200 in column L2 are located in another isolation opening 301, so that in the process of preparing the light emitting devices, all the light emitting devices 200 in column L1 are prepared at the same time, all the light emitting devices 200 in column L2 are prepared at the same time, and the light emitting devices 200 in column L1 and the light emitting devices 200 in column L2 are formed in a certain order.

[0096] It should be noted that in the embodiments of the present disclosure, "column" and "row" are relative. Depending on the orientation when describing the structure of the display panel, "column" can be replaced by "row", or the following "row" can be replaced by "column".

[0097] It should be noted that in the embodiments of the present disclosure, columns or rows are only one form of presentation of groups, and groups can also be distributed in blocks, that is, the light-emitting devices of each group can be arranged in multiple rows, multiple columns or other forms. Below, the structure of the display panel is described by taking the form of groups presented in columns as an example.

[0098] In at least one embodiment of the present disclosure, Figure 3AAs shown, in the direction away from the substrate 100, the light-emitting device 200 may include a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 which are sequentially stacked on the substrate 100. Because the light-emitting devices 200 in the same column (or group) are limited to the same isolation opening 301, the second electrodes 230 of the light-emitting devices 200 in the same column (or group) are in contact with each other and connected to form an integrated film layer, that is, the second electrodes 230 of each light-emitting device 200 in the same column (or group) are formed by one film formation. For example, the first electrodes 200 of the light-emitting devices 200 in the same column (or group) are spaced apart from each other to drive each light-emitting device 200 separately.

[0099] For example, the light-emitting functional layer 220 may further include a light-emitting layer 222 and a second functional layer 223, and the first functional layer 221, the light-emitting layer 222 and the second functional layer 223 are sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that one or more light-emitting layers 222 may be provided in the light-emitting device 200. In the case of multiple light-emitting layers 222, the light-emitting device 200 may have a higher light extraction efficiency.

[0100] For example, in at least one embodiment of the present disclosure, the light-emitting functional layers 220 of the light-emitting devices 200 in the same column (or group) are contacted and connected to form an integrated film layer, that is, the light-emitting functional layers 220 of each light-emitting device 200 in the same column (or group) are formed by one film formation.

[0101] For example, in at least one embodiment of the present disclosure, the first electrode 210 may be configured as an anode, and the second electrode 230 may be configured as a cathode.

[0102] In at least one embodiment of the present disclosure, the substrate 100 may include a substrate and a driving circuit layer located on the substrate, the driving circuit layer includes a plurality of pixel driving circuits located in the display area, and the display function layer is located on the driving circuit layer. For example, the pixel driving circuit may include a plurality of transistors TFT, capacitors, etc., for example, formed in various forms such as 2T1C (i.e., 2 transistors (TFT) and 1 capacitor (C)), 3T1C or 7T1C. The pixel driving circuit is connected to the light-emitting device 200 to control the switching state and light brightness of the light-emitting device 200.

[0103] In at least one embodiment of the present disclosure, Figure 2 , Figure 3A and Figure 3B As shown, the driving circuit layer of the substrate 100 includes a common electrode line 111. In each column of light emitting devices 200, at least one of the two light emitting devices 200 at both ends of the column has a second electrode 230 ( Figure 2The common electrode line 111 can directly supply power (e.g., negative voltage) to the light emitting devices 200 in each column without being connected to the common electrode line 111 through the first isolation structure 300a, so there is no need to consider the impedance problem caused by the poor connection between the light emitting device 200 and the first isolation structure 300a.

[0104] It should be noted that, when the technical solution of the present application is not adopted, the isolation structure 300 will be set as a grid structure, and the light-emitting devices 200 will be respectively located in the meshes of the grid structure. Therefore, the second electrodes 230 of two adjacent light-emitting devices 200 in each column will be spaced apart from each other, and the second electrodes 230 can only be connected to each other through the isolation structure 300.

[0105] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the display panel also includes a first encapsulation layer 410 located on the side of the isolation structure 300 and the light-emitting device 200 away from the substrate 100. The first encapsulation layer 410 includes encapsulation units 411 corresponding to the light-emitting devices 200 in different columns, respectively. The encapsulation units 411 cover the isolation openings 301, and the light-emitting devices 200 in the same column are covered by the same encapsulation unit 411. In the process of preparing the light-emitting devices 200 in batches based on the isolation structure 300, the encapsulation units 411 are formed synchronously with the corresponding light-emitting devices 200. After preparing each batch of light-emitting devices 200, the encapsulation units 411 can encapsulate and protect the light-emitting devices 200 that have been prepared in the process of preparing the next batch of light-emitting devices 200, so as to ensure the light-emitting effect of the light-emitting devices 200. In this way, in each isolation opening 301, the encapsulation unit 411 will appear as a continuous film layer structure.

[0106] For example, in the case where the light-emitting devices 200 are divided into multiple types that emit light of different colors, the light-emitting devices 200 that emit different lights are independently manufactured, but the film layer (evaporated film layer such as a light-emitting functional layer, etc.) in each light-emitting device 200 is evaporated on the entire surface of the display panel during evaporation. For example, the light-emitting devices 200 are classified into light-emitting devices that emit red light (R), green light (G), and blue light (B), respectively. During the preparation process, the light-emitting devices R, G, and B are prepared in sequence. When preparing the light-emitting device R, a light-emitting device R is formed in each isolation opening 301. A first encapsulation layer 410 is prepared on the display panel to cover the light-emitting device G. Then, the first encapsulation layer 410 in a portion of the isolation openings 301 (used to form the light-emitting devices G and B in the final product) and the second electrode and the light-emitting functional layer of the light-emitting device R are removed to obtain an encapsulation unit 411. During this process, the first encapsulation layer 410 is used to protect the light-emitting devices R in other isolation openings 301. Based on this method, the light-emitting devices G and B are prepared in sequence to finally form a light-emitting device such as the light-emitting device R shown in FIG. Figure 3A and Figure 3B The first encapsulation layer 410 shown, that is, the first encapsulation layer 410 on the entire display panel is prepared by multiple processes.

[0107] It should be noted that in the embodiments of the present disclosure, there is no restriction on the preparation order of the three types of light-emitting devices R, G, and B, and it can be designed according to the actual process requirements. For example, the preparation process can also be implemented based on the order of light-emitting devices B, G, and R.

[0108] The reason why the first encapsulation layer 410 is composed of a plurality of encapsulation units 411 is related to the principle that the light emitting device 200 is prepared based on the isolation structure 300. For details, please refer to the following FIG. 13A to FIG. 13I The relevant descriptions in the illustrated embodiments are not repeated here.

[0109] In at least one embodiment of the present disclosure, Figure 2 and Figure 3B As described above, the isolation structure 300 is provided in a plurality of strips, and at least two of the plurality of isolation structures 300 are second isolation structures 300b, and the extension direction (the direction of the X axis) of the second isolation structure 300b intersects with the extension direction (the direction of the Y axis) of the first isolation structure 300a, so as to be respectively connected to the ends of the first isolation structure 300a located on both sides of each column of light-emitting devices 200, so that the orthographic projection of the edge of the isolation opening 301 on the substrate 100 is a closed ring. In this way, each isolation structure 300 (the first isolation structure 300a and the second isolation structure 300b) encloses a closed isolation opening 301, thereby increasing the packaging thickness of the packaging unit 411 around the isolation opening 301, so as to improve the packaging effect of the light-emitting device 200.

[0110] It should be noted that if Figure 3A and Figure 3B As shown, at the side wall position of the first isolation structure 300a, the film thickness of the packaging unit 411 is limited and the shape is complex. If the second isolation structure 300b extending in a direction perpendicular to the column direction is not set, then at the end of the column, the first isolation structure 300a will appear as a fault, so that the deposition topography of the packaging unit 411 during film formation will suddenly change, resulting in poor continuity of the film layer. After the second isolation structure 300b extending in a direction perpendicular to the column direction is set, the fault problem can be eliminated, thereby facilitating the improvement of the continuity of the film layer of the packaging unit 411.

[0111] In at least one embodiment of the present disclosure, Figure 3A and Figure 3BAs shown, the edge of the packaging unit 411 extends to the side of the isolation structure 300 facing away from the substrate 100, and on the side of the isolation structure 300 facing away from the substrate 100, the edge of the packaging unit 411 is spaced from the isolation structure 300 to form a suspended portion 411a. In this way, the packaging unit 411 can have a larger size to ensure that the isolation opening 301 is completely covered during the preparation process of the display panel to protect the light-emitting device 200 therein.

[0112] It should be noted that, depending on the preparation process, the suspended portion 411a may appear suspended without being supported by other structures during the process of preparing the light-emitting device 200, or there may be a supporting structure between the suspended portion 411a and the isolation structure 300 to avoid breaking of the suspended portion 411a.

[0113] For example, in some embodiments of the present disclosure, during the process of manufacturing the light emitting device 200, there is an unfilled gap between the suspended portion 411a and the isolation structure 300. Specifically, Figure 4A and Figure 4B As shown, the display panel also includes a second encapsulation layer 420 covering the first encapsulation layer 410 and the isolation structure 300. The second encapsulation layer 420 is a planarization layer and fills at least part of the gap between the suspended portion 411a and the isolation structure 300. In the process of preparing the light-emitting device 200 and the encapsulation unit 411 by dry etching and wet etching, the edge of the encapsulation unit 411 will be suspended. By filling the gap below the suspended portion 411a with the second encapsulation layer 420, the suspended portion 411a of the encapsulation unit 411 can be supported to reduce the risk of damage to the edge of the encapsulation unit 411. The preparation process of preparing the light-emitting device 200 and the encapsulation unit 411 by dry etching and wet etching can be referred to the following. FIG. 13A to FIG. 13I The relevant descriptions in the relevant embodiments are not repeated here.

[0114] For example, the second encapsulation layer 420 may be formed by inkjet printing, thereby having a good leveling effect to obtain a relatively flat surface. Correspondingly, during this process, ink will fill the gap between the suspended portion 411 a and the isolation structure 300 .

[0115] In at least one embodiment of the present disclosure, Figure 4A and Figure 4B As shown, the display panel further includes a third encapsulation layer 430, and the second encapsulation layer 420 is located between the first encapsulation layer 410 and the third encapsulation layer 430. For example, the first encapsulation layer 410 and the third encapsulation layer 430 are both inorganic film layers, so as to have a high density to block the intrusion of water, oxygen, etc. from the outside, and the second encapsulation layer 420 is an organic film layer, so as to have good flatness and a certain flexibility to release stress.

[0116] For example, in some other embodiments of the present disclosure, the gap between the suspended portion 411a and the isolation structure 300 is always filled during the process of preparing the light emitting device 200. Specifically, Figure 5A and Figure 5B As shown, the display panel further includes a filling portion 440, and the filling portion 440 fills at least a portion of the gap between the suspended portion 411a and the isolation structure 300. In this way, the light-emitting device 200 and the encapsulation unit 411 can be prepared by dry etching to retain the filling portion 440 so as to support the suspended portion 411a of the encapsulation unit 411. In addition, this method can support the suspended portion 411a of the encapsulation unit 411 that has been formed in the preparation process of each batch of the light-emitting device 200 and the encapsulation unit 411, thereby further reducing the risk of damage to the edge of the encapsulation unit 411. The preparation process of the filling portion 440, the light-emitting device 200 and the encapsulation unit 411 by dry etching can be referred to the following FIG. 13A to FIG. 13I The relevant descriptions in the relevant embodiments are not repeated here.

[0117] In at least one embodiment of the present disclosure, Figure 5A and Figure 5B As shown, for the filling part 440 and the light-emitting device 200 corresponding to the same packaging unit 411, the filling part 440 is in the same layer and made of the same material as the light-emitting functional layer 220 and the second electrode 230 of the light-emitting device 200. In this way, the filling part 440 can be prepared simultaneously during the preparation of the light-emitting device 200 to simplify the preparation process of the display panel. In addition, this method can also form the suspended part 411a and the filling part 440 at the same time, so that the filling part 440 can support the suspended part 411a from beginning to end.

[0118] In at least one embodiment of the present disclosure, Figure 5A and Figure 5B As shown, the driving circuit layer of the substrate 100 may further include a plurality of signal lines 112, and the signal lines 112 are in the same layer and made of the same material as the common electrode lines 111. Since the signal lines 112 are arranged in the substrate 100, they may have a higher design thickness and conductivity. When the signal lines 112 are prepared at the same time as the common electrode lines 111, not only the preparation process of the display panel may be simplified, but also the voltage drop generated on the entire circuit when the light-emitting device 200 is driven may be reduced, thereby improving the display effect of the display panel and reducing power consumption.

[0119] For example, the substrate 100 further includes a planar layer 120 , which is located between the first electrode 210 and the signal line 112 . A via 101 is provided in the planar layer 120 , and the common electrode line 111 and the second electrode 230 are electrically connected through the via 101 .

[0120] For example, the signal line 112 may be a power line, a data line, or other types of signal lines.

[0121] For example, the signal line 112 and the common electrode line 111 include a first conductive layer, a second conductive layer and a third conductive layer stacked in sequence, and the first conductive layer and the third conductive layer are both connected to the second conductive layer, that is, there is no other film layer between the first conductive layer, the second conductive layer and the third conductive layer.

[0122] For example, the materials of the first conductive layer, the second conductive layer and the third conductive layer are molybdenum, aluminum, molybdenum, or titanium, aluminum, titanium. Aluminum has a low resistivity, so that the common electrode line 111 and the signal line 112 have high conductivity to reduce the voltage drop during driving, and molybdenum and titanium have strong corrosion resistance, so the second conductive layer formed by aluminum can be protected to reduce the risk of etching damage to the common electrode line 111 and the signal line 112.

[0123] In the embodiments of the present disclosure, when the isolation structure can play a role of partition, there is no restriction on the specific shape, material, etc. of the isolation structure, and it can be designed according to the actual process requirements. In the following, several configurations of the isolation structure are described.

[0124] In at least one embodiment of the present disclosure, Figure 5A and Figure 5B As shown, the isolation structure 300 includes a support portion 310 and a crown portion 320, the support portion 310 is located between the substrate 100 and the crown portion 320, and the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100, that is, the isolation structure 300 as a whole will appear to be wide at the top and narrow at the bottom, so that when some film layers in the light-emitting device 200 (such as the light-emitting functional layer 220) are evaporated, these film layers will be disconnected at the edge of the isolation structure 300 to reduce the risk of crosstalk between adjacent light-emitting devices 200.

[0125] In some embodiments of the present disclosure, the main structure of the isolation structure 300 may tend to be made of a conductive material to reduce the voltage when driving the second electrode 230. Figure 5A and Figure 5B As shown, the support portion 310 is a conductive structure, and the second electrode 230 is connected to the side wall of the support portion 310. The setting of the support portion 310 does not need to consider light transmission, so it can have a larger design thickness (greater than the second electrode 230), that is, the square resistance of the support portion 310 is less than the square resistance of the second electrode 230. In this solution, the support portion 310 can be connected to the second electrode 230 of the light-emitting device 200 to share a common potential, thereby reducing the voltage drop generated on the second electrode 230.

[0126] For example, Figure 5A and Figure 5B As shown, on the basis that the support portion 310 is a conductive structure, the crown portion 320 can also be further designed as a conductive structure, so that the voltage drop problem generated on the second electrode 230 when driving the light-emitting device 200 can be further reduced.

[0127] For example, in the case where the main structure of the isolation structure 300 may tend to be made of a conductive material, such as Figure 6 As shown, the isolation structure 300 further includes a bottom 340, the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the bottom 340 on the substrate 100, the bottom 340 is a conductive structure, and the second electrode 230 is connected to a portion of the surface of the bottom 340 that is away from the substrate 100 and is not covered by the support portion 310. Compared with the sidewall of the support portion 310, the second electrode 230 is more easily deposited on the surface area of ​​the bottom 340 that is away from the substrate 100, thereby reducing the impedance at the connection between the second electrode 230 and the isolation structure 300.

[0128] For example, the orthographic projection of the bottom 340 on the substrate 100 is located within the orthographic projection of the crown 320 on the substrate 100 , thereby ensuring the partition effect on part of the film layer (eg, the light-emitting functional layer 220 ) of the light-emitting device 200 .

[0129] For example, Figure 6 As shown, the bottom 340, the support portion 310 and the crown 320 can be made of molybdenum, aluminum and titanium in sequence, and the corrosion resistance of aluminum, molybdenum and titanium increases in sequence, so as to form a Figure 6 An isolation structure 300 is shown.

[0130] In at least one embodiment of the present disclosure, Figure 6 As shown, in the case where the support portion 310 is a conductive structure, the display panel further includes a pixel defining layer 330, which is located between the isolation structure 300 and the substrate 100 and defines a plurality of pixel openings 302 corresponding to the light-emitting devices 200, respectively, the pixel openings 302 are connected to the isolation openings 301, and portions of the light-emitting functional layer 220 and the second electrode 230 of the light-emitting device 200 are located in the pixel openings 302. The pixel defining layer 330 can separate the conductive isolation structure 300 and the first electrode 210 of the light-emitting device 200, so that the gap of the light-emitting device 200 can have a smaller design size, so as to increase the pixel density PPI of the display panel.

[0131] In at least one embodiment of the present disclosure, Figure 6As shown, when the main structure of the isolation structure 300 can be prepared with conductive materials, the pixel defining layer 330 is an inorganic film layer. In the process of preparing the light-emitting device 200 based on the isolation structure 300, the pixel defining layer 330 does not need a high thickness to accommodate the light-emitting device 200, which is conducive to the thin and light design of the display panel; in addition, the pixel defining layer 330 as an inorganic film layer can have a high bonding strength with the isolation structure 300 and the first electrode 210 to reduce the risk of the isolation structure 300 and the first electrode 210 falling off; in addition, the inorganic film layer has a high density, which can more effectively block the intrusion of water, oxygen, etc., thereby improving the packaging effect of the display panel.

[0132] Alternatively, in the case where the main structure of the isolation structure 300 may tend to be made of a conductive material, such as Figure 6 As shown, the edge of the first electrode 210 is located between the pixel defining layer 330 and the substrate 100, and the orthographic projection of the pixel opening 302 on the substrate 100 is located within the orthographic projection of the first electrode 210 on the substrate 100. In this way, the alignment accuracy problem of the first electrode 210 and the pixel opening 302 caused by process errors can be eliminated in the actual process, thereby ensuring the effective light-emitting area of ​​the light-emitting device 200.

[0133] In some other embodiments of the present disclosure, the isolation structure 300 may be configured as an insulating structure. Fig. 7A and Figure 7B As shown, the support portion 310 and the crown portion 320 are insulating structures, and the orthographic projection of the gap between the first electrodes 210 of the adjacent light-emitting devices 200 located in different columns on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. In this way, the gap size between the light-emitting areas of the adjacent light-emitting devices 200 is no longer limited by the spacing distance between the isolation structure 300 and the first electrodes 210 of the light-emitting devices 200, so that the display panel can have a higher pixel density PPI.

[0134] For example, the material of the support portion 310 includes silicon nitride, and the material of the crown portion 320 includes silicon oxide. Silicon nitride is easier to etch than silicon oxide, so it is convenient to form Fig. 7A and Figure 7B An isolation structure 300 is shown.

[0135] In at least one embodiment of the present disclosure, when the support portion 310 and the crown portion 320 are insulating structures, as shown in FIG. Fig. 7A and Figure 7BAs shown, the display panel further includes a pixel defining layer 330, which is located between the first isolation structure 300a and the substrate 100, and defines a plurality of clearance openings 303 and a plurality of pixel openings 302 respectively corresponding to the light-emitting devices 200, the first isolation structure 300a is located in the clearance openings 303, the pixel openings 302 are connected to the isolation openings 301, and parts of the light-emitting functional layer 220 and the second electrode 230 of the light-emitting device 200 are located in the pixel openings 302. The setting of the clearance openings 303 can reduce the setting height of the isolation structure 300, so as to reduce the influence of the isolation structure 300 on the light-emitting angle of the light-emitting device 200, thereby improving the viewing angle of the display panel.

[0136] In at least one embodiment of the present disclosure, when the support portion 310 and the crown portion 320 are insulating structures, as shown in FIG. Figure 8 , Fig.9A and Fig. 9B As shown, the display panel further includes an auxiliary electrode 240, which is located on the side of the isolation structure 300 away from the substrate 100 and connected to the second electrode 230, and the orthographic projection of the auxiliary electrode 240 on the substrate 100 is located within the orthographic projection of the gap of the light-emitting device 200 on the substrate 100. The auxiliary electrode 240 is connected in parallel with the second electrode 230 of the light-emitting device 200, thereby reducing the voltage drop generated on the second electrode 230 when the light-emitting device 200 is driven, so as to improve the display effect of the display panel while reducing power consumption, and enable the display panel to be applied to medium and large sizes.

[0137] In at least one embodiment of the present disclosure, Figure 8 , Fig.9A and Fig. 9B As shown, the orthographic projection of at least part of the auxiliary electrode 240 on the substrate 100 coincides with the orthographic projection of the first isolation structure 300a on the substrate 100, or the orthographic projection of at least part of the auxiliary electrode 240 on the substrate 100 is located at the location of the orthographic projection of the first isolation structure 300a on the substrate 100. For example, when the orthographic projection of the first isolation structure 300a on the substrate 100 is located within the orthographic projection of the gap between the adjacent light-emitting devices 200 on the substrate 100, the orthographic projection of at least part of the auxiliary electrode 240 on the substrate 100 is located within the orthographic projection of the first isolation structure 300a on the substrate 100. In this way, because the auxiliary electrode 240 is mainly distributed in the gap between the light-emitting devices 200, it is not necessary to consider the transmittance to have a higher thickness, and the auxiliary electrode 240 is not limited by the material, so a material with high conductivity can be selected to have a smaller square resistance, thereby further reducing the voltage drop generated on the second electrode 230 when the light-emitting device 200 is driven.

[0138] In at least one embodiment of the present disclosure, Figure 8 , Fig.9A and Fig. 9B As shown, part of the auxiliary electrode 240 (eg Figure 8 The extending direction of the auxiliary electrode 240 (the portion extending along the X-axis) intersects with the extending direction of the first isolation structure 300a, so as to connect the second electrodes 230 of the light emitting devices 200 of each column in parallel.

[0139] In at least one embodiment of the present disclosure, the width of the isolation structure 300 may be 1 to 20 micrometers, so as to have a sufficient size for disposing the auxiliary electrode 240 .

[0140] For example, the auxiliary electrode 240 includes a first auxiliary conductive layer, a second auxiliary conductive layer, and a third auxiliary conductive layer stacked in sequence. For example, the materials of the first auxiliary conductive layer, the second auxiliary conductive layer, and the third auxiliary conductive layer are molybdenum, aluminum, and molybdenum, or titanium, aluminum, and titanium, etc. Aluminum has a low resistivity, so that the auxiliary electrode 240 has a high conductivity to reduce the voltage drop during driving, and molybdenum and titanium have strong corrosion resistance, so that the second conductive layer formed by aluminum can be protected to reduce the risk of the auxiliary electrode 240 being damaged by etching.

[0141] In at least one embodiment of the present disclosure, Figure 8 , Fig.9A and Fig. 9B As shown, at least part of the auxiliary electrode 240 is located at the gap between adjacent encapsulation units 411. For example, at least part of the auxiliary electrode 240 is located on a side of the encapsulation unit 411 away from the substrate 100. In this way, the auxiliary electrode 240 can be prepared after the light-emitting device 200 and the first encapsulation layer 410 are prepared. Therefore, the provision of the auxiliary electrode 240 will not affect the preparation process of the light-emitting device 200 and the first encapsulation layer 410.

[0142] For example, the packaging unit 411 includes a packaging opening 102 , the orthographic projection of the packaging opening 102 on the substrate 100 is located in the same column and the gap between adjacent light-emitting devices 200 is within the orthographic projection on the substrate 100 , and the auxiliary electrode 240 is connected to the second electrode 230 of the light-emitting device 200 through the packaging opening 102 .

[0143] For example, after the first encapsulation layer 410 and all the light-emitting devices 200 are prepared, a patterning process is performed on the encapsulation unit 411 of the first encapsulation layer 410 to form an encapsulation opening 102 exposing the second electrode 230 in the encapsulation unit 411 .

[0144] In the embodiments of the present disclosure, there is no restriction on the planar shape of the first isolation structure, which can be set according to the pixel arrangement of the display panel. Below, several pixel arrangements of the display panel and the corresponding planar shape of the first isolation structure are respectively described through different embodiments.

[0145] In at least one embodiment of the present disclosure, it is possible to refer to Figure 2 The light emitting devices 200 are arranged into multiple columns (L1-L5) and classified into multiple first-type light emitting devices G, multiple second-type light emitting devices R and multiple third-type light emitting devices B. The light emitting colors of the first-type light emitting devices G, the second-type light emitting devices R and the third-type light emitting devices B are different.

[0146] In at least one embodiment of the present disclosure, it is possible to refer to Figure 2 , along the direction (X-axis direction) perpendicular to the column direction (Y-axis direction), the column where the first type of light-emitting devices G are located, the column where the second type of light-emitting devices R are located, and the column where the third type of light-emitting devices B are located are repeatedly arranged in sequence.

[0147] In some embodiments of the present disclosure, it can be referred to again Figure 2 The light emitting devices 200 are arranged in a matrix of multiple rows and columns, and in each row, the first type of light emitting devices G, the second type of light emitting devices R and the third type of light emitting devices B are arranged repeatedly in sequence. Thus, the orthographic projection of each first isolation structure 300a on the substrate is in the shape of a straight line segment.

[0148] In other embodiments of the present disclosure, Fig.10 As shown, for the adjacent columns of the second type light emitting devices R and the third type light emitting devices B, the second type light emitting devices R and the third type light emitting devices B are arranged alternately along the column direction and the direction perpendicular to the column. In this way, the orthographic projection of the first isolation structure 300a on the substrate is in the shape of a broken line segment.

[0149] For example, the first type of light-emitting devices G, the second type of light-emitting devices R and the third type of light-emitting devices B are arranged in multiple rows and columns, the second type of light-emitting devices R and the third type of light-emitting devices B that are adjacent and located in different columns are located in different rows, and the first type of light-emitting devices G that are adjacent and located in the same column are arranged in the same row with the second type of light-emitting devices R and the third type of light-emitting devices B that are adjacent and located in different columns, so that the number of the first type of light-emitting devices G, the second type of light-emitting devices R and the third type of light-emitting devices B is approximately 1:1:1.

[0150] In some embodiments of the present disclosure, Fig.11 As shown, the adjacent columns of the second type light emitting devices R and the third type light emitting devices B overlap, and the second type light emitting devices R and the third type light emitting devices B in adjacent columns are arranged alternately along the column direction. In this way, the orthographic projection of the first isolation structure 300a on the substrate is in the shape of a broken line segment.

[0151] For example, the first type of light-emitting devices G, the second type of light-emitting devices R and the third type of light-emitting devices B are arranged in multiple rows and columns, the second type of light-emitting devices R and the third type of light-emitting devices B adjacent to each other and located in the same column are located in different rows, and the first type of light-emitting devices G adjacent to each other in the same column are arranged in the same row with the second type of light-emitting devices R and the third type of light-emitting devices B adjacent to each other and located in the same column, so that the number of the first type of light-emitting devices G, the second type of light-emitting devices R and the third type of light-emitting devices B is approximately 1:1:1.

[0152] In at least one embodiment of the present disclosure, the light emission wavelengths of the second type light emitting device, the first type light emitting device and the third type light emitting device decrease sequentially. For example, the second type light emitting device, the first type light emitting device and the third type light emitting device emit red light, green light and blue light sequentially.

[0153] At least one embodiment of the present disclosure provides a method for preparing a display panel, such as Fig. 12A As shown, the preparation method may include the following steps S100 and S200.

[0154] S100 , providing a substrate and forming at least one isolation structure on the substrate, wherein the isolation structure defines a plurality of isolation openings.

[0155] S200, preparing a plurality of light-emitting devices based on the isolation structure, wherein the plurality of light-emitting devices are arranged into a plurality of groups, and the light-emitting devices in the same group have the same light emission color and are formed in the same isolation opening.

[0156] In the preparation method shown in steps S100 and S200, while the light-emitting devices are prepared in batches based on the isolation structure, the ends of the columns where the light-emitting devices are located are not restricted by the isolation structure, so that they can be directly connected to the external circuit (for example, the common electrode line described below), so as to reduce the risk of excessive driving impedance caused by poor connection between the light-emitting devices and the isolation structure. Regarding the structure of the display panel obtained in the above steps S100 and S200, the technical problems solved and the corresponding technical effects, further improvements, etc., please refer to the relevant descriptions in the above embodiments, and no further description will be given here.

[0157] In the method for preparing a display panel provided by at least one embodiment of the present disclosure, Fig. 12B As shown, the steps in the above step S200 regarding preparing the light emitting device 200 based on the isolation structure 300 may include the following steps S210 to S260.

[0158] S210 , before forming the isolation structure, forming a plurality of first electrodes spaced apart from each other on a substrate, wherein each isolation opening exposes the plurality of first electrodes.

[0159] S220, after forming the isolation structure, forming a light-emitting functional material film layer, a conductive material film layer and a packaging material film layer covering the isolation opening and the isolation structure.

[0160] S230, forming a photoresist layer on the packaging material film layer, and exposing and developing the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening.

[0161] S240, etching the light-emitting functional material film layer, the conductive material film layer and the packaging material film layer based on the photoresist pattern, the remaining part of the light-emitting functional material film layer is formed as a light-emitting functional layer, the remaining part of the conductive material film layer is formed as a second electrode, the remaining part of the packaging material film layer is formed as a packaging unit, the light-emitting functional layer, the first electrode and the second electrode in the isolation opening covered with the photoresist pattern constitute a light-emitting device, wherein a plurality of light-emitting devices emitting the same color are formed in each isolation opening covered with the photoresist pattern, the second electrodes of the light-emitting devices in the same isolation opening are contacted and connected to form an integrated film layer, and the light-emitting functional layers of the light-emitting devices in the same isolation opening are contacted and connected to form an integrated film layer.

[0162] S250, removing the remaining photoresist pattern.

[0163] S260, repeating the above steps to form a light-emitting device that emits light of other colors in the isolation opening where no light-emitting device is formed, and forming a packaging unit on the light-emitting device, and all the packaging units constitute a first packaging layer.

[0164] Regarding the structure of the display panel obtained in the above steps S210 to S260, the technical problems solved and the corresponding technical effects, further improvements, etc., please refer to the relevant descriptions in the above embodiments, and no further details will be given here.

[0165] In at least one embodiment of the present disclosure, Fig. 12C As shown, the preparation method may further include the following steps S270 to S290.

[0166] S270, after forming the light-emitting device and the first packaging layer, performing a composition process on the first packaging layer to form a packaging opening in the packaging unit, wherein the orthographic projection of the packaging opening on the substrate is located in the same column and the gap between adjacent light-emitting devices is within the orthographic projection on the substrate.

[0167] S280 , forming an auxiliary conductive material film layer covering the package opening, the isolation structure and the first package layer.

[0168] S290, performing a patterning process on the auxiliary conductive material film layer to form an auxiliary electrode, wherein the auxiliary electrode is connected to the second electrode of the light-emitting device through the package opening.

[0169] Regarding the structure of the display panel obtained in the above steps S270 to S290, the technical problems solved and the corresponding technical effects, further improvements, etc., please refer to the relevant descriptions in the above embodiments and will not be elaborated here.

[0170] Next, combine FIG. 13A to FIG. 13I right Figure 3A The preparation process of the display panel shown is described to intuitively demonstrate the principle that the first isolation structure can increase the pixel arrangement density PPI.

[0171] like Fig.13A As shown, a substrate 100 is provided and first electrodes 210 arranged in an array are formed on the substrate 100 .

[0172] like Fig. 13B As shown, a pixel defining material layer 330 a is deposited on the substrate 100 on which the first electrode 210 is formed.

[0173] like Fig. 13C As shown, a first material layer 310a and a second material layer 320a are formed on the pixel defining material layer 330a. For example, the material of the first material layer 310a may be aluminum, and the material of the second material layer 320a may be titanium. It should be noted that, in the case where the isolation structure to be formed is an insulating structure, the first material layer 310a and the second material layer 320a may both be insulating materials, for example, the material of the first material layer 310a may be silicon nitride, and the material of the second material layer 320a may be silicon oxide.

[0174] like Fig.13D As shown, the first material layer 310a and the second material layer 320a are patterned so that the first material layer 310a is formed into a support portion 310, and the second material layer 320a is formed into a crown portion 320. The support portion 310 and the crown portion 320 define isolation openings 301 and constitute an isolation structure 300, and each isolation opening 301 corresponds to a plurality of first electrodes 210. The specific structure of the isolation structure 300 can refer to the relevant description in the aforementioned embodiment, and will not be repeated here.

[0175] In an embodiment of the present disclosure, the patterning process may be a photolithography patterning process, which may include, for example, coating a photoresist on a structure layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structure layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that, in the case where the material of the structure layer (such as the photoresist pattern 500 described below) includes photoresist, the structure layer may be directly exposed through a mask to form a desired pattern.

[0176] It should be noted that if the corrosion resistance of the second material layer 320a (such as titanium) is greater than that of the first material layer 310a (such as aluminum), the etching rate of the first material layer 310a will be greater than the etching rate of the second material layer 320a, so that the width of the crown portion 320 will be greater than the width of the support portion 310, so as to form Fig.13D The structure shown.

[0177] like Fig.13E As shown, the pixel defining material layer 330 a is patterned to form a pixel opening 302 at a location where the partial isolation opening 301 is located, and the pixel defining material layer 330 a is formed into a pixel defining layer 330 (not in a final form).

[0178] It should be noted that in Fig.13E In the steps shown, a photolithography patterning process may be used to form the pixel opening 302 . In this process, the isolation structure 300 may also be used to expose the photoresist, so as to accurately control the formation position of the pixel opening 302 .

[0179] like Fig.13F As shown, a light-emitting functional layer 220 and a second electrode 230 are evaporated on the substrate 100 to form a plurality of light-emitting devices 200 in each isolation opening 301 of the isolation structure 300. No mask plate is used in the evaporation process, so the evaporated material is also deposited on the crown 320. It should be noted that in the actual process, the evaporated material is deposited on the upper surface of the crown 320 away from the substrate 100 and the side wall (not shown in the figure) to form a filling material layer 440a; and then a first encapsulation film 410a is deposited to cover the light-emitting device 200 and the isolation structure 300.

[0180] It should be noted that at a position where an isolation opening 301 is formed but a pixel opening 302 is not formed, the light-emitting functional layer 220 and the first electrode 210 are spaced apart, so the light-emitting functional layer 220 and the first electrode 210 of the light-emitting device 200 at this position are separated from each other and thus have no light-emitting function.

[0181] like Figure 13G As shown, a photoresist is formed (e.g., coated) on the substrate 100 formed with the first encapsulation film 410a, and then patterned to form a photoresist pattern 500, which only covers a portion of the isolation opening 301 of the isolation structure 300 (the isolation opening 301 corresponding to the pixel opening 302).

[0182] like Fig.13HAs shown, the surface of the display panel is etched using the photoresist pattern 500 as a mask to remove the first encapsulation film 410a, the second electrode 230 and the light-emitting functional layer 220 that are not covered by the photoresist pattern 500, and the remaining part of the first encapsulation film 410a forms the encapsulation unit 411 of the first encapsulation layer 410; then the remaining photoresist pattern 500 is removed.

[0183] It should be noted that the first encapsulation film 410a can be dry-etched, and the second electrode 230 and the light-emitting functional layer 220 can be wet-etched to remove the filling material layer 440a between the first encapsulation film 410a and the isolation structure 300; or, the first encapsulation film 410a, the second electrode 230 and the light-emitting functional layer 220 can be dry-etched to form a portion of the filling material layer 440a covered by the photoresist pattern 500. Figure 5A The filling portion 440 is shown.

[0184] like Fig.13I As shown, the pixel definition layer 330 is patterned to form a pixel opening 302 at a location where another portion of the isolation opening 301 is located (where the pixel opening 302 is not formed).

[0185] Repeat the above FIG. 13E to FIG. 13H The steps are as follows, so as to form a light emitting device 200 emitting green light and a light emitting device 200 emitting blue light in the other isolation openings 301, and form Figure 3A The display panel shown.

[0186] It should be noted that in the embodiments of the present disclosure, the above FIG. 13A to FIG. 13H In the process shown, the pixel openings 302 may be prepared not in batches along with the light-emitting device 200 , but all the pixel openings may be prepared at one time before preparing the light-emitting device 200 , as described below.

[0187] like Fig.14A As shown in the above Fig.13D After the structure shown in FIG. 1 is formed, the pixel defining material layer 330 a is patterned to form pixel openings 302 at the locations of all the isolation openings 301 , and the pixel defining material layer 330 a is formed into a pixel defining layer 330 .

[0188] like Fig. 14BAs shown, a light-emitting functional layer 220 and a second electrode 230 are evaporated on the substrate 100 to form a plurality of light-emitting devices 200 in each isolation opening 301 of the isolation structure 300. No mask plate is used in the evaporation process, so the evaporated material is also deposited on the crown 320. It should be noted that in the actual process, the evaporated material is deposited on the upper surface of the crown 320 away from the substrate 100 and the side wall (not shown in the figure) to form a filling material layer 440a; and then a first encapsulation film 410a is deposited to cover the light-emitting device 200 and the isolation structure 300.

[0189] like Fig. 14C As shown, a photoresist is formed (e.g., coated) on the substrate 100 formed with the first encapsulation film 410a, and then patterned to form a photoresist pattern 500, which only covers a portion of the isolation opening 301 of the isolation structure 300 (the isolation opening 301 corresponding to the pixel opening 302).

[0190] exist Fig. 14C Based on the structure shown in FIG. 1 , the surface of the display panel is etched using the photoresist pattern 500 as a mask to remove the first encapsulation film 410a, the second electrode 230 and the light-emitting functional layer 220 that are not covered by the photoresist pattern 500. The remaining portion of the first encapsulation film 410a forms the encapsulation unit 411 of the first encapsulation layer 410. Then, the remaining photoresist pattern 500 is removed. After performing this step, the following is obtained: Fig.13I The structure shown.

[0191] The above process is repeatedly performed to form a light emitting device 200 emitting green light and a light emitting device 200 emitting blue light in other isolation openings 301 and pixel openings 302, respectively, and to form a light emitting device 200 emitting green light and a light emitting device 200 emitting blue light. Figure 3A The display panel shown.

[0192] like Fig.15 As shown, when the light-emitting functional layer (for example, the first functional layer) is evaporated, if the evaporation source P moves to face the isolation structure 300, the boundary of the evaporation angle corresponds to the line L1 and the line L2 on the display panel, that is, the area before the line L1 and the line L2 will not be evaporated in this case, and the area on the side of the line L1 and the line L2 away from the isolation structure 300 will be evaporated no matter where the evaporation source P moves. That is, starting from the line L1 or the line L2 area, the closer to the isolation structure 300, the smaller the thickness of the light-emitting functional layer. Similarly, the second electrode can also be formed based on evaporation. Therefore, the closer to the isolation structure 300, the smaller the thickness of the second electrode.

[0193] At least one embodiment of the present disclosure provides a display device, which includes the display panel mentioned in any of the above embodiments or the display panel obtained by the preparation method mentioned in any of the above embodiments. For example, the display device can be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, etc.

[0194] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, etc. made within the spirit and principles of this specification should be included in the protection scope of this specification.

Claims

1. A display panel, characterized in that: include: substrate; A plurality of light-emitting devices are located on one side of the substrate and arranged in a plurality of groups, wherein at least two light-emitting devices are arranged in each group, and the light-emitting devices in the same group have the same light-emitting color; At least one isolation structure is located on one side of the substrate and defines a plurality of isolation openings, wherein the light emitting devices of the same group are located in the same isolation opening.

2. The display panel according to claim 1, characterized in that: The light emitting device comprises a first electrode, a light emitting functional layer and a second electrode which are sequentially stacked on the substrate, and The second electrodes of the light emitting devices in the same group are contact-connected to form an integrated film layer; Preferably, the first electrodes of the light emitting devices in the same group are spaced apart from each other; Preferably, the light-emitting functional layers of the light-emitting devices in the same group are contact-connected to form an integrated film layer.

3. The display panel according to claim 2, characterized in that: The light emitting devices are arranged in a plurality of columns, and the light emitting devices in each group are arranged in one column. The at least one isolation structure includes at least one first isolation structure, and the first isolation structure is located between the columns to separate the light emitting devices in different columns. Preferably, the substrate comprises a common electrode line, and in each column of the light emitting devices, the second electrode of at least one of the two light emitting devices located at both ends of the column is connected to the common electrode line.

4. The display panel according to claim 3, characterized in that: It also includes a first encapsulation layer located on a side of the isolation structure and the light-emitting device away from the substrate, wherein: The first encapsulation layer includes encapsulation units corresponding to the light-emitting devices in different columns, respectively, the encapsulation units cover the isolation openings, and the light-emitting devices in the same column are covered by the same encapsulation unit.

5. The display panel according to claim 4, characterized in that: The isolation structure is arranged in a plurality of strips, and the plurality of isolation structures include at least two second isolation structures, and the extension direction of the second isolation structure intersects with the extension direction of the first isolation structure so as to be respectively connected to the ends of the first isolation structure, so that the positive projection of the edge of the isolation opening on the substrate is a closed ring.

6. The display panel according to claim 4, characterized in that: The edge of the packaging unit extends to a side of the isolation structure away from the substrate, and On a side of the isolation structure away from the substrate, an edge portion of the packaging unit is spaced apart from the isolation structure to form a suspended portion; Preferably, the display panel further comprises a second encapsulation layer covering the first encapsulation layer and the isolation structure, wherein the second encapsulation layer is a planarization layer and fills at least a portion of a gap between the suspended portion and the isolation structure; or The display panel also includes a filling portion, which fills at least a portion of the gap between the suspended portion and the isolation structure. Further preferably, for the filling portion and the light-emitting device corresponding to the same packaging unit, the filling portion is in the same layer and made of the same material as the light-emitting functional layer and the second electrode of the light-emitting device.

7. The display panel according to any one of claims 3 to 6, characterized in that: The substrate further comprises a plurality of signal lines which are in the same layer and made of the same material as the common electrode lines; Preferably, the substrate further comprises a flat layer, the flat layer is located between the first electrode and the signal line, a via hole is provided in the flat layer, and the common electrode line and the second electrode are connected through the via hole; Preferably, the signal line includes a power line or a data line; Preferably, the signal line and the common electrode line include a first conductive layer, a second conductive layer and a third conductive layer stacked in sequence, and the first conductive layer and the third conductive layer are both connected to the second conductive layer. Further preferably, the materials of the first conductive layer, the second conductive layer and the third conductive layer are molybdenum, aluminum, molybdenum, or titanium, aluminum, titanium, respectively.

8. The display panel according to claim 3, characterized in that: The isolation structure includes a support portion and a crown portion, wherein the support portion is located between the substrate and the crown portion, and an orthographic projection of the support portion on the substrate is located within an orthographic projection of the crown portion on the substrate.

9. The display panel according to claim 8, characterized in that: The support portion is a conductive structure, and the second electrode is connected to a side wall of the support portion; Preferably, the crown is a conductive structure; Preferably, the isolation structure further comprises a bottom, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the bottom on the substrate, the bottom is a conductive structure, and the second electrode is connected to a portion of a surface of the bottom facing away from the substrate that is not covered by the support portion; Preferably, the orthographic projection of the bottom portion on the substrate is located within the orthographic projection of the crown portion on the substrate.

10. The display panel according to claim 8, characterized in that: Also included is a pixel defining layer, wherein the pixel defining layer is located between the isolation structure and the substrate and defines a plurality of pixel openings corresponding to the light emitting devices respectively, and The pixel opening is connected to the isolation opening, and the light-emitting function layer of the light-emitting device and a portion of the second electrode are located in the pixel opening; Preferably, the pixel defining layer is an inorganic film layer; Preferably, an edge of the first electrode is located between the pixel defining layer and the substrate, and an orthographic projection of the pixel opening on the substrate is located within an orthographic projection of the first electrode on the substrate.

11. The display panel according to claim 8, characterized in that: The support portion and the crown portion are insulating structures, and the orthographic projection of the gap between the first electrodes of the light-emitting devices that are adjacent and located in different columns on the substrate is located within the orthographic projection of the first isolation structure on the substrate; Preferably, the material of the support portion includes silicon nitride; Preferably, the material of the crown comprises silicon oxide.

12. The display panel according to claim 11, characterized in that: Also included is a pixel defining layer, wherein the pixel defining layer is located between the isolation structure and the substrate and defines a plurality of clearance openings and a plurality of pixel openings corresponding to the light emitting devices respectively, and The first isolation structure is located in the clearance opening, the pixel opening is connected to the isolation opening, and the light emitting function layer of the light emitting device and a portion of the second electrode are located in the pixel opening.

13. The display panel according to claim 11, characterized in that: Also included is an auxiliary electrode, wherein the auxiliary electrode is located on a side of the isolation structure away from the substrate and connected to the second electrode, and the orthographic projection of the auxiliary electrode on the substrate is located at the orthographic projection of the gap between adjacent light-emitting devices on the substrate; Preferably, the orthographic projection of at least part of the auxiliary electrode on the substrate coincides with the orthographic projection of the isolation structure on the substrate, or at least part of the auxiliary electrode is located within the orthographic projection of the isolation structure on the substrate; Further preferably, the extension direction of the auxiliary electrode portion intersects with the extension direction of the first isolation structure, so as to connect the second electrodes of the light emitting devices in each column in parallel; Preferably, the auxiliary electrode comprises a first auxiliary conductive layer, a second auxiliary conductive layer and a third auxiliary conductive layer stacked in sequence; Further preferably, the materials of the first auxiliary conductive layer, the second auxiliary conductive layer and the third auxiliary conductive layer are molybdenum, aluminum, molybdenum, or titanium, aluminum, titanium, respectively.

14. The display panel according to claim 13, characterized in that: It also includes a first encapsulation layer located on a side of the isolation structure and the light-emitting device away from the substrate, wherein: The first encapsulation layer comprises encapsulation units respectively corresponding to the light-emitting devices in different columns, and at least a portion of the auxiliary electrode is located at a gap between adjacent encapsulation units; Preferably, at least a portion of the auxiliary electrode is located on a side of the packaging unit away from the substrate; Preferably, the packaging unit includes a packaging opening, the orthographic projection of the packaging opening on the substrate is located in the same column and the gap between adjacent light-emitting devices is within the orthographic projection on the substrate, and the auxiliary electrode is connected to the second electrode of the light-emitting device through the packaging opening.

15. The display panel according to any one of claims 3 to 6, characterized in that: The light emitting devices are arranged in multiple columns and classified into multiple first-category light emitting devices, multiple second-category light emitting devices, and multiple third-category light emitting devices, and the first-category light emitting devices, the second-category light emitting devices, and the third-category light emitting devices have different light emission colors; Preferably, along a direction perpendicular to the direction of the columns, the column where the first type of light emitting devices are located, the column where the second type of light emitting devices are located, and the column where the third type of light emitting devices are located are repeatedly arranged in sequence.

16. The display panel according to claim 15, characterized in that: The light-emitting devices are arranged in a matrix of multiple rows and columns, and in each row, the first type of light-emitting devices, the second type of light-emitting devices and the third type of light-emitting devices are repeatedly arranged in sequence; Preferably, the orthographic projection of the first isolation structure on the substrate is in the shape of a straight line segment parallel to the extension direction of the column; Preferably, the light emission wavelengths of the second type of light emitting devices, the first type of light emitting devices and the third type of light emitting devices decrease in sequence.

17. The display panel according to claim 15, characterized in that: For the adjacent columns where the second type of light emitting devices are located and the adjacent columns where the third type of light emitting devices are located, the second type of light emitting devices and the third type of light emitting devices are alternately arranged along the column direction and in a direction perpendicular to the column; Preferably, the first type of light emitting devices, the second type of light emitting devices and the third type of light emitting devices are arranged in multiple rows and multiple columns, the second type of light emitting devices and the third type of light emitting devices adjacent to each other and located in different columns are located in different rows, and the first type of light emitting devices adjacent to each other and located in the same column are arranged in the same row with the second type of light emitting devices and the third type of light emitting devices adjacent to each other and located in different columns; Preferably, the orthographic projection of the first isolation structure on the substrate is in the shape of a broken line segment parallel to the extension direction of the column; Preferably, the light emission wavelengths of the second type of light emitting devices, the first type of light emitting devices and the third type of light emitting devices decrease in sequence.

18. The display panel according to claim 15, characterized in that: The adjacent columns where the second-type light-emitting devices are located overlap with the columns where the third-type light-emitting devices are located, and the second-type light-emitting devices and the third-type light-emitting devices in adjacent columns are alternately arranged along the column direction; Preferably, the first type of light emitting devices, the second type of light emitting devices and the third type of light emitting devices are arranged in multiple rows and multiple columns, the second type of light emitting devices and the third type of light emitting devices adjacent to each other and located in the same column are located in different rows, and the first type of light emitting devices adjacent to each other and located in the same column are arranged in the same row as the second type of light emitting devices and the third type of light emitting devices adjacent to each other and located in the same column; Preferably, the orthographic projection of the first isolation structure on the substrate is in the shape of a broken line segment parallel to the extension direction of the column; Preferably, the light emission wavelengths of the second type of light emitting devices, the first type of light emitting devices and the third type of light emitting devices decrease in sequence.

19. A method for preparing a display panel, characterized in that: include: Providing a substrate and forming at least one isolation structure on the substrate, wherein the isolation structure defines a plurality of isolation openings; A plurality of light-emitting devices are prepared based on the isolation structure, wherein the plurality of light-emitting devices are arranged into a plurality of groups, and the light-emitting devices in the same group have the same light-emitting color and are formed in the same isolation opening.

20. The preparation method according to claim 19, characterized in that: The preparing a plurality of light-emitting devices based on the isolation structure comprises: Before forming the isolation structure, forming a plurality of first electrodes spaced apart from each other on the substrate, wherein each of the isolation openings exposes a plurality of the first electrodes; After forming the isolation structure, forming a light-emitting functional material film layer, a conductive material film layer and a packaging material film layer covering the isolation opening and the isolation structure; forming a photoresist layer on the packaging material film layer, and exposing and developing the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening; The light-emitting functional material film layer, the conductive material film layer and the packaging material film layer are etched based on the photoresist pattern, the remaining part of the light-emitting functional material film layer is formed as a light-emitting functional layer, the remaining part of the conductive material film layer is formed as a second electrode, the remaining part of the packaging material film layer is formed as a packaging unit, the light-emitting functional layer, the first electrode and the second electrode in the isolation opening covered with the photoresist pattern constitute the light-emitting device, wherein a plurality of light-emitting devices emitting the same color are formed in each of the isolation openings covered with the photoresist pattern, the second electrodes of the respective light-emitting devices in the same isolation opening are contact-connected to form an integrated film layer, and the light-emitting functional layers of the respective light-emitting devices in the same isolation opening are contact-connected to form an integrated film layer; removing the remaining photoresist pattern; Repeat the above steps to form the light emitting device emitting light of other colors in the isolation opening where the light emitting device is not formed, and form the packaging unit on the light emitting device, and all the packaging units constitute a first packaging layer.

21. The preparation method according to claim 20, characterized in that: Also includes: After forming the light-emitting device and the first encapsulation layer, patterning the first encapsulation layer to form an encapsulation opening in the encapsulation unit, wherein the orthographic projection of the encapsulation opening on the substrate is located in the same column and the gap between adjacent light-emitting devices is within the orthographic projection on the substrate; forming an auxiliary conductive material film layer covering the packaging opening, the isolation structure and the first packaging layer; The auxiliary conductive material film layer is patterned to form an auxiliary electrode, wherein the auxiliary electrode is connected to the second electrode of the light emitting device through the packaging opening.

22. A display device, characterized in that: A display panel comprising any one of claims 1 to 18 or a display panel obtained by any one of claims 19 to 21.

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