A High-Isolation Antenna Applied to Millimeter-Wave Multi-Channel Short-Range Communication

Abstract

The present invention provides a high-isolation antenna applied to millimeter-wave multi-channel short-distance communication. The high-isolation antenna applied to millimeter-wave multi-channel short-distance communication includes an antenna body and an absorbing layer; the antenna body is provided with a plurality of horn structure cavities and accommodating cavities, the accommodating cavities correspond to the horn structure cavities one by one, each horn structure cavity corresponds to a transmission channel, the horn structure cavity includes an opening part, an extending part and a connecting part, the accommodating cavity is arranged at the bottom of the horn structure cavity and communicates with the connecting part of the horn structure cavity, and a patch probe is arranged in the accommodating cavity; the absorbing layer is provided with an opening at the top, the opening corresponds to the horn structure cavity one by one, and the opening communicates with the opening part. This solution solves the problem of the short transmission distance of traditional non-contact connectors, and at the same time makes up for the blank of non-contact connectors in multi-channel communication, providing a way for the realization of millimeter-wave non-contact connectors.

Description

Technical Field

[0001] The present invention relates to the technical field of non-contact connectors, and in particular to a high-isolation antenna applied to millimeter-wave multi-channel short-distance communication. Background Art

[0002] With the continuous development of data transmission technology, the frequency and scale of data exchange have increased significantly. In the aerospace field, contact connectors such as GF3A and GFB high-speed connectors are often used for the transmission of high-speed signals between boards. However, misalignment, vibration, and frequent disassembly between the motherboard and the plug-in board of the connectors often lead to wear of the connectors, thereby affecting the transmission of data signals. Therefore, in special and harsh application environments such as misalignment between the motherboard and the plug-in board, strong mechanical vibration, and high temperature, it is particularly important to select a suitable and reliable data connector. Non-contact connectors provide an effective solution for such applications. First of all, non-contact connectors can achieve data transmission over a certain distance without physical contact, ensuring the reliability of data transmission in environments with misalignment and strong mechanical vibration.

[0003] There have been many research results in non-contact connector technology at present, but the existing non-contact connectors are often single-channel transmissions, with low data transmission efficiency, and lack multi-channel non-contact connectors. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a high-isolation antenna applied to millimeter-wave multi-channel short-distance communication to eliminate or improve one or more defects existing in the prior art.

[0005] One aspect of the present invention provides a high-isolation antenna applied to millimeter-wave multi-channel short-distance communication. The high-isolation antenna applied to millimeter-wave multi-channel short-distance communication includes an antenna body and an absorbing layer;

[0006] The antenna body is provided with a plurality of horn structure cavities and accommodating cavities. The accommodating cavities correspond to the horn structure cavities one by one. Each horn structure cavity corresponds to a transmission channel. The horn structure cavity includes an opening part, an extending part, and a connecting part. The accommodating cavity is arranged at the bottom of the horn structure cavity and is communicated with the connecting part of the horn structure cavity. A patch probe is arranged in the accommodating cavity;

[0007] The absorbing layer is provided with an opening at the top. The openings correspond to the horn structure cavities one by one, and the openings are communicated with the opening parts.

[0008] Adopting the above solution, this solution designs a high-isolation antenna in the mode of a multi-channel communication antenna, constituting multiple transmitting channels and multiple receiving channels and the transmitting channels, realizing multi-channel communication for signal transmission and reception, and absorbing surface waves and reflected waves between the transmitting and receiving high-isolation antennas by adding absorbing materials, greatly improving the isolation performance of the transmitting and receiving antennas. This solution solves the problem of the short transmission distance of traditional non-contact connector technology, and also makes up for the gap of non-contact connectors in the field of multi-channel communication, providing a technical approach for the realization of millimeter-wave non-contact connectors.

[0009] In some embodiments of the present invention, the polarization direction of the transmission channel corresponding to the horn structure cavity is perpendicular to the length direction of the cross-section of the corresponding connecting part.

[0010] In some embodiments of the present invention, the antenna body is provided with 4 horn structure cavities, the cross-section of the antenna body is rectangular, the 4 horn structure cavities are respectively arranged at the 4 corners of the cross-section of the antenna body, the polarization direction of the transmission channel corresponding to the horn structure cavity is perpendicular to the polarization direction of the transmission channel corresponding to the adjacent horn structure cavity, and is the same as the polarization direction of the transmission channel corresponding to the horn structure cavity at the diagonal corner.

[0011] In some embodiments of the present invention, a ceramic sealing member is arranged at the opening part so that electromagnetic waves radiate to the outside after passing through the ceramic medium.

[0012] In some embodiments of the present invention, the patch probe is provided with a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, a fifth metal layer and a sixth metal layer extending layer by layer from the bottom upwards, and high-frequency laminates are arranged between adjacent metal layers.

[0013] In the specific implementation process, the high-frequency laminate is Rogers RO3003 high-frequency laminate. Rogers RO3003 high-frequency laminate is a PTFE composite filled with ceramics. Rogers RO3003 high-frequency laminate still has excellent dielectric constant (Dk) stability at different temperatures and frequencies. The unique design makes the material have stability, eliminating the step change of the dielectric constant of the general PTFE material at room temperature.

[0014] In some embodiments of the present invention, the first metal layer is a metal strip, one end of the metal strip is arranged on one side of the length direction of the patch probe, and the metal strip is arranged in the middle of the width direction of the patch probe.

[0015] In some embodiments of the present invention, both the second metal layer and the fifth metal layer are metal plates each provided with a hole, both the third metal layer and the fourth metal layer are multi-branch annular chokes, the multi-branch annular choke includes a metal ring and a plurality of outer branches, one end of the outer branch is laterally connected to the outer side of the metal ring, and the other end extends outward.

[0016] In some embodiments of the present invention, the sixth metal layer includes an outer metal plate and an inner metal plate, the outer metal plate is provided with a window opening, the inner metal plate is disposed within the window opening, and the width of one end of the inner metal plate is greater than that of the other end.

[0017] In some embodiments of the present invention, the patch probe includes a first through hole, a second through hole, and a third through hole. The first through hole extends from the upper surface of the first metal layer to the lower surface of the sixth metal layer. One end of the first through hole is disposed on one side of the first metal layer away from the edge of the patch probe. The first through hole passes through the set holes of the second metal layer and the fifth metal layer, passes through the inner ring of the metal ring of the third metal layer and the fourth metal layer, and extends to the narrow side of the inner metal plate of the sixth metal layer. The second through hole extends from the upper surface of the third metal layer to the lower surface of the fourth metal layer, and the opening of the second through hole is the inner ring of the metal ring and is evenly distributed along the inner ring of the metal ring. The third metal hole extends from the upper surface of the fifth metal layer to the lower surface of the sixth metal layer, and a plurality of the third metal holes are disposed along the edge of the window opening of the outer metal plate.

[0018] In some embodiments of the present invention, the wave-absorbing layer is made of a wave-absorbing material.

[0019] In the specific implementation process, the wave-absorbing material can be a silicone rubber flat material, a rubber flat material, or a polyurethane foam flat material;

[0020] In some embodiments of the present invention, the wave-absorbing material uses a silicone rubber flat material with the model of RATG-24 / 77GHz-1mm, and this material has high temperature resistance and can effectively absorb electromagnetic waves in the frequency band of 56 GHz to 64 GHz.

[0021] The additional advantages, objects, and features of the present invention will be partially described below, and will become partially apparent to those of ordinary skill in the art after studying the following text, or can be learned from the practice of the present invention. The objects and other advantages of the present invention can be pointed out and obtained specifically in the description and the drawings.

[0022] Those skilled in the art will understand that the objects and advantages that can be achieved by the present invention are not limited to the above specific descriptions, and the above and other objects that the present invention can achieve will be more clearly understood according to the following detailed description. Description of the Drawings

[0023] The accompanying drawings described herein are used to provide a further understanding of the present invention, form a part of this application, and do not limit the present invention.

[0024] Figure 1 It is a schematic diagram of an embodiment of this solution;

[0025] Figure 2 It is a perspective schematic diagram of this solution;

[0026] Figure 3 It is a top - view structural schematic diagram of this solution after removing the ceramic sealing piece and the patch probe;

[0027] Figure 4 It is a perspective schematic diagram of this solution after removing the wave - absorbing layer, the ceramic sealing piece and the patch probe;

[0028] Figure 5 It is a schematic diagram of the cavity of the horn structure;

[0029] Figure 6 It is a schematic diagram of one side - view angle of the cavity of the horn structure;

[0030] Figure 7 It is a schematic diagram of another side - view angle of the cavity of the horn structure;

[0031] Figure 8 It is a structural schematic diagram of the patch probe;

[0032] Fig. 9 It is a schematic diagram of one side - view angle of the patch probe;

[0033] Fig.10 It is a schematic diagram of another side - view angle of the patch probe;

[0034] Fig.11 It is a schematic diagram of the first metal layer;

[0035] Fig.12 It is a schematic diagram of the second metal layer and the fifth metal layer;

[0036] Fig.13 It is a schematic diagram of the third metal layer and the fourth metal layer;

[0037] Fig.14 It is a schematic diagram of the sixth metal layer;

[0038] Fig.15 It is a schematic diagram of the metal layer and the metal via - hole structure of the patch probe;

[0039] Fig.16 It is a schematic diagram of one side - view angle of the metal layer and the metal via - hole structure of the patch probe;

[0040] Fig.17 Schematic diagram of another side view angle of the metal layer of the patch probe and the metal through-hole structure;

[0041] Fig.18 Schematic diagram of the combined structure of the cavity of the horn structure and the patch probe;

[0042] Fig.19 Schematic diagram of the structure of this solution including the polarization direction;

[0043] Fig. 20 Combined schematic diagram of the first transceiver scenario of the high isolation antenna of this solution;

[0044] Fig.21 Layout schematic diagram of the first transceiver scenario;

[0045] Fig. 22 Combined schematic diagram of the second transceiver scenario of the high isolation antenna of this solution;

[0046] Fig.23 Layout schematic diagram of the second transceiver scenario;

[0047] Fig.24 Schematic diagram of the transmission coefficient of the first transceiver scenario;

[0048] Fig.25 Schematic diagram of the isolation degree from antenna ATX1 to antenna BRX0 in the first transceiver scenario;

[0049] Fig.26 Schematic diagram of the isolation degree from antenna BTX0 to antenna BRX0 in the first transceiver scenario;

[0050] Fig. 27 Schematic diagram of the isolation degree from antenna BTX1 to antenna BRX0 in the first transceiver scenario;

[0051] Fig.28 Schematic diagram of the transmission coefficient of the second transceiver scenario;

[0052] Fig.29 Schematic diagram of the isolation degree from antenna ATX1 to antenna BRX0 in the second transceiver scenario;

[0053] Fig.30 Schematic diagram of the isolation degree from antenna BTX0 to antenna BRX0 in the second transceiver scenario;

[0054] Fig.31 Schematic diagram of the isolation degree from antenna BTX1 to antenna BRX0 in the second transceiver scenario;

[0055] Fig.32 Schematic diagram of the electric field distribution between parallel plates without adding an absorbing layer in this solution;

[0056] Fig.33 Schematic diagram of the electric field distribution between parallel plates with an absorbing layer added to this solution.

[0057] Description of Reference Numerals

[0058] 1. Antenna main body; 11. Horn structure cavity; 111. Opening part; 112. Extension part; 113. Connection part; 12. Accommodation cavity; 13. Ceramic sealing piece; 2. Absorbing layer; 3. Patch probe; 31. First metal layer; 32. Second metal layer; 33. Third metal layer; 34. Fourth metal layer; 341. Metal ring; 342. Outer branch; 35. Fifth metal layer; 36. Sixth metal layer; 361. Outer metal plate; 362. Inner metal plate; 363. Window opening; 37. First through hole; 38. Second through hole; 39. Third through hole. Detailed implementation manners

[0059] To make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below in conjunction with the implementation manners and the drawings. Herein, the illustrative implementation manners of the present invention and their descriptions are used to explain the present invention, but do not limit the present invention.

[0060] Herein, it should also be noted that in order to avoid obscuring the present invention due to unnecessary details, only the structures and / or processing steps closely related to the solution of the present invention are shown in the drawings, while other details less related to the present invention are omitted.

[0061] As Figures 1 to 8 shown, the present invention provides a high-isolation antenna applied to millimeter-wave multi-channel short-distance communication. The high-isolation antenna applied to millimeter-wave multi-channel short-distance communication includes an antenna main body 1 and an absorbing layer 2;

[0062] The antenna main body 1 is provided with a plurality of horn structure cavities 11 and accommodation cavities 12. The accommodation cavities 12 correspond to the horn structure cavities 11 one by one. Each horn structure cavity 11 corresponds to a transmission channel. The horn structure cavity 11 includes an opening part 111, an extension part 112 and a connection part 113. The accommodation cavity 12 is arranged at the bottom of the horn structure cavity 11 and is communicated with the connection part 113 of the horn structure cavity 11. A patch probe 3 is arranged in the accommodation cavity 12;

[0063] The absorbing layer 2 is provided with an opening at the top. The opening corresponds to the horn structure cavity 11 one by one, and the opening is communicated with the opening part 111.

[0064] In the specific implementation process, by reasonably designing the structural dimensions of the horn antenna, the electromagnetic waves radiated by the patch probe 3 can be transmitted from the rectangular waveguide in the form of TE10 mode to the quadrangular pyramid horn sealed by a cylindrical ceramic. The cylindrical ceramic is pressed at the horn mouth of the quadrangular pyramid by a metal ring, and the electromagnetic waves are radiated to the outside after passing through the ceramic medium.

[0065] In the specific implementation process, by reasonably designing the size of the absorbing layer 2 and selecting an absorbing material that can absorb electromagnetic waves in the working frequency band, after reserving the position required for the horn antenna opening, it is attached to the surface of the high-isolation antenna to absorb the surface waves and reflected waves generated by the parallel plate structure.

[0066] Adopting the above scheme, this scheme designs a high-isolation antenna in the mode of a multi-channel communication antenna, constituting multiple transmitting channels and multiple receiving channels and transmitting channels, realizing multi-channel communication for signal transmission and reception, and absorbing the surface waves and reflected waves between the transmitting and receiving high-isolation antennas by adding an absorbing material, greatly improving the isolation performance of the transmitting and receiving antennas. This scheme solves the problem of the short transmission distance of traditional non-contact connector technology, and at the same time makes up for the blank of non-contact connectors in the field of multi-channel communication, providing a technical approach for the realization of millimeter-wave non-contact connectors.

[0067] As Fig.18 and 19 shown, in some embodiments of the present invention, the polarization direction of the transmission channel corresponding to the horn structure cavity 11 is perpendicular to the length direction of the cross-section of the corresponding connection part 113.

[0068] In some embodiments of the present invention, the patch probe 3 connected to the RF chip through a coaxial structure radiates and feeds electromagnetic waves to the rectangular waveguide. The electromagnetic waves are transmitted in the rectangular waveguide in the form of TE10 mode, and then the electromagnetic waves penetrate the ceramic in a direction perpendicular to the long side of the rectangular waveguide, that is Fig.18 the y direction in the figure, and radiate to the outside in the form of a linearly polarized wave. The design of the ceramic-loaded horn antenna enables the antenna to work efficiently in high-temperature and strong impact environments.

[0069] As Figures 1 to 4 shown, in some embodiments of the present invention, the antenna body 1 is provided with 4 horn structure cavities 11. The cross-section of the antenna body 1 is rectangular, and the 4 horn structure cavities 11 are respectively arranged at the 4 corners of the cross-section of the antenna body 1. The polarization direction of the transmission channel corresponding to the horn structure cavity 11 is perpendicular to the polarization direction of the transmission channel corresponding to the adjacent horn structure cavity 11, and is the same as the polarization direction of the transmission channel corresponding to the horn structure cavity 11 at the diagonal corner.

[0070] In the specific implementation process, four patch probes 3 are rotationally symmetrically connected below the horn structure cavity 11 arranged in the same way around the central axis of the high-isolation antenna. After leaving the position required for the horn antenna opening in the absorbing layer 2, it is attached to the surface of the high-isolation antenna.

[0071] As Figures 1 to 4 shown, in some embodiments of the present invention, a ceramic sealing member 13 is provided at the opening 111 so that electromagnetic waves radiate to the outside after passing through the ceramic medium.

[0072] In some embodiments of the present invention, the ceramic sealing member 13 is made of quartz fiber-reinforced quartz composite ceramic material (SiO2f / SiO2), and the sol-gel method is used. With a quartz fiber woven fabric as the reinforcement, it is formed through multiple rounds of impregnation-sintering-processing, and has excellent properties such as high temperature resistance, impact resistance, low dielectric and low loss performance, and low thermal conductivity.

[0073] As Fig. 9 and 10 shown, in some embodiments of the present invention, the patch probe 3 is successively provided with a first metal layer 31, a second metal layer 32, a third metal layer 33, a fourth metal layer 34, a fifth metal layer 35, and a sixth metal layer 36 extending from the bottom upwards, and a high-frequency laminate is provided between adjacent metal layers.

[0074] In the specific implementation process, the first metal layer 31, the second metal layer 32, the third metal layer 33, the fourth metal layer 34, the fifth metal layer 35, and the sixth metal layer 36 are all made of copper.

[0075] As Fig. 9 and 11 , in some embodiments of the present invention, the first metal layer 31 is a metal strip, one end of the metal strip is arranged on one side of the length direction of the patch probe 3, and the metal strip is arranged in the middle of the width direction of the patch probe 3.

[0076] In the specific implementation process, the metal strip of the first metal layer 31 is a 50-ohm microstrip line. Specifically, the RF chip is connected to the patch probe 3 through the metal strip of the first metal layer 31, and the sixth metal layer 36 is fed through the microstrip-line - coaxial-line - microstrip-line conversion structure, thereby realizing the feeding of the horn antenna.

[0077] As Fig.12 and 13As shown, in some embodiments of the present invention, both the second metal layer 32 and the fifth metal layer 35 are metal plates provided with one hole, both the third metal layer 33 and the fourth metal layer 34 are multi-branch annular chokes, the multi-branch annular choke includes a metal ring 341 and a plurality of outer branches 342, one end of the outer branch 342 is laterally connected to the outside of the metal ring 341, and the other end extends outward.

[0078] As Fig.14 shown, in some embodiments of the present invention, the sixth metal layer 36 includes an outer metal plate 361 and an inner metal plate 362, the outer metal plate 361 is provided with a window 363, the inner metal plate 362 is disposed within the window 363, and the width of one end of the inner metal plate 362 is greater than that of the other end.

[0079] In the specific implementation process, the sixth metal layer 36 serves as a probe.

[0080] As Fig. 9 、 10 、15, 16 and 17 shown, in some embodiments of the present invention, the patch probe 3 includes a first through hole 37, a second through hole 38 and a third through hole 39, the first through hole 37 extends from the upper surface of the first metal layer 31 to the lower surface of the sixth metal layer 36, one end of the first through hole 37 is disposed on the side of the first metal layer 31 away from the edge of the patch probe 3, the first through hole 37 passes through the set holes of the second metal layer 32 and the fifth metal layer 35, the first through hole 37 passes through the inner ring of the metal ring 341 of the third metal layer 33 and the fourth metal layer 34, and the first through hole 37 extends to the narrow side of the inner metal plate 362 of the sixth metal layer 36; the second through hole 38 extends from the upper surface of the third metal layer 33 to the lower surface of the fourth metal layer 34, and the opening of the second through hole 38 is the inner ring of the metal ring 341 and is evenly distributed along the inner ring of the metal ring 341; the third metal hole extends from the upper surface of the fifth metal layer 35 to the lower surface of the sixth metal layer 36, and a plurality of the third metal holes are disposed along the edge of the window 363 of the outer metal plate 361.

[0081] Adopting the above solution, the second metal layer 32 and the fifth metal layer 35 are respectively the ground planes of the microstrip line and the probe. Since the core board between the second metal layer 32 and the fifth metal layer 35 needs to be processed with through holes of a coaxial structure, but since the core boards between the second metal layer 32 and the third metal layer 33, and between the fourth metal layer 34 and the fifth metal layer 35 are too thin to be processed with through holes, a multi-branch annular choke is designed in the third metal layer 33 and the fourth metal layer 34 to replace the metal through holes of the coaxial structure, avoiding impedance mismatch caused by wave leakage between the core boards. At the same time, metal through hole processing is performed around the patch of the fifth metal layer 35 and the sixth metal layer 36 to avoid wave transmission between the substrate dielectrics.

[0082] In some embodiments of the present invention, the wave-absorbing layer 2 is made of a wave-absorbing material.

[0083] In the specific implementation process, the wave-absorbing material can be a silicone rubber flat material, a rubber flat material or a polyurethane foam flat material;

[0084] In some embodiments of the present invention, the wave-absorbing material uses a silicone rubber flat material with the model of RATG-24 / 77GHz-1mm, and this material has high temperature resistance and can effectively absorb electromagnetic waves in the frequency band of 56GHz to 64GHz.

[0085] In the specific implementation process, the patch probe 3 of this solution feeds the microstrip probe through a microstrip line - coaxial line - waveguide conversion structure, and then realizes the feeding of the pyramidal horn antenna. At the same time, combined with the characteristics of the wave-absorbing material to absorb electromagnetic waves, the surface waves and reflected waves between the transceiver antennas are absorbed, which improves the isolation performance of the transceiver antennas from the perspective of eliminating multipath.

[0086] Adopting the above solution, this solution is designed to improve the data transmission rate, and a high-isolation antenna with two transmitters and two receivers is designed in the mode of a multi-channel communication antenna. The introduction of multiple channels requires a high degree of isolation between the four communication channels. By reasonably designing the structural dimensions of the high-isolation antenna, the antenna has four horn antennas designed with axial symmetry rotation in the working frequency band, where the transmitting antenna and the receiving antenna are respectively arranged on the diagonal line, constituting two transmitting channels and two receiving channels and the transmitting channels, realizing multi-channel communication for signal transmission and reception, and absorbing the surface waves and reflected waves between the high-isolation transceiver antennas by adding wave-absorbing materials, which greatly improves the isolation performance of the transceiver antennas. This patent solves the problem of the short transmission distance of traditional non-contact connector technology, and also makes up for the blank of non-contact connectors in the field of multi-channel communication, providing a technical approach for the realization of millimeter-wave non-contact connectors.

[0087] This solution includes four patch probe 3 structures symmetrically connected by rotation around the central axis of the high-isolation antenna under the horn antenna structure arranged in the same way. After the wave-absorbing layer 2 reserves the positions required for the horn antenna openings, it is attached to the surface of the high-isolation antenna. Due to the uniqueness of the distribution of the patch probe 3 and the horn antenna, after feeding the patch probe 3, the polarization modes of adjacent antennas are orthogonal, and the polarization modes of the two antennas in the diagonal direction are the same. The antennas with the same polarization mode are set as the transmitting channel or the receiving channel, so as to constitute two transmitting channels and two receiving channels. The structure and layout of the transceiver antennas are as Fig. 20 and 21As shown, antenna ATX0 transmits signals, and antenna BRX0 receives signals; antenna ATX1 transmits signals, and antenna BRX1 receives signals; antenna BTX0 transmits signals, and antenna ARX0 receives signals; antenna BTX1 transmits signals, and antenna ARX1 receives signals. At the same time, to weaken the surface waves and reflected waves formed by the parallel plate structure of the transceiver antennas, which will deteriorate the isolation of the transceiver antennas, wave-absorbing materials are added to the antenna surface to absorb the surface waves and reflected waves, so as to improve the isolation performance of the transceiver antennas from the perspective of suppressing multipath.

[0088] In this solution, the RF chip is connected and fed through a microstrip line structure, i.e., the first metal layer 31, and a coaxial structure, i.e., the first via 37, to a patch structure, i.e., the sixth metal layer 36. The patch of the sixth metal layer 36 radiates electromagnetic waves to the outside world. Among them, the second via 38 between the third metal layer 33 and the fourth metal layer 34 prevents the electromagnetic waves transmitted by the coaxial structure from spreading around, ensuring the efficient transmission of electromagnetic waves on the coaxial structure; the third via 39 between the fifth metal layer 35 and the sixth metal layer 36 prevents the electromagnetic waves transmitted to the probe from spreading around, ensuring the efficient radiation of electromagnetic waves to the outside world through the probe; the multi-branch ring choke between the third metal layer 33 and the fourth metal layer 34 prevents the electromagnetic waves transmitted by the coaxial structure between the extremely thin core boards from spreading to the outside world. While achieving impedance matching and efficient energy transmission of the patch probe 3, it greatly reduces the processing difficulty of the patch probe 3.

[0089] Experimental example:

[0090] For this solution, a high-isolation antenna with a working frequency band from 59.7 GHz to 61.2 GHz was designed in the experimental example, and the high-isolation transceiver antennas were simulated and verified under the communication conditions of 18 mm communication distance, 0 mm misalignment, and 0° offset as Fig. 20 and 21 shown. The simulation results are as Figures 24 to 27 shown. When the signal transmitted by antenna ATX0 is received by antenna BRX0, the signals transmitted by antennas ATX1, BTX0, and BTX1 will interfere with antenna BRX0; the simulation verification was carried out under the communication conditions of 18 mm communication distance, 8 mm misalignment, and 10° offset as Fig. 22 and 23 shown, and the simulation results are as Figures 28 to 31As shown, when the signal transmitted by antenna ATX0 is received by antenna BRX0, the signals transmitted by antennas ATX1, BTX0, and BTX1 will interfere with antenna BRX0. Under the conditions of a communication spacing of 18 mm, 0 mm misalignment, and 0° offset, within the operating frequency range of 59.7 GHz to 61.2 GHz, the transmission coefficient ≥ -15 dB; the worst isolation degree from the simulated antennas ATX1, BTX0, and BTX1 to antenna BRX0 ≥ 38 dB; under the conditions of a communication spacing of 25 mm, 8 mm misalignment, and 10° offset, within the operating frequency range of 59.7 GHz to 61.2 GHz, the transmission coefficient ≥ -26 dB; the worst isolation degree from the simulated antennas ATX1, BTX0, and BTX1 to antenna BRX0 ≥ 25 dB.

[0091] In the specific implementation process, first, a 90° rotated ceramic-loaded horn antenna is used to distinguish the polarization directions of the antennas. Electromagnetic waves with two mutually perpendicular polarization directions are orthogonal to each other. On this basis, a high-isolation communication channel is established (the mutual interference between channels is small).

[0092] Now, taking Fig. 20 and 21 the layout of the transceiver antennas as an example to describe the working principle of the high-isolation antenna. The high-isolation antenna establishes a dual-transmit and dual-receive communication channel through four ceramic-loaded horn antennas: ATX0 transmits and BRX0 receives, ATX1 transmits and BRX1 receives, BTX0 transmits and ARX0 receives, and BTX1 transmits and ARX1 receives. The electromagnetic waves transmitted / received by the horn antennas between the diagonals are orthogonal to each other. The two horn antennas on the diagonal have the same polarization mode, but the distance between the antennas is relatively increased through the diagonal layout, thereby improving the isolation degree between the two channels on the diagonal. Due to the relative placement method of the transceiver antennas, a parallel-plate structure is formed between the transceiver antennas. In the case of no absorbing material added, the electromagnetic waves radiated by the antennas will be reflected by the metal, thereby introducing surface waves and reflected waves to cause multipath interference to the communication channel and reducing the isolation degree between channels. Therefore, an absorbing material is attached to the surface of the high-isolation antenna to absorb the surface waves and reflected waves, thereby suppressing multipath interference and improving the isolation degree between channels.

[0093] The design of the PCB patch probe 3 enables efficient energy transmission between the RF chip and the horn antenna. The first proposed multi-branch annular choke on the board solves the leakage problem caused by the difficulty of processing through holes in traditional double-layer thin-core boards; the ceramic-loaded metal horn design enables the high-isolation antenna to work efficiently in high-temperature and strong-impact environments; the special polarization layout and antenna aperture design ensure that the antenna aperture field has the characteristics of phase consistency and high isolation within a certain range, enabling the high-isolation antenna to achieve signal transmission with the characteristics of efficient near-field coupling and high channel isolation under the conditions of limited space, high temperature, strong impact, and antenna angle and position offset.

[0094] Fig.32 and 33 is the electric field distribution of the absorbing surface between the high-isolation transceiver antennas described in the present invention, verifying that the absorbing material has a certain absorption effect on the surface wave and reflection wave formed by the parallel plate structure.

[0095] Those of ordinary skill in the art should understand that the various exemplary components, systems, and methods described in connection with the embodiments disclosed herein can be implemented in hardware, software, or a combination of both. Specifically, whether to implement in hardware or software depends on the specific application and design constraints of the technical solution. A person skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention. When implemented in hardware, it can be, for example, an electronic circuit, an application-specific integrated circuit (ASIC), appropriate firmware, a plug-in, a functional card, etc. When implemented in software, the elements of the present invention are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium or transmitted via a data signal carried in a carrier wave on a transmission medium or a communication link.

[0096] It should be clear that the present invention is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications, and additions, or change the order between steps after understanding the spirit of the present invention.

[0097] In the present invention, the features described and / or illustrated for one embodiment can be used in the same way or in a similar way in one or more other embodiments, and / or combined with the features of other embodiments or replace the features of other embodiments.

[0098] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the embodiments of the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high isolation antenna applied to millimeter-wave multi-channel short-range communication, characterized in that, The high-isolation antenna applied to millimeter-wave multi-channel short-distance communication includes an antenna body (1) and an absorbing layer (2); The antenna body (1) is provided with a plurality of horn structure cavities (11) and accommodation cavities (12). The accommodation cavities (12) correspond to the horn structure cavities (11) one by one. Each horn structure cavity (11) corresponds to a transmission channel. The horn structure cavity (11) includes an opening part (111), an extension part (112) and a connecting part (113). The accommodation cavity (12) is arranged at the bottom of the horn structure cavity (11) and communicates with the connecting part (113) of the horn structure cavity (11). A patch probe (3) is arranged in the accommodation cavity (12); The patch probe (3) is successively provided with a first metal layer (31), a second metal layer (32), a third metal layer (33), a fourth metal layer (34), a fifth metal layer (35) and a sixth metal layer (36) from bottom to top. A high-frequency laminate is arranged between adjacent metal layers. The first metal layer (31) is a metal strip. One end of the metal strip is arranged on one side of the length direction of the patch probe (3), and the metal strip is arranged in the middle of the width direction of the patch probe (3). The second metal layer (32) and the fifth metal layer (35) are both metal plates provided with a hole. The third metal layer (33) and the fourth metal layer (34) are both multi-section type circular chokes. The multi-section type circular choke includes a metal ring (341) and a plurality of outer branches (342). One end of the outer branch (342) is connected to the outside of the metal ring (341), and the other end extends outward; The absorbing layer (2) is provided with an opening at the top. The opening corresponds to the horn structure cavity (11) one by one, and the opening communicates with the opening part (111).

2. The high isolation antenna applied to millimeter-wave multi-channel short-range communication according to claim 1, wherein The polarization direction of the transmission channel corresponding to the horn structure cavity (11) is perpendicular to the length direction of the cross section of the corresponding connecting part (113).

3. The high isolation antenna applied to millimeter-wave multi-channel short-distance communication according to claim 1 or 2, characterized in that, The antenna body (1) is provided with 4 horn structure cavities (11). The cross section of the antenna body (1) is rectangular. The 4 horn structure cavities (11) are respectively arranged at the 4 corners of the cross section of the antenna body (1). The polarization direction of the transmission channel corresponding to the horn structure cavity (11) is perpendicular to the polarization direction of the transmission channel corresponding to the adjacent horn structure cavity (11), and is the same as the polarization direction of the transmission channel corresponding to the horn structure cavity (11) at the diagonal corner.

4. The high isolation antenna applied to millimeter-wave multi-channel short-distance communication according to claim 1, characterized in that, A ceramic sealing piece (13) is arranged at the opening part (111) so that electromagnetic waves radiate to the outside after passing through the ceramic medium.

5. The high isolation antenna applied to millimeter-wave multi-channel short-distance communication according to claim 1, wherein The sixth metal layer (36) includes an outer metal plate (361) and an inner metal plate (362). The outer metal plate (361) is provided with a window opening (363). The inner metal plate (362) is arranged in the window opening (363). The width of one end of the inner metal plate (362) is greater than that of the other end.

6. The high isolation antenna applied to millimeter-wave multi-channel short-distance communication according to claim 5, characterized in that, The patch probe (3) includes a first through hole (37), a second through hole (38) and a third through hole (39). The first through hole (37) extends from the upper surface of the first metal layer (31) to the lower surface of the sixth metal layer (36). One end of the first through hole (37) is arranged on one side of the first metal layer (31) away from the edge of the patch probe (3). The first through hole (37) passes through the holes of the second metal layer (32) and the fifth metal layer (35). The first through hole (37) passes through the inner ring of the metal ring (341) of the third metal layer (33) and the fourth metal layer (34). The first through hole (37) extends to the narrow side of the inner metal plate (362) of the sixth metal layer (36). The second through hole (38) extends from the upper surface of the third metal layer (33) to the lower surface of the fourth metal layer (34). The opening of the second through hole (38) is the inner ring of the metal ring (341) and is evenly distributed along the inner ring of the metal ring (341). The third through hole extends from the upper surface of the fifth metal layer (35) to the lower surface of the sixth metal layer (36), and a plurality of the third through holes are arranged along the edge of the window (363) of the outer metal plate (361).

7. The high isolation antenna applied to millimeter-wave multi-channel short-distance communication according to claim 1, wherein The wave absorbing layer (2) is made of wave absorbing material.

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