High-thermal-conductivity organic silicon gel and preparation method thereof

Abstract

The invention relates to the technical field of heat-conducting interface materials, and particularly discloses high-heat-conductivity organic silicon gel and a preparation method thereof. The high-thermal-conductivity organic silicon gel is prepared from the following components in parts by weight: 100 parts of insulating and thermal-conducting filler, 0.1 to 0.3 part of poly-alpha-olefin, 0.3 to 5 parts of vinyl silicone oil, 0.03 to 1 part of hydrogen-containing silicone oil, 0.01 to 0.3 part of alkynol modified silicone oil, 0.01 to 0.5 part of catalyst and 0 to 2 parts of additive, the viscosity of the poly-alpha olefin at 100 DEG C is 1-40 mm < 2 > / s, and the viscosity index is 80-175. According to the high-thermal-conductivity organic silicon gel provided by the invention, by adopting a mode of adding a small amount of poly-alpha-olefin, the problem that the insulating thermal-conductivity filler is high in filling amount and easy to agglomerate is solved, and the obtained organic silicon gel has a high thermal conductivity coefficient of 5-8W / m.K and breakdown strength of greater than 18kV / mm.

Description

Technical Field

[0001] This application relates to the technical field of thermal interface materials, and more specifically, to a high thermal conductivity silicone gel and a preparation method thereof. Background Art

[0002] During the operation of electronic devices, the power loss is mainly converted into heat energy, which causes the temperature of the electronic device to rise and the thermal stress to increase, seriously affecting the reliability and service life of the electronic device. Therefore, it is necessary to dissipate these excess heat energies as soon as possible. In this heat dissipation process, the thermal interface material plays a crucial role. The thermal interface material is mainly used to fill the microvoids and the uneven holes on the surface generated when the electronic device contacts the radiator, and reduce the thermal resistance of heat transfer.

[0003] Currently, the common thermal interface materials on the market include thermal gels, thermal pads, thermal greases, thermal adhesives, thermal tapes, phase change materials, welding materials, and carbon-based thermal interface materials, etc. Among them, the thermal gel has become one of the most widely used interface thermal materials due to its advantages such as stable storage, high thermal conductivity, high reliability, and the ability to achieve an efficient automatic dispensing process. The thermal gel is usually composed of a reactive curable silicone oil with excellent heat and weather resistance as the matrix, and is filled with a large number of fillers with high thermal conductivity. The thermal conductivity of traditional thermal gels is generally only about 2W / m·K. In recent years, through the innovation and progress of materials, the technology of thermal gels with a thermal conductivity of 4-6W / m·K has been continuously maturing and entering the industrial application stage. However, facing the higher requirements continuously put forward by the heat dissipation of electronic devices, especially the development of emerging fields such as 5G communication, photovoltaic energy storage, power batteries, automotive electronics, and consumer electronics in recent years, the insufficient thermal conductivity of thermal gels has become one of the important factors seriously restricting the further breakthrough of technology.

[0004] Thermal conductive silicone gel is a kind of silicone gel with thermal conductivity formed by compounding organosilicon gel and thermal conductive fillers. The most common thermal conductive fillers used in thermal conductive gels are spherical or quasi-spherical alumina. Because of its good morphology, high filling rate can be achieved. The prepared thermal conductive gel has good process performance and good reliability due to its chemical inertness. However, the theoretical upper limit of the thermal conductivity of alumina is only about 30 W / m·K, and the thermal conductivity of the prepared thermal conductive gel cannot reach more than 6 W / m·K. In order to further improve the thermal conductivity, fillers with higher thermal conductivity need to be added, such as silver (420 W / m·K), copper (397 W / m·K) and liquid metal, etc. In recent years, newly developed high-performance carbon materials also have very excellent thermal conductivity, such as carbon fiber (axial 20 - 100 W / m·K), carbon nanotube (axial about 3000 W / m·K) and graphene (in-plane 5300 W / m·K), etc. However, the practical applications of these materials in the electronic field are often restricted. Because the main thermal conduction mechanism of the above-mentioned high-performance thermal conductive materials is electronic thermal conduction, even when the addition ratio is very small as a thermal conductive filler, it will seriously affect the insulation performance of the colloid, especially manifested as a large attenuation of volume resistivity and dielectric strength.

[0005] Through retrieval, it is found that in the field of high thermal conductive gels in China, a small number of patents such as CN111925654A, CN112457821A, CN114539781A, etc. have disclosed thermal conductive gels with a thermal conductivity of up to 8 W / m·K or even more than 10 W / m·K. However, without exception, at least one or more of metal materials including copper, silver, aluminum or liquid metal, carbon materials such as carbon fiber, carbon nanotube or graphene sheet, and aluminum nitride that is not hydrolysis-resistant are added to the system in these examples. When these examples are actually used, they cannot simultaneously meet the strict insulation and breakdown voltage performance widely required by electronic products and the aging resistance reliability during long-term use. Therefore, they cannot meet the application requirements of current electronic products for high thermal conductive gels. Summary of the Invention

[0006] In order to solve the above technical problems, the present application provides a high thermal conductive organosilicon gel and its preparation method. By adding a small amount of poly-α-olefin, the problem that high filling amount of insulating and thermal conductive fillers is easy to agglomerate is improved. The obtained organosilicon gel has a high thermal conductivity of 5 - 8 W / m·K and a breakdown strength greater than 18 kV / mm.

[0007] In the first aspect, the present application provides a high thermal conductive organosilicon gel, adopting the following technical scheme:

[0008] A highly thermally conductive silicone gel, comprising the following components in parts by weight: 100 parts of an insulating and thermally conductive filler, 0.1 - 0.3 parts of a polyalphaolefin, 0.3 - 5 parts of a vinyl silicone oil, 0.03 - 1 part of a hydrogen-containing silicone oil, 0.01 - 0.3 parts of an alkyne alcohol-modified silicone oil, 0.01 - 0.5 parts of a catalyst, and 0 - 2 parts of an additive; the polyalphaolefin has a viscosity of 1 - 40 mm 2 / s at 100 °C and a viscosity index of 80 - 175.

[0009] The role of the polyalphaolefin in the preparation of the silicone gel is to ensure the fluidity of the glue solution and improve the dispersion of the inorganic filler. In addition, it can also adjust the viscosity of the glue solution and enhance the breakdown strength of the silicone gel.

[0010] Furthermore, the polyalphaolefin is a metallocene polyalphaolefin and / or a non-metallocene polyalphaolefin, preferably a metallocene polyalphaolefin.

[0011] The metallocene polyalphaolefin (mPAO) is a product obtained by the polymerization reaction of linear alpha-olefins of C 4 -C 20 under a metallocene catalyst system and subsequent hydrogenation saturation. The metallocene catalyst system contains at least one metallocene catalyst, which is an inorganic-organic complex containing at least one metallocene ring or metallocene ring derivative as a ligand and at least one Group IVB transition element as a central atom.

[0012] The non-metallocene polyalphaolefin is a product obtained by the polymerization reaction of linear alpha-olefins of C 4 -C 20 under a non-metallocene catalyst system and subsequent hydrogenation saturation. The non-metallocene catalyst system contains at least one non-metallocene catalyst, which is a non-metallocene inorganic-organic complex formed by a ligand without a cyclopentadiene structure and a transition metal or a rare earth metal.

[0013] The compatibility between the thermally conductive filler and the silicone matrix is poor. When the filling amount of the thermally conductive filler increases, the viscosity of the gel system increases rapidly, the gel gradually loses its fluidity, and defects such as pores even appear inside, and the thermal conductivity does not increase but decreases. By adding a polyalphaolefin, the viscosity of the gel system can be adjusted to ensure the fluidity of the gel. It not only has the effect of diluting the glue solution system but also can provide support for a high filling amount of the thermally conductive filler; in addition, the addition of the polyalphaolefin can, to a certain extent, improve the dielectric strength of the gel, thereby enhancing the insulation performance of the silicone gel.

[0014] The hydrogen-containing silicone oil plays a crosslinking role. It reacts with the vinyl silicone oil through a hydrosilylation reaction to form a crosslinked network, thereby endowing the silicone gel with good physical properties and chemical stability; using the hydrogen-containing silicone oil as a crosslinking agent has the characteristics of not producing by-products and having a small shrinkage rate.

[0015] The addition of a small amount of alkynol-modified silicone oil can delay the gel time of the glue solution at room temperature, and has a certain inhibitory effect on the hydrosilylation of vinyl silicone oil and hydrogen-containing silicone oil, thus providing a longer operable time; in addition, the alkynol-modified silicone oil can improve the viscosity of the glue solution and make the glue solution have high fluidity, which can fully fill the mold, and is not prone to cracking and bubbling after gelation, and the thermal conductivity is further improved.

[0016] Further, the insulating and heat-conducting filler is selected from at least one of aluminum nitride, diamond, alumina, boron nitride, silicon carbide, zinc oxide, and silicon nitride.

[0017] Further, the external form of the insulating and heat-conducting filler is spherical or quasi-spherical, preferably spherical.

[0018] Further, the particle size of the insulating and heat-conducting filler is 0.05 - 100 μm.

[0019] To improve the dispersion uniformity of the insulating and heat-conducting filler in the gel system and reduce the porosity inside the gel system, the insulating and heat-conducting filler is surface-treated with a coupling agent before being added. By using the bridging effect of the coupling agent, a part of the groups in its molecule has an affinity for organic silica gel, and the other part has an affinity for inorganic insulating and heat-conducting filler. Therefore, agglomeration will not occur while ensuring a high filling amount of the insulating and heat-conducting filler.

[0020] Further, the coupling agent is at least one of a silane coupling agent, a titanate coupling agent, and an aluminate coupling agent.

[0021] Among them, the silane coupling agent includes but is not limited to cetyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidylethoxypropyltrimethoxysilane, vinyltris(2-methoxyethoxy)silane, etc.; the titanate coupling agent includes but is not limited to isopropyl tris(dioctylphosphate)titanate, isopropyl dioleate titanate, isopropyl tris(dioctylphosphate)titanate, etc.; the aluminate coupling agent includes but is not limited to diisostearoyl oxyisopropyl aluminate, etc.

[0022] Further, the specific steps for the coupling agent to treat the insulating and heat-conducting filler are: adding the insulating and heat-conducting filler to the coupling agent, carrying out high-speed stirring or ultrasonic dispersion, then keeping warm at 60 - 80 °C for 0.5 - 1 h, and filtering and drying to obtain.

[0023] Further, the vinyl silicone oil includes at least one of linear vinyl silicone oil and branched vinyl silicone oil.

[0024] Among them, the linear vinyl silicone oil is a vinyl-terminated polysiloxane, and the branched vinyl silicone oil is a methyl-terminated polysiloxane with vinyl groups in the side chains.

[0025] Further, the vinyl content in the vinyl silicone oil is 0.05 - 0.2 wt%, preferably 0.15 - 0.2 wt%; the viscosity of the vinyl silicone oil at 25°C is 300 - 2000 mPa·s.

[0026] Further, the hydrogen content in the hydrogen-containing silicone oil is 0.01 - 10 wt%; the viscosity of the hydrogen-containing silicone oil at 25°C is 20 - 200 mPa·s.

[0027] Further, the catalyst is a hydrosilylation catalyst, specifically a chloroplatinic acid catalyst, including but not limited to isopropanol complexes of chloroplatinic acid, vinylsiloxane complexes of chloroplatinic acid, tetrahydrofuran complexes of chloroplatinic acid, etc.

[0028] Further, to improve the existing properties of the high thermal conductivity silicone gel or endow it with new properties, the additives in the high thermal conductivity silicone gel of the present application include but not limited to antioxidants, heat stabilizers, light stabilizers, etc. The additives can be added selectively or in combination.

[0029] Among them, the antioxidant is a hindered phenol type antioxidant and / or a phosphite type antioxidant. Examples of the hindered phenol type antioxidant include antioxidant 1098 and 1010. The main component of antioxidant 1098 is N,N'-bis-(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl)hexanediamine, and the main component of antioxidant 1010 is pentaerythritol tetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]. Examples of the phosphite type antioxidant include antioxidant 168, and its main component is tris(2,4-di-tert-butylphenyl)phosphite.

[0030] Among them, the heat stabilizer is a tin-containing heat stabilizer and / or a lead-containing heat stabilizer. Examples of the tin-containing heat stabilizer include tin oxide, dimethyldichlorotin, tributyltin chloride, etc. Examples of the lead-containing heat stabilizer include dibasic lead stearate, tribasic lead sulfate trihydrate, dibasic lead phthalate, dibasic lead phosphite, etc.

[0031] Among them, the light stabilizer is a hindered amine type light stabilizer. Examples of the hindered amine type light stabilizer include bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, etc.

[0032] Since a low-viscosity poly-α-olefin is added to the gel system of the present application, it has a low viscosity and good high and low temperature properties, which not only endows the gel system with good fluidity but also has certain lubricating properties. Therefore, the additives in the present application do not require additional lubricants and can have excellent construction performance.

[0033] Second aspect, the present application provides a method for preparing a highly thermally conductive silicone gel, which is obtained by mixing and curing the above-mentioned components. The specific preparation steps are as follows:

[0034] (1) Mix the insulating and thermally conductive filler, poly-α-olefin, vinyl silicone oil, hydrogen-containing silicone oil, alkynol-modified silicone oil, catalyst, and additive aid evenly, stir at 100 - 140 °C for 0.5 - 4 h, cool, add the alkynol-modified silicone oil and catalyst, and continue to stir for 0.5 - 2 h to obtain a glue solution;

[0035] (2) Evacuate the air, and heat-cure the glue solution at 120 - 150 °C to obtain a highly thermally conductive silicone gel.

[0036] In summary, the present application has the following beneficial effects:

[0037] By adding poly-α-olefin, the present application can dilute the glue solution system and support a high filling amount of the thermally conductive filler. In addition, the addition of poly-α-olefin can, to a certain extent, improve the dielectric strength of the gel, thereby enhancing the insulation performance of the silicone gel;

[0038] By adding a small amount of alkynol-modified silicone oil, the present application can delay the gel time of the glue solution at room temperature and has a certain inhibitory effect on the hydrosilylation of vinyl silicone oil and hydrogen-containing silicone oil, thereby providing a longer operable time. In addition, the alkynol-modified silicone oil can improve the viscosity of the glue solution and make the glue solution have high fluidity, which can fully fill the mold and is not prone to cracking and bubbling after gelation, further improving the thermal conductivity. Specific Embodiments

[0039] The following specific examples illustrate the embodiments of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application.

[0040] In addition, it should be understood that one or more method steps mentioned in the present application do not exclude the existence of other method steps before and after the combined steps or the insertion of other method steps between these clearly mentioned steps, unless otherwise stated. Moreover, unless otherwise stated, the numbers of the method steps are only convenient tools for identifying the method steps, rather than limiting the arrangement order of the method steps or the scope of implementation of the present application. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope of implementation of the present application.

[0041] If the specific experimental conditions are not specified in the examples, they are generally in accordance with the conventional conditions in the art or the conditions recommended by the reagent company; the materials, reagents, etc. used in the examples can be obtained through commercial channels without special instructions.

[0042] The physical and chemical properties and sources of some raw materials in this application are as follows:

[0043] Table 1 Polyalphaolefin

[0044]

[0045] The vinyl silicone oil is a mixture composed of linear vinyl silicone oil and branched vinyl silicone oil, and the mass ratio of the two is 1:1. Among them, the linear vinyl silicone oil is a vinyl-terminated polysiloxane, specifically RH-Vi500E purchased from Runhe Materials, with a viscosity (25 °C) of 500 ± 50 mPa·s and a vinyl content of 0.42 ± 0.03 wt%; the branched vinyl silicone oil is a methyl-terminated polysiloxane with vinyl groups in the side chains, specifically RH-Vi305B purchased from Runhe Materials, with a viscosity (25 °C) of 1000 mPa·s and a vinyl content of 0.36 ± 0.01 wt%.

[0046] The hydrogen-containing silicone oil is RH-DH07 purchased from Runhe Materials, with a viscosity (25 °C) of 40 mPa·s and a hydrogen content of 0.07 wt%.

[0047] The alkynol-modified silicone oil is -7000; the catalyst used is a Karstedt catalyst with a platinum content of 3000 ppm.

[0048] The insulating and heat-conducting filler is a mixture composed of alumina and boron nitride, and the mass ratio of the two is 1:1, with an average particle size of 15 - 20 μm.

[0049] Preparation of high thermal conductivity silicone gel in Examples 1 - 7:

[0050] (1) According to the dosage of each component in Table 1, add the insulating and heat-conducting filler, polyalphaolefin, vinyl silicone oil, hydrogen-containing silicone oil, alkynol-modified silicone oil, and chloroplatinic acid catalyst to the mixer, stir at a speed of 100 rpm and 120 °C for 2 h, cool, add the alkynol-modified silicone oil and the catalyst, and continue to stir for 2 h to obtain a glue solution; (2) Evacuate to -0.1 MPa, and heat-cure the glue solution at 150 °C to obtain a high thermal conductivity silicone gel.

[0051] Table 2 Dosage of components in Examples 1 - 7 (unit: 0.01 kg)

[0052] Example 1 2 3 4 5 6 7 Insulating and thermally conductive filler 100 100 100 100 100 100 100 mPAO2 0.2 0 0 0 0.1 0.1 0.1 mPAO40 0 0.2 0 0 0.1 0 0 PAO2 0 0 0.2 0 0 0.1 0 PAO40 0 0 0 0.2 0 0 0.1 Vinyl silicone oil 2 2 2 2 2 2 2 Hydrogen-containing silicone oil 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Alkynol-modified silicone oil 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Catalyst 0.1 0.1 0.1 0.1 0.1 0.1 0.1

[0053] Preparation of high thermal conductivity silicone gel in Example 8:

[0054] The component dosages and preparation method are the same as those in Example 1. The difference from Example 1 is that the insulating and heat-conducting filler in this example is surface-treated with a coupling agent before use. The specific treatment steps are as follows:

[0055] Prepare an aqueous solution of silane coupling agent KH-550 with a mass concentration of 3%, heat it to 60 °C, add the insulating and heat-conducting filler, stir at a speed of 1000 rpm for 10 min, then keep it warm and stand for 0.5 h. After the reaction is completed, filter by suction and dry to obtain the product.

[0056] Preparation of silicone gel in Comparative Example 1:

[0057] mPAO2 was not added, and the others were the same as in Example 1.

[0058] Preparation of silicone gel in Comparative Example 2:

[0059] mPAO150 was used to replace mPAO2, and the others were the same as in Example 1.

[0060] Preparation of silicone gel in Comparative Example 3:

[0061] 1-Methyl-3-butyn-2-ol was used to replace the alkynol-modified silicone oil. The preparation steps were as follows: (1) According to the dosages of each component in Table 1, add the insulating and heat-conducting filler, poly-α-olefin, vinyl silicone oil, hydrogen-containing silicone oil, alkynol-modified silicone oil, and chloroplatinic acid catalyst to a mixer, stir at a speed of 100 rpm and 150 °C for 2 h. After cooling, add the alkynol-modified silicone oil and the catalyst, and continue to stir for 2 h to obtain a glue solution; (2) Evacuate to -0.1 MPa, and heat and cure the glue solution at 150 °C to obtain a highly heat-conductive silicone gel.

[0062] Preparation of silicone gel in Comparative Example 4:

[0063] 3-Methyl-1-pentyn-3-ol was used to replace the alkynol-modified silicone oil. The preparation steps were as follows: (1) According to the dosages of each component in Table 1, add the insulating and heat-conducting filler, poly-α-olefin, vinyl silicone oil, hydrogen-containing silicone oil, alkynol-modified silicone oil, and chloroplatinic acid catalyst to a mixer, stir at a speed of 100 rpm and 150 °C for 2 h. After cooling, add the alkynol-modified silicone oil and the catalyst, and continue to stir for 2 h to obtain a glue solution; (2) Evacuate to -0.1 MPa, and heat and cure the glue solution at 150 °C to obtain a highly heat-conductive silicone gel.

[0064] Performance detection test

[0065] Thermal conductivity: Conducted according to ASTM D5470. The higher the thermal conductivity, the better the thermal conductivity of the material;

[0066] Breakdown strength: It is carried out according to ASTM D149. The higher the breakdown strength, the better the insulation performance of the material;

[0067] Appearance: Observed by scanning electron microscope at a magnification of 10,000 times. The surface flatness and internal bubbles affect the service performance and thermal conductivity of the silicone gel. The smoother the surface and the fewer the bubbles, the better the dispersion of the material components, the better the service performance, and the better the thermal conductivity.

[0068] Table 3 Test Results

[0069]

[0070]

[0071] According to the test results in Table 3:

[0072] By comparing the test results of Examples 1-7, Comparative Examples 1 and 2, it can be seen that the addition of poly-α-olefin can significantly improve the thermal conductivity and insulation performance of the silicone gel. And the prepared silicone gel is observed under SEM at 10,000 times, with a smooth surface, no wrinkles and no bubbles, having high service performance, being able to closely fit with precision electronic equipment and playing a good thermal conduction role. In addition, the selection of poly-α-olefin also has a great influence on the various properties of the silicone gel. Generally speaking, the use effect of metallocene poly-α-olefin is the best, and when the viscosity of metallocene poly-α-olefin at 100 °C is 1-40 cSt and the viscosity index is 80-175, the thermal conductivity coefficient and breakdown strength of the prepared silicone gel are the highest.

[0073] By comparing the test results of Example 1, Comparative Examples 3 and 4, it can be seen that adding a small amount of alkynol-modified silicone oil can improve the microscopic morphology of the silicone gel, making its surface smooth and bubble-free, and the corresponding thermal conductivity coefficient and breakdown strength are both improved; in addition, using alkynol-modified silicone oil to replace the commonly used alkynol can also reduce the heating temperature during the preparation process of the silicone gel, saving more energy and reducing consumption.

[0074] The above are only the preferred embodiments of the present invention, and do not impose any formal or substantial limitations on the present invention. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the method of the present invention, several improvements and supplements can still be made, and these improvements and supplements should also be regarded as the protection scope of the present invention. For those skilled in the art, without departing from the spirit and scope of the present invention, any equivalent changes made by using the technical content disclosed above, such as slight modifications, decorations and evolutions, are all equivalent embodiments of the present invention; at the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A high thermal conductivity silicone gel, characterized in that: The invention comprises the following components in parts by weight: 100 parts of insulating thermal conductive filler, 0.1-0.3 parts of polyalphaolefin, 0.3-5 parts of vinyl silicone oil, 0.03-1 parts of hydrogen-containing silicone oil, 0.01-0.3 parts of acetylene alcohol modified silicone oil, 0.01-0.5 parts of catalyst, and 0-2 parts of additive; the viscosity of the polyalphaolefin at 100° C. is 1-40 mm 2 / s, viscosity index is 80-175.

2. The high thermal conductivity silicone gel according to claim 1, characterized in that: The polyalphaolefin is metallocene polyalphaolefin.

3. The high thermal conductivity silicone gel according to claim 1, characterized in that: The insulating thermal conductive filler is selected from at least one of aluminum nitride, diamond, aluminum oxide, boron nitride, silicon carbide, zinc oxide, and silicon nitride.

4. The high thermal conductivity silicone gel according to claim 3, characterized in that: The particle size of the insulating thermal conductive filler is 0.05-100 μm.

5. The high thermal conductivity silicone gel according to claim 4, characterized in that: The insulating thermally conductive filler is also subjected to surface modification treatment before use, and the treatment steps are: adding the insulating thermally conductive filler to the coupling agent, stirring at high speed or ultrasonically dispersing, keeping warm at 60-80° C. for 0.5-1h, filtering and drying.

6. The high thermal conductivity silicone gel according to claim 1, characterized in that: The vinyl silicone oil includes at least one of a linear vinyl silicone oil and a branched vinyl silicone oil. The linear vinyl silicone oil is a vinyl-terminated polysiloxane, and the branched vinyl silicone oil is a methyl-terminated polysiloxane containing a vinyl group in the side chain.

7. The high thermal conductivity silicone gel according to claim 6, characterized in that: The vinyl content of the vinyl silicone oil is 0.05-0.2wt%, and the viscosity of the vinyl silicone oil at 25°C is 300-2000mPa·s.

8. The high thermal conductivity silicone gel according to claim 1, characterized in that: The hydrogen content of the hydrogen-containing silicone oil is 0.01-10 wt %, and the viscosity of the hydrogen-containing silicone oil at 25° C. is 20-200 mPa·s.

9. The high thermal conductivity silicone gel according to claim 1, characterized in that: The catalyst is a hydrosilylation catalyst, and the additive comprises at least one of an antioxidant, a heat stabilizer, and a light stabilizer.

10. A method for preparing the high thermal conductivity silicone gel according to any one of claims 1 to 9, characterized in that: The specific preparation steps are: (1) The insulating thermal conductive filler, polyalphaolefin, vinyl silicone oil, hydrogenated silicone oil, acetylene alcohol modified silicone oil, catalyst, and additive are mixed uniformly, stirred at 100-140° C. for 0.5-4 h, and after cooling, acetylene alcohol modified silicone oil and catalyst are added, and stirring is continued for 0.5-2 h to obtain a glue solution; (2) Evacuate the mixture, heat and cure the glue at 120-150° C. to obtain a high thermal conductivity silicone gel.

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