Radar transmit-receive assembly reliability enhancement test method

Abstract

The invention relates to a radar transmit-receive assembly reliability enhancement test method. The method comprises the following steps: carrying out fault mode and influence analysis of a transmit-receive assembly; carrying out temperature distribution and vibration response analysis on the transmitting-receiving assembly to obtain a heat concentration point and a vibration sensitive point in the assembly; carrying out a low-temperature stepping stress test to obtain a low-temperature working limit or a damage limit of the product; carrying out a high-temperature stepping stress test to obtain a high-temperature working limit or a damage limit of the product; carrying out a rapid temperature change test; carrying out a vibration stepping test to obtain the vibration working limit of the product; carrying out a duty ratio stepping test to obtain a duty ratio working limit or a damage limit of the product; carrying out a comprehensive stress test; and carrying out a welding spot fatigue life test, and checking the welding spots in the assembly after the test is completed. According to the method, weak links of telecommunication and process design are found, corrective measures are taken, the working limit or damage limit of a product is expanded, the inherent reliability of the product is improved, and the use risk is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of reliability testing, and particularly to a reliability enhancement test method for a radar transceiver assembly. Background Art

[0002] An active phased array radar is a phased control electronically scanned array radar that realizes fast and accurate scanning by controlling the phase and amplitude of a large number of antenna elements in the array surface. This kind of radar has flexible beam pointing, multi-target tracking ability, strong anti-interference ability and high detection accuracy. Therefore, active phased array radar has become the main development direction of current radars and is widely used in national defense and military fields such as national air defense, shipborne early warning, airborne fire control, and airborne early warning, as well as civil fields such as meteorological observation, aerospace, traffic monitoring, and communication navigation.

[0003] In an active phased array radar antenna, each radiation unit is connected to a separate transceiver assembly at the back end. These assemblies can independently transmit and receive signals. Therefore, their performance and quantity directly determine the combat performance and overall state of the radar system. Along with the high-performance requirements and increasing integration of the radar system, the quantity of transceiver assemblies is also continuously increasing, and the power is gradually increasing. Their high reliability is the most important guarantee for the active phased array radar system. At present, the reliability assessment of radar transceiver assemblies mostly occurs in the later stage of testing, with a long test cycle, high test cost, late discovery of problems, and large impacts and losses caused by state changes, directly affecting customer satisfaction and product delivery progress.

[0004] The theoretical basis of reliability enhancement testing is the physics of failure, which belongs to excitation-type reliability development testing and does not assess the environmental adaptability of products. Without changing the failure mechanism of the product itself, by gradually applying temperatures, vibrations, and working stresses that exceed the product design specifications, continuous detection of the product is carried out, quickly stimulating design defects in the product into faults, analyzing their fault causes and mechanisms, and taking corresponding corrective measures and validations. Repeating this process, by improving the design, continuously searching for and optimizing the working limit and destruction limit of the product, the inherent reliability and environmental tolerance of the product are enhanced. Considering the large quantity, high cost, and complexity of testing and verification of transceiver assemblies in a radar, identifying their design defects and weak links in the early stage of component development and taking improvement measures to improve the inherent reliability of the product can effectively save research and development production costs. Therefore, carrying out reliability enhancement testing for radar transceiver assemblies has important engineering value. Summary of the Invention

[0005] To solve the technical problem that existing radar transceiver assemblies need to undergo reliability enhancement testing to stimulate design defects, the present invention provides a reliability enhancement test method for a radar transceiver assembly.

[0006] The specific content of the present invention is as follows: A reliability enhancement test method for a radar transceiver module, comprising the following steps: Step 1: Conduct a failure mode and effects analysis of the transceiver module, identify the weak links of the transceiver module, focus on components with lower quality grades and weaker temperature and vibration resistance performance, and prepare spare parts and rework measures in advance; Step 2: Conduct an analysis of the temperature distribution and vibration response of the transceiver module to obtain the internal heat concentration points and vibration sensitive points of the module; Step 3: Conduct a low-temperature step stress test, gradually apply low-temperature stress to the transceiver module and test it until the low-temperature working limit or failure limit T of the product is obtained Ln ; Step 4: Conduct a high-temperature step stress test, gradually apply high-temperature stress to the transceiver module and test it until the high-temperature working limit or failure limit T of the product is obtained Hn ; Step 5: Conduct a rapid temperature change test; Step 6: Conduct a vibration step test to obtain the vibration working limit G of the product n ; Step 7: Conduct a duty cycle step test to obtain the duty cycle working limit or failure limit D of the product n ; Step 8: Conduct a combined stress test; Step 9: Conduct a solder joint fatigue life test, and inspect the internal solder joints of the module after the test.

[0007] Furthermore, in Step 1, before the test starts, a complete component information table, an FMEA analysis report, or a summary table of faults found in the production, testing, and inspection processes of similar products is formed. The component information table includes a component list, the ultimate working environment, the ultimate storage environment, and the quality grade.

[0008] Furthermore, in Step 2, the temperature distribution investigation includes: under normal ambient temperature and normal working conditions, using an infrared thermal imager for non-contact temperature investigation or using a temperature data logger to conduct a contact temperature investigation on the transceiver module to form a temperature investigation record table. The temperature investigation record table contains the ambient temperature, part / device name, and thermal measurement results. The parts / devices investigated include power amplifier modules, limiting low-noise amplifiers, circulators, power supply chips, and field effect transistors; The vibration response investigation includes: arranging vibration sensors on or near components that are more sensitive to vibration or on relatively weak structural parts. The vibration investigation record table includes the location / part / device name, excitation spectrum type, and response spectrum type. The location / part / device name includes printed circuit boards, busbars, heat sink plates, and cover plates.

[0009] Further, in step three, conducting the low-temperature step stress test includes: using the low-temperature operating temperature specified in the technical requirements plus 20°C as the starting temperature T of the low-temperature stress test L1 , if this temperature value is greater than 0°C, then use 0°C as the starting temperature of the low-temperature stress. The temperature change rate is taken as the limit temperature change rate of the test equipment. Before reaching the low-temperature operating temperature specified in the technical requirements, the step size is 10°C. After reaching the low-temperature operating temperature specified in the technical requirements, the step size is 5°C. Gradually apply the low-temperature stress to the transceiver assembly and test until the low-temperature operating limit or failure limit T of the product is obtained Ln .

[0010] Further, in step four, conducting the high-temperature step stress test includes: using the high-temperature operating temperature specified in the technical requirements minus 20°C as the starting temperature T of the high-temperature stress test H1 , if this temperature value is less than 40°C, then use 40°C as the starting temperature of the high-temperature stress. The temperature change rate is taken as the limit temperature change rate of the test equipment. Before reaching the high-temperature operating temperature specified in the technical requirements, the step size is 10°C. After reaching the high-temperature operating temperature specified in the technical requirements, the step size is 5°C. Gradually apply the high-temperature stress to the transceiver assembly and test until the high-temperature operating limit or failure limit T of the product is obtained Hn .

[0011] Further, in step five, conducting the rapid temperature change test includes: using the high-temperature operating limit temperature - 5°C as the upper limit temperature and the low-temperature operating limit temperature + 5°C as the lower limit temperature. The temperature change rate is taken as the limit temperature change rate of the test equipment, and the number of applied cycles is not less than 5 times

[0012] Further, in step six, conducting the vibration step test includes: using the vibration level specified in the technical requirements as the starting level G 1 , the step value is 5 grms. Gradually apply the vibration stress to the transceiver assembly and test. When the level exceeds 20 grms, reduce the vibration level to 5 grms and then test until the vibration operating limit G of the product is obtained n .

[0013] Further, conducting the duty cycle step test includes: using the duty cycle specified in the technical requirements as the starting level R 1 , gradually apply the duty cycle stress to the transceiver assembly and test until the duty cycle operating limit or failure limit D of the product is obtained n .

[0014] Further, conducting the combined stress test includes: the application method of the temperature stress is: using the high-temperature operating limit temperature - 5°C as the upper limit temperature and the low-temperature operating limit temperature + 5°C as the lower limit temperature. The temperature change rate is taken as the limit temperature change rate of the test equipment, and the number of applied cycles is not less than 5 times; the application method of the vibration stress is: using the vibration level specified in the technical requirements as the starting level G1 Apply vibration stress to the transceiver component step by step with a step value of 5 grms and test. When the magnitude exceeds 20 grms, reduce the vibration magnitude to 5 grms and then test until the vibration operating limit G of the product is obtained. n ; Each vibration magnitude corresponds to a temperature cycle change, with the vibration operating limit G n Divided by the number of cycles N as the starting vibration magnitude of the vibration stress.

[0015] Furthermore, the solder joint fatigue life test is carried out as follows: with the upper limit temperature being the high-temperature operating limit temperature - 5°C and the lower limit temperature being the low-temperature operating limit temperature + 5°C, the temperature change rate is taken as 10°C / min, the number of applied cycles is not less than 200 times, and the component is tested every 5 times. After the test is completed, the internal solder joints of the component are inspected.

[0016] The present invention improves the inherent reliability of the product and reduces the usage risk by finding the weak links in telecommunications and process design, taking corrective measures, expanding the operating limit or failure limit of the product. At the same time, it provides a basis for environmental stress screening, the determination of reliability growth test conditions, and the expanded application of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The following further clarifies the specific embodiments of the present invention with reference to the drawings.

[0018] Figure 1 is the flowchart of the reliability enhancement test for the radar transceiver component of the present invention; Figure 2 is the schematic diagram of the low-temperature step stress test; Figure 3 is the schematic diagram of the high-temperature step stress test; Figure 4 is the schematic diagram of the rapid temperature cycle change test; Figure 5 is the schematic diagram of the vibration step stress test; Figure 6 is the schematic diagram of the duty cycle step stress test; Figure 7 is the schematic diagram of the combined stress test; Figure 8 is the schematic diagram of the solder joint fatigue life test; Figure 9 is the low-temperature step stress test profile of the embodiment of the present invention; Figure 10 is the high-temperature step stress test profile of the embodiment of the present invention; Figure 11 is the rapid temperature cycle change test profile of the embodiment of the present invention; Figure 12 is the vibration step stress test profile of the embodiment of the present invention; Figure 13 Duty cycle step stress test profile of the embodiment of the present invention; Figure 14 Comprehensive stress test profile of the embodiment of the present invention; Figure 15 Solder joint fatigue test profile of the embodiment of the present invention. Specific implementation manners

[0019] Combined with Figures 1-8 , the reliability enhancement test method for radar transceiver components of the present invention includes the following steps: Step 1: Conduct failure mode and effect analysis of the transceiver components, identify the weak links of the transceiver components, focus on the components with lower quality grades and weaker temperature and vibration resistance performance, and prepare spare parts and rework measures in advance.

[0020] Step 2: Conduct temperature distribution and vibration response analysis of the transceiver components to obtain the internal heat concentration points and vibration sensitive points of the components for arranging sensors in the test.

[0021] Step 3: Conduct a low-temperature step stress test, and the low-temperature stress application method is shown in Figure 2 . Use the low-temperature operating temperature specified in the technical requirements plus 20°C as the starting temperature T of the low-temperature stress test L1 . If this temperature value is greater than 0°C, then use 0°C as the starting temperature of the low-temperature stress. The temperature change rate takes the limit temperature change rate of the test equipment. The step size is 10°C before reaching the low-temperature operating temperature specified in the technical requirements, and the step size is 5°C after reaching the low-temperature operating temperature specified in the technical requirements. Gradually apply low-temperature stress to the transceiver components and test until the low-temperature operating limit or failure limit T of the product is obtained Ln .

[0022] Step 4: Conduct a high-temperature step stress test, and the high-temperature stress application method is shown in Figure 3 . Use the high-temperature operating temperature specified in the technical requirements minus 20°C as the starting temperature T of the high-temperature stress test H1 . If this temperature value is less than 40°C, then use 40°C as the starting temperature of the high-temperature stress. The temperature change rate takes the limit temperature change rate of the test equipment. The step size is 10°C before reaching the high-temperature operating temperature specified in the technical requirements, and the step size is 5°C after reaching the high-temperature operating temperature specified in the technical requirements. Gradually apply high-temperature stress to the transceiver components and test until the high-temperature operating limit or failure limit T of the product is obtained Hn .

[0023] Step 5: Conduct a rapid temperature change test, and the rapid temperature change test stress application method is shown in Figure 4With the upper limit temperature being the high-temperature operating limit temperature of -5°C and the lower limit temperature being the low-temperature operating limit temperature of +5°C, the temperature change rate is taken as the limit temperature change rate of the test equipment, and the number of applied cycles is not less than 5 times.

[0024] Step 6: Conduct a vibration step test. The method of applying the vibration test stress is shown in Figure 5 . Use the vibration level specified in the technical requirements as the starting level G 1 , and the step value is 5 grms. Gradually apply the vibration stress to the transceiver assembly and test (when the level exceeds 20 grms, reduce the vibration level to 5 grms and then test) until the vibration operating limit G of the product is obtained n .

[0025] Step 7: Conduct a duty cycle step test. The method of applying the duty cycle test stress is shown in Figure 6 . Use the duty cycle specified in the technical requirements as the starting level R 1 , gradually apply the duty cycle stress to the transceiver assembly and test until the duty cycle operating limit or failure limit D of the product is obtained n .

[0026] Step 8: Conduct a combined stress test. The method of applying the combined stress is shown in Figure 7 . The method of applying the temperature stress is the same as that of the rapid temperature change test, with no less than 5 cycles. The vibration stress is applied step by step, and each vibration level corresponds to a temperature change cycle. Use the vibration operating limit G n divided by the number of cycles N as the starting vibration level of the vibration stress.

[0027] Step 9: Conduct a solder joint fatigue life test. The method of applying the stress is shown in Figure 8 . With the upper limit temperature being the high-temperature operating limit temperature of -5°C and the lower limit temperature being the low-temperature operating limit temperature of +5°C, the temperature change rate is taken as 10°C / min, and the number of applied cycles is not less than 200 times. The assembly is tested every 5 times. After the test is completed, check the internal solder joints of the assembly.

[0028] Taking a newly developed radar transceiver assembly as an example, the technical solutions in the embodiments of the present invention are described in more detail.

[0029] Step 1: Conduct an analysis of the component list and FMEA of the transceiver assembly Before the test starts, a complete component information table (including component list, extreme operating environment, extreme storage environment, quality grade, etc.), an FMEA analysis report, or a summary table of faults found during the production, test, and inspection of similar products should be formed. During the test, key attention should be paid to weak links such as components and parts with lower quality grades and weaker temperature and vibration resistance. Prepare spare parts and rework and repair plans in advance.

[0030] Step 2: Conduct analysis on the temperature distribution and vibration response of the transceiver assembly Before the test starts, under normal ambient temperature and normal working conditions, use an infrared thermal imager for non-contact temperature survey or a temperature patrol instrument for contact temperature survey of the transceiver assembly to understand its thermal distribution and temperature rise, providing a reference for the layout of temperature sensors in the test. Record the temperature survey results according to the requirements in the following table.

[0031] Table 1 Radar Transceiver Assembly Temperature Survey Record Form

[0032] Conduct a vibration response survey to preliminarily understand the vibration response characteristics of the transceiver assembly. The vibration sensors should be arranged on or near the components that are more sensitive to vibration or on relatively weak structural parts to obtain the vibration values at these test points, providing a reference for troubleshooting in the test. Record the vibration survey results according to the requirements in the following table.

[0033] Table 2 Radar Transceiver Assembly Vibration Survey Record Form

[0034] Step 3: Low-temperature step stress test The low-temperature working requirement for the assembly is -40°C. Take -20°C as the starting temperature of the low-temperature stress test, with a temperature change rate of 60°C / min and step levels of -20°C, -30°C, -40°C, -45°C, -50°C, -55°C... Insulate for 2 hours at each temperature step. After the power-on temperature stabilizes, power on and start, and conduct 3 start-up detections to assess the start-up ability of the assembly at extreme temperatures. Conduct functional and performance tests on the assembly after the 3rd start-up, and cut off the power after the test is completed. The test profile is shown in Figure 9 .

[0035] When the temperature steps to -85°C, the transceiver assembly tests normally; when the temperature steps to -90°C, the transceiver assembly cannot start normally; when the temperature step is raised to -85°C again, the transceiver assembly cannot work normally; when the temperature is restored to normal temperature, the transceiver assembly still cannot work normally. Therefore, it is determined that the low-temperature working limit of the transceiver assembly is -85°C and the low-temperature damage limit is -90°C. After analysis, the cause of the failure is the chip failure in the transceiver assembly. Since this limit far exceeds the low-temperature working requirement specified in the technical requirements, no improvement is made to this failure.

[0036] Step 4: High-temperature step stress test The high-temperature operating requirement for the component is 60°C. Using 40°C as the starting temperature for the high-temperature stress test, the temperature change rate is 60°C / min, and the step increments are 40°C, 50°C, 60°C, 65°C, 70°C, 75°C... At each temperature step, keep it insulated for 2 hours. After the power-on temperature stabilizes, power on and start, and conduct 3 start-up detections to assess the start-up ability of the component at extreme temperatures. After the 3rd start-up, conduct functional and performance tests on the component, and power off after the tests are completed. The test profile is shown in Figure 10 。

[0037] When the temperature steps up to 110°C, the transceiver component works normally; when the temperature steps up to 115°C, 4 channels of the transceiver component cannot work properly; when the temperature step is lowered back to 110°C, the transceiver component works normally; when the temperature returns to normal temperature, the transceiver component works normally. Therefore, it is determined that the high-temperature operating limit of the transceiver component is 110°C. After analysis, the cause of the failure is that the FPGA device in the transceiver component is over-temperature protected. Since this operating limit far exceeds the high-temperature operating requirements specified in the technical requirements, the destruction limit of the component is not sought.

[0038] Step Five: Rapid Temperature Change Test Based on the results of the low-temperature step and high-temperature step stress tests, conduct a rapid temperature change test. Using 105°C as the upper limit temperature and -80°C as the lower limit temperature, the temperature change rate is 60°C / min, and the number of applied cycles is 5 times. Keep it insulated for 2 hours at high temperature and low temperature. Conduct 3 start-up detections at the beginning stage of each cycle of temperature increase or decrease to assess the start-up ability of the component under rapid temperature change. After the 3rd start-up detection, conduct tests on the component, and power off after the tests are completed. The test profile is shown in Figure 11 。

[0039] The transceiver component has no faults during the entire test process.

[0040] Step Six: Vibration Step Test Using 5 grms as the starting magnitude for the vibration stress test, the step increments are 10 grms, 15 grms, 20 grms, 25 grms, 30 grms, 35 grms... Conduct power-on tests throughout the process. When the vibration steps up to 45 grms, the transceiver component works normally; when the vibration steps up to 50 grms, the transceiver component cannot work properly; when the vibration step is lowered back to 5 grms, the transceiver component still cannot work properly. Therefore, it is determined that the vibration operating limit of the transceiver component is 45 grms, and the vibration destruction limit of the transceiver component is 50 grms. Since this limit far exceeds the vibration operating requirements specified in the technical requirements, no improvement is made to this fault. The test profile is shown in Figure 12 。

[0041] Step Seven: Duty Cycle Step Test Starting from a duty cycle of 5%, the step increments are 5%, 10%, 15%, 20%, 25%, 30%... Each step is baked for 2 hours. The test profile is shown in Figure 13 .

[0042] When the duty cycle is 35%, the component works normally; when the duty cycle is 40%, the transceiver component works abnormally; the duty cycle is reduced to 35%. The component still cannot work normally. Therefore, it is determined that the working limit of the duty cycle of the transceiver component is 35%, and the failure limit of the duty cycle is 40%. After analysis, the failure is that the connector inside the component has plastic deformation due to excessive temperature. By changing the connector size to improve its high-temperature resistance performance, it is verified that the transceiver components with duty cycles of 40% and 45% work normally, and work abnormally at a duty cycle of 50%. Therefore, the working limit of the duty cycle of the transceiver component is increased to 45%, and the failure limit of the duty cycle is 50%.

[0043] Step Eight: Comprehensive Stress Test With 105°C as the upper limit temperature, -80°C as the lower limit temperature, the temperature change rate is 60°C / min, and the number of applied cycles is 5 times. Keep warm for 2 hours at high temperature and low temperature, and apply vibration stresses of 9 grms, 18 grms, 27 grms, 36 grms, and 40 grms respectively during the temperature change process. Test at a duty cycle of 45%. The test profile is shown in Figure 14 , and there is no failure in the transceiver component during the test process.

[0044] Step Nine: Solder Joint Fatigue Life Test With 105°C as the upper limit temperature, -80°C as the lower limit temperature, the temperature change rate is 10°C / min. The test profile is shown in Figure 15 . When the number of applied cycles is 95 times, the transceiver component works abnormally during the test. After analysis, it is found that there are fatigue cracks in the high-lead solder balls at the bottom of a certain device inside the component. After changing the high-lead solder balls at the bottom to high-lead solder posts, the component tests normally after 200 cycles, and the fatigue life of the solder joints is improved.

[0045] The reliability enhancement test method for the radar transceiver component of the present invention can quickly stimulate the defects of the newly developed radar transceiver component and expose the weak links in the design by applying low-temperature step stress, high-temperature step stress, rapid temperature change stress, vibration step stress, duty cycle step stress, comprehensive stress, and solder joint fatigue life stress, find and increase its working limit and failure limit; at the same time, by analyzing the mechanism of the faults and failures occurring during the test process and taking improvement measures, the purpose of discovering defects as early as possible and correcting them can be achieved, and the inherent reliability of the radar transceiver component can be improved.

[0046] Numerous specific details are set forth in the foregoing description in order to provide a thorough understanding of the present invention. However, the above description is only a preferred embodiment of the present invention, and the present invention can be implemented in many other ways different from those described herein. Therefore, the present invention is not limited by the specific embodiments disclosed above. At the same time, any person skilled in the art can make many possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present invention, or modify it into equivalent embodiments with equivalent changes. All simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A radar transceiver component reliability enhancement test method, characterized in that: The steps include: Step 1: Conduct failure mode and impact analysis of transceiver components, identify weak links of transceiver components, focus on components with lower quality grades and weaker temperature and vibration resistance, and prepare spare parts and rework and repair measures in advance; Step 2: Conduct temperature distribution and vibration response analysis of the transceiver components to obtain the heat concentration points and vibration sensitive points in the components; Step 3: Conduct low-temperature step stress test, gradually apply low-temperature stress to the transceiver components and test until the low-temperature working limit or damage limit T of the product is obtained. Ln ; Step 4: Conduct high temperature step stress test, gradually apply high temperature stress to the transceiver components and test until the high temperature working limit or destruction limit T of the product is obtained. Hn ; Step 5: Conduct rapid temperature change test; Step 6: Conduct a vibration step test to obtain the product's vibration working limit G n ; Step 7: Carry out duty cycle step test to obtain the duty cycle working limit or damage limit D of the product n ; Step 8: Conduct comprehensive stress test; Step 9: Conduct solder joint fatigue life test and inspect the internal solder joints of the components after the test is completed.

2. The radar transceiver component reliability enhancement test method according to claim 1, characterized in that: Step 1: Before the test begins, a complete component information table, FMEA analysis report or a summary table of failures found in the production, testing and inspection of similar products is prepared. The component information table includes a component list, extreme working environment, extreme storage environment and quality grade.

3. The radar transceiver component reliability enhancement test method according to claim 1, characterized in that: In step 2, the temperature distribution survey includes: under normal ambient temperature and normal working conditions, a non-contact temperature survey is conducted using an infrared thermal imager or a contact temperature survey is conducted on the transceiver components using a temperature inspection instrument to form a temperature survey record sheet, which includes the ambient temperature, the name of the parts / devices, and the thermal measurement results. The parts / devices surveyed include power amplifier modules, limiting low noise amplifiers, circulators, power chips, and field effect transistors; The vibration response survey includes: the vibration sensor is arranged on or near the components that are sensitive to vibration, or on relatively weak structural parts. The vibration survey record sheet includes the name of the part / part / device, the excitation spectrum, and the response spectrum. The names of the parts / parts / devices include printed circuit boards, bus bars, heat conduction plates, and cover plates.

4. The radar transceiver component reliability enhancement test method according to claim 1, characterized in that: In step 3, the low temperature step stress test is carried out, including: taking the low temperature working temperature specified in the technical requirements plus 20°C as the starting temperature T of the low temperature stress test L1 If the temperature value is greater than 0℃, 0℃ is used as the starting temperature of low-temperature stress, and the temperature change rate is the limit temperature change rate of the test equipment. The step length is 10℃ before reaching the low-temperature working temperature specified in the technical requirements, and the step length is 5℃ after reaching the low-temperature working temperature specified in the technical requirements. Low-temperature stress is gradually applied to the transceiver components and tested until the low-temperature working limit or destruction limit T of the product is obtained. Ln .

5. The radar transceiver component reliability enhancement test method according to claim 1, characterized in that: In step 4, the high temperature step stress test is carried out, including: taking the high temperature working temperature specified in the technical requirements minus 20°C as the starting temperature T of the high temperature stress test H1 If the temperature value is less than 40℃, 40℃ is used as the starting temperature of high temperature stress, and the temperature change rate is the limit temperature change rate of the test equipment. The step length is 10℃ before reaching the high temperature working temperature specified in the technical requirements, and the step length is 5℃ after reaching the high temperature working temperature specified in the technical requirements. High temperature stress is gradually applied to the transceiver components and tested until the high temperature working limit or destruction limit T of the product is obtained. Hn .

6. The radar transceiver component reliability enhancement test method according to claim 1, characterized in that: In step five, a rapid temperature change test is carried out, including: taking the high temperature working limit temperature of -5°C as the upper limit temperature, the low temperature working limit temperature of +5°C as the lower limit temperature, the temperature change rate taking the limit temperature change rate of the test equipment, and the number of cycles applied is not less than 5 times.

7. The radar transceiver component reliability enhancement test method according to claim 1, characterized in that: In step 6, the vibration step test includes: taking the vibration level specified in the technical requirements as the starting level G1, the step value is 5grms, gradually applying vibration stress to the transceiver components and testing, when the level exceeds 20grms, reducing the vibration level to 5grms and then testing until the vibration working limit G of the product is obtained. n .

8. The radar transceiver component reliability enhancement test method according to claim 1, characterized in that: Carrying out duty cycle step test includes: taking the duty cycle specified in the technical requirements as the starting level R1, gradually applying duty cycle stress to the transceiver components and testing until the product's duty cycle working limit or damage limit D is obtained. n .

9. The radar transceiver component reliability enhancement test method according to claim 1, characterized in that: Comprehensive stress tests include: temperature stress is applied in the following ways: the high temperature working limit temperature -5℃ is used as the upper limit temperature, the low temperature working limit temperature +5℃ is used as the lower limit temperature, the temperature change rate is the limit temperature change rate of the test equipment, and the number of applied cycles is not less than 5 times; vibration stress is applied in the following ways: the vibration level specified in the technical requirements is used as the starting level G1, the step value is 5grms, vibration stress is gradually applied to the transceiver components and tested, when the level exceeds 20grms, the vibration level is reduced to 5grms and then tested until the vibration working limit G1 of the product is obtained. n Each vibration level corresponds to a temperature change cycle, with the vibration working limit G n Divide by the number of cycles N as the starting vibration level of vibration stress.

10. The radar transceiver component reliability enhancement test method according to claim 1, characterized in that: The fatigue life test of solder joints includes: taking the high temperature working limit temperature of -5℃ as the upper limit temperature, the low temperature working limit temperature of +5℃ as the lower limit temperature, the temperature change rate is 10℃ / min, the number of cycles is not less than 200 times, the components are tested every 5 times, and the internal solder joints of the components are inspected after the test is completed.

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