Domain controller housing assembly and domain controller

Abstract

The invention provides a domain controller shell assembly and a domain controller, the domain controller shell assembly comprises a main board, the main board is provided with a first surface and a second surface opposite to the first surface, the end part of the main board is provided with a water inlet nozzle and a water outlet nozzle, and the water inlet nozzle and the water outlet nozzle are communicated with the main board; a U-shaped flow channel connected to the water inlet nozzle and the water outlet nozzle respectively is arranged on the first surface of the main plate; the flow channel cover plate is mounted on the U-shaped flow channel, so that a closed flow channel is formed between the main plate and the flow channel cover plate; the first shell is combined to the first surface of the main board and covers the first surface and the flow channel cover plate; the second shell is combined to the second surface of the main board and covers the second surface; a plurality of PCBs can be installed in the domain controller shell assembly, compact arrangement of the shell structure is achieved, and efficient heat dissipation and reliable protection can be provided for the PCBs.

Description

Technical Field

[0001] The present application relates to the technical field of vehicle controllers, and in particular, to a domain controller housing assembly and a domain controller. Background Art

[0002] The automotive domain controller integrates the functions of multiple ECUs into one or more high-performance ECUs, performs a wide range of functional integration, and improves the reliability of the system. Since there are certain functional collaborations between different domains, such as the driver status monitoring system in the cockpit domain and the autonomous driving system can be linked to automatically adjust the autonomous driving mode and strategy according to the driver's status, cross-domain integration has gradually become a development trend. In recent years, with the support of greatly improved chip manufacturing processes and computing power, multi-domain controllers can achieve information sharing and collaborative work between different functional domains, providing users with a more intelligent and safe driving experience. At present, multi-domain controllers have become a hot research object in the field of vehicle controllers.

[0003] The multi-domain controller integrates multiple domain functions, so it usually involves multiple printed circuit board assemblies (PCBA: Printed Circuit Board Assembly), which leads to an increase in the size of the shell structure required for the controller. However, when installing the controller, it is necessary to find an installation location within the limited body space of the car (usually inside the center console), which requires the shell structure of the multi-domain controller to be compact, so it is necessary to arrange multiple PCBAs in the controller reasonably. The multi-domain controller integrates more module functions, which increases the heat generated during operation and is relatively concentrated, which requires the water cooling system of the multi-domain controller to have efficient heat dissipation capabilities. At the same time, the controller may be affected by vibration, shock, static electricity and electromagnetic compatibility during vehicle driving, which also puts higher requirements on the functional installation stability, anti-collision protection, anti-static ability of the PCBA motherboard and electromagnetic compatibility (EMC: Electro Magnetic Compatibility) of the multi-domain controller.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] One aspect of the present application is to solve a technical problem of how to make the housing structure of the multi-domain controller more compact and how to improve the heat dissipation capability of the multi-domain controller.

[0006] In addition, other aspects of the present application are also intended to solve or alleviate other technical problems existing in the prior art.

[0007] The present application provides a domain controller housing assembly. Specifically, according to one aspect of the present application, there is provided:

[0008] A domain controller housing assembly, comprising:

[0009] A main board having a first surface and a second surface opposite to the first surface. An inlet nozzle and an outlet nozzle are provided at an end of the main board, and a U-shaped flow channel connecting to the inlet nozzle and the outlet nozzle respectively is provided on the first surface of the main board;

[0010] A flow channel cover plate is installed on the U-shaped flow channel such that a closed flow channel is formed between the main board and the flow channel cover plate;

[0011] A first housing is coupled to the first surface of the main board and covers the first surface and the flow channel cover plate;

[0012] A second housing is coupled to the second surface of the main board and covers the second surface.

[0013] Optionally, according to an embodiment of the present application, a plurality of U-shaped partition ribs are provided in the U-shaped flow channel, which divide the U-shaped flow channel into a plurality of U-shaped sub-flow channels, and the plurality of U-shaped partition ribs have the same spacing therebetween.

[0014] Optionally, according to an embodiment of the present application, threaded connection portions are provided on the inlet nozzle and the outlet nozzle, and threaded holes matching the threaded connection portions are provided on the main board, and the inlet nozzle and the outlet nozzle are connected to the threaded holes through the threaded connection portions.

[0015] Optionally, according to an embodiment of the present application, at least one heat-conducting boss is provided on both the first surface and the second surface of the main board for dissipating heat of chips on an adjacent PCB board.

[0016] Optionally, according to an embodiment of the present application, a heat-conducting boss is provided on a side of the flow channel cover plate facing the first housing for dissipating heat of chips on a PCB board installed at the flow channel cover plate.

[0017] Optionally, according to an embodiment of the present application, a layered bracket is further provided between the main board and the second housing. The layered bracket includes a bracket main body and a heat-conducting support portion provided at an edge of the bracket main body. The layered bracket is supported on the main board through the heat-conducting support portion and a gap for accommodating a PCB board is maintained between the layered bracket and the main board.

[0018] Optionally, according to an embodiment of the present application, at least one heat-conducting boss is provided on a side of the layered bracket facing the mainboard, so as to dissipate heat from a chip on a PCB board adjacent thereto.

[0019] Optionally, according to an embodiment of the present application, a plug-in through hole is provided on the layered bracket.

[0020] According to another aspect of the present application, the present application provides a domain controller, wherein the domain controller includes the domain controller housing assembly described above and at least two PCB boards, at least one PCB board is arranged on both sides of the main board, and a first PCB board is arranged between the flow channel cover plate and the first housing.

[0021] Optionally, according to an implementation of another aspect of the present application, the domain controller further comprises a layered bracket, the layered bracket is arranged between the mainboard and the second shell and supported on the mainboard, and a plug-in through hole is arranged on the layered bracket;

[0022] A second PCB board is arranged between the layered bracket and the main board, and a third PCB board is arranged between the layered bracket and the second shell. The second PCB board and the third PCB board are electrically connected through the plug-in through hole to achieve communication.

[0023] Optionally, according to an embodiment of another aspect of the present application, the second PCB board is fixed on the second surface of the main board within a position area relative to the U-shaped channel, the third PCB board is also fixed on the second surface and is separated from the second PCB board by the layered bracket, and a fourth PCB board is arranged adjacent to the second PCB board on the second surface.

[0024] Optionally, according to an implementation of another aspect of the present application, a fifth PCB board is arranged on the first surface of the main board adjacent to the first PCB board.

[0025] Benefits of this application include:

[0026] 1. A domain controller proposed in one embodiment of the present application adds a mainboard in the middle of the housing, arranges multiple PCBs (Printed Circuit Boards) at different positions on both sides of the mainboard, and reasonably utilizes the installation space to arrange and install the PCBs, thereby realizing a compact arrangement of multiple PCBs of different sizes and functions, reducing the overall structural size of the domain controller housing, and providing better anti-static and electromagnetic compatibility protection for the PCBs;

[0027] 2. In a domain controller proposed in an embodiment of the present application, a flow channel for cooling is provided on the main board, enabling both sides of the main board to have a cooling function. This efficiently utilizes the internal space of the housing to provide a large cooling and heat dissipation space, which is beneficial to the reasonable layout of the PCB board.

[0028] 3. In a domain controller proposed in an embodiment of the present application, through the isolation and installation functions of the hierarchical bracket, the domain controller can integrate as many PCB boards as possible with different sizes and functions, and ensure the compact layout, effective cooling, and normal communication between the PCB boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Referring to the accompanying drawings, the above and other features of the present application will become apparent. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the protection scope of the present application. In addition, similar numbers in the figures are used to represent similar components, where

[0030] Figure 1 shows an exploded schematic diagram of a domain controller proposed in an embodiment of the present application;

[0031] Figure 2 shows a schematic diagram of the first side of the main board with a flow channel provided according to an embodiment of the present application;

[0032] Figure 3 shows Figure 2 a schematic diagram of the second side of the main board in

[0033] Figure 4 shows a schematic diagram of the structure of a flow channel cover plate proposed in an embodiment of the present application;

[0034] Figure 5 shows a schematic diagram of the structure when a hierarchical bracket supports the main board according to an embodiment of the present application;

[0035] Figure 6 shows a schematic diagram of the structure of a first housing proposed in an embodiment of the present application;

[0036] Figure 7 shows a schematic diagram of the structure of a second housing proposed in an embodiment of the present application;

[0037] Figure 8 shows a cross-sectional view of a domain controller proposed in an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0038] It is easy to understand that according to the technical solution of the present application, under the condition of not changing the essential spirit of the present application, those of ordinary skill in the art can propose various interchangeable structural forms and implementation manners. Therefore, the following specific embodiments and the accompanying drawings are only exemplary illustrations of the technical solution of the present application, and should not be regarded as the whole of the present application or as a limitation or restriction on the technical solution of the present application.

[0039] The orientation terms such as up, down, left, right, front, back, front side, back side, top, bottom, etc. mentioned or possibly mentioned in this specification are defined with respect to the structures shown in the respective drawings. They are relative concepts and may therefore change accordingly depending on their different positions and different usage states. Therefore, these or other orientation terms should not be construed as restrictive terms. In addition, the terms "first", "second", "third", etc. or similar expressions are only used for descriptive and distinguishing purposes, and should not be understood as indicating or implying the relative importance of the corresponding components or the sequence of components or the assembly sequence.

[0040] Reference Figure 1 , which shows a decomposition schematic diagram of a domain controller proposed according to an embodiment of the present application. The domain controller 10 includes a domain controller housing assembly and a plurality of PCB boards, which can achieve a compact layout and efficient heat dissipation of the plurality of PCB boards, and the domain controller housing assembly has a relatively small overall structural size and can provide good anti-static and electromagnetic compatibility protection for the PCB boards. The domain controller housing assembly includes a first housing 100, a second housing 200, a main board 300, and a flow channel cover 400. The main board 300 is disposed between the first housing 100 and the second housing 200, and has a first surface 310 and a second surface 320 opposite to the first surface 310. The first housing 100 and the second housing 200 are respectively connected to the main board 300 by bolts, and cover the first surface 310 and the second surface 320 of the main board 300, thereby protecting the PCB boards and other structures (such as the flow channel cover 400) mounted on the main board 300. A U-shaped flow channel 311 is disposed on the first surface 310 of the main board 300. The two end portions of the U-shaped flow channel 311 are respectively disposed at the end portions of the main board 300 and are respectively connected to a water inlet nozzle 301 and a water outlet nozzle 302. Through the U-shaped flow channel 311, the main board 300 can provide cooling for the PCB boards on both its first surface 310 and the second surface 320, which increases the level of the heat dissipation space in the domain controller housing assembly and is beneficial to improving the cooling effect of the PCB boards arranged at different positions.

[0041] In an embodiment of the present application, threaded connection portions are provided on the water inlet nozzle 301 and the water outlet nozzle 302, and threaded holes matching the threaded connection portions are provided at the ends of the main board 300. The water inlet nozzle 301 and the water outlet nozzle 302 are screwed into the threaded holes through the threaded connection portions. It should be understood that the water inlet nozzle 301 and the water outlet nozzle 302 can be set as the linear water nozzles as described in Figure 1 or can be set as curved (such as L-shaped) water nozzles, etc. The water nozzles 301 and 302 are connected to the main board 300 through standardized thread fits. Thus, the main board 300 can be matched with different shapes or types of water nozzles with standardized threaded connection portions without re-performing the overall structural design.

[0042] Refer to Figure 2 , which shows a schematic diagram of the first surface 310 of the main board 300 provided with a flow channel according to an embodiment of the present application. In an embodiment of the present application, a plurality of U-shaped partition ribs 312 are provided in the U-shaped flow channel 311, which divide the U-shaped channel 311 into a plurality of U-shaped sub-flow channels. There is especially the same spacing between the plurality of U-shaped partition ribs 312. In the Figure 2 embodiment, there are 4 U-shaped partition ribs 312, which divide the U-shaped channel 311 into 5 sub-flow channels. This setting method of a plurality of sub-flow channels can make the coolant evenly distributed in the channel and increase the flow rate of the coolant in the flow channel, thereby improving the cooling effect of the PCB board.

[0043] Refer to Figure 3 , which shows Figure 2 a schematic diagram of the second surface 320 of the main board 300 in Figure 2 and Figure 3 . It can be seen from

[0044] Refer to Figure 4, which shows a schematic structural diagram of a runner cover plate 400 proposed according to an embodiment of the present application. The runner cover plate 400 is installed on the U-shaped runner 311, for example, welded, especially friction-welded, to the runner wall of the U-shaped runner 311, so as to form a closed runner between the main board 300 and the runner cover plate 400. In the case where the partition ribs 312 are provided, the top of the partition ribs 312 is attached to the runner cover plate 400, so that the sub-runners are relatively independent and sealed. A heat-conducting boss 401 is provided on the side of the runner cover plate 400 facing the first housing 100, for dissipating heat from the chips on the PCB board installed at the runner cover plate 400.

[0045] Reference Figure 5 , which shows a schematic structural diagram of a hierarchical bracket 500 proposed according to an embodiment of the present application. The hierarchical bracket 500 is provided between the main board 300 and the second housing 200. It is used to space apart two PCB boards and realize heat dissipation of the adjacent PCB board. The hierarchical bracket 500 includes a bracket main body 501 and a heat-conducting support portion 502 provided at the edge of the bracket main body 501. The hierarchical bracket 500 is supported on the main board 300 through the heat-conducting support portion 502, and there is a gap for accommodating the PCB board between it and the main board 300. The hierarchical bracket 500 is made of, for example, metal aluminum with good heat conductivity. The PCB board adjacent to the hierarchical bracket 500 can transfer its heat to the main board 300 through the heat-conducting support portion 502 of the hierarchical bracket 500 to achieve heat dissipation. A heat-conducting boss 503 is provided on the side of the hierarchical bracket 500 facing the main board 300 for dissipating heat from the chips on the adjacent PCB board. Plug-through holes 504 are also provided on the hierarchical bracket 500. The PCB boards on both sides of the hierarchical bracket 500 can be electrically connected through the plug-through holes 504 to achieve board-to-board communication. The setting of the hierarchical bracket 500 further promotes the layering of the PCB board installation space in the domain controller housing assembly, so that more PCB boards can be installed in the housing assembly in layers without increasing the structural size of the housing assembly; at the same time, the short circuit between two adjacent PCB boards can also be prevented through the hierarchical bracket 500, and the connection between the hierarchical bracket 500 and the main board 300 can be used to promote the heat dissipation of the PCB board.

[0046] Reference Figure 6 , which shows a schematic structural diagram of the first housing 100 proposed according to an embodiment of the present application. The first housing 100 is made of, for example, galvanized steel sheet, especially through a stamping process, and it can play the role of EMC shielding and protection for the domain controller 10. In this embodiment, through holes 101, especially rectangular through holes, are provided on the first housing 100 for the connection and communication between the vehicle harness end and the domain controller 10.

[0047] Reference Figure 7, which shows a schematic structural diagram of the second housing 200 proposed according to an embodiment of the present application. The first housing 100 is manufactured in the same way as the first housing 100, for example, and it can also play the role of EMC shielding and protection for the domain controller 10. In this embodiment, a Bluetooth antenna mounting structure 201 is provided on the second housing 200 for the Bluetooth communication function of the intelligent cockpit.

[0048] Reference Figure 8 , which shows a cross-sectional view of the domain controller 10 proposed according to an embodiment of the present application. In the embodiment according to Figure 1 and Figure 8 , the domain controller 10 includes a domain controller housing assembly and five PCB boards 1, 2, 3, 4, and 5. Among them, the first PCB board 1 is arranged between the flow channel cover plate 400 and the first housing 100, and in particular, the chips on it are abutted against the heat-conducting bosses 401 of the flow channel cover plate 400 to guide the heat to the U-shaped flow channel 311 and dissipate the heat through the coolant in the flow channel. The second PCB board 2 is arranged between the layered bracket 500 and the main board 300, especially within the area relative to the U-shaped flow channel 311 on the second surface 320 of the main board 300, so that the second PCB board 2 can be better cooled by the coolant in the U-shaped flow channel 311. The second PCB board 2 is abutted against the heat-conducting bosses 303 and 503 of the main board 300 and the layered bracket 500 respectively through the chips on it. The third PCB board 3 is arranged between the layered bracket 500 and the second housing 200, and it is also fixed on the second surface 320 of the main board 300 and is spaced apart from the second PCB board 2 by the layered bracket 500. The third PCB board 3 and the second PCB board 2 are electrically connected and communicate through the plug-through holes 504 on the layered bracket 500. On the second surface 320 of the main board 300, a fourth PCB board 4 is arranged adjacent to the second PCB board 2, and the fourth PCB board 4 is also abutted against the heat-conducting boss 303 of the main board 300 through the chips on it. On the first surface 310 of the main board 300, a fifth PCB board 5 is arranged adjacent to the first PCB board 1, and the fifth PCB board 5 is abutted against the heat-conducting boss 303 of the main board 300 through the chips on it. The first PCB board 1 is connected and communicates with the third PCB board 3 through the plug-through hole 304 on the main board 300 in particular, and the fifth PCB board 5 is connected and communicates with the fourth PCB board 4 through the plug-through hole 304 on the main board 300 in particular. The third PCB board 3 and the fourth PCB board 4 are connected and communicate through docking. The first PCB board 1 is fixedly connected to the flow channel cover plate 400 by bolts, for example. The second PCB board 2, the third PCB board 3, the fourth PCB board 4, and the fifth PCB board 5 are fixedly connected to the main board 300 by bolts, for example.

[0049] It should be understood that those skilled in the art can set less than 5 PCB boards or more than 5 PCB boards in the domain controller 10 according to the design requirements. These PCB boards can be arranged at different positions on the main board according to their different sizes and shapes, and these situations should also be included within the protection scope of this application.

[0050] The domain controller housing assembly and the domain controller proposed in an embodiment of this application achieve a compact layout of the housing structure capable of installing multiple PCB boards, realize efficient heat dissipation of multiple PCB boards through the main board, and expand the hierarchical installation space of the PCB boards through the hierarchical bracket. In addition, the domain controller housing assembly also has high functional installation stability, anti-collision protection, and anti-static and electromagnetic compatibility protection.

[0051] It should be understood that all the above preferred embodiments are exemplary rather than restrictive, and all modifications or deformations made by those skilled in the art to the specific embodiments described above under the concept of this application should be within the legal protection scope of this application.

Claims

1. A domain controller housing assembly, characterized in that: include: A main board, the main board having a first surface and a second surface opposite to the first surface, a water inlet and a water outlet are arranged at the end of the main board, and a U-shaped flow channel connected to the water inlet and the water outlet respectively is arranged on the first surface of the main board; A flow channel cover plate, the flow channel cover plate being mounted on the U-shaped flow channel so as to form a closed flow channel between the main board and the flow channel cover plate; a first shell, the first shell being coupled to the first surface of the main board and covering the first surface and the flow channel cover plate; The second shell is coupled to the second surface of the mainboard and covers the second surface.

2. The domain controller housing assembly according to claim 1, characterized in that: A plurality of U-shaped partition ribs are arranged in the U-shaped flow channel, which divide the U-shaped flow channel into a plurality of U-shaped sub-flow channels, and the plurality of U-shaped partition ribs have the same spacing.

3. The domain controller housing assembly according to claim 1, characterized in that: The water inlet and the water outlet are provided with threaded connection parts, and the main board is provided with threaded holes matching the threaded connection parts. The water inlet and the water outlet are connected to the threaded holes through the threaded connection parts.

4. The domain controller housing assembly according to claim 1, characterized in that: At least one heat-conducting boss is disposed on the first surface and the second surface of the main board to dissipate heat from chips on the adjacent PCB board.

5. The domain controller housing assembly according to claim 1, characterized in that: A heat-conducting boss is arranged on one side of the flow channel cover plate facing the first shell, so as to dissipate heat of a chip on a PCB board mounted on the flow channel cover plate.

6. The domain controller housing assembly according to claim 1, characterized in that: A layered bracket is also provided between the mainboard and the second shell, and the layered bracket includes a bracket body and a heat-conducting support portion provided at the edge of the bracket body. The layered bracket is supported on the mainboard by the heat-conducting support portion and a gap is maintained between the layered bracket and the mainboard for accommodating a PCB board.

7. The domain controller housing assembly according to claim 6, characterized in that: At least one heat-conducting boss is arranged on a side of the layered bracket facing the mainboard, so as to dissipate heat of a chip on a PCB board adjacent thereto.

8. The domain controller housing assembly according to claim 6, characterized in that: The layered support is provided with a plug-in through hole.

9. A domain controller, characterized in that: The domain controller comprises a domain controller housing assembly according to any one of claims 1 to 8 and at least two PCB boards, at least one PCB board is arranged on both sides of the main board, and a first PCB board is arranged between the flow channel cover plate and the first housing.

10. The domain controller according to claim 9, characterized in that: The domain controller further comprises a layered bracket, the layered bracket is arranged between the mainboard and the second housing and supported on the mainboard, and a plug-in through hole is arranged on the layered bracket; A second PCB board is arranged between the layered bracket and the main board, and a third PCB board is arranged between the layered bracket and the second shell. The second PCB board and the third PCB board are electrically connected through the plug-in through hole to achieve communication.

11. The domain controller according to claim 10, characterized in that: The second PCB board is fixed to the second surface of the main board within a position area relative to the U-shaped channel, the third PCB board is also fixed on the second surface and is spaced apart from the second PCB board by the layered bracket, and a fourth PCB board is arranged adjacent to the second PCB board on the second surface.

12. The domain controller according to claim 9, characterized in that: A fifth PCB board is arranged on the first surface of the main board adjacent to the first PCB board.

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