Crystal resonator

Abstract

A crystal resonator comprises a crystal wafer and an electrode group. The crystal plate is in a sheet shape and is integrally formed, and can generate thickness shear oscillation in a movement direction which is not parallel to the thickness direction by being applied with voltage. The crystal wafer comprises a first vibration part and a second vibration part which are arranged in the movement direction and connected with each other. The electrode group comprises a first pair of electrodes arranged on the first vibration part and a second pair of electrodes arranged on the second vibration part. And the first pair of electrodes and the second pair of electrodes respectively apply voltages with opposite polarities to the first vibration part and the second vibration part, so that the thickness shear oscillations generated by the first vibration part and the second vibration part oppositely vibrate or reversely vibrate in the movement direction. Therefore, inertia forces introduced by external interference on the first vibration part and the second vibration part can be mutually counteracted, and the acceleration vibration effect generated by the inertia forces on the crystal plate is further eliminated, so that the effect of reducing the acceleration sensitivity is achieved.

Description

Technical Field

[0001] The present invention relates to a resonator, and particularly to a crystal resonator. Background Art

[0002] Referring to Figure 1 , there is a known crystal resonator 1. The crystal resonator 1 is adapted to be installed in a resonant circuit and used as an electronic component for outputting a signal of a specific oscillation frequency. The crystal resonator 1 includes a crystal wafer 11 and a pair of electrodes 12 respectively disposed at two ends of the thickness axis of the crystal wafer 11. The pair of electrodes 12 are respectively fixed to the resonant circuit by two conductive adhesive blocks 13 in an electrically connected manner. When the pair of electrodes 12 are energized to generate a voltage difference at two ends of the thickness axis of the crystal wafer 11, two crystal faces of the crystal wafer 11 that are not parallel to the thickness axis will move in opposite directions repeatedly, causing the entire crystal wafer 11 to generate vibrations of a fixed frequency, and thereby outputting a signal of a specific oscillation frequency. However, when the crystal resonator 1 is tilted, rotated or shaken relative to the external environment under the action of an external force, the crystal wafer 11 is equivalent to being applied with an inertial force, thereby affecting the vibration of the crystal wafer 11 and resulting in a frequency shift problem of the crystal resonator 1. Summary of the Invention

[0003] An object of the present invention is to provide a crystal resonator with reduced acceleration sensitivity (g-sensitivity).

[0004] The crystal resonator of the present invention includes a crystal wafer and an electrode group. The crystal wafer is in a sheet shape and integrally formed, and can be applied with a voltage to generate thickness shear oscillations in a movement direction that is not parallel to the thickness direction. The crystal wafer includes a first vibration portion and a second vibration portion that are arranged and connected to each other along the movement direction. The electrode group includes a first pair of electrodes disposed on the first vibration portion and a second pair of electrodes disposed on the second vibration portion. The first pair of electrodes and the second pair of electrodes respectively apply voltages with opposite polarities to the first vibration portion and the second vibration portion, so that the thickness shear oscillations generated by the first vibration portion and the second vibration portion vibrate towards each other or away from each other in the movement direction.

[0005] In the crystal resonator of the present invention, the crystal wafer further includes two crystal faces respectively located on two opposite sides. The crystal faces are parallel to the movement direction and perpendicular to the thickness direction. The shape of the crystal faces is one of a rectangle, a perfect circle and an ellipse.

[0006] In the crystal resonator of the present invention, the crystal wafer is in a circular sheet shape and further includes a cut surface parallel to the thickness direction, and the cut surface is used to define a crystal axis.

[0007] For the crystal resonator of the present invention, the first pair of electrodes has an input terminal electrode and a first back electrode respectively disposed on two opposite surfaces of the first vibrating portion in the thickness direction. The input terminal electrode and the first back electrode are aligned with each other in the thickness direction. The second pair of electrodes has an output terminal electrode and a second back electrode respectively disposed on two opposite surfaces of the second vibrating portion in the thickness direction. The output terminal electrode and the second back electrode are aligned with each other in the thickness direction. The input terminal electrode and the output terminal electrode are located on the same side of the crystal wafer and are spaced apart in the movement direction. One of the input terminal electrode and the output terminal electrode is a high-potential electrode. The other of the input terminal electrode and the output terminal electrode is a low-potential electrode. The first back electrode and the second back electrode are spaced apart in the movement direction. And the first back electrode is electrically connected to the output terminal electrode. The second back electrode is electrically connected to the input terminal electrode.

[0008] For the crystal resonator of the present invention, the first pair of electrodes has an input terminal electrode and a first back electrode respectively disposed on two opposite surfaces of the first vibrating portion in the thickness direction. The input terminal electrode and the first back electrode are aligned with each other in the thickness direction. The second pair of electrodes has an output terminal electrode and a second back electrode respectively disposed on two opposite surfaces of the second vibrating portion in the thickness direction. The output terminal electrode and the second back electrode are aligned with each other in the thickness direction. The input terminal electrode and the output terminal electrode are located on the same side of the crystal wafer and are spaced apart in the movement direction. One of the input terminal electrode and the output terminal electrode is a high-potential electrode. The other of the input terminal electrode and the output terminal electrode is a low-potential electrode. The first back electrode and the second back electrode are electrically connected.

[0009] For the crystal resonator of the present invention, the distance between adjacent side edges of the input terminal electrode and the output terminal electrode is less than 0.5 mm and is not zero.

[0010] For the crystal resonator of the present invention, the shape of one surface of the input terminal electrode and the output terminal electrode that is parallel to the movement direction and perpendicular to the thickness direction is one of a polygon, a perfect circle, and an ellipse.

[0011] The crystal resonator according to the present invention is adapted to be electrically connected to a base through two conductive fixing members. Among them, the crystal wafer is spaced apart from the base in the thickness direction. The first vibration part and the second vibration part define a joint surface that engages with each other. The two side edges of the joint surface parallel to the thickness direction are respectively for connecting the conductive fixing members. The first pair of electrodes further has an input connecting electrode with two ends respectively connected to one of the conductive fixing members and the input end electrode. The second pair of electrodes further has an output connecting electrode with two ends respectively connected to the other of the conductive fixing members and the output end electrode.

[0012] The crystal resonator according to the present invention, the crystal wafer includes a plurality of vibration part assemblies arranged and connected to each other along the movement direction. Each of the vibration part assemblies has one of the first vibration parts and one of the second vibration parts. The first vibration part and the second vibration part are arranged alternately in the movement direction. The electrode group has a plurality of the first pairs of electrodes respectively arranged on the first vibration part and connected to each other, and a plurality of the second pairs of electrodes respectively arranged on the second vibration part and connected to each other. The first pair of electrodes and the second pair of electrodes located in each of the vibration part assemblies respectively apply voltages with opposite polarities to the corresponding first vibration part and second vibration part, so that the thickness shear oscillations generated by the corresponding first vibration part and second vibration part vibrate towards or away from each other in the movement direction.

[0013] The beneficial effect of the present invention is that by applying voltages with opposite polarities to the first vibration part and the second vibration part respectively through the first pair of electrodes and the second pair of electrodes, the inertial forces introduced by external interference on the first vibration part and the second vibration part can be offset from each other, thereby eliminating the acceleration vibration effect generated by the inertial force on the crystal wafer, so as to achieve the effect of reducing the acceleration sensitivity. Description of the Drawings

[0014] Figure 1 is a perspective view showing an embodiment of a known crystal resonator and the connection relationship between the known crystal resonator and two conductive adhesive blocks;

[0015] Figure 2 is a perspective view showing an embodiment in which the first embodiment of the crystal resonator of the present invention is electrically connected to a base through two conductive fixing members;

[0016] Figure 3 is along Figure 2 in the cross-sectional view taken along line III-III and removing the conductive fixing members and the base;

[0017] Figure 4is a front view schematic diagram showing the circuit connection relationship of the first embodiment;

[0018] Figure 5 is an analog diagram showing the vibration displacement amounts in the moving direction of the thickness shear oscillations generated by both the first vibration part and the second vibration part of the first embodiment;

[0019] Figure 6 is a data diagram showing the measurement results of the acceleration sensitivity of different oscillation frequency signals generated by a known crystal resonator;

[0020] Figure 7 is a data diagram showing the measurement results of the acceleration sensitivity of different oscillation frequency signals generated by the first embodiment;

[0021] Figure 8 is a three - dimensional schematic diagram showing the implementation manner in which the second embodiment of the crystal resonator of the present invention is electrically connected to the base through the conductive fixing member;

[0022] Figure 9 is along Figure 8 a cross - sectional schematic diagram taken along line IX - IX in, and removing the conductive fixing member and the base;

[0023] Figure 10 is a front view schematic diagram showing the circuit connection relationship of the second embodiment;

[0024] Figure 11 is a top view schematic diagram showing the implementation manner of the crystal wafer of the third embodiment of the crystal resonator of the present invention;

[0025] Figure 12 is a top view schematic diagram showing the implementation manner of the fourth embodiment of the crystal resonator of the present invention

[0026] Figure 13 is a three - dimensional schematic diagram showing the implementation manner in which the fifth embodiment of the crystal resonator of the present invention is connected to two conductive fixing members;

[0027] Figure 14 is a three - dimensional schematic diagram showing another implementation manner of the fifth embodiment connected to two conductive fixing members. Detailed implementation manners

[0028] The present invention will be described in detail below with reference to the accompanying drawings and embodiments. Before the present invention is described in detail, it should be noted that in the following description, similar components are denoted by the same reference numerals.

[0029] Refer to Figures 2 to 4, which is a first embodiment of the crystal resonator 100 of the present invention. The crystal resonator 100 is adapted to be electrically connected to a base 9 through two conductive fixing members 8. The base 9 may be a package body provided with a circuit pattern, and is not limited to a specific form. The material of the conductive fixing member 8 is, for example, a conductive metal, but is not limited thereto. Moreover, the conductive fixing member 8 may be cured between the crystal resonator 100 and the base 9 by means of silver glue dispensing or soldering, etc., and the crystal resonator 100 is suspended on the base 9.

[0030] The crystal resonator 100 includes a crystal wafer 2 and an electrode group 3. The crystal wafer 2 is inserted into the conductive fixing member 8 and is spaced from the base 9 in a thickness direction Z. The crystal wafer 2 is, for example, quartz and is in a sheet shape. The oscillation mode of the crystal wafer 2 is a thickness shear oscillation mode. That is to say, the crystal wafer 2 can be applied with a voltage to generate thickness shear oscillation in a movement direction X that is not parallel to the thickness direction Z. For convenience of subsequent description, the extending direction of the thickness axis of the crystal wafer 2 is defined as the thickness direction Z of the crystal wafer 2, that is Figure 2 the up and down direction of the crystal resonator 100 described in; Figure 2 the left and right direction of the crystal resonator 100 described in is defined as the movement direction X of the crystal wafer 2, and the movement direction X is not parallel to the thickness direction Z; Figure 2 the front and back direction of the crystal resonator 100 described in is defined as a width direction Y that is not parallel to the movement direction X.

[0031] The crystal wafer 2 is integrally formed and includes a first vibration portion 21, a second vibration portion 22, and two crystal faces 23 respectively located on two opposite sides of the crystal wafer 2. The first vibration portion 21 and the second vibration portion 22 are arranged along the movement direction X and are connected to each other. The first vibration portion 21 and the second vibration portion 22 define a joint surface 24 that engages with each other. In this way, the first vibration portion 21 and the second vibration portion 22 are the same in size in the three axial directions of the movement direction X, the width direction Y, and the thickness direction Z. Moreover, the position of the joint surface 24 is the middle of the crystal wafer 2 in the movement direction X.

[0032] Continue to refer to Figures 2 to 4, the crystal plane 23 is parallel to the movement direction X and perpendicular to the thickness direction Z. Each of the crystal planes 23 is a surface on the same side of the first vibration part 21 and the second vibration part 22. In the present first embodiment, one of the crystal planes 23 is the top surface of the first vibration part 21 and the second vibration part 22, and the other of the crystal planes 23 is the bottom surface of the first vibration part 21 and the second vibration part 22. And the shape of the crystal plane 23 is exemplified by a rectangle such as a rectangle, that is, the dimension of the crystal wafer 2 in the movement direction X is greater than the dimension of the crystal wafer 2 in the width direction Y. In this way, when the crystal wafer 2 is divided into the first vibration part 21 and the second vibration part 22, the stress received at the junction (i.e., the joint surface 24) of the first vibration part 21 and the second vibration part 22 is small and not easily broken. However, the shape of the crystal plane 23 can also be a perfect circle or an ellipse, and is not limited to a specific shape.

[0033] Continue to refer to Figures 2 to 4 , the electrode group 3 includes a first pair of electrodes 31 disposed on the first vibration part 21 and a second pair of electrodes 32 disposed on the second vibration part 22. The first pair of electrodes 31 and the second pair of electrodes 32 apply voltages with opposite polarities to the first vibration part 21 and the second vibration part 22 respectively, so that the thickness-shear oscillations generated by the first vibration part 21 and the second vibration part 22 vibrate towards each other or away from each other in the movement direction X (see Figure 4 the arrows drawn on the crystal wafer 2 in the figure). For convenience of subsequent description, the first pair of electrodes 31 and the second pair of electrodes 32 in the figure are shown in gray scale, and the gray scale color presented by the first pair of electrodes 31 is lighter than the gray scale color presented by the second pair of electrodes 32.

[0034] Specifically, the first pair of electrodes 31 has an input terminal electrode 311, a first back electrode 312, an input terminal connecting electrode 313, and a first back connecting electrode 314. The input terminal electrode 311 and the first back electrode 312 are respectively disposed on two opposite surfaces of the first vibrating portion 21 in the thickness direction Z, and are aligned with each other in the thickness direction Z. Two ends of the input terminal connecting electrode 313 are respectively connected to the top of one of the conductive fixing members 8 and the input terminal electrode 311; two ends of the first back connecting electrode 314 are respectively connected to the bottom of the other of the conductive fixing members 8 and the first back electrode 312. In the present first embodiment, the input terminal electrode 311 and the first back electrode 312 may have exactly the same shape and area, and the input terminal electrode 311 and the first back electrode 312 are completely aligned in the thickness direction Z. However, in some other embodiments, the input terminal electrode 311 and the first back electrode 312 may also have different shapes or areas, such that the input terminal electrode 311 and the first back electrode 312 are only partially aligned in the thickness direction Z, or the distance from the edge of the input terminal electrode 311 to the edge of the first vibrating portion 21 is different from the distance from the edge of the first back electrode 312 to the edge of the first vibrating portion 21, such that the input terminal electrode 311 and the first back electrode 312 are also only partially aligned in the thickness direction Z. When at least a part of the input terminal electrode 311 and the first back electrode 312 are aligned in the thickness direction Z, the input terminal electrode 311 and the first back electrode 312 can apply a voltage to the first vibrating portion 21.

[0035] The second pair of electrodes 32 has an output terminal electrode 321, a second back electrode 322, an output terminal connection electrode 323, and a second back connection electrode 324. The output terminal electrode 321 and the second back electrode 322 are respectively disposed on two opposite surfaces of the second vibrating portion 22 in the thickness direction Z and are aligned with each other in the thickness direction Z. Two ends of the second back connection electrode 324 are respectively connected to the bottom of one of the conductive fixing members 8 and the second back electrode 322, so that the second back electrode 322 is electrically connected to the input terminal electrode 311; two ends of the output terminal connection electrode 323 are respectively connected to the top of the other of the conductive fixing members 8 and the output terminal electrode 321, so that the output terminal electrode 321 is electrically connected to the first back electrode 312. In this first embodiment, the output terminal electrode 321 and the second back electrode 322 may also be such that their shapes and areas are exactly the same, and the output terminal electrode 321 and the second back electrode 322 are completely aligned in the thickness direction Z. However, in some other embodiments, the output terminal electrode 321 and the second back electrode 322 may also be such that their shapes or areas are different, so that the output terminal electrode 321 and the second back electrode 322 are only partially aligned in the thickness direction Z, or the distance from the edge of the output terminal electrode 321 to the edge of the second vibrating portion 22 is different from the distance from the edge of the second back electrode 322 to the edge of the second vibrating portion 22, so that the output terminal electrode 321 and the second back electrode 322 are also only partially aligned in the thickness direction Z. When at least a part of the output terminal electrode 321 and the second back electrode 322 are aligned in the thickness direction Z, the output terminal electrode 321 and the second back electrode 322 can apply a voltage to the second vibrating portion 22.

[0036] In other words, the input terminal electrode 311 and the output terminal electrode 321 are located on the same side of the crystal wafer 2 (i.e., the top surface of the crystal wafer 2) and are spaced left and right in the movement direction X. The first back electrode 312 and the second back electrode 322 are both located on the same other side of the crystal wafer 2 (i.e., the bottom surface of the crystal wafer 2) and are spaced left and right in the movement direction X. Moreover, the first back electrode 312 is electrically connected to the output terminal electrode 321 and has the same potential; the second back electrode 322 is electrically connected to the input terminal electrode 311 and has the same potential. In this way, when one of the input terminal electrode 311 and the output terminal electrode 321 is a high-potential electrode and the other is a low-potential electrode, a voltage difference will be formed between the input terminal electrode 311 and the first back electrode 312, and another voltage difference with a polarity opposite to that of the voltage difference will be formed between the output terminal electrode 321 and the second back electrode 322, and the upper and lower sides of the first vibrating portion 21 will respectively move in opposite directions repeatedly in the movement direction X, and the upper and lower sides of the second vibrating portion 22 will also respectively move in opposite directions repeatedly in the movement direction X. That is to say, as shown by the arrows in Figure 4 , the tops of the first vibrating portion 21 and the second vibrating portion 22 vibrate towards each other, and the bottoms of the first vibrating portion 21 and the second vibrating portion 22 vibrate away from each other, so that the inertial forces introduced by external disturbances on the first vibrating portion 21 and the second vibrating portion 22 cancel each other out, and the acceleration vibration effect generated by the inertial force on the crystal wafer 2 can be eliminated, so as to achieve the effect of reducing the acceleration sensitivity.

[0037] Referring to Figure 3 and Figure 4 , in this first embodiment, the distance d between the adjacent side edges of the input terminal electrode 311 and the output terminal electrode 321 is less than 0.5 mm and is not zero.

[0038] Referring to Figure 2 , preferably, the two side edges of the junction surface 24 parallel to the thickness direction Z are respectively for connecting the conductive fixing members 8, so that the crystal wafer 2 is supported by the conductive fixing members 8 at the center in the movement direction X, and the left and right sides of the crystal wafer 2 can be symmetrically suspended.

[0039] Referring to Figure 5 , it is a simulation diagram of the vibration displacement amounts in the movement direction of the thickness shear oscillations generated by the first vibrating portion 21 and the second vibrating portion 22 when voltages are applied to the first vibrating portion 21 and the second vibrating portion 22. Among them, Figure 5The arrow therein indicates that the first vibrating part 21 and the second vibrating part 22 vibrate away from each other in the movement direction X. And, Figure 5 The lighter part presented in the middle gray scale indicates a larger vibration displacement amount, Figure 5 and the darker part presented in the middle gray scale indicates a smaller vibration displacement amount. Therefore, in this first embodiment, the shapes of the input end electrode 311 and the output end electrode 321 are, for example, rectangles that can cover Figure 5 a polygon example of the lighter part therein, but the shapes of the input end electrode 311 and the output end electrode 321 are not limited to polygons. The shapes of the input end electrode 311 and the output end electrode 321 can also be a perfect circle or an ellipse, etc., which can cover Figure 5 the electrode pattern of the lighter part therein.

[0040] Refer to Figure 6 and Figure 7 , which are the signal measurement results of the known crystal resonator 100 and the first embodiment respectively under the same test conditions. As Figure 7 shown, when the first embodiment is applied with a voltage to generate signals with different oscillation frequencies, its acceleration sensitivity (g-sensitivity) range is less than 0.2 ppb / g (close to 0.1 ppb / g); and as Figure 6 shown, when the known crystal resonator 100 is applied with a voltage to generate signals with different oscillation frequencies, its acceleration sensitivity range is 0.4 ppb / g to 0.8 ppb / g. That is to say, the anti-acceleration effect of the first embodiment is significantly better than that of the known crystal resonator 100.

[0041] Refer to Figures 8 to 10, which is a second embodiment of the crystal resonator 100' of the present invention. The structure of the second embodiment is similar to that of the first embodiment. The first pair of electrodes 31 also has an input terminal electrode 311, a first back electrode 312, an input terminal connecting electrode 313, and a first back connecting electrode 314'. The second pair of electrodes 32 also has an output terminal electrode 321, a second back electrode 322, an output terminal connecting electrode 323, and a second back connecting electrode 324'. The difference between the second embodiment and the first embodiment is that the first back connecting electrode 314' and the second back connecting electrode 324' of the second embodiment are connected to each other, and the first back connecting electrode 314' is separated from the conductive fixing member 8, and the end of the first back connecting electrode 314' far from the second back connecting electrode 324' is connected to the first back electrode 312; the second back connecting electrode 324' is also separated from the conductive fixing member 8, and the end of the second back connecting electrode 324' far from the first back connecting electrode 314' is connected to the second back electrode 322. In this way, the first back electrode 312 and the second back electrode 322 will have the same potential (zero potential). When one of the input terminal electrode 311 and the output terminal electrode 321 is a high-potential electrode, and the other of the input terminal electrode 311 and the output terminal electrode 321 is a low-potential electrode, a voltage difference can also be formed between the input terminal electrode 311 and the first back electrode 312, and another voltage difference with a polarity opposite to that of the voltage difference will also be formed between the output terminal electrode 321 and the second back electrode 322, and the thickness-shear oscillations generated by both the first vibrating portion 21 and the second vibrating portion 22 can also vibrate towards or away from each other in the movement direction X, thereby enabling the inertial forces introduced by external interference on both the first vibrating portion 21 and the second vibrating portion 22 to cancel each other out, and being able to eliminate the acceleration vibration effect generated by the inertial force on the crystal wafer 2, so as to achieve the effect of reducing the acceleration sensitivity.

[0042] Refer to Figure 11 , which is a third embodiment of the crystal resonator 100″ of the present invention. The structure of the third embodiment is similar to that of the first embodiment. The difference between the third embodiment and the first embodiment is that the crystal wafer 2″ is in a circular sheet shape, and further includes a section plane 25 parallel to the thickness direction Z, and the section plane 25 is used to define the crystal axis. The two opposite side edges of the section plane 25 are respectively connected to the crystal plane 23″ and are linear. In this third embodiment, the section plane 25 can be formed by longitudinally cutting the crystal wafer 2″. In addition, the crystal plane 23″ is generally circular, and a part of the periphery of the crystal plane 23″ (that is, the top edge and the bottom edge of the section plane 25) is slightly flat, and can define the crystal axis for external device alignment use.

[0043] Refer toFigure 12 This is a fourth embodiment of the crystal resonator 100″′ of the present invention. The structure of the fourth embodiment is similar to that of the first embodiment. The first pair of electrodes 31 also has an input terminal electrode 311, a first back electrode 312, an input terminal connecting electrode 313″′, and a first back connecting electrode 314. The second pair of electrodes 32 also has an output terminal electrode 321, a second back electrode 322, an output terminal connecting electrode 323″′, and a second back connecting electrode 324. The difference between the fourth embodiment and the first embodiment is that the input terminal connecting electrode 313″′ and the output terminal connecting electrode 323″′ of the fourth embodiment are symmetrically distributed at two diagonal corners of the crystal wafer 2 at the center of the crystal wafer 2 in the moving direction X and at the center of the crystal wafer 2 in the width direction Y, and the positions of the conductive fixing members 8 corresponding to the input terminal connecting electrode 313″′ and the output terminal connecting electrode 323″′ are at two diagonal corners of the crystal wafer 2, so that the left and right sides of the crystal wafer 2 can be stably supported.

[0044] Refer to Figure 13, which is an embodiment of a fifth embodiment of the crystal resonator 100″″ of the present invention. The structure of the fifth embodiment is similar to that of the first embodiment. The crystal resonator 100″″ also includes a crystal sheet 2″″ and an electrode group 3″″. The crystal sheet 2″″ also presents as a sheet and is integrally formed, and can be applied with a voltage to generate thickness-shear oscillation in the movement direction X. The difference between the fifth embodiment and the first embodiment is that the crystal sheet 2″″ of the fifth embodiment includes a plurality of vibration part assemblies 20 arranged and connected to each other along the movement direction X. Each vibration part assembly 20 has one first vibration part 21″″ and one second vibration part 22″″. The first vibration part 21″″ and the second vibration part 22″″ are staggered in the movement direction X. And, the electrode group 3″″ has a plurality of first pairs of electrodes 31″″ respectively arranged on the first vibration part 21″″ and connected to each other, and a plurality of second pairs of electrodes 32″″ respectively arranged on the second vibration part 22″″ and connected to each other. Each first pair of electrodes 31″″ also has an input terminal electrode 311″″, a first back electrode (not shown in the figure), an input terminal connection electrode 313″″ and a first back connection electrode (not shown in the figure). The input terminal electrodes 311″″ are respectively located on the top surface of the first vibration part 21″″ and are spaced from each other in the movement direction X. The input terminal connection electrodes 313″″ are respectively connected to the input terminal electrodes 311″″ and are all connected to one of the conductive fixing members 8, so that the input terminal electrodes 311″″ have the same potential. Each second pair of electrodes 32″″ also has an output terminal electrode 321″″, a second back electrode (not shown in the figure), an output terminal connection electrode 323″″ and a second back connection electrode (not shown in the figure). The output terminal electrodes 321″″ are respectively located on the top surface of the second vibration part 22″″ and are spaced from each other in the movement direction X. In addition, the output terminal electrodes 321″″ and the input terminal electrodes 311″″ are arranged alternately and spaced from each other in the movement direction X. The output terminal connection electrodes 323″″ are respectively connected to the output terminal electrodes 321″″ and are all connected to the other of the conductive fixing members 8, so that the output terminal electrodes 321″″ all have the same potential. The first back electrode can be electrically connected to the output terminal electrode 321″″ through the conductive fixing member 8 and have the same potential as the output terminal electrode 321″″. The first back electrode can also be electrically connected to the second back electrode and have the same potential (zero potential) as the second back electrode. The second back electrode can be electrically connected to the input terminal electrode 311″″ through the conductive fixing member 8 and have the same potential as the input terminal electrode 311″″. The second back electrode can also be electrically connected to the first back electrode and have the same potential (zero potential) as the first back electrode.In addition, the number of the first pair of electrodes 31″″, the second pair of electrodes 32″″ is the same as that of the vibration unit assembly 20. In this way, when one of the input terminal electrodes 311″″ and the output terminal electrodes 321″″ is a high-potential electrode and the other is a low-potential electrode, the first pair of electrodes 31″″ and the second pair of electrodes 32″″ located in each vibration unit assembly 20 can still apply voltages with opposite polarities to the corresponding first vibration unit 21″″ and the second vibration unit 22″″ respectively, so that the thickness-shear oscillations generated by the corresponding first vibration unit 21″″ and the second vibration unit 22″″ vibrate towards or away from each other in the movement direction X, and have the effect of respectively offsetting the acceleration vibration effect generated by the inertial force on the vibration unit assembly 20.

[0045] Refer to Figure 14 , which is another implementation of the fifth embodiment. In the implementation shown in Figure 13 , the number of the first pair of electrodes 31″″, the second pair of electrodes 32″″ and the vibration unit assembly 20 are all exemplified by two. However, in the implementation shown in Figure 14 , the number of the first pair of electrodes 31″″, the second pair of electrodes 32″″ and the vibration unit assembly 20 can also be all three. The number of the first pair of electrodes 31″″, the second pair of electrodes 32″″ and the vibration unit assembly 20 only needs to be the same, and is not limited to a specific number. To sum up, by applying voltages with opposite polarities to the first vibration unit 21 and the second vibration unit 22 respectively through the first pair of electrodes 31 and the second pair of electrodes 32, the inertial forces introduced by external interference on the first vibration unit 21 and the second vibration unit 22 can be offset from each other, thereby eliminating the acceleration vibration effect generated by the inertial force on the crystal wafer 2, so as to achieve the effect of reducing the acceleration sensitivity. Therefore, the object of the present invention can be truly achieved.

Claims

1. A crystal resonator; characterized in that: The crystal resonator comprises: A crystal sheet, which is in a sheet shape and integrally formed, and can generate thickness shear oscillation in a motion direction that is not parallel to the thickness direction when a voltage is applied thereto, the crystal sheet comprising a first vibration portion and a second vibration portion arranged along the motion direction and connected to each other; and The electrode group includes a first pair of electrodes arranged on the first vibration part, and a second pair of electrodes arranged on the second vibration part. The first pair of electrodes and the second pair of electrodes respectively apply voltages of opposite polarities to the first vibration part and the second vibration part, so that the thickness shear oscillations generated by the first vibration part and the second vibration part vibrate in the direction of movement in the same direction or in opposite directions.

2. The crystal resonator according to claim 1, characterized in that: The crystal sheet further includes two crystal planes located at two opposite sides, the crystal planes are parallel to the movement direction and perpendicular to the thickness direction, and the shape of the crystal planes is one of a rectangle, a perfect circle and an ellipse.

3. The crystal resonator according to claim 1, characterized in that: The crystal sheet is in the shape of a disk and further includes a cut surface parallel to the thickness direction, wherein the cut surface is used to define a crystal axis.

4. The crystal resonator according to claim 1, characterized in that: The first pair of electrodes comprises an input terminal electrode and a first back electrode respectively arranged on two opposite sides of the first vibration part in the thickness direction, the input terminal electrode and the first back electrode are aligned with each other in the thickness direction, the second pair of electrodes comprises an output terminal electrode and a second back electrode respectively arranged on two opposite sides of the second vibration part in the thickness direction, the output terminal electrode and the second back electrode are aligned with each other in the thickness direction, the input terminal electrode and the output terminal electrode are located on the same side of the crystal piece and are spaced apart in the movement direction, one of the input terminal electrode and the output terminal electrode is a high potential electrode, the other of the input terminal electrode and the output terminal electrode is a low potential electrode, the first back electrode and the second back electrode are spaced apart in the movement direction, the first back electrode is electrically connected to the output terminal electrode, and the second back electrode is electrically connected to the input terminal electrode.

5. The crystal resonator according to claim 1, characterized in that: The first pair of electrodes comprises an input terminal electrode and a first back electrode respectively arranged on two opposite sides of the first vibration part in the thickness direction, and the input terminal electrode and the first back electrode are aligned with each other in the thickness direction. The second pair of electrodes comprises an output terminal electrode and a second back electrode respectively arranged on two opposite sides of the second vibration part in the thickness direction, and the output terminal electrode and the second back electrode are aligned with each other in the thickness direction. The input terminal electrode and the output terminal electrode are located on the same side of the crystal piece and are spaced apart in the movement direction. One of the input terminal electrode and the output terminal electrode is a high potential electrode, and the other of the input terminal electrode and the output terminal electrode is a low potential electrode, and the first back electrode is electrically connected to the second back electrode.

6. The crystal resonator according to claim 4 or 5, characterized in that: The spacing between the adjacent side edges of the input terminal electrode and the output terminal electrode is less than 0.5 mm and is not zero.

7. The crystal resonator according to claim 4 or 5, characterized in that: The shape of a surface of the input-end electrode and the output-end electrode which is parallel to the moving direction and perpendicular to the thickness direction is one of a polygon, a perfect circle and an ellipse.

8. The crystal resonator according to claim 4 or 5, characterized in that: The crystal resonator is suitable for being electrically connected to a base through two conductive fixings, the crystal plate and the base are spaced apart in the thickness direction, the first vibration part and the second vibration part define a mutually joined interface, and the two side edges of the interface parallel to the thickness direction are respectively connected to the conductive fixings; the first pair of electrodes also have input-end connecting electrodes whose two ends are respectively connected to one of the conductive fixings and the input-end connecting electrodes, and the second pair of electrodes also have output-end connecting electrodes whose two ends are respectively connected to the other of the conductive fixings and the output-end connecting electrodes.

9. The crystal resonator according to claim 1, characterized in that: The crystal piece includes a plurality of vibration part assemblies arranged along the movement direction and connected to each other, each of the vibration part assemblies has one first vibration part and one second vibration part, and the first vibration part and the second vibration part are arranged alternately in the movement direction; The electrode group comprises a plurality of first pairs of electrodes respectively arranged on the first vibration part and connected to each other, and a plurality of second pairs of electrodes respectively arranged on the second vibration part and connected to each other; the first pair of electrodes and the second pair of electrodes located in each vibration part combination respectively apply voltages of opposite polarities to the corresponding first vibration part and the second vibration part, so that the thickness shear oscillations generated by the corresponding first vibration part and the second vibration part vibrate in opposite directions or in opposite directions in the movement direction.

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