Temperature calibration device, implantation equipment, method, equipment and medium

Abstract

The invention relates to a temperature calibration device, implantation equipment, method, equipment and medium, and belongs to the field of temperature measurement, the temperature calibration device comprises a temperature analysis circuit, a controller and a plurality of stimulation units, each stimulation unit is provided with an external thermosensitive element, and the external thermosensitive element is used for reflecting the temperature of a non-heating position of the implantation equipment; the external thermosensitive element is connected with the temperature analysis circuit, and the temperature analysis circuit is used for outputting a temperature signal according to the physical characteristic change of the external thermosensitive element; and the controller is connected with the temperature analysis circuit and is used for judging the temperature change according to the temperature signal and outputting an early warning signal. By detecting the temperature of the external thermosensitive element, the effect of improving the measurement accuracy of the temperature of the contact position of the implantation equipment and the patient is achieved.

Description

Technical Field

[0001] This application relates to the technical field of temperature measurement, and particularly to a temperature calibration device, an implant device, a method, a device, and a medium. Background Art

[0002] In the field of nerve therapy, an implantable nerve stimulation system is used to treat patients. The implantable nerve stimulation system includes a nerve stimulator and an external controller. The nerve stimulator is implanted into the patient's body, and the external controller and the nerve stimulator communicate wirelessly. The user adjusts the stimulation parameters of the external controller and sends the stimulation parameters to the nerve stimulator through wireless communication to control the working state of the nerve stimulator.

[0003] During the process of treating a patient with a nerve stimulator in the patient's body, the temperature difference between the temperature of the nerve stimulator and the patient's body temperature needs to be maintained within a certain range. Otherwise, the temperature generated by the nerve stimulator may cause certain damage to the patient.

[0004] Currently, in order to measure the temperature of implant devices such as nerve stimulators, a temperature sensor is set inside the chip of the implant device to measure the temperature of the implanted chip. However, this can only measure the temperature inside the chip and cannot measure the temperature at the position where the implant device contacts the patient, resulting in inaccurate temperature measurement of the implant device.

[0005] The above-mentioned related technical solutions have the following defects: the measurement accuracy of the temperature at the position where the implant device contacts the patient is low. Summary of the Invention

[0006] To improve the problem of low measurement accuracy of the temperature at the position where the implant device contacts the patient, this application provides a temperature calibration device, an implant device, a method, a device, and a medium.

[0007] In the first aspect of this application, a temperature calibration device is provided. The device includes a temperature analysis circuit, a controller, and a plurality of stimulation units. An external thermosensitive element is provided on each stimulation unit, and the external thermosensitive element is used to reflect the temperature of the non-heating position of the implant device; The external thermosensitive element is connected to the temperature analysis circuit, and the temperature analysis circuit is used to output a temperature signal according to the physical property change of the external thermosensitive element; The controller is connected to the temperature analysis circuit and is used to judge the temperature change and output a warning signal according to the temperature signal.

[0008] As can be seen from the above technical solutions, by setting an external thermosensitive element to measure the temperature at a non-heating position of the implanted device, the influence of the temperature rise of the implanted device itself on the external thermosensitive element is reduced. Then, a temperature analysis circuit is used to analyze the external thermosensitive element and output a temperature signal, and the controller will judge the temperature signal, improving the accuracy of temperature measurement.

[0009] In a possible implementation manner, each stimulation unit includes a stimulation electrode, a blocking capacitor, and a four-way switch. The stimulation electrode, the blocking capacitor, and the four-way switch are connected in series. The four input terminals of the four-way switch are respectively connected to a stimulation input terminal, a stimulation output terminal, a temperature input terminal, and a temperature output terminal, and the stimulation electrode is in contact with nerve tissue.

[0010] In a possible implementation manner, the external thermosensitive element is connected across any two stimulation units. The connection point of the external thermosensitive element and the stimulation unit is located between the blocking capacitor and the four-way switch. The resistance value of the external thermosensitive element is m times the resistance value of the contact resistance corresponding to the stimulation electrode, and m is greater than 1.

[0011] As can be seen from the above technical solutions, by limiting the relationship between the resistance value of the contact resistance corresponding to the external thermosensitive element and the stimulation electrode, the current flowing through the external thermosensitive element is reduced, thereby reducing the temperature rise of the external thermosensitive element due to circuit operation and improving the accuracy of temperature measurement.

[0012] In a possible implementation manner, the temperature analysis circuit includes a temperature analysis unit, a single-pole double-throw switch, and an analog-to-digital converter. One input terminal of the single-pole double-throw switch is connected to the external thermosensitive element, and the other input terminal of the single-pole double-throw switch is connected to an internal thermosensitive element. The internal thermosensitive element is used to reflect the temperature inside the implanted device. The output terminal of the single-pole double-throw switch is connected to the analog-to-digital converter through the temperature analysis circuit.

[0013] As can be seen from the above technical solutions, by using a single-pole double-throw switch, the multiplexing of the temperature analysis unit is realized, reducing the circuit burden of the implanted device. At the same time, an internal thermosensitive element and an external thermosensitive element are set, improving the accuracy of temperature measurement.

[0014] In a possible implementation manner, the device further includes a digital logic circuit for controlling the four-way switch to close.

[0015] In the second aspect of the present application, an implanted device is provided. The implanted device includes a temperature calibration device and a stimulation chip according to the first aspect of the present application, and the distance between the external thermosensitive element in the temperature calibration device and the stimulation chip is within a preset range.

[0016] As can be seen from the above technical solutions, by restricting the distance between the external thermosensitive element and the stimulation chip, the influence of the heat generated by the stimulation chip on the external thermosensitive element can be reduced, thereby improving the accuracy of temperature measurement.

[0017] In the third aspect of the present application, a temperature calibration method is provided. The method includes: The controller obtains the initial internal temperature and the initial external temperature. The initial internal temperature represents the initial temperature inside the implant device, and the initial external temperature represents the initial temperature at a non-heating position of the implant device; Calculate the difference between the initial internal temperature and the initial external temperature to obtain the initial temperature difference; Output a warning message according to the initial temperature difference.

[0018] In a possible implementation manner, the method further includes: Obtain the current internal temperature and the current external temperature; Calculate the difference between the current internal temperature and the current external temperature to obtain the current temperature difference; Output a warning message according to the current temperature difference.

[0019] In the fourth aspect of the present application, an electronic device is provided. The electronic device includes: a memory and a processor. A computer program is stored on the memory, and when the processor executes the program, the method described above is implemented.

[0020] In the fifth aspect of the present application, a computer-readable storage medium is provided, on which a computer program is stored. When the program is executed by a processor, the method according to the third aspect of the present application is implemented.

[0021] In summary, the present application includes at least one beneficial technical effect: By setting an external thermosensitive element, the temperature at a non-heating position of the implant device is measured, the influence of the temperature rise of the implant device itself on the external thermosensitive element is reduced, and then the temperature analysis circuit is used to analyze the external thermosensitive element and output a temperature signal. The controller will judge the temperature signal, improving the accuracy of temperature measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic circuit diagram of a temperature calibration device provided by an embodiment of the present application.

[0023] Figure 2 is a schematic diagram of the structure of a temperature analysis circuit provided by an embodiment of the present application.

[0024] Figure 3 is a schematic diagram of the structure of an implant device provided by an embodiment of the present application.

[0025] Figure 4 It is a schematic flowchart of the temperature calibration method provided by an embodiment of the present application.

[0026] Figure 5 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

[0027] In the figure, 1 is a controller; 2 is a temperature analysis circuit; 21 is a temperature analysis unit; 22 is a single-pole double-throw switch; 23 is a digital-to-analog converter; 3 is a stimulation unit; 31 is a DC-blocking capacitor; 32 is a four-way switch; 4 is an external thermosensitive element; 5 is an internal thermosensitive element; 6 is a stimulation chip; 7 is a circuit board; 301 is a CPU; 302 is a ROM; 303 is a RAM; 304 is an I / O interface; 305 is an input part; 306 is an output part; 307 is a storage part; 308 is a communication part; 309 is a driver; 310 is a removable medium. Detailed implementation manners

[0028] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some but not all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0029] In addition, the term "and / or" in this article is only a kind of association relationship describing associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after unless otherwise specified.

[0030] When using a nerve stimulator to treat a patient, it is necessary to implant the nerve stimulator into the patient's body. During the treatment process of the nerve stimulator, the temperature of the nerve stimulator will also change. If the temperature of the nerve stimulator is a little higher than the patient's body temperature, no damage will occur. However, if the temperature difference between the nerve stimulator and the patient's body temperature is large, for example, the temperature difference is greater than two degrees Celsius, the temperature generated by the nerve stimulator may cause a certain degree of burns to the nerve tissue around the nerve stimulator in the patient.

[0031] Currently, in order to measure the temperature of implanted devices such as nerve stimulators, a temperature sensor is set inside the chip of the implanted device to measure the temperature of the implanted chip. However, due to the influence of the actual usage scenario, the accuracy of such a temperature sensor is relatively limited. At the same time, setting it inside the chip can only measure the temperature inside the chip, but not the temperature at the contact position between the implanted device and the patient, resulting in inaccurate temperature measurement of the implanted device. If a new temperature signal processing circuit is added outside the implanted device, additional pins are required to connect the above circuit, which will increase the burden on the implanted device.

[0032] In order to improve the accuracy of temperature measurement without increasing too much circuit burden, the embodiment of the present application provides a temperature calibration device, which reduces the circuit burden caused by temperature measurement and improves the accuracy of temperature measurement by multiplexing some circuits.

[0033] The following further describes the embodiment of the present application in detail with reference to the accompanying drawings of the specification.

[0034] The embodiment of the present application provides a temperature calibration device. Referring to Figure 1 , the temperature calibration device includes a temperature analysis circuit 2, a controller 1, and multiple stimulation units 3. An external thermosensitive element 4 is provided on each of the above stimulation units 3. The above external thermosensitive element 4 is used to reflect the temperature of the non-heating position of the implanted device. The above external thermosensitive element 4 is connected to the above temperature analysis circuit 2. The above temperature analysis circuit 2 is used to output a temperature signal according to the change in the physical characteristics of the above external thermosensitive element 4. The above controller 1 is connected to the above temperature analysis circuit 2 and is used to judge the temperature change and output a warning signal according to the above temperature signal.

[0035] Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the described controller 1 can refer to the corresponding process in the subsequent method embodiment and will not be described in detail here.

[0036] Further, each of the above stimulation units 3 includes a stimulation electrode, a blocking capacitor 31, and a four-way switch 32. The above stimulation electrode, the above blocking capacitor 31, and the above four-way switch 32 are connected in series. The four input terminals of the above four-way switch 32 are respectively connected to a stimulation input terminal, a stimulation output terminal, a temperature input terminal, and a temperature output terminal. The above stimulation electrode is in contact with nerve tissue. The above external thermosensitive element 4 is connected across any two of the above stimulation units 3. The connection point between the above external thermosensitive element 4 and the above stimulation unit 3 is located between the above blocking capacitor 31 and the above four-way switch 32. The resistance value of the above external thermosensitive element 4 is m times the resistance value of the contact resistance corresponding to the above stimulation electrode, and m is greater than 1.

[0037] It can be understood that the stimulating electrode is in contact with or connected to the nerve tissue. The impedance corresponding to the stimulating electrode can reflect the contact condition between the stimulating electrode and the nerve tissue. The better the contact condition of the stimulating electrode, the larger the impedance value; conversely, the worse the contact condition of the stimulating electrode, the smaller the impedance value. In Figure 1 the resistance generated by the contact between the stimulating electrode and the nerve tissue is equivalent to the contact resistance R1 - Rn, where n is a positive integer. Among them, P1 represents the contact point between the stimulating electrode and the nerve tissue, and the contact resistance R1 is the resistance generated at point P1. Similarly, Pn represents the contact point between the stimulating electrode and the nerve tissue, and the contact resistance Rn represents the contact resistance generated at point Pn.

[0038] By setting the above-mentioned four-way switch, operations such as temperature measurement and impedance measurement can be carried out while using the stimulating electrode for treatment. For example, switch S1 is connected to terminal a, that is, connected to Sense1 terminal, and switch S2 is connected to terminal c, that is, connected to Sense2. Among them, Sense1 and Sense2 are the two ends connected to the temperature analysis circuit 2. Sense1 is the current input terminal, and Sense2 is the current output terminal. After switches S1 and S2 are closed, the current flows in from the Sense1 terminal, passes through switch S1, and then passes through RT1 and the parts of C1, R1, R2, and C2 connected in parallel with RT1 respectively. It is known that the resistance of RT1 is greater than the resistances of R1 and R2. The greater the resistance of RT1, the smaller the current flowing into RT1, which can reduce the temperature change of RT1 caused by the current magnitude and improve the measurement accuracy of the external thermosensitive element 4. In a specific example, m is greater than 100.

[0039] While using S1 and S2 for temperature measurement, other switches such as S3 and S4 can also be used to connect to terminals b and d, conduct with O1 terminal and O2 terminal. O1 terminal is the input terminal of the stimulating current, and O2 terminal is the output terminal of the stimulating current. In this way, temperature measurement and treatment of the stimulating electrode can be carried out simultaneously.

[0040] The temperature calibration device further includes a digital logic circuit, which can be used to control the closing of the above-mentioned four-way switch 32. For example, the digital logic circuit includes multiple output ports, and each output port can output 2 bits, that is, output binary data 00, 01, 10, and 11. Among them, 00 means closing terminal a, 01 means closing terminal b, 10 means closing terminal c, and 11 means closing terminal d. In other embodiments, other methods can also be used to control the closing of the above-mentioned four-way switch 32, which is not limited here.

[0041] Further, the above temperature analysis circuit 2 includes a temperature analysis unit 21, a single-pole double-throw switch 22, and a digital-to-analog converter 23. One input terminal of the single-pole double-throw switch 22 is connected to the external thermosensitive element 4, and the other input terminal of the single-pole double-throw switch 22 is connected to an internal thermosensitive element 5. The internal thermosensitive element 5 is used to reflect the temperature inside the implant device. The output terminal of the single-pole double-throw switch 22 is connected to the digital-to-analog converter 23 through the temperature analysis circuit 2.

[0042] The above temperature analysis unit 21 is used to obtain the temperature rise or fall of the corresponding position of the thermosensitive element according to the change of the physical characteristics of the external thermosensitive element 4 or the internal thermosensitive element 5. The specific circuit structure of the temperature analysis unit 21 is well-known technical content to those skilled in the art and will not be elaborated here.

[0043] By setting the single-pole double-throw switch 22, connecting the internal thermosensitive element 5 and the external thermosensitive element 4 to the same temperature analysis circuit 2, the multiplexing of the temperature analysis circuit 2 can be realized. By controlling the closing of the single-pole double-throw switch 22, the temperature of the internal thermosensitive element 5 or the external thermosensitive element 4 can be obtained. While reducing the circuit burden in the implant device, the temperature at different positions can also be detected, improving the accuracy of temperature detection.

[0044] The embodiment of the present application also provides an implant device, which includes the above temperature calibration device and a stimulation chip 6. The distance between the external thermosensitive element 4 in the temperature calibration device and the stimulation chip 6 is within a preset range.

[0045] In a specific example, referring to Figure 3 , on the circuit board 7 of the implant device, there are a stimulation chip 6 and an external thermosensitive element 4. However, in order to reduce the influence of the temperature of the stimulation chip 6 on the temperature of the external thermosensitive element 4, the external thermosensitive element 4 is arranged at one end far from the stimulation chip 6. The above preset range needs to be determined according to actual needs. In other embodiments, other setting methods can also be adopted as long as the distance between the stimulation chip 6 and the external thermosensitive element 4 is within the preset range.

[0046] The embodiment of the present application provides a temperature calibration method, and the main process of the method is described as follows.

[0047] As Figure 4 shown: Step S101: The controller 1 obtains the initial internal temperature and the initial external temperature.

[0048] Specifically, the above-mentioned initial internal temperature represents the initial temperature inside the implant device, and the above-mentioned initial external temperature represents the initial temperature at a non-heating position of the implant device. By switching the single-pole double-throw switch 22, the initial external temperature corresponding to the external thermosensitive element 4 and the initial internal temperature corresponding to the internal thermosensitive element 5 are obtained.

[0049] Step S102: Calculate the difference between the initial internal temperature and the initial external temperature to obtain the initial temperature difference.

[0050] Step S103: Output a warning message according to the initial temperature difference.

[0051] After the preliminary judgment is completed, it is also necessary to timely detect the temperature difference between the temperatures sensed by the external thermosensitive element 4 and the internal thermosensitive element 5 during the treatment process. The above temperature calibration method further includes: Obtain the current internal temperature and the current external temperature. The above-mentioned current internal temperature represents the temperature sensed by the internal thermosensitive element 5 at the current time, and the above-mentioned current external temperature represents the temperature sensed by the external thermosensitive element 4 at the current time. Calculate the difference between the above-mentioned current internal temperature and the above-mentioned current external temperature to obtain the current temperature difference; output a warning message according to the above-mentioned current temperature difference. When the above-mentioned current temperature difference exceeds the difference preset value, output a warning message to prompt that there may be a problem of too high temperature of the implant device for the patient, and the treatment needs to be paused.

[0052] It can be understood that the change of the human body temperature will cause the change of the temperature reference of the chip. For example, the current temperature of the chip is 36.5 °C, but due to the fluctuation of the body temperature, the chip temperature rises from 36.5 °C to 37 °C. Since the chip itself also generates heat during operation, the temperature rises, for example, by 2 °C. At this time, the actual temperature of the chip is 39 °C. If 36.5 °C is directly used as the temperature reference, the measured temperature increase of the chip is 2.5 °C. The difference preset value is set to 2 °C. At this time, the temperature difference is abnormal. However, in fact, the human body temperature is 37 °C, the chip measures its own temperature as 39 °C, and the measured temperature rise of the chip at this time is 2 °C, which does not exceed 2 °C, so there is no abnormality. If the temperature inside the chip is not calibrated, the measured temperature difference is inaccurate. The above-mentioned human body temperature is measured by the external thermosensitive element 4, and the above-mentioned chip temperature is measured by the internal thermosensitive element 5.

[0053] First, power on the stimulation chip 6. Then, the implanted device will receive stimulation control information to control the stimulation electrodes for treatment. At this time, the path that has not been used for stimulation treatment is selected from the paths corresponding to the four-way switch 32 for temperature measurement. Then, by switching the single-pole double-throw switch 22, the initial internal temperature Tempin1 and the initial external temperature Tempbody1 can be measured. Determine whether TempError1 = Tempin1 - Tempbody1 exceeds the temperature difference preset value Temperrmax1. If it exceeds, an early warning message is output. Otherwise, if it does not exceed, it indicates that the device temperature is normal.

[0054] After the stimulation chip 6 operates for a period of time, the internal temperature of the stimulation chip 6 will change. At this time, the temperature corresponding to the internal thermal component 5 is measured again and recorded as Tempin2, and the temperature corresponding to the external thermal component 4 is measured and recorded as Tempbody2. Determine whether TempError2 = Tempin2 - Tempbody2 exceeds the temperature limit Temperrmax2. A preliminary judgment is made on the temperature difference between the internal thermal component 5 and the external thermal component 4. When the initial temperature difference is greater than the difference preset value, if it exceeds, an early warning message is output. Otherwise, if it does not exceed, it indicates that the device temperature is normal. Outputting an early warning message may indicate that there is a problem with the thermal component or that the patient's temperature is abnormal. The patient, medical staff, etc. can check the reason for the large temperature difference based on the received early warning message and then proceed with subsequent treatment.

[0055] The embodiment of the present application discloses an electronic device. Refer to Figure 5 , the electronic device includes a central processing unit (CPU) 301, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 302 or the program loaded from the storage section 307 into the random access memory (RAM) 303. In the RAM 303, various programs and data required for system operation are also stored. The CPU 301, ROM 302, and RAM 303 are connected to each other through a bus. The input / output (I / O) interface 304 is also connected to the bus.

[0056] The following components are connected to the I / O interface 304: an input section 305 including a keyboard, a mouse, etc.; an output section 306 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc. and a speaker, etc.; a storage section 307 including a hard disk, etc.; and a communication section 308 including a network interface card such as a local area network (LAN) card, a modem, etc. The communication section 308 performs communication processing via a network such as the Internet. A drive 309 is also connected to the I / O interface 304 as needed. A removable medium 310 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc. is installed on the drive 309 as needed so that a computer program read from the removable medium 310 is installed into the storage section 307 as needed.

[0057] Specifically, according to an embodiment of the present application, the process described above with reference to the flowchart Figure 4 can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product that includes a computer program carried on a machine-readable medium, and the computer program includes program code for performing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via the communication section 308, and / or installed from the removable medium 310. When the computer program is executed by a central processing unit (CPU) 301, the above-described functions defined in the apparatus of the present application are executed.

[0058] It should be noted that the computer-readable medium shown in this application can be a computer-readable signal medium, a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples of a computer-readable storage medium can include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this application, a computer-readable storage medium can be any tangible medium that contains or stores a program, and this program can be used by or in combination with an instruction execution system, apparatus, or device. In this application, a computer-readable signal medium can include a data signal propagated in a baseband or as part of a carrier wave, which carries computer-readable program code. Such a propagated data signal can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, and this computer-readable medium can send, propagate, or transmit a program for use by or in combination with an instruction execution system, apparatus, or device. The program code contained on a computer-readable medium can be transmitted using any appropriate medium, including but not limited to: wireless, wire, optical cable, radio frequency (RF), etc., or any suitable combination of the above.

[0059] The above description is only a preferred embodiment of this application and an explanation of the applied technical principles. Those skilled in the art should understand that the scope of the application involved in this application is not limited to the technical solution formed by the specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the foregoing application concept. For example, a technical solution formed by mutually replacing the above features with (but not limited to) technical features having similar functions in this application.

Claims

1. A temperature calibration device, characterized in that, It includes a temperature analysis circuit (2), a controller (1), and multiple stimulation units (3). An external thermosensitive element (4) is provided on each of the stimulation units (3), and the external thermosensitive element (4) is used to reflect the temperature of the non-heating position of the implanted device; The external thermosensitive element (4) is connected to the temperature analysis circuit (2), and the temperature analysis circuit (2) is used to output a temperature signal according to the change in the physical characteristics of the external thermosensitive element (4); The controller (1) is connected to the temperature analysis circuit (2) and is used to judge the temperature change and output a warning signal according to the temperature signal.

2. The temperature calibration device according to claim 1, wherein Each of the stimulation units (3) includes a stimulation electrode, a direct current blocking capacitor (31), and a four-way switch (32). The stimulation electrode, the direct current blocking capacitor (31), and the four-way switch (32) are connected in series. Four input terminals of the four-way switch (32) are respectively connected to a stimulation input terminal, a stimulation output terminal, a temperature input terminal, and a temperature output terminal, and the stimulation electrode is in contact with nerve tissue.

3. The temperature calibration device according to claim 2, characterized in that, The external thermosensitive element (4) is connected across any two of the stimulation units (3). The connection point of the external thermosensitive element (4) and the stimulation unit (3) is located between the direct current blocking capacitor (31) and the four-way switch (32). The resistance value of the external thermosensitive element (4) is m times the resistance value of the contact resistance corresponding to the stimulation electrode, and m is greater than 1.

4. The temperature calibration device according to claim 2, wherein, The temperature analysis circuit (2) includes a temperature analysis unit (21), a single-pole double-throw switch (22), and an analog-to-digital converter (23). One input terminal of the single-pole double-throw switch (22) is connected to the external thermosensitive element (4), and the other input terminal of the single-pole double-throw switch (22) is connected to an internal thermosensitive element (5). The internal thermosensitive element (5) is used to reflect the temperature inside the implanted device. The output terminal of the single-pole double-throw switch (22) is connected to the analog-to-digital converter (23) through the temperature analysis circuit (2).

5. The temperature calibration device according to claim 2, wherein The device further includes a digital logic circuit for controlling the closing of the four-way switch (32).

6. An implant device, characterized in that, It includes the temperature calibration device according to any one of claims 1-5 and a stimulation chip (6). The distance between the external thermosensitive element (4) in the temperature calibration device and the stimulation chip (6) is within a preset range.

7. A temperature calibration method, characterized in that, Applied to the temperature calibration device according to any one of claims 1-5, it includes: The controller (1) obtains an initial internal temperature and an initial external temperature. The initial internal temperature represents the initial temperature inside the implanted device, and the initial external temperature represents the initial temperature of the non-heating position of the implanted device; Calculate the difference between the initial internal temperature and the initial external temperature to obtain an initial temperature difference; Output a warning message according to the initial temperature difference.

8. The temperature calibration method according to claim 7, characterized in that, The method further includes: Obtain the current internal temperature and the current external temperature; Calculate the difference between the current internal temperature and the current external temperature to obtain a current temperature difference; Output a warning message according to the current temperature difference.

9. An electronic device, characterized in that, It includes a memory and a processor, and a computer program capable of being loaded and executed by the processor for the method described in any one of claims 7 to 8 is stored on the memory.

10. A computer-readable storage medium, characterized in that, A computer program capable of being loaded and executed by the processor for the method described in any one of claims 7 to 8 is stored.

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