Stacked gate laser secondary injection enhanced repair equipment and repair method

Abstract

The invention provides stacked gate laser secondary injection enhanced repair equipment and a repair method. The stacked gate laser secondary injection enhanced repair equipment comprises a conveying belt; the feeding assembly comprises a first feeding mechanism and a second feeding mechanism which can be used in a power-off state; a first dual-laser assembly; a second dual-laser assembly; a carrying assembly; a turntable; the feeding assembly, the rotary table and the discharging assembly are sequentially arranged, and the carrying assembly is located on one side of the rotary table so that position switching of products between the conveying belt and the rotary table can be achieved. The device can be suitable for battery pieces of different sizes, the battery pieces of different sizes are positioned for four times through laser, the acting contact time of the laser and the battery pieces is prolonged, ohmic contact is better, current is increased, silver-silicon microcrystals are promoted to be formed, sintering is sufficient, and the filling factor of the battery pieces is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of battery processing, and particularly relates to a stacked gate laser secondary injection enhancement repair device and a repair method. Background Art

[0002] The current laser repair technology for stacked gate battery wafers uses the conduction mechanism of traditional high-temperature sintered metallized ohmic contacts, where the direct conduction of silver-silicon microcrystals dominates, supplemented by different types of tunneling indirect conduction. From an electrochemical perspective, the construction of a direct conduction channel requires sufficient electrons to be obtained by Ag+ dissolved in the glass during sintering to reduce and form silver-silicon microcrystals. The existing laser repair technology for stacked gate battery wafers has the following defects:

[0003] 1. There is insufficient Ag-si binding, making it difficult to form silver-silicon microcrystals, resulting in high resistance and poor process efficiency improvement.

[0004] 2. In terms of process control, multiple processing areas cannot be selected for processing, and only the entire surface can be processed. During the processing, the processing area is large, resulting in insufficient instantaneous current intensity within the entire area and insufficient sintering. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide a stacked gate laser secondary injection enhancement repair device and a repair method, which can be applicable to battery wafers of different sizes. Through laser, four-positioning of battery wafers of different sizes is carried out, increasing the contact time between the laser and the battery wafer, improving the ohmic contact, increasing the current, promoting the formation of silver-silicon microcrystals, achieving sufficient sintering, and enhancing the fill factor of the battery wafer.

[0006] The embodiments of the present invention are achieved through the following technical solutions:

[0007] A stacked gate laser secondary injection enhancement repair device includes:

[0008] A conveyor belt, the conveyor belt including a plurality of feeding belt units;

[0009] A loading assembly, the loading assembly including a first loading mechanism and a second loading mechanism that can be used in a power-off state; both the first loading mechanism and the second loading mechanism are provided with loading storage units;

[0010] An unloading assembly, the unloading assembly including a first unloading mechanism and a second unloading mechanism that can be used in a power-off state; both the first unloading mechanism and the second unloading mechanism are provided with unloading storage units;

[0011] The first dual-laser component, the first dual-laser component includes a first sintering mechanism and at least two first lasers, the first sintering mechanism includes a first lifting unit and a first pressing structure provided with a plurality of first probes, and the lifting end of the first lifting unit drives the first pressing structure to move up and down;

[0012] The second dual-laser component, the second dual-laser component includes a second sintering mechanism and at least two second lasers, the second sintering mechanism includes a second lifting unit and a second pressing structure provided with a plurality of second probes, and the lifting end of the second lifting unit drives the second pressing structure to move up and down;

[0013] The handling component, the handling component includes a handling X-axis moving mechanism and at least two liftable handling suction cups, and the moving end of the handling X-axis moving mechanism can drive at least two of the handling suction cups to move in the X-axis direction;

[0014] The turntable, the turntable is provided with a voltage loading end and a plurality of turntables for placing batteries, the first dual-laser component is located above one of the turntables, and the second dual-laser component is located above another turntable;

[0015] The feeding component, the turntable, and the discharging component are arranged in sequence, and the handling component is located on one side of the turntable to realize the position switching of the product between the conveyor belt and the turntable.

[0016] According to a preferred embodiment, a batch loading mechanism and a batch unloading mechanism are further provided on the front side of the feeding component;

[0017] Both the batch loading mechanism and the batch unloading mechanism include an inclined hopper and a driving unit, and the driving unit causes the inclined hopper to tilt to collect materials or tilt to discharge materials;

[0018] The batch loading mechanism, the batch unloading mechanism, the first feeding mechanism, the second feeding mechanism, the first discharging mechanism, and the second discharging mechanism also all include a cutting Y-axis moving unit and a cutting suction cup.

[0019] According to a preferred embodiment, the first pressing structure includes at least two first pressing units, and each first pressing unit includes at least two rows of staggered first probes;

[0020] The second pressing structure includes at least two second pressing units, and each second pressing unit includes at least two rows of staggered second probes.

[0021] According to a preferred embodiment, a vision positioning component is further included, and the vision positioning component includes at least four detection cameras.

[0022] A method for enhancing repair by double injection of moiré laser includes the following steps:

[0023] Step S10, confirm the product size, confirm the template, and confirm whether the light spot changes;

[0024] Step S20, device debugging;

[0025] Step S30, divide the product into four equal - part regions, perform laser positioning on the product, and control the first laser or / and the second laser to calibrate the laser positioning of each region of the four equal - part regions once;

[0026] Step S40, test the voltage and power parameters, apply voltage to the product, and then control the first laser or / and the second laser to emit a laser beam to repair the corresponding region of the product for junction burning.

[0027] According to a preferred embodiment, in step S10, the range for confirming whether the light spot changes includes whether the size and shape of the light spot are intact, and confirm whether the light spot is within the standard range.

[0028] According to a preferred embodiment, in step S10, if it is found that the light spot changes, the laser parameters are adjusted in a timely manner.

[0029] According to a preferred embodiment, in step S20, the device debugging specifically includes the following steps:

[0030] Step S201, adjust the loading and unloading storage units to ensure that the handling suction cup can pick up the wafer normally;

[0031] Step S202, adjust the step distance of the feeding belt unit to ensure that the product walks to the specified position before rectification;

[0032] Step S203, adjust the first probe and the second probe to ensure that the first probe and the second probe press on the main grid of the product each time they are lowered.

[0033] According to a preferred embodiment, in step S30, rough positioning is performed before laser positioning of the product, and the detection camera is controlled to perform visual positioning on each region of the four equal - part regions once.

[0034] According to a preferred embodiment, the voltage range is 10V - 17V.

[0035] The technical solution of the embodiment of the present invention has at least the following advantages and beneficial effects:

[0036] The present invention can be applicable to battery wafers of different sizes. By performing four - time laser positioning on battery wafers of different sizes through laser, the contact time between the laser beam and the battery wafer is increased, the ohmic contact is better, the formation of silver - silicon microcrystals is promoted, the current is increased, the junction burning is sufficient, and the fill factor of the battery wafer is improved. Brief Description of the Drawings

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0038] Figure 1 Schematic three-dimensional structure diagram of a stacked-gate laser secondary injection enhancement repair device provided by an embodiment of the present invention;

[0039] Figure 2 Schematic top view structure diagram of a stacked-gate laser secondary injection enhancement repair device provided by an embodiment of the present invention;

[0040] Figure 3 Schematic structure diagram of a loading component provided by an embodiment of the present invention;

[0041] Figure 4 Schematic structure diagram of a handling component provided by an embodiment of the present invention;

[0042] Figure 5 Schematic structure diagram of a first sintering mechanism and a second sintering mechanism provided by an embodiment of the present invention;

[0043] Figure 6 Schematic bottom view structure diagram of a turntable provided by an embodiment of the present invention.

[0044] Reference Signs: 1, conveyor belt; 2, first loading mechanism; 3, second loading mechanism; 4, loading storage unit; 5, first unloading mechanism; 6, second unloading mechanism; 7, unloading storage unit; 8, first laser; 9, first pressing structure; 10, first probe; 11, first lifting unit; 12, second laser; 13, second pressing structure; 14, second probe; 15, second lifting unit; 16, handling X-axis moving mechanism; 17, handling suction cup; 18, turntable; 19, turntable; 20, detection camera; 21, inclined hopper; 22, driving unit; 23, cutting Y-axis moving unit; 24, cutting suction cup; 26, batch sintering loading mechanism; 27, batch sintering unloading mechanism. Detailed Embodiments

[0045] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0046] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0048] Embodiment

[0049] Please refer to Figures 1 to 6 A stacked-gate laser secondary injection enhanced repair device, comprising: a conveyor belt 1, the conveyor belt 1 including a plurality of feeding belt units; a loading assembly, the loading assembly including a first loading mechanism 2 and a second loading mechanism 3 that can be used in a power-off state; both the first loading mechanism 2 and the second loading mechanism 3 are provided with loading storage units 4; a discharging assembly, the discharging assembly including a first discharging mechanism 5 and a second discharging mechanism 6 that can be used in a power-off state; both the first discharging mechanism 5 and the second discharging mechanism 6 are provided with discharging storage units 7; a first double-laser assembly, the first double-laser assembly including at least two first lasers 8 and a first sintering mechanism, the first sintering mechanism including a first lifting unit 11 and a first pressing structure 9 provided with a plurality of first probes 10, the lifting end of the first lifting unit 11 driving the first pressing structure 9 to move up and down; a second double-laser assembly, the second double-laser assembly including at least two second lasers 12 and a second sintering mechanism, the second sintering mechanism including a second lifting unit 15 and a second pressing structure 13 provided with a plurality of second probes 14, the lifting end of the second lifting unit 15 driving the second pressing structure 13 to move up and down; a handling assembly, the handling assembly including a handling X-axis moving mechanism 16 and at least two liftable handling suction cups 17, the moving end of the handling X-axis moving mechanism 16 driving at least two handling suction cups 17 to move in the X-axis direction; a turntable 18, the turntable 18 being provided with a voltage loading end and a plurality of turntables 19 for placing batteries, the first double-laser assembly being located above one turntable 19, and the second double-laser assembly being located above another turntable 19; the loading assembly, the turntable 18, and the discharging assembly are arranged in sequence, and the handling assembly is located on one side of the turntable 18 to realize the position switching of the product between the conveyor belt 1 and the turntable 18.

[0050] Preferably, a batch loading mechanism 26 and a batch discharging mechanism 27 are further provided on the front side of the loading assembly;

[0051] Both the batch feeding mechanism 26 and the batch discharging mechanism 27 include an inclined hopper 21 and a driving unit 22, and the driving unit 22 causes the inclined hopper 21 to incline to collect materials or discharge materials obliquely.

[0052] The batch feeding mechanism 26, the batch discharging mechanism 27, the first feeding mechanism 2, the second feeding mechanism 3, the first discharging mechanism 5 and the second discharging mechanism 6 also all include a cutting Y-axis moving unit 23 and a cutting suction cup 24.

[0053] Preferably, the first pressing structure 9 includes at least two first pressing units, and each first pressing unit includes at least two rows of first probes 10 arranged staggeredly.

[0054] The second pressing structure 13 includes at least two second pressing units, and each second pressing unit includes at least two rows of second probes 14 arranged staggeredly.

[0055] Preferably, it further includes a visual positioning component, and the visual positioning component includes at least four detection cameras 20.

[0056] A method for repairing by double injection enhancement of moiré laser includes the following steps:

[0057] Step S10, confirm the product size, confirm the template and confirm whether the light spot changes;

[0058] Step S20, equipment debugging;

[0059] Step S30, divide the product into four equal parts regions, perform laser positioning on the product, and control the first laser 8 or / and the second laser 12 to calibrate the laser positioning of each region of the four equal parts regions once;

[0060] Step S40, test the voltage and power parameters, apply voltage to the product and then control the first laser 8 or / and the second laser 12 to emit a laser beam to repair the junction burn of the corresponding region of the product.

[0061] Preferably, in step S10, the range for confirming whether the light spot changes includes whether the size and shape of the light spot are intact and whether the light spot is within the standard range.

[0062] Preferably, in step S10, if it is found that the light spot changes, the laser parameters are adjusted in time.

[0063] Preferably, in step S20, the equipment debugging specifically includes the following steps:

[0064] Step S201, adjust the feeding storage unit 4 and the discharging storage unit 7 to ensure that the handling suction cup 17 can pick up the wafer normally;

[0065] Step S202: Adjust the step distance of the feeding belt unit to ensure that the product reaches the specified position before rectification.

[0066] Step S203: Adjust the first probe 10 and the second probe 14 to ensure that the first probe 10 and the second probe 14 press down on the main grid of the product each time.

[0067] Preferably, in step S30, rough positioning is performed before laser positioning of the product, and the detection camera 20 is controlled to perform visual positioning on each of the four equal parts of the area once.

[0068] Preferably, the voltage range is 10V - 17V.

[0069] The working principle of the present invention:

[0070] The n+ / n-Poly doped phosphorus surface of the battery cell is rich in electrons, which is beneficial to the reduction of Ag+ to form silver-silicon microcrystals; while the p+ / p-Poly surface doped with boron lacks electrons, which is not conducive to the reduction of Ag+ to form silver-silicon microcrystals. In this embodiment, laser carriers (electrons) can be injected to compensate for the surface electron deficiency, promote the reduction of Ag+ to silver-silicon microcrystals, and generate a thermal effect: under the bias voltage, the photo-generated carriers form a local high-density current, and the heat generation promotes the local Ag-Si interdiffusion to form an AgSix alloyed contact with extremely low resistance, thereby reducing the influence of resistance on the repair of the laser battery.

[0071] Such as Figure 1As shown, the conveyor belt 1 conveys from left to right in sequence, and the wafers to be processed pass through the batch loading mechanism 26, batch unloading mechanism 27, first loading mechanism 2, and second loading mechanism 3 in sequence. The handling component can transfer the wafers on the conveyor belt 1 behind the second loading mechanism 3 to the turntable 19. The turntable 18 drives the turntable 19 to rotate, driving different turntables 19 to rotate in sequence, and can be positioned by the inspection camera 20, first laser 8, and second laser 12. Finally, processing and repair are carried out through the first laser 8 and second laser 12. After the laser repair process is completed, the wafers are conveyed by the handling component to the conveyor belt 1 under the first unloading mechanism 5, and the conveyor belt 1 conveys along the conveying direction. A copper plate fixture can be set on the turntable 19, and the copper plate fixture on the turntable 19 can be connected with an external electrical connection end, and the external electrical connection end is located at the bottom of the turntable 18. In this embodiment, except for the copper plate fixture, other connecting components can be selected to realize the electrical connection of the two poles of the battery. The batch loading mechanism 26 and batch unloading mechanism 27 can perform batch loading and batch unloading of wafers. When an abnormality occurs during the processing, the batch unloading mechanism 27 can be started to unload the wafers on the conveyor belt 1. After the processing resumes normal operation, the batch loading mechanism 26 is used for batch loading. In addition, the second loading mechanism 3 can be set to start during the power-off offline process and can delay loading. Similarly, the second unloading mechanism 6 can also delay unloading, realizing the continuation of the overall processing process and ensuring the normal operation of the processing process, avoiding equipment damage or product damage caused by momentary power-off or other abnormal offline situations. The driving unit 22 can prompt the inclined hopper 21 to move horizontally, lift, and tilt. The inclined hopper 21 can approach the feeding belt unit. When the feeding belt unit drives the wafers to move, the driving unit 22 drives the inclined hopper 21 to move to one side of the feeding belt unit, and the opening is inclined to dock with the feeding belt unit, so that the corresponding wafers fall into the inclined hopper 21. The inclined hopper 21 is located below the batch loading mechanism 26 or / and batch unloading mechanism 27, and a part of the inclined hopper 21 can pass through between two adjacent feeding belt units, thereby intercepting and collecting the wafers.

[0072] The products mentioned above are battery wafers or silicon wafers, etc., which can be mainly used for the laser processing of crystalline silicon batteries. They can be used for the battery wafers of PERC, TOPCON, HJT, and XBC. The processing size is not limited to half-cell and full-cell batteries, ranging from 156*156mm to 230*230mm. The main size of the half-cell is 182*91mm to 230*105mm, and other size specifications can also be used. The repair process is compatible with various battery types such as PERC, TOPCon, HJT, and IBC, and supports processes such as SMBB and 0BB. Four lasers (two first lasers 8 and two second lasers 12) process the battery wafers. They are processed by using continuous laser or pulsed laser. The optical system can adapt to a variety of optical schemes, and the light source wavelength band is in the 355 - 1080nm band, especially in the 450 - 1080nm band, which can meet the process requirements. In this embodiment, both the first laser 8 and the second laser 12 can adopt the infrared continuous laser scheme, and the main wavelength band is in the range of 750 - 1400nm. It can also be compatible with the green laser scheme, and the wavelength band of the green laser is between 500 - 570nm. Four lasers are used for processing, and the wavelength band of 355 - 1080nm can meet the requirements. The power is between 10 - 500W, and the laser processing area is less than 280*280mm, which can cover all battery wafer sizes on the market, including half-cell sizes and full-cell sizes. At the same time, it is also compatible with ultraviolet lasers: This device is compatible with pulsed laser or continuous laser, and also compatible with the laser beam splitting scheme. The laser has a power feedback function, and it can be used for the component welding processes of PERC, TOPCON, HJT, and XBC.

[0073] This embodiment can achieve the processing from circular spot, rectangular spot to strip spot, which can be customized according to application needs. The minimum range of the spot is a 20*20um spot, and the spot of this application is 80*80um - 150*150um, and the maximum spot can reach 2*2mm.

[0074] This embodiment is provided with four detection cameras 20 for visual calibration and rough positioning of the battery wafers, and two first lasers 8 and two second lasers 12 for laser calibration and fine positioning of the battery wafers, increasing the contact time between the laser and the battery wafer, making the ohmic contact better, increasing the current, burning the junction sufficiently, improving the fill factor of the battery wafer, and reducing the influence of the resistance on the battery wafer in the subsequent process on the laser battery repair.

[0075] In step S10, before confirming the proofing template, determine the size of the battery cells first, including the whole battery cells and half battery cells, etc. Line scanning or area scanning can be selected. For line scanning, the laser coincides with the screen grid lines, and its advantage is that the CT (working efficiency / production beat) is relatively fast. For area scanning, increasing the contact between the laser and the battery cell can better excite charge carriers, thereby improving the battery conversion efficiency and fill factor. Also, confirm whether the light spot changes, whether the current status of the light spot size is intact, and whether it is within the standard range. If there are changes, adjust it in time.

[0076] In step S20, a cassette can be set to load the battery cells and an air knife. Adjust the cassette and the air knife. The air knife can remove dust to ensure that the suction cup can normally pick up the battery cells. The step distance and deviation correction of the conveyor belt can be adjusted. In this embodiment, a deviation correction clamp can be set. The deviation correction clamp can be provided with telescopic rollers to guide the battery cells to correct their positions, which is used to correct the deviation of the battery cells and determine to correct the deviation after ensuring that the product reaches the specified position. Adjust the first probe 10 and the second probe 14 to ensure that the corresponding first probe 10 or / and the second probe 14 can press onto the main grid of the battery cell every time they are pressed down.

[0077] In step S30, use the inspection camera 20 to take pictures and position the battery cells, mark the mark points with a marker pen, and adjust the camera hardware to ensure that each camera can capture the mark points and display them in the image, that is, each mark point is located at the specified position within the corresponding quarter area. Each quarter area corresponds to a mark point. In this embodiment, edge grasping positioning can also be compatible. It can be used for laser injection enhancement and repair of half or whole stacked grid battery cells of photovoltaic crystalline silicon batteries (TOPCON / HJT / XBC). This equipment greatly improves the production efficiency of the stacked grid battery cells, and the overall product yield and stability can be improved through this process solution.

[0078] In step S40, before proofing, first test and determine the parameters of the required lasers (the first laser 8 or / and the second laser 12). A suitable voltage can be selected within the voltage range of 10V - 17V. Use a power meter to test the power of the first laser 8 and the second laser 12. A laser with a power of 50W can be selected. The marking parameters are as follows: the marking speed is generally 80000mm / s, and then adjust the jump speed and delay according to the actual situation. The laser parameters include the parameters of the first laser 8 and the second laser 12, and the parameters include jump speed, power, frequency, pulse, etc. In this embodiment, even if the processing area is large, after four laser positioning calibrations, the instantaneous current intensity of the entire area is ensured to be large enough at the same time.

[0079] The technical means disclosed by the solution of the present invention are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present invention.

Claims

1. A double-grating laser secondary injection enhanced repair device, characterized in that, Comprising: A conveyor belt, the conveyor belt comprising a number of feeding belt units; A loading assembly, the loading assembly comprising a first loading mechanism and a second loading mechanism that can be used in a power-off state; both the first loading mechanism and the second loading mechanism are provided with loading storage units; An unloading assembly, the unloading assembly comprising a first unloading mechanism and a second unloading mechanism that can be used in a power-off state; both the first unloading mechanism and the second unloading mechanism are provided with unloading storage units; A first dual-laser assembly, the first dual-laser assembly comprising a first sintering mechanism and at least two first lasers, the first sintering mechanism comprising a first lifting unit and a first pressing structure provided with a number of first probes, and the lifting end of the first lifting unit driving the first pressing structure to move up and down; A second dual-laser assembly, the second dual-laser assembly comprising a second sintering mechanism and at least two second lasers, the second sintering mechanism comprising a second lifting unit and a second pressing structure provided with a number of second probes, and the lifting end of the second lifting unit driving the second pressing structure to move up and down; A handling assembly, the handling assembly comprising a handling X-axis moving mechanism and at least two liftable handling suction cups, and the moving end of the handling X-axis moving mechanism being able to drive at least two of the handling suction cups to move in the X-axis direction; A turntable, the turntable being provided with a voltage loading end and a number of turntables for placing batteries, the first dual-laser assembly being located above one of the turntables, and the second dual-laser assembly being located above another of the turntables; The loading assembly, the turntable, and the unloading assembly are arranged in sequence, and the handling assembly is located on one side of the turntable to achieve position switching of the product between the conveyor belt and the turntable.

2. The stacked grating laser secondary injection enhancement repair device according to claim 1, wherein A batch loading mechanism and a batch unloading mechanism are further provided on the front side of the loading assembly; Both the batch loading mechanism and the batch unloading mechanism comprise an inclined hopper and a driving unit, and the driving unit causes the inclined hopper to tilt to collect materials or tilt for discharging materials; The batch loading mechanism, the batch unloading mechanism, the first loading mechanism, the second loading mechanism, the first unloading mechanism, and the second unloading mechanism further all comprise a cutting Y-axis moving unit and a cutting suction cup.

3. The stacked grating laser secondary injection enhancement repair device according to claim 2, wherein The first pressing structure comprises at least two first pressing units, and each first pressing unit comprises at least two rows of first probes arranged in a staggered manner; The second pressing structure comprises at least two second pressing units, and each second pressing unit comprises at least two rows of second probes arranged in a staggered manner.

4. The stacked grating laser secondary injection enhancement repair device according to claim 2, wherein It further comprises a vision positioning assembly, and the vision positioning assembly comprises at least four detection cameras.

5. A method for enhancing repair by secondary injection of moiré laser, characterized in that, Including the following steps: Step S10, confirming the product size, confirming the template, and confirming whether the light spot changes; Step S20, equipment debugging; Step S30: Divide the product into four equal-area regions, perform laser positioning on the product, and control the first laser or / and the second laser to calibrate the laser positioning of each region in the four equal-area regions once. Step S40: Test the voltage and power parameters, apply voltage to the product, and then control the first laser or / and the second laser to emit laser beams to repair the junction burn of the corresponding region of the product.

6. The method for enhanced repair by double injection of stacked-gate lasers according to claim 5, wherein In step S10, the range for confirming whether the light spot changes includes whether the size and shape of the light spot are intact and whether the light spot is within the standard range.

7. The method for enhanced repair by double injection of stacked-gate lasers according to claim 5, wherein In step S10, if it is found that the light spot changes, the laser parameters are adjusted in a timely manner.

8. The method for enhanced repair by double injection of stacked-gate lasers according to claim 5, wherein In step S20, the equipment debugging specifically includes the following steps: Step S201: Adjust the loading storage unit and the unloading storage unit to ensure that the handling suction cup can pick up the wafers normally. Step S202: Adjust the step distance of the feeding belt unit to ensure that the product is corrected after reaching the specified position. Step S203: Adjust the first probe and the second probe to ensure that the first probe and the second probe press onto the main gate of the product each time they are pressed down.

9. The method for enhanced repair by double injection of stacked-gate lasers according to claim 5, wherein In step S30, rough positioning is performed before laser positioning of the product, and the detection camera is controlled to perform visual positioning on each region of the four equal parts once.

10. The method for enhanced repair by double injection of stacked-gate lasers according to claim 5, wherein The voltage range is 10V - 17V.

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