System and method for detecting angle of wafer positioning groove

Abstract

The embodiment of the invention provides a system and method for detecting the angle of a wafer positioning groove, and the system comprises a wafer box, the side surface of which is provided with a side surface opening used for the incoming and outgoing of a wafer; the wafer slot is positioned in the wafer box and is used for accommodating a wafer; the plurality of infrared scanning devices are coupled to the inner wall of the wafer box so as to scan and transmit edge surface information of the wafer; and the processing module is used for generating a wafer edge image based on the edge surface information, responding to a wafer positioning groove contained in the wafer edge image, and determining the angle of the wafer positioning groove. By adopting the technical scheme, the problems of time waste and low accuracy of obtaining the angle of the positioning groove before the wafer enters the machine table can be solved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of semiconductor manufacturing technology, and in particular, to a system and method for detecting the angle of a wafer positioning groove. Background Art

[0002] In the semiconductor production process, the angle of the wafer positioning groove is generally measured only on specific machines, and some machines cannot obtain the information of the wafer positioning groove angle. When some wafers are defective, it is necessary to know the angle of the wafer before it enters the machine to facilitate the analysis of which process and which machine the wafer is defective at. The current method can only deduce the angle of the positioning groove of the wafer before it enters the machine from front to back, which is time-consuming and laborious, and the accuracy is relatively low.

[0003] Therefore, how to provide a technical solution to solve the problem of time-consuming and low accuracy in obtaining the angle of the positioning groove of the wafer before it enters the machine has become an urgent technical problem to be solved. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a system and method for detecting the angle of a wafer positioning groove, which can effectively improve the timeliness and accuracy of obtaining the angle of the positioning groove of the wafer before it enters the machine.

[0005] To solve the above technical problems, embodiments of the present invention provide a system for detecting the angle of a wafer positioning groove, including: a wafer cassette, the side surface of the wafer cassette having a side opening for wafers to enter and exit; a wafer slot, located inside the wafer cassette for accommodating wafers; a plurality of infrared scanning devices, coupled to the inner wall of the wafer cassette to scan and transmit the edge surface information of the wafers; a processing module, configured to generate a wafer edge image based on the edge surface information and determine the angle of the wafer positioning groove in response to the wafer positioning groove included in the wafer edge image.

[0006] Optionally, the number of the wafer slots is at least two and is connected to a first inner wall group of the wafer cassette, the first inner wall group including opposite inner walls of the wafer cassette and not including the inner wall having the side opening; the plurality of infrared scanning devices are respectively coupled to one or more inner walls in the first inner wall group.

[0007] Optionally, the wafer slot includes: a plurality of layers of support plates, with wafers being accommodated between adjacent support plates; a first positioning block, adjacent support plates being connected by the first positioning block and located in the central area of the support plates; wherein the distance between two first positioning blocks opposite to each other on the same plane is greater than the diameter of the wafer.

[0008] Optionally, the wafer slot further includes: a second positioning block, located between adjacent support plates and away from the side opening.

[0009] Optionally, the wafer cassette further has a wafer cassette cover which is snap-fitted to the side opening of the wafer cassette, and the shape and size of the wafer cassette cover are adapted to the side opening of the wafer cassette for closing the wafer cassette.

[0010] Optionally, the infrared scanning device includes: an optical component for emitting and receiving infrared signals and converting the received optical signal from the wafer into an electrical signal; an electronic component for converting the electrical signal into a digital signal; and a wireless transmission component coupled to the electronic component for transmitting the digital signal.

[0011] Optionally, the optical component includes: an infrared emission part and an infrared reception part; the infrared emission part is an infrared light source for emitting an infrared light beam onto the scanning object; the infrared reception part is an infrared detector for receiving the infrared optical signal reflected back by the wafer and converting the optical signal into an electrical signal.

[0012] Optionally, the electronic component includes: a signal amplifier for amplifying the electrical signal converted by the infrared detector; and an analog-to-digital converter for converting the analog signal amplified by the signal amplifier into a digital signal.

[0013] Optionally, the wireless transmission component includes one or more of the following: a signal transmitter coupled to the wafer cassette for transmitting the digital signal; a first signal receiver coupled to the machine platform for receiving the digital signal, wherein the processing module is arranged on the machine platform; and a second signal receiver coupled to the wafer cassette for receiving the digital signal, wherein the processing module is arranged in the wafer cassette.

[0014] Optionally, the optical component further includes: a galvanometer mirror or a rotating mirror for controlling the scanning path of the infrared light beam.

[0015] Optionally, the number of the infrared scanning devices is 4, and they are evenly arranged on the inner wall of the wafer cassette and / or the intersection of the inner walls of the wafer cassette, and the infrared scanning devices face the wafer storage area of the wafer cassette.

[0016] Optionally, the system for detecting the angle of the wafer positioning groove further includes a plurality of moving components; guide rails installed on opposite sides of the wafer cassette and / or the inner wall of the wafer cassette, arranged in a direction perpendicular to the surface of the wafer in the wafer cassette, and the length of the guide rail is adapted to the length of the wafer slot; fixing members are arranged on the guide rails for fixing the infrared scanning device, and the infrared scanning device faces the wafer; a driving motor is used to drive the fixing member to move along the guide rail; a position sensor is used to monitor the position of the infrared scanning device on the guide rail; a control unit is respectively coupled to the position sensor and the driving motor, and is used to control the driving motor according to the position information transmitted back by each position sensor, so that the relative positions of the infrared scanning devices on the guide rail are at the same height.

[0017] Optionally, the processing module uses the circle on the wafer surface and the radius facing or perpendicular to the side opening of the wafer cassette as the zero-degree line, and the radius where the center of the wafer positioning groove range is located as the auxiliary line to calculate the orientation of the wafer positioning groove.

[0018] Correspondingly, the present invention also provides a method for automatically detecting the angle of the wafer positioning groove, a wafer cassette for detecting the angle of the wafer positioning groove, the wafer cassette having a wafer slot, and a plurality of infrared scanning devices arranged around the wafer slot; the method includes: in response to placing the wafer cassette into the wafer port of the machine tool, scanning the wafer located in the wafer slot through the infrared scanning device; determining the angle of the wafer positioning groove according to the scanned data.

[0019] Optionally, the infrared scanning device controls the scanning path of the infrared beam through a galvanometer or a rotating mirror, and scans the wafers in the wafer cassette one by one.

[0020] Optionally, the wafer cassette further has a moving component; in response to placing the wafer cassette into the wafer port of the machine tool, the method further includes one or more of the following: setting the infrared scanning device at the initial position through the moving component, and driving the infrared scanning device to move from the initial position to the end position; scanning the wafers located in the wafer slot in sequence during the movement through the infrared scanning device; controlling the infrared scanning device to return to the initial position through the moving component.

[0021] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0022] In the system for detecting the angle of the wafer positioning groove provided by the embodiments of the present invention, the wafer can be placed into the wafer slot through the side opening of the wafer cassette. A plurality of infrared scanning devices coupled to the inner wall of the wafer cassette can scan and transmit the edge surface information of the wafer. The processing module can generate a wafer edge image based on the edge surface information and analyze the information of the wafer positioning groove in the wafer edge image to determine the angle of the wafer positioning groove. Therefore, the timeliness and accuracy of obtaining the angle of the positioning groove of the wafer before entering the machine can be effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention in this specification, the following will briefly introduce the drawings required for the description of the embodiments of the present invention in this specification or the prior art. Obviously, the following described drawings are only some embodiments of this specification. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 Shows a cross-sectional schematic view of a wafer cassette for detecting the angle of a wafer positioning groove in an embodiment of the present invention;

[0025] Figure 2 Shows a cross-sectional schematic view of a wafer slot of a wafer cassette for detecting the angle of a wafer positioning groove in an embodiment of the present invention;

[0026] Figure 3 Shows a cross-sectional schematic view of a wafer slot of another wafer cassette for detecting the angle of a wafer positioning groove in an embodiment of the present invention;

[0027] Figure 4 Shows a schematic diagram of the signal conversion process of an infrared scanning device in an embodiment of the present invention;

[0028] Figure 5 Shows a schematic diagram of a moving component in an embodiment of the present invention;

[0029] Figure 6 Shows a schematic flow chart of a method for detecting the angle of a wafer positioning groove in an embodiment of the present invention;

[0030] Figure 7 Shows a schematic flow chart of another method for detecting the angle of a wafer positioning groove in an embodiment of the present invention.

[0031] DESCRIPTION OF THE REFERENCE NUMERALS:

[0032] Wafer W, wafer insertion direction F;

[0033] Wafer cassette 100, wafer slot 110, support plate 111, first positioning block 112, second positioning block 113;

[0034] Infrared scanning device 200, optical component 210, electronic component 220, wireless transmission component 230;

[0035] Moving component 300, guide rail 310, fixing part 320, drive motor 330, position sensor 340. Specific implementation manner

[0036] The technical solution of the present invention will be described in detail below in conjunction with specific embodiments and their accompanying drawings. The embodiments described herein are specific specific implementation manners of the present invention and are used to illustrate the concept of the present invention. These descriptions are all explanatory and exemplary and should not be construed as limiting the implementation manner of the present invention and the protection scope of the present invention. Except for the embodiments described herein, those skilled in the art can also adopt other obvious technical solutions based on the content disclosed in the claims and the specification of the present application. These technical solutions include technical solutions that make any obvious substitutions and modifications to the embodiments described herein.

[0037] It should be noted that the accompanying drawings in this embodiment are schematic diagrams to assist in illustrating the concept of the present invention, schematically showing the shapes of various parts and their mutual relationships. It should be understood that in order to clearly show the structures of the various components of the present invention, the accompanying drawings are not drawn in the same proportion, and the same reference numerals are used to represent the same parts in the accompanying drawings.

[0038] As described in the background art, in the semiconductor production process, the angle of the wafer positioning groove is generally measured only on specific machines, and some machines cannot obtain the information of the wafer positioning groove angle. When some wafers are defective, it is necessary to know the angle of the wafer before it enters the machine to facilitate analyzing which process and which machine the wafer is defective at. The current method can only deduce the angle of the positioning groove of the wafer before it enters the machine from front to back, which is time-consuming and laborious, and the accuracy is relatively low.

[0039] To solve the above technical problems, in a system for detecting the angle of a wafer positioning groove provided by an embodiment of the present invention, the wafer can be placed in a wafer slot that can be inserted from the side opening of the wafer cassette. A plurality of infrared scanning devices coupled to the inner wall of the wafer cassette can scan and transmit the edge surface information of the wafer. The processing module can generate a wafer edge image based on the edge surface information and analyze the information of the wafer positioning groove in the wafer edge image to determine the angle of the wafer positioning groove. Therefore, it can effectively improve the timeliness and accuracy of obtaining the angle of the positioning groove of the wafer before it enters the machine.

[0040] To make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be clearly and completely illustrated below in conjunction with the accompanying drawings.

[0041] See Figure 1 , Figure 1The cross-sectional schematic diagram of a wafer cassette for detecting the angle of a wafer positioning groove in an embodiment of the present invention is shown.

[0042] In this embodiment, the system for detecting the angle of a wafer positioning groove may include: a wafer cassette 100, a wafer slot 110, an infrared scanning device 200, and a processing module.

[0043] The wafer cassette 100 has a side opening for wafers to enter and exit the wafer cassette 100.

[0044] The wafer cassette 100 further has a wafer slot 110 for accommodating wafers.

[0045] A plurality of infrared scanning devices 200 are coupled to the inner wall of the wafer cassette 100. The infrared scanning device 200 is configured to scan the surface information of the wafer edge and transmit the scanned surface information of the wafer edge.

[0046] Among them, the scanned surface information of the wafer edge can be transmitted to the processing module. The processing module is configured to generate a wafer edge image based on the edge surface information, and analyze and calculate to determine the angle of the wafer positioning groove in response to the wafer positioning groove included in the wafer edge image.

[0047] It should be noted that the processing module is only a division of logical functions. In actual implementation, it can be fully or partially integrated into a physical entity, or physically separated. In addition, this module can be implemented in the form of a processor calling software.

[0048] In some embodiments, the processing module is integrated in the wafer cassette 100 and is coupled to the infrared scanning device 200, and is configured to process the information transmitted from the infrared scanning device 200 and transmit the processed information.

[0049] Specifically, the processing module can parse the angle of the wafer positioning groove from the surface information of the wafer edge scanned by the infrared scanning device 200 and transmit this information. The machine tool can receive the angle information of the wafer positioning groove and display it.

[0050] In some embodiments, the processing module is integrated in the machine tool. The processing module receives the data sent from the wafer cassette 100. The processing module can generate an image based on the data according to an algorithm model, display it, further analyze and calculate the angle information of the wafer positioning groove, and display it.

[0051] In some embodiments, the wafer cassette 100 further includes a wafer cassette cover, and the wafer cassette cover is fixed to the side opening of the wafer cassette 100 by a snap connection method.

[0052] Specifically, the shape and size of the wafer cassette cover are exactly adapted to the side opening of the wafer cassette 100 to ensure that the wafer cassette cover can tightly cover and close the side opening, prevent external contaminants from entering the interior of the wafer cassette 100, and at the same time avoid damage to the wafers due to vibration or collision during storage or transportation.

[0053] In addition, a handle may be provided on the outer surface of the wafer cassette cover to facilitate the user to quickly open or close the wafer cassette 100.

[0054] The material of the wafer cassette cover is preferably plastic or metal to ensure good mechanical strength and chemical stability, while meeting the cleanliness requirements of the semiconductor manufacturing environment.

[0055] In some embodiments, a clamping structure is provided at the edge of the wafer cassette cover, and the clamping structure cooperates with the corresponding clamping groove at the edge of the side opening of the wafer cassette 100, so as to realize the stable connection between the wafer cassette cover and the wafer cassette 100.

[0056] See Figure 2 , Figure 2 shows a cross-sectional schematic view of a wafer slot of a wafer cassette for detecting the angle of a wafer positioning groove in an embodiment of the present invention, wherein sub-figure a is a view perpendicular to the surface of the placed wafer, and sub-figure b is a side view parallel to one direction of the surface of the placed wafer.

[0057] In some embodiments, the number of the wafer slots 110 is at least two, and they are evenly distributed along the first inner wall group of the wafer cassette 100.

[0058] Specifically, the first inner wall group includes the opposite inner walls of the wafer cassette 100, but does not include the inner wall having the side opening 101.

[0059] In other words, the opposite inner walls are parallel and opposite to each other, and the wafer slots 110 are fixed on the opposite inner walls for accommodating and fixing a plurality of wafers W.

[0060] In a specific embodiment, the number of wafers accommodated is 25.

[0061] In addition, the width and depth of each wafer slot 110 are adapted to the thickness and diameter of the wafer W to maintain the stability of the wafer W during storage and transportation and avoid damage due to vibration or collision.

[0062] In some embodiments, the connection manner between the wafer slot 110 and the inner wall is a detachable connection, which can be adjusted according to the different sizes of the stored wafers.

[0063] Combined with reference to Figure 3, Another cross-sectional schematic diagram of a wafer slot of a wafer cassette for detecting the angle of a wafer positioning groove.

[0064] In some embodiments, the wafer slot 110 includes multiple layers of support plates 111 arranged in parallel, and a gap for accommodating the wafer W is formed between adjacent support plates 111.

[0065] Specifically, the thickness and spacing of each layer of support plate 111 are designed according to the thickness of the wafer W and the storage requirements to ensure that the wafer W remains stable during storage and transportation and is protected from damage due to vibration or collision.

[0066] In addition, the infrared scanning device 200 can scan the surface information of the wafer edge through the gap formed between the adjacent support plates 111 for accommodating the wafer W.

[0067] In some embodiments, an anti-slip structure is provided in the edge region of the support plate 111 to increase the friction between the wafer W and the support plate 111 and further prevent the wafer W from sliding or shifting.

[0068] In some embodiments, the wafer slot 110 further includes a first positioning block 112, and the first positioning block 112 is located in the central region of adjacent support plates 111 and is fixedly connected to the adjacent support plates 111.

[0069] Specifically, the size and shape of the first positioning block 112 are precisely designed to ensure that it can firmly support the support plates 111 and at the same time play a role in positioning the wafer W.

[0070] In other words, the distance between two opposite first positioning blocks 112 on the same plane is greater than or equal to the diameter of the wafer W, thereby providing sufficient operating space for inserting or removing the wafer W and ensuring that the wafer W can be positioned in the wafer slot 110 to prevent the wafer W from sliding or shifting. Figure 2 and Figure 3 In the figure, the direction F is the wafer insertion direction.

[0071] In addition, the wafer slot 110 further includes a second positioning block 113, and the second positioning block 113 is located between adjacent support plates 111 and is arranged away from the side opening. The second positioning block 113 is used to further fix the relative positions of the support plates 111 and prevent the support plates 111 from tilting or deforming due to external forces.

[0072] Specifically, the number and distribution positions of the second positioning blocks 113 can be adjusted according to the length of the support plates 111 and the weight of the wafer W.

[0073] For example, in one embodiment, two second positioning blocks 113 may be provided between each pair of adjacent support plates 111, respectively located at both ends of the support plate 111.

[0074] In another embodiment, multiple second positioning blocks 113 may be provided between each pair of adjacent support plates 111 to enhance the overall stability of the support plate 111.

[0075] In a specific embodiment, the first positioning blocks 112 and the second positioning blocks 113 on the opposite sides in the same plane can cooperate with each other, adapt to the size of the wafer, achieve the purpose of positioning the wafer W, and prevent the wafer W from sliding or shifting.

[0076] In some embodiments, the materials of the first positioning blocks 112 and the second positioning blocks 113 are preferably high-strength plastics or metals to ensure good mechanical strength and durability.

[0077] In addition, a buffer layer, such as silicone rubber, may be provided on the surfaces of the first positioning blocks 112 and the second positioning blocks 113 to reduce the direct contact between the wafer W and the positioning blocks, thereby reducing the risk of damage to the wafer W due to collision or friction.

[0078] In some embodiments, the multiple infrared scanning devices 200 are respectively coupled to one or more inner walls in the first inner wall group.

[0079] Specifically, the infrared scanning device 200 is fixed to the opposite inner wall, and each infrared scanning device 200 is arranged in the direction of the wafer slot 110 to scan the edge surface of the wafer W.

[0080] In addition, the installation position and quantity of the infrared scanning device 200 can be adjusted according to actual requirements.

[0081] In a specific embodiment, the number of the infrared scanning devices 200 is 4.

[0082] In some embodiments, the infrared scanning devices 200 are axially symmetrically arranged on the inner wall of the wafer cassette 100 and / or the intersection of the inner walls of the wafer cassette 100, and the infrared scanning devices 200 face the wafer storage area of the wafer cassette 100.

[0083] Specifically, in the case where the opening area of the side surface of the wafer cassette 100 is relatively large (for example, greater than or equal to 2 / 3 of the area of the side surface), the infrared scanning devices 200 can be provided only on two opposite side surfaces except the side surface where the side opening is located, and through the axially symmetric arrangement, the data processing complexity of the infrared scanning devices 200 can be reduced.

[0084] In some embodiments, the infrared scanning device 200 is uniformly disposed on the inner wall of the wafer cassette 100 and / or at the junction of the inner walls of the wafer cassette 100, and the infrared scanning device 200 faces the wafer storage area of the wafer cassette 100.

[0085] Among them, uniformly disposed can be used to indicate uniform distribution in the direction parallel to the bottom surface of the wafer cassette 100.

[0086] Specifically, in the case where the side opening area of the wafer cassette 100 is small (for example, less than 2 / 3 of the area of the side), the infrared scanning device 200 can be disposed on some or all sides, and by being uniformly disposed, while reducing the data processing complexity of the infrared scanning device 200, the coverage comprehensiveness of the infrared scanning device 200 can be further improved.

[0087] In some embodiments, one infrared scanning device 200 can be installed at each adjacent inner wall junction to achieve scanning of various angles of the wafer W.

[0088] In some other embodiments, one or more infrared scanning devices 200 can be installed on each opposite inner wall to improve the scanning accuracy and coverage.

[0089] In some embodiments, the infrared scanning device 200 can also be equipped with a position adjustment mechanism for finely adjusting its installation position and angle to adapt to wafers W of different sizes or types.

[0090] See Figure 4 , Figure 4 shows a schematic diagram of the signal conversion process of an infrared scanning device in an embodiment of the present invention.

[0091] In some embodiments, the infrared scanning device 200 includes an optical component 210, an electronic component 220, and a wireless transmission component 230, and the components cooperate to achieve high-precision scanning and data transmission of the wafer W.

[0092] In some embodiments, the optical component 210 is used to emit and receive infrared signals and convert the received optical signals into electrical signals.

[0093] Specifically, the optical component 210 includes an infrared emission part and an infrared reception part. The infrared emission part is an infrared light source, preferably an infrared laser or an infrared light-emitting diode (LED), for emitting an infrared light beam with a specific wavelength. The wavelength range of the infrared light beam is generally from 0.75 μm to 15 μm to adapt to the detection requirements of different materials.

[0094] In some embodiments, the infrared emission part may further include a beam shaping element for adjusting the shape and intensity distribution of the infrared beam to ensure that the beam uniformly irradiates the edge surface of the wafer W.

[0095] In some embodiments, the infrared reception part is an infrared detector, preferably a thermopile, a pyroelectric detector or an infrared focal plane array (FPA), for receiving the infrared light signal reflected or transmitted from the surface of the wafer W. The infrared reception part converts the received infrared light signal into an electrical signal and transmits the electrical signal to the electronic component 220 through a signal line.

[0096] In addition, the infrared reception part may further include a filter for filtering out the interfering light of non-target wavelengths and improving the signal-to-noise ratio of the signal.

[0097] In some embodiments, the optical component 210 further includes a galvanometer or a rotating mirror. The galvanometer or the rotating mirror is used to control the scanning path of the infrared beam.

[0098] Specifically, the galvanometer changes the direction of the infrared beam by swinging the reflecting lens, thereby achieving high-speed and precise scanning. The rotating mirror covers a larger scanning range by rotating the reflecting lens.

[0099] In some embodiments, the driving device of the galvanometer or the rotating mirror is preferably a stepper motor or a servo motor to ensure precise control of the scanning path.

[0100] In some embodiments, the electronic component 220 is used to convert the electrical signal into a digital signal. Specifically, the electronic component 220 includes a signal amplifier and an analog-to-digital converter.

[0101] In some embodiments, the signal amplifier is a preamplifier for amplifying the electrical signal output by the infrared reception part. The preamplifier is preferably a transimpedance amplifier (TIA) or a low-noise operational amplifier (Op-Amp), and its design goal is to minimize the introduction of noise while amplifying the signal to improve the signal-to-noise ratio (SNR) of the signal. The gain and bandwidth of the preamplifier can be adjusted according to actual needs to ensure that it can adapt to input signals of different intensities.

[0102] In some embodiments, the electronic component 220 further includes a filter.

[0103] Specifically, the filter is used to filter out the noise and interference in the signal. The filter is preferably a low-pass filter or a band-pass filter, and the specific selection depends on the characteristics of the signal and the frequency range of the noise. For example, a low-pass filter can be used to filter out high-frequency noise, while a band-pass filter can be used to retain the signal within the target frequency range.

[0104] In some implementations, the filter may be integrated into the preamplifier to simplify circuit design and improve signal processing efficiency.

[0105] In addition, the filter may further include adjustable parameters (such as cutoff frequency) so as to be dynamically adjusted according to actual application requirements.

[0106] In some embodiments, the analog-to-digital converter is used to convert the analog signal processed by the filter or the signal amplifier into a digital signal.

[0107] In a specific embodiment, the resolution of the analog-to-digital converter is preferably 12 bits to 24 bits to meet different accuracy requirements.

[0108] In some embodiments, the analog-to-digital converter may further include a sample-and-hold circuit for maintaining signal stability during the conversion process.

[0109] In some embodiments, the wireless transmission component 230 is coupled to the electronic component 220 to transmit the processed digital signal to an external device.

[0110] In some embodiments, the wireless transmission component 230 includes a signal transmitter coupled to the wafer pod 100 for transmitting digital signals.

[0111] In some embodiments, the signal transmitter is preferably a Wi-Fi module, a Bluetooth module or a ZigBee module, which is used to achieve high-speed and stable transmission of digital signals.

[0112] In some embodiments, the signal transmitter may further include an antenna to enhance the transmission distance and stability of the wireless signal.

[0113] In some embodiments, the wireless transmission component 230 includes a first signal receiver coupled to a machine (not shown) for receiving the digital signal transmitted by the signal transmitter. The first signal receiver is preferably a wireless communication module that matches the signal transmitter to ensure efficient signal reception and decoding.

[0114] Furthermore, the processing module may be disposed on the machine to help the machine obtain the positioning groove angles of a plurality of wafers for subsequent analysis from the perspective of the machine.

[0115] In some embodiments, the wireless transmission component 230 includes a second signal receiver coupled to the wafer pod 100 for receiving the digital signal transmitted by the signal transmitter. The second signal receiver is preferably a wireless communication module that matches the signal transmitter to ensure efficient signal reception and decoding.

[0116] Further, the processing module may be disposed in the wafer cassette 100, which helps the wafer cassette 100 obtain the positioning slot angles of the wafers entering multiple machines for subsequent analysis from the wafer angles.

[0117] In an embodiment of the present invention, the method for the processing module to determine the angle of the wafer positioning slot may include: taking the radius of the circle on the wafer surface that faces or is perpendicular to the side opening of the wafer cassette 100 as the zero-degree line, and taking the radius where the center of the wafer positioning slot range is located as the auxiliary line to calculate the orientation of the wafer positioning slot.

[0118] In addition, the wireless transmission component 230 may further include a data encryption unit for encrypting the transmitted digital signals to ensure the security and privacy of the data.

[0119] In some embodiments, the infrared scanning device 200 further includes a power management unit for providing stable power to the optical component 210, the electronic component 220, and the wireless transmission component 230.

[0120] The power management unit preferably includes a low dropout linear regulator (LDO) and a battery management circuit to ensure the stability and reliability of the device during long-term operation.

[0121] See Figure 5 , Figure 5 which shows a schematic diagram of a moving component in an embodiment of the present invention.

[0122] In some embodiments, the system for detecting the wafer positioning slot angle further includes a plurality of moving components 300. A plurality of groups of moving components 300 are provided in the wafer cassette 100 for achieving precise positioning and movement of the infrared scanning device 200 in the wafer cassette 100. The moving component includes: a guide rail 310, a fixing member 320, a driving motor 330, a position sensor 340, and a control unit.

[0123] Specifically, the guide rail 310 is installed on opposite sides and / or inner walls of the wafer cassette 100 and is arranged in a direction perpendicular to the surface of the wafer W in the wafer cassette 100. The length of the guide rail 310 is adapted to the length of the wafer slot 110, so that the infrared scanning device 200 can scan the edge surfaces of each wafer W.

[0124] In some embodiments, the guide rail 310 preferably adopts a high-strength aluminum alloy or stainless steel material, which has high rigidity and wear resistance to ensure accuracy during long-term use.

[0125] In addition, the surface of the guide rail 310 can be coated with a lubricating coating to reduce the frictional resistance when the fixing member 320 moves.

[0126] In some embodiments, the fixing member 320 is disposed on the guide rail 310 for fixing the infrared scanning device 200. The fixing member 320 is preferably a slider or a moving platform, and a chute matching with the guide rail 310 is provided at the bottom thereof to ensure smooth movement.

[0127] In some embodiments, an installation bracket is provided on the upper portion of the fixing member 320 for fixing the infrared scanning device 200 and making the optical component 210 of the infrared scanning device 200 face the edge surface of the wafer W. The installation bracket can adjust the angle and height to adapt to wafers W of different sizes and types.

[0128] In some embodiments, a stopper can also be provided on the guide rail 310 for limiting the moving range of the fixing member 320 to prevent overtravel.

[0129] In some embodiments, the driving motor 330 is used to drive the fixing member 320 to move along the guide rail 310.

[0130] Specifically, the driving motor 330 is preferably a stepping motor or a servo motor, which has high precision and high response speed and can achieve precise control of the infrared scanning device 200.

[0131] In some embodiments, the driving motor 330 is connected to the fixing member 320 through a coupling to convert the rotational motion into a linear motion.

[0132] In addition, the driving motor 330 can also be equipped with a reducer to increase the torque and the motion smoothness.

[0133] In some embodiments, the position sensor 340 is used to monitor the position of the infrared scanning device 200 on the guide rail 310.

[0134] In some embodiments, the position sensor 340 is preferably an optical encoder or a Hall sensor, and is installed at both ends of the guide rail 310 or on the driving motor 330.

[0135] In some embodiments, the position sensor 340 detects the position of the fixing member 320 in real time and feeds back the position information to a control unit (not shown).

[0136] In some embodiments, the control unit is coupled to the position sensor 340 and the driving motor 330, and is used to control the motion of the driving motor 330 according to the position information transmitted back by each of the position sensors 340. <>

[0137] Specifically, the control unit is preferably a microcontroller (MCU) or a programmable logic controller (PLC), with built-in control algorithms, capable of adjusting the positions of the respective infrared scanning devices 200 in real time to ensure that their relative positions on their respective guide rails 310 are highly consistent.

[0138] It should be particularly noted that when the processing module is integrated into the wafer cassette 100, the control unit is integrated with the processing module.

[0139] It can be understood that the above describes multiple embodiment solutions provided in this embodiment. The various alternative ways described in each embodiment solution can be combined and cross-referenced with each other without conflict, thereby extending multiple possible embodiment solutions, all of which can be considered as the embodiment solutions disclosed and made public in the present invention.

[0140] This embodiment also provides a method for detecting the angle of the wafer positioning groove corresponding to the above system for detecting the angle of the wafer positioning groove.

[0141] It should be pointed out that the content described below for the method of detecting the angle of the wafer positioning groove can be correspondingly referred to the content of the system for detecting the angle of the wafer positioning groove described above.

[0142] See Figure 6 , Figure 6 which shows a schematic flowchart of a method for detecting the angle of a wafer positioning groove in an embodiment of the present invention. The system for detecting the angle of the wafer positioning groove at least has a wafer cassette for detecting the angle of the wafer positioning groove. The wafer cassette has a wafer slot and a plurality of infrared scanning devices arranged around the wafer slot. The method can perform the following steps S10 to S12, and the following explains each step.

[0143] In step S10, the wafer cassette is placed in the wafer port of the machine tool.

[0144] Specifically, the wafer cassette is pushed into the receiving groove along the guiding device of the wafer port of the machine tool until the wafer cassette is in full contact with the positioning device of the wafer port, so that the wafer cassette 100 remains stable during the operation of the machine tool.

[0145] In some embodiments, the wafer cassette and the wafer port can communicate with each other.

[0146] After the wafer cassette is placed in the wafer port, the wafer cassette can obtain the signal that the wafer cassette is placed in the wafer port.

[0147] The wafer port can obtain information such as the temperature and humidity inside the wafer cassette.

[0148] In step S11, the infrared scanning device scans the wafers located in the wafer slots.

[0149] Specifically, the optical component of the infrared scanning device emits an infrared light beam that irradiates the edge surface of the wafer W. The infrared receiving part receives the infrared light signal reflected or transmitted from the surface of the wafer W and converts it into an electrical signal. The electronic component converts the electrical signal into a digital signal and performs processes such as denoising, enhancement, and feature extraction. The infrared scanning device controls the scanning path of the infrared light beam through a galvanometer or a rotating mirror.

[0150] In some embodiments, the galvanometer changes the direction of the infrared light beam by quickly swinging the reflecting mirror, thereby achieving high-speed and precise scanning.

[0151] In some embodiments, the rotating mirror covers a larger scanning range by rotating the reflecting mirror.

[0152] In step S12, the angle of the wafer positioning slot is determined according to the scanned data.

[0153] In some embodiments, the scanned data (such as the digital signal obtained in S11) can be transmitted to determine the angle of the wafer positioning slot.

[0154] Further, the step of determining the angle of the wafer positioning slot may include: taking the circle on the wafer surface and the radius facing or perpendicular to the side opening of the wafer cassette as the zero-degree line, and taking the radius where the center of the wafer positioning slot range is located as the auxiliary line to calculate the orientation of the wafer positioning slot.

[0155] Even further, a processing module provided on the machine and / or the wafer cassette can be used to determine the angle of the wafer positioning slot.

[0156] Specifically, the wireless transmission component transmits the processed digital signal to an external device.

[0157] In some embodiments, the infrared scanning device scans the wafers in the wafer cassette one by one, and transmits the information of each scanned wafer.

[0158] See Figure 7 , Figure 7 shows a schematic flowchart of another method for detecting the angle of a wafer positioning slot in an embodiment of the present invention. The following steps S20 to S24 can be executed, and each step will be described below.

[0159] As Figure 7 The method for detecting the angle of a wafer positioning slot, and the corresponding system for detecting the angle of a wafer positioning slot has multiple sets of moving components.

[0160] In step S20, the wafer cassette is placed in the wafer port of the machine tool.

[0161] It should be noted that the wafer cassette can be manually placed in the wafer port of the machine tool, or the wafer cassette can be placed in the wafer port of the machine tool by an automatic overhead crane.

[0162] In step S21, the infrared scanning device is set at the initial position by the moving component, and the infrared scanning device is driven to move from the initial position to the end position.

[0163] Specifically, after the wafer cassette receives the information that the wafer cassette is placed in the wafer port of the machine tool, the driving motor in the moving component controls the guide rail to move the positioning block fixed with the infrared scanning device to a preset initial position. The initial position is the position where the surface information of the outermost wafer can be detected.

[0164] In step S22, the wafers located in the wafer slots are sequentially scanned by the infrared scanning device during the movement.

[0165] Specifically, the driving motor in the moving component drives the infrared scanning device by controlling the position of the positioning block on the guide rail. The infrared scanning device starts scanning the wafers from the initial position and sequentially scans all the wafers.

[0166] In some embodiments, the wafer cassette has a storage unit, and the wafers can be scanned and then transferred after all the wafers are scanned.

[0167] In step S23, the angle of the wafer positioning slot is determined according to the scanned data.

[0168] Specifically, the scanned data will be transmitted to the processing module, and the angle of the wafer positioning slot is determined according to the scanned data.

[0169] In some embodiments, the processing module is integrated in the wafer cassette. The processing module will analyze and process the scanned data, and finally transmit the processed data to the data receiving end through the wireless transmission component.

[0170] In other embodiments, the scanned data will be directly transmitted to the data receiving end through the wireless transmission component.

[0171] In step S24, the infrared scanning device is controlled by the moving component to return to the initial position.

[0172] Controlling the infrared scanning device to return to the initial position can effectively save the time for the next scan.

[0173] It should be noted that the control unit can control a plurality of the moving components to drive the positioning blocks during the operation of each moving component, so as to adjust the positions of the respective infrared scanning devices, making their relative position heights on their respective guide rails consistent. The purpose is to enable each infrared scanning device to scan the same wafer simultaneously. After scanning the edge surface information of the wafer, it then scans the next wafer.

[0174] It can be understood that the above text describes multiple embodiment solutions of the method for detecting the angle of the wafer positioning groove. The various optional ways introduced in each embodiment solution can be combined with each other and cross-referenced without conflict, thus extending multiple possible embodiment solutions, all of which can be considered as the embodiment solutions disclosed and made public by the present invention.

[0175] The above embodiments can be implemented in whole or in part by software, hardware, firmware, or any other combination. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the processes or functions described in the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer program can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer program can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center in a wired or wireless manner.

[0176] It should be understood that the term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article indicates that the associated objects before and after are in an "or" relationship.

[0177] The term "a plurality of" that appears in the embodiments of the present application refers to two or more.

[0178] The descriptions such as first and second that appear in the embodiments of the present application are only for schematic and distinguishing the described objects, without an order, nor do they represent a special limitation on the number of devices in the embodiments of the present application, and cannot constitute any limitation to the embodiments of the present application.

[0179] It should be noted that the sequence numbers of the steps in this embodiment do not represent the limitation of the execution sequence of each step.

[0180] Although the embodiments of the present invention are disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A system for detecting the angle of a wafer positioning groove, characterized in that, Comprising: A wafer cassette, the side of the wafer cassette having a side opening for wafers to enter and exit; Wafer slots, located within the wafer cassette for accommodating wafers; A plurality of infrared scanning devices, coupled to the inner wall of the wafer cassette to scan and transmit information on the edge surface of the wafer; A processing module, configured to generate a wafer edge image based on the edge surface information, and determine the angle of the wafer positioning groove in response to the wafer positioning groove included in the wafer edge image.

2. The system for detecting the angle of the positioning groove of the wafer according to claim 1, wherein The number of the wafer slots is at least two, and they are connected to a first inner wall group of the wafer cassette, the first inner wall group including opposite inner walls of the wafer cassette and not including the inner wall having the side opening; The plurality of infrared scanning devices are respectively coupled to one or more inner walls in the first inner wall group.

3. The system for detecting the angle of the wafer positioning groove according to claim 2, wherein The wafer slot includes: Multiple layers of support plates, with wafers accommodated between adjacent support plates; A first positioning block, adjacent support plates being connected by the first positioning block and located in the central region of the support plates; Wherein, the distance between two opposite first positioning blocks on the same plane is greater than the diameter of the wafer.

4. The system for detecting the angle of the wafer positioning groove according to claim 3, wherein The wafer slot further includes: A second positioning block, located between adjacent support plates and away from the side opening.

5. The system for detecting the angle of the wafer positioning groove according to claim 1, wherein, The wafer cassette further has a wafer cassette cover, the wafer cassette cover being snap-fitted to the side opening of the wafer cassette, and the shape and size of the wafer cassette cover being adapted to the side opening of the wafer cassette for closing the wafer cassette.

6. The system for detecting the angle of the wafer positioning groove according to claim 1, wherein The infrared scanning device includes: An optical component, configured to emit and receive infrared signals, and convert the received optical signal from the wafer into an electrical signal; An electronic component, configured to convert the electrical signal into a digital signal; A wireless transmission component, coupled to the electronic component for transmitting the digital signal.

7. The system for detecting the angle of the wafer positioning groove according to claim 6, wherein The optical component includes: an infrared emission part and an infrared reception part; The infrared emission part is an infrared light source for emitting an infrared light beam onto the scanning object; The infrared reception part is an infrared detector for receiving the infrared optical signal reflected back by the wafer and converting the optical signal into an electrical signal.

8. The system for detecting the angle of the wafer positioning groove according to claim 6, characterized in that, The electronic component includes: A signal amplifier for amplifying the electrical signal converted by the infrared detector; An analog-to-digital converter for converting the analog signal amplified by the signal amplifier into a digital signal.

9. The system for detecting the angle of the wafer positioning groove according to claim 6, wherein The wireless transmission component includes one or more of the following: A signal transmitter, coupled to the wafer cassette for transmitting digital signals; A first signal receiver, coupled to the machine platform for receiving the digital signals, wherein the processing module is provided on the machine platform; A second signal receiver, coupled to the wafer cassette for receiving the digital signals, wherein the processing module is provided in the wafer cassette.

10. The system for detecting the angle of the wafer positioning groove according to claim 6, wherein The optical component further includes: a galvanometer mirror or a rotating mirror for controlling the scanning path of the infrared light beam.

11. The system for detecting the angle of the wafer positioning groove according to claim 1, wherein, The number of the infrared scanning devices is 4, and they are evenly arranged on the inner wall of the wafer cassette and / or the intersection of the inner walls of the wafer cassette, and the infrared scanning devices are oriented towards the wafer storage area of the wafer cassette.

12. The system for detecting the angle of the wafer positioning groove according to claim 1, wherein Also including a plurality of moving components; A guide rail installed on opposite two sides inside the wafer cassette and / or the inner wall of the wafer cassette, arranged in a direction perpendicular to the surface of the wafer in the wafer cassette, and the length of the guide rail is adapted to the length of the wafer slot; A fixing member is arranged on the guide rail for fixing the infrared scanning device, and the infrared scanning device faces the wafer; A driving motor is used to drive the fixing member to move along the guide rail; A position sensor is used to monitor the position of the infrared scanning device on the guide rail; A control unit is respectively coupled to the position sensor and the driving motor, and is used to control the driving motor according to the position information transmitted back by each position sensor, so that the relative position heights of the infrared scanning devices on the guide rail are the same.

13. The system for detecting the angle of the wafer positioning groove according to claim 1, wherein The processing module calculates the orientation of the wafer positioning groove with the circle on the wafer surface and the radius facing or perpendicular to the side opening of the wafer cassette as the zero-degree line, and the radius where the center of the wafer positioning groove range is located as the auxiliary line.

14. A method for detecting the angle of a wafer positioning groove, characterized in that, A wafer cassette for detecting the angle of the wafer positioning groove, the wafer cassette having a wafer slot and a plurality of infrared scanning devices arranged around the wafer slot; The method includes: In response to placing the wafer cassette into the wafer port of the machine tool, scanning the wafer located in the wafer slot through the infrared scanning device; Determining the angle of the wafer positioning groove according to the scanned data.

15. The method for detecting the angle of the wafer positioning groove according to claim 14, wherein, The infrared scanning device controls the scanning path of the infrared beam through a galvanometer or a rotating mirror, and scans the wafers in the wafer cassette one by one.

16. The method for detecting the angle of the wafer positioning groove according to claim 14, wherein The wafer cassette further has a moving component; In response to placing the wafer cassette into the wafer port of the machine tool, the method further includes one or more of the following: Setting the infrared scanning device at an initial position through the moving component, and driving the infrared scanning device to move from the initial position to an end position; Scanning the wafers located in the wafer slot in sequence during the movement through the infrared scanning device; Controlling the infrared scanning device to return to the initial position through the moving component.

Images