A filter patch antenna based on three-dimensional packaging integration

Abstract

The present invention provides a filter patch antenna based on three-dimensional packaging integration. Its main materials include a five-layer dielectric substrate, a four-layer adhesive plate, and an overall circuit structure, which includes a signal transmission metal post, a coupled stripline, a quarter-wavelength stripline resonator, an open-circuit stripline branch, a feed stripline, a microstrip patch, a grounding metal post, and a ground plane. The novel filter antenna proposed in this invention features high integration, miniaturization, high selectivity, a wide stopband, and packaging characteristics, making it well-suited for wireless communication systems.

Description

Technical Field

[0001] The present invention relates to the technical field of wireless mobile communications, and in particular to a filtering patch antenna based on three-dimensional packaging integration. Background Art

[0002] With the rapid development of wireless communication technology, RF front-end systems are moving towards high performance, high integration, and miniaturization. Traditionally, filter antennas designed based on cascade or feature introduction often suffer from problems such as low compactness and insufficient out-of-band suppression. This invention studies and designs a filter patch antenna based on three-dimensional packaging integration. It has high integration, miniaturization, high selectivity, wide stopband characteristics, and packaging characteristics, which are consistent with actual engineering needs and have important theoretical and practical significance.

[0003] Compared with the prior art, the differences are as follows:

[0004] 1. China's published application CN118610767A discloses a broadband millimeter-wave magnetoelectric dipole antenna with out-of-band suppression filtering characteristics. This antenna overcomes the high loss and narrow bandwidth issues of existing technologies and is primarily targeted at millimeter-wave mobile communications. (The antenna operates in the 22.9GHz-42.6GHz frequency band and is designed for 5G mobile short-range communications.)

[0005] To overcome the challenges of existing filter antenna designs, such as low compactness and insufficient out-of-band suppression, this application discloses a filter patch antenna based on three-dimensional package integration. This antenna balances compactness, frequency selectivity, and out-of-band suppression. Its packaged structure not only ensures low loss but is also well-suited for high-density integration applications, including radar and satellite communication systems. The antenna described in this application operates in the X-band (9.75 GHz-11.09 GHz) and is primarily designed for satellite communication scenarios.

[0006] There are essential differences between the two in application scenarios and usage backgrounds.

[0007] 2. Chinese published application CN118610767A discloses a broadband millimeter-wave magnetoelectric dipole antenna with out-of-band suppression filtering characteristics. The design of the filter antenna is based on the principle of characteristic introduction. Filter ring grooves etched within the main radiating patch alter the distribution of high-order mode currents in the high-frequency band, introducing reverse currents in specific frequency bands to achieve current reversal and gain suppression filtering. Slot coupling is used for feeding. Electromagnetic energy is input through the feed port, passes through the substrate's integrated coaxial line and back cavity, and is coupled to the main radiating patch through slots etched in the second metal plate, achieving radiation. The antenna is relatively thick, measuring 0.28 times the wavelength. Both low- and high-frequency gain suppression levels are approximately -24 dB. The antenna has a radiation null at both the low- and high-frequency gains. The antenna's -10 dB out-of-band suppression is 1.53 fo (fo is the center frequency).

[0008] This application discloses a three-dimensional packaged integrated filtering patch antenna designed based on filter integration. Leveraging the antenna's inherent structural characteristics, the filtering circuit is cleverly embedded without increasing the antenna's size. Furthermore, the filter circuit design method based on a folded multimode resonator achieves excellent filtering characteristics. The antenna utilizes a non-contact folded L-shaped stripline feed method. Electromagnetic energy is input through a bottom feed port, passes through a folded multimode filter unit, and then couples energy to the patch through the folded L-shaped stripline, achieving radiation. The antenna has a low thickness of 0.17λg (0.107 times the wavelength). The antenna's low-frequency and high-frequency gain suppression levels are 28.6dB and 40dB, respectively. The antenna has three radiation nulls for both low-frequency and high-frequency gains. The antenna's -20dB out-of-band suppression is 1.8f0 (f0 is the center frequency).

[0009] There are essential differences between the two in terms of technical solutions, implementation paths, physical structures and beneficial effects. Summary of the Invention

[0010] To address these issues, the present invention proposes a filter patch antenna based on three-dimensional packaged integration. This design incorporates innovations in design concept, antenna structure, and filter structure. Leveraging the antenna's inherent structural characteristics, the filter circuit is cleverly embedded without increasing the antenna's size. Furthermore, the invention innovatively proposes an antenna feeding scheme based on a folded L-shaped stripline and a filter circuit design method based on a folded multimode resonator. Furthermore, the design utilizes a multilayer PCB process to achieve vertical integration in three dimensions. This design balances compactness, frequency selectivity, and out-of-band suppression. Its packaged structure ensures low loss and is well-suited for high-density integration applications, making it well-suited for radar and satellite communication systems.

[0011] A filtering patch antenna based on three-dimensional packaging integration includes five dielectric substrates and four bonding plates. The five dielectric substrates and four bonding plates are arranged in order from bottom to top: a first dielectric substrate, a first bonding plate, a second dielectric substrate, a second bonding plate, a third dielectric substrate, a third bonding plate, a fourth dielectric substrate, a fourth bonding plate, and a fifth dielectric substrate. The five dielectric substrates and four bonding plates are vertically integrated in three dimensions, forming the main structure of the antenna in a centrally stacked arrangement of at least two layers.

[0012] The overall circuit structure is distributed within the main structure of the antenna, including a first ground plate, a second ground plate, a first signal transmission metal column, a second signal transmission metal column, a third signal transmission metal column, a fourth signal transmission metal column, a first coupled stripline, a first quarter-wavelength stripline resonator, an open stripline branch, a second coupled stripline, a second quarter-wavelength stripline resonator, a first feed stripline, a second feed stripline, a microstrip patch, a first metal disk, a second metal disk, a third metal disk, a fourth metal disk, a fifth metal disk, a grounded metal column, and a coaxial feed terminal;

[0013] The first ground plane is located immediately below the first dielectric substrate; the first coupled stripline, the first quarter-wavelength stripline resonator, and the open stripline branch are located immediately above the first dielectric substrate; the second coupled stripline and the second quarter-wavelength stripline resonator are located immediately above the first bonding plate; the second ground plane is located immediately above the second dielectric substrate; the first feed stripline is located immediately above the third dielectric substrate; the second feed stripline is located immediately above the fourth dielectric substrate; and the microstrip patch is located immediately above the fifth dielectric substrate.

[0014] The grounding metal pillars are distributed in a rectangular shape, but two metal pillars are missing in the portion directly below the first feeding stripline; the grounding metal pillars penetrate the first dielectric substrate, the first bonding plate, and the second dielectric substrate, connecting the first ground plate and the second ground plate, while confining the first coupled stripline, the first quarter-wavelength stripline resonator, the open stripline branch, the second coupled stripline, and the second quarter-wavelength stripline resonator within the range of the grounding metal pillars;

[0015] The first signal transmission metal pillar passes through the first dielectric substrate, and its two ends are respectively connected to the coaxial feeding terminal and the first metal disc; the second signal transmission metal pillar passes through the first bonding plate, and its two ends are respectively connected to the second metal disc and the third metal disc; the third signal transmission metal pillar passes through the second dielectric substrate, the second bonding plate, and the third dielectric substrate, and its two ends are respectively connected to the fourth metal disc and the first feeding stripline; the fourth signal transmission metal pillar passes through the third bonding plate and the fourth dielectric substrate, and its two ends are respectively connected to the first feeding stripline and the fifth metal disc.

[0016] As a further improvement of the present invention, the first coupling strip lines are arranged in an n-shape, and the ends of the first coupling strip lines are connected to the first metal disk.

[0017] As a further improvement of the present invention, the first quarter-wavelength stripline resonator is located on the right side of the first coupled stripline, and signals are transmitted between the two through coupling. The first quarter-wavelength stripline resonator is composed of two sections, which are connected along the central axis. The end of the first quarter-wavelength stripline resonator is connected to the second metal disk. The open stripline branch is L-shaped, located on the left side of the first quarter-wavelength stripline resonator, and is connected to it via the second metal disk.

[0018] As a further improvement of the present invention, the second quarter-wavelength stripline resonator is located directly above the first quarter-wavelength stripline resonator, has the same shape and size as the latter, and realizes inter-layer transmission of signals through the third metal disk and the second signal transmission metal column and the first quarter-wavelength stripline resonator.

[0019] As a further improvement of the present invention, the second coupling stripline is located directly above the first coupling stripline, has the same shape and size as the latter, and is located to the left of the second quarter-wavelength stripline resonator, and signals are transmitted between the two through coupling.

[0020] As a further improvement of the present invention, the first feeding stripline is connected to the second coupling stripline via a third signal transmission metal column and a fourth metal disk. The first feeding stripline is placed perpendicular to the latter via the third signal transmission metal column, and both ends are rounded.

[0021] As a further improvement of the present invention, the second feeding stripline is connected to the first feeding stripline via a fifth metal disk and a fourth signal transmission metal column, and the other end of the second feeding stripline opposite to the fifth metal disk is rounded.

[0022] As a further improvement of the present invention, the microstrip patch is arranged at the exact center of the fifth dielectric substrate and has no contact with the rest of the circuits.

[0023] As a further improvement of the present invention, the thickness of the first dielectric substrate and the second dielectric substrate is 0.254 mm, the thickness of the third dielectric substrate and the fourth dielectric substrate is 0.508 mm, and the thickness of the fifth dielectric substrate is 0.76 mm. The dielectric constants of the above dielectric substrates are all 3.0.

[0024] As a further improvement of the present invention, the thickness of the first bonding plate is 0.306 mm, the thickness of the second bonding plate, the third bonding plate, and the fourth bonding plate is 0.102 mm, and the dielectric constants of the above bonding plates are all 3.0.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] (1) The present invention provides a filter patch antenna design based on three-dimensional packaging integration, which achieves multifunctionality and miniaturization. It has both the good radiation performance of a linearly polarized antenna and the filtering performance of the filter element itself. It uses one device instead of the cascade of multiple devices, avoiding the problem of large insertion loss and achieving multifunctional integration. It also has the advantage of compact size.

[0027] (2) The present invention utilizes a novel filter circuit design method based on a folded multimode resonator. By introducing cross-coupling between the source load and the resonant unit, the filter achieves multiple zeros and a high roll-off characteristic in both the upper and lower stopbands, with excellent out-of-band suppression. Consequently, the filter antenna achieves excellent frequency selectivity and out-of-band suppression capabilities.

[0028] (3) The present invention is based on the antenna feeding method of the folded L-shaped strip line. The antenna has a wide bandwidth characteristic, and a radiation zero point is introduced in the lower stop band, which further increases the suppression capability of the lower stop band;

[0029] (4) The present invention embeds a metal shielding cavity inside the antenna, which not only ensures low loss but also makes the antenna very suitable for high-density integrated self-packaging application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the three-dimensional structure of a filtering patch antenna based on three-dimensional packaging integration of the present invention;

[0031] Figure 2 This is a schematic diagram of the plane size of a filter patch antenna based on three-dimensional packaging integration of the present invention. Figure 1 (including microstrip patch and fifth dielectric substrate);

[0032] Figure 3 This is a schematic diagram of the plane size of a filter patch antenna based on three-dimensional packaging integration of the present invention. Figure 2 (including a second feeding stripline and a fourth dielectric substrate);

[0033] Figure 4 This is a schematic diagram of the plane size of a filter patch antenna based on three-dimensional packaging integration of the present invention. Figure 3 (comprising a first feeding stripline and a third dielectric substrate);

[0034] Figure 5 This is a schematic diagram of the plane size of a filter patch antenna based on three-dimensional packaging integration of the present invention. Figure 4 (including a second ground plate and a second dielectric substrate);

[0035] Figure 6This is a schematic diagram of the plane size of a filter patch antenna based on three-dimensional packaging integration of the present invention. Figure 5 (including the first dielectric substrate and its upper circuit);

[0036] Figure 7 The present invention provides an S-parameter and gain curve of a filtering patch antenna based on three-dimensional packaging integration;

[0037] Figure 8 The radiation pattern of a filter patch antenna based on three-dimensional packaging integration of the present invention;

[0038] Figure 8 (a) is the E-plane radiation pattern of the filter patch antenna based on three-dimensional packaging integration;

[0039] Figure 8 (b) is the H-plane radiation pattern of the filter patch antenna based on three-dimensional packaging integration;

[0040] In the figure, 100, a first dielectric substrate; 200, a first bonding plate; 300, a second dielectric substrate; 400, a second bonding plate; 500, a third dielectric substrate; 600, a third bonding plate; 700, a fourth dielectric substrate; 800, a fourth bonding plate; 900, a fifth dielectric substrate; 101, a first ground plate; 102, a second ground plate; 103, a first signal transmission metal pillar; 104, a second signal transmission metal pillar; 105, a third signal transmission metal pillar; 106, a fourth signal transmission metal pillar; 107, First coupled stripline; 108, first quarter-wavelength stripline resonator; 109, open stripline branch; 110, second coupled stripline; 111, second quarter-wavelength stripline resonator; 112, first fed stripline; 113, second fed stripline; 114, microstrip patch; 115, first metal disk; 116, second metal disk; 117, third metal disk; 118, fourth metal disk; 119, fifth metal disk; 120, grounded metal column; 121, coaxial feed terminal. DETAILED DESCRIPTION

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings.

[0042] like Figure 1As shown, the present invention proposes a filtering patch antenna based on three-dimensional packaging integration. The antenna comprises five dielectric substrates and four bonding plates. From bottom to top, the five dielectric substrates can be described as a first dielectric substrate 100, a first bonding plate 200, a second dielectric substrate 300, a second bonding plate 400, a third dielectric substrate 500, a third bonding plate 600, a fourth dielectric substrate 700, a fourth bonding plate 800, and a fifth dielectric substrate 900. The five dielectric substrates and four bonding plates are vertically integrated in three dimensions, forming the main structure of the antenna in a multi-layer, center-stacked arrangement.

[0043] Furthermore, the overall circuit structure is distributed within the main structure of the antenna; the first ground plane 101 is located immediately below the first dielectric substrate 100; the first coupled stripline 107, the first quarter-wavelength stripline resonator 108, and the open stripline branch 109 are located immediately above the first dielectric substrate 100; the second coupled stripline 110 and the second quarter-wavelength stripline resonator 111 are located immediately above the first bonding plate 200; the second ground plane 102 is located immediately above the second dielectric substrate 300; the first feeding stripline 112 is located immediately above the third dielectric substrate 500; the second feeding stripline 113 is located immediately above the fourth dielectric substrate 700; and the microstrip patch 114 is located immediately above the fifth dielectric substrate 900.

[0044] Furthermore, the grounding metal pillars 120 are distributed in a rectangular shape, but two metal pillars are missing in the portion directly below the first feeding stripline 112. The grounding metal pillars 120 penetrate the first dielectric substrate 100, the first bonding plate 200, and the second dielectric substrate 300, connecting the first ground plate 101 and the second ground plate 102. At the same time, the first coupled stripline 107, the first quarter-wavelength stripline resonator 108, the open stripline branch 109, the second coupled stripline 110, and the second quarter-wavelength stripline resonator 111 are confined within the range of the grounding metal pillars 120, thereby achieving a shielding effect.

[0045] Furthermore, the first signal transmission metal pillar 103 passes through the first dielectric substrate 100, with its two ends connected to the coaxial feed terminal 121 and the first metal disk 115, respectively. The second signal transmission metal pillar 104 passes through the first bonding plate 200, with its two ends connected to the second metal disk 116 and the third metal disk 117, respectively. The third signal transmission metal pillar 105 passes through the second dielectric substrate 300, the second bonding plate 400, and the third dielectric substrate 500, with its two ends connected to the fourth metal disk 118 and the first feed stripline 112, respectively. The fourth signal transmission metal pillar 106 passes through the third bonding plate 600 and the fourth dielectric substrate 700, with its two ends connected to the first feed stripline 112 and the fifth metal disk 119, respectively.

[0046] Furthermore, in the filtering antenna based on three-dimensional packaging integration, the first coupled stripline 107 is arranged in an n-shape, and its end is connected to the first metal disk 115; the first quarter-wavelength stripline resonator 108 is located on the right side of the first coupled stripline 107, and the signals are transmitted between the two through coupling, and the former is composed of two sections, the first section is located on the upper side, and the second section is located on the lower side, and the length and width of the two sections are different, and the end is connected to the second metal disk 116; the open stripline branch 109 is L-shaped, located on the left side of the first quarter-wavelength stripline resonator 108, and is connected to it through the second metal disk 116; the second quarter-wavelength stripline resonator 111 is located directly above the first quarter-wavelength stripline resonator 108, and has the same shape and size as the latter, and is connected to the second signal through the third metal disk 117. The signal transmission metal pillar 104 and the second coupling stripline resonator 111 achieve interlayer signal transmission. The second coupling stripline 110 is located directly above the first coupling stripline 107, has the same shape and size as the second coupling stripline resonator 111, and is located to the left of the second quarter-wavelength stripline resonator 111. Signals are transmitted between the two through coupling. The first feeding stripline 112 is connected to the second coupling stripline 110 via the third signal transmission metal pillar 105 and the fourth metal disk 118. Its placement direction is perpendicular to the second coupling stripline 110, and both ends are rounded. The second feeding stripline 113 is connected to the first feeding stripline 112 via the fourth signal transmission metal pillar 106 via the fifth metal disk 119. Its other end opposite to the fifth metal disk 119 is rounded. The microstrip patch 114 is arranged at the center of the fifth dielectric substrate 900 and has no contact with the remaining circuits.

[0047] Furthermore, the filtering patch antenna based on three-dimensional packaging integration is characterized in that the thickness of the first dielectric substrate 100 and the second dielectric substrate 300 is 0.254 mm, the thickness of the third dielectric substrate 500 and the fourth dielectric substrate 700 is 0.508 mm, and the thickness of the fifth dielectric substrate 900 is 0.76 mm, and the dielectric constant of the above dielectric substrates is 3.0.

[0048] Furthermore, the filtering patch antenna based on three-dimensional packaging integration is characterized in that the thickness of the first bonding plate 200 is 0.306 mm, the thickness of the second bonding plate 400, the third bonding plate 600, and the fourth bonding plate 800 is 0.102 mm, and the dielectric constants of the above bonding plates are all 3.0.

[0049] This design example provides a filter patch antenna design based on three-dimensional packaging integration, achieving multifunctionality and miniaturization. It combines the excellent radiation performance of a linearly polarized antenna with the filtering performance of a filter element. Using a single device instead of cascading multiple components avoids the problem of high insertion loss and achieves multifunctional integration, while also offering the advantage of compact size. A novel filter circuit design approach based on a folded multimode resonator introduces cross-coupling between the source, load, and resonant unit. This allows for multiple zeros and a high roll-off characteristic in both the upper and lower stopbands of the filter, resulting in excellent out-of-band suppression. Consequently, the filter antenna achieves excellent frequency selectivity and out-of-band suppression. Based on the antenna feeding method of a folded L-shaped stripline, the antenna exhibits a wide bandwidth, and a radiation zero is introduced in the lower stopband, further enhancing its suppression capability. Embedding a metal shielding cavity within the antenna not only ensures low loss but also makes the antenna well-suited for high-density integrated, self-packaged applications.

[0050] This design example achieves multifunctionality and miniaturization, with the final size being 0.53λg * 0.39λg * 0.17λg (λg represents the wavelength of the guided wave at the center frequency). Figures 2 to 6 As shown, the specific dimensions are shown in Table 1, unit: mm; among which, L and W denote the length and width of the microstrip patch 114, respectively; L 1 and W 1 Respectively represent the length and width of the second ground plate 102; l 1 and w 1 represent the length and width of the second feeding stripline 113 respectively; l 2 and w 2 Respectively represent the length and width of the first feeding stripline 112; the first quarter-wavelength stripline resonator 108 is divided into two sections, l 3 and w 3 Represent the length and width of the first segment respectively, l 4 and w 5 Respectively represent the length and width of the second section; the open strip line branch 109 is divided into two sections perpendicular to each other, l 5 and w 6 Represent the length and width of the first segment respectively, l 6 and w 7Respectively represent the length and width of the second segment; the first coupling stripline 107 is divided into three segments, l 7 and w 8 Represent the length and width of the first segment respectively, l 8 and w 4 Represent the length and width of the second segment respectively, ( l 3 -l 9 )and w 4 Respectively represent the length and width of the third segment; r 1 、 r 4 、 r 5 and r 6 the radii of the fifth metal disk 119 , the grounded metal post 120 , the first metal disk 115 , and the second metal disk 116 , respectively; r 2 and r 3 Respectively represent the radii of the two circles hollowed out on the second ground plate 102; d 1 represents the distance between the grounding metal pillars 120 .

[0051] Table 1: Design parameter value table

[0052]

[0053] The simulation results of the present invention show that the -10 dB impedance bandwidth is 12.86% in the range of 9.75 GHz to 11.09 GHz, the peak actual gain is 6.48 dBi, and the in-band efficiency can reach up to 89%. Figure 7 The antenna's response is shown, where s11 represents the antenna's return loss. This indicates that the designed antenna achieves a suppression level of 28.6dB in the lower near-stopband and 40dB in the upper near-stopband, demonstrating the invention's high selectivity. Furthermore, six radiation nulls can be clearly observed on the left and right sides of the passband, and the 20dB stopband suppression reaches a high of 1.8f0, demonstrating excellent out-of-band suppression performance. Figure 8 is the radiation pattern of the filter antenna at the center frequency of 10.4 GHz, Figure 8The phi (phi) in the figure represents the azimuth angle of the antenna pattern. co-pol represents the main polarization component, and x-pol represents the cross-polarization component. The antenna exhibits omnidirectional radiation characteristics and cross-polarization suppression levels exceeding 15dB, demonstrating excellent radiation performance.

[0054] The above embodiments are intended to illustrate the present invention only and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications, or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and should be encompassed by the scope of the claims of the present invention.

Claims

1. A filter patch antenna based on three-dimensional packaging integration, comprising five layers of dielectric substrate and four layers of bonding plate; characterized in that: The first dielectric substrate (100), the first bonding plate (200), the second dielectric substrate (300), the second bonding plate (400), the third dielectric substrate (500), the third bonding plate (600), the fourth dielectric substrate (700), the fourth bonding plate (800) and the fifth dielectric substrate (900) are sequentially arranged from bottom to top. The five dielectric substrates and the four bonding plates are vertically integrated in a three-dimensional scale and constitute the main structure of the antenna in a centrally stacked arrangement in the form of at least two layers. The overall circuit structure is distributed within the main structure of the antenna, and includes a first grounding plate (101), a second grounding plate (102), a first signal transmission metal column (103), a second signal transmission metal column (104), a third signal transmission metal column (105), a fourth signal transmission metal column (106), a first coupling stripline (107), a first quarter-wavelength stripline resonator (108), an open-circuit stripline branch (109), a second coupling stripline (110), a second quarter-wavelength stripline resonator (111), a first feeding stripline (112), a second feeding stripline (113), a microstrip patch (114), a first metal disc (115), a second metal disc (116), a third metal disc (117), a fourth metal disc (118), a fifth metal disc (119), a grounding metal column (120), and a coaxial feeding terminal (121); The first ground plane (101) is located immediately below the first dielectric substrate (100); the first coupled stripline (107), the first quarter-wavelength stripline resonator (108), and the open stripline branch (109) are located immediately above the first dielectric substrate (100); the second coupled stripline (110) and the second quarter-wavelength stripline resonator (111) are located immediately above the first bonding plate (200); the second ground plane (102) is located immediately above the second dielectric substrate (300); the first feed stripline (112) is located immediately above the third dielectric substrate (500); the second feed stripline (113) is located immediately above the fourth dielectric substrate (700); and the microstrip patch (114) is located immediately above the fifth dielectric substrate (900); The grounding metal pillars (120) are distributed in a rectangular shape, but two metal pillars are missing in the portion directly below the first feeding stripline (112); the grounding metal pillars (120) penetrate the first dielectric substrate (100), the first bonding plate (200) and the second dielectric substrate (300), connect the first grounding plate (101) and the second grounding plate (102), and simultaneously confine the first coupled stripline (107), the first quarter-wavelength stripline resonator (108), the open stripline branch (109), the second coupled stripline (110) and the second quarter-wavelength stripline resonator (111) within the range of the grounding metal pillars (120); The first signal transmission metal column (103) passes through the first dielectric substrate (100), and its two ends are respectively connected to the coaxial feeding terminal (121) and the first metal disk (115); the second signal transmission metal column (104) passes through the first bonding plate (200), and its two ends are respectively connected to the second metal disk (116) and the third metal disk (117); the third signal transmission metal column (105) passes through the second dielectric substrate (300), the second bonding plate (400) and the third dielectric substrate (500), and its two ends are respectively connected to the fourth metal disk (118) and the first feeding stripline (112); the fourth signal transmission metal column (106) passes through the third bonding plate (600) and the fourth dielectric substrate (700), and its two ends are respectively connected to the first feeding stripline (112) and the fifth metal disk (119).

2. The filtering patch antenna based on three-dimensional packaging integration according to claim 1, characterized in that: The first coupling stripline (107) is arranged in an n-shape, and an end of the first coupling stripline (107) is connected to a first metal disk (115).

3. The filtering patch antenna based on three-dimensional packaging integration according to claim 1, characterized in that: The first quarter-wavelength stripline resonator (108) is located on the right side of the first coupled stripline (107), and signals are transmitted between the two through coupling. The first quarter-wavelength stripline resonator (108) is composed of two sections, which are connected along the central axis. The end of the first quarter-wavelength stripline resonator (108) is connected to the second metal disk (116); the open stripline branch (109) is L-shaped, located on the left side of the first quarter-wavelength stripline resonator (108), and is connected to the second metal disk (116).

4. The filtering patch antenna based on three-dimensional packaging integration according to claim 1, characterized in that: The second quarter-wavelength stripline resonator (111) is located directly above the first quarter-wavelength stripline resonator (108), has the same shape and size as the latter, and realizes inter-layer transmission of signals with the first quarter-wavelength stripline resonator (108) through the third metal disk (117) and the second signal transmission metal column (104).

5. The filtering patch antenna based on three-dimensional packaging integration according to claim 1, characterized in that: The second coupling stripline (110) is located directly above the first coupling stripline (107), has the same shape and size as the latter, and is located on the left side of the second quarter-wavelength stripline resonator (111), and signals are transmitted between the two through coupling.

6. The filtering patch antenna based on three-dimensional packaging integration according to claim 1, characterized in that: The first feeding stripline (112) is connected to the second coupling stripline (110) via a third signal transmission metal column (105) and a fourth metal disk (118); the first feeding stripline (112) is placed perpendicular to the third signal transmission metal column (105) via the latter, and both ends are circularized.

7. The filtering patch antenna based on three-dimensional packaging integration according to claim 1, characterized in that: The second feeding stripline (113) is connected to the first feeding stripline (112) via a fifth metal disc (119) and a fourth signal transmission metal column (106), and the other end of the second feeding stripline (113) opposite to the fifth metal disc (119) is circularized.

8. The filtering patch antenna based on three-dimensional packaging integration according to claim 1, characterized in that: The microstrip patch (114) is arranged at the exact center of the fifth dielectric substrate (900) and has no contact with the rest of the circuits.

9. The filtering patch antenna based on three-dimensional packaging integration according to claim 1, characterized in that: The thickness of the first dielectric substrate (100) and the second dielectric substrate (300) is 0.254 mm, the thickness of the third dielectric substrate (500) and the fourth dielectric substrate (700) is 0.508 mm, and the thickness of the fifth dielectric substrate (900) is 0.76 mm. The dielectric constants of the above dielectric substrates are all 3.

0.

10. The filtering patch antenna based on three-dimensional packaging integration according to claim 1, characterized in that: The thickness of the first bonding plate (200) is 0.306 mm, and the thickness of the second bonding plate (400), the third bonding plate (600), and the fourth bonding plate (800) is 0.102 mm. The dielectric constants of the above bonding plates are all 3.0.

Images