A roll-to-roll semi-automatic preparation method and system for flexible optoelectronic devices

Abstract

The present invention discloses a roll-to-roll semi-automatic preparation method and system for flexible optoelectronic devices, relating to the technical field of flexible optoelectronic device manufacturing. The method comprises: using a roll-to-roll slit coater to slit-coat a functional material onto a laser P1 patterned coil, obtaining a flexible coil coated with a light absorbing layer and an interface layer; performing machine vision inspection using a physical coil archive to obtain a coil digital twin archive; transferring the flexible coil coated with the light absorbing layer and the interface layer to a roll-to-roll laser scribing device for laser P2 scribing to obtain a P2 patterned coil; and packaging and cutting the P3 patterned coil using a laminated packaging method based on coil packaging instructions and electrical cutting instructions to obtain a flexible optoelectronic device. Through process flow design, the present invention improves device processing accuracy and performance, enhances process flexibility, and is more suitable for industrial production.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible optoelectronic device manufacturing, and in particular to a roll-to-roll semi-automatic preparation method and system for flexible optoelectronic devices. Background Art

[0002] Roll-to-roll semi-automated fabrication of flexible optoelectronic devices plays a crucial role in current flexible optoelectronic device manufacturing. Flexible optoelectronic devices (such as flexible thin-film solar cells and organic light-emitting diode (OLED) displays) have broad application prospects in energy and display fields due to their lightweight and bendable nature. These devices typically utilize a structure that continuously deposits multiple layers of functional thin films on a flexible substrate, making roll-to-roll processing suitable for large-scale production. Existing roll-to-roll production lines typically integrate cleaning, coating, deposition, patterning (scribing), and packaging processes into a single continuous assembly line to enable large-scale, continuous production.

[0003] In the field of semi-automatic roll-to-roll preparation of flexible optoelectronic devices, traditional preparation methods still have some shortcomings in practical applications: on the one hand, the fully continuously integrated roll-to-roll production line has a complex structure, the various processes are closely connected, and the equipment investment and maintenance costs are high. In such a highly integrated production line, the beats between different processes require strict synchronization. Any failure in a single link will cause the entire line to stop, reducing production efficiency. In addition, each process has extremely high requirements for the position accuracy of the coil during continuous operation. Especially in precision processing such as laser scribing, the movement of the coil can easily introduce cumulative errors, resulting in graphic misalignment or reduced processing accuracy. On the other hand, for the manufacture of flexible optoelectronic devices, some key processes are difficult to complete efficiently under completely continuous conditions. Summary of the Invention

[0004] In view of the above existing problems, the present invention is proposed.

[0005] Therefore, the present invention provides a roll-to-roll semi-automatic preparation method for flexible optoelectronic devices to solve the problem of complex structure of continuous production lines and cumulative errors in precision processing.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] In a first aspect, the present invention provides a roll-to-roll semi-automatic method for preparing a flexible optoelectronic device, comprising: loading a flexible conductive substrate roll, placing the flexible conductive substrate roll into a laser scribing device, and obtaining a laser P1 patterned roll and a physical roll file;

[0008] Using a roll-to-roll slit coater, the laser P1 patterned coil is slit-coated with functional materials to obtain a flexible coil coated with a light absorption layer and an interface layer. Machine vision inspection is then performed on the physical coil archive to obtain a digital twin archive of the coil.

[0009] The flexible web coated with the light absorbing layer and the interface layer is moved to a roll-to-roll laser scribing device for laser P2 scribing to obtain a P2 patterned processed web;

[0010] Transfer the P2 patterned processed coil to the evaporation equipment to deposit the electrode layer and obtain the deposited coil;

[0011] Perform P3 laser processing on the deposited coil, and use the digital twin model to simulate the process and optimize the parameters to generate coil packaging instructions and electrical cutting instructions;

[0012] Based on the coil packaging instructions and electrical cutting instructions, the P3 patterned processing coil is packaged and cut through the lamination packaging method to obtain flexible optoelectronic devices.

[0013] As a preferred embodiment of the roll-to-roll semi-automatic preparation method of the flexible optoelectronic device of the present invention, the steps of loading the flexible conductive substrate roll, placing the flexible conductive substrate roll on the laser scribing device, and obtaining the laser P1 patterned roll and the physical roll file are as follows:

[0014] Loading flexible conductive substrate rolls and creating physical roll files based on roll identification;

[0015] The flexible conductive substrate roll is moved to the unwinding mechanism of the roll-to-roll laser marking equipment, the roll is unwound and the film layer is laser-marked in sections while the roll is stationary.

[0016] As a preferred embodiment of the roll-to-roll semi-automatic preparation method of the flexible optoelectronic device of the present invention, the steps are as follows: the laser P1 patterned coil is slit-coated with a functional material by a roll-to-roll slit coater to obtain a flexible coil coated with a light absorption layer and an interface layer, and a machine vision inspection is performed through a physical coil archive to obtain a coil digital twin archive.

[0017] Perform slit coating of functional materials on the surface of the laser P1 patterned coil, and accurately wind the coil through deviation correction control to obtain a flexible coil coated with a light absorption layer and an interface layer;

[0018] Based on a flexible coil coated with a light absorbing layer and an interface layer, a hyperspectral camera is used to measure the film thickness and component distribution to obtain physical property data;

[0019] Based on the physical property data, the initial coil archive is updated through data mapping and archiving methods, and a digital twin archive of the coil is generated based on machine vision inspection.

[0020] As a preferred solution of the roll-to-roll semi-automatic preparation method of the flexible optoelectronic device described in the present invention, the laser scribing device refers to multiple laser light sources for performing P1, P2 and P3 scribing respectively; wherein P1 scribing is used to scribing the bottom electrode layer on the roll to form an electrode spacing band, P2 scribing is used to scribing the middle functional layer to open a window to expose the lower electrode, and P3 scribing is used to cut the upper electrical layer to form a battery separator; the three scribing steps are all completed in the same device, and the scribing tracks are parallel to each other and precisely aligned relative to the device sub-unit position.

[0021] As a preferred embodiment of the roll-to-roll semi-automatic preparation method of the flexible optoelectronic device of the present invention, the steps of moving the flexible roll coated with the light absorption layer and the interface layer to a roll-to-roll laser scribing device for laser P2 scribing, and then transferring the roll to an evaporation device for deposition of the electrode layer to obtain the deposited roll are as follows:

[0022] The flexible web coated with the light absorbing layer and the interface layer is moved to the unwinding mechanism of the roll-to-roll laser scribing equipment, the web is unwound, and the thin film layer is laser-scribed in sections while the web is stationary to obtain a P2 patterned web;

[0023] The P2 patterned processed coil is transferred to the evaporation equipment, and an electrode layer is deposited on the surface of the coil by wire lamination and hot pressing lamination to obtain the deposited coil;

[0024] Online thickness measurement is performed on the deposited coil, and the digital twin archive is updated through data mapping and archiving methods.

[0025] As a preferred solution of the roll-to-roll semi-automatic preparation method of the flexible optoelectronic device of the present invention, wherein: the deposited coil is subjected to P3 laser processing, and processing simulation and parameter optimization are performed through a digital twin model to generate coil packaging instructions and electrical cutting instructions. The steps are as follows:

[0026] Perform P3 laser processing on the deposited coil, obtain the P3 patterned processed coil, and update it to the coil digital twin archive;

[0027] The digital twin model is used to perform processing simulation and parameter optimization for the final packaging and cutting processes, generating coil packaging instructions and electrical appliance cutting instructions respectively.

[0028] As a preferred embodiment of the roll-to-roll semi-automatic preparation method of the flexible optoelectronic device of the present invention, the steps of: based on the roll packaging instructions and the electrical cutting instructions, the P3 patterned processing roll is packaged and cut by the lamination packaging method to obtain the flexible optoelectronic device,

[0029] Based on the roll packaging instructions, the P3 patterned processing roll is packaged using a continuous lamination packaging method to produce a packaged roll of flexible optoelectronic devices;

[0030] Based on the packaged rolled flexible optoelectronic devices, slicing operations are performed through electrical cutting instructions to obtain single-chip flexible optoelectronic devices.

[0031] In the second aspect, the present invention provides a roll-to-roll semi-automatic preparation system for flexible optoelectronic devices, including a P1 scribing module for loading a flexible conductive substrate roll, placing the flexible conductive substrate roll on a laser scribing device, and obtaining a laser P1 patterned processed roll and a physical roll archive; a slit coating module for slit coating the laser P1 patterned processed roll with a functional material through a roll-to-roll slit coater, obtaining a flexible roll coated with a light absorption layer and an interface layer, and performing machine vision inspection through the physical roll archive to obtain a roll digital twin archive; a P2 scribing module for slit coating the laser P1 patterned processed roll with a functional material through a roll-to-roll slit coater, obtaining a flexible roll coated with a light absorption layer and an interface layer, and performing machine vision inspection through the physical roll archive to obtain a roll digital twin archive; The flexible coil of the surface layer is moved to the roll-to-roll laser marking equipment for laser P2 marking to obtain the P2 patterned processed coil; the electrode deposition module is used to transfer the P2 patterned processed coil to the evaporation equipment for deposition of the electrode layer to obtain the deposited coil; the P3 marking module is used to perform P3 laser processing on the deposited coil, and perform processing simulation and parameter optimization through the digital twin model to generate coil packaging instructions and electrical cutting instructions; the packaging and cutting module is used to package and cut the P3 patterned processed coil based on the coil packaging instructions and electrical cutting instructions, and through the laminated packaging method to obtain flexible optoelectronic devices.

[0032] In a third aspect, the present invention provides a computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: when the computer program is executed by the processor, any step of the roll-to-roll semi-automatic preparation method of flexible optoelectronic devices as described in the first aspect of the present invention is implemented.

[0033] In a fourth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein: when the computer program is executed by a processor, any step of the roll-to-roll semi-automatic preparation method of a flexible optoelectronic device as described in the first aspect of the present invention is implemented.

[0034] The beneficial effects of the present invention are: by improving processing accuracy and device performance, the scribing accuracy is improved to the micron level, reducing the ineffective area of ​​the battery series area; enhancing process flexibility, which can not only achieve roll-to-roll continuous production throughout the entire process, but also switch to slice processing at specific steps; reducing equipment complexity and maintenance costs, decomposing the entire line into independent modular equipment, avoiding the complex control requirements of highly coupled full-line connections; improving industrial feasibility, and fully considering the needs of actual large-scale production. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 Flowchart of the roll-to-roll semi-automatic preparation method for flexible optoelectronic devices.

[0037] Figure 2 Schematic diagram of the roll-to-roll semi-automatic preparation system for flexible optoelectronic devices.

[0038] Figure 3 This is the laser scribing process flow chart.

[0039] Figure 4 Optimize the decision flow chart for packaging and cutting. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0041] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0042] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0043] Reference Figures 1 to 4 , is an embodiment of the present invention, which provides a roll-to-roll semi-automatic preparation method for a flexible optoelectronic device, comprising the following steps:

[0044] S1. Load the flexible conductive substrate coil and place it on the laser scribing device to obtain the laser P1 patterned coil and physical coil file;

[0045] Loading flexible conductive substrate rolls and creating physical roll files based on roll identification;

[0046] It should be noted that the physical roll file records the supplier information, material batch, substrate type, inspection area information, repair trigger criteria, reliability criteria, and nominal physical parameters of the flexible conductive substrate roll.

[0047] Furthermore, a roll of flexible conductive substrate coil to be processed is loaded on the unwinding mechanism of the roll-to-roll slit coater, and by reading the coil identity tag attached to the core of the flexible conductive substrate coil, a physical coil file bound to the coil identity tag is created in the central data processor for full life cycle traceability.

[0048] Moving the flexible conductive substrate roll to an unwinding mechanism of a roll-to-roll laser scribing device, unwinding the roll and performing laser scribing on the film layer in sections while the roll is stationary;

[0049] It should be noted that the laser pattern is preset according to the process requirements. Laser scribing is performed section by section according to the predetermined submodule area, that is, the coil moves intermittently and completes all scribing operations in the module area in sequence after being stationary in each submodule area, and then moves to the next area to continue scribing. The roll-to-roll laser scribing equipment is equipped with multiple laser light sources for performing P1, P2 and P3 scribing respectively; P1 scribing is used to remove the bottom electrode layer on the coil to form an electrode spacing band, P2 scribing is used to remove the middle functional layer to open a window to expose the lower electrode, and P3 scribing is used to cut the upper power layer to form a battery separator; all three scribing processes are completed in the same equipment, and the scribing tracks are parallel to each other and precisely aligned relative to the device subunit position.

[0050] Furthermore, the flexible conductive substrate coil is placed on a laser marking device to perform P1 marking. The laser marking device includes: an unwinding mechanism, a conveying and positioning platform, multiple laser processing heads, a dust collection and waste collection device, and a rewinding mechanism. First, the unwinding mechanism unwinds the coil, flattens it through a guide roller, and enters the positioning platform. The positioning platform has a vacuum adsorption or electrostatic adsorption function, which can firmly fix a local area of ​​the flexible conductive substrate coil to the platform surface when necessary. The device is equipped with a high-precision stepper drive system for moving the coil at a predetermined step distance. Whenever the coated flexible conductive substrate coil moves into position, it stops moving, obtains the laser P1 patterned processed coil, and enters the static marking stage.

[0051] S2. Slit-coating the laser P1 patterned coil with functional materials using a roll-to-roll slit coater to obtain a flexible coil coated with a light absorbing layer and an interface layer. Machine vision inspection is then performed on the physical coil archive to obtain a digital twin archive of the coil.

[0052] Perform slit coating of functional materials on the surface of the laser P1 patterned coil, and accurately wind the coil through deviation correction control to obtain a flexible coil coated with a light absorption layer and an interface layer;

[0053] It should be noted that functional layer coating refers to the core manufacturing process of coating a functional material solution on a flexible substrate in air using a roll-to-roll slit coating method, and then drying or solvent volatilization treatment to form a uniform and stable solid functional film.

[0054] Furthermore, the flexible conductive substrate coil is unwound in a roll-to-roll slot coating machine, which includes a precision unwinding unit, plasma cleaning, a slot coating head, and a drying unit. The flexible conductive substrate coil is conveyed through the plasma cleaning and slot coating head under constant tension control. The plasma cleaning cleans and treats the substrate surface to improve the adhesion of the subsequent film layer. The slot coating head then evenly coats the functional material (such as an active layer precursor solution, an oxide nanoparticle interface layer solution, etc.) onto the surface of the flexible conductive substrate coil in air to form a functional layer film. Depending on the material processing requirements, the coil may then pass through a drying oven area for drying and a drying unit for drying and curing. After coating, the flexible conductive substrate coil enters a rewinding mechanism and is precisely wound into a roll under the control of a correction sensor and servo system. The rewinding process ensures that the coil edges are neatly aligned, resulting in a flexible coil coated with a light absorbing layer and an interface layer.

[0055] Based on a flexible coil coated with a light absorbing layer and an interface layer, a hyperspectral camera is used to measure the film thickness and component distribution to obtain physical property data;

[0056] It should be noted that a hyperspectral camera is an advanced online, non-contact analytical tool that combines traditional imaging and spectroscopy techniques. Unlike conventional cameras, which simply record light intensity in three broad bands: red, green, and blue, a hyperspectral camera collects hundreds of continuous, narrow-band spectral information from visible light to near-infrared for every pixel in the image, generating a data cube containing both two-dimensional spatial and one-dimensional spectral information. By analyzing the spectral curve at each spatial point in this data cube, multiple physical and chemical properties, such as film thickness (based on interference effects), chemical composition (based on characteristic absorption spectra), and crystallization state, can be simultaneously inferred at that point, enabling comprehensive and detailed characterization of film quality.

[0057] Furthermore, based on a flexible web coated with a light-absorbing layer and an interface layer, a hyperspectral camera is used to scan the surface of the moving web line by line in an online and non-contact manner, and detailed spectral response data of each pixel point in the continuous electromagnetic spectrum (such as visible light to near-infrared band) is collected in real time to form a data cube containing spatial and spectral information. Subsequently, by analyzing the spectral curve at each spatial coordinate point in the data cube, the film thickness is calculated based on the thin film interference effect, and the distribution uniformity of different chemical components is identified based on their characteristic absorption peaks. Finally, the physical property data is obtained by combining the two-dimensional thickness distribution map with the component distribution map.

[0058] Based on the physical property data, the initial coil archive is updated through data mapping and archiving methods, and a digital twin archive of the coil is generated based on machine vision inspection.

[0059] It should be noted that data mapping and archiving methods encapsulate two core data processing processes. Data mapping is the process of obtaining precise spatial and temporal coordinates in the physical world for each piece of independent measurement data, establishing a one-to-one correspondence between the data and its physical location. Archiving is the principle of continuously writing and storing structured data points with precise spatial and temporal coordinates after data mapping into a designated digital archive in an orderly and searchable manner.

[0060] Furthermore, based on the physical property data acquired in real time, the data mapping and archiving method is used to accurately bind each set of thickness and sheet resistance measurement results with the longitudinal position provided by the web conveyor encoder and the lateral position provided by the detection head scanner, thereby assigning a unique two-dimensional coordinate to each data point. Subsequently, all structured data with coordinates are written and updated to the initial web archive, realizing a complete mapping of the physical state to digital information, and finally generating a digital twin archive of the web that can accurately reproduce the distribution of physical properties on the surface of the real web in a virtualized form.

[0061] S3, moving the flexible web coated with the light absorbing layer and the interface layer to a roll-to-roll laser scribing device for laser P2 scribing to obtain a P2 patterned processed web;

[0062] The flexible web coated with the light absorbing layer and the interface layer is moved to the unwinding mechanism of the roll-to-roll laser scribing equipment, the web is unwound and the film layer is laser-scribed in sections while the web is stationary;

[0063] Next, the flexible web coated with a light-absorbing layer and an interface layer is placed in a laser scribing system for P2 scribing. At this point, the web already has a light-absorbing layer and an interface layer thin film on its surface. Another laser head (selected for wavelength and power to transmit or ablate the light-absorbing layer without damaging the bottom electrode layer, such as 532 nm green laser) is activated. Following a pre-set laser pattern, the absorber layer is locally removed using the specific pattern etched at the four corners during P1 scribing as positioning points. A typical P2 scribing pattern involves creating a narrow groove in the absorber layer within each subcell, exposing the bottom electrode strip at this groove. This electrically isolates the bottom electrodes of adjacent subcells, paving the way for the subsequent series connection of the top and bottom electrodes. Similarly, scribing is performed area by area in a static state, using the specific pattern etched at the four corners during P1 scribing as positioning points. This pattern is repeated across the entire web to ensure precise alignment of the pattern position with the previous P1 scribing. Material debris removed during P2 scribing is also immediately removed by a dust collector. After scribing is complete, the web is rewound.

[0064] S4, transferring the P2 patterned processed coil to an evaporation device for deposition of an electrode layer to obtain the deposited coil;

[0065] The P2 patterned processed coil is transferred to the evaporation equipment, and an electrode layer is deposited on the surface of the coil by wire lamination and hot pressing lamination to obtain the deposited coil;

[0066] It should be noted that the evaporation equipment is a vacuum deposition device that supports roll-to-roll continuous coating. It is equipped with a vacuum chamber, a reel-unwind mechanism, a conveyor roller system, an evaporation source, and a target. When necessary, the evaporation equipment can also be switched to a sheet-by-sheet mode.

[0067] The functional film layer deposition includes a photoelectric conversion active layer, a conductive electrode layer, and an electron transport and hole transport functional layer; the deposition method is selected according to the film layer type, including roll-to-roll continuous coating and deposition, including roll-to-roll continuous vacuum evaporation and single-wafer vacuum deposition.

[0068] The P2 patterned web is then transferred to an evaporation device, where electrode deposition is performed to form at least one functional thin film layer for the flexible optoelectronic device. Prior to this, the multilayer film surrounding the flexible optoelectronic device is removed using a laser or mechanical method until the substrate is exposed, creating a clean border area to improve package sealing. This deposition process can be performed in a roll-to-roll continuous manner. A transparent conductive oxide (such as ITO or IZO) is sputtered as the top electrode. The evaporation device switches to sputtering mode, and the web is unwound in a vacuum over the target area. Magnetron sputtering deposits a transparent conductive film on the web surface. Because the P2 scribing removes a portion of the absorber layer, exposing the bottom electrode, these areas will achieve cross-cell connections after electrode cutting on the subsequent P3 scribing. The sputtering process is also performed in a roll-to-roll continuous manner. Upon completion, the web is reeled out of the bin, resulting in a complete multilayer structure. During the deposition process, the evaporation device uses its own web tracking and tension control to ensure that the film is accurately deposited in the target location and the web surface is flat and wrinkle-free. If necessary, the coil can also be inspected online (such as thickness test) in the vacuum chamber or after leaving the warehouse after each deposition to ensure the quality of the film layer.

[0069] Online film thickness testing is performed on the deposited coil, and the digital twin archive is updated through data mapping and archiving methods.

[0070] For the newly added electrode layer on the P2 patterned processing coil after deposition, the online film thickness test method is adopted, and continuous scanning is performed through non-contact sensors (such as eddy current sensors) to obtain real-time physical property data that can characterize the uniformity and conductivity of the electrode layer. Subsequently, through data mapping and archiving methods, this newly acquired physical property data is associated with its precise position coordinates on the coil, and this structured new information layer is integrated and written into the existing coil digital twin archive to complete the status update of the coil digital twin archive.

[0071] S5. Perform P3 laser processing on the deposited coil, perform processing simulation and parameter optimization through the digital twin model, and generate coil packaging instructions and electrical cutting instructions;

[0072] Perform P3 laser processing on the deposited coil, obtain the P3 patterned processed coil, and update the coil digital twin archive.

[0073] After the deposition process, the coil is placed in the laser apparatus for a third time, unrolled and positioned, for the laser P3 scribing process. At this point, the coil surface already has a top electrode layer. The corresponding laser head (such as a 532nm green laser, which effectively ablates metal or conductive oxide layers) is activated, using the specific pattern etched at the four corners during P1 scribing as registration points to cut and scribe the top electrode layer along the designed path. The P3 pattern is typically located at the opposite edge of each subcell, severing the top electrode layer and isolating the electrical connection between the top electrodes of adjacent cells. The P3 scribing pattern is positioned relative to the previous P1 and P2 patterns, ensuring that the top electrode of each subcell forms an electrical series connection with the bottom electrode of the adjacent cell through the P2 opening. At this point, the internal electrical connections of the flexible optoelectronic device on the coil are complete. P3 scribing is performed in blocks while the coil remains stationary. The registration points left at the four corners during P1 scribing ensure precise alignment with the previous two scribing steps. After scribing, debris is removed and the coil is finally reeled up to yield a semi-finished coil with patterned interconnects. At the same time, the marking quality data obtained through machine vision inspection, the actual process parameters and marking quality data used in P3 laser processing, are archived in the digital twin archive of the coil.

[0074] The digital twin model is used to perform processing simulation and parameter optimization for the final packaging and cutting processes, generating coil packaging instructions and electrical appliance cutting instructions respectively.

[0075] Based on the complete digital twin archive of the coil, which contains all historical data from substrate loading to P3 processing, the K-means clustering algorithm is used to analyze the coupled simulation state set in the archive, and the packaging process data and cutting information data used to guide subsequent decision-making are extracted by classification. Subsequently, based on the packaging process data, the finite element simulation optimization method is used to virtually verify the packaging process in order to find the optimal packaging parameters that can take into account both sealing and minimizing stress in the repair area. At the same time, based on the cutting information data, the global optimal cutting path is deduced through a heuristic search algorithm to plan a cutting solution that can maximize the yield rate. Finally, the optimal packaging parameters and optimal cutting paths obtained from the above two independent optimization processes are encoded into instruction sets to generate coil packaging instructions for guiding differentiated operations and electrical cutting instructions for achieving high-precision segmentation.

[0076] S6. Based on the coil packaging instructions and the electrical cutting instructions, the P3 patterned coil is packaged and cut through the lamination packaging method to obtain flexible optoelectronic devices.

[0077] Based on the roll packaging instructions, the P3 patterned processing roll is packaged using a continuous lamination packaging method to generate a packaged flexible conductive substrate roll;

[0078] Based on the differentiated parameters (such as temperature and pressure) specified for different regions of the P3 patterned process roll in the roll packaging instructions, the P3 patterned process roll first undergoes P4 edge cleaning. The P3 patterned process roll, now with all functional layers formed, is then mounted on the unwind mechanism of the packaging apparatus. The laminating unit precisely laminates the barrier encapsulation film onto the P3 patterned process roll. The laminating unit applies heat and pressure to securely bond the encapsulation film to the device layer on the P3 patterned process roll. Specifically, in this embodiment, a flexible, high-barrier, transparent film is used as the encapsulation film and adhered to the optoelectronic device surface via hot-melt adhesive lamination. The P3 patterned process roll passes through the laminating rollers within the apparatus at a constant speed. Under heat and pressure, the encapsulation film and the device layer are bonded together, eliminating bubbles and voids. The encapsulated roll then enters the rewinding unit, where it is rolled up to produce the encapsulated flexible conductive substrate roll. This process provides continuous encapsulation and protection for the entire roll of flexible optoelectronic devices. The encapsulated product can be directly cut into individual devices or retained as a roll for subsequent processing.

[0079] It should be noted that the system design of the present invention allows the packaging step to be completed in the intact coil state or in the sliced ​​state. In this embodiment, roll-to-roll packaging is used, which reflects the efficiency advantage of the present invention in continuous mode.

[0080] Based on the packaged flexible conductive substrate coil, the flexible optoelectronic device is obtained by slicing the coil through the electrical cutting instruction.

[0081] Furthermore, based on the high-precision cutting path and speed parameters contained in the electrical cutting instructions, which have been path-deduced and optimized, high-precision mechanical cutting methods are then used. The machine vision alignment function is used to lock the reference marks on the coil to calibrate the cutting coordinates, and drive the cutting tools (such as CNC cutting dies) to strictly follow the instructions to perform contour punching and cutting of each unit, ultimately accurately dividing the continuous coil into physically completely separated flexible optoelectronic devices that have passed the terminal performance test.

[0082] It should be noted that before coil packaging, P4 edge cleaning can be performed. This involves using a laser or mechanical method to remove excess film around the device edges, leaving only the base material at the edges. This prevents leakage or poor sealing due to exposed laminated film at the edges. In this embodiment, P4 edge cleaning can be performed at any appropriate stage before packaging. For example, during P3 scribing, a laser can be used to burn off a 5 mm wide strip of film along the device's border. The cleaned coil is then cut into individual device slices according to the predetermined unit size (e.g., corresponding to each submodule). Each individual flexible optoelectronic device slice now contains the internal series connection structure and is encapsulated for protection, ready for subsequent assembly or application. Finally, the encapsulated product undergoes quality inspection, including visual inspection, electrical performance testing, and encapsulation sealing testing, to ensure that product performance meets requirements.

[0083] This embodiment also provides a roll-to-roll semi-automatic preparation system for flexible optoelectronic devices, including: a P1 scribing module for loading a flexible conductive substrate roll, placing the flexible conductive substrate roll on a laser scribing device, and obtaining a laser P1 patterned roll and a physical roll archive; a slit coating module for slit coating the laser P1 patterned roll with a functional material through a roll-to-roll slit coater, obtaining a flexible roll coated with a light absorption layer and an interface layer, performing machine vision inspection through the physical roll archive, obtaining a roll digital twin archive, and performing machine vision inspection through the physical roll archive, obtaining a roll digital twin archive; a P2 scribing module , used to move the flexible coil coated with the light absorption layer and the interface layer to the roll-to-roll laser marking equipment for laser P2 marking to obtain the P2 patterned processed coil; the electrode deposition module is used to transfer the P2 patterned processed coil to the evaporation equipment for deposition of the electrode layer to obtain the deposited coil; the P3 marking module is used to perform P3 laser processing on the deposited coil, and perform processing simulation and parameter optimization through the digital twin model to generate coil packaging instructions and electrical cutting instructions; the packaging and cutting module is used to package and cut the P3 patterned processed coil based on the coil packaging instructions and electrical cutting instructions, and through the laminated packaging method to obtain flexible optoelectronic devices.

[0084] This embodiment also provides a computer device suitable for the roll-to-roll semi-automatic preparation method of flexible optoelectronic devices, including: a memory and a processor; the memory is used to store computer-executable instructions, and the processor is used to execute computer-executable instructions to implement the roll-to-roll semi-automatic preparation method of flexible optoelectronic devices proposed in the above embodiment.

[0085] The computer device may be a terminal, comprising a processor, memory, a communication interface, a display, and an input device connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores an operating system and computer programs. The internal memory provides an environment for the operating system and computer programs stored in the non-volatile storage media. The communication interface of the computer device is used to communicate with external terminals via wired or wireless communication. Wireless communication may be achieved via Wi-Fi, a carrier network, NFC (near-field communication), or other technologies. The display of the computer device may be a liquid crystal display or an electronic ink display. The input device may be a touchscreen overlay on the display, buttons, a trackball, or a touchpad on the computer device housing, or an external keyboard, touchpad, or mouse.

[0086] This embodiment also provides a storage medium having a computer program stored thereon, which, when executed by a processor, implements the roll-to-roll semi-automatic preparation method for flexible optoelectronic devices as proposed in the above embodiment; the storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0087] In summary, the present invention improves processing accuracy and device performance, raising the scribing accuracy to the micron level and reducing the ineffective area of ​​the battery series region; enhances process flexibility, enabling both roll-to-roll continuous production throughout the entire process and switching to slice processing at specific steps; reduces equipment complexity and maintenance costs, breaking down the entire line into independent modular equipment, avoiding the complex control requirements of highly coupled full-line connections; and enhances industrial feasibility, fully considering the needs of actual large-scale production.

[0088] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A roll-to-roll semi-automatic production method for flexible optoelectronic devices, characterized by: include, Load the flexible conductive substrate coil and place it on the laser scribing device to obtain the laser P1 patterned coil and physical coil file; Using a roll-to-roll slit coater, the laser P1 patterned coil is slit-coated with functional materials to obtain a flexible coil coated with a light absorption layer and an interface layer. Machine vision inspection is then performed on the physical coil archive to obtain a digital twin archive of the coil. The flexible web coated with the light absorbing layer and the interface layer is moved to a roll-to-roll laser scribing device for laser P2 scribing to obtain a P2 patterned processed web; Transfer the P2 patterned processed coil to the evaporation equipment to deposit the electrode layer and obtain the deposited coil; Perform P3 laser processing on the deposited coil, and use the digital twin model to simulate the process and optimize the parameters to generate coil packaging instructions and electrical cutting instructions; Based on the coil packaging instructions and electrical cutting instructions, the P3 patterned processing coil is packaged and cut through the lamination packaging method to obtain flexible optoelectronic devices.

2. The roll-to-roll semi-automatic production method of a flexible optoelectronic device according to claim 1, characterized in that: The steps of loading the flexible conductive substrate coil and placing the flexible conductive substrate coil on the laser scribing device to obtain the laser P1 patterned coil and physical coil file are as follows: Loading flexible conductive substrate rolls and creating physical roll files based on roll identification; The flexible conductive substrate roll is moved to the unwinding mechanism of the roll-to-roll laser marking equipment, the roll is unwound and the film layer is laser-marked in sections while the roll is stationary.

3. The roll-to-roll semi-automatic production method of a flexible optoelectronic device according to claim 1, characterized in that: The roll-to-roll slit coater is used to slit coat the laser P1 patterned coil with functional materials to obtain a flexible coil coated with a light absorption layer and an interface layer, and a machine vision inspection is performed through the physical coil archive to obtain a coil digital twin archive. The steps are as follows: Perform slit coating of functional materials on the surface of the laser P1 patterned coil, and accurately wind the coil through deviation correction control to obtain a flexible coil coated with a light absorption layer and an interface layer; Based on a flexible roll coated with a light absorbing layer and an interface layer, a hyperspectral camera is used to measure the film thickness and component distribution to obtain physical property data; Based on the physical property data, the initial coil archive is updated through data mapping and archiving methods, and a digital twin archive of the coil is generated based on machine vision inspection.

4. The roll-to-roll semi-automatic production method of a flexible optoelectronic device according to claim 3, wherein: The laser scribing device refers to multiple laser light sources used to perform P1, P2 and P3 scribing respectively; among them, P1 scribing is used to scribing the bottom electrode layer on the coil to form an electrode spacing band, P2 scribing is used to scribing the middle functional layer to open a window to expose the lower electrode, and P3 scribing is used to cut the upper electrical layer to form a battery separator; the three scribing processes are all completed in the same device, and the scribing tracks are parallel to each other and precisely aligned relative to the device sub-unit position.

5. The roll-to-roll semi-automatic production method of a flexible optoelectronic device according to claim 4, characterized in that: The flexible coil coated with the light absorbing layer and the interface layer is moved to a roll-to-roll laser scribing device for laser P2 scribing, and then transferred to an evaporation device for deposition of the electrode layer to obtain the deposited coil. The steps are as follows: The flexible web coated with the light absorbing layer and the interface layer is moved to the unwinding mechanism of the roll-to-roll laser scribing equipment, the web is unwound, and the thin film layer is laser-scribed in sections while the web is stationary to obtain a P2 patterned web; The P2 patterned processed coil is transferred to the evaporation equipment, and an electrode layer is deposited on the surface of the coil by wire lamination and hot pressing lamination to obtain the deposited coil; Online thickness measurement is performed on the deposited coil, and the digital twin archive is updated through data mapping and archiving methods.

6. The roll-to-roll semi-automatic production method of a flexible optoelectronic device according to claim 1, wherein: The P3 laser processing is performed on the deposited coil, and the processing simulation and parameter optimization are performed through the digital twin model to generate coil packaging instructions and electrical cutting instructions. The steps are as follows: Perform P3 laser processing on the deposited coil, obtain the P3 patterned processed coil, and update it to the coil digital twin archive; The digital twin model is used to perform processing simulation and parameter optimization for the final packaging and cutting processes, generating coil packaging instructions and electrical appliance cutting instructions respectively.

7. The roll-to-roll semi-automatic production method of a flexible optoelectronic device according to claim 1, wherein: The steps of packaging and cutting the P3 patterned coil based on the coil packaging instructions and the electrical cutting instructions and obtaining the flexible optoelectronic device are as follows: Based on the roll packaging instructions, the P3 patterned processing roll is packaged using a continuous lamination packaging method to produce a packaged roll of flexible optoelectronic devices; Based on the packaged rolled flexible optoelectronic devices, slicing operations are performed through electrical cutting instructions to obtain single-piece flexible optoelectronic devices.

8. A roll-to-roll semi-automatic production system for flexible optoelectronic devices, based on the roll-to-roll semi-automatic production method for flexible optoelectronic devices according to any one of claims 1 to 7, characterized in that: include, The P1 scribing module is used to load the flexible conductive substrate roll, place the flexible conductive substrate roll into the laser scribing device, and obtain the laser P1 patterned roll and physical roll file; The slit coating module is used to slit-coat functional materials on laser P1 patterned coils using a roll-to-roll slit coater to obtain flexible coils coated with a light absorption layer and an interface layer. Machine vision inspection is then performed on the physical coil archive to obtain a digital twin archive of the coil. A P2 scribing module is used to move the flexible web coated with the light absorbing layer and the interface layer to the roll-to-roll laser scribing equipment for laser P2 scribing to obtain a P2 patterned processed web; The electrode deposition module is used to transfer the P2 patterned processed coil to the evaporation equipment for electrode layer deposition and obtain the deposited coil; The P3 scribing module is used to perform P3 laser processing on the deposited coil, and uses the digital twin model to simulate the process and optimize parameters to generate coil packaging instructions and electrical cutting instructions; The packaging and cutting module is used to package and cut P3 patterned processed rolls based on roll packaging instructions and electrical cutting instructions, and obtain flexible optoelectronic devices through a laminated packaging method.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the roll-to-roll semi-automatic preparation method of the flexible optoelectronic device according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the roll-to-roll semi-automatic preparation method of a flexible optoelectronic device according to any one of claims 1 to 7 are implemented.

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