Ultrathin VC vapor chamber

Abstract

The invention provides an ultrathin VC vapor chamber which comprises a VC lower cover and a VC upper cover arranged on the VC lower cover, the VC upper cover is arranged in a zigzag mode, and a plurality of steam cavities arranged at intervals are arranged between the VC upper cover and the VC lower cover which are arranged in a zigzag mode, the ultrathin VC vapor chamber is characterized in that a metal foil capillary structure is arranged between the VC upper cover and the VC lower cover, and the lower portion of the metal foil capillary structure is attached to the VC lower cover. The upper portion of the metal foil capillary structure is attached to a part of the VC upper cover, the metal foil capillary structure comprises a metal foil and evaporation backflow holes which penetrate through the metal foil and are distributed in the metal foil in an array mode, the metal foil is provided with a hollowed-out supporting structure, and the hollowed-out supporting structure and the evaporation backflow holes are arranged in a staggered mode. Compared with a traditional copper net, the metal foil capillary structure facilitates development of ultrathin VC, the metal foil capillary structure has better capillary force, the VC can achieve higher heat dissipation power, and meanwhile the metal foil capillary structure is lower in cost compared with the traditional copper net.

Description

Technical Field

[0001] The present invention belongs to the technical field of vapor chambers, and in particular relates to an ultra-thin VC vapor chamber. Background Art

[0002] A vapor chamber is a microstructured vapor chamber, typically made of copper. When heat is transferred from the heat source to the evaporation zone, the coolant within the chamber, heated in a low vacuum environment, begins to vaporize. This process absorbs heat energy and rapidly expands, rapidly filling the entire chamber. When the vapor comes into contact with a cooler area, it condenses, releasing the heat accumulated during evaporation. The condensed coolant then flows back to the evaporation heat source via the microstructured capillaries, a process that repeats itself repeatedly within the chamber.

[0003] For existing vapor chambers, the results Figure 1 As shown, it specifically includes a VC lower cover 1, a VC upper cover 2 arranged on the VC lower cover 1, the VC upper cover 2 is zigzag and a copper mesh 3 is provided between the zigzag VC upper cover 2 and the VC lower cover 1, and a plurality of steam chambers 4 are provided between the VC lower cover 1 and the VC upper cover 2. Capillary water return performance is achieved through the copper mesh 3, but since the existing technology generally adopts a copper mesh of 150 to 400 mesh, the copper mesh thickness is generally 50um, which occupies a relatively large air cavity space, thereby affecting the steam transmission performance. Due to the warp and weft weaving structure of the copper mesh, there is a U-shaped opening, so that the hydraulic radius is large and the capillary performance is relatively poor, which affects the VC water return and thus affects the maximum heat dissipation power of the VC. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides an ultra-thin VC vapor chamber to solve the problems in the above background technology.

[0005] The invention provides the following technical solution: an ultra-thin VC heat spreader, the ultra-thin VC heat spreader includes a VC lower cover, a VC upper cover arranged on the VC lower cover, the VC upper cover is zigzagly arranged, and a number of steam chambers are arranged at intervals between the zigzag VC upper cover and the VC lower cover, a metal foil capillary structure is provided between the VC upper cover and the VC lower cover, the metal foil capillary structure is adhered to the VC lower cover at the bottom, and is adhered to part of the VC upper cover at the top, the metal foil capillary structure includes metal foil and evaporation reflow holes that are through and arrayed on the metal foil, a hollow support structure is provided on the metal foil, and the hollow support structure and the evaporation reflow holes are staggered.

[0006] Compared with the existing technology, the beneficial effects of this application are: this application adopts a metal foil capillary structure, which is thinner than the copper mesh, which is convenient for the development of ultra-thin VC, and the metal foil capillary structure has better capillary force than the traditional copper mesh, which is beneficial for the VC to achieve greater heat dissipation power. At the same time, the metal foil capillary structure is lower in cost than the traditional copper mesh.

[0007] Preferably, the metal foil is one or more of copper foil, stainless steel foil, and titanium alloy foil.

[0008] Preferably, the thickness of the metal foil is 5um-40um.

[0009] Preferably, the diameter of the evaporation and reflow holes is 5um-100um, and the hole pitch of the evaporation and reflow holes is 50um-1mm.

[0010] Preferably, the hollow support structure is a column point, and the column point and the evaporation return hole are arranged in a staggered manner.

[0011] Preferably, the height of the pillar points is 3um-35um, and the spacing between the pillar points is 50um-1mm.

[0012] Preferably, the hollow support structure is a micro-groove, two adjacent micro-grooves are arranged in a staggered manner, and the micro-grooves and the evaporation reflow holes are arranged in a staggered manner.

[0013] Preferably, micro-grooves breakpoints are provided between the micro-grooves.

[0014] Preferably, the depth of the micro groove is 3um-35um, and the width of the micro groove is 10um-1mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 This is a structural diagram of a VC heat spreader provided in the prior art; Figure 2 A structural diagram of an ultra-thin VC vapor chamber provided in an embodiment of the present invention; Figure 3 A structural diagram of a metal foil capillary structure provided by an embodiment of the present invention; Figure 4 A cross-sectional view of a metal foil capillary structure provided by an embodiment of the present invention; Figure 5A structural diagram of a metal foil capillary structure provided by another embodiment of the present invention; Figure 6 A cross-sectional view of a metal foil capillary structure provided in another embodiment of the present invention.

[0017] Description of reference numerals:

[0018] The present invention will be further described below with reference to the accompanying drawings and their descriptions. DETAILED DESCRIPTION

[0019] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0020] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0022] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0023] In one embodiment of the present invention, Figure 2As shown, an ultra-thin VC vapor chamber comprises a VC lower cover 1, a VC upper cover 2 disposed on the VC lower cover 1, the VC upper cover 2 being zigzag and having a plurality of spaced-apart steam chambers 4 between the zigzag VC upper cover 2 and the VC lower cover 1, a metal foil capillary structure 5 being disposed between the VC upper cover 2 and the VC lower cover 1, the metal foil capillary structure 5 being in contact with the VC lower cover 1 below and with a portion of the VC upper cover 2 above, the metal foil capillary structure 5 comprising a metal foil 51 and evaporation reflow holes 52 extending through and distributed in an array on the metal foil 51, a hollow support structure being provided on the metal foil 51, the hollow support structure being staggered with the evaporation reflow holes 52; Specifically, in this application, the VC lower cover 1, the VC upper cover 2, and the steam chamber 4 are all general settings of the heat sink in the prior art, and therefore will not be described in detail. At the same time, the present application uses a metal foil capillary structure 5 to replace the copper mesh 3 in the traditional heat spreader, and since the VC upper cover 2 is arranged in a zigzag manner, the metal foil capillary structure 5 arranged between the VC upper cover 2 and the VC lower cover 1 is adhered to the VC lower cover 1 at the bottom and to part of the VC upper cover 2 at the top. At the same time, the metal foil capillary structure 5 includes a metal foil 51 and an evaporation reflow hole 52 arranged on the metal foil 51. The evaporation reflow hole 52 is arrayed on the metal foil 51, and its arrangement can be a square arrangement or a triangular arrangement. The evaporation reflow hole 52 can be prepared by etching, and the evaporation reflow hole 52 serves as the entrance and exit for water evaporation and condensation. A hollow support structure is also provided on the metal foil 51, and the hollow support structure is staggered with the evaporation reflow hole 52, so as to improve the capillary performance and occupy a smaller air cavity.

[0024] In this embodiment, the metal foil 51 is one or more of copper foil, stainless steel foil, and titanium alloy foil; Specifically, in another embodiment of the present invention, the surface of the metal foil may be subjected to a hydrophilic treatment to further increase the capillary force. The hydrophilic treatment may be performed by chemical or physical roughening, deposition of hydrophilic particles, plating of a hydrophilic layer, and the like.

[0025] In this embodiment, the thickness of the metal foil 51 is 5 μm-40 μm.

[0026] In this embodiment, the diameter of the evaporation reflow holes 52 is 5 μm-100 μm, and the hole pitch of the evaporation reflow holes 52 is 50 μm-1 mm.

[0027] like Figure 3 、 4 As shown, in this embodiment, the hollow support structure is a column point 53, and the column point 53 and the evaporation return hole 52 are staggered; Specifically, the pillar points 53 can be prepared by half-etching, and then a plurality of pillar points 53 distributed in an array are formed on the side of the metal foil 51 close to the VC lower cover 1. The pillar points 53 can improve the capillary performance, reduce the hydraulic radius and enhance the capillary force, while making the metal foil capillary structure thinner and occupying a smaller air cavity.

[0028] In this embodiment, the height of the pillar points 53 is 3um-35um, and the spacing between the pillar points 53 is 50um-1mm.

[0029] like Figure 5 、 6 As shown, in another embodiment of the present invention, the hollow support structure is a micro-groove 54, two adjacent micro-grooves 54 are staggered, and the micro-grooves 54 and the evaporation reflow holes 52 are staggered; Specifically, the micro grooves 54 can be prepared by half etching, and the micro grooves 54 can further reduce the hydraulic radius and enhance the capillary force.

[0030] In another embodiment of the present invention, micro-grooves 55 are provided between the micro-grooves 54; Specifically, the micro-grooves 54 are separated by the micro-grooves 55 to facilitate the communication of water channels between the grooves. At the same time, the two adjacent micro-grooves 54 are staggered, so that the micro-grooves breakpoints 55 are also staggered, which can improve the communication ability of the water channels in the grooves.

[0031] In another embodiment of the present invention, the depth of the micro groove 54 is 3 um-35 um, and the width of the micro groove 54 is 10 um-1 mm.

[0032] In summary, the ultra-thin VC heat spreader in the above-mentioned embodiments of the present invention adopts a metal foil capillary structure 5, which has a lower thickness than the copper mesh, which is convenient for the development of ultra-thin VC, and the metal foil capillary structure 5 has better capillary force than the traditional copper mesh 3, which is beneficial for the VC to achieve greater heat dissipation power. At the same time, the metal foil capillary structure 5 is lower in cost than the traditional copper mesh.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An ultra-thin VC vapor chamber, comprising a VC lower cover and a VC upper cover disposed on the VC lower cover, wherein the VC upper cover is zigzag and a plurality of steam chambers are spaced apart between the zigzag VC upper cover and the VC lower cover, characterized in that: A metal foil capillary structure is provided between the VC upper cover and the VC lower cover. The lower portion of the metal foil capillary structure is in contact with the VC lower cover, and the upper portion of the metal foil capillary structure is in contact with a portion of the VC upper cover. The metal foil capillary structure includes a metal foil and evaporation reflow holes that penetrate the metal foil and are distributed in an array on the metal foil. A hollow support structure is provided on the metal foil, and the hollow support structure and the evaporation reflow holes are arranged in an alternating manner.

2. The ultra-thin VC vapor chamber according to claim 1, characterized in that: The metal foil is one or more of copper foil, stainless steel foil and titanium alloy foil.

3. The ultra-thin VC vapor chamber according to claim 1, characterized in that: The thickness of the metal foil is 5um-40um.

4. The ultra-thin VC vapor chamber according to claim 1, characterized in that: The diameter of the evaporation and reflow holes is 5um-100um, and the hole spacing of the evaporation and reflow holes is 50um-1mm.

5. The ultra-thin VC vapor chamber according to claim 1, characterized in that: The hollow support structure is a column point, and the column point and the evaporation reflux hole are arranged in a staggered manner.

6. The ultra-thin VC vapor chamber according to claim 5, characterized in that: The height of the column points is 3um-35um, and the spacing between the column points is 50um-1mm.

7. The ultra-thin VC vapor chamber according to claim 1, characterized in that: The hollow support structure is a micro-groove, two adjacent micro-grooves are arranged in a staggered manner, and the micro-grooves and the evaporation reflux holes are arranged in a staggered manner.

8. The ultra-thin VC vapor chamber according to claim 7, characterized in that: Micro groove breakpoints are arranged between the micro grooves.

9. The ultra-thin VC vapor chamber according to claim 7, characterized in that: The depth of the micro groove is 3um-35um, and the width of the micro groove is 10um-1mm.

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