Low-acid-value modified epoxy acrylic resin solder resist ink and preparation method thereof

Abstract

The invention provides low-acid-value modified epoxy acrylic resin solder resist ink and a preparation method thereof.The low-acid-value modified epoxy acrylic resin solder resist ink comprises a composition A and a composition B. The composition A comprises acrylic resin, low-acid-value modified epoxy acrylic resin, modified boron nitride, an acrylate monomer, a photoinitiator, an auxiliary and a solvent; the composition B comprises the following components in parts by mass: alicyclic epoxy resin, an auxiliary agent and a solvent; wherein the modified boron nitride is hexagonal boron nitride modified by an adamantane derivative. The low-acid-value modified epoxy acrylic resin solder resist ink is formed by compounding multiple components such as the low-acid-value modified epoxy acrylic resin and the modified boron nitride, so that multiple properties such as stability and dispersity of the ink and strength and adhesive force of a coating film are effectively improved, and the defects and problems in the prior art are solved; the method is of great significance to development of solder resist ink.

Description

Technical Field

[0001] The present invention relates to the field of solder resist ink, and in particular to a low-acid value modified epoxy acrylic resin solder resist ink and a preparation method thereof. Background Art

[0002] Epoxy acrylic resin is a key film-forming material for solder mask inks, combining the high adhesion and heat resistance of epoxy resin with the UV-curing properties of acrylic resin. The epoxy groups in its molecular structure provide excellent chemical stability and mechanical strength, while the acrylic double bonds impart light-curing properties, enabling the ink to cure rapidly under UV irradiation, improving production efficiency. Furthermore, this resin enhances the ink's adhesion to the PCB substrate and forms a dense protective layer that resists high solder temperatures, moisture, and chemical corrosion. Certain modified epoxy acrylic resins can also improve flexibility, reduce cure shrinkage, prevent coating cracking, and ensure reliable circuit insulation.

[0003] Epoxy acrylic resins are typically obtained by the polymerization reaction of epoxy resin and acrylic monomers. Due to factors such as the type of epoxy resin and the ratio of the reactants, most current epoxy acrylic resin products have high acid values ​​(greater than 80mgKOH / g). While a high acid value can improve system transparency, the large number of hydrophilic groups can affect the water resistance and stability of the cured coating. Furthermore, the stability of the ink system cannot be effectively guaranteed after long-term storage.

[0004] In addition, existing solder mask ink products still have problems such as high content of inorganic fillers, poor bonding strength with resins, insufficient film performance, and poor storage effect. After conventional modification of the inorganic fillers, the overall performance improvement of the coating is still not ideal, and it is difficult to meet the ever-increasing performance requirements of products in this field, which affects the further promotion and application of solder mask inks.

[0005] In summary, there is an urgent need to develop a new technical solution to solve the problems existing in the existing technology. Summary of the Invention

[0006] The present invention provides a low-acid value modified epoxy acrylic resin solder resist ink and a preparation method thereof. The low-acid value modified epoxy acrylic resin solder resist ink is compounded from multiple components such as a low-acid value modified epoxy acrylic resin and modified boron nitride. The low-acid value modified epoxy acrylic resin solder resist ink effectively improves the stability and dispersibility of the ink as well as the strength and adhesion of the coating film, thereby solving the deficiencies and problems in the prior art and having important significance for the development of solder resist inks.

[0007] One object of the present invention is to provide a low acid value modified epoxy acrylic resin solder resist ink, wherein the low acid value modified epoxy acrylic resin solder resist ink comprises composition A and composition B.

[0008] The composition A comprises the following components in parts by weight:

[0009] 5-10 parts of acrylic resin

[0010] 10-30 parts of low acid value modified epoxy acrylic resin

[0011]

[0012] The composition B comprises the following components in parts by weight:

[0013] 1-10 parts of cycloaliphatic epoxy resin

[0014] 1-10 parts of additives

[0015] 1-10 parts of solvent;

[0016] in,

[0017] The modified boron nitride is hexagonal boron nitride modified by an adamantane derivative.

[0018] Furthermore, the modified boron nitride is obtained by reacting a silane coupling agent with hexagonal boron nitride, and then reacting with an epoxy resin and an adamantane derivative.

[0019] Furthermore, the epoxy resin is a multifunctional epoxy resin, the silane coupling agent is an aminosilane coupling agent, and the adamantane derivative is an amino-containing adamantane derivative.

[0020] Preferably, the multifunctional epoxy resin is pentaerythritol glycidyl ether.

[0021] Preferably, the aminosilane coupling agent is KH-550 (γ-aminopropyltriethoxysilane).

[0022] Preferably, the adamantane derivative is selected from adamantaneamine or 3-aminoadamantan-1-ol.

[0023] Furthermore, the acid value of the low-acid-value modified epoxy acrylic resin is ≤40 mgKOH / g.

[0024] Furthermore, the acrylate monomer is an acrylate having a monofunctional group or a multifunctional group.

[0025] Furthermore, the auxiliary agent is selected from one or more of a pigment, a leveling agent, a defoaming agent, a toughening agent, a dispersant, and an ultraviolet absorber.

[0026] Furthermore, the preparation method of the low acid value modified epoxy acrylic resin solder resist ink comprises the following steps:

[0027] S1, mixing bisphenol epoxy resin and initiator and heating them to react, then adding vinyl monomer and heating them to react to obtain modified epoxy acrylic resin;

[0028] S2, mixing hexagonal boron nitride and a silane coupling agent, heating for reaction, and then further mixing with an epoxy resin to obtain an intermediate product;

[0029] S3, mixing the intermediate product and an adamantane derivative, and heating the mixture for reaction to obtain modified boron nitride;

[0030] S4. Mix acrylic resin, low-acid value modified epoxy acrylic resin, modified boron nitride, acrylate monomer, photoinitiator, additive and solvent to obtain composition A; mix alicyclic epoxy resin, additive and solvent to obtain composition B; then mix the composition A and composition B to obtain low-acid value modified epoxy acrylic resin solder resist ink.

[0031] Further, in step S1, the vinyl monomer comprises acrylic acid, alkyl acrylate and styrene in a mass ratio of (1-4):(2-5):(2-5);

[0032] The mass ratio of the bisphenol epoxy resin to the vinyl monomer is (0.8-1.2):1.

[0033] Furthermore, in step S2, the mass ratio of the hexagonal boron nitride to the epoxy resin is (0.5-2):1.

[0034] Furthermore, in step S3, the mass ratio of the intermediate product to the adamantane derivative is (4-8):1.

[0035] The present invention has the following beneficial effects:

[0036] The present invention provides a low-acid modified epoxy acrylic resin solder mask ink comprising a low-acid modified epoxy acrylic resin, modified boron nitride, and other components. The low-acid modified epoxy acrylic resin is prepared by optimizing the ratio of epoxy resin to acrylic monomer, as well as the reaction temperature and time, to obtain an acid value below 40 mgKOH / g. This significantly improves the ink's stability and the film's water resistance, enhancing its universal applicability in various environments. The modified boron nitride is boron nitride modified with a silane coupling agent to introduce amino groups, and then reacted with a multifunctional epoxy resin to coat the surface with an epoxy resin layer. Finally, an epoxy group and an amino-containing adamantane derivative are reacted to graft adamantane groups. On the one hand, the resulting product has a large number of structures such as ether bonds and ester groups, and has better compatibility with the main resin, which is conducive to improving the stability and uniformity of the ink. On the other hand, a large number of active functional groups such as epoxy groups and hydroxyl groups are also introduced into the modified boron nitride, which can cross-link with other groups during curing and combine through hydrogen bonds, thereby enhancing the bonding strength between different components and promoting the improvement of the adhesion, toughness and strength of the film layer. The introduced adamantane groups also help to further improve the mechanical properties of the film layer.

[0037] The present invention also uses alicyclic epoxy resin as a component, reduces the content of benzene rings, and after compounding with adamantane groups, can further improve the comprehensive performance of the ink, especially improve the anti-yellowing effect of the film layer. DETAILED DESCRIPTION

[0038] In order to more clearly illustrate the technical solutions of the present invention, the following examples are given. Unless otherwise stated, the raw materials, reactions and post-processing methods mentioned in the examples are common raw materials on the market and technical methods well known to those skilled in the art.

[0039] The terms "preferred," "preferably," "more preferred," and the like, used herein, refer to embodiments of the invention that may provide certain benefits under certain circumstances. However, other embodiments may also be preferred under the same or other circumstances. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.

[0040] It should be understood that, except in any operating examples, or where otherwise indicated, all numbers expressing, for example, quantities of ingredients used in the specification and claims are to be understood as being modified in all instances by the term "about." Accordingly, unless indicated to the contrary, the numerical parameters set forth in the following specification and appended claims are approximations that may vary depending upon the desired properties to be obtained by the present invention.

[0041] The acrylic resin in the embodiment of the present invention is Sartomer CN104 NS.

[0042] The acrylate monomer in the embodiment of the present invention is methyl acrylate.

[0043] The photoinitiator in the embodiment of the present invention is ITX and UVI-6976 in a mass ratio of 1:1.

[0044] In the embodiment of the present invention, the auxiliary agent 1 is a pigment (titanium dioxide) and a leveling agent (isopropyl alcohol) in a mass ratio of 4:1; the auxiliary agent 2 is a leveling agent (isopropyl alcohol).

[0045] The solvent in the embodiment of the present invention is a divalent acid ester.

[0046] The alicyclic epoxy resin in the embodiment of the present invention is 4,5-epoxytetrahydrophthalic acid diglycidyl ester.

[0047] The first initiator and the second initiator in the embodiment of the present invention are both BPO (benzoyl peroxide).

[0048] The “parts” in the embodiments of the present invention refer to parts by mass.

[0049] Example 1

[0050] A low acid value modified epoxy acrylic resin solder resist ink, the low acid value modified epoxy acrylic resin solder resist ink comprising composition A and composition B,

[0051] The composition A comprises the following components in parts by weight:

[0052]

[0053] The composition B comprises the following components in parts by weight:

[0054] 5 parts of cycloaliphatic epoxy resin

[0055] 1 part of additive 2

[0056] 5 parts solvent.

[0057] The preparation method of the low acid value modified epoxy acrylic resin solder resist ink comprises the following steps:

[0058] S1. Add E-44 epoxy resin and the first initiator to n-butanol as solvent, react at 90°C for 0.5h, then add acrylic acid, butyl acrylate, styrene and the second initiator, react at 110°C for 5h, remove the solvent to obtain a low-acid-value modified epoxy acrylic resin with an acid value of 31.37mgKOH / g;

[0059] The mass ratio of E-44 epoxy resin, the first initiator, acrylic acid, butyl acrylate, styrene and the second initiator is 3:0.01:0.9:1:1:0.16;

[0060] S2. Using ethanol and water in a volume ratio of 5:1 as solvent, add hexagonal boron nitride and KH-550 in a mass ratio of 1:2, reflux in an oil bath at 90°C for 12 hours, filter, wash, and dry to obtain a solid product;

[0061] The solid product, pentaerythritol glycidyl ether and DMAP (4-dimethylaminopyridine) were mixed in NMP as solvent (the mass ratio of hexagonal boron nitride, pentaerythritol glycidyl ether and DMAP was 0.7:1:0.01), reacted at 95° C. for 6 h, and filtered and dried to obtain an intermediate product;

[0062] S3. Using NMP as solvent, the intermediate product, 3-aminoadamantan-1-ol, and DMAP in a mass ratio of 5:1:0.01 were mixed, reacted at 95° C. for 6 h, and filtered and dried to obtain modified boron nitride;

[0063] S4. According to the above-mentioned mass parts, acrylic resin, low-acid value modified epoxy acrylic resin, modified boron nitride, acrylate monomer, photoinitiator, additive and solvent are mixed to obtain composition A; alicyclic epoxy resin, additive and solvent are mixed to obtain composition B; then the composition A and composition B are mixed, stirred and dispersed evenly, and then ground to a fineness of ≤20μm and passed through a 500-mesh sieve to obtain a low-acid value modified epoxy acrylic resin solder resist ink.

[0064] Example 2

[0065] A low acid value modified epoxy acrylic resin solder resist ink, the low acid value modified epoxy acrylic resin solder resist ink comprising composition A and composition B,

[0066] The composition A comprises the following components in parts by weight:

[0067]

[0068] The composition B comprises the following components in parts by weight:

[0069] 8 parts of cycloaliphatic epoxy resin

[0070] 2 parts of additive 2

[0071] 7 parts solvent.

[0072] The preparation method of the low acid value modified epoxy acrylic resin solder resist ink comprises the following steps:

[0073] S1. Add E-44 epoxy resin and the first initiator to n-butanol as solvent, react at 90°C for 0.5h, then add acrylic acid, butyl acrylate, styrene and the second initiator, react at 110°C for 5h, remove the solvent to obtain a low-acid-value modified epoxy acrylic resin with an acid value of 31.37mgKOH / g;

[0074] The mass ratio of E-44 epoxy resin, the first initiator, acrylic acid, butyl acrylate, styrene and the second initiator is 3:0.01:0.9:1:1:0.16;

[0075] S2. Using ethanol and water in a volume ratio of 5:1 as solvent, add hexagonal boron nitride and KH-550 in a mass ratio of 1:2, reflux in an oil bath at 90°C for 12 hours, filter, wash, and dry to obtain a solid product;

[0076] The solid product, pentaerythritol glycidyl ether and DMAP were mixed in NMP as solvent (the mass ratio of hexagonal boron nitride, pentaerythritol glycidyl ether and DMAP was 0.7:1:0.01), reacted at 95° C. for 6 h, and filtered and dried to obtain an intermediate product;

[0077] S3. Using NMP as solvent, the intermediate product, 3-aminoadamantan-1-ol, and DMAP in a mass ratio of 5:1:0.01 were mixed, reacted at 95° C. for 6 h, and filtered and dried to obtain modified boron nitride;

[0078] S4. According to the above-mentioned mass parts, acrylic resin, low-acid value modified epoxy acrylic resin, modified boron nitride, acrylate monomer, photoinitiator, additive and solvent are mixed to obtain composition A; alicyclic epoxy resin, additive and solvent are mixed to obtain composition B; then the composition A and composition B are mixed, stirred and dispersed evenly, and then ground to a fineness of ≤20μm and passed through a 500-mesh sieve to obtain a low-acid value modified epoxy acrylic resin solder resist ink.

[0079] Example 3

[0080] A low acid value modified epoxy acrylic resin solder resist ink, the low acid value modified epoxy acrylic resin solder resist ink comprising composition A and composition B,

[0081] The composition A comprises the following components in parts by weight:

[0082]

[0083] The composition B comprises the following components in parts by weight:

[0084] 10 parts of alicyclic epoxy resin

[0085] 2-3 parts of additives

[0086] 10 parts solvent.

[0087] The preparation method of the low acid value modified epoxy acrylic resin solder resist ink comprises the following steps:

[0088] S1. Add E-44 epoxy resin and the first initiator to n-butanol as solvent, react at 90°C for 0.5h, then add acrylic acid, butyl acrylate, styrene and the second initiator, react at 110°C for 5h, remove the solvent to obtain a low-acid-value modified epoxy acrylic resin with an acid value of 31.37mgKOH / g;

[0089] The mass ratio of E-44 epoxy resin, the first initiator, acrylic acid, butyl acrylate, styrene and the second initiator is 3:0.01:0.9:1:1:0.16;

[0090] S2. Using ethanol and water in a volume ratio of 5:1 as solvent, add hexagonal boron nitride and KH-550 in a mass ratio of 1:2, reflux in an oil bath at 90°C for 12 hours, filter, wash, and dry to obtain a solid product;

[0091] The solid product, pentaerythritol glycidyl ether and DMAP were mixed in NMP as solvent (the mass ratio of hexagonal boron nitride, pentaerythritol glycidyl ether and DMAP was 0.7:1:0.01), reacted at 95° C. for 6 h, and filtered and dried to obtain an intermediate product;

[0092] S3. Using NMP as solvent, the intermediate product, 3-aminoadamantan-1-ol, and DMAP in a mass ratio of 5:1:0.01 were mixed, reacted at 95° C. for 6 h, and filtered and dried to obtain modified boron nitride;

[0093] S4. According to the above-mentioned mass parts, acrylic resin, low-acid value modified epoxy acrylic resin, modified boron nitride, acrylate monomer, photoinitiator, additive and solvent are mixed to obtain composition A; alicyclic epoxy resin, additive and solvent are mixed to obtain composition B; then the composition A and composition B are mixed, stirred and dispersed evenly, and then ground to a fineness of ≤20μm and passed through a 500-mesh sieve to obtain a low-acid value modified epoxy acrylic resin solder resist ink.

[0094] Comparative Example 1

[0095] A low acid value modified epoxy acrylic resin solder resist ink. The difference between this comparative example and Example 1 is that steps S2-S3 are modified as follows:

[0096] Using ethanol and water in a volume ratio of 5:1 as solvent, hexagonal boron nitride and KH-560 (γ-glycidyloxypropyltrimethoxysilane) in a mass ratio of 1:2 were added, and the mixture was reacted at 70°C for 12 hours. After filtration, washing, and drying, a solid product was obtained.

[0097] Using NMP as solvent, the solid product, 3-aminoadamantan-1-ol, and DMAP in a mass ratio of 5:1:0.01 were mixed, reacted at 95° C. for 6 h, and filtered and dried to obtain modified boron nitride;

[0098] The amounts of other ingredients and the preparation method are the same as those in Example 1.

[0099] Comparative Example 2

[0100] A low acid value modified epoxy acrylic resin solder resist ink. The difference between this comparative example and Example 1 is that step S3 is modified as follows:

[0101] Using NMP as solvent, the intermediate product, lauric acid and DMAP in a mass ratio of 5:1:0.01 were mixed, reacted at 95° C. for 6 h, and filtered and dried to obtain modified boron nitride;

[0102] The amounts of other ingredients and the preparation method are the same as those in Example 1.

[0103] Comparative Example 3

[0104] A low acid value modified epoxy acrylic resin solder resist ink. The difference between this comparative example and Example 1 is that step S1 is modified as follows:

[0105] Using n-butanol as solvent, E-44 epoxy resin and the first initiator were added, and the reaction was carried out at 90°C for 0.5 h. Then, acrylic acid, butyl acrylate, styrene, and the second initiator were added, and the reaction was carried out at 110°C for 3 h. The solvent was removed to obtain a modified epoxy acrylic resin with an acid value of 84.65 mgKOH / g.

[0106] The mass ratio of E-44 epoxy resin, the first initiator, acrylic acid, butyl acrylate, styrene and the second initiator is 7:0.02:1:1:1:0.2;

[0107] The amounts of other ingredients and the preparation method are the same as those in Example 1.

[0108] Test Case

[0109] The performance tests were performed on the solder resist ink samples prepared in Examples 1-3 and Comparative Examples 1-3.

[0110] The test method is as follows:

[0111] Stability test: Take 200mL of each solder mask ink sample, place it in a transparent container and seal it, place it at 50℃ for 30 days, and observe whether there is any change in appearance after returning to room temperature.

[0112] The solder resist inks prepared in the examples and comparative examples were applied to the PCB boards respectively and light cured for 1 h (wavelength 395 nm, intensity 25.0 mW / cm2 The film was then cured at 150°C for 1 hour to form a 0.7 mm thick film.

[0113] Adhesion: Use a needle to make an X-shape on the film. Then, apply cellophane tape to the cuts and pull. Evaluate based on the following criteria:

[0114] Qualified: not torn off;

[0115] Unqualified: A lot of tearing off.

[0116] Bending resistance: Bend the sample 180° with the solder mask film on the outside, then return it to a horizontal position. Repeat this process five times and evaluate the sample based on the following criteria:

[0117] Qualified: No cracks on the film;

[0118] Unqualified: There are cracks on the film.

[0119] Water resistance: Immerse the PCB coated with solder mask ink in deionized water at 20°C. After 120 hours, remove the PCB and evaluate the coating's condition and adhesion. The criteria are as follows:

[0120] Pass: No change or slight change was found;

[0121] Unqualified: There is swelling or shedding on the coating film.

[0122] Acid resistance: Immerse the PCB coated with solder mask ink in a 10% sulfuric acid solution at 20°C. After 3 hours, remove the PCB and evaluate the coating's condition and adhesion. The criteria are as follows:

[0123] Pass: No change or slight change was found;

[0124] Unqualified: There is swelling or shedding on the coating film.

[0125] Heat resistance: Thermal shock performance test is conducted according to the method in IPC-SM-840E. The judgment criteria are as follows:

[0126] Qualified: no bubbles or cracks;

[0127] Unqualified: bubbles and cracks appear.

[0128] Anti-yellowing performance: The reflectivity of the sample was measured after reflow soldering for three times. The reflow soldering conditions were: 190℃*3min, 220℃*2min, 240℃*3min, 280℃*4min, for a total of 12min.

[0129] The test instrument used is an X-RITE colorimeter model SP62. The larger the △B value, the more serious the yellowing.

[0130] The test results are shown in Table 1.

[0131] Table 1 Performance test results

[0132]

[0133] The above test results show that the low-acid-value modified epoxy acrylic resin solder mask ink prepared in the present invention exhibits excellent stability, adhesion, flex resistance, solvent resistance, and other properties, as well as strong yellowing resistance, resulting in good overall performance. Comparative Examples 1-2, which replaced the modified boron nitride, resulted in reduced bonding between ink components and the performance of the modified boron nitride, leading to varying degrees of decrease in the adhesion, strength, and yellowing resistance of the film. The epoxy acrylic resin in Comparative Example 3 has a higher acid value, resulting in defects in the water resistance and acid resistance of the film. Furthermore, the increased acid value also has a certain impact on the stability of the ink and the yellowing resistance of the film, resulting in relatively poor overall performance.

[0134] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced therein.

[0135] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A low acid value modified epoxy acrylic resin solder resist ink, characterized in that: The low acid value modified epoxy acrylic resin solder resist ink comprises composition A and composition B. The composition A comprises the following components in parts by weight: The composition B comprises the following components in parts by weight: 1-10 parts of cycloaliphatic epoxy resin 1-10 parts of additives 1-10 parts of solvent; in, The modified boron nitride is hexagonal boron nitride modified by an adamantane derivative.

2. The low acid value modified epoxy acrylic resin solder resist ink according to claim 1, characterized in that: The modified boron nitride is obtained by reacting a silane coupling agent with hexagonal boron nitride, and then reacting with epoxy resin and adamantane derivatives.

3. The low acid value modified epoxy acrylic resin solder resist ink according to claim 2, characterized in that: The epoxy resin is a multifunctional epoxy resin, the silane coupling agent is an aminosilane coupling agent, and the adamantane derivative is an amino-containing adamantane derivative.

4. The low acid value modified epoxy acrylic resin solder resist ink according to claim 1, characterized in that: The acid value of the low-acid-value modified epoxy acrylic resin is ≤40 mgKOH / g.

5. The low acid value modified epoxy acrylic resin solder resist ink according to claim 1, characterized in that: The acrylate monomer is an acrylate having a monofunctional group or a multifunctional group.

6. The low acid value modified epoxy acrylic resin solder resist ink according to claim 1, characterized in that: The auxiliary agent is selected from one or more of a pigment, a leveling agent, a defoaming agent, a toughening agent, a dispersant, and an ultraviolet absorber.

7. The low acid value modified epoxy acrylic resin solder resist ink according to claim 1, characterized in that: The preparation method of the low acid value modified epoxy acrylic resin solder resist ink comprises the following steps: S1, mixing bisphenol epoxy resin and initiator and heating them to react, then adding vinyl monomer and heating them to react to obtain modified epoxy acrylic resin; S2, mixing hexagonal boron nitride and a silane coupling agent, heating for reaction, and then further mixing with an epoxy resin to obtain an intermediate product; S3, mixing the intermediate product and an adamantane derivative, and heating the mixture for reaction to obtain modified boron nitride; S4. Mix acrylic resin, low-acid value modified epoxy acrylic resin, modified boron nitride, acrylate monomer, photoinitiator, additive and solvent to obtain composition A; mix alicyclic epoxy resin, additive and solvent to obtain composition B; then mix the composition A and composition B to obtain low-acid value modified epoxy acrylic resin solder resist ink.

8. The low acid value modified epoxy acrylic resin solder resist ink according to claim 7, characterized in that: In step S1, the vinyl monomer comprises acrylic acid, alkyl acrylate and styrene in a mass ratio of (1-4):(2-5):(2-5); The mass ratio of the bisphenol epoxy resin to the vinyl monomer is (0.8-1.2):

1.

9. The low acid value modified epoxy acrylic resin solder resist ink according to claim 7, characterized in that: In step S2, the mass ratio of the hexagonal boron nitride to the epoxy resin is (0.5-2):

1.

10. The low acid value modified epoxy acrylic resin solder resist ink according to claim 7, characterized in that: In step S3, the mass ratio of the intermediate product to the adamantane derivative is (4-8):1.

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