Liquid cooling radiator and electronic equipment

Abstract

The embodiment of the invention provides a liquid cooling radiator and electronic equipment, and relates to the field of liquid cooling heat dissipation. The liquid cooling radiator comprises a liquid cooling piece. The liquid cooling piece comprises a flow channel wall used for forming a flow channel in an enclosing mode, and the flow channel is used for allowing a liquid cooling medium to flow. The flow channel wall comprises an insulating wall and a plurality of conductive parts arranged at intervals, the conductive parts of the flow channel wall are connected through the insulating wall, and the plurality of conductive parts form a frequency selective surface structure. Thus, the frequency selective surface structure can play a role in filtering interference electromagnetic waves, interference on a communication device arranged on the side of the liquid cooling radiator can be reduced, and the communication experience of the electronic equipment can be improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of liquid cooling technology, and in particular to a liquid cooling radiator and electronic equipment. Background Art

[0002] When mobile phones, tablet computers and other electronic devices are in operation, they often generate a lot of heat. In order to improve the heat dissipation performance of the electronic devices, some electronic devices may include liquid cooling radiators.

[0003] In the related art, an electronic device may include a liquid-cooled radiator and a communication device disposed on the side of the liquid-cooled radiator. The liquid-cooled radiator includes a liquid-cooling element having a flow channel for cooling liquid to flow therein.

[0004] However, in the related art, the communication of the communication device arranged on the side of the liquid-cooled radiator is easily interfered, resulting in a poor communication experience of the electronic device. Summary of the Invention

[0005] An embodiment of the present application provides a liquid-cooled radiator and an electronic device. The frequency selective surface structure formed on the flow channel wall of the liquid-cooled radiator can filter out interfering electromagnetic waves, thereby reducing interference to communication devices arranged on the side of the liquid-cooled radiator, thereby improving the communication experience of the electronic device.

[0006] On the one hand, an embodiment of the present application provides a liquid-cooled radiator, which includes a liquid cooling element. The liquid cooling element includes a flow channel wall for enclosing a flow channel, and the flow channel is used to supply a liquid cooling medium to flow. The flow channel wall includes an insulating wall and a plurality of conductive parts arranged at intervals. The conductive parts of the flow channel wall are connected by the insulating wall, and the plurality of conductive parts form a frequency selective surface structure. Among them, the frequency selective surface structure is a two-dimensional periodic array structure with a specific frequency selection effect, which can effectively control the transmission and reflection of the incident electromagnetic wave. The frequency selective surface structure can also be called a spatial filter.

[0007] The liquid-cooled radiator provided in the embodiment of the present application has a frequency selective surface structure for filtering electromagnetic waves within a preset frequency range. The frequency selective surface structure formed by the conductive member of the flow channel wall can be used to filter the interference electromagnetic waves generated by the device arranged at the liquid-cooled radiator, so as to suppress the interference electromagnetic waves from propagating to the communication device arranged on the side of the liquid-cooled radiator. In this way, the interference of the interference electromagnetic waves generated by the device arranged at the liquid-cooled radiator on the communication device can be reduced, thereby improving the communication experience of the electronic device. In addition, the frequency selective surface structure is integrated on the flow channel wall for forming the flow channel, and has little impact on the arrangement of devices in the installation space of the electronic device. In addition, after the frequency selective surface structure is integrated on the flow channel wall of the liquid-cooled radiator, the setting of some shielding structures for shielding interference electromagnetic waves in the installation space of the electronic device can be reduced, thereby saving space in the installation space.

[0008] In a possible embodiment, the flow channel wall includes a first side wall segment, two ends of the first side wall segment are spaced apart in a first direction, and the first side wall segment includes a conductive member. The conductive member of the first side wall segment forms a frequency selective surface structure.

[0009] In this way, it is beneficial to reflect the interfering electromagnetic waves in the second direction, and it is beneficial to reduce the interference of the interfering electromagnetic waves on the communication devices arranged on the side of the liquid-cooled radiator in the second direction.

[0010] In one possible embodiment, the flow channel wall includes multiple layers of first side wall segments spaced apart along a second direction, and the conductive elements of each layer of the first side wall segments are formed with a frequency selective surface structure.

[0011] In this way, the multiple layers of first sidewall segments can form a multi-layer frequency selective surface structure spaced apart in the second direction, thereby enabling multi-layer reflection of interfering electromagnetic waves in the second direction, thereby improving the filtering effect of interfering electromagnetic waves. In addition, the interfering electromagnetic waves can be caused to oscillate between the different layers of frequency selective surface structures spaced apart in the second direction, thereby attenuating the interfering electromagnetic waves, thereby facilitating the reduction of interference from the interfering electromagnetic waves on communication devices disposed to the sides of the liquid-cooled radiator. Furthermore, after the interfering electromagnetic waves are oscillated and attenuated by the multiple layers of frequency selective surface structures spaced apart in the second direction, they can also reduce interference from the interfering electromagnetic waves on communication devices disposed to the sides of the liquid-cooled radiator in the first direction. Furthermore, when the interfering electromagnetic waves propagate between the multiple layers of frequency selective surface structures spaced apart in the second direction, the multiple layers of frequency selective surface structures spaced apart in the second direction can simultaneously suppress the propagation of the interfering electromagnetic waves to both sides of the second direction, thereby facilitating the simultaneous reduction of interference from the interfering electromagnetic waves on communication devices disposed to both sides of the liquid-cooled radiator in the second direction.

[0012] In a possible embodiment, the flow channel wall includes a second side wall segment, two ends of the second side wall segment are spaced apart in the second direction, and the second side wall segment includes a conductive member. The conductive member of the second side wall segment forms a frequency selective surface structure.

[0013] In this way, it is beneficial to reflect the interfering electromagnetic waves in the first direction, and it is beneficial to reduce the interference of the interfering electromagnetic waves on the communication devices arranged on the side of the liquid-cooled radiator in the first direction.

[0014] In a possible implementation, the flow channel wall includes a plurality of second side wall segments spaced apart along the first direction, and the conductive element of each layer of the second side wall segment is formed with a frequency selective surface structure.

[0015] In this way, the multiple layers of second sidewall segments can form a multi-layer frequency selective surface structure spaced apart in the first direction, thereby enabling multi-layer reflection of interfering electromagnetic waves in the first direction, thereby improving the filtering effect of interfering electromagnetic waves. In addition, the interfering electromagnetic waves can be caused to oscillate between the different layers of frequency selective surface structures spaced apart in the first direction, thereby attenuating the interfering electromagnetic waves, thereby facilitating the reduction of interference from the interfering electromagnetic waves on communication devices disposed to the sides of the liquid-cooled radiator. Furthermore, after the interfering electromagnetic waves are oscillated and attenuated by the multiple layers of frequency selective surface structures spaced apart in the first direction, they can also reduce interference from the interfering electromagnetic waves on communication devices disposed to the sides of the liquid-cooled radiator in the second direction. Furthermore, when the interfering electromagnetic waves propagate between the multiple layers of frequency selective surface structures spaced apart in the first direction, the multiple layers of frequency selective surface structures spaced apart in the first direction can simultaneously suppress the propagation of the interfering electromagnetic waves to both sides of the first direction, thereby facilitating the simultaneous reduction of interference from the interfering electromagnetic waves on communication devices disposed to both sides of the liquid-cooled radiator in the first direction.

[0016] In a possible implementation, the length of the conductive member is greater than or equal to L1 and less than or equal to L2. c is the speed of light in a vacuum, f1 is the first preset frequency, f2 is the second preset frequency, Er is the relative dielectric constant of the liquid cooling medium, and the frequency selective surface structure is used to filter electromagnetic waves with a frequency greater than or equal to the second preset frequency and less than or equal to the first preset frequency.

[0017] In this way, the conductive part can better reflect electromagnetic waves with a quarter wavelength close to the length of the conductive part when propagating in the liquid-cooling medium. The length of the conductive part can be designed according to the frequency range of the electromagnetic waves that need to be filtered by the frequency selective surface structure, so as to achieve more accurate filtering of interfering electromagnetic waves by the frequency selective surface structure, and not easily affect the communication device's reception and transmission of target electromagnetic waves.

[0018] In a possible implementation, the plurality of conductive members include a first conductive member and a second conductive member, and the length of the first conductive member is smaller than the length of the second conductive member.

[0019] In this way, the frequency selective surface structure formed by the flow channel wall can better reflect a wider range of electromagnetic waves, which is conducive to filtering interfering electromagnetic waves in different frequency ranges, so that the frequency selective surface structure formed by the flow channel wall can filter a wider range of interfering electromagnetic waves.

[0020] In a possible implementation, the length of the conductive member is greater than or equal to 0.14 cm and less than or equal to 7.5 cm.

[0021] In this way, when the relative dielectric constant of the liquid cooling medium is in the range of 4 to 78, the frequency selective surface structure can achieve better filtering of electromagnetic waves in the frequency range of 0.5GHz to 6GHz, which is beneficial to filtering the interference electromagnetic waves generated in electronic equipment that affect the communication device's reception and transmission of target electromagnetic waves, and has little impact on the communication device's reception and transmission of target electromagnetic waves.

[0022] In a possible implementation manner, the conductive member is embedded in the insulating wall.

[0023] This makes it easier to shape the channel walls. Furthermore, the conductive element does not affect the flow of the liquid cooling medium. Furthermore, the conductive element is less likely to come into contact with the liquid cooling medium or components outside the liquid cooling element, making it less likely to cause circuit failures due to accidental contact with the conductive element.

[0024] In one possible embodiment, the liquid-cooled radiator further includes a drive device. The drive device is disposed on the liquid-cooling element, with the inlet end of the drive device connected to the outlet end of the flow channel, and the outlet end of the drive device connected to the inlet end of the flow channel. The drive device is configured to drive the liquid cooling medium to circulate within the flow channel. The frequency selective surface structure is configured to filter electromagnetic waves generated by the drive device.

[0025] In this way, the liquid-cooled radiator has good heat dissipation performance and can dissipate heat in a long-lasting and efficient manner, and the interference of electromagnetic waves generated by the driving device on the communication device can be reduced.

[0026] In a possible implementation, at least one side of the driving device in the first direction is provided with a frequency selective surface structure.

[0027] In this way, the frequency selective surface structure arranged on the side of the driving device in the first direction can reflect the electromagnetic waves generated by the driving device in the first direction, which is beneficial to reduce the interference of the electromagnetic waves generated by the driving device on the communication device arranged on the side of the liquid-cooled radiator.

[0028] In a possible implementation, at least one side of the driving device in the second direction is provided with a frequency selective surface structure.

[0029] In this way, the frequency selective surface structure arranged on the side of the driving device in the second direction can reflect the electromagnetic waves generated by the driving device in the second direction, which is beneficial to reduce the interference of the electromagnetic waves generated by the driving device on the communication device arranged on the side of the liquid-cooled radiator.

[0030] Another embodiment of the present application provides an electronic device including a communication device and a liquid cooling radiator according to any of the above embodiments. The communication device is provided on at least one side of the liquid cooling radiator in a first direction, or the communication device is provided on at least one side of the liquid cooling radiator in a second direction.

[0031] In a possible embodiment, in the first direction, a communication device is provided on at least one side of the liquid-cooled radiator, and a frequency selective surface structure of the liquid-cooled radiator is provided between the communication device provided on at least one side of the liquid-cooled radiator and the driving device of the liquid-cooled radiator.

[0032] In this way, the frequency selective surface structure between the communication device and the driving device located on the side of the liquid-cooled radiator in the first direction can suppress the electromagnetic waves generated by the driving device from propagating toward the communication device located on the side of the liquid-cooled radiator in the first direction, thereby reducing the interference of the electromagnetic waves generated by the driving device on the communication device located on the side of the liquid-cooled radiator in the first direction.

[0033] In a possible embodiment, in the second direction, a communication device is provided on at least one side of the liquid-cooled radiator, and a frequency selective surface structure of the liquid-cooled radiator is provided between the communication device provided on at least one side of the liquid-cooled radiator and the driving device of the liquid-cooled radiator.

[0034] In this way, the frequency selective surface structure between the communication device and the driving device located on the side of the liquid-cooled radiator in the second direction can suppress the electromagnetic waves generated by the driving device from propagating toward the communication device located on the side of the liquid-cooled radiator in the second direction, thereby reducing the interference of the electromagnetic waves generated by the driving device on the communication device located on the side of the liquid-cooled radiator in the second direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of an electronic device provided in an embodiment of the present application;

[0036] Figure 2 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0037] Figure 3 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0038] Figure 4 A schematic cross-sectional view of an electronic device provided in an embodiment of the present application;

[0039] Figure 5 A schematic cross-sectional view of a liquid cooling radiator provided in an embodiment of the present application;

[0040] Figure 6 A schematic cross-sectional view of a flow channel wall provided in an embodiment of the present application;

[0041] Figure 7 for Figure 6 Another cross-sectional schematic diagram of the flow channel wall in FIG;

[0042] Figure 8 A schematic cross-sectional view of another flow channel wall provided in an embodiment of the present application;

[0043] Figure 9 for Figure 8 Another cross-sectional schematic diagram of the flow channel wall in FIG;

[0044] Figure 10 A schematic cross-sectional view of another flow channel wall provided in an embodiment of the present application;

[0045] Figure 11 A schematic cross-sectional view of another flow channel wall provided in an embodiment of the present application;

[0046] Figure 12 for Figure 11 Another cross-sectional schematic diagram of the flow channel wall in FIG;

[0047] Figure 13 A schematic cross-sectional view of another flow channel wall provided in an embodiment of the present application;

[0048] Figure 14 for Figure 13 Another cross-sectional schematic diagram of the flow channel wall in FIG;

[0049] Figure 15 Schematic diagram of the intensity of interfering electromagnetic waves at a liquid cooling radiator in the prior art;

[0050] Figure 16 A schematic diagram of the intensity of interfering electromagnetic waves at a liquid cooling radiator provided in an embodiment of the present application;

[0051] Figure 17 A schematic diagram comparing the scattering (S) parameters of a liquid-cooled radiator provided in an embodiment of the present application and two comparative examples.

[0052] Description of reference numerals:

[0053] 10. Housing; 11. Middle frame; 12. Back cover;

[0054] 20. Display screen; 30. Liquid cooling radiator; 41. First communication device; 42. Second communication device; 43. Third communication device;

[0055] 100. Liquid cooling parts;

[0056] 110, flow channel wall;

[0057] 111. Insulating wall; 112. Conductive member; 113. First side wall segment; 114. Second side wall segment;

[0058] 120, runner;

[0059] 200, driving device;

[0060] x, first direction; y, second direction. DETAILED DESCRIPTION

[0061] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0062] The present application provides an electronic device, which may include but is not limited to a mobile phone, a laptop computer, a portable Android device (PAD), an in-vehicle device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical care, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, etc. The present application takes the electronic device as a mobile phone as an example for description.

[0063] Figure 1 A schematic diagram of an electronic device provided in an embodiment of the present application.

[0064] In an embodiment of the present application, the electronic device may include a housing 10 and a display screen 20. The display screen 20 is disposed on one side of the housing 10 in the thickness direction. A mounting space for mounting components may be defined between the display screen 20 and the housing 10. The thickness direction of the housing 10 is the same as the thickness direction of the electronic device.

[0065] The electronic device may further include a main board (not shown), which is disposed in the installation space. Electronic devices (not shown) may be disposed on the main board, and the display screen 20 may be electrically connected to the main board.

[0066] For example, the electronic components provided on the mainboard may include but are not limited to a processor, a memory, and the like.

[0067] For example, the housing 10 may include a middle frame 11 and a back cover 12. The back cover 12 covers one side of the middle frame 11 in the thickness direction. The display 20 is disposed on the other side of the middle frame 11 in the thickness direction. The display 20, the middle frame 11, and the back cover 12 enclose a mounting space. The thickness direction of the middle frame 11 is the same as the thickness direction of the housing 10.

[0068] In some examples, the electronic device may be a non-foldable device, for example, the electronic device may be a candy-bar phone.

[0069] Figure 2 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0070] like Figure 2 As shown, in other examples, the electronic device may be a foldable device, for example, the electronic device may be a foldable mobile phone. The electronic device may include a plurality of housings 10, a hinge mechanism is provided between two adjacent housings 10, and the two adjacent housings 10 are rotatably connected via the hinge mechanism therebetween. Specifically, the middle frames 11 of the two adjacent housings 10 may be rotatably connected via the hinge mechanism therebetween. When the electronic device is a foldable device, the display screen 20 may be a flexible screen, and the flexible screen may be covered on a plurality of housings 10. When the foldable device is in an unfolded state, the flexible screen may be located on the same side of the covered plurality of housings 10.

[0071] When the electronic device is a foldable device, the length direction, width direction, and thickness direction of the electronic device refer to the length direction, width direction, and thickness direction of the electronic device when it is in an unfolded state.

[0072] Figure 3 This is a schematic diagram of another electronic device provided in an embodiment of the present application. The x-direction is a first direction, the y-direction is a second direction, and both the first and second directions are perpendicular to the thickness of the electronic device. For example, the first direction may be the length of the electronic device, and the second direction may be the width of the electronic device.

[0073] like Figure 3 As shown, in this embodiment of the present application, the electronic device further includes a liquid-cooled radiator 30. The liquid-cooled radiator 30 can be disposed within the mounting space formed by the housing 10 and the display screen 20. The liquid-cooled radiator 30 is used to improve the heat dissipation performance of the electronic device. Specifically, the electronic components of the electronic device generate heat during operation. The liquid-cooled radiator 30 can be attached to certain electronic components that generate a large amount of heat to dissipate heat from the attached electronic components.

[0074] For example, the liquid-cooled radiator 30 can be mounted on the inner wall of the rear cover 12. One side of the liquid-cooled radiator 30, along the thickness direction of the electronic device, is connected to the rear cover 12. The other side of the liquid-cooled radiator 30, along the thickness direction of the electronic device, is used to attach to certain electronic components that generate a large amount of heat. In other words, along the thickness direction of the electronic device, the liquid-cooled radiator 30 can be located between the electronic component it is attached to and the rear cover 12, with both sides of the liquid-cooled radiator 30 connected to the rear cover 12 and the attached electronic component, respectively.

[0075] For example, the electronic components attached to the liquid cooling radiator 30 may include but are not limited to a processor, memory, etc.

[0076] In the embodiment of the present application, the liquid cooling radiator 30 includes a liquid cooling element 100. The liquid cooling element 100 includes a flow channel wall 110 for enclosing and forming a flow channel 120. The flow channel 120 is used for allowing a liquid cooling medium to flow.

[0077] The liquid cooling element 100 can be attached to some electronic devices that generate a large amount of heat to absorb the heat generated by the attached electronic devices.

[0078] The liquid cooling element 100 can be mounted on the inner wall of the rear cover 12. One side of the liquid cooling element 100, along the thickness of the electronic device, is connected to the rear cover 12. The other side of the liquid cooling element 100, along the thickness of the electronic device, is intended for attachment to electronic components that generate a large amount of heat. In other words, along the thickness of the electronic device, the liquid cooling element 100 can be positioned between the electronic component to which the liquid cooling radiator 30 is attached and the rear cover 12.

[0079] The flow channel wall 110 includes a first heat-conducting wall and a second heat-conducting wall, which are located on either side of the liquid cooling element 100 in the thickness direction of the electronic device. The first and second heat-conducting walls are made of a thermally conductive material with good thermal conductivity. One of the first and second heat-conducting walls is connected to the back cover 12, and the other is designed to be attached to certain electronic devices with high heat generation. The liquid cooling medium can exchange heat with the material outside the liquid cooling element 100 through the first and second heat-conducting walls. The flow channel wall 110 also includes a sidewall structure for connecting the first and second heat-conducting walls, which are spaced apart in the thickness direction of the electronic device. The sidewall structure, the first and second heat-conducting walls together form the flow channel 120.

[0080] For example, the material outside the liquid cooling element 100 may include electronic devices mounted on the liquid cooling element 100. For example, the liquid cooling medium may be used to exchange heat with electronic devices such as processors mounted on the liquid cooling element 100 through the flow channel wall 110. The material outside the liquid cooling element 100 may include a medium in the environment outside the liquid cooling element 100. For example, the liquid cooling medium may be used to exchange heat with the air in the installation space through the flow channel wall 110.

[0081] Exemplarily, the liquid cooling medium may include, but is not limited to, cooling water, cooling oil, etc. For example, the liquid cooling medium may be deionized water.

[0082] In some examples, the liquid cooling component 100 can be a plate-like structure, and the side wall structure includes an outer wall and a partition. The outer wall is connected to the first heat-conducting wall and the second heat-conducting wall to form the outer wall of the liquid cooling component 100. The partition is located in the space enclosed by the outer wall and the first heat-conducting wall and the second heat-conducting wall. The partition is used to separate the space enclosed by the outer wall and the first heat-conducting wall and the second heat-conducting wall to form a flow channel 120.

[0083] In other examples, the liquid cooling element 100 may be a zigzag tubular structure, and the tube wall of the liquid cooling element 100 is the flow channel wall 110 .

[0084] like Figure 3 As shown, in some examples, the liquid-cooled radiator 30 further includes a drive device 200. The drive device 200 is disposed on the liquid-cooling element 100. The inlet end of the drive device 200 is connected to the outlet end of the flow channel 120, and the outlet end of the drive device 200 is connected to the inlet end of the flow channel 120. The drive device 200 is used to drive the liquid cooling medium to circulate within the flow channel 120. This improves the heat dissipation performance of the liquid-cooled radiator 30, facilitating long-term and efficient heat dissipation.

[0085] Exemplarily, the driving device 200 may include a driving pump, for example, a micro pump.

[0086] For example, the driving device 200 can adjust the flow rate of the liquid cooling medium circulating in the flow channel 120 as needed to achieve a better heat dissipation effect.

[0087] Exemplarily, the side wall structure may include a main channel wall and a sub-channel wall, the main channel wall and the first heat-conducting wall and the second heat-conducting wall are combined to form a main channel, the sub-channel wall is arranged in the main channel, and the sub-channel wall is used to separate the main channel into multiple sub-channels. The driving device 200 may include multiple driving pumps, and the inlet and outlet ends of each sub-channel are respectively connected to the outlet and inlet ends of a driving pump.

[0088] When the side wall structure includes an outer wall and a partition, the outer wall is a main channel wall, and the partition may include a main channel wall and a sub-channel wall.

[0089] For example, the main flow channel may include a confluence region that connects a plurality of sub-flow channels.

[0090] Exemplarily, the electronic device further includes a driver chip (not shown), which is electrically connected to the driver device 200 and used to control the driver device 200. The driver chip can be arranged adjacent to the liquid cooling radiator 30 and is electrically connected to the mainboard.

[0091] like Figure 3As shown, in the embodiment of the present application, the electronic device further includes a communication device disposed on the side of the liquid-cooled radiator 30. The communication device can be used to transmit and receive signals to interact with other devices or electronic components. Specifically, the communication device is disposed on at least one side of the liquid-cooled radiator 30 in the first direction, or the communication device is disposed on at least one side of the liquid-cooled radiator 30 in the second direction.

[0092] Exemplarily, the communication device may include but is not limited to an antenna, a radio frequency switch, a radio frequency chip, etc.

[0093] In some examples, a communication device is provided on at least one side of the liquid-cooled radiator 30 in the first direction.

[0094] For example, a communication device is provided on one side of the liquid-cooled radiator 30 in the first direction, and the communication device provided on one side of the liquid-cooled radiator 30 in the first direction may include a first communication device 41 .

[0095] Exemplarily, the first communication device 41 may be an antenna, and the first communication device 41 may be disposed on the middle frame 11 .

[0096] In some examples, a communication device is provided on at least one side of the liquid-cooled radiator 30 in the second direction.

[0097] In some examples, a communication device is provided on one side of the liquid-cooled radiator 30 in the second direction.

[0098] For example, the communication device disposed on one side of the liquid-cooling radiator 30 in the second direction may include a second communication device 42 .

[0099] Exemplarily, the second communication device 42 may be an antenna, and the second communication device 42 may be disposed on the middle frame 11 .

[0100] In some examples, a communication device may also be provided on the other side of the liquid-cooled radiator 30 in the second direction.

[0101] For example, the communication device disposed on the other side of the liquid-cooling radiator 30 in the second direction may include a third communication device 43 .

[0102] Exemplarily, the third communication device 43 may be an antenna, and the third communication device 43 may be disposed on the middle frame 11 .

[0103] In related art, the flow channel walls of liquid cooling components are made of insulating materials such as plastic. However, when operating, components located at the liquid cooling radiator (e.g., the liquid cooling radiator's drive device, chips located near the liquid cooling radiator, etc.) generate interfering electromagnetic waves that can easily interfere with the communication of communication components. In related art, the interfering electromagnetic waves generated by components located at the liquid cooling radiator can penetrate the liquid cooling component and propagate to communication components located to the side of the liquid cooling radiator. The interfering electromagnetic waves propagating to communication components located to the side of the liquid cooling radiator can easily interfere with the communication of communication components located to the side of the liquid cooling radiator, resulting in a poor communication experience for electronic devices.

[0104] Figure 4 A schematic cross-sectional view of an electronic device provided in an embodiment of the present application.

[0105] like Figure 4 As shown, based on this, in an embodiment of the present application, the flow channel wall 110 includes an insulating wall 111 and a plurality of conductive members 112 arranged at intervals. The conductive members 112 of the flow channel wall 110 are connected through the insulating wall 111. The plurality of conductive members 112 form a frequency selective surface (FSS) structure. The frequency selective surface structure is used to filter electromagnetic waves within a preset frequency range.

[0106] Among them, the frequency selective surface structure is a two-dimensional periodic array structure with a specific frequency selection function, which can effectively control the transmission and reflection of the incident electromagnetic wave. The conductive part 112 used to form the frequency selective surface structure is the frequency selection unit of the frequency selective surface structure. The frequency selective surface structure can also be called a spatial filter.

[0107] In this way, the frequency selective surface structure formed by the conductive member 112 of the flow channel wall 110 can be used to filter the interference electromagnetic waves generated by the device arranged at the liquid-cooled radiator 30, so as to suppress the interference electromagnetic waves from propagating to the communication device arranged on the side of the liquid-cooled radiator 30. In this way, the interference of the interference electromagnetic waves generated by the device arranged at the liquid-cooled radiator 30 on the communication device can be reduced, thereby improving the communication experience of the electronic device. In addition, the frequency selective surface structure is integrated on the flow channel wall 110 used to form the flow channel 120, and has little impact on the arrangement of devices in the installation space of the electronic device. In addition, after the frequency selective surface structure is integrated on the flow channel wall 110 of the liquid-cooled radiator 30, the setting of some shielding structures for shielding interference electromagnetic waves in the installation space of the electronic device can be reduced, thereby saving space in the installation space.

[0108] The conductive member 112 forming the frequency selective surface structure can be adjusted according to the frequency of the interfering electromagnetic wave to be filtered, so as to adjust the frequency range of the electromagnetic wave filtered by the frequency selective surface structure and filter the interfering electromagnetic wave.

[0109] The frequency selective surface structure can transparently transmit electromagnetic waves outside the preset frequency range, so that the frequency selective surface structure will not filter the target electromagnetic waves that the communication device needs to transmit and receive, so that the communication device can normally transmit and receive the target electromagnetic waves.

[0110] Exemplarily, the insulating wall 111 and the conductive member 112 are located on the sidewall structure.

[0111] For example, the conductive member 112 may be a strip-shaped structure, a sheet-shaped structure, a sleeve-shaped structure, etc. extending along the extension direction of the flow channel 120 .

[0112] In some examples, the electrical conductor 112 may be made of graphite.

[0113] In other examples, the conductive member 112 may be made of metal.

[0114] In this way, the conductive member 112 is not easily broken, which is conducive to forming the conductive member 112 into various shapes, thereby reducing the restrictions on the location of the conductive member 112. In addition, the conductive member 112 is connected to the insulating wall 111 more conveniently and firmly.

[0115] For example, the material of the conductive member 112 may include one or more of the following materials: copper, silver, aluminum, etc.

[0116] In some examples where the liquid-cooled heat sink 30 includes the driving device 200 , the frequency selective surface structure is used to filter electromagnetic waves generated by the driving device 200 .

[0117] In this way, the interference of the electromagnetic waves generated by the driving device 200 on the communication device can be reduced.

[0118] The conductive member 112 forming the frequency selective surface structure may be adjusted according to the frequency of the electromagnetic wave generated by the driving device 200 , so as to filter the electromagnetic wave generated by the driving device 200 .

[0119] In some possible implementations, a frequency selective surface structure is provided on at least one side of the driving device 200 in the first direction.

[0120] In this way, the frequency selective surface structure arranged on the side of the driving device 200 in the first direction can reflect the electromagnetic waves generated by the driving device 200 in the first direction, which is conducive to reducing the interference of the electromagnetic waves generated by the driving device 200 on the communication device arranged on the side of the liquid-cooled radiator 30.

[0121] Illustratively, in the first direction, a communication device is provided on at least one side of the liquid-cooled radiator 30 , and a frequency selective surface structure is provided between the communication device on at least one side of the liquid-cooled radiator 30 and the driving device 200 .

[0122] In this way, the frequency selective surface structure between the communication device located on the side of the liquid-cooled radiator 30 in the first direction and the driving device 200 can suppress the electromagnetic waves generated by the driving device 200 from propagating toward the communication device located on the side of the liquid-cooled radiator 30 in the first direction, thereby reducing the interference of the electromagnetic waves generated by the driving device 200 on the communication device located on the side of the liquid-cooled radiator 30 in the first direction.

[0123] In some examples where the electronic device includes the first communication device 41 , a frequency selective surface structure is provided between the first communication device 41 and the driving apparatus 200 in the first direction.

[0124] In this way, the frequency selective surface structure provided between the first communication device 41 and the driving device 200 can inhibit the electromagnetic waves generated by the driving device 200 from propagating toward the first communication device 41 , thereby reducing the interference of the electromagnetic waves generated by the driving device 200 on the first communication device 41 .

[0125] Exemplarily, the driving device 200 is disposed on a side of the liquid cooling radiator 30 away from the first communication device 41 .

[0126] In some possible implementations, a frequency selective surface structure is provided on at least one side of the driving device 200 in the second direction.

[0127] In this way, the frequency selective surface structure arranged on the side of the driving device 200 in the second direction can reflect the electromagnetic waves generated by the driving device 200 in the second direction, which is beneficial to reduce the interference of the electromagnetic waves generated by the driving device 200 on the communication device arranged on the side of the liquid-cooled radiator 30.

[0128] Illustratively, in the second direction, a communication device is provided on at least one side of the liquid-cooled radiator 30, and a frequency selective surface structure of the liquid-cooled radiator 30 is provided between the communication device on at least one side of the liquid-cooled radiator 30 and the driving device 200 of the liquid-cooled radiator 30.

[0129] In this way, the frequency selective surface structure between the communication device located on the side of the liquid-cooled radiator 30 in the second direction and the driving device 200 can suppress the electromagnetic waves generated by the driving device 200 from propagating toward the communication device located on the side of the liquid-cooled radiator 30 in the second direction, thereby reducing the interference of the electromagnetic waves generated by the driving device 200 on the communication device located on the side of the liquid-cooled radiator 30 in the second direction.

[0130] In some examples where the electronic device includes the second communication device 42 , a frequency selective surface structure is provided between the driving apparatus 200 and the second communication device 42 in the second direction.

[0131] In this way, the frequency selective surface structure provided between the second communication device 42 and the driving device 200 can inhibit the electromagnetic waves generated by the driving device 200 from propagating toward the second communication device 42 , thereby reducing the interference of the electromagnetic waves generated by the driving device 200 on the second communication device 42 .

[0132] In some examples where the electronic device includes the third communication device 43 , a frequency selective surface structure is provided between the driving apparatus 200 and the third communication device 43 in the second direction.

[0133] In this way, the frequency selective surface structure provided between the third communication device 43 and the driving device 200 can inhibit the electromagnetic waves generated by the driving device 200 from propagating toward the third communication device 43 , thereby reducing the interference of the electromagnetic waves generated by the driving device 200 on the third communication device 43 .

[0134] Figure 5 A cross-sectional schematic diagram of a liquid-cooled radiator provided in an embodiment of the present application.

[0135] like Figure 5 As shown, in some possible embodiments, the flow channel wall 110 includes a first side wall segment 113. Specifically, the side wall structure includes the first side wall segment 113. The two ends of the first side wall segment 113 are spaced apart in a first direction, and the first side wall segment 113 includes a conductive member 112. The conductive member 112 of the first side wall segment 113 is formed with a frequency selective surface structure.

[0136] In this way, it is beneficial to reflect the interfering electromagnetic waves in the second direction, and it is beneficial to reduce the interference of the interfering electromagnetic waves on the communication devices arranged on the side of the liquid-cooled radiator 30 in the second direction.

[0137] In some possible implementations, the flow channel wall 110 includes a plurality of first side wall segments 113 spaced apart along the second direction, and the conductive elements 112 of each layer of the first side wall segment 113 are formed with a frequency selective surface structure.

[0138] In this way, the multiple layers of first sidewall segments 113 can form a multi-layer frequency selective surface structure spaced apart in the second direction, thereby enabling multi-layer reflection of interfering electromagnetic waves in the second direction, thereby improving the filtering effect of interfering electromagnetic waves. Furthermore, the interfering electromagnetic waves can be caused to oscillate between the different layers of frequency selective surface structures spaced apart in the second direction, thereby attenuating the interfering electromagnetic waves and thereby reducing interference with communication devices disposed to the sides of the liquid-cooled radiator 30. Furthermore, after the interfering electromagnetic waves are oscillated and attenuated by the multiple layers of frequency selective surface structures spaced apart in the second direction, they can also reduce interference with communication devices disposed to the sides of the liquid-cooled radiator 30 in the first direction. Furthermore, when interfering electromagnetic waves propagate between the multiple layers of frequency selective surface structures spaced apart in the second direction, the multiple layers of frequency selective surface structures spaced apart in the second direction can simultaneously suppress the propagation of the interfering electromagnetic waves to both sides of the second direction, thereby simultaneously reducing interference with communication devices disposed to both sides of the liquid-cooled radiator 30 in the second direction.

[0139] Exemplarily, at least one first sidewall segment 113 includes a plurality of conductive elements 112 spaced apart from each other, and the plurality of conductive elements 112 on the same first sidewall segment 113 form a frequency selective surface structure.

[0140] Exemplarily, at least one layer of first side wall segments 113 includes multiple first side wall segments 113 spaced apart from each other, at least one first side wall segment 113 in the same layer includes a conductive member 112, and the multiple conductive members 112 in the same layer of first side wall segments 113 form a frequency selective surface structure.

[0141] In this way, the arrangement of the conductive elements 112 used to form the frequency selective surface structure can be made more flexible.

[0142] In some examples where the flow channel wall 110 includes a main flow channel wall and a sub-flow channel wall, both the main flow channel wall and the sub-flow channel wall may include a first sidewall segment 113 .

[0143] In this way, the number of layers of the first side wall section 113 can be increased, which is conducive to forming a frequency selective surface structure with multiple layers spaced apart in the second direction.

[0144] In some possible embodiments, the flow channel wall 110 includes a second sidewall segment 114. Specifically, the sidewall structure includes the second sidewall segment 114. The two ends of the second sidewall segment 114 are spaced apart in the second direction. The second sidewall segment 114 includes a conductive member 112. The conductive member 112 of the second sidewall segment 114 is formed with a frequency selective surface structure.

[0145] In this way, it is beneficial to reflect the interfering electromagnetic waves in the first direction, and it is beneficial to reduce the interference of the interfering electromagnetic waves on the communication devices arranged on the side of the liquid-cooled radiator 30 in the first direction.

[0146] In some possible implementations, the flow channel wall 110 includes a plurality of second side wall segments 114 spaced apart along the first direction, and the conductive elements 112 of each layer of the second side wall segment 114 are formed with a frequency selective surface structure.

[0147] In this way, the multiple layers of second sidewall segments 114 can form a multi-layer frequency selective surface structure spaced apart in the first direction, thereby enabling multi-layer reflection of interfering electromagnetic waves in the first direction, thereby improving the filtering effect of interfering electromagnetic waves. Furthermore, the interfering electromagnetic waves can be caused to oscillate between the different layers of frequency selective surface structures spaced apart in the first direction, thereby attenuating the interfering electromagnetic waves and thereby reducing interference with communication devices disposed to the sides of the liquid-cooled radiator 30. Furthermore, after the interfering electromagnetic waves are oscillated and attenuated by the multiple layers of frequency selective surface structures spaced apart in the first direction, they can also reduce interference with communication devices disposed to the sides of the liquid-cooled radiator 30 in the second direction. Furthermore, when interfering electromagnetic waves propagate between the multiple layers of frequency selective surface structures spaced apart in the first direction, the multiple layers of frequency selective surface structures spaced apart in the first direction can simultaneously suppress the propagation of the interfering electromagnetic waves to both sides of the first direction, thereby simultaneously reducing interference with communication devices disposed to both sides of the liquid-cooled radiator 30 in the first direction.

[0148] Illustratively, at least one second sidewall segment 114 includes a plurality of conductive elements 112 spaced apart from each other, and the plurality of conductive elements 112 on the same second sidewall segment 114 form a frequency selective surface structure.

[0149] Illustratively, at least one layer of second sidewall segments 114 includes multiple intervals of second sidewall segments 114 , at least one second sidewall segment 114 in the same layer includes a conductive member 112 , and the multiple conductive members 112 in the same layer of second sidewall segments 114 form a frequency selective surface structure.

[0150] In this way, the arrangement of the conductive elements 112 used to form the frequency selective surface structure can be made more flexible.

[0151] In some examples where the flow channel wall 110 includes a main flow channel wall and a sub-flow channel wall, both the main flow channel wall and the sub-flow channel wall may include a second sidewall segment 114 .

[0152] In this way, the number of layers of the second sidewall section 114 can be increased, which is conducive to forming a frequency selective surface structure with multiple layers spaced apart in the first direction.

[0153] The frequency of electromagnetic waves that the frequency selective surface structure can better reflect is related to the length of the frequency selective unit. In other words, the frequency of electromagnetic waves that the frequency selective surface structure can better reflect is related to the length of the conductive member 112. A conductive member 112 of a certain length can better reflect electromagnetic waves within a corresponding specific frequency range, and conductive members 112 of different lengths can better reflect electromagnetic waves in different frequency ranges.

[0154] In some possible implementations, the plurality of conductive members 112 may include a plurality of conductive members 112 of different lengths. Specifically, the plurality of conductive members 112 may include a first conductive member and a second conductive member, wherein the length of the first conductive member is less than the length of the second conductive member.

[0155] In this way, the frequency selective surface structure formed by the flow channel wall 110 can better reflect a wider range of electromagnetic waves, which is beneficial for filtering interfering electromagnetic waves in different frequency ranges, so that the frequency selective surface structure formed by the flow channel wall 110 can filter a wider range of interfering electromagnetic waves.

[0156] In some possible implementations, the plurality of conductive members 112 may include a plurality of conductive members 112 having the same length. Specifically, the plurality of conductive members 112 may include a third conductive member and a fourth conductive member, and the third conductive member and the fourth conductive member have the same length.

[0157] In this way, the filtering effect of electromagnetic waves within the specific frequency range corresponding to the third conductive element and the fourth conductive element can be improved.

[0158] For example, the third conductive member and the fourth conductive member may be arranged side by side and spaced apart along the first direction. For example, the third conductive member and the fourth conductive member may be respectively located on two different layers of the second sidewall segments 114 .

[0159] In this way, electromagnetic waves within a specific frequency range corresponding to the third conductive element and the fourth conductive element are facilitated to oscillate and attenuate between the two different frequency selective surface structures spaced apart and distributed in the first direction.

[0160] For example, the plurality of conductive members 112 may further include a fifth conductive member and a sixth conductive member. The fifth conductive member and the sixth conductive member may have the same length and may be arranged side by side and spaced apart along the second direction. For example, the fifth conductive member and the sixth conductive member may be located on two different first sidewall segments 113.

[0161] In this way, electromagnetic waves within a specific frequency range corresponding to the fifth conductive element and the sixth conductive element can be facilitated to oscillate and attenuate between the two different frequency selective surface structures spaced apart in the second direction.

[0162] In some possible embodiments, the length of the conductive member 112 is greater than or equal to L1 and less than or equal to L2, where L1 = λ1 / 4 and L2 = λ2 / 4. λ1 is the wavelength of an electromagnetic wave with a first preset frequency propagating in the liquid cooling medium, and λ2 is the wavelength of an electromagnetic wave with a second preset frequency propagating in the liquid cooling medium. The frequency selective surface structure is used to filter electromagnetic waves with a frequency greater than or equal to the second preset frequency and less than or equal to the first preset frequency.

[0163] because, but, Wherein, c is the speed of light in vacuum, f1 is the first preset frequency, f2 is the second preset frequency, and Er is the relative dielectric constant of the liquid cooling medium.

[0164] In this way, the conductive member 112 can better reflect electromagnetic waves with a quarter wavelength close to the length of the conductive member 112 when propagating in the liquid-cooling medium. The length of the conductive member 112 can be designed according to the frequency range of the electromagnetic waves that the frequency selective surface structure needs to filter, so as to achieve more accurate filtering of interfering electromagnetic waves by the frequency selective surface structure, and is not likely to affect the communication device's reception and transmission of target electromagnetic waves.

[0165] In some possible implementations, the length of the conductive member 112 is greater than or equal to 0.14 cm and less than or equal to 7.5 cm.

[0166] In this way, when the relative dielectric constant of the liquid cooling medium is in the range of 4 to 78, the frequency selective surface structure can achieve better filtering of electromagnetic waves in the frequency range of 0.5GHz to 6GHz, which is beneficial to filtering the interference electromagnetic waves generated in electronic equipment that affect the communication device's reception and transmission of target electromagnetic waves, and has little impact on the communication device's reception and transmission of target electromagnetic waves.

[0167] Figure 6 A schematic cross-sectional view of a flow channel wall provided in an embodiment of the present application is shown. Figure 7 for Figure 6 Another cross-sectional schematic diagram of the flow channel wall in .

[0168] like Figure 6 、 Figure 7 As shown, in some possible implementations, the conductive member 112 is embedded in the insulating wall 111 , and each side of the conductive member 112 is covered by the insulating wall 111 .

[0169] This makes it easier to form the flow channel wall 110. Furthermore, the conductive member 112 does not affect the flow of the liquid cooling medium. Furthermore, the conductive member 112 is less likely to come into contact with the liquid cooling medium or components outside the liquid cooling unit 100, making it less likely that circuit failures could occur due to accidental contact with the conductive member 112.

[0170] For example, the conductive member 112 may be embedded in the insulating wall 111 by injection molding.

[0171] Figure 8 A cross-sectional schematic diagram of another flow channel wall provided in an embodiment of the present application, Figure 9 for Figure 8 Another cross-sectional schematic diagram of the flow channel wall in .

[0172] like Figure 8 、 Figure 9 As shown, in some examples, the inner wall of the insulating wall 111 has a receiving groove, and the conductive member 112 is embedded in the receiving groove.

[0173] In this way, the thickness of the channel wall 110 can be reduced where the conductive element 112 is provided. In addition, the conductive element 112 is not easily contacted with components outside the liquid cooling element 100, making it less likely to cause circuit accidents due to accidental contact with the conductive element 112.

[0174] Figure 10 A schematic cross-sectional view of another flow channel wall provided in an embodiment of the present application.

[0175] like Figure 10 As shown, in some examples, the conductive members 112 and the insulating walls 111 are alternately arranged along the extension direction of the flow channel 120, and the conductive members 112 and the insulating walls 111 are spliced, that is, the two ends of the conductive member 112 along the extension direction of the flow channel 120 are respectively connected to the two adjacent sections of the insulating walls 111, and the two ends of the insulating wall 111 along the extension direction of the flow channel 120 are respectively connected to the two adjacent conductive members 112.

[0176] In this way, the thickness of the channel wall 110 at the location where the conductive member 112 is provided can be reduced.

[0177] Figure 11 A cross-sectional schematic diagram of another flow channel wall provided in an embodiment of the present application, Figure 12 for Figure 11 Another cross-sectional schematic diagram of the flow channel wall in .

[0178] like Figure 11 、 Figure 12 As shown, in some examples, the conductive member 112 is attached to the surface of the insulating wall 111. For example, the conductive member 112 can be attached to the inner surface of the insulating wall 111.

[0179] Figure 13 A cross-sectional schematic diagram of another flow channel wall provided in an embodiment of the present application, Figure 14 for Figure 13 Another cross-sectional schematic diagram of the flow channel wall in .

[0180] like Figure 13、 Figure 14 As shown, in some examples, the conductive member 112 is formed on the surface of the insulating wall 111 by spraying, and the conductive member 112 can surround the insulating wall 111 along the circumference of the insulating wall 111 .

[0181] Figure 15 Schematic diagram of the intensity of interference electromagnetic waves at a liquid cooling radiator in the prior art. Figure 16 A schematic diagram of the intensity of interfering electromagnetic waves at a liquid cooling radiator provided in an embodiment of the present application.

[0182] like Figure 15 In the prior art, the flow channel wall 110 made of insulating materials such as plastic will not significantly affect the propagation of interfering electromagnetic waves. Figure 16 As shown, in the embodiment of the present application, the interfering electromagnetic waves will be reflected by the frequency selective surface structure and oscillate between the multiple layers of frequency selective surface structures, resulting in a higher intensity of the interfering electromagnetic waves in the inner area of ​​the liquid cooling radiator 30. Figure 16 The intensity of the interfering electromagnetic waves is significantly reduced above and on both sides of the channel. The interfering electromagnetic waves are filtered by the frequency selective surface structure of the channel wall 110. Figure 16 The communication devices arranged above and on the left and right sides cause less interference.

[0183] Figure 17 Schematic diagram comparing the scattering (S) parameters of a liquid-cooled radiator provided in an embodiment of the present application and two comparative examples. L1 is the scattering parameter curve of a liquid-cooled radiator 30 provided in an embodiment of the present application, L2 is the scattering parameter curve of a liquid-cooled radiator 30 with a flow channel wall 110 made of an insulating material, and L3 is the scattering parameter curve of a liquid-cooled radiator 30 with a flow channel wall 110 made of a metal material.

[0184] like Figure 17 As shown in the figure, from the perspective of scattering parameters, L1 has a higher degree of suppression than L2 and L3 in certain specific frequency ranges. For electromagnetic waves in certain specific frequency ranges, the input reflection coefficient (S11) of L1 is significantly higher than that of L2 and L3. For example, for electromagnetic waves with a frequency of around 0.848GHz, the input reflection coefficient of L1 is about 15db higher than that of L2 and L3. Figure 17 It can be seen that the liquid-cooled radiator 30 with a frequency selective surface structure provided in the embodiment of the present application can better filter electromagnetic waves within certain specific frequency ranges, thereby reducing the interference of electromagnetic waves within certain specific frequency ranges on communication devices on the side of the liquid-cooled radiator 30.

[0185] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0186] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0187] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0188] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the related objects; in a formula, the character " / " indicates a "division" relationship between the related objects.

[0189] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0190] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A liquid cooling radiator, characterized in that: Includes liquid cooling components; The liquid cooling element includes a flow channel wall for enclosing and forming a flow channel, and the flow channel is used for the flow of liquid cooling medium; The flow channel wall includes an insulating wall and a plurality of conductive members arranged at intervals. The conductive members of the flow channel wall are connected through the insulating wall, and the plurality of conductive members form a frequency selective surface structure.

2. The liquid cooling radiator according to claim 1, characterized in that: The flow channel wall includes a first side wall segment, and two ends of the first side wall segment are spaced apart in a first direction; The first sidewall section includes a conductive member, and the frequency selective surface structure is formed on the conductive member of the first sidewall section.

3. The liquid cooling radiator according to claim 2, characterized in that: The flow channel wall comprises a plurality of first side wall segments spaced apart and distributed along the second direction, and the conductive member of each layer of the first side wall segment is formed with a frequency selective surface structure; The second direction is perpendicular to the first direction.

4. The liquid cooling radiator according to any one of claims 1 to 3, characterized in that: The flow channel wall includes a second side wall segment, and two ends of the second side wall segment are spaced apart in the second direction; The second sidewall section includes the conductive member, and the conductive member of the second sidewall section is formed with a frequency selective surface structure.

5. The liquid cooling radiator according to claim 4, characterized in that: The channel wall includes a plurality of second side wall segments spaced apart and distributed along the first direction, and the conductive element of each layer of the second side wall segment is formed with the frequency selective surface structure.

6. The liquid cooling radiator according to any one of claims 1 to 5, characterized in that: The length of the conductive member is greater than or equal to L1 and less than or equal to L2, wherein: L1=c / (4×f1×√ Er ); L2=c / (4×f2×√Er); c is the speed of light in a vacuum, f1 is the first preset frequency, f2 is the second preset frequency, and Er is the relative dielectric constant of the liquid cooling medium; The frequency selective surface structure is used to filter electromagnetic waves within a range of frequencies greater than or equal to the second preset frequency and less than or equal to the first preset frequency.

7. The liquid cooling radiator according to any one of claims 1 to 6, characterized in that: The plurality of conductive members include a first conductive member and a second conductive member, wherein a length of the first conductive member is smaller than a length of the second conductive member.

8. The liquid cooling radiator according to any one of claims 1 to 7, characterized in that: The length of the conductive member is greater than or equal to 0.14 cm and less than or equal to 7.5 cm.

9. The liquid cooling radiator according to any one of claims 1 to 8, characterized in that: The conductive member is embedded in the insulating wall.

10. The liquid cooling radiator according to any one of claims 1 to 9, characterized in that: Also includes a drive device; The driving device is provided on the liquid cooling element, the inlet end of the driving device is connected to the outlet end of the flow channel, and the outlet end of the driving device is connected to the inlet end of the flow channel, and the driving device is used to drive the liquid cooling medium to circulate in the flow channel; The frequency selective surface structure is used to filter the electromagnetic waves generated by the driving device.

11. The liquid cooling radiator according to claim 10, characterized in that: The frequency selective surface structure is provided on at least one side of the driving device in the first direction.

12. The liquid cooling radiator according to claim 10 or 11, characterized in that: The frequency selective surface structure is provided on at least one side of the driving device in the second direction.

13. An electronic device, characterized in that: comprising a communication device and a liquid cooling radiator according to any one of claims 1 to 12; The communication device is provided on at least one side of the liquid-cooled radiator in the first direction, or the communication device is provided on at least one side of the liquid-cooled radiator in the second direction.

14. The electronic device according to claim 13, wherein: In the first direction, the communication device is provided on at least one side of the liquid-cooled radiator, and the frequency selective surface structure of the liquid-cooled radiator is provided between the communication device provided on at least one side of the liquid-cooled radiator and the driving device of the liquid-cooled radiator.

15. The electronic device according to claim 13 or 14, characterized in that: In the second direction, the communication device is provided on at least one side of the liquid-cooled radiator, and the frequency selective surface structure of the liquid-cooled radiator is provided between the communication device provided on at least one side of the liquid-cooled radiator and the driving device of the liquid-cooled radiator.

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