Thermal transfer printing head with semiconductor chilling plate and thermal transfer printer

Abstract

The invention relates to a thermal transfer printing head with a semiconductor chilling plate and a thermal transfer printer, the thermal transfer printing head comprises a printing head body and a printing head back plate, and one side face of the printing head back plate is provided with an assembly through groove in the length direction of the printing head back plate; a limiting through groove extending in the length direction of the printing head back plate is formed in the groove bottom of the assembling through groove, a copper pipe is embedded in the limiting through groove, and the copper pipe is provided with a contact face flush with the groove bottom of the assembling through groove. An assembling through groove is formed in the printing head back plate, a plurality of semiconductor chilling plates are arranged in the assembling through groove, the printing head body is installed on one side face of the printing head back plate and fixedly connected with the printing head back plate, and the printing head body covers the assembling through groove and makes contact with the semiconductor chilling plates. The thermal transfer printing head with the semiconductor chilling plate has the advantages that high-precision linear adjustment of the temperature can be achieved, and inertia-free rapid adjustment can be achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat transfer printing, and particularly relates to a heat transfer printing head with semiconductor refrigeration sheets and a heat transfer printer. BACKGROUND

[0002] The heat transfer printing technology is widely used in label printing, barcode printing, industrial identification and many other fields due to its high precision and high quality. The core working principle of the heat transfer printing technology is to transfer ink on a ribbon to a printing material surface through a heating element (such as a thermistor) in a thermal print head (TPH). In this process, the temperature control of the print head plays a decisive role in the transfer effect, directly affecting the image definition, color uniformity and printing speed and other key indicators. At present, the heat dissipation of the print head mainly adopts air cooling (heat sink + fan) and water cooling. However, the two traditional temperature control technologies have many disadvantages: first, the temperature control precision is low, which is difficult to meet the stringent requirements of high-precision printing on temperature stability; second, the response speed is slow, which cannot timely respond to the temperature changes caused by the periodic fluctuations of the print head power; and third, the reliability is poor, and under high power density and high load working conditions, the heat dissipation efficiency is seriously insufficient, which easily leads to local overheating of the print head (temperature difference > 5℃), and further causes uneven ink transfer, short service life of the heating element and other problems, seriously affecting the printing quality and the normal operation of the equipment. SUMMARY

[0003] The technical problem to be solved by the present application is that the power of the print head presents periodic fluctuations during the heat transfer process. The traditional air cooling and water cooling temperature control methods cannot quickly and accurately adjust the temperature due to the slow response, resulting in overshoot or under-adjustment of the temperature, which is finally reflected in the printed products, showing that the printed patterns are not of the same depth, the overprint deviation is > 0.1mm, and the printing quality and production efficiency are seriously affected.

[0004] The technical solution of the present application to solve the above technical problem is as follows: the present application provides a heat transfer printing head with semiconductor refrigeration sheets, comprising a print head body and a print head back plate, one side of the print head back plate is provided with an assembly through slot along the length direction of the print head back plate, a limiting through slot extending along the length direction of the print head back plate is provided in the slot bottom of the assembly through slot, a copper pipe is embedded in the limiting through slot, and the copper pipe has a contact surface flush with the slot bottom of the assembly through slot; a plurality of semiconductor refrigeration sheets are arranged in the assembly through slot, the print head body is installed on one side of the print head back plate and fixedly connected with the print head back plate, and the print head body covers the assembly through slot and is in contact with the semiconductor refrigeration sheets.

[0005] The heat transfer printing head with semiconductor refrigeration sheets has the following advantages: (1) High precision linear regulation: the refrigeration capacity of semiconductor refrigeration piece has strict linear relationship with input current, through accurate control of current size, ultra-high temperature control precision of ±0.1 ℃ level can be realized, and strict requirements of high precision printing on temperature stability are met.

[0006] (2) No inertia rapid regulation: the semiconductor refrigeration piece has no inertia dynamic regulation characteristics, and the refrigeration / heat state can be changed instantaneously through current switching, the response time is less than 1 second, and it is very suitable for special printing operation which requires rapid temperature rise / drop or temperature cycle.

[0007] (3) Miniaturization and integration advantage: the semiconductor refrigeration piece is small in size, and the minimum can reach millimeter level (such as 5mm*5mm), which is convenient for integration into small equipment or printing device with limited space, and provides the possibility for miniaturization and integrated design of equipment.

[0008] (4) High reliability and long service life: the semiconductor refrigeration piece used in the application only needs power supply driving, and does not need fan, water pump and other easily damaged mechanical moving parts, so that the equipment failure risk is greatly reduced, the service life can reach more than 100,000 hours, and the reliability and service life of the equipment are significantly improved.

[0009] On the basis of the above technical scheme, the application can also be improved as follows.

[0010] Further, the cold surface of the semiconductor refrigeration piece is in contact with the print head body through the heat-conducting silicone grease, and the hot surface of the semiconductor refrigeration piece is in contact with the bottom of the assembly through groove and the contact surface of the copper pipe.

[0011] The beneficial effects of the above further scheme are that by setting the heat-conducting silicone grease on the cold surface and the hot surface of the semiconductor refrigeration piece, the heat-conducting contact between the print head body and the copper pipe can be realized, and the heat transfer is accelerated.

[0012] Further, the assembly through groove is also provided with a heat insulation gasket, at least one heat insulation gasket is arranged between two adjacent semiconductor refrigeration pieces, and the heat insulation gasket is in contact with the print head body and the bottom of the assembly through groove respectively.

[0013] The beneficial effects of the above further scheme are that by setting the heat insulation gasket, the heat transfer between the print head body and the print head back plate can be reduced, and the heat transfer path is blocked.

[0014] Further, the print head body, the heat insulation gasket and the print head back plate are fixed by bolt connection.

[0015] Further, a convex strip is integrally connected to the position close to the edge of the one side surface of the print head back plate, the convex strip extends along the length direction of the print head back plate and is located at one side of the assembly through slot, a through hole for passing in cold water is arranged at the position corresponding to the convex strip in the print head back plate, and the through hole is arranged in parallel with the copper pipe.

[0016] The beneficial effect of the further scheme is that a small amount of heat passing through the copper pipe can be taken away by the circulating water in the through hole.

[0017] Further, the middle part of the print head body is in contact with the semiconductor refrigerating sheet and the heat insulation pad respectively, and the two sides of the print head body are in contact with the one side surface of the print head back plate and the convex strip through the heat insulation film respectively.

[0018] The beneficial effect of the further scheme is that the heat insulation film can reduce the heat dissipation to the two sides of the print head body.

[0019] Further, a temperature sensor is integrated in the print head body, and the temperature sensor and the semiconductor refrigerating sheet are connected with a PID controller respectively. The temperature sensor is used for detecting the working temperature of the print head body and feeding back to the PID controller, and the PID controller is used for controlling the semiconductor refrigerating sheet to start and stop according to the working temperature, so that the working temperature is maintained at 23℃±0.25℃.

[0020] The beneficial effect of the further scheme is that the combination of the temperature sensor, the semiconductor refrigerating sheet and the PID controller has excellent constant temperature stability, the semiconductor refrigerating sheet can dynamically compensate the temperature fluctuation in real time, and is especially suitable for complex printing scenes requiring long-term stable temperature control, and ensures the consistency and stability of the printing quality.

[0021] Further, two parallel and spaced limiting through slots are arranged at the bottom of the assembly through slot, and a copper pipe is embedded in each limiting through slot.

[0022] The beneficial effect of the further scheme is that the two copper pipes can effectively control the heat of the hot surface between the two copper pipes.

[0023] Further, a cold water machine is further included, and the two ends of the copper pipe are connected with the cold water outlet and the backwater outlet of the cold water machine respectively.

[0024] The application further provides a thermal transfer printer comprising the thermal transfer printing head with the semiconductor refrigeration sheet as described above, and further comprising a printing head rubber roller, a printing head connecting base and an air cylinder, the air cylinder is connected with the printing head back plate through the printing head connecting base, and the printing head rubber roller is fixed on the wall plate and located below the printing head body.

[0025] The application has the advantages that the thermal transfer printer can ensure the rapid export of printing heat, has high heat dissipation efficiency and good heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 Fig. 1 is a front view structural schematic diagram of the thermal transfer printing head with the semiconductor refrigeration sheet of the application; Figure 2 Fig. 2 is a sectional view structural schematic diagram of A-A in Fig. 1; Figure 1 Fig. 3 is a sectional view structural schematic diagram of B-B in Fig. 1; Figure 3 Figure 1 Fig. 4 is a sectional view structural schematic diagram of C-C in Fig. 1; Figure 4 Fig. 5 is a sectional view structural schematic diagram of D-D in Fig. 1; Figure 1 Fig. 6 is a side view structural schematic diagram of the thermal transfer printing head with the semiconductor refrigeration sheet of the application; Figure 5 Figure 1 Fig. 7 is a top view structural schematic diagram of the thermal transfer printing head with the semiconductor refrigeration sheet of the application. Figure 6 Fig. 1 is a front view structural schematic diagram of the thermal transfer printing head with the semiconductor refrigeration sheet of the application; Figure 7 Fig. 7 is a top view structural schematic diagram of the thermal transfer printing head with the semiconductor refrigeration sheet of the application.

[0027] In the drawings, the components represented by the respective reference numerals are listed as follows: 1, printing head body; 11, heating wire; 12, printing head rubber roller; 13, printing head connecting base; 2, printing head back plate; 21, assembly through groove; 22, copper pipe; 23, convex strip; 24, through hole; 25, first joint; 26, second joint; 3, semiconductor refrigeration sheet; 4, heat insulation gasket; 5, bolt; 6, heat insulation film sheet. DETAILED DESCRIPTION

[0028] The principles and features of the application are described below, and the examples are only used to explain the application and not to limit the scope of the application.

[0029] Example 1 As Figures 1 to 7 ​​As shown, a thermal transfer print head with a semiconductor cooling plate in this embodiment includes a print head body 1 and a print head back plate 2, a side surface of the print head back plate 2 is provided with an assembly slot 21 along the length direction of the print head back plate 2, the bottom of the assembly slot 21 is provided with a limiting slot extending along the length direction of the print head back plate 2, a copper tube 22 is embedded in the limiting slot, and the copper tube 22 has a contact surface flush with the bottom of the assembly slot 21; a plurality of semiconductor cooling plates 3 are provided in the assembly slot 21, the print head body 1 is mounted on one side surface of the print head back plate 2 and fixedly connected to the print head back plate 2, the print head body 1 covers the assembly slot 21 and is in contact with the semiconductor cooling plate 3.

[0030] In one specific embodiment of this invention, the cold surface of the semiconductor cooling chip 3 contacts the print head body 1 via thermal grease, while the hot surface of the semiconductor cooling chip 3 contacts the bottom of the assembly slot 21 and the contact surface of the copper tube 22 via thermal grease. By applying thermal grease to both the cold and hot surfaces of the semiconductor cooling chip, thermal contact between the print head body and the copper tube is achieved, accelerating heat transfer.

[0031] like Figures 2 to 4 As shown, a preferred embodiment of this embodiment comprises two parallel, spaced-apart limiting slots at the bottom of the assembly slot 21, each of which is embedded with a copper tube 22. The two copper tubes effectively confine the heat of the hot surface between the two tubes. The small amount of heat that passes through the copper tubes can also be dissipated through holes provided on the printhead backplate 2.

[0032] The semiconductor cooling fins 3 of this embodiment can be evenly arranged along the length of the assembly slots 21. Due to the limited thickness precision of the semiconductor cooling fins 3, if the gap between the cold surface of the semiconductor cooling fin and the printhead body is too large, a vapor chamber of varying thickness can be placed on the semiconductor cooling fins to fill the gap. If the cold surface of the semiconductor cooling fin is higher than one side of the printhead body, a thermal insulation film can also be used to fill the gap between the printhead body and the printhead backplate. The hot surface of the semiconductor cooling fins 3 is tightly bonded to the printhead backplate using thermal grease.

[0033] like Figures 2 to 4 As shown, the print head body 1 of this embodiment has a heating wire 11 on the side facing away from the print head back plate 2, which is used to cooperate with the print head rubber roller 12 for printing.

[0034] In this embodiment, an assembly slot 21 is formed on the print head back plate 2 and a semiconductor cooling plate 3 is embedded in the assembly slot 21. The print head back plate 2 and the print head body 1 can be tightly fitted through the semiconductor cooling plate 3 to ensure rapid absorption and conduction of heat.

[0035] The thermal transfer printing head with semiconductor refrigeration sheet of the embodiment has the following advantages: (1) high-precision linear adjustment: the refrigeration capacity of the semiconductor refrigeration sheet has a strict linear relationship with the input current, and by precisely controlling the current size, an ultra-high temperature control precision of ±0.1℃ level can be achieved, which meets the strict requirements of high-precision printing on temperature stability. (2) Inertia-free rapid adjustment: the semiconductor refrigeration sheet has the dynamic adjustment characteristic of no inertia, and by switching the current, the refrigeration / heat generation state can be changed instantaneously, with a response time <1 second, which is very suitable for special printing operations that require rapid temperature rise / drop or temperature cycling. (3) Miniaturization and integration advantage: the semiconductor refrigeration sheet is small in size, with a minimum of millimeter level (such as 5mm×5mm), which is convenient for integration into small devices or printing devices with limited space, providing the possibility for the miniaturization and integrated design of the device. (4) High reliability and long service life: the semiconductor refrigeration sheet used in the present application only needs to be driven by a power supply, without the need for fan, water pump and other easily damaged mechanical moving parts, greatly reducing the risk of equipment failure, and its service life can reach more than 100,000 hours, significantly improving the reliability and service life of the equipment.

[0036] Embodiment 2 On the basis of embodiment 1, the present embodiment provides a preferred assembly scheme of the semiconductor refrigeration sheet. As shown in Figure 2 and Figure 5 , the assembly through slot 21 is also provided with a heat insulation gasket 4, at least one heat insulation gasket 4 is arranged between two adjacent semiconductor refrigeration sheets 3, and the heat insulation gasket 4 is in contact with the printing head body 1 and the slot bottom of the assembly through slot 21 respectively. By arranging the heat insulation gasket, the heat transfer between the printing head body and the printing head back plate can be reduced, and the heat transfer path is blocked.

[0037] As shown in Figure 2 and Figure 4 , one specific scheme of the present embodiment is that the printing head body 1, the heat insulation gasket 4 and the printing head back plate 2 are connected and fixed by bolts 5.

[0038] Specifically, as shown in Figure 5 , the assembly through slot 21 of the printing head body 1 of the present embodiment is provided with six semiconductor refrigeration sheets 3, and one heat insulation gasket 4 is arranged between two adjacent semiconductor refrigeration sheets 3. The height of the heat insulation gasket 4 is the same as or higher than the height of the semiconductor refrigeration sheet 3.

[0039] In order to reduce the heat conduction between the printing head body and the printing head back plate, the present embodiment needs to do a good job in the heat insulation treatment between the two, which can block the heat transfer path through the heat insulation gasket 4. Moreover, in cooperation with the copper pipe, the copper pipe can efficiently take away the heat generated by the hot surface of the semiconductor refrigeration sheet as the core component of the liquid cooling system.

[0040] Example 3 Based on Example 1 or Example 2, this embodiment provides a preferred solution for the print head back plate 2. Figures 2 to 4 As shown, a ridge 23 is integrally connected to one side of the printhead backplate 2, near its edge. This ridge 23 extends along the length of the printhead backplate 2 and is located on one side of the mounting slot 21. A through-hole 24 for admitting cold water is provided within the printhead backplate 2, corresponding to the ridge 23. This through-hole 24 is arranged parallel to the copper tube 22. By providing a ridge on one side of the printhead backplate and a through-hole within the ridge, a small amount of heat that permeates the copper tube can be removed by circulating water within the through-hole.

[0041] The two ends of the through hole 24 pass through the two ends of the convex strip 23 and can be connected to the joints for connecting to the cold water outlet and return water inlet of the water cooler.

[0042] Example 4 Based on any of the above embodiments, this embodiment provides a preferred solution for the print head body 1. Figures 2 to 5 As shown, the middle of the print head body 1 contacts the semiconductor cooling sheet 3 and the thermal insulation gasket 4, respectively. The two sides of the print head body 1 contact one side of the print head back plate 2 and the ridge 23 through the thermal insulation film 6. The thermal insulation film can reduce the heat dissipation to the two sides of the print head body.

[0043] Specifically, such as Figures 2 to 5 As shown, the thermal insulation gasket 4 and the semiconductor cooling plate 3 of this embodiment are arranged higher than the bottom of the assembly groove 21. When the print head body 1 is placed on the thermal insulation gasket 4 and the semiconductor cooling plate 3, an assembly gap will be reserved between the print head body 1 and one side of the print head back plate 2 and between the side walls of the convex strip 23. The thermal insulation diaphragm 6 can be placed or pasted in the assembly gap for thermal insulation assembly between the print head body 1 and the print head back plate 2.

[0044] Specifically, the thermal insulation diaphragm of this embodiment can be a thermal insulation polytetrafluoroethylene diaphragm.

[0045] Example 5 On the basis of any of the above embodiments, the embodiment provides a temperature control scheme of the print head body 1. The print head body 1 is integrated with a temperature sensor, and the temperature sensor and the semiconductor refrigeration sheet 3 are respectively connected with a PID controller; the temperature sensor is used to detect the working temperature of the print head body 1 and feed back to the PID controller, and the PID controller is used to control the semiconductor refrigeration sheet 3 to start and stop according to the working temperature, so that the working temperature is maintained at 23℃±0.25℃. The temperature sensor can be integrated inside the print head body, close to the working area. One or more temperature sensors can be integrated. When multiple temperature sensors are integrated, the maximum value or the average value can be taken for control. The combination of the temperature sensor, the semiconductor refrigeration sheet 3 and the PID controller has excellent constant temperature stability; the semiconductor refrigeration sheet can dynamically compensate the temperature fluctuation in real time, and is especially suitable for complex printing scenarios that require long-term stable temperature control, to ensure the consistency and stability of the printing quality.

[0046] In order to realize accurate control of the semiconductor refrigeration sheet, a high-precision temperature sensor is installed at a key position of the print head body in the embodiment. The temperature sensor can monitor the temperature of the print head in real time and accurately, and feed back the collected temperature data to the PID controller in real time. Based on the difference between the preset temperature value and the actual monitoring temperature value, the PID controller uses the PID control algorithm to accurately adjust the current input to the semiconductor refrigeration sheet, so as to realize accurate regulation and control of the refrigeration capacity of the semiconductor refrigeration sheet, and ensure that the temperature of the print head body is always stable within the set range.

[0047] Embodiment 6 On the basis of any of the above embodiments, a further scheme of the heat transfer printing head is provided. The heat transfer printing head further comprises a cold water machine, and the two ends of the copper pipe 22 are respectively connected with the cold water outlet and the backwater outlet of the cold water machine.

[0048] Specifically, as shown in Figure 1 and Figure 6 The two ends of the copper pipe 22 of the embodiment are respectively provided with a first joint 25 and a second joint 26 for respectively connecting the cold water outlet and the backwater outlet of the cold water machine.

[0049] The through hole and the two copper pipes are used as the core structure of the entire external water circulation cooling system, which can realize rapid and accurate temperature regulation.

[0050] Embodiment 7 The embodiment provides a thermal transfer printer, which comprises the thermal transfer print head with the semiconductor refrigeration sheet 3 according to any one of the above embodiments, and further comprises a print head rubber roller 12, a print head connecting base 13 and an air cylinder, the air cylinder is connected with the print head back plate 2 through the print head connecting base 13, and the print head rubber roller 12 is fixed on the wall plate and located below the print head body 1. The print head connecting base 13 can be connected and fixed with the print head back plate 2 through a screw rod.

[0051] The thermal transfer printer of the embodiment can fix the print head rubber roller 12 on the wall plate, the print head connecting base 13 can be connected with the air cylinder, the working pressure of the print head body is applied through the air cylinder, the screw rod is used to connect and fix the print head back plate 13, and the print head back plate is connected with the lower part through a bolt to form a whole. The area of the print head body 1 corresponding to the print head rubber roller 12 is a printing working area, and the area needs to bear about 70kg of pressure through calculation, therefore, the heat insulation Teflon film needs to keep good stability and heat insulation performance under the pressure of 70kg. The embodiment is provided with one or more temperature sensors which are evenly arranged in the print head body, the temperature is controlled through a PID control algorithm, and the temperature in the area is accurately controlled at 23 DEG C + / - 0.25 DEG C. When the temperature rises, the PID controller starts the semiconductor refrigeration sheet to reduce the temperature immediately; when the temperature drops, the PID controller can reverse the cold and hot surfaces of the semiconductor refrigeration sheet by reversing the semiconductor current, or the temperature can be increased by using the heat generated in the printing process of the print head body, so that the temperature of the print head is always stable in the set range.

[0052] The thermal transfer printer of the embodiment can ensure that the printing heat is quickly exported, the heat dissipation efficiency is high, and the heat dissipation effect is good.

[0053] In the description of the present application, it should be understood that the terms "length", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0054] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0055] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0056] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0057] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0058] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A thermal transfer print head with a semiconductor cooling plate, characterized in that: It includes a print head body and a print head back plate, one side of the print head back plate is provided with an assembly slot along the length direction of the print head back plate, the bottom of the assembly slot is provided with a limiting slot extending along the length direction of the print head back plate, a copper tube is embedded in the limiting slot, and the copper tube has a contact surface flush with the bottom of the assembly slot; a plurality of semiconductor cooling plates are provided in the assembly slot, the print head body is mounted on one side of the print head back plate and fixedly connected to the print head back plate, the print head body covers the assembly slot and is in contact with the semiconductor cooling plates.

2. A thermal transfer print head with a semiconductor cooling plate according to claim 1, characterized in that: The cold surface of the semiconductor refrigeration chip contacts the print head body through thermal grease, and the hot surface of the semiconductor refrigeration chip contacts the bottom of the assembly groove and the contact surface of the copper tube through thermal grease.

3. A thermal transfer print head with a semiconductor cooling plate according to claim 1, characterized in that: A thermal insulation gasket is further provided in the assembly slot, and at least one thermal insulation gasket is provided between two adjacent semiconductor refrigeration plates. The thermal insulation gasket is in contact with the print head body and the bottom of the assembly slot respectively.

4. A thermal transfer print head with a semiconductor cooling plate according to claim 3, characterized in that: The print head body, the heat insulation gasket and the print head back plate are connected and fixed by bolts.

5. A thermal transfer print head with a semiconductor cooling plate according to claim 3, characterized in that: A convex strip is integrally connected to a side surface of the print head back plate near the edge, and the convex strip extends along the length direction of the print head back plate and is located on one side of the assembly groove. A through hole for passing cold water is opened in the print head back plate at a position corresponding to the convex strip, and the through hole is arranged parallel to the copper tube.

6. A thermal transfer print head with a semiconductor cooling plate according to claim 5, characterized in that: The middle of the print head body is in contact with the semiconductor refrigeration sheet and the thermal insulation gasket respectively, and both sides of the print head body are in contact with one side surface of the print head back plate and the convex strips respectively through thermal insulation membranes.

7. A thermal transfer print head with a semiconductor cooling chip according to claim 1, characterized in that: A temperature sensor is integrated in the print head body, and the temperature sensor and the semiconductor refrigeration chip are respectively connected to the PID controller; The temperature sensor is used to detect the operating temperature of the print head body and feed it back to the PID controller. The PID controller is used to control the start and stop of the semiconductor refrigeration plate according to the operating temperature to maintain the operating temperature at 23°C ± 0.25°C.

8. The thermal transfer print head with a semiconductor cooling chip according to claim 1, characterized in that: The bottom of the assembly through groove is provided with two parallel and spaced limiting through grooves, and a copper tube is embedded in each of the limiting through grooves.

9. A thermal transfer print head with a semiconductor cooling chip according to claim 1, characterized in that: It also includes a water chiller, and the two ends of the copper pipe are respectively connected to the cold water outlet and return water inlet of the water chiller.

10. A thermal transfer printer, characterized in that: A thermal transfer print head with a semiconductor cooling plate as described in any one of claims 1 to 9, further comprising a print head rubber roller, a print head connecting seat and a cylinder, wherein the cylinder is connected to the print head back plate through the print head connecting seat, and the print head rubber roller is fixed on the wall panel and is located below the print head body.

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