Integrated telemetering terminal hardware module and optimized layout method thereof

Abstract

The invention provides an integrated telemetering terminal hardware module and an optimized layout method thereof. The invention discloses an integrated telemetering terminal hardware module and an optimized layout method thereof, and the integrated telemetering terminal hardware module comprises a data collection module which is used for collecting analog signals and digital signals of an environment or equipment and comprises a sensor interface circuit, a signal conditioning circuit and an analog-to-digital conversion circuit; the data processing module is connected with the data acquisition module, is used for processing and analyzing the acquired data in real time, comprises a microcontroller unit or a digital signal processor, and integrates an embedded algorithm to optimize data compression and filtering; a communication module, a power management module, a storage module and a protection module. The integrated telemetering terminal hardware module and the optimized layout method thereof provided by the invention have the advantages that the size of a telemetering terminal can be reduced, the power consumption can be reduced, the precision can be improved, and excellent heat dissipation and anti-interference performance can be achieved through high integration and optimized layout design.

Description

Technical Field

[0001] This invention relates to the field of telemetry terminal equipment technology, and in particular to an integrated telemetry terminal hardware module and its optimized layout method. Background Technology

[0002] Traditional telemetry terminals typically employ a discrete design, with each functional module (such as data acquisition, communication, and power supply) laid out independently. This results in large device size, high power consumption, high cost, and significant signal interference issues. Furthermore, existing layout methods lack systematic optimization for thermal management, electromagnetic compatibility (EMC), and signal integrity, affecting the reliability and long-term stability of the terminal.

[0003] Therefore, it is necessary to provide an integrated telemetry terminal hardware module and its optimized layout method to solve the above-mentioned technical problems. Summary of the Invention

[0004] The technical problem solved by this invention is to provide an integrated telemetry terminal hardware module and its optimized layout method that can reduce the size of the telemetry terminal, reduce power consumption, improve accuracy, and have excellent heat dissipation and anti-interference performance through highly integrated and optimized layout design.

[0005] To solve the above-mentioned technical problems, the present invention provides an integrated telemetry terminal hardware module and its optimized layout method, including: a data acquisition module for acquiring analog and digital signals of the environment or equipment, including a sensor interface circuit, a signal conditioning circuit and an analog-to-digital conversion circuit;

[0006] The data processing module, connected to the data acquisition module, is used to process and analyze the acquired data in real time. It includes a microcontroller unit (MCU) or a digital signal processor (DSP) and integrates embedded algorithms to optimize data compression and filtering.

[0007] The communication module is connected to the data processing module, supports multiple communication protocols (such as 4G / 5G, LoRa, NB-IoT), and has a built-in adaptive switching mechanism to optimize communication efficiency.

[0008] The power management module provides stable power to each module, including a multi-channel voltage conversion circuit, a battery management unit (BMS), and a low-power sleep / wake-up circuit.

[0009] Storage modules, used for caching and storing data, include Flash memory and an SD card interface;

[0010] The protection module integrates an electromagnetic shielding layer, a waterproof and dustproof structure, and overvoltage and overcurrent protection circuits.

[0011] The modules are integrated through a high-density multilayer PCB board, and the MCU, DSP and communication chip are packaged into a single system-on-a-chip (SoC) using heterogeneous packaging technology to reduce size and power consumption.

[0012] Preferably, the data acquisition module supports dynamic range adjustment, and its input signal range is dynamically adapted using the following formula:

[0013]

[0014] Among them, V range The adjusted range, where k is the scaling factor. Let N be the mean of the input signal and N be the number of sampling points.

[0015] Preferably, the communication module uses a Time Division Multiple Access (TDMA) protocol to optimize data transmission, and its time slot allocation formula is as follows:

[0016]

[0017] Among them, T slot T is the time slot length. frame denoted as frame period, M as the number of terminals, α as the channel attenuation factor, and SNR as the signal-to-noise ratio.

[0018] Preferably, the power management module employs Dynamic Voltage and Frequency Scaling (DVFS) technology, and its power consumption optimization formula is as follows:

[0019]

[0020] Among them, C i , f i These are the equivalent capacitance, operating voltage, and frequency of each module.

[0021] Preferably, the electromagnetic shielding effectiveness of the protection module is achieved through a multi-layer metallized through-hole structure, and its shielding effectiveness (SE) satisfies:

[0022] SE>40dB (frequency band 0.1-10GHz).

[0023] This invention also provides an optimized layout method for an integrated telemetry terminal hardware module, comprising the following steps:

[0024] S1: Thermal coupling analysis: Determine the heat distribution of high-power components through finite element simulation, and arrange the MCU, communication chip and heat dissipation structure (such as copper pillar or heat pipe) in close proximity;

[0025] S2: Signal integrity optimization: Use serpentine routing to match the length of high-speed signal lines, and arrange decoupling capacitor arrays around the power module;

[0026] S3: Spatial layer design: The PCB is divided into signal layer, power layer and ground layer, and the radio frequency part of the communication module is separately isolated and laid out;

[0027] S4: Modular stacking: Achieve three-dimensional integration through flexible printed circuit boards (FPCs) or vertical interlocking structures, reducing planar footprint.

[0028] Preferably, in the thermal coupling analysis, the layout spacing d of the heat dissipation structure satisfies:

[0029]

[0030] Where λ is the thermal conductivity of the material, ΔT is the allowable temperature rise, and P dissipated This represents the power consumption of the component.

[0031] Preferably, in the signal integrity optimization, the length deviation of the serpentine trace is controlled within ±5%, and the spacing between adjacent traces is greater than 3 times the trace width.

[0032] Preferably, in the spatial layering design, the spacing h between the power layer and the ground layer must satisfy:

[0033]

[0034] Where c is the speed of light, f max ε is the highest signal frequency. r is the relative permittivity of the medium.

[0035] Preferably, the modular stack uses metallized blind vias or buried vias to achieve interlayer interconnection, and the antenna part of the communication module is integrated into the inner side of the housing using LDS laser direct forming technology.

[0036] Compared with related technologies, the integrated telemetry terminal hardware module and its optimized layout method provided by this invention have the following beneficial effects:

[0037] This invention provides an integrated telemetry terminal hardware module and its optimized layout method. Through heterogeneous packaging technology and 3D stacking design, it highly integrates data acquisition, processing, communication, and power management modules, reducing the terminal size by more than 50% compared to traditional solutions. Employing dynamic range adjustment technology and an adaptive TDMA communication protocol, combined with DVFS dynamic power management, it achieves a 20% improvement in data acquisition accuracy while reducing overall power consumption by 30%–40%. Innovative thermal coupling analysis and multi-layer PCB layout methods, through copper pillar heat dissipation structures and optimized interlayer spacing, effectively solve the heat dissipation and signal interference problems caused by high-density integration, enabling the device to operate stably within a wide temperature range of -40℃ to 85℃, with a mean time between failures (MTBF) exceeding 100,000 hours. Modular protective design (IP67 enclosure + electromagnetic shielding) significantly improves the reliability of the device in complex environments. This solution achieves synergistic optimization in miniaturization, low power consumption, and high performance, and can be widely applied in industrial IoT fields such as smart grids and environmental monitoring. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the integrated telemetry terminal hardware module provided by the present invention.

[0039] Figure 2 A flowchart illustrating the optimized layout method for the integrated telemetry terminal hardware module provided by this invention. Detailed Implementation

[0040] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0041] Please refer to the following: Figure 1 and Figure 2 ,in, Figure 1 This is a schematic diagram of the integrated telemetry terminal hardware module provided by the present invention. Figure 2 This is a flowchart illustrating the optimized layout method for the integrated telemetry terminal hardware module provided by the present invention. The integrated telemetry terminal hardware module includes a data acquisition module, a data processing module, a communication module, a power management module, a storage module, and a protection module. Each module is compactly integrated using high-density multilayer PCBs and heterogeneous packaging technologies (such as System-in-Package), as detailed below:

[0042] Data acquisition module:

[0043] In this embodiment, the data acquisition module supports the acquisition of analog signals (such as temperature, pressure, and humidity) and digital signals (such as switch signals and pulse signals).

[0044] The data acquisition module employs dynamic range adjustment technology, automatically adjusting the ADC range by calculating the root mean square (RMS) value of the input signal in real time, thereby improving measurement accuracy. The range adjustment formula is as follows:

[0045]

[0046] Among them, V range The adjusted range is represented by k, which is a scaling factor (usually taken as 1.2 to 1.5). Let N be the mean of the input signal and N be the number of sampling points.

[0047] The signal conditioning circuit uses a programmable gain amplifier (PGA) to accommodate the output range of different sensors.

[0048] Data processing module:

[0049] In this embodiment, the data processing module uses a low-power MCU (such as STM32U5) or DSP (such as TI C2000) and integrates embedded data compression algorithms (such as LZ77) and digital filtering (such as FIR / IIR) to reduce the amount of data transmission.

[0050] In this embodiment, the data processing module supports edge computing, which can complete data preprocessing (such as anomaly detection and trend analysis) locally, reducing the computing burden on the cloud.

[0051] Communication module:

[0052] In this embodiment, the communication module supports multi-mode communication (4G / 5G+LoRa / NB-IoT) and adopts an adaptive switching mechanism to automatically select the optimal communication method based on signal strength and data volume.

[0053] In this embodiment, the communication module uses the TDMA (Time Division Multiple Access) protocol to optimize data transmission, and the time slot allocation formula is as follows:

[0054]

[0055] Among them, T slot T is the time slot length. frame denoted as frame period, M as the number of terminals, α as the channel attenuation factor, and SNR as the signal-to-noise ratio.

[0056] Power management module:

[0057] In this embodiment, the power management module employs Dynamic Voltage and Frequency Scaling (DVFS) technology to dynamically adjust the voltage and frequency of the MCU and communication module according to the load, thereby reducing power consumption. The optimization formula is as follows:

[0058]

[0059] Among them, C i , f i These are the equivalent capacitance, operating voltage, and frequency of each module.

[0060] In this embodiment, the power management module integrates a hybrid power supply scheme of supercapacitor + lithium battery, supports energy harvesting (such as solar energy and vibration energy), and is suitable for passive environments.

[0061] Storage module:

[0062] In this embodiment, the storage module adopts a dual storage scheme of SPI Flash + TF card, with Flash used to cache real-time data and TF card used for long-term storage.

[0063] In this embodiment, the storage module supports a circular storage strategy, which automatically overwrites the oldest data when storage space is insufficient.

[0064] Protection module:

[0065] In this embodiment, the protection module includes electromagnetic shielding: it adopts multi-layer metallized through holes + ferrite magnetic ring, and the shielding effectiveness (SE) is >40dB (0.1-10GHz).

[0066] In this embodiment, the protection module includes environmental protection: the outer shell adopts an IP67 waterproof and dustproof design, and the internal circuit is coated with a three-proof paint to improve corrosion resistance.

[0067] This invention also provides an optimized layout method for integrated telemetry terminal hardware modules. The layout method provided by this invention is based on three core optimization objectives: thermal management, signal integrity, and space utilization. The specific steps are as follows:

[0068] S1: Thermo-coupling analysis:

[0069] Perform thermal simulations using ANSYS Icepak or COMSOL Multiphysics to identify high-heat-generating components (such as MCUs and communication chips).

[0070] Copper pillar heat dissipation + heat pipe heat conduction treatment is adopted, and the spacing d of the heat dissipation structure satisfies:

[0071]

[0072] Where λ is the thermal conductivity of the material, ΔT is the allowable temperature rise, and P dissipated This represents the power consumption of the component.

[0073] S2: Signal integrity optimization:

[0074] High-speed signal lines (such as USB and LVDS) use serpentine routing with length deviation controlled within ±5% to avoid timing issues.

[0075] Power supply decoupling: A 0.1μF + 10μF capacitor array is placed around the MCU and communication chip to reduce power supply noise.

[0076] S3: Spatial Layering Design:

[0077] The PCB uses a 6-layer structure, with the following layer stack-up order: Top Layer (signal layer), GND Plane (ground layer), Power Plane (power layer), Mid Layer 1 (high-speed signals), Mid Layer 2 (low-speed signals), Bottom Layer (RF isolation area). The spacing h between the power layer and the ground layer satisfies the following conditions:

[0078]

[0079] Where c is the speed of light, f max ε is the highest signal frequency. r is the relative permittivity of the medium.

[0080] S4: Modular stacking:

[0081] Three-dimensional stacking is achieved by using a vertical interlocking structure or a flexible printed circuit board (FPC), reducing the planar footprint.

[0082] The antenna portion of the communication module is integrated into the inner side of the housing using LDS laser direct forming technology to avoid external interference.

[0083] Compared with related technologies, the integrated telemetry terminal hardware module and its optimized layout method provided by this invention have the following beneficial effects:

[0084] This invention provides an integrated telemetry terminal hardware module and its optimized layout method. Through heterogeneous packaging technology and 3D stacking design, it highly integrates data acquisition, processing, communication, and power management modules, reducing the terminal size by more than 50% compared to traditional solutions. Employing dynamic range adjustment technology and an adaptive TDMA communication protocol, combined with DVFS dynamic power management, it achieves a 20% improvement in data acquisition accuracy while reducing overall power consumption by 30%–40%. Innovative thermal coupling analysis and multi-layer PCB layout methods, through copper pillar heat dissipation structures and optimized interlayer spacing, effectively solve the heat dissipation and signal interference problems caused by high-density integration, enabling the device to operate stably within a wide temperature range of -40℃ to 85℃, with a mean time between failures (MTBF) exceeding 100,000 hours. Modular protective design (IP67 enclosure + electromagnetic shielding) significantly improves the reliability of the device in complex environments. This solution achieves synergistic optimization in miniaturization, low power consumption, and high performance, and can be widely applied in industrial IoT fields such as smart grids and environmental monitoring.

[0085] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. An integrated telemetry terminal hardware module, characterized in that, include: The data acquisition module is used to acquire analog and digital signals from the environment or equipment, including sensor interface circuits, signal conditioning circuits, and analog-to-digital conversion circuits; A data processing module, connected to the data acquisition module, is used to process and analyze the acquired data in real time. It includes a microcontroller unit or a digital signal processor and integrates embedded algorithms to optimize data compression and filtering. The communication module is connected to the data processing module, supports multiple communication protocols, and has a built-in adaptive switching mechanism to optimize communication efficiency. The power management module provides stable power to each module, including a multi-channel voltage conversion circuit, a battery management unit (BMS), and a low-power sleep / wake-up circuit. Storage modules, used for caching and storing data, include Flash memory and an SD card interface; The protection module integrates an electromagnetic shielding layer, a waterproof and dustproof structure, and overvoltage and overcurrent protection circuits. The modules are integrated through a high-density multilayer PCB board, and the MCU, DSP and communication chip are packaged into a single system-on-a-chip using heterogeneous packaging technology.

2. The integrated telemetry terminal hardware module according to claim 1, characterized in that, The data acquisition module supports dynamic range adjustment, and its input signal range is dynamically adapted using the following formula: Among them, V range The adjusted range, where k is the scaling factor. Let N be the mean of the input signal and N be the number of sampling points.

3. The integrated telemetry terminal hardware module according to claim 1, characterized in that, The communication module uses a Time Division Multiple Access (TDMA) protocol to optimize data transmission, and its time slot allocation formula is as follows: Among them, T slot T is the time slot length. frame denoted as frame period, M as the number of terminals, α as the channel attenuation factor, and SNR as the signal-to-noise ratio.

4. The integrated telemetry terminal hardware module according to claim 1, characterized in that, The power management module employs Dynamic Voltage and Frequency Scaling (DVFS) technology, and its power consumption optimization formula is as follows: Among them, C i , f i These are the equivalent capacitance, operating voltage, and frequency of each module.

5. The integrated telemetry terminal hardware module according to claim 1, characterized in that, The electromagnetic shielding effectiveness of the protection module is achieved through a multi-layer metallized through-hole structure, and its shielding effectiveness satisfies the following: SE>40dB (frequency band 0.1-10GHz).

6. An optimized layout method for the hardware module of the integrated telemetry terminal as described in any one of claims 1-5, characterized in that, Includes the following steps: S1: Thermal coupling analysis: Determine the thermal distribution of high-power components through finite element simulation, and arrange the MCU, communication chip and heat dissipation structure in close proximity; S2: Signal integrity optimization: Use serpentine routing to match the length of high-speed signal lines, and arrange decoupling capacitor arrays around the power module; S3: Spatial layer design: The PCB is divided into signal layer, power layer and ground layer, and the radio frequency part of the communication module is separately isolated and laid out; S4: Modular stacking: Three-dimensional integration is achieved through flexible circuit boards or vertical plug-in structures, reducing the planar area occupied.

7. The optimized layout method for the hardware module of the integrated telemetry terminal according to claim 6, characterized in that, In the aforementioned thermo-coupling analysis, the layout spacing d of the heat dissipation structure satisfies: Where λ is the thermal conductivity of the material, ΔT is the allowable temperature rise, and P dissipated This represents the power consumption of the component.

8. The optimized layout method for the hardware module of the integrated telemetry terminal according to claim 6, characterized in that, In the signal integrity optimization, the length deviation of the serpentine trace is controlled within ±5%, and the spacing between adjacent traces is greater than 3 times the trace width.

9. The optimized layout method for the hardware module of the integrated telemetry terminal according to claim 6, characterized in that, In the aforementioned spatial layering design, the spacing h between the power layer and the ground layer must satisfy the following: Where c is the speed of light, f max ε is the highest signal frequency. r is the relative permittivity of the medium.

10. The optimized layout method for the hardware module of the integrated telemetry terminal according to claim 6, characterized in that, The modular stack uses metallized blind vias or buried vias to achieve interlayer interconnection, and the antenna part of the communication module is integrated into the inner side of the shell through LDS laser direct forming technology.

Images