Camera module and electronic equipment

Abstract

The invention discloses a camera module and electronic equipment, and belongs to the technical field of electronics. The camera module comprises a circuit board, at least two photosensitive chips, a base and at least two lens components. The at least two photosensitive chips corresponding to the at least two lens components are arranged on the same circuit board, the photosensitive chips are arranged in the bearing cavity in the base, and the at least two lens components can be connected with the side, away from the circuit board, of the base. Therefore, the common circuit board design of the at least two lens components in the camera module is realized, the size of the camera module is effectively reduced, and the occupied space of the camera module in the electronic equipment is reduced. Besides, other components can be flexibly arranged in the internal space of the electronic equipment while the miniaturization design of the electronic equipment is ensured, so that the space utilization rate of the electronic equipment is improved.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a camera module and electronic device. Background Technology

[0002] With the continuous development of electronic technology, electronic devices with camera modules are becoming increasingly common. The camera module, integrated inside the electronic device, enables it to take photos and videos, greatly enriching and expanding its application range.

[0003] Currently, camera modules typically include multiple lens components, resulting in poor space utilization in electronic devices. Summary of the Invention

[0004] This application provides a camera module and an electronic device. It solves the problem in the prior art where multiple lens assemblies occupy space in electronic devices, resulting in low space utilization. The technical solution is as follows:

[0005] On one hand, a camera module is provided, the camera module comprising:

[0006] Circuit board;

[0007] At least two photosensitive chips fixed on the same circuit board;

[0008] A base connected to the side of the circuit board facing the at least two photosensitive chips, the base having at least two isolated carrier cavities and at least two light-transmitting holes that are connected to the at least two carrier cavities in a one-to-one correspondence, the at least two carrier cavities corresponding to the at least two photosensitive chips, each of the photosensitive chips being distributed in the corresponding carrier cavity;

[0009] The device includes at least two lens components, each of which is connected to at least one side of the base away from the circuit board. Each of the at least two lens components corresponds to one of the at least two photosensitive chips, with the photosensitive surface of each photosensitive chip facing the corresponding lens component through the light-transmitting hole.

[0010] Optionally, the lens component includes: a support member and a lens body. The support member has a mounting cavity and a light-transmitting opening communicating with the mounting cavity. At least a portion of the support member is fixed to the side of the base away from the circuit board. At least a portion of the lens body is located within the mounting cavity, and the lens body is used to receive light transmitted through the light-transmitting opening and guide the light to the corresponding photosensitive chip.

[0011] In this configuration, the two support members in two adjacent lens components are arranged in contact.

[0012] Optionally, the at least two lens components include: a first lens component and a second lens component arranged side by side, and the at least two photosensitive chips include: a first photosensitive chip corresponding to the first lens component and a second photosensitive chip corresponding to the second lens component;

[0013] The optical axis of the lens body in the first lens component coincides with the central axis of the first photosensitive chip;

[0014] The optical axis of the lens body in the second lens component includes: a first sub-optical axis that coincides with the central axis of the second photosensitive chip, a second sub-optical axis that is parallel to but does not coincide with the first sub-optical axis, and a third sub-optical axis located between the first sub-optical axis and the second sub-optical axis, wherein the third sub-optical axis intersects with the first sub-optical axis.

[0015] Optionally, the lens body in the second lens component includes: a first reflective element and a second reflective element, and a lens group located between the first reflective element and the second reflective element, wherein the reflective surface of the first reflective element faces the second photosensitive chip and the lens group, and the reflective surface of the second reflective element faces the lens group and the light-transmitting port in the second lens component;

[0016] The third sub-optical axis coincides with the optical axis of the lens group.

[0017] Optionally, the support member in the second lens component includes: a first sub-support member and a second sub-support member connected to each other, the first sub-support member being connected to the side of the base away from the circuit board, and the first sub-support member being in contact with the support member in the first lens component, and the second sub-support member being located on the side of the first sub-support member away from the first lens component.

[0018] The first sub-support member has a first sub-cavity, the second sub-support member has a second sub-cavity communicating with the first sub-cavity, and the light-transmitting port in the second lens component is communicating with the second sub-cavity;

[0019] The first reflective element is located within the first sub-cavity, while the lens group and the second reflective element are both located within the second sub-cavity.

[0020] Optionally, the first sub-support member has a first top plate on the side opposite to the base, and a second top plate fixedly connected to one end of the first top plate, wherein the end of the second top plate opposite to the first top plate is fixedly connected to the second sub-support member.

[0021] The side of the first top plate facing away from the base is flush with the side of the support member in the first lens component facing away from the base, and the second top plate is arranged parallel to the reflective surface of the first reflective element.

[0022] Optionally, the second sub-support member has a third top plate on the side opposite to the base, the third top plate is fixedly connected to the end of the second top plate opposite to the first top plate, and the third top plate and the first top plate are arranged parallel to each other; the light-transmitting opening in the second lens component is located on the third top plate.

[0023] Optionally, the first sub-support member includes: a first top plate and a second top plate, and a first side plate fixedly connected to the edge portions of both the first top plate and the second top plate, wherein the side of the first side plate facing away from the first top plate and the second top plate is connected to the base;

[0024] The second sub-support member includes: the third top plate, and a second side plate fixedly connected to the edge portion of the third top plate, the second side plate being fixedly connected to the first side plate, and the second side plate and the first side plate forming an annular side plate;

[0025] The second lens component further includes: an encapsulation base arranged side by side with the base, the encapsulation base being fixedly connected to the side of the second side plate opposite to the third top plate.

[0026] Optionally, the camera module further includes at least two infrared filters corresponding to the at least two light-transmitting holes, wherein the at least two infrared filters are fixed on the side of the base away from the circuit board, and each infrared filter is used to cover the area where the corresponding light-transmitting hole is located.

[0027] On the other hand, an electronic device is provided, the electronic device comprising: a housing, and a camera module mounted within the housing, the camera module being any of the camera modules given above.

[0028] The beneficial effects of the technical solutions provided in this application include at least the following:

[0029] A camera module may include: a circuit board, at least two photosensitive chips, a base, and at least two lens components. By placing at least two photosensitive chips corresponding to at least two lens components on the same circuit board, and housing the photosensitive chips within a support cavity in the base, and allowing each of the at least two lens components to be connected to the side of the base opposite to the circuit board, a shared circuit board design for at least two lens components in the camera module is achieved. This effectively reduces the size of the camera module and the space it occupies within the electronic device. Furthermore, while ensuring a miniaturized design, other components can be flexibly arranged within the internal space of the electronic device, improving space utilization. For example, a smaller camera module size allows for more space for the battery, increasing battery life. In other aspects, sharing the circuit board with at least two photosensitive chips ensures that they are located on the same reference plane, thereby ensuring good relative positional accuracy between the lens components and the photosensitive chips during installation, resulting in smoother image quality when the camera module zooms (i.e., switching from one lens component to another for imaging). For example, it reduces the probability of undesirable phenomena such as abrupt changes in image brightness, color, and viewing angle when zooming. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of a camera module provided in an embodiment of this application;

[0032] Figure 2 yes Figure 1 An exploded view of the camera module is shown.

[0033] Figure 3 yes Figure 1 A cross-sectional view of the camera module shown;

[0034] Figure 4 This is a cross-sectional view of another camera module provided in an embodiment of this application;

[0035] Figure 5 This is a cross-sectional view of another camera module provided in the embodiments of this application;

[0036] Figure 6 This is a partial structural diagram of a camera module provided in an embodiment of this application;

[0037] Figure 7 This is a schematic diagram of another camera module provided in an embodiment of this application;

[0038] Figure 8 yes Figure 7 A cross-sectional view of the camera module shown;

[0039] Figure 9 This is an exploded view of another camera module provided in an embodiment of this application;

[0040] Figure 10 This is a schematic diagram of the structure of a smartphone provided in an embodiment of this application.

[0041] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0043] Please refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a schematic diagram of the structure of a camera module provided in an embodiment of this application. Figure 2 yes Figure 1 The diagram shown is an exploded view of the camera module. Figure 3 yes Figure 1 The diagram shows a cross-sectional view of a camera module. The camera module 000 may include: a circuit board 100, at least two photosensitive chips 200, a base 300, and at least two lens components 400.

[0044] At least two photosensitive chips 200 in the camera module 000 can be fixed on the same circuit board 100 and can be electrically connected to the circuit board 100. Here, since at least two lens components 400 are set on the same circuit board 100, only one flexible circuit board can be used to achieve the electrical connection between the circuit board 100 and the motherboard in the electronic device.

[0045] The base 300 in the camera module 000 can be connected to the side of the circuit board 100 facing at least two photosensitive chips 200. The base 300 can have at least two isolated carrier cavities 301 and at least two light-transmitting holes 302 corresponding to each of the at least two carrier cavities 301. Each of the at least two carrier cavities 301 can correspond to at least two photosensitive chips 200, and each photosensitive chip 200 can be distributed within its corresponding carrier cavity 301. In this way, each photosensitive chip 200 is distributed within its corresponding carrier cavity 301, while the carrier cavities 301 are isolated from each other, ensuring that there is no cross-contamination between the light rays incident on the photosensitive surface of each photosensitive chip.

[0046] In the camera module 000, at least two lens components 400 are connected to at least one side of the base 300 away from the circuit board 100, and each lens component 400 corresponds to at least two photosensitive chips 200. The photosensitive surface of each photosensitive chip 200 faces the corresponding lens component 400 through a corresponding light-transmitting hole 302. For example, the camera module 000 in this embodiment can be installed in an electronic device. When the electronic device takes a picture, firstly, light reflected from the surface of an external object can be transmitted through the lens components in the camera module 000 to the photosensitive chip in the camera module 000. The photosensitive chip can sense and collect the light reflected from the surface of the external object and generate corresponding image information. Then, the circuit board in the camera module can transmit the image information generated by the photosensitive chip to the electronic device with this camera module, so that the electronic device can display the corresponding image.

[0047] In this embodiment, by placing at least two photosensitive chips 200 corresponding to at least two lens components 400 on the same circuit board 100, and placing the photosensitive chips 200 within the carrier cavity 301 in the base 300, each of the at least two lens components 400 can be connected to the side of the base 300 opposite to the circuit board 100. This achieves a shared circuit board 100 design for at least two lens components 400 in the camera module 000, effectively reducing the size of the camera module 000 and thus reducing the space occupied by the camera module 000 within the electronic device. Furthermore, while ensuring a miniaturized design of the electronic device, other components can be flexibly arranged within the internal space of the electronic device, improving space utilization. For example, a smaller camera module size allows for more space to be allocated for the battery, increasing the battery life of the electronic device. In other aspects, by setting at least two image sensors on the same circuit board, it can be ensured that at least two image sensors are located on the same reference plane. This ensures better relative positional accuracy between different lens components and the image sensors, resulting in better image smoothness when the camera module zooms (i.e., switching from one lens component to another for imaging). For example, it reduces the probability of undesirable phenomena such as abrupt changes in brightness, color, and viewing angle during zooming.

[0048] In summary, this application provides a camera module that may include: a circuit board, at least two photosensitive chips, a base, and at least two lens components. By placing at least two photosensitive chips corresponding to at least two lens components on the same circuit board and housing the photosensitive chips within a support cavity in the base, and allowing each of the at least two lens components to be connected to the side of the base away from the circuit board, a shared circuit board design for at least two lens components in the camera module is achieved. This effectively reduces the size of the camera module and the space it occupies within the electronic device. Furthermore, while ensuring the miniaturization of the electronic device, other components can be flexibly arranged within the internal space of the electronic device, improving space utilization. For example, a smaller camera module size allows for more space for the battery, increasing battery life. In other aspects, sharing the circuit board with at least two photosensitive chips ensures that they are located on the same reference plane, thereby ensuring good relative positional accuracy between the lens components and the photosensitive chips during installation, resulting in smoother image quality when the camera module zooms (i.e., switching from one lens component to another). For example, it reduces the probability of undesirable phenomena such as abrupt changes in image brightness, color, and viewing angle when zooming.

[0049] Optional, please refer to Figure 4 , Figure 4This is a cross-sectional view of another camera module provided in this application embodiment. The lens component 400 in the camera module 000 may include a support member 401 and a lens body 402. The support member 401 may have a mounting cavity 401a and a light-transmitting opening 401b communicating with the mounting cavity 401a. At least a portion of the support member 401 may be fixed to the side of the base 300 opposite to the circuit board 100. At least a portion of the lens body 402 may be located within the mounting cavity 401a, and the lens body 402 may be used to receive light transmitted through the light-transmitting opening 401b on the support member 401 and guide the light to the photosensitive chip 200 corresponding to this lens component. The two support members 401 in two adjacent lens components 400 may be in contact. In this case, by mounting the lens body 402 in the lens component 400 within the mounting cavity 401a in the support member 401, the lens body 402 can achieve focusing and image stabilization within the mounting cavity 401a in the support member 401. Furthermore, the two support members 401 in the two adjacent lens components 400 are arranged in contact, which effectively reduces the size of the camera module 000 and thus reduces the internal space occupied by the camera module 000 in the electronic device.

[0050] In the embodiments of this application, please refer to Figure 5 , Figure 5 This is a cross-sectional view of another camera module provided in this application embodiment. The camera module 000 may include at least two lens components 400, including a first lens component A1 and a second lens component A2 arranged side-by-side. The camera module 000 may include at least two photosensitive chips 200, including a first photosensitive chip B1 corresponding to the first lens component A1 and a second photosensitive chip B2 corresponding to the second lens component A2. The optical axis F1 of the lens body 402 in the first lens component A1 may coincide with the central axis of the first photosensitive chip B1. The optical axis of the lens body 402 in the second lens component A2 may include a first sub-optical axis F21 coinciding with the central axis of the second photosensitive chip B2, a second sub-optical axis F22 parallel to but not coinciding with the first sub-optical axis F21, and a third sub-optical axis F23 located between the first sub-optical axis F21 and the second sub-optical axis F22. The third sub-optical axis F23 may intersect with the first sub-optical axis F21. It should be noted that this application embodiment uses two lens components in the camera module 000 as an example for illustrative purposes. Here, the optical axis F1 of the lens body 402 in the first lens component A1 can coincide with the central axis of the first photosensitive chip B1, and the optical axis of the lens body 402 in the second lens component A2 can include three optical axis segments, that is, the second lens component A2 can be a periscope lens, so that the focal length of the second lens component A2 is greater than the focal length of the first lens component A1, realizing the design of a common circuit board 100 for two lens components with different focal lengths.

[0051] Optional, such as Figure 5 As shown, the lens body 402 in the second lens assembly A2 may include: a first reflective element 402a and a second reflective element 402b, and a lens group 402c located between the first reflective element 402a and the second reflective element 402b. The reflective surface a1 of the first reflective element 402a faces the second photosensitive chip B2 and the lens group 402c, and the reflective surface b1 of the second reflective element 402b faces the lens group 402c and the light-transmitting aperture 401b in the second lens assembly A2. The third sub-optical axis F23 of the lens body 402 in the second lens assembly A2 may coincide with the optical axis of the lens group 402c. In this case, by providing two reflective elements in the lens body 402 of the second lens assembly A2, light incident from the light-transmitting aperture 401b in the second lens assembly A2 can be deflected by the two reflective elements and then directed towards the second photosensitive chip B2. Furthermore, the focusing and image stabilization functions of the second lens assembly A2 can be achieved by moving the lens group 402c. In this application, the arrangement direction of the second reflective element 402b and the light-transmitting port 401b in the second lens component A2 can be parallel to the arrangement direction of the first reflective element 402a and the second photosensitive chip B2, and the arrangement direction of the first reflective element 402a, the lens group 402c and the second reflective element 402b can be perpendicular to the arrangement direction of the first reflective element 402a and the second photosensitive chip B2.

[0052] For example, please refer to Figure 5 and Figure 6 , Figure 6This is a partial structural schematic diagram of a camera module provided in an embodiment of this application. The second reflective element 402b can be a prism in the shape of a triangular prism. The second reflective element 402b has a first light-transmitting surface b2 and a second light-transmitting surface b3 arranged perpendicularly to each other, and a first reflective surface b1 located between the first light-transmitting surface b2 and the second light-transmitting surface b3. The first light-transmitting surface b2 can be parallel to the opening surface of the light-transmitting aperture 401b in the second lens component A2, and the second light-transmitting surface b3 can be parallel to the light-incident surface of the lens group 402c. The first reflective surface b1 can face the lens group 402c and the light-transmitting aperture 401b in the second lens component A2. In this way, the light incident from the light-transmitting aperture 401b in the second lens component A2 passes through the first light-transmitting surface b2, and after being incident on the first reflective surface b1, it is reflected by the first reflective surface b1 to the second light-transmitting surface b3. The light then passes through the second light-transmitting surface b3 and is incident on the light-incident surface of the lens group 402c. The first reflective element 402a can be a prism in the shape of a triangular prism. The first reflective element 402a has a third light-transmitting surface a2 and a fourth light-transmitting surface a3 arranged perpendicularly to each other, and a second reflective surface a1 located between the third light-transmitting surface a2 and the fourth light-transmitting surface a3. The third light-transmitting surface a2 can be parallel to the light-emitting surface of the lens group 402c, and the fourth light-transmitting surface a3 can be parallel to the photosensitive surface of the second photosensitive chip B2. The second reflective surface a1 can face the second photosensitive chip B2 and the lens group 402c. In this way, the light emitted from the light-emitting surface of the lens group 402c is transmitted through the third light-transmitting surface a2 and then reflected by the second reflective surface a1 towards the fourth light-transmitting surface a3. After that, the light passes through the fourth light-transmitting surface a3 and is incident on the photosensitive surface of the second photosensitive chip B2.

[0053] In the embodiments of this application, please refer to Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of another camera module provided in an embodiment of this application. Figure 8 yes Figure 7The diagram shows a cross-sectional view of the camera module. The support member 401 in the second lens component A2 may include a first sub-support member 4011 and a second sub-support member 4012 connected to each other. The first sub-support member 4011 may be connected to the side of the base 300 opposite to the circuit board 100, and the first sub-support member 4011 may be in contact with the support member 401 in the first lens component A1. Here, the second sub-support member 4012 may be located on the side of the first sub-support member 4011 opposite to the first lens component A1. The first sub-support member 4011 may have a first sub-cavity q1, and the second sub-support member 4012 may have a second sub-cavity q2 communicating with the first sub-cavity q1. The light-transmitting opening 401b in the second lens component A2 may communicate with the second sub-cavity q2 in the second sub-support member 4012. In this configuration, the first reflective element 402a can be distributed within the first sub-cavity q1 of the first sub-support member 4011, while the lens group 402c and the second reflective element 402b can be evenly distributed within the second sub-cavity q2. In this case, by having the first sub-support member 4011 in contact with the support member 401 in the first lens component A1, and the second sub-support member 4012 disposed on the side of the first sub-support member 4011 facing away from the first lens component A1, with the first reflective element 402a distributed within the first sub-cavity q1 of the first sub-support member 4011, and the lens group 402c and the second reflective element 402b both distributed within the second sub-cavity q2, the distance between the second photosensitive chip B2 and the first photosensitive chip B1 located on the reflective surface side of the first reflective element 402a is shorter, resulting in a shorter circuit board 100 length, which helps to save on the manufacturing cost of the circuit board 100.

[0054] In this application, as Figure 7 and Figure 8As shown, the support member 401 in the first lens component A1 can be a first support member C1, and the support member 401 in the second lens component A2 can be a second support member C2. The side of the first sub-support member 4011 in the second support member C2 facing away from the base 300 can have: a first top plate C21, and a second top plate C22 fixedly connected to one end of the first top plate C21. The end of the second top plate C22 facing away from the first top plate C21 can be fixedly connected to the second sub-support member 4012. The side c1 of the first top plate C21 facing away from the base 300 can be flush with the side c2 of the first support member C1 facing away from the base 300 in the first lens component A1, and the second top plate C22 can be arranged parallel to the reflective surface a1 of the first reflective element 402a. In this configuration, by placing the second photosensitive chip B2 parallel to the first photosensitive chip B1 on the circuit board 100, and placing the first reflective element 402a within the first sub-cavity q1 of the first sub-support 4011 in the second support C2, the second top plate C22 of the first sub-support 4011 in the second support C2 can be positioned parallel to the reflective surface a1 of the first reflective element 402a. Furthermore, the side c1 of the first top plate C21 of the first sub-support 4011 facing away from the base 300 is flush with the side c2 of the first support C1 in the first lens assembly A1 facing away from the base 300, effectively reducing the local shoulder height of the camera module 000. Additionally, other components can be placed within the space formed by the side of the first support C1 facing away from the base 300, the side of the first top plate C21 facing away from the base 300, and the side of the second top plate C22 facing away from the base 300 in the first lens assembly A1, ensuring high space utilization of the electronic device.

[0055] Optional, such as Figure 7 and Figure 8 As shown, the second sub-support member 4012 of the second support member C2 of the second lens component A2 may have a third top plate C23 on the side opposite to the base 300. This third top plate C23 can be fixedly connected to the end of the second top plate C22 opposite to the first top plate C21, and the third top plate C23 can be arranged parallel to the first top plate C21. The light-transmitting opening 401b in the second lens component A2 can be located on the third top plate C23 of the second sub-support member 4012. In this case, by setting the third top plate C23 parallel to the first top plate C21, the first top plate C21 and the side of the first support member C1 in the first lens component A1 opposite to the base are flush, and the light-transmitting opening 401b in the first lens component A1 can be located on the side of the first support member C1 in the first lens component A1 opposite to the base 300. Thus, the orientation of the light-transmitting opening 401b in the first lens component A1 and the orientation of the light-transmitting opening 401b in the second lens component A2 can be the same.

[0056] In the embodiments of this application, such as Figure 7 and Figure 8 As shown, the first sub-support member 4011 in the second support member C2 of the second lens component A2 may include: a first top plate C21 and a second top plate C22, and a first side plate C24 fixedly connected to the edge portions of both the first top plate C21 and the second top plate C22. The side of the first side plate C24 facing away from the first top plate C21 and the second top plate C22 may be fixedly connected to the base 300. The second sub-support member 4012 in the second support member C2 of the second lens component A2 may include: a third top plate C23, and a second side plate C25 fixedly connected to the edge portion of the third top plate C23. The second side plate C25 and the first side plate C24 may be fixedly connected, and the second side plate C25 and the first side plate C24 may be used to form an annular side plate. The second lens component A2 may also include: an encapsulation base 403 arranged side by side with the base 300, and the encapsulation base 403 may be fixedly connected to the side of the second side plate C25 facing away from the third top plate C23. Thus, the base 300 and the encapsulation base 403, arranged side by side, can be used to encapsulate the first sub-cavity q1 of the first sub-support 4011 and the second sub-cavity q2 of the second sub-support 4012, thereby protecting the components located within the two sub-cavities. Here, the first sub-cavity q1 of the first sub-support 4011 and the second sub-cavity q2 of the second sub-support 4012 can form the mounting cavity 401a of the second support C2 in the second lens component A2.

[0057] Optional, please refer to Figure 9 , Figure 9 This is an exploded view of another camera module provided in this application embodiment. The camera module 000 may further include at least two infrared filters 500 corresponding one-to-one with at least two light-transmitting holes 302 on the base 300. Each of the at least two infrared filters 500 can be fixed to the side of the base 300 facing away from the circuit board 100, and each infrared filter 500 can cover the area where the corresponding light-transmitting hole 302 is located. In this case, by providing an infrared filter 500 between the lens component 400 and the photosensitive chip 200, the infrared filter 500 can prevent infrared radiation from causing image distortion. In this application, as... Figure 9As shown, the base 300, on the side facing away from the circuit board 100, may have a limiting mounting groove 303 corresponding to at least two infrared filters 500. Each limiting mounting groove 303 may communicate with a corresponding light-transmitting hole 302, and each infrared filter 500 may be fixed within the corresponding limiting mounting groove 303. For example, the at least two infrared filters 500 may include a first infrared filter D1 corresponding to the first lens component A1 and a second infrared filter D2 corresponding to the second lens component A2. Thus, the light beam emitted from the first lens component A1 is filtered by the first infrared filter D1 and then directed towards the first photosensitive chip B1; the light beam emitted from the second lens component A2 is filtered by the second infrared filter D2 and then directed towards the second photosensitive chip B2. In this case, by setting a limiting mounting groove 303 on the side of the base 300 away from the circuit board 100, each infrared filter 500 can be fixed in the corresponding limiting mounting groove 303, which ensures the installation accuracy of the infrared filter 500, and thus ensures the positional accuracy of the infrared filter 500 and the photosensitive chip 200.

[0058] In summary, this application provides a camera module that may include: a circuit board, at least two photosensitive chips, a base, and at least two lens components. By placing at least two photosensitive chips corresponding to at least two lens components on the same circuit board and housing the photosensitive chips within a support cavity in the base, and allowing each of the at least two lens components to be connected to the side of the base away from the circuit board, a shared circuit board design for at least two lens components in the camera module is achieved. This effectively reduces the size of the camera module and the space it occupies within the electronic device. Furthermore, while ensuring a miniaturized design of the electronic device, other components can be flexibly arranged within the internal space of the electronic device, increasing its space utilization. For example, a smaller camera module size allows for more space for the battery, improving battery life. In other aspects, sharing the circuit board with at least two photosensitive chips ensures that they are located on the same reference plane, thereby ensuring good relative positional accuracy between the lens components and the photosensitive chips during installation, resulting in smoother images when the camera module zooms (i.e., switching from one lens component to another for imaging). For example, it reduces the probability of undesirable phenomena such as abrupt changes in image brightness, color, and viewing angle when zooming.

[0059] This application also provides an electronic device, which may include, but is not limited to, devices with cameras such as webcams, smartphones, smartwatches, and tablets. The electronic device may include a housing 001 and a camera module 000 installed within the housing 001. This camera module 000 may be any of the camera modules given above. For examples, please refer to... Figure 10 , Figure 10 This is a schematic diagram of the structure of a smartphone according to an embodiment of this application. The smartphone can integrate any of the camera modules given in the above embodiments. The lens component in the camera module 000 can be the rear lens of the smartphone.

[0060] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0061] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A camera module, characterized in that, include: Circuit board (100); At least two photosensitive chips (200) are fixed on the same circuit board (100); A base (300) is connected to the side of the circuit board (100) facing the at least two photosensitive chips (200). The base (300) has at least two isolated carrier cavities (301) and at least two light-transmitting holes (302) that are connected to the at least two carrier cavities (301) in a one-to-one correspondence. The at least two carrier cavities (301) correspond to the at least two photosensitive chips (200), and each photosensitive chip (200) is distributed in the corresponding carrier cavity (301). And at least two lens components (400), each of which is connected to at least one side of the base (300) away from the circuit board (100), and each of the at least two lens components (400) corresponds one-to-one with the at least two photosensitive chips (200), with the photosensitive surface of each photosensitive chip (200) facing the corresponding lens component (400) through the light-transmitting hole (302).

2. The camera module according to claim 1, characterized in that, The lens component (400) includes a support member (401) and a lens body (402). The support member (401) has a mounting cavity (401a) and a light-transmitting opening (401b) communicating with the mounting cavity (401a). At least a portion of the support member (401) is fixed to the base (300) on the side opposite to the circuit board (100). At least a portion of the lens body (402) is located in the mounting cavity (401a), and the lens body (402) is used to receive light transmitted through the light-transmitting opening (401b) and guide the light to the corresponding photosensitive chip (200). In this configuration, two of the support members (401) in two adjacent lens components (400) are in contact with each other.

3. The camera module according to claim 2, characterized in that, The at least two lens components (400) include: a first lens component (A1) and a second lens component (A2) arranged side by side, and the at least two photosensitive chips (200) include: a first photosensitive chip (B1) corresponding to the first lens component (A1) and a second photosensitive chip (B2) corresponding to the second lens component (A2). The optical axis (F1) of the lens body (402) in the first lens component (A1) coincides with the central axis of the first photosensitive chip (B1); The optical axis of the lens body (402) in the second lens component (A2) includes: a first sub-optical axis (F21) that coincides with the central axis of the second photosensitive chip (B2), a second sub-optical axis (F22) that is parallel to but does not coincide with the first sub-optical axis (F21), and a third sub-optical axis (F23) located between the first sub-optical axis (F21) and the second sub-optical axis (F22), wherein the third sub-optical axis (F23) intersects with the first sub-optical axis (F21).

4. The camera module according to claim 3, characterized in that, The lens body (402) in the second lens assembly (A2) includes: a first reflective element (402a) and a second reflective element (402b), and a lens group (402c) located between the first reflective element (402a) and the second reflective element (402b). The reflective surface (a1) of the first reflective element (402a) faces the second photosensitive chip (B2) and the lens group (402c), and the reflective surface (b1) of the second reflective element (402b) faces the lens group (402c) and the light-transmitting aperture (401b) in the second lens assembly (A2). The third sub-optical axis (F23) coincides with the optical axis of the lens group (402c).

5. The camera module according to claim 4, characterized in that, The support member (401) in the second lens component (A2) includes: a first sub-support member (4011) and a second sub-support member (4012) connected to each other. The first sub-support member (4011) is connected to the side of the base (300) away from the circuit board (100), and the first sub-support member (4011) is in contact with the support member (401) in the first lens component (A1). The second sub-support member (4012) is located on the side of the first sub-support member (4011) away from the first lens component (A1). The first sub-support member (4011) has a first sub-cavity (q1), the second sub-support member (4012) has a second sub-cavity (q2) communicating with the first sub-cavity (q1), and the light-transmitting port (401b) in the second lens component (A2) is communicating with the second sub-cavity (q2); The first reflective element (402a) is located within the first sub-cavity (q1), and the lens group (402c) and the second reflective element (402b) are both located within the second sub-cavity (q2).

6. The camera module according to claim 5, characterized in that, The first sub-support member (4011) has a first top plate (C21) on the side opposite to the base (300), and a second top plate (C22) fixedly connected to one end of the first top plate (C21), the end of the second top plate (C22) opposite to the first top plate (C21) being fixedly connected to the second sub-support member (4012); The side (c1) of the first top plate (C21) facing away from the base (300) is flush with the side (c2) of the support member (401) in the first lens component (A1) facing away from the base (300), and the second top plate (C22) is arranged parallel to the reflective surface (a1) of the first reflective element (402a).

7. The camera module according to claim 6, characterized in that, The second sub-support member (4012) has a third top plate (C23) on the side opposite to the base (300). The third top plate (C23) is fixedly connected to the end of the second top plate (C22) opposite to the first top plate (C21), and the third top plate (C23) and the first top plate (C21) are arranged in parallel. The light-transmitting hole (401b) in the second lens component (A2) is located on the third top plate (C23).

8. The camera module according to claim 6, characterized in that, The first sub-support member (4011) includes: a first top plate (C21) and a second top plate (C22), and a first side plate (C24) fixedly connected to the edge portions of both the first top plate (C21) and the second top plate (C22), wherein the side of the first side plate (C24) facing away from the first top plate (C21) and the second top plate (C22) is connected to the base (300); The second sub-support member (4012) includes: the third top plate (C23), and a second side plate (C25) fixedly connected to the edge portion of the third top plate (C23), the second side plate (C25) being fixedly connected to the first side plate (C24), and the second side plate (C25) and the first side plate (C24) forming an annular side plate; The second lens component (A2) further includes an encapsulation base (403) arranged side by side with the base (300), the encapsulation base (403) being fixedly connected to the side of the second side plate (C25) away from the third top plate (C23).

9. The camera module according to any one of claims 1-8, characterized in that, The camera module further includes at least two infrared filters (500) corresponding to the at least two light-transmitting holes (302), the at least two infrared filters (500) being fixed on the side of the base (300) away from the circuit board (100), and each infrared filter (500) covering the area where the corresponding light-transmitting hole (302) is located.

10. An electronic device, characterized in that, include: The housing (001) and the camera module (000) installed within the housing (001), wherein the camera module (000) is the camera module according to any one of claims 1 to 9.

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