Integrated circuit system of coupling equipment

Abstract

The invention discloses an integrated circuit system of coupling equipment, and relates to the technical field of optoelectronic device packaging. According to the system, the main control module and the golden finger connector are integrated through the communication base plate, and the LED light source driving module, the photoelectric detection module and other functional modules are connected in a pluggable mode to form closed-loop control. And the main control module adopts a double-microcontroller architecture, so that data acquisition and driving control are separated, and the real-time response efficiency is improved. Each functional module is connected with the communication base plate through a golden finger connector, and an expansion interface of each functional module supports the access of a UV curing controller and other modules, so that the expansibility of the system is enhanced. The device is high in integration degree and excellent in module cooperation efficiency, coupling time can be shortened, hardware cost and maintenance cost can be reduced, production line beat efficiency and equipment operation stability can be improved, and the device is suitable for automatic coupling packaging of elements such as optical modules and lasers.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optoelectronic device packaging, in particular to an integrated circuit system for automatic coupling alignment and packaging of optical modules, lasers and TO packaging elements. BACKGROUND

[0002] In the field of photoelectric coupling device manufacturing, the traditional technical solution usually adopts a discrete control system architecture, which deploys core function modules such as program-controlled power supply, optical power detection, light source driving, motion control, etc. as independent units. This discrete architecture exposes obvious systematic defects in actual application: each function module needs to be independently configured with a communication interface, resulting in communication delay when devices work together; the power supply systems of different modules are independent of each other, increasing system power consumption and wiring complexity; each module uses an independent control unit, making parameter calibration difficult and global synchronous control difficult to achieve. Especially in batch production scenarios, this architecture requires operators to debug each module individually, which not only increases labor costs, but also easily causes product quality fluctuations due to human operation differences. In addition, the discrete design requires detection of each module one by one when maintaining the device, significantly reducing maintenance efficiency. There is a lack of an integrated solution in the prior art that can achieve multi-module collaborative control, centralized data processing and scalability, which severely restricts the production efficiency improvement and cost optimization of photoelectric coupling devices.

[0003] In view of these problems of the traditional mode, it is urgent to develop an integrated system that highly integrates control, acquisition and vision to replace the traditional independent module accumulation method, thereby solving the maintenance efficiency problem, reducing costs, improving operation efficiency, especially achieving a breakthrough in coupling efficiency, reducing coupling time, and reducing production costs for production enterprises. SUMMARY

[0005] The purpose of the present application is to provide an integrated circuit system of a coupling device and a modular control method thereof, which has the advantages of high integration degree, efficient inter-module collaborative control, and strong system scalability. The technical solution is as follows: An integrated circuit system of a coupling device, comprising: A communication backplane 1 integrated with a master control module 11 and a gold finger connector 2; the master control module 11 is in communication connection with an external host computer; The master module 11 is pluggable connected with LED light source driving module 3, light source board module 4, photoelectric detection module 5, signal conversion module 6 and motion control module 7 through the golden finger connector 2; wherein, the master module 11 receives the signals output by the photoelectric detection module 5 and the signal conversion module 6 and uploads to the external host computer; the master module 11 receives the control instructions generated by the external host computer, and drives the LED light source driving module 3 and the motion control module 7 based on the control instructions and adjusts the driving current parameters of the light source board module 4 through the LED light source driving module 3.

[0006] Further, the master module 11 comprises: The first microcontroller 111 is used as a master controller of the coupling device, and is in communication connection with the external host computer through the USB hub 12; the first microcontroller 111 is provided with a plurality of input pins 111a for collecting digital signals output by the photoelectric detection module 5 and the signal conversion module 6; The second microcontroller 112 is used as a coprocessor of the coupling device, and is provided with a plurality of first output pins 112a and a plurality of second output pins 112b; the first output pins 112a are used to output control signals to drive the LED light source driving module 3, and the second output pins 112b are used to output control signals to drive the motion control module 7; the second microcontroller 112 is connected with a first storage circuit 112c through an I2C bus 13, which is used to store control parameters, calibration data or configuration information of working mode of the coupling device.

[0007] Further, the second microcontroller 112 is connected in communication with the first microcontroller 111 through a USB pin 112d; the first output pins 112a of the second microcontroller 112 output analog voltage to the LED light source driving module 3; the first microcontroller 111 is configured to collect feedback data of the photoelectric detection module 5 through the signal input pins 111a, and can be sent to the second microcontroller 112 through the USB pin 112d; the second microcontroller 112 is configured to adjust the signals output to the LED light source driving module 3 according to the received data; the second microcontroller 112 outputs step motor pulse and direction signal to the motion control module 7 through the second output pins 112b.

[0008] Further, the light source board module 4 comprises: The SFP optical module interface control circuit 41 is provided with a communication pin 411 connected with the I2C bus 13 and a fault detection pin 412 connected with the first microcontroller 111.

[0009] The high-speed drive circuit 42 is provided with a level conversion chip 421; a drive signal pin 421a of the level conversion chip 421 receives a drive signal of a first output pin 112a of the second microcontroller 112, and a differential output pin 421b is connected to an input end of the SFP optical module interface control circuit 41; The power supply circuit 43 converts a +24V input into a +3.3V output through a power conversion chip 431, and a current sampling signal is fed back to the first microcontroller 111 through a feedback pin 432a.

[0010] Further, the photoelectric detection module 5 comprises: The photoelectric conversion circuit 51 is provided with a photoelectric detector 511, which is used to receive an external optical signal and convert it into a weak current signal; The logarithmic amplification circuit 52 is a logarithmic amplifier chip 521 with an integrated model number AD8304, an input end of which is connected to an output end of the photoelectric conversion circuit 51, which is used to perform logarithmic amplification processing on the weak current signal and output an analog voltage signal in a logarithmic linear relationship with the optical power; The detection chip circuit 53 is a detection chip 531 with an integrated model number C8051F340, which is connected to a voltage output end of the logarithmic amplification circuit 52 and is in communication connection with the first microcontroller 111 through an I2C bus 13, which is used to convert the analog voltage signal output by the logarithmic amplification circuit 52 into a digital signal and transmit it to the first microcontroller 111.

[0011] Further, the signal conversion module 6 comprises: The multi-channel analog input channel 61 is used to collect voltage signals of external sensors; The signal conditioning circuit 62 is connected to an output end of the multi-channel analog input channel 61, which is used to suppress overcurrent through a current-limiting resistor and filter out high-frequency noise through a filter capacitor; The analog-to-digital converter 63 is connected to an output end of the signal conditioning circuit 62 and is in communication connection with the first microcontroller 111 through an SPI bus 14, which is used to convert the analog voltage signal output by the signal conditioning circuit 62 into a digital signal.

[0012] Further, the optical fiber transceiver module 8 comprises: The power supply mode switching circuit 81 comprises a linear voltage stabilizer 811, which is used to provide an optional power supply voltage for an external optical module.

[0013] The second storage circuit 82 is connected to the main control module 11 through an I2C bus 13, which is used to store power supply mode configuration information of the external optical module; The network interface circuit (83) includes a chip 831 of model IP113 and its peripheral circuit, which is configured to be connected to an external host computer and is in communication connection with the SFP optical module interface control circuit 41 of the light source board module 4, and is used to realize transmission coupling and electrical isolation between network data signals and the light source board module 4.

[0014] Further, the main control module 11 is connected with a 25MHz crystal oscillator circuit 11a and a matching first capacitor C64 and second capacitor C65, which are used to provide a clock signal for the main control module 11.

[0015] Further, the gold finger connector 2 has at least two gold finger expansion interfaces 21, which are used to be pluggably connected with a UV curing controller, a dispensing controller or a visual positioning module on a coupling device. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a schematic diagram of the overall architecture of the system of the present case; Figure 2 is a first microcontroller schematic diagram of the main control module of the present case; Figure 3 is a second microcontroller schematic diagram of the main control module of the present case; Figure 4 is a light source board module circuit diagram of the present case; Figure 5 is a photoelectric detection module circuit diagram of the present case; Figure 6 is a signal conversion module circuit diagram of the present case; Figure 7 is a power supply mode switching circuit schematic diagram of the optical fiber transceiver module of the present case; Figure 8 is a network interface circuit and a second storage circuit schematic diagram of the optical fiber transceiver module of the present case; DETAILED DESCRIPTION

[0017] The technical solutions in the present application will be clearly and completely described below with reference to the drawings in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. The components of the present application described and shown in the drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the present application. It should be noted that: similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. Meanwhile, in the description of the present application, the terms "first", "second", etc. are only used for differentiation, and cannot be understood as indicating or implying relative importance.

[0018] In the prior art, optoelectronic coupling devices usually realize functions in a separate module combination mode, and the parameters and communication interfaces of each module need to be debugged separately. Such a decentralized architecture results in a large device size, poor compatibility and synergy of different modules. In a mass production scenario, the operator needs to frequently switch the control interface of different modules, the debugging time is long and the maintenance cost is high. The physical connection mode between modules is complex, and when new functions are expanded, the hardware interface needs to be redesigned, affecting production efficiency.

[0019] To solve the above problems, the researchers found that the core contradiction of the traditional architecture lies in the physical isolation of the function modules and the fragmentation of the communication protocol. Through analysis, if the control unit and the function module are physically integrated and the communication protocol is unified, the hardware redundancy can be greatly reduced. Further considering the demand for module hot plugging in the production site, an extensible connector is used to realize modular deployment. At the same time, data acquisition and control instruction processing are concentrated in a single master module, which can avoid the delay problem caused by multiple controllers.

[0020] Therefore, the present application proposes an integrated circuit system including a communication backplane and a pluggable function module. As shown in Figure 1 The communication backplane 1 integrates a master module 11 and a gold finger connector 2, and the master module 11 communicates with an external host computer. The master module 11 connects an LED light source driving module 3, a light source board module 4, a photoelectric detection module 5, a signal conversion module 6 and a motion control module 7 through the gold finger connector 2. The master module 11 receives the signals of the photoelectric detection module 5 and the signal conversion module 6 and uploads them to the external host computer, and at the same time receives the instructions of the external host computer to drive the LED light source driving module 3 and the motion control module 7, and realizes closed-loop control by adjusting the driving current of the light source board module 4.

[0021] The communication baseboard 1 refers to the multi-layer printed circuit board that carries the main control module 11 and the gold finger connector 2. Specifically, it can be implemented using a four-layer FR-4 substrate, integrating a power layer and a signal isolation layer to ensure power supply stability and signal integrity for each module. The main control module 11 is a microcontroller unit with data processing and instruction distribution functions, specifically implemented using a dual-core ARM architecture processor, used to coordinate the timing of various functional modules. The gold finger connector 2 is an inter-board connection interface with a foolproof design, specifically implemented using a 0.8mm pitch PCI-E slot, with gold-plated contacts to ensure reliable high-frequency signal transmission.

[0022] Specifically, the communication baseboard 1, as the core carrier of the system, centrally processes data through its built-in main control module 11. When an external host computer sends control commands, the commands are transmitted to the main control module. After parsing the commands, the main control module sends a pulse width modulation signal to the LED light source driver module 3. This signal, after level conversion, drives the light source board module 4 to generate the required light intensity. The photoelectric detection module 5 monitors the light signal intensity in real time and feeds the detection data back to the main control module 11 to form a closed-loop regulation. The motion control module 7 receives the stepping pulse signal sent by the main control module 11 and drives the mechanical actuator to complete precise positioning. The various functional modules are physically connected through the gold finger connector 12, supporting hot-swapping operations while ensuring signal quality.

[0023] Compared to existing technologies, traditional solutions require separate controllers and communication interfaces for each functional module. This solution integrates the control unit through a communication baseboard. Existing technologies use fixed soldering to connect functional modules; this solution uses gold-finger connectors for modular expansion. Traditional architectures require multiple processors to work collaboratively for data acquisition and instruction execution; this solution uses a main control module to achieve unified scheduling of data processing and instruction distribution.

[0024] Through the above technical solutions, this application achieves plug-and-play functionality and centralized control of functional modules, reducing equipment debugging time. Modular design reduces the maintenance difficulty of individual functional units, allowing for rapid replacement when a module fails. A unified communication protocol eliminates signal delays caused by multiple interface conversions, improving system response speed. Centralized power supply design optimizes power management efficiency and reduces overall power consumption.

[0025] like Figures 1 to 3As shown, this application further proposes a main control module 11 including a first microcontroller 111 and a second microcontroller 112. The first microcontroller 111, as the main controller, communicates with an external host computer through a USB hub 12 and is provided with multiple input pins 111a for acquiring digital signals output by the photoelectric detection module 5 and the signal conversion module 6. The second microcontroller 112, as a coprocessor, is provided with multiple first output pins 112a and second output pins 112b, which drive the LED light source driving module 3 and the motion control module 7 respectively, and are connected to the first storage circuit 112c through the I2C bus 13 for storing control parameters, calibration data and working mode configuration information.

[0026] The first microcontroller 111 is a processing unit responsible for system-level communication and data integration. It can be implemented using an STM32F407 series chip. Its multiple input pins 111a can receive digital signals from the photoelectric detection module 5 and the signal conversion module 6 in parallel, avoiding timing conflicts during signal transmission. The USB hub 12 is an expansion interface device supporting the USB 2.0 protocol. It can be implemented using a TUSB8041 chip. Its downstream ports are expanded via board-to-board connectors for connecting pluggable functional modules. The second microcontroller 112 is a coprocessor unit dedicated to device driving and parameter execution. It can be implemented using an STM32F103 series chip. Its independent first output pin 112a and second output pin 112b form dedicated channels for the LED driving signal 3 and motion control signal 7, respectively, ensuring the stability of the analog signal output. The I2C bus 13 is a communication protocol used for parameter transmission between the main controller and the coprocessor. It can be implemented using a standard I2C physical interface, achieving physical isolation between control parameters and real-time data through two-wire communication. The first storage circuit 112c refers to an independent storage unit for storing the operating parameters of the storage device. Specifically, it can be implemented using an AT24C256 series EEPROM chip. By independently storing calibration data and operating mode configuration information, it avoids bus resource contention when calling parameters.

[0027] Specifically, the first microcontroller 111 establishes a real-time communication link with the host computer via the USB hub 12, receives external control commands, and integrates the input data from the photoelectric detection module 3 and the signal conversion module 5. The second microcontroller 112 reads preset control parameters from the first storage circuit 112c via the I2C bus 13, and dynamically adjusts the analog voltage signal output to the LED light source driver module 3 and generates stepper motor control pulses based on the real-time data transmitted by the first microcontroller 111. The two processing units form a master-slave architecture through functional division. The master controller focuses on system communication and data integration, while the coprocessor focuses on drive signal generation and parameter execution. This architecture effectively avoids the interrupt response delay problem when a single controller handles multiple tasks.

[0028] Compared to existing technologies, traditional coupling devices use a single microcontroller to handle communication, data acquisition, and drive control tasks simultaneously, which can easily lead to jitter in the motion control signal output due to task priority conflicts. This solution, however, physically separates communication control and drive execution functions through a dual-controller architecture. The main controller ensures real-time communication through a high-speed USB interface, while the coprocessor ensures drive signal stability through dedicated output pins. Simultaneously, independent storage circuitry avoids bus congestion during parameter access.

[0029] Through the above technical solutions, this application improves the parallel processing capability of multi-module control commands, solving the motion control delay problem caused by insufficient processing power in traditional systems. Physical isolation of control parameters and real-time data storage reduces mutual interference during signal transmission, shortening the response time for calibration data retrieval. The dual-controller architecture enables synchronous acquisition of photoelectric detection data and generation of LED driving signals, improving the overall system coordination efficiency.

[0030] like Figures 1 to 3 As shown, this application further proposes that the second microcontroller 112 is connected and communicates with the first microcontroller 111 via USB pin 112d; the first output pin 112a of the second microcontroller 112 outputs an analog voltage to the LED light source driver module 3; the first microcontroller 111 is configured to collect feedback data from the photoelectric detection module 5 via signal input pin 111a, and can send it to the second microcontroller 112 via USB pin 112d; the second microcontroller 112 is configured to adjust the signal output to the LED light source driver module 3 according to the received data; the second microcontroller 112 outputs stepper motor pulses and direction signals to the motion control module via the second output pin 112b.

[0031] The USB pin 112d is a dedicated physical interface for establishing communication between the main and coprocessors. It can be implemented using the USB 2.0 protocol, with a transmission rate of up to 480Mbps, meeting real-time data exchange requirements and avoiding the bandwidth limitations of traditional GPIO communication. The analog voltage output converts digital control signals into continuous voltage signals via digital-to-analog conversion. This can be implemented using a DAC chip, with an output range of 0-5V, directly matching the voltage control port of the LED driver chip to achieve linear adjustment of the light source brightness. The signal input pin 111a is an interface for receiving data from external sensors. This can be implemented using an ADC input channel with high impedance characteristics, effectively acquiring the weak current signals output by the photoelectric detection module. The stepper motor pulse and direction signals are the timing control signals that drive the stepper motor. This can be implemented using a two-channel differential signal output mode. Adjusting the pulse frequency controls the motor speed, and the direction level controls the rotation direction, meeting precise positioning requirements.

[0032] Specifically, the first microcontroller 111 transmits real-time data from the photoelectric detection module 3 to the second microcontroller 112 via a high-speed USB channel, forming a closed-loop control link. Based on the received optical power feedback data, the second microcontroller dynamically adjusts the analog voltage value output by the DAC, enabling the LED light source driver module 3 to quickly respond to changes in light intensity. Simultaneously, the stepper motor control signal independently generated by the second microcontroller 112 is transmitted to the motion control module 7 via an isolated drive circuit, thereby driving the mechanical actuator to complete precise positioning. This achieves accurate motion control during the coupling process, ensuring the system's accuracy and stability in automated coupling alignment and packaging. Communication and data distribution between the main and coprocessors employ a time-division multiplexing mechanism to ensure the timing consistency of light source adjustment and motion control commands.

[0033] Compared to existing technologies, traditional solutions use a single microcontroller to handle all control tasks, resulting in interrupt response delays and task scheduling conflicts, leading to millisecond-level lags in light source adjustment and motion control. This solution, however, separates data acquisition, light source control, and motion drive functions through a dual-processor architecture, combined with a dedicated USB communication channel, reducing the control command generation cycle to the microsecond level. Existing technologies using PWM signals to control light source brightness suffer from nonlinear adjustment defects; this solution replaces this with an analog voltage output method, reducing the deviation rate between the drive current and the set value.

[0034] Through the above technical solution, this application achieves real-time interaction between photoelectric detection data and control commands, reducing the LED light source drive response time to one-third of the original system and improving the stepper motor positioning accuracy to the ±0.01 mm level. The division of labor and cooperation between the main and coprocessors effectively avoids data processing bottlenecks, enabling the system to simultaneously maintain 1000 light intensity samples per second and 200-step motor micro-stepping control. The bit error rate of the USB communication channel is controlled below 10^-6, ensuring the reliability of control command transmission.

[0035] like Figure 4 As shown, this application further proposes a light source board module 4 including an SFP optical module interface control circuit 41, a high-speed drive circuit 42, and a 3.3V power supply circuit 43. The SFP optical module interface control circuit 41 is provided with a communication pin 411 connected to the I2C bus 13 and a fault detection pin 412 connected to the first microcontroller; the high-speed drive circuit is provided with a level conversion chip 421, whose drive signal pin receives the drive signal from the first output pin 112a of the second microcontroller 112, and the differential output pin 421b is connected to the input terminal of the SFP optical module interface control circuit 41; the power supply circuit 43 converts the +24V input to the +3.3V output through a power conversion chip, and its current sampling signal is fed back to the first microcontroller 111 through a feedback pin.

[0036] The SFP optical module interface control circuit 41 is a circuit that configures optical module parameters and detects faults. It can be implemented using an interface chip with integrated I2C communication protocol. Its communication pin 411 receives configuration commands from the main control system, and its fault detection pin 412 transmits hardware status signals to the main control system. The level conversion chip 421 in the high-speed drive circuit 42 is a device that matches signal levels. It can be implemented using a differential driver such as the MAX9117, converting the single-ended signal output by the microcontroller into an LVDS differential signal conforming to the SFP interface standard. The power conversion chip 431 in the 3.3V power supply circuit 43 is a module that implements voltage conversion and current monitoring. It can be implemented using a switching regulator such as the LM2674, and its feedback pin obtains load current information through a sampling resistor.

[0037] Specifically, the SFP optical module interface control circuit 41 receives the optical module operating parameters from the main control system via the I2C bus 13, and simultaneously transmits hardware abnormality signals of the optical module, such as over-temperature or communication interruption status, to the first microcontroller in real time via an independent fault detection pin. The high-speed drive circuit 42 receives the PWM drive signal output from the second microcontroller 112, converts it into a differential signal via the level conversion chip 421, and transmits it to the SFP optical module interface 41 to eliminate electromagnetic interference during signal transmission. The 3.3V power supply circuit 43 converts the externally input 24V DC power into a stable 3.3V output, and simultaneously transmits the current sampling value to the first microcontroller 111 in real time via a feedback loop. When an over-limit current is detected, a protection mechanism is triggered.

[0038] Compared to existing technologies, traditional light source board modules use a single voltage conversion circuit and lack an independent fault detection channel, resulting in the inability to promptly respond to power supply fluctuations, and fault detection relies on inefficient software polling. This solution establishes a hardware-level monitoring path by setting an independent fault detection pin, and combines it with a closed-loop current feedback mechanism to achieve real-time monitoring of the power supply system. At the same time, differential signal transmission is used to eliminate the quality degradation of high-speed drive signals.

[0039] Through the above technical solutions, this application achieves electrical compatibility between the light source drive signal and the SFP interface, avoiding signal transmission distortion; shortens the response time to abnormal states through a hardware-level fault detection channel; and maintains the stability of the light source drive current through a closed-loop current monitoring mechanism, thereby improving the control accuracy of the light source board module and the system reliability.

[0040] like Figure 5 As shown, this application further proposes a photoelectric detection module 5 including a photoelectric conversion circuit 51, a logarithmic amplifier circuit 52, and a detection chip circuit 53. The photoelectric conversion circuit 51 is equipped with a photodetector 511 for receiving external light signals and converting them into weak current signals; the logarithmic amplifier circuit 52 integrates a logarithmic amplifier chip 521 of model AD8304, whose input terminal is connected to the output terminal of the photoelectric conversion circuit 51, for performing logarithmic amplification processing on the weak current signal and outputting an analog voltage signal that is logarithmically linear with the light power; the detection chip circuit 53 integrates a detection chip 531 of model C8051F340, which is connected to the voltage output terminal of the logarithmic amplifier circuit 52 and communicates with the first microcontroller 111 through the I2C bus 13, for converting the analog voltage signal output by the logarithmic amplifier circuit 52 into a digital signal and transmitting it to the first microcontroller 111.

[0041] Among them, the photodetector 511 is a semiconductor device that converts light signals into current signals. Specifically, it can be implemented using a silicon-based photodiode, with a sensitivity range covering the visible to near-infrared band. It is used to directly capture external light signals and generate microampere-level current signals. The AD8304 logarithmic amplifier chip 521 is an analog signal processing device with wide dynamic range characteristics. Specifically, it can be implemented using a single-chip integrated logarithmic amplifier circuit, with an input current range covering 1nA to 10mA. It is used to convert the weak current output by the photodetector into a linear voltage signal that is logarithmically related to the light power. The detection chip 531, model C8051F340, is a mixed-signal microcontroller with a built-in analog-to-digital converter. Specifically, it can be implemented using a 12-bit precision ADC module, with a sampling rate set to 100ksps. It is used to convert the analog voltage signal output by the AD8304 logarithmic amplifier chip 521 into a digital signal and to transmit data with the main control module via the I2C bus protocol.

[0042] Specifically, after receiving an external optical signal, the photodetector 521 generates a weak current signal, which is directly input to the input terminal of the logarithmic amplifier chip 521. The logarithmic amplifier chip 521 performs nonlinear processing on the input current through its built-in logarithmic amplification circuit, generating a linear voltage output that is logarithmically related to the optical power value. This voltage signal is transmitted to the analog input port of the detection chip 531, where it is converted into a digital signal by its internal analog-to-digital converter. The converted data is packaged and transmitted to the main control module 11 via the I2C bus 13 protocol. The bus clock frequency can be set to 400kHz to achieve stable transmission. The entire signal processing flow is completed through a three-level cascaded architecture, avoiding the signal attenuation problem between traditional discrete components.

[0043] Compared to existing technologies, traditional optical signal detection systems typically use linear amplifiers to process weak current signals, which are prone to quantization errors under low signal-to-noise ratio conditions and require an additional independent analog-to-digital converter module. This solution directly processes current signals with a wide dynamic range using a logarithmic amplifier chip, eliminating the gain limitation problem of linear amplifiers. Simultaneously, it employs a detection chip with integrated ADC functionality to digitize the signal, reducing the number of interfaces between modules. In existing technologies, the photoelectric detection module and the main control system typically use parallel communication or custom protocols, while this solution achieves data transmission through a standard I2C bus, reducing system complexity.

[0044] Through the above technical solution, this application achieves high-precision logarithmic amplification of weak photocurrent signals, avoiding the signal distortion problem of traditional linear amplifiers under low signal-to-noise ratio conditions. By integrating an analog-to-digital conversion detection chip with a standard bus protocol, data transmission delay in the signal conversion stage is reduced, improving the response speed of the photoelectric detection system. The combination of a single-chip logarithmic amplifier and integrated detection circuit effectively reduces the risk of signal interference when multiple modules operate independently, ensuring the consistency of the detection data.

[0045] like Figure 6 Furthermore, this application proposes a signal conversion module 6, including a multi-channel analog input channel 61 for acquiring voltage signals from external sensors; a signal conditioning circuit 62, whose input terminal is connected to the output terminal of the multi-channel analog input channel, for suppressing overcurrent through a current-limiting resistor and filtering high-frequency noise through a filter capacitor; and an analog-to-digital converter circuit 63, whose input terminal is connected to the output terminal of the signal conditioning circuit and is connected to a first microcontroller via an SPI bus 14, for converting the analog voltage signal output by the signal conditioning circuit into a digital signal.

[0046] Among them, the multi-channel analog input channel 61 refers to a parallel input interface capable of simultaneously receiving output signals from multiple sensors. It can be implemented using a multiplexer or an independent ADC channel, used to synchronously acquire analog voltage signals from different sensors, solving the timing delay problem caused by traditional single-channel acquisition. The current-limiting resistor in the signal conditioning circuit 62 is an impedance matching element connected in series at the input terminal. It can be implemented using a 1% precision surface-mount resistor, used to limit the peak input current and prevent overcurrent damage to downstream circuits. The filter capacitor is a high-frequency noise suppression element connected in parallel along the signal path. It can be implemented using a 0.1μF ceramic capacitor, used to filter out high-frequency noise generated by environmental electromagnetic interference. The SPI bus 14 refers to a serial interface using a four-wire synchronous communication protocol. It can be implemented using a level conversion chip from MAXIM, used to establish a high-speed digital transmission link between the analog-to-digital converter and the main control chip, reducing the number of signal lines.

[0047] Specifically, the multi-channel analog input 61 synchronously acquires signals from multiple sensors using a parallel architecture, eliminating the data delay caused by time-division multiplexing in traditional solutions. The signal conditioning circuit 62 employs a composite structure of current-limiting resistors and filter capacitors, achieving dual functions of overcurrent protection and high-frequency noise suppression at the physical level. The current-limiting resistors limit the input current to a safe threshold through impedance matching, while the filter capacitors eliminate interference signals above a set frequency through low-pass filtering characteristics. After the conditioned analog signals are converted into digital signals by an analog-to-digital converter, they are transmitted using the SPI bus 14 protocol. This protocol achieves high-speed serial data transmission through a clock synchronization mechanism, reducing the number of lines compared to traditional parallel interfaces while maintaining the data transmission rate. The three-level processing architecture forms a complete signal conversion link, achieving seamless integration from multi-source signal acquisition to digital signal output.

[0048] Compared to existing technologies, traditional coupling devices typically employ single-channel signal acquisition, making it impossible to simultaneously process data from multiple sensors. Furthermore, their signal conditioning circuits only have a single filtering function and lack overcurrent protection mechanisms. Existing analog-to-digital converters often use parallel interfaces for data transmission, resulting in complex circuitry and susceptibility to interference. This solution achieves synchronous acquisition through multiple parallel input channels, employs a composite signal conditioning circuit to simultaneously address overcurrent and noise issues, and optimizes digital signal transmission efficiency via an SPI bus, forming an integrated signal processing system.

[0049] Through the above technical solutions, this application achieves synchronous acquisition and centralized processing of multi-channel sensor signals, avoiding the data asynchrony problem caused by traditional time-division acquisition. By combining current-limiting resistors and filtering capacitors, overcurrent protection and noise suppression are synchronously completed during the signal input stage, improving signal integrity. The SPI bus protocol is used to replace the parallel transmission interface, reducing the number of signal lines while ensuring data conversion accuracy, lowering the risk of line interference, and improving system integration and anti-interference capabilities.

[0050] like Figure 7 and Figure 8 As shown, this application further proposes an optical fiber transceiver module 8, which includes a power supply mode switching circuit 81, including a linear regulator 811, for providing a selectable power supply voltage for the external optical module; a second storage circuit 82, connected to the main control module 11 via an I2C bus 13, for storing the power supply mode configuration information of the external optical module; and a network interface circuit, including a chip 831 of model IP113 and its peripheral circuits, configured to connect to an external network and communicate with the SFP optical module interface 41 control circuit of the light source board module 4, for realizing the transmission coupling and electrical isolation between the network data signal and the light source board module.

[0051] The linear regulator 811 in the power supply mode switching circuit 81 refers to a circuit that outputs different voltage values ​​through a voltage regulation device. Specifically, it can be implemented using an LM317 chip and its voltage divider resistor network, used to switch the power supply voltage according to the specifications of the external optical module. The second storage circuit 83 is a memory that stores power supply mode parameters, specifically implemented using an EEPROM chip, used to save the power supply configuration parameters of different optical modules and achieve rapid parameter retrieval. The IP113 chip 831 in the network interface circuit 83 refers to a network controller that supports Ethernet communication and integrates isolation functions. Specifically, it can achieve signal transmission and electrical isolation through a built-in magnetic coupling isolator, used to block ground interference during high-speed network communication.

[0052] Specifically, the power supply mode switching circuit 81 outputs an adjustable voltage, such as 3.3V or 5V, through a linear regulator to adapt to the power supply requirements of different optical modules. The second storage circuit 82 receives configuration data from the main control module via the I2C bus 13, such as storing the rated voltage value of the optical module in the EEPROM, and automatically loading the configuration parameters when the system starts. The network interface circuit 83 connects to the interface control circuit of the SFP optical module 41 through the differential signal pin of the IP113 chip 831, such as converting the network signal of the RJ45 port into an LVDS signal that the optical module can recognize, while using the internal isolation layer of the chip to block common-mode interference between the external network and the light source board module.

[0053] Compared to existing technologies, traditional solutions use power modules with fixed output voltages, which cannot be adapted to various optical modules. Furthermore, network communication relies on discrete opto-converters and isolation devices, leading to increased circuit complexity and signal delay. This solution achieves dynamic switching of power supply modes through the coordinated operation of an adjustable power supply circuit and stored configuration parameters. Simultaneously, it employs a network interface chip with integrated isolation functions, completing signal conversion and electrical isolation on a single circuit board.

[0054] Through the above technical solution, this application solves the power supply compatibility problem of external optical modules, avoids the operation of manually reconfiguring power supply parameters, reduces the risk of signal distortion in network communication, and reduces the space occupation and cost consumption caused by discrete isolation devices.

[0055] like Figure 2 As shown, this application further proposes that the main control module 11 is connected to a 25MHz crystal oscillator circuit 11a and matching first capacitor C64 and second capacitor C65, which are used to provide clock signals to the main control module 11.

[0056] The 25MHz crystal oscillator circuit 11a refers to a clock signal generation circuit based on a quartz crystal oscillator. Specifically, it can be implemented using a surface-mount crystal oscillator with a package size of 3.2mm × 2.5mm. The reference frequency it generates is used to drive the timing synchronization of the internal logic circuits of the main control module. The first capacitor C64 and the second capacitor C65 are load capacitors connected in parallel with the crystal oscillator circuit. Specifically, they can be implemented using ceramic capacitors with a capacitance of 20pF, used to match the load capacitance parameters of the crystal oscillator circuit, suppress high-frequency harmonic interference, and stabilize the oscillation waveform.

[0057] Specifically, the main control module 11 establishes a unified timing reference by receiving the clock signal output from the 25MHz crystal oscillator circuit 11a. The square wave signal generated by the crystal oscillator circuit 11a is divided by the internal phase-locked loop circuit to provide a synchronous clock for USB communication protocol processing, photoelectric signal sampling, and control command generation. The first capacitor C64 and the second capacitor V65 form a π-type filter network with the crystal oscillator circuit to absorb the influence of power supply noise on the oscillation frequency and reduce clock signal jitter. As a result, the functional units inside the main control module 11 execute commands under a unified clock cycle, eliminating signal acquisition timing misalignment or control command transmission delay caused by clock phase offset.

[0058] Compared to existing technologies, traditional coupling devices typically use low-frequency crystal oscillators or rely on external clock sources for frequency division in their main control modules, resulting in insufficient clock accuracy and poor anti-interference capabilities. This solution, however, combines a crystal oscillator circuit of a specific frequency with a filter capacitor to ensure clock signal stability while avoiding electromagnetic compatibility issues caused by high-frequency oscillations.

[0059] Through the above technical solution, this application achieves high-precision clock synchronization of each functional unit inside the main control module, and solves the problems of USB communication data loss, photoelectric detection signal sampling error accumulation and motion control command delay caused by clock signal jitter, thereby improving system operation stability and control response consistency.

[0060] like Figure 1 As shown, this application further proposes that the gold finger connector 2 is provided with at least two gold finger expansion interfaces 21 for pluggable connection to a UV curing controller, dispensing controller or vision positioning module on the coupling device.

[0061] The gold finger connector 2 refers to a standardized pluggable interface with conductive contacts, which can be implemented using contact terminals on the edge of a gold-plated copper foil printed circuit board, establishing an electrical connection through mechanical plugging. This feature enables rapid switching and compatibility between modules through standardized physical interfaces. The gold finger expansion interface 21 refers to an independent signal channel reserved on the gold finger connector 2, which can be implemented using a dual-row pin layout, with each interface corresponding to an independent power supply and communication line. This feature enables parallel access and independent control of functional modules through a multi-channel design.

[0062] Specifically, the gold finger connector 2, through the physical structure design of the expansion interface 21, allows modules such as the UV curing controller and dispensing controller to be connected to the system in a plug-and-play manner. When it is necessary to replace or upgrade functional modules, the hardware connection can be completed directly through plugging and unplugging, without the need for rewiring or debugging of interface circuits. The configuration of two expansion interfaces allows for the simultaneous connection of two functional modules, such as the combination of a UV curing controller and a vision positioning module, to achieve multi-tasking in parallel. During plugging and unplugging, the conductivity of the gold finger contacts ensures the stability of signal transmission, while the standardized interface size eliminates mechanical adaptation differences between modules.

[0063] In some specific implementations, the pin definitions of the gold finger expansion interface 21 may include power supply pins, digital signal pins, and ground pins. For example, a 12-pin dual in-line package layout may be used, in which the first 6 pins are defined as +5V power supply and PWM control signals, and the last 6 pins are defined as GND and I2C communication lines.

[0064] Compared to existing technologies, traditional coupling devices require a dedicated interface for each functional module, resulting in complex hardware structures and the need to disassemble the entire device for maintenance. This solution unifies module access specifications through pluggable expansion interfaces, simplifying the physical connection structure while preserving electrical performance and shortening module replacement time.

[0065] Through the above technical solution, this application enables rapid replacement and collaborative operation of different functional modules. Maintenance does not require individual debugging of each module, and in case of module failure, the corresponding component can be directly replaced without downtime for repairing other parts of the system. Modules share main control resources through a unified interface, avoiding resource conflicts caused by multiple controllers in traditional solutions, while also reducing hardware redundancy and production costs.

[0066] Example 1: Automated Coupling of Optical Modules 1. System Configuration and Parameter Initialization The SFP optical module interface control circuit 41 is inserted through the gold finger connector 2 of the communication baseboard 1. The main control module 11 writes working parameters (such as wavelength and transmission rate) to the optical module through the I2C bus 13. The parameters are stored in the first storage circuit 112c.

[0067] The photodetector 511 of the photoelectric detection module 5 is aligned with the output end of the optical module, and the detection chip circuit 53 uploads the initial optical power data to the first microcontroller 111 via the I2C bus.

[0068] 2. Closed-loop coupling control process An external host computer sends a coupling command, and the second microcontroller 112 outputs an analog voltage (0-5V) to the LED light source driver module 3 through the first output pin 112a, adjusting the drive current of the light source board module 4 so that the light module emits a light signal of a specified power.

[0069] The motion control module 7 receives the stepping pulse signal from the second microcontroller 112 and drives the three-dimensional mechanical platform to adjust the relative position of the optical module and the fiber array. The photoelectric detection module 5 provides real-time feedback of the optical power value.

[0070] The first microcontroller 111 calculates the position deviation based on the feedback data and transmits it to the second microcontroller 112 via USB pin 112d to dynamically adjust the motion control parameters until the optical power coupling efficiency reaches more than 95%.

[0071] 3. Fault monitoring and protection The SFP optical module interface control circuit 41 monitors abnormalities such as overheating and communication interruption of the optical module in real time through the fault detection pin 412, triggering the first microcontroller 111 to cut off the drive current and report to the host computer.

[0072] Example 2: Laser Coupling 1. High-precision light source drive and power calibration The second microcontroller 112 reads the laser calibration data in the first storage circuit 112c through the I2C bus 13, generates a PWM drive signal, and inputs it into the light source board module 4 through the LED light source drive module 3.

[0073] The logarithmic amplification submodule 52 of the photoelectric detection module 5 converts the weak photocurrent signal output by the laser into a logarithmic linear voltage. The detection chip circuit 53 converts it into a digital signal and feeds it back to the main control module 11, forming a current-optical power closed-loop control.

[0074] 2. Dynamic temperature compensation mechanism The signal conversion module 6 uses multiple analog input channels 61 to acquire the voltage signal from the laser temperature control sensor. After being filtered by the signal conditioning circuit 62, the signal is converted into a digital temperature value by the analog-to-digital converter 63.

[0075] The first microcontroller 111 adjusts the drive current parameters through the second microcontroller 112 based on the temperature-wavelength drift characteristics to compensate for the impact of temperature changes on coupling efficiency.

[0076] 3. High-speed sampling and real-time response The system acquires optical power and temperature data at a sampling rate of 100ksps. The second microcontroller 112 processes the data in parallel with the first microcontroller 111 through the USB pin 112d. The control loop delay is ≤10μs, which meets the coupling accuracy requirements of the high-speed laser.

[0077] Example 3; Automated Coupling of TO Packaged Components 1. Visual positioning and precision mechanical adjustment A visual positioning module (such as a CMOS camera) is inserted through the gold finger expansion interface 21 to acquire position images of TO components (such as laser diodes and photodetectors). The first microcontroller 111 calculates the offset through an image processing algorithm.

[0078] The motion control module 7 receives the differential pulse signal from the second microcontroller 112 and drives the precision slide to adjust the coaxiality of the TO element and the fiber optic adapter until the image recognition deviation is ≤1μm.

[0079] 2. Synergistic control of dispensing and UV curing Insert the dispensing controller into the gold finger expansion interface 21. The main control module 11 sends instructions to control the amount of adhesive and dispenses it evenly on the TO encapsulation interface. Then, insert the UV curing controller and adjust the UV lamp power through the LED light source driver module 3. The curing time is controlled by the process parameters in the first storage circuit 112c.

[0080] 3. Coupling efficiency verification and encapsulation The photoelectric detection module 5 monitors the optical power after the TO element is coupled in real time. If the efficiency is ≥85%, the motion control module 7 drives the UV curing controller to complete the encapsulation. If the efficiency is not up to standard, the system automatically readjusts the position and repeats the dispensing process. After a maximum of 3 retries, an abnormality is reported.

[0081] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An integrated circuit system for a coupling device, characterized in that, include: The communication baseboard (1) integrates a main control module (11) and a gold finger connector (2); the main control module (11) is connected to an external host computer for communication. The main control module (11) is pluggably connected to the LED light source driver module (3), the light source board module (4), the photoelectric detection module (5), the signal conversion module (6), and the motion control module (7) via the gold finger connector (2). The main control module (11) receives the signals output by the photoelectric detection module (5) and the signal conversion module (6) and uploads them to the external host computer. The main control module (11) receives the control commands generated by the external host computer and drives the LED light source driver module (3) and the motion control module (7) based on the control commands, and adjusts the drive current parameters of the light source board module (4) through the LED light source driver module (3).

2. The integrated circuit system of the coupling device according to claim 1, characterized in that, The main control module (11) includes: The first microcontroller (111) is used as the main controller of the coupling device and communicates with the external host computer through the USB hub (12); the first microcontroller (111) is provided with multiple input pins (111a) for acquiring digital signals output by the photoelectric detection module (5) and the signal conversion module (6); The second microcontroller (112), which serves as a coprocessor for the coupling device, has multiple first output pins (112a) and multiple second output pins (112b). The first output pins (112a) are used to output control signals to drive the LED light source driving module (3), and the second output pins (112b) are used to output control signals to drive the motion control module (7). The second microcontroller (112) is connected to a first storage circuit (112c) for storing the control parameters, calibration data, or configuration information of the working mode of the coupling device.

3. The integrated circuit system of the coupling device according to claim 2, characterized in that, The second microcontroller (112) is connected to the first microcontroller (111) via a USB pin (112d); the first output pin (112a) of the second microcontroller (112) outputs an analog voltage to the LED light source driver module (3); the first microcontroller (111) is configured to collect feedback data from the photoelectric detection module (5) via a signal input pin (111a) and send it to the second microcontroller (112) via the USB pin (112d); the second microcontroller (112) is configured to adjust the signal output to the LED light source driver module (3) according to the received data; the second microcontroller (112) outputs stepper motor pulses and direction signals to the motion control module (7) via the second output pin (112b).

4. The integrated circuit system of the coupling device according to claim 3, characterized in that, The light source board module (4) includes: The SFP optical module interface control circuit (41) is provided with a communication pin (411) connected to the I2C bus (13) and a fault detection pin (412) connected to the first microcontroller (111). The high-speed drive circuit (42) is equipped with a level conversion chip (421); the drive signal pin (421a) of the level conversion chip (421) receives the drive signal of the first output pin (112a) of the second microcontroller (112), and the differential output pin (421b) is connected to the input terminal of the SFP optical module interface control circuit (41); The power supply circuit (43) converts the +24V input to +3.3V output through the power conversion chip (431), and its current sampling signal is fed back to the first microcontroller (111) through the feedback pin (432a).

5. An integrated circuit system for a coupling device according to claim 3, characterized in that, The photoelectric detection module (5) includes: a photoelectric conversion circuit (51) with a photodetector (511) for receiving external light signals and converting them into weak current signals; The logarithmic amplifier circuit (52) integrates a logarithmic amplifier chip (521) of model AD8304. Its input terminal is connected to the output terminal of the photoelectric conversion circuit (51) and is used to perform logarithmic amplification processing on the weak current signal and output an analog voltage signal that is logarithmically linear with the optical power. The detection chip circuit (53) integrates a detection chip (531) of model C8051F340, which is connected to the voltage output terminal of the logarithmic amplifier circuit (52) and communicates with the first microcontroller (111) through the I2C bus (13). It is used to convert the analog voltage signal output by the logarithmic amplifier circuit (52) into a digital signal and transmit it to the first microcontroller (111).

6. The integrated circuit system of the coupling device according to claim 3, characterized in that, The signal conversion module (6) includes: Multiple analog input channels (61) are used to acquire voltage signals from external sensors; The signal conditioning circuit (62) has its input terminal connected to the output terminal of the multi-channel analog input channel (61) and is used to suppress overcurrent through the current limiting resistor and filter out high-frequency noise through the filter capacitor. The analog-to-digital converter circuit (63) has its input terminal connected to the output terminal of the signal conditioning circuit (62) and is connected to the first microcontroller (111) via the SPI bus (14) to convert the analog voltage signal output by the signal conditioning circuit (62) into a digital signal.

7. The integrated circuit system of the coupling device according to claim 1, characterized in that, It also includes a fiber optic transceiver module (8), which includes: The power supply mode switching circuit (81) includes a linear regulator (811) for providing an optional power supply voltage to the external optical module; The second storage circuit (82) is connected to the main control module (11) via the I2C bus (13) and is used to store the power supply mode configuration information of the external optical module; The network interface circuit (83) includes a chip (831) of model IP113 and its peripheral circuits, configured to connect to an external host computer and communicate with the SFP optical module interface control circuit (41) of the light source board module (4), and is used to realize the transmission coupling and electrical isolation between the network data signal and the light source board module (4).

8. The integrated circuit system of the coupling device according to claim 1, characterized in that, The main control module (11) is connected to a 25MHz crystal oscillator circuit (11a) and matching first capacitor (C64) and second capacitor (C65) to provide clock signals for the main control module (11).

9. An integrated circuit system for a coupling device according to claim 1, characterized in that, The gold finger connector (2) has at least two gold finger expansion interfaces (21) for pluggable connection to a UV curing controller, dispensing controller or vision positioning module on the coupling device.

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