processing liquid

Abstract

The present invention relates to a processing liquid containing an effective ingredient and water, wherein the effective ingredient contains the following component (A), the following component (B), and the following component (C), • component (A): one or more compounds selected from a specific acetylenic diol and an alkylene oxide adduct thereof, • component (B): a compound containing a copolymerization site of ethylene oxide and another alkylene oxide, and not having a carbon-carbon triple bond, • component (C): a compound containing a copolymerization site of ethylene oxide and another alkylene oxide, not having a carbon-carbon triple bond, and having a higher cloud point than the component (B) at 1 mass% aqueous solution, the content of the component (A) and the total content of the component (B) and the component (C) are in a specific range based on the total amount of the effective ingredient, and the content ratio (A) / (C) of the component (A) and the component (C) and the content ratio (B) / (C) of the component (B) and the component (C) are in a specific range in terms of mass ratio.

Description

TECHNICAL FIELD

[0001] The present application relates to a processing liquid. BACKGROUND

[0002] In the manufacture of semiconductor products, it is important to perform high-precision cutting processing on a silicon ingot, which is a brittle material, and in the cutting processing of a silicon ingot, wire saw processing is generally used from the viewpoints of processing precision and productivity. In addition, wire saw processing can also be used in the processing of materials such as ceramics, quartz, sapphire, and glass.

[0003] In general, as a processing method using a wire saw, there are a free abrasive method in which processing is performed while supplying a free abrasive to a sliding portion of a wire and a workpiece, and a fixed abrasive method in which processing is performed using a wire on the surface of which an abrasive is fixed in advance.

[0004] In addition, in the wire saw processing of the above two methods, a processing liquid (coolant) is used for the purpose of improving processing efficiency at the time of cutting processing, suppressing friction between a processed material and a tool processing the processed material, reducing frictional heat generated due to processing, prolonging the life of the tool, removing chips, and the like. As a processing liquid used in the above uses and the like, there are an oil-based processing liquid in which a mineral oil, a plant and animal oil, a synthetic oil, or the like is used as a main component, and a water-based processing liquid in which a compound having surface activity is compounded to impart water solubility.

[0005] In recent years, from the viewpoints of safety at the time of handling and environmental problems, a processing liquid imparted with water solubility is gradually used.

[0006] For example, Patent Literature 1 discloses a water-soluble cutting fluid for slicing a silicon ingot, characterized by containing, as essential components, a polyoxyalkylene adduct having a number average molecular weight of 500 or less and a specific structure, and a mono- or di-basic aliphatic carboxylic acid or a salt thereof having 4 to 10 carbon atoms (including the carbon of a carbonyl group).

[0007] Patent Literature 2 discloses a water-soluble processing liquid composition for a fixed abrasive wire saw, which is a water-soluble processing liquid composition for a fixed abrasive wire saw for cutting a rare earth magnet, characterized by containing a glycol, a carboxylic acid, a compound that is alkaline when dissolved in water, and water, respectively, at specific amounts (where the total of these components is 100 parts by weight).

[0008] Patent document 3 discloses a processing fluid for brittle materials, which contains, in specific amounts, one or more of the following: alkynyl diols with an HLB value of 4 or higher and 12 or lower, and alkynyl diols with an HLB value of 4 or higher and 12 or lower, alkynyl diols with an HLB value of 4 or higher and 12 or lower, alkynyl diols with an HLB value of 6 or higher, and alkynyl diols with an HLB value of 5 or higher, and which do not have carbon-carbon triple bonds; and a carboxylic acid.

[0009] However, in both of the above-mentioned wire sawing methods, a multi-wire saw is used to cut multiple wafers from a spindle at once. In a multi-wire saw, a metal wire is wound into each groove on two or more guide rollers that are engraved with multiple grooves at regular intervals. Each metal wire is held parallel under a certain tension. Furthermore, during cutting, the guide rollers rotate, causing the metal wire to adhere to the cutting fluid discharged from nozzles, etc., while the metal wire travels in one or both directions, pressing the spindle against the fluid-coated wire and cutting it.

[0010] By using a multi-wire saw, multiple wafers can be cut at once, thus enabling efficient cutting. Furthermore, due to the narrow cutting allowance, material loss during cutting is minimal, and it also has the advantage of easily handling larger diameter ingots.

[0011] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2011-68884 Patent Document 2: Japanese Patent Application Publication No. 2003-82335 Patent document 3: Japanese Patent Application Publication No. 2018-154762. Summary of the Invention

[0012] The problem that the invention aims to solve However, in recent years, with the increasing demand for semiconductors and solar cells, the efficient utilization of materials has become a key issue from the perspective of reducing the manufacturing costs of semiconductors and solar cells. Based on this situation, this study investigated how to further narrow the cutting allowance when cutting wafers using a multi-wire saw, thereby reducing material loss during cutting, increasing the number of wafers obtained in a single cut, and improving material utilization efficiency (yield).

[0013] As a method to further narrow the cutting allowance and reduce material loss during cutting, one example is to make the metal wire thinner. Another example is to increase the number of wafers obtained in a single cutting operation by reducing the spacing between the metal wires in a multi-wire saw.

[0014] However, in multi-wire saws, if the wires are made thinner and the spacing between them is reduced, the frequency of wire breakage increases when cutting the ingot. Therefore, it is desirable to improve this.

[0015] In addition, the wire saw and the cut wafers are significantly contaminated by the fine cutting powder generated during the cutting process, which increases the workload for cleaning them.

[0016] Therefore, the objective of this invention is to provide a processing fluid that, in a multi-wire saw apparatus, can suppress wire breakage even when the wires are made thinner and the spacing between the wires is reduced, has appropriate lubricity, and excellent cleanliness.

[0017] Solution for solving the problem According to the present invention, the following [1] to [2] are provided.

[0018] [1] A processing fluid containing an active ingredient and water, wherein, The active ingredients include the following components (A), (B), and (C). • Component (A): One or more compounds selected from alkynyldiols with HLB values ​​of 4 to 12 and their olefinic oxygen adducts with HLB values ​​of 4 to 12. • Component (B): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and which does not have carbon-carbon triple bonds. • Component (C): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and lacking carbon-carbon triple bonds, wherein the cloud point of a 1% by mass aqueous solution is higher than that of component (B). Based on the total amount of the active ingredients, the content of ingredient (A) is 3.0% by mass or more. Based on the total amount of the active ingredients, the combined content of ingredient (B) and ingredient (C) is 60% by mass or more. The content ratio of component (A) to component (C) [(A) / (C)] is 0.60 or more by mass. The ratio of component (B) to component (C) [(B) / (C)] by mass is less than 18.

[0019] [2] A method for manufacturing a processing fluid, comprising a process of mixing the active ingredient and the water. The active ingredients include the following components (A), (B), and (C). • Component (A): One or more compounds selected from alkynyldiols with HLB values ​​of 4 to 12 and their olefinic oxygen adducts with HLB values ​​of 4 to 12. • Component (B): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and which does not have carbon-carbon triple bonds. • Component (C): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and lacking carbon-carbon triple bonds, wherein the cloud point of a 1% by mass aqueous solution is higher than that of component (B). Based on the total amount of the active ingredients, the amount of ingredient (A) in the formulation is 3.0% by mass or more. Based on the total amount of the active ingredients, the combined amount of ingredient (B) and ingredient (C) is 60% by mass or more. The mixing ratio of component (A) to component (C) [(A) / (C)] is 0.60 or more by mass. The mixing ratio of component (B) to component (C) [(B) / (C)] is less than 18 by mass.

[0020] The effects of the invention According to the present invention, a processing fluid can be provided that, in a multi-wire saw apparatus, can suppress wire breakage even when the wires are thinned and the spacing between the wires is reduced, and has suitable lubricity and excellent cleanliness. Detailed Implementation

[0021] The upper and lower limits of the numerical ranges described in this specification can be combined arbitrarily. For example, when "A~B" and "C~D" are described as numerical ranges, the numerical ranges of "A~D" and "C~B" are also included within the scope of this invention.

[0022] In addition, unless otherwise specified, the numerical range “lower limit to upper limit” described in this specification means above the lower limit and below the upper limit.

[0023] Furthermore, in this specification, the numerical values ​​of the embodiments are numerical values ​​that can be used as upper or lower limits.

[0024] It should be noted that, unless otherwise specified in this specification, "olefinic oxygen (hereinafter also referred to as "AO") adducts" include not only compounds with a single olefinic oxygen adduct, but also compounds with multiple olefinic oxygen adducts, i.e., polyepoxides.

[0025] Examples of olefinic oxygens include those with 2 to 4 carbon atoms, such as ethylene oxide, propylene oxide (PO), oxobutane, 1,2-epoxybutane, 2,3-epoxybutane, 1,3-epoxybutane, and tetrahydrofuran.

[0026] Furthermore, in the following explanations, ethylene oxide will be abbreviated as "EO". Additionally, propylene oxide will be abbreviated as "PO".

[0027] [Form of processing fluid] The processing fluid in this embodiment contains active ingredients and water.

[0028] The active ingredients include the following components (A), (B), and (C).

[0029] • Component (A): One or more compounds selected from alkynyldiols with HLB values ​​of 4 to 12 and their olefinic oxygen adducts with HLB values ​​of 4 to 12. • Component (B): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and which does not have carbon-carbon triple bonds. • Component (C): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and lacking carbon-carbon triple bonds, wherein the cloud point of a 1% by mass aqueous solution is higher than that of component (B). • Ingredient (D): Water.

[0030] The processing fluid of this embodiment further satisfies the following requirements.

[0031] Based on the total amount of active ingredients, the content of ingredient (A) is 3.0% by mass or more.

[0032] Based on the total amount of active ingredients, the combined content of ingredients (B) and (C) is 60% by mass or more.

[0033] The ratio of component (A) to component (C) [(A) / (C)] is 0.60 or more by mass.

[0034] The ratio of component (B) to component (C) [(B) / (C)] by mass is less than 18.

[0035] In order to solve the above-mentioned problems, the inventors have made repeated efforts in research.

[0036] First, the inventors investigated the reasons for the increased wire breakage frequency during cutting of a spindle in a multi-wire saw apparatus. The results showed that the primary cause of the increased wire breakage frequency during spindle cutting was the contact and entanglement of the wires with each other.

[0037] Therefore, the inventors conducted further research on aspects such as imparting appropriate lubricity and improving cleanliness, and found that the above-mentioned problems could be solved by using the above-mentioned components (A), (B), and (C) as active ingredients and adjusting the content and ratio of these components to a specific range in the processing fluid. Through repeated research, the present invention was completed.

[0038] The following is a detailed description of the active ingredients contained in the processing fluid of this embodiment.

[0039] <Ingredients (A)> The processing fluid in this embodiment contains component (A).

[0040] Component (A) is one or more compounds selected from alkynyl diols with HLB values ​​of 4 to 12 and alkynyl diols with HLB values ​​of 4 to 12.

[0041] Here, component (A) has an HLB value of 4 or higher. It should be noted that the above-mentioned alkynyl diols and their olefinic oxygen adducts refer to those commonly known as "alkynyl diols (...)". Among substances that meet the specified HLB value, such as alkynyl diols (i.e., broadly defined alkynyl diols) or their alkynyl oxygen adducts.

[0042] By making the HLB value of component (A) above 4, the solubility of component (A) in water can be made appropriate.

[0043] From the viewpoint that it is easier to improve the solubility of component (A) in water, the HLB value of component (A) is preferably 5 or more, more preferably 6 or more, and even more preferably 7 or more.

[0044] In addition, the HLB value of component (A) is below 12.

[0045] The effects of the present invention can be achieved by making the HLB value of component (A) below 12.

[0046] From the viewpoint of making it easier to improve the effect of the present invention, the HLB value of component (A) is preferably 11 or less, more preferably 10 or less, and even more preferably 9 or less.

[0047] The upper and lower limits of these numerical ranges can be combined arbitrarily. Specifically, 5 to 11 is preferred, 6 to 10 is more preferred, and 7 to 9 is even more preferred.

[0048] In this specification, the HLB (Hydrophilic-Lipophilic Balance) value of component (A) is a value calculated using the Griffin method.

[0049] Examples of alkynyl diols include compounds represented by the general formula (1) below.

[0050] [Chemistry 1] In general formula (1), R 1 ~R 4 Each can be independently represented as an alkyl group having 1 to 6 hydrogen atoms or carbon atoms.

[0051] As R 1 ~R 4 Preferably, it is an alkyl group having 1 to 5 carbon atoms.

[0052] As an option, R 1 ~R 4 Alkyl groups having 1 to 5 carbon atoms, specifically methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl, 1,1-dimethylpropyl, 1,2-dimethylpropyl, and 2,2-dimethylpropyl.

[0053] Among them, as R 1 and R 3 Preferably, isobutyl or 3-methylbutyl. Additionally, as R... 2 and R 4 Preferably, it is methyl.

[0054] Furthermore, as a compound represented by general formula (1), it is preferred to have R 1 and R 3 The same structure or R 2 and R 4 Compounds with the same structure as each other, more preferably having R 1 and R 3 They are the same and R 2 and R 4 Compounds with the same structure as each other.

[0055] Furthermore, as olefinic oxygen adducts of alkynyldiols, preferably are olefinic oxygen adducts of compounds of general formula (1) with AO added to each of the hydroxyl groups of the compounds shown in general formula (1), more preferably are olefinic oxygen adducts of compounds of general formula (1) with EO and / or PO added, and even more preferably are olefinic oxygen adducts of compounds of general formula (1) with EO added. It should be noted that the suitable manner in which the alkynyldiol forms the olefinic oxygen adduct is the same as that in which the compounds of general formula (1) are formed.

[0056] It should be noted that when a structure is included that combines a structure derived from EO (e.g., ethylene oxide or poly(oxyethylene) structure) and a structure derived from PO (e.g., propylene oxide or poly(oxypropylene) structure), the structures can be combined with each other in a random or block form, preferably in a block form.

[0057] As component (A), examples include 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol, 5,8-dimethyl-6-dodecyn-5,8-diol, 2,4,7,9-tetramethyl-5-dodecyn-4,7-diol, 8-hexadecyn-7,10-diol, 7-tetradecyn-6,9-diol, 2,3,6,7-tetramethyl-4-octyne-3,6-diol, 3,6-diethyl-4-octyne-3,6-diol, 2,5-dimethyl-3-hexyn-2,5-diol, 2,4,7,9-tetramethyl-5-decyn-4,7-diol, and 3,6-dimethyl-4-octyne-3,6-diol, as well as alkynyl diols represented by general formula (1); and alkynyl diols represented by general formula (1). Examples of olefinic oxygens include EO and / or PO.

[0058] Preferably, the preferred compounds are selected from 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol, 5,8-dimethyl-6-dodecyn-5,8-diol, 2,4,7,9-tetramethyl-5-dodecyn-4,7-diol, 8-hexadecyn-7,10-diol, 7-tetradecyn-6,9-diol, 2,3,6,7-tetramethyl-4-octyne-3,6-diol, and 3,6-diethyl-4-octyne-3,6-diol. An olefinic adduct of one or more ynylene diols selected from 6-diol, 2,5-dimethyl-3-hexyn-2,5-diol, 2,4,7,9-tetramethyl-5-decyn-4,7-diol, and 3,6-dimethyl-4-octyne-3,6-diol; more preferably, an olefinic adduct selected from 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol, 5,8-dimethyl-6-dodecyn-5,8-diol, 2,4,7,9-tetramethyl-5-decyn-4,7-diol, and 3,6-dimethyl-4-octyne-3,6-diol. -Tetramethyl-5-dodecyn-4,7-diol, 8-hexadecyn-7,10-diol, 7-tetradecyn-6,9-diol, 2,3,6,7-tetramethyl-4-octyne-3,6-diol, 3,6-diethyl-4-octyne-3,6-diol, 2,5-dimethyl-3-hexyn-2,5-diol, 2,4,7,9-tetramethyl-5-decyn-4,7-diol and 3,6-dimethyl-4-octyne- Ethylene oxide adducts of one or more alkynyl diols selected from 3,6-diols; more preferably one or more selected from 2,5,8,11-tetramethyl-6-dodecyn-5,8-diols and 2,4,7,9-tetramethyl-5-decyn-4,7-diols; even more preferably ethylene oxide adducts of 2,5,8,11-tetramethyl-6-dodecyn-5,8-diols.

[0059] It should be noted that ingredient (A) can be used alone or in combination with two or more ingredients.

[0060] That is, component (A) may be one or more selected from alkynyldiols with an HLB value of 4 to 12, or one or more selected from olefinic oxygen adducts of alkynyldiols with an HLB value of 4 to 12, or a combination of one or more selected from alkynyldiols with an HLB value of 4 to 12 and one or more selected from olefinic oxygen adducts of alkynyldiols with an HLB value of 4 to 12.

[0061] From the viewpoint of improving the effect of the present invention, component (A) is preferably one or more selected from alkynyl diols with an HLB value of 4 to 12.

[0062] (Second alcohols and their olefinic adducts) In the processing fluid of this embodiment, as component (A), one or more compounds selected from secondary alcohols and olefinic adducts of secondary alcohols may be further included.

[0063] That is, in the processing fluid of this embodiment, as component (A), in addition to one or more compounds selected from alkynyl diols and alkynyl diols with HLB values ​​of 4 to 12, one or more compounds selected from secondary alcohols and alkynyl diols with HLB values ​​of 4 to 12 may also be included as component (A).

[0064] One or more compounds selected from secondary alcohols and their olefinic adducts can complement the function of component (A) by combining one or more compounds selected from alkynyl diols with HLB values ​​of 4 to 12 and their olefinic adducts with HLB values ​​of 4 to 12 with the above-mentioned compound as component (A).

[0065] Here, secondary alcohols with 8 to 18 carbon atoms are preferably listed as examples. Furthermore, secondary alcohols are preferably monohydric alcohols. That is, monohydric secondary alcohols with 8 to 18 carbon atoms are preferred. The same applies to secondary alcohols that are olefinic adducts constituting secondary alcohols.

[0066] Examples of olefinic adducts of secondary alcohols include olefinic adducts with AO added to the hydroxyl group of the secondary alcohol, more preferably olefinic adducts with EO and / or PO added, and even more preferably olefinic adducts with EO added.

[0067] Here, the compound selected from one or more olefinic adducts of secondary alcohols is preferably a compound represented by the following general formula (2).

[0068] [Chemistry 2] In general formula (2), R 5 and R 6 Each can independently represent an alkyl group having 1 to 16 carbon atoms. Among them, can be used as R. 5 and R 6 The total number of carbon atoms in the selected alkyl group is 7 to 17.

[0069] The alkyl group can be straight-chain or branched, but is preferably branched.

[0070] In addition, in general formula (2), m is an integer from 0 to 20, preferably an integer from 1 to 20.

[0071] <Ingredient (B)> The processing fluid in this embodiment contains component (B).

[0072] Component (B) is a compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and which does not have carbon-carbon triple bonds.

[0073] Here, the cloud point of a 1% by mass aqueous solution of component (C) is higher than that of component (B). Therefore, the cloud point of a 1% by mass aqueous solution of component (B) is lower than that of component (C).

[0074] There is no limitation on the cloud point of a 1% by mass aqueous solution of component (B) as long as it is lower than that of a 1% by mass aqueous solution of component (C). However, from the viewpoint of more easily improving the effect of the present invention, the cloud point of a 1% by mass aqueous solution of component (B) is preferably 10°C or more lower than that of a 1% by mass aqueous solution of component (C), more preferably 15°C or more lower, and more preferably 18°C ​​or more lower. As a specific example of the cloud point of a 1% by mass aqueous solution of component (B), it is preferably 60°C or less.

[0075] It should be noted that, from the viewpoint of facilitating good solubility in water, the cloud point of a 1% by mass aqueous solution of component (B) is preferably 15°C or higher, more preferably 18°C ​​or higher, and even more preferably 20°C or higher.

[0076] In this specification, the cloud point value of a 1% by mass aqueous solution of component (B) is the value determined using the method described in the examples described later.

[0077] Examples of compounds that are copolymers of ethylene oxide and olefinic oxygen other than ethylene oxide and do not have carbon-carbon triple bonds include copolymers of EO and AO other than EO, and polyoxyethylene alkylene ethers.

[0078] As a copolymer of EO and AO other than EO, there is a copolymer of EO and AO other than EO described later. The addition of EO and AO other than EO can be either random addition or block addition. Random addition and block addition can also coexist. Preferably, it is a copolymer that has undergone block addition.

[0079] Examples of AOs other than EOs include olefinic oxygens with 3 or 4 carbon atoms, such as propylene oxide (PO), oxobutane, 1,2-epoxybutane, 2,3-epoxybutane, 1,3-epoxybutane, and tetrahydrofuran.

[0080] The copolymer of EO and AO other than EO is more preferably a copolymer of EO and PO, further preferably a block copolymer of EO and PO (also called a "block copolymer having polyethylene glycol units and polypropylene glycol units"), and even more preferably a triblock copolymer of EO and PO (also called a "triblock copolymer having polyethylene glycol units and polypropylene glycol units"). Additionally, the triblock copolymer of EO and PO can be a triblock copolymer with EO as the terminal block and PO as the middle block (EO / PO / EO type), or a triblock copolymer with PO as the terminal block and EO as the middle block (PO / EO / PO type (reverse type)).

[0081] Examples of polyoxyethylene alkylene alkyl ethers include AO adducts of alcohols other than EO and EO, with EO and PO adducts of alcohols being preferred.

[0082] Examples of such alcohols include aliphatic alcohols with 1 or more and 24 or fewer carbon atoms. From the viewpoint of balancing hydrophilicity and lipophilicity, the number of carbon atoms in such alcohols is preferably 1 to 14, more preferably 1 to 10, further preferably 1 to 6, even more preferably 1 to 4, even more preferably 1 or 2, and even more preferably 1.

[0083] The aliphatic alcohol is preferably a primary or secondary alcohol, more preferably a primary alcohol. It can also be linear, branched, or cyclic, but linear is preferred.

[0084] Examples of aliphatic alcohols include, for instance, methanol, ethanol, propanol, isopropanol, butanol, isobutanol, 2-methyl-2-butanol, pentanol, isoamyl alcohol, hexanol, 3-methyl-1-pentanol, heptanol, 2-heptanol, 3-heptanol, octanol, 2-ethylhexanol, nonanol, decanol, undecyl alcohol, lauryl alcohol, tridecyl alcohol, isotriadecyl alcohol, myristol, pentadecyl alcohol, palmitol, heptadecanol, stearyl alcohol, isostearyl alcohol, nonadecanol, eicosyl alcohol, etc.; unsaturated aliphatic alcohols include octenol, decenol, dodecenol, tridecenol, tetradecenol, palmitol, oleyl alcohol, eicosyl alcohol, linolenic acid alcohol, etc.; and cyclic aliphatic alcohols include ethylcyclohexanol, propylcyclohexanol, octylcyclohexanol, nonylcyclohexanol, adamantanol, etc.

[0085] Other than the EO in polyoxyethylene alkylene alkyl ethers, AOs can include, for example, olefinic oxygen with 3 or 4 carbon atoms, such as propylene oxide (PO), oxetane, 1,2-epoxybutane, 2,3-epoxybutane, 1,3-epoxybutane, and tetrahydrofuran. Among these, PO is preferred.

[0086] In addition, in the polyoxyethylene alkylene alkyl ether involved in component (B), in the copolymerization site of the aforementioned EO and AO other than EO, the addition mode of the EO and AO other than EO can be either random addition or block addition, and random addition and block addition can also coexist.

[0087] It should be noted that polyoxyethylene alkylene ethers can be synthesized by adding EO and AO to alcohols. The addition of EO and AO to alcohols can be carried out using known methods, or in one or more stages under normal or high pressure, with or without a catalyst.

[0088] Furthermore, in the copolymerization region of EO and AO other than EO, from the viewpoint of more easily improving the effect of the present invention, the content of the constituent unit derived from EO is preferably 15 mol% or more, more preferably 20 mol% or more, and even more preferably 25 mol% or more in the total amount of constituent units constituting the copolymerization region of 100 mol%, and preferably 85 mol% or less, more preferably 80 mol% or less, and even more preferably 75 mol% or less.

[0089] Furthermore, from the viewpoint of improving lubricity, the mass-average molecular weight (Mw) of component (B) is preferably 500 or more, more preferably 1000 or more, further preferably 1500 or more, and even more preferably 2000 or more. On the other hand, from the viewpoint of improving the abrasive's engagement with the workpiece, the mass-average molecular weight (Mw) of component (B) is preferably 10000 or less, more preferably 9000 or less, further preferably 8000 or less, and even more preferably 6000 or less.

[0090] In this specification, the mass-average molecular weight (Mw) value is a value determined using the method described in the examples described later.

[0091] Component (B) can be used alone or in combination of two or more.

[0092] It should be noted that, as a method for adjusting the cloud point of component (B), one example is to lower the cloud point by reducing the EO ratio of component (B).

[0093] <Ingredient (C)> The processing fluid in this embodiment contains component (C).

[0094] Component (C) is a compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and which does not have carbon-carbon triple bonds. It is a compound whose cloud point is higher than that of component (B) in a 1% by mass aqueous solution.

[0095] Here, the cloud point of a 1% aqueous solution of component (C) is higher than that of component (B).

[0096] There is no limitation on the cloud point of a 1% by mass aqueous solution of component (C) being higher than that of a 1% by mass aqueous solution of component (B). However, from the viewpoint of more easily improving the effect of the present invention, the cloud point of a 1% by mass aqueous solution of component (C) is preferably 10°C or more higher than that of a 1% by mass aqueous solution of component (B), preferably 15°C or more, and more preferably 18°C ​​or more.

[0097] It should be noted that, from the viewpoint of more easily improving the effect of the present invention, the cloud point of a 1% by mass aqueous solution of component (C) is preferably below 90°C, more preferably below 85°C, and even more preferably below 80°C.

[0098] In this specification, the cloud point value of a 1% by mass aqueous solution of component (C) is the value determined using the method described in the examples described later.

[0099] Compounds that contain a copolymerization site of ethylene oxide and olefinic oxygen other than ethylene oxide and do not have a carbon-carbon triple bond can be listed as, for example, copolymers of EO and AO other than EO or polyoxyethylene alkylene ethers, one or more of these. Among these, copolymers of EO and AO other than EO are preferred.

[0100] In copolymers of EO and AO other than EO, the addition of EO and AO other than EO can be either random addition or block addition, and random addition and block addition can also coexist. Preferred copolymers are those that have undergone block addition.

[0101] As AOs other than EOs, examples include olefinic oxygens with 3 or 4 carbon atoms, such as propylene oxide (PO), oxobutane, 1,2-epoxybutane, 2,3-epoxybutane, 1,3-epoxybutane, and tetrahydrofuran.

[0102] As a copolymer of AO other than EO, it is more preferably a copolymer of EO and PO, even more preferably a block copolymer of EO and PO, even more preferably a triblock copolymer of EO and PO, and even more preferably a Pluronic type copolymer (EO-PO-EO type triblock copolymer) with ethylene oxide added to polypropylene glycol.

[0103] Furthermore, in the copolymer of EO and AO other than EO involved in component (C), from the viewpoint of more easily improving the effect of the present invention, the content of the constituent units derived from EO is preferably 25 mol% or more, more preferably 30 mol% or more, further preferably 35 mol% or more, and even more preferably 40 mol% or more in the total amount of constituent units constituting the aforementioned copolymer of 100 mol%, and preferably 75 mol% or less, more preferably 70 mol% or less, further preferably 65 mol% or less, and even more preferably 60 mol% or less.

[0104] As a polyoxyethylene alkylene ether, except for the difference in cloud point, it is the same as the polyoxyethylene alkylene ether described for component (B), and its appropriate manner is also the same.

[0105] It should be noted that, as a method for adjusting the cloud point of component (C), one example is to increase the cloud point by increasing the EO ratio of component (C).

[0106] Furthermore, from the viewpoint of improving lubricity, the mass-average molecular weight (Mw) of component (C) is preferably 500 or more, more preferably 1000 or more, further preferably 1500 or more, and even more preferably 2000 or more. On the other hand, from the viewpoint of improving the abrasive's engagement with the workpiece, the mass-average molecular weight (Mw) of component (C) is preferably 10000 or less, more preferably 9000 or less, further preferably 8000 or less, and even more preferably 6000 or less.

[0107] In this specification, the mass-average molecular weight (Mw) value is a value determined using the method described in the examples described later.

[0108] Component (C) can be used alone or in combination of two or more.

[0109] <Content of Ingredient (A)> In the processing fluid of this embodiment, the content of component (A) needs to be 3.0% by mass or more based on the total amount of active ingredients.

[0110] By ensuring that the content of component (A) is 3.0% by mass or more, the compositional balance of the processing fluid can be ensured, thereby maximizing the effects of the present invention.

[0111] Here, from the viewpoint of more easily improving the effect of the present invention, the content of component (A) is based on the total amount of the active ingredient, preferably 3.000% by mass or more, more preferably 5.000% by mass or more, further preferably 8.000% by mass or more, even more preferably 10.000% by mass or more, even more preferably 12.000% by mass or more, even more preferably 12.300% by mass or more, and even more preferably 12.500% by mass or more.

[0112] <Total content of ingredients (B) and (C)> In the processing fluid of this embodiment, the total content of component (B) and component (C) needs to be 60% by mass or more based on the total amount of active ingredients.

[0113] By ensuring that the total content of components (B) and (C) is 60% by mass or more, the compositional balance of the processing fluid can be ensured, thereby achieving the effects of the present invention.

[0114] Here, from the viewpoint of more easily improving the effect of the present invention, the total content of component (B) and component (C) is preferably 60.000% by mass or more, more preferably 65.000% by mass or more, further preferably 68.000% by mass or more, even more preferably 70.000% by mass or more, even more preferably 72.000% by mass or more, even more preferably 74.000% by mass or more, and even more preferably 75.000% by mass or more.

[0115] <Content ratio of ingredient (A) to ingredient (C) [(A) / (C)]> In the processing fluid of this embodiment, the content ratio of component (A) to component (C) [(A) / (C)] is required to be 0.60 or more by mass.

[0116] By ensuring that [(A) / (C)] is 0.60 or higher, the compositional balance of the processing fluid can be ensured, thus achieving the effects of the present invention.

[0117] Here, from the viewpoint of more easily improving the effect of the present invention, [(A) / (C)] is preferably 0.600 or more, more preferably 0.630 or more, further preferably 0.660 or more, and even more preferably 0.690 or more. In addition, it is preferably 3.200 or less, more preferably 3.0 or less, further preferably 2.800 or less, and even more preferably 2.700 or less.

[0118] <Content ratio of ingredient (B) to ingredient (C) [(B) / (C)]> In the processing fluid of this embodiment, the ratio of component (B) to component (C) [(B) / (C)] is required to be less than 18 by mass.

[0119] By ensuring that [(B) / (C)] is less than 18, the compositional balance of the processing fluid can be ensured, thus achieving the effects of the present invention.

[0120] Here, from the viewpoint of more easily improving the effect of the present invention, [(B) / (C)] is preferably 1.500 to 18.000, more preferably 1.500 to 17.000, further preferably 2.000 to 15.000, and even more preferably 2.500 to 12.000.

[0121] <[(A) / {(B)+(C)}]> In the processing fluid of this embodiment, the ratio of the content of component (A) to the total content of components (B) and component (C) [(A) / {(B)+(C)}] by mass is preferably 0.040 to 2.0, more preferably 0.040 to 2.000, even more preferably 0.080 to 1.000, and even more preferably 0.100 to 0.500.

[0122] By making [(A) / {(B)+(C)}] within the above range, the composition of the processing fluid can be well balanced, which can easily improve the effect of the present invention.

[0123] <Water> The processing fluid in this embodiment contains water.

[0124] There are no particular limitations on the water used; purified water such as distilled water or ion-exchange water (deionized water) can be used; tap water; industrial water, etc. It is preferred to use purified water or ion-exchange water (deionized water), and even more preferably ion-exchange water (deionized water).

[0125] The water content can be adjusted appropriately according to the usage of the processing fluid.

[0126] For example, from the viewpoints of improving the flame retardancy and safety of the processing fluid, and from the viewpoints of improving operability by reducing the viscosity of the processing fluid, when the processing fluid of this embodiment is supplied to the workpiece for processing (e.g., cutting of brittle materials in a multi-wire saw apparatus), the water content in the processing fluid (hereinafter also referred to as "the water content of the first method") is preferably 95.000% by mass or more, more preferably 97.500% by mass or more, even more preferably 99.500% by mass or more, and even more preferably 99.600% by mass or more, based on 100% by mass of the total amount of processing fluid. Moreover, from the viewpoint of ensuring the amount of component (A), component (B), and component (C) in the processing fluid, it is 99.910% by mass or less, preferably 99.900% by mass or less, more preferably 99.890% by mass or less, even more preferably 99.880% by mass or less, and even more preferably 99.870% by mass or less.

[0127] It should be noted that, from the viewpoints of delivery efficiency and storage efficiency, the processing fluid in this embodiment can also be a processing fluid obtained by reducing the amount of water in the processing fluid and concentrating it. For example, it can also be a concentrated product obtained by reducing the amount of water in the processing fluid and concentrating it to 20 to 2000 times. Moreover, it can be diluted with water to 20 to 2000 times when used (during workpiece processing).

[0128] (Content of component (A)) In this embodiment, when the water content of the processing fluid is the same as that in the first embodiment described above, the content of component (A) is preferably 0.0100% by mass or more, based on 100% by mass of the total amount of the processing fluid. By ensuring that the content of component (A) is 0.0100% by mass or more, the composition of the processing fluid can be well balanced, and the effects of the present invention can be easily improved.

[0129] Here, from the viewpoint of more easily improving the effect of the present invention, based on 100% by mass of the total amount of processing fluid, the content of component (A) is preferably 0.0150% by mass or more, more preferably 0.0200% by mass or more, and even more preferably 0.0250% by mass or more.

[0130] Furthermore, from the viewpoint of the solubility of component (A) in water, based on the total amount of the processing liquid, the content of component (A) is preferably 0.100% by mass or less, more preferably 0.0800% by mass or less, and even more preferably 0.0700% by mass or less.

[0131] (Total content of ingredients (B) and (C)) In this embodiment, when the water content of the processing fluid is the same as that in the first embodiment described above, the total content of components (B) and (C) is preferably 0.0750% by mass or more, based on 100% by mass of the total amount of the processing fluid. By ensuring that the total content of components (B) and (C) is 0.0750% by mass or more, a good balance in the composition of the processing fluid can be achieved, which can easily improve the effect of the present invention.

[0132] Here, from the viewpoint of more easily improving the effect of the present invention, based on the total amount of the processing fluid, the total content of component (B) and component (C) is preferably 0.0850% by mass or more, more preferably 0.0950% by mass or more, and even more preferably 0.100% by mass or more.

[0133] Furthermore, it is preferred to be 0.600% by mass or less, more preferably 0.500% by mass or less, and even more preferably 0.400% by mass or less.

[0134] <Other Ingredients> The above-mentioned processing fluid may also contain components other than the active ingredient and water (hereinafter also referred to as "other components") without hindering the purpose of the present invention.

[0135] Other ingredients include, in addition to compounds equivalent to ingredients (A) to (C), surfactants, pH adjusters, water retention improvers, defoamers, metal inertizers, bactericides / preservatives, rust inhibitors, and antioxidants.

[0136] Other ingredients can be used alone or in combination of two or more.

[0137] In addition, among the other components, it is preferred to select one or more of surfactants, pH adjusters and water retention improvers other than components (A) to (C), more preferably one or more of water retention improvers and pH adjusters, and even more preferably a pH adjuster.

[0138] Examples of surfactants other than compounds equivalent to components (A) to (C) include anionic surfactants, cationic surfactants, nonionic surfactants other than compounds equivalent to components (A) to (C), and amphoteric surfactants.

[0139] Examples of anionic surfactants include alkylbenzene sulfonates and α-olefin sulfonates. Examples of cationic surfactants include quaternary ammonium salts such as alkyl trimethylammonium salts, dialkyl dimethylammonium salts, and alkyl dimethyl benzylammonium salts.

[0140] Examples of nonionic surfactants other than those corresponding to components (A) to (C) include, for example, polyoxyethylene alkyl ethers; polyoxyethylene alkyl ethers (wherein the polyoxyethylene portion does not include a component derived from ethylene oxide); ethers such as polyoxyethylene alkylphenyl ethers; compounds whose 1% by mass aqueous solution has a cloud point below 20°C or above 80°C, contains a copolymer portion of olefinic oxygen other than ethylene oxide, and does not have a carbon-carbon triple bond; alkynyl glycols with an HLB value less than 4 or greater than 12; olefinic oxygen adducts of alkynyl glycols with an HLB value less than 4 or greater than 12; and amides such as fatty acid alkanolamides.

[0141] As amphoteric surfactants, alkyl betaines and other similar surfactants can be listed.

[0142] pH adjusters are primarily used to adjust the pH of processing fluids. Various acidic and alkaline components can be listed as pH adjusters; by adjusting the proportions of these components, the pH of the processing fluid can be appropriately adjusted.

[0143] It should be noted that the acid and base components can react with each other to form a salt.

[0144] Therefore, when using acidic and alkaline components as pH adjusters, and when the reactants of these acidic and alkaline components are present in the aforementioned processing fluid, as described above, the content of each acidic and alkaline component contributing to the reaction can be calculated from the content of the reactants. Alternatively, in this case, instead of the reactants, the acidic and alkaline components can be considered as present before the reaction.

[0145] Examples of acidic components that can be used as pH adjusters include various fatty acids such as lauric acid, stearic acid, oleic acid, linoleic acid, linolenic acid, neodecanoic acid, isononanoic acid, decanoic acid, and isostearic acid; carboxylic acids such as acetic acid, malic acid, and citric acid; high molecular weight acids such as polyacrylic acid and their salts; and inorganic acids such as phosphoric acid. Among these, fatty acids are preferred, more preferably fatty acids with 12 or fewer carbon atoms such as neodecanoic acid, isononanoic acid, decanoic acid, and dodecanoic acid, and even more preferably one or more selected from neodecanoic acid, isononanoic acid, decanoic acid, and dodecanoic acid.

[0146] Examples of alkaline components that can be used as pH adjusters include, for example, monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, tri-n-propanolamine, tri-n-butanolamine, triisobutanolamine, tri-tert-butanolamine, N-methylethanolamine, N-ethylethanolamine, N-butylethanolamine, N-cyclohexylethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine, N-cyclohexyldiethanolamine, N,N-dimethylethanolamine, N,N-diethylethanolamine, and other alkanolamines; methylamine, dimethylamine, ethylamine, diethylamine, propylamine, dipropylamine, and other alkylamines; and ammonia. Among these, tertiary amines are preferred, and at least one selected from triethanolamine, triisopropanolamine, N-methyldiethanolamine, and N-cyclohexyldiethanolamine is more preferred.

[0147] Examples of water-retention improvers include ethylene glycol, propylene glycol, 1,4-butanediol, hexamethylene glycol, neopentyl glycol, diethylene glycol, triethylene glycol, dipropylene glycol, tripropylene glycol, glycerol, their ester derivatives, their ether derivatives; polyethylene glycol, polypropylene glycol, etc.

[0148] Examples of defoamers include silicone oil, fluorosilicone oil, polyether polysiloxane, and fluoroalkyl ether.

[0149] Examples of metal inert agents include imidazoline, pyrimidine derivatives, thiadiazole, and benzotriazole.

[0150] As bactericides / preservatives, examples include, in addition to parabens, benzoic acid, salicylic acid, sorbic acid, dehydroacetic acid, p-toluenesulfonic acid and their salts, as well as phenoxyethanol.

[0151] Examples of rust inhibitors include alkylbenzene sulfonates, dinonylnaphthalene sulfonates, alkenyl succinates, and polyol esters.

[0152] Examples of antioxidants include phenolic antioxidants and amine antioxidants.

[0153] When the processing fluid of this embodiment contains other components, the total content of the other components relative to 100 parts by mass of components (A), (B), and (C) can be 0.10 parts by mass or more, 0.20 parts by mass or more, or 0.30 parts by mass or more. Alternatively, it can be 30.00 parts by mass or less, 20.00 parts by mass or less, 10.00 parts by mass or less, 5.00% by mass or less, or 3.00 parts by mass or less.

[0154] [Physical properties of processing fluids] The processing fluid in this embodiment preferably satisfies the following physical properties.

[0155] <pH> From the viewpoint of suppressing corrosion of the various metal wires, processing devices, etc., described later in the section on the uses of the processing fluid, the pH of the processing fluid in this embodiment is preferably 3.0 or higher, more preferably 4.0 or higher, and even more preferably 5.0 or higher. On the other hand, from the viewpoint of suppressing the excessive generation of hydrogen from the chips during the processing of silicon, the pH of the processing fluid is preferably 10.0 or lower, more preferably 9.5 or lower, and even more preferably 9.0 or lower. In addition, the pH of the processing fluid is preferably 3.0 to 9.0.

[0156] In this specification, the pH of the processing fluid is a value determined using the method described in the examples described later.

[0157] <Si friction coefficient> From the viewpoint of imparting appropriate lubricity to the machining fluid and performing cutting operations effectively, the Si friction coefficient of the machining fluid in this embodiment is preferably 0.20 or less, more preferably 0.19 or less, and even more preferably 0.18 or less. Furthermore, it is preferably 0.10 or more, more preferably 0.11 or more, and even more preferably 0.12 or more.

[0158] In this specification, the Si friction coefficient of the processing fluid is a value determined using the method described in the examples described later.

[0159] [Method for manufacturing processing fluid] The method for manufacturing the processing fluid in this embodiment is not particularly limited. For example, the method for manufacturing the processing fluid in this embodiment is a method for manufacturing a processing fluid containing an active ingredient and water, wherein... The process includes mixing the active ingredient with the water. The active ingredients include the following components (A), (B), and (C). • Component (A): One or more compounds selected from alkynyldiols with HLB values ​​of 4 to 12 and their olefinic oxygen adducts with HLB values ​​of 4 to 12. • Component (B): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and which does not have carbon-carbon triple bonds. • Component (C): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and lacking carbon-carbon triple bonds, wherein the cloud point of a 1% by mass aqueous solution is higher than that of component (B). The amount of component (A) in the formulation is 3.0% by mass or more, based on the total amount of the active ingredient. The total amount of component (B) and component (C) is at least 60% by mass, based on the total amount of the active ingredients. The mixing ratio of component (A) to component (C) [(A) / (C)] is 0.60 or more by mass. The mixing ratio of component (B) to component (C) [(B) / (C)] is less than 18 by mass.

[0160] There are no particular restrictions on the mixing order of components (A) to (C). For example, components (A), (B), and (C) can be mixed into water sequentially or simultaneously, or components (A), (B), and (C) can be mixed in advance and then added to water.

[0161] In addition, in this manufacturing method, components (A) to (C) can be mixed in water, and other components can be mixed as needed. In this case, there are no particular limitations on the mixing order or mixing method of the mixed components.

[0162] It should be noted that components (A), (B), (C), water, and other components are each the same as described above, and their suitable formulations are also the same; therefore, detailed descriptions are omitted. Furthermore, the suitable mixing amounts and suitable mixing ratios of components (A), (B), (C), water, and other components are also the same as the contents and ratios of each component described above in the processing fluid; therefore, detailed descriptions are omitted.

[0163] [Applications of processing fluids] The processing fluid of this embodiment can suppress wire breakage even when the wires are thinned and the spacing between them is narrowed in a multi-wire saw apparatus, exhibiting appropriate lubricity and excellent cleanliness. Therefore, the processing fluid of this embodiment can be appropriately used when cutting workpieces made of brittle materials using a multi-wire saw apparatus. As the wire constituting the multi-wire saw apparatus, fixed abrasive wires can be suitable.

[0164] It should be noted that the processing fluid of this embodiment can be used not only for cutting operations based on multi-wire saw devices, but also for cutting operations based on single-wire saw devices. The metal wire constituting the single-wire saw device can also be abrasive wire with fixed particles.

[0165] Examples of brittle materials include crystalline silicon, sapphire, gallium nitride, silicon carbide, neodymium magnets, crystal, and glass. The processing fluid of this embodiment is particularly suitable for use when machining crystalline silicon, sapphire, or silicon carbide.

[0166] Processing methods for brittle materials The processing fluid of this embodiment can suppress wire breakage even when the wires are made thinner and the spacing between the wires is narrowed in a multi-wire saw device, has appropriate lubricity, and excellent cleanliness.

[0167] Therefore, according to the processing fluid of this embodiment, a method can be provided for cutting a workpiece made of brittle material using the processing fluid and a multi-wire saw apparatus. As the metal wire constituting the multi-wire saw apparatus, a fixed abrasive wire can be suitable.

[0168] It should be noted that, according to the processing fluid of this embodiment, a method for cutting a workpiece made of brittle material using a single-wire saw is also provided.

[0169] <Multi-wire saw device> The multi-wire saw apparatus described in the embodiments of this invention, specifically the application of the processing fluid and the processing method for brittle materials, will be explained. For example, in a multi-wire saw apparatus used in cutting, a metal wire is wound into each groove on two or more guide rollers that are engraved with multiple grooves at regular intervals. Each metal wire is held parallel with a certain tension. During cutting, the guide rollers are rotated, and while processing fluid discharged from nozzles or the like adheres to the metal wire, the wire is moved in one or both directions, pressing the silicon ingot against the wire coated with processing fluid and cutting it. Additionally, sometimes processing is performed while the processing fluid is applied to the workpiece itself, such as the silicon ingot, as needed.

[0170] The processing fluid used in the process is stored in tanks or the like and transported from there to the aforementioned processing chamber nozzles via piping. Furthermore, the processing fluid used during cutting is recovered using a used processing fluid receiving tank or the like at the bottom of the cutting device. Additionally, depending on the situation, it is sometimes circulated within the device for reuse.

[0171] The wire diameter of the metal wire used for processing brittle materials is appropriately selected according to its application, for example, preferably 120 μm or less, more preferably 100 μm or less, even more preferably 80 μm or less, even more preferably 60 μm or less, even more preferably 45 μm or less, and even more preferably 40 μm or less.

[0172] In addition, a size of 20 μm or larger is preferred.

[0173] The spacing of the metal wires used for processing brittle materials is appropriately set according to the required thickness of the cut wafer, for example, preferably 1100 μm or less, more preferably 1000 μm or less.

[0174] In addition, a size of 100 μm or larger is preferred.

[0175] [One aspect of the present invention provided] In one embodiment of the present invention, the following [1] to

[12] may be provided.

[0176] [1] A processing fluid containing an active ingredient and water, wherein, The active ingredients include the following components (A), (B), and (C). • Component (A): One or more compounds selected from alkynyldiols with HLB values ​​of 4 to 12 and their olefinic oxygen adducts with HLB values ​​of 4 to 12. • Component (B): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and which does not have carbon-carbon triple bonds. • Component (C): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and lacking carbon-carbon triple bonds, wherein the cloud point of a 1% by mass aqueous solution is higher than that of component (B). Based on the total amount of the active ingredients, the content of ingredient (A) is 3.0% by mass or more. Based on the total amount of the active ingredients, the combined content of ingredient (B) and ingredient (C) is 60% by mass or more. The content ratio of component (A) to component (C) [(A) / (C)] is 0.60 or more by mass. The ratio of component (B) to component (C) [(B) / (C)] by mass is less than 18.

[0177] [2] According to the processing fluid of [1], wherein the acetylenic diol is a compound represented by the following general formula (1), [Chemical Formula 3] [In the above general formula (1), R]1 ~R 4 Each can independently represent an alkyl group having 1 to 6 hydrogen atoms or carbon atoms.

[0178] [3] According to the processing liquid described in [1] or [2] above, wherein the cloud point of a 1% by mass aqueous solution of the component (B) is above 15°C.

[0179] [4] The processing liquid according to any one of [1] to [3] above, wherein the cloud point of a 1% by mass aqueous solution of the component (C) is below 90°C.

[0180] [5] The processing fluid according to any one of [1] to [4] above, wherein, as component (A), it further contains one or more compounds selected from secondary alcohols and olefinic adducts of secondary alcohols.

[0181] [6] The processing fluid according to any one of [1] to [5] above, wherein the ratio of the content of component (A) to the total content of component (B) and component (C) [(A) / {(B)+(C)}] is 0.040 to 2.0 by mass.

[0182] [7] The processing fluid according to any one of [1] to [6] above, wherein the pH is 3.0 to 9.0.

[0183] [8] The processing fluid according to any one of [1] to [7] above is used when cutting a workpiece made of brittle material using a multi-wire saw.

[0184] [9] According to the processing fluid described in [8] above, the metal wire constituting the multi-wire saw device is a fixed abrasive metal wire.

[0185]

[10] According to the processing fluid described in [8] or [9] above, wherein the brittle material is crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnet, crystal or glass.

[0186]

[11] The processing fluid according to any one of [8] to

[10] above, wherein the diameter of the wire constituting the multi-wire saw device is 120 μm or less, and the spacing between the wires is 1100 μm or less.

[0187]

[12] A method for manufacturing a processing fluid, comprising a process of mixing the active ingredient and the water. The active ingredients include the following components (A), (B), and (C). • Component (A): One or more compounds selected from alkynyldiols with HLB values ​​of 4 to 12 and their olefinic oxygen adducts with HLB values ​​of 4 to 12. • Component (B): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and which does not have carbon-carbon triple bonds. • Component (C): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and lacking carbon-carbon triple bonds, wherein the cloud point of a 1% by mass aqueous solution is higher than that of component (B). Based on the total amount of the active ingredients, the amount of ingredient (A) in the formulation is 3.0% by mass or more. Based on the total amount of the active ingredients, the combined amount of ingredient (B) and ingredient (C) is 60% by mass or more. The mixing ratio of component (A) to component (C) [(A) / (C)] is 0.60 or more by mass. The mixing ratio of component (B) to component (C) [(B) / (C)] is less than 18 by mass. Example

[0188] The present invention will be specifically described through the following embodiments. However, the present invention is not limited to the following embodiments.

[0189] [Methods for determining various physical properties] The properties of each raw material used in each embodiment and each comparative example were determined according to the following procedures.

[0190] (1) Cloud point of 1% by mass aqueous solution Regarding the turbidity point of 1% aqueous solutions of components (B) and (C), 100 mL of 1% aqueous solution of the components to be determined was poured into a 200 mL beaker. While stirring the aqueous solution with a magnetic stirrer (stirrer length: 30 mm) at a rotation speed of 400 rpm, the temperature of the aqueous solution was increased from 15 °C to the turbidity point at a rate of 5 °C / min. The liquid temperature at which the appearance of the aqueous solution became turbid was measured.

[0191] It should be noted that the “cloud point” of the compounds shown in Tables 1 and 2 below refers to the “cloud point of a 1% by mass aqueous solution of the compound”.

[0192] (2) HLB value The HLB value of component (A) is calculated using the Griffin method.

[0193] (3) Mass-average molecular weight The mass-average molecular weight (Mw) was determined using gel permeation chromatography (GPC). For GPC, two Tosoh Corporation-manufactured "TSKgel (registered trademark) SuperMultipore HZ-M" columns were used, with tetrahydrofuran as the eluent. A refractive index detector was used for the determination, with polystyrene as the standard sample.

[0194] [Examples 1-9, Comparative Examples 1-6] The following components were mixed to prepare the processing fluid with the composition shown in Table 1, and the following evaluation was conducted.

[0195] It should be noted that the numerical units for the blending composition in Table 1 are "mass%".

[0196] The following details the components used in the preparation of the processing fluids with the compositions shown in Table 1.

[0197] <Ingredients (A)> ・"Ingredient (A)-1" EO adduct of 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol (EO adduct of ynyndiol, HLB=8) ・"Ingredient (A)-2" The following compound (EO adduct of secondary alcohol) is represented by formula (1).

[0198] [Chemistry 4] .

[0199] <Ingredient (B)> • "Ingredient (B)-1" The polyoxyethylene portion is a polyoxyethylene alkyl ether formed by a random copolymer of ethylene oxide (EO) and propylene oxide (PO) (terminal methyl (terminal alkyl part), weight-average molecular weight (Mw) = 4597, EO / PO ratio (molar ratio) = 42 / 58, cloud point of 1% by mass aqueous solution = 43℃). • "Ingredient (B)-2" Poly(propylene oxide)-poly(ethylene oxide)-poly(propylene oxide) block copolymer (weight-average molecular weight (Mw) = 4261, EO / PO ratio (molar ratio) = 30 / 70, cloud point of 1% aqueous solution = 38℃) • "Ingredient (B)-3" Poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide) block copolymer (cloud point of 1% by mass aqueous solution = 23℃).

[0200] <Ingredient (C)> • "Ingredient (C)-1" Poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide) block copolymer (weight-average molecular weight (Mw) = 5654, EO / PO ratio (molar ratio) = 48 / 52, cloud point of 1% aqueous solution = 63℃) • "Ingredient (C)-2" Poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide) block copolymer (weight-average molecular weight (Mw) = 5498, EO / PO ratio (molar ratio) = 52 / 48, cloud point of 1% aqueous solution = 61℃).

[0201] <Water> • Ion-exchanged water.

[0202] <Other Ingredients> • pH adjuster 1: Isononanoic acid • pH adjuster 2: triisopropanolamine.

[0203] [evaluate] The following evaluations were performed on the processing fluids of the Examples and Comparative Examples 1 to 3.

[0204] <Evaluation 1: Determination of the coefficient of friction of silicon (Si)> Using the processing fluids obtained in Examples 1-9 and Comparative Examples 1-6, a reciprocating kinetic friction test was conducted under the following test conditions to determine the coefficient of friction.

[0205] • Reciprocating dynamic friction testing machine: "F-2100" manufactured by ORIENTEC Co., Ltd.

[0206] (Measurement conditions) • Ball: 3 / 16 inch SUJ2 • Test plate temperature: 50℃ • Test board: Polycrystalline silicon (surface polished to a mirror finish) • Sliding speed: 20mm / second • Sliding distance: 2cm • Number of round trips: 150 • Load capacity: 100g.

[0207] (evaluate) Processing fluids with a friction coefficient of 0.20 or less are classified as acceptable (Evaluation A). Fluids that are unacceptable are classified as unacceptable (Evaluation B).

[0208] <Evaluation 2: Evaluation based on processing using a multi-wire saw> For the processing fluids of Examples 1-9 and Comparative Examples 1-4, an evaluation was conducted based on processing using a multi-wire saw device.

[0209] (Experimental conditions) • Test setup: Multi-wire saw device • Metal wire: Abrasive-bonded metal wire core (wire diameter: 38μm) • Workpiece: Si ingot facing the solar cell.

[0210] (Evaluation Method) Evaluate the wire breakage rate during processing. Specifically, perform 100 processing cycles (cutting 100 ingots), and a breakage rate of less than 10 times is considered acceptable (Evaluation A). A failure rate is considered acceptable (Evaluation B).

[0211] <Evaluation 3: Cleanliness Evaluation> The processing fluids obtained in Examples 1-9 and Comparative Examples 1-6 were evaluated according to the following steps.

[0212] (Evaluation of fouling on the barrel wall) Pour 90 mL of processing fluid and 0.5 g of micro powder ("graphite powder", manufactured by Fujifilm and Kohden Chemical Industries, Ltd., premium grade) into a 100 mL graduated cylinder. Cover the graduated cylinder and shake it vigorously up and down 10 times. Evaluate the condition of the dirt on the upper part of the inner wall of the graduated cylinder according to the following criteria, and set evaluation A as qualified.

[0213] • A: The fouling on the barrel wall caused by the micro powder is mild, and the background near the liquid surface can be observed through the lens.

[0214] • B: The fouling on the barrel wall caused by the micro powder is so severe that the background near the liquid surface cannot be observed through the lens.

[0215] The results of evaluations 1 to 3 are shown in Table 1.

[0216] [Table 1] .

[0217] The following information can be obtained from Table 1.

[0218] It can be seen that the processing fluids of Examples 1 to 9 have low breakage rates, the silicon (Si) friction coefficient is an appropriate value, and the cleaning properties are also excellent.

[0219] In contrast, the processing fluids of Comparative Examples 1 to 3 have a higher breakage rate.

[0220] Furthermore, it is known that for the processing fluids of Comparative Examples 4 to 6, the coefficient of friction of silicon (Si) is high, and an appropriate value is not shown.

[0221] Therefore, it can be concluded that the processing fluids of comparative examples 3, 5, and 6 have poor cleanliness.

Claims

1. A processing fluid comprising an active ingredient and water, wherein, The active ingredients include the following components (A), (B), and (C). • Component (A): One or more compounds selected from alkynyldiols with HLB values ​​of 4 to 12 and their olefinic oxygen adducts with HLB values ​​of 4 to 12. • Component (B): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and which does not have carbon-carbon triple bonds. • Component (C): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and lacking carbon-carbon triple bonds, wherein the cloud point of a 1% by mass aqueous solution is higher than that of component (B). Based on the total amount of the active ingredients, the content of ingredient (A) is 3.0% by mass or more. Based on the total amount of the active ingredients, the combined content of ingredient (B) and ingredient (C) is 60% by mass or more. The content ratio of component (A) to component (C) [(A) / (C)] is 0.60 or more by mass. The ratio of component (B) to component (C) [(B) / (C)] by mass is less than 18.

2. The processing fluid according to claim 1, wherein, The acetylenic diol is a compound represented by the following general formula (1). [Chemical Formula 1] In the above general formula (1), R 1 ~R 4 Each can be independently represented as an alkyl group having 1 to 6 hydrogen atoms or carbon atoms.

3. The processing fluid according to claim 1 or 2, wherein, The cloud point of a 1% aqueous solution of component (B) is above 15°C.

4. The processing fluid according to any one of claims 1 to 3, wherein, The cloud point of a 1% aqueous solution of component (C) is below 90°C.

5. The processing fluid according to any one of claims 1 to 4, wherein, As said component (A), it also contains one or more compounds selected from secondary alcohols and their olefinic adducts.

6. The processing fluid according to any one of claims 1 to 5, wherein, The ratio of the content of component (A) to the total content of components (B) and (C) [(A) / {(B)+(C)}] is 0.040 to 2.0 by mass.

7. The processing fluid according to any one of claims 1 to 6, wherein, The pH ranges from 3.0 to 9.

0.

8. The processing fluid according to any one of claims 1 to 7, used when cutting a workpiece made of brittle material using a multi-wire saw.

9. The processing fluid according to claim 8, wherein, The metal wires constituting the multi-wire saw device are fixed abrasive metal wires.

10. The processing fluid according to claim 8 or 9, wherein, The brittle material is crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnet, crystal, or glass.

11. The processing fluid according to any one of claims 8 to 10, wherein, The diameter of the metal wires constituting the multi-wire saw device is less than 120 μm, and the spacing between the metal wires is less than 1100 μm.

12. A method for manufacturing a processing fluid, comprising a processing fluid containing an active ingredient and water, wherein, It includes a step of mixing the active ingredient with the water. The active ingredients include the following components (A), (B), and (C). • Component (A): One or more compounds selected from alkynyldiols with HLB values ​​of 4 to 12 and their olefinic oxygen adducts with HLB values ​​of 4 to 12. • Component (B): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and which does not have carbon-carbon triple bonds. • Component (C): A compound containing copolymerization sites of ethylene oxide and olefinic oxygen other than ethylene oxide, and lacking carbon-carbon triple bonds, wherein the cloud point of a 1% by mass aqueous solution is higher than that of component (B). Based on the total amount of the active ingredients, the amount of ingredient (A) in the formulation is 3.0% by mass or more. Based on the total amount of the active ingredients, the combined amount of ingredient (B) and ingredient (C) is 60% by mass or more. The mixing ratio of component (A) to component (C) [(A) / (C)] is 0.60 or more by mass. The mixing ratio of component (B) to component (C) [(B) / (C)] is less than 18 by mass.

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