Resin composition and manufacturing method thereof
By adding conductive carbon black and graphene to the resin composition, the problem of static electricity accumulation in resin products is solved, mechanical properties and surface resistance are improved, component leaching or escaping is reduced, and safety and performance are enhanced.
Patent Information
- Application Number
- CN202410635589.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-11-25
AI Technical Summary
In the electronics industry, resin products are prone to accumulating static charge during manufacturing or application, leading to risks of dust adsorption, electric shock, combustion, or explosion. Existing technologies are unable to effectively solve this problem.
By adding conductive carbon black and graphene to a resin composition, the conductivity is improved by using conductive carbon black and the amount of conductive carbon black used is reduced by using graphene, thus forming a resin composition in which conductive carbon black accounts for 1 wt% to 3 wt% and graphene accounts for 2 wt% to 4 wt%, and a specific preparation process is used to avoid the precipitation or escape of the components.
This reduces the accumulation of static charge, improves the mechanical properties and surface resistance of resin components, avoids the precipitation or escape of components during processing, and enhances the safety and performance of the product.
Smart Images
Figure CN121006045A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a resin composition and a method for manufacturing the same. Background Technology
[0002] In the electronics industry, resins (plastic parts) play a crucial role, often used as insulating components. For example, resin applications include circuit board substrates, electronic product casings, and adhesives. Depending on the specific requirements, resins with different physical properties can be selected.
[0003] However, the accumulation of static charge is a common problem in the manufacturing or application of resin products, such as when friction causes static charge to accumulate on the surface of the resin product. These static charges can lead to various negative effects. For example, they may attract dust, thus damaging the product. Furthermore, static charge can also trigger electric shocks, potentially leading to combustion or explosion hazards. To address these issues, there is an urgent need to develop a novel resin composition that can effectively prevent the accumulation of static charge.
[0004] The "Background Art" paragraph is only used to help understand the content of this invention. Therefore, the content disclosed in the "Background Art" paragraph may include some known technologies that are not known to those skilled in the art. The content disclosed in the "Background Art" paragraph does not mean that the content or the problems to be solved by one or more embodiments of this invention were known or understood by those skilled in the art prior to this application. Summary of the Invention
[0005] This invention provides a resin composition and a method for manufacturing the same. The conductive carbon black and graphene in the resin composition can reduce the surface resistivity of the resin composition, thereby reducing the accumulation of electrostatic charge. Furthermore, the resin composition proposed in this invention has the advantage of simple composition, which can reduce the problem of carbon or organic components leaching or escaping from the resin composition. Other objects and advantages of this invention can be further understood from the technical features disclosed herein.
[0006] To achieve one or more of the above-mentioned objectives, or other objectives, at least one embodiment of the present invention provides a resin composition comprising a resin carrier, conductive carbon black, and graphene. The conductive carbon black and graphene are dispersed in the resin carrier. By total weight of the resin composition, the resin carrier comprises 93 wt% to 97 wt%, the conductive carbon black comprises 1 wt% to 3 wt%, and the graphene comprises 2 wt% to 4 wt%.
[0007] To achieve one, some, or all of the above-mentioned objectives, or other objectives, at least one embodiment of the present invention provides a method for manufacturing a resin composition, comprising the following steps: mixing graphite material and an intercalating agent in a solvent, and treating with ultrasonic vibration to obtain a graphene solution. Mixing the graphene solution with a stabilizer to obtain a graphene dispersion. Drying the graphene dispersion to obtain graphene in a dry powder state, wherein at least a portion of the intercalating agent and at least a portion of the stabilizer are removed during the drying process. Mixing the dry powder graphene, conductive carbon black, and a resin carrier to obtain a resin composition. By total weight of the resin composition, the resin carrier accounts for 93 wt% to 97 wt%, the conductive carbon black accounts for 1 wt% to 3 wt%, and the graphene accounts for 2 wt% to 4 wt%.
[0008] Based on the above, by removing at least a portion of the intercalating agent and at least a portion of the stabilizer from the graphene dispersion through a drying process, the final resin composition can have a simpler composition, wherein the resin carrier can account for more than 93 wt%. Furthermore, by adding graphene, the amount of conductive carbon black used can be reduced while maintaining both electrical and mechanical properties. Attached Figure Description
[0009] Figure 1 This is a cross-sectional schematic diagram of a resin composition according to an embodiment of the present invention.
[0010] Figure 2 yes Figure 1 A flowchart of a method for manufacturing resin compositions.
[0011] Explanation of reference numerals in the attached figures:
[0012] 10: Resin carrier
[0013] 20: Conductive carbon black
[0014] 30: Graphene
[0015] S1, S2, S3, S4: Steps. Detailed Implementation
[0016] The foregoing description and other technical contents, features, and effects of this invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the invention.
[0017] Please refer to Figure 1Some embodiments of the present invention provide a resin composition comprising a resin carrier 10, conductive carbon black 20, and graphene 30. The resin composition may be formed, for example, into a plastic part, a housing, or a plate. Specific descriptions of the components of the resin composition are as follows.
[0018] resin carrier
[0019] The resin carrier 10 includes polycarbonate (PC) or other suitable resin materials (e.g., polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), etc.). Polycarbonate is an amorphous polymer engineering material with excellent impact strength, thermal stability, gloss, and flame retardancy. Due to its excellent electrical insulation properties, polycarbonate products are very suitable for industrial insulation materials, mainly due to its high surface resistivity or volume resistivity.
[0020] In the resin composition, the resin carrier 10 is used as the main component. Adding other additives besides the resin carrier 10 to the resin composition may result in the precipitation or dispersion of these other additives. To avoid the aforementioned problems, the higher the proportion of the resin carrier 10 in the resin composition, the better, except for necessary additives. In some embodiments, the resin carrier 10 accounts for 93 wt% to 97 wt% (weight percentage) of the total weight of the resin composition, while other additives account for 3 wt% to 7 wt%. In other embodiments, the resin carrier 10 accounts for 93 wt% to 96.5 wt%, while other additives account for 3 wt% to 7 wt%. Specifically, in this embodiment, the resin carrier refers to a single resin material (e.g., polycarbonate) or a mixture of multiple resin materials, but does not include non-resin materials.
[0021] Conductive carbon black
[0022] The conductive carbon black 20 is dispersed in the resin carrier 10. For example, the conductive carbon black 20 includes a plurality of conductive carbon black units (or conductive carbon black particles) that are uniformly distributed in the resin carrier 10.
[0023] In some embodiments, the conductive carbon black 20 comprises 95 wt% to 100 wt% carbon and 0 wt% to 5 wt% other components, including at least one of oxygen, sulfur, and nitrogen. For example, other components in the conductive carbon black 20 include ash. Specifically, the conductive carbon black 20 may be conductive channel black, conductive furnace black, super-conductive furnace black, or acetylene black, etc. In one embodiment of the present invention, the conductive carbon black 20 may contain only one of the above-mentioned carbon blacks; in another embodiment, the conductive carbon black 20 may contain a mixture of multiple carbon blacks, for example, conductive channel black and acetylene black, with a weight percentage ratio, for example, between 0.01 and 99.
[0024] In some embodiments, the conductive carbon black 20 does not exist as a single particle, but rather as a grape-like aggregate composed of tightly linked primary carbon black particles with diameters ranging from approximately 10 nm to 500 nm. This morphology constitutes the primary structure of the carbon black. These primary structures aggregate into larger structures, called agglomerates, due to the mutual attraction of van der Waals forces. Finally, after granulation, the conductive carbon black 20 used herein can be obtained. In some embodiments, the particle size of the conductive carbon black (or conductive carbon black unit) obtained after granulation is 30 nm to 65 nm.
[0025] In the resin composition of the present invention, the addition of conductive carbon black 20 helps to improve the conductivity of the resin composition, thereby improving the electrostatic problem of the resin composition. However, if the content of conductive carbon black 20 in the resin composition is too high, it will cause the problem of conductive carbon black 20 precipitation on the surface of the resin composition. In the present invention, the addition of graphene 30 to the resin composition helps to reduce the required content of conductive carbon black 20 in the resin composition. In some embodiments, the conductive carbon black 20 accounts for 1 wt% to 3 wt% of the total weight of the resin composition.
[0026] Graphene
[0027] Graphene 30 is dispersed in resin carrier 10. For example, graphene 30 comprises multiple graphene units (or graphene particles) that are uniformly distributed in resin carrier 10.
[0028] Graphene 30 is a two-dimensional material composed of a single layer (or fewer than 10 layers) of carbon atoms arranged in a highly efficient manner, resulting in excellent electrical conductivity. It is one of the best-conducting materials known. Graphene 30 also exhibits excellent thermal conductivity, even surpassing that of copper. This makes it an ideal material for thermal management, suitable for preparing high-performance heat dissipation materials and high-thermal-conductivity composite materials. Compared to one-dimensional carbon nanotubes, which are prone to entanglement and aggregation, two-dimensional graphene can be better dispersed in a resin carrier. In some embodiments, the graphene 30 described herein is prepared using an intercalation method.
[0029] In some embodiments, the average particle size of graphene (or graphene units) 30 is 5 μm to 10 μm (micrometers). In some embodiments, the oxygen content in graphene 30 is less than 0.1 wt%. In some embodiments, the addition of graphene 30 helps to reduce the required content of conductive carbon black 20 in the resin composition. In some embodiments, graphene 30 accounts for 2 wt% to 4 wt% of the total weight of the resin composition. In some embodiments, the weight percentage of graphene 30 to the weight percentage of conductive carbon black 20 in the resin composition is greater than or equal to 1.3 and less than or equal to 2. If the weight percentage of graphene 30 to the weight percentage of conductive carbon black 20 is greater than 2, it will result in excessively high conductivity of the resin composition, forming a conductive material; if the weight percentage of graphene 30 to the weight percentage of conductive carbon black 20 is less than 1.3, it will result in deterioration of the physical properties and conductivity of the resin composition.
[0030] The resin composition of the present invention has a simple composition. Specifically, the total weight of the resin carrier 10, conductive carbon black 20, and graphene 30 accounts for 96 wt% or more, preferably 99.5 wt% or more, of the resin composition. Other components in the resin composition may be impurities remaining from the manufacturing process; however, if the impurities are controlled to less than 0.5 wt%, they can be ignored. This configuration reduces the problem of components in the resin composition escaping or precipitating during processing. For example, if the resin composition contains too many other organic additives (e.g., residual intercalating agents and / or residual stabilizers), these organic additives are likely to escape during vacuum or heating processes when the resin composition is applied in semiconductor manufacturing, causing contamination problems. By using the resin composition of the present invention, the above-mentioned problems can be avoided.
[0031] The following will be paired Figure 2 The steps for preparing the resin composition of the present invention are further described below. It should be noted that the steps described below are not intended to limit the present invention, and other additional steps may be included between each step.
[0032] First, in step S1, the graphite material and the intercalating agent are mixed in a solvent. In some embodiments, the graphite material refers to, for example, pulverized graphite or other types of graphite. In some embodiments, the intercalating agent includes strong acids such as sulfuric acid, nitric acid, and perchloric acid, and potassium permanganate, sodium nitrate, hydrogen peroxide, or other suitable materials, or combinations thereof. In some embodiments, the solvent includes deionized water or other suitable materials, or combinations thereof.
[0033] After or during mixing, the graphite material, intercalating agent, and solvent are treated with ultrasonic vibration. The graphite material may consist of multiple layers (e.g., hundreds, thousands, or more layers), and the intercalating agent is inserted between the graphite layers. Ultrasonic vibration is then used to separate the graphite layers, thereby obtaining a graphene solution.
[0034] Next, in step S2, the graphene solution is mixed with a stabilizer to obtain a graphene dispersion. In some embodiments, the stabilizer is added to the graphene solution during ultrasonic oscillation. In some embodiments, the stabilizer adheres to the surface of the graphene in the graphene dispersion, thereby allowing the graphene to be stably dispersed in the solvent. Therefore, in some embodiments, the stabilizer may also be referred to as a dispersant. In some embodiments, the stabilizer includes hydrocarbon solvents, halogenated hydrocarbon solvents, alcohol solvents, or other suitable materials or combinations thereof.
[0035] In some embodiments, the graphene dispersion comprises 1 wt% to 5 wt% of solvent, 90 wt% to 94 wt% of graphene, 1 wt% to 2.5 wt% of intercalating agent, and 0.1 wt% to 0.5 wt% of stabilizer.
[0036] In step S3, after obtaining the graphene dispersion, the graphene dispersion is subjected to a drying process to obtain graphene in a dry powder state. For example, the solvent, at least a portion of the intercalating agent, and at least a portion of the stabilizer in the graphene dispersion are removed by a drying process (e.g., a vacuum process and / or a heating process). In this step, the intercalating agent and stabilizer are removed as much as possible to avoid residual intercalating agent and stabilizer in the finally obtained resin composition, which could lead to escape problems. In some embodiments, the residual intercalating agent and stabilizer in the dry powder state accounts for 0 wt% to 0.1 wt%.
[0037] In step S4, the obtained dry powder graphene, conductive carbon black, and uncured resin carrier are mixed to obtain a resin composition. In some embodiments, the dry powder graphene, conductive carbon black, and resin are melt-kneaded using a twin-screw extruder, and finally the resin composition is extruded. In this invention, dry powder graphene is added to the twin-screw extruder instead of graphene in a dispersion state, otherwise the extrusion process would be difficult.
[0038] Table 1 provides a comparison of the properties of the resin compositions of Examples 1, Comparative Examples 1 and 2 of the present invention. To facilitate comparison of the differences in properties between the examples and comparative examples, in Examples 1 and Comparative Examples 1 of Table 1, the conductive carbon black contains, for example, only acetylene black. In Example 1 of Table 1, the resin composition includes 93 wt% to 97 wt% polycarbonate, 1 wt% to 3 wt% acetylene black, and 2 wt% to 4 wt% graphene. In Comparative Example 1 of Table 1, the resin composition includes 80 wt% to 90 wt% polycarbonate and 10 wt% to 20 wt% acetylene black. In Comparative Example 2 of Table 1, the resin composition includes 90 wt% to 95 wt% polycarbonate and 5 wt% to 10 wt% carbon nanotubes.
[0039] Example 1 Comparative Example 1 Comparative Example 2 proportion 1.2 1.22 1.22 Bending strength (MPa) 99 83 75 Bending modulus (MPa) 2980 2705 2605 <![CDATA[Impact strength (KJ / m 2 )]]> 12.9 8.8 5 Tensile strength (MPa) 58 58 52 Elongation (%) 36 24 20 Surface resistivity (ohms / sq) <![CDATA[10 3 ]]> <![CDATA[10 5 ]]> <![CDATA[10 5 ]]>
[0040] In Table 1, the measurement standards for flexural strength, flexural modulus, impact strength, tensile strength, and elongation are ASTM D790, ASTM D256, ASTM D638, and ASTM D638, respectively. Table 1 shows that the resin composition of Example 1 of the present invention has better mechanical properties and lower surface resistivity than the resin compositions of Comparative Example 1 and Comparative Example 2.
[0041] In summary, the resin composition of the embodiments of the present invention has at least one of the following advantages: reduced precipitation of conductive carbon black in the resin composition; reduced graphene agglomeration in the resin composition; and improved mechanical properties and surface resistivity of the resin composition.
[0042] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the invention are still within the scope of this patent. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features disclosed in the invention. In addition, the abstract and title (invention title) are merely for assisting in patent document retrieval and are not intended to limit the scope of the invention.
Claims
1. A resin composition, characterized in that, The resin composition includes a resin carrier, conductive carbon black, and graphene, wherein: The resin carrier accounts for 93% to 97% of the total weight of the resin composition; The conductive carbon black is dispersed in the resin carrier, wherein the conductive carbon black accounts for 1% to 3% by weight of the total weight of the resin composition; and The graphene is dispersed in the resin carrier, wherein the graphene accounts for 2% to 4% by weight based on the total weight of the resin composition.
2. The resin composition according to claim 1, characterized in that, The total weight of the resin carrier, the conductive carbon black, and the graphene accounts for more than 99.5% of the weight of the resin composition.
3. The resin composition according to claim 1, characterized in that, The ratio of the weight percentage of graphene to the weight percentage of conductive carbon black is greater than or equal to 1.3 and less than or equal to 2.
4. The resin composition according to claim 1, characterized in that, The graphene comprises multiple graphene units, which are uniformly distributed in the resin carrier.
5. The resin composition according to claim 2, characterized in that, The conductive carbon black comprises 95% to 100% by weight of carbon and 0% to 5% by weight of other components, including at least one of oxygen, sulfur, and nitrogen.
6. The resin composition according to claim 1, characterized in that, The specific gravity of the resin composition is approximately 1.2, and the surface resistivity of the resin composition is approximately 10 Ω. 3 Ohms per square meter.
7. The resin composition according to claim 1, characterized in that, The graphene has an average particle size of 5 μm to 10 μm, and the conductive carbon black has an average particle size of 30 nm to 65 nm.
8. The resin composition according to claim 1, characterized in that, The conductive carbon black comprises at least two of the following: conductive channel black, conductive furnace black, superconducting furnace black, and acetylene black.
9. A method for manufacturing a resin composition, characterized in that, The manufacturing method includes: Graphite material and intercalating agent are mixed in a solvent and then subjected to ultrasonic vibration to obtain a graphene solution. The graphene solution was mixed with a stabilizer to obtain a graphene dispersion; The graphene dispersion is subjected to a drying process to obtain graphene in a dry powder state, wherein at least a portion of the intercalating agent and at least a portion of the stabilizer are removed during the drying process; and The dry powder of graphene, conductive carbon black, and a resin carrier are mixed to obtain the resin composition, wherein the resin carrier accounts for 93% to 97% by weight, the conductive carbon black accounts for 1% to 3% by weight, and the graphene accounts for 2% to 4% by weight, based on the total weight of the resin composition.
10. The manufacturing method according to claim 9, characterized in that, In the dry powder graphene, the residues of the intercalating agent and the stabilizer account for 0% to 0.1% by weight.
11. The manufacturing method according to claim 9, characterized in that, The drying process includes a vacuum process and / or a heating process.
12. The manufacturing method according to claim 9, characterized in that, The method of mixing the dry powder graphene, the conductive carbon black, and the resin carrier includes melt mixing using a twin-screw extruder.