Eddy current (EC) defect map and defect classification

Abstract

A presentation indicative of eddy current (EC) inspection results may be generated and displayed. For example, amplitude values or phase values associated with an eddy current measurement signal may be presented graphically, for example, by aligning indicia of the amplitude values or phase values associated with the eddy current measurement signal with a shape representative of the measured object, the indicia corresponding to locations on or within the shape at which the eddy current measurement signal is obtained. In another example, visual attributes of the displayed indicia of amplitude or phase values may be assigned based on defect categories, e.g., using different colors corresponding to different defect categories defined by regions in the impedance plane. Identifying defects using attributes may be performed alone, or in combination with alignment of markers and shapes.

Description

[0001] Priority requirements

[0002] This patent application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 493,190 (Attorney’s File No. 6409.261PRV), filed March 30, 2023, entitled “EDDY CURRENT (EC) DEFECT VIEW AND COLOR PALETTE”, which is incorporated herein by reference in its entirety. Technical Field

[0003] This document relates in general, but not in a limiting manner, to devices and techniques for nondestructive testing (e.g., facilitating eddy current testing), and more specifically to devices and techniques for generating the presentation of inspection results in a manner that provides defect classification (e.g., by color) or indication of the spatial location of defects in a representation of the object under test, or a combination of such classification and spatial location indication. Background Technology

[0004] Non-destructive testing (NDT) can refer to the use of one or more different techniques to inspect areas on or within an object, for example, to determine the presence of defects or flaws, or to otherwise characterize the object being inspected. One class of NDTs can include the use of eddy current testing methods, in which electromagnetic energy is applied to an object and induced currents generated on or within the object are detected, where the value of the detected current (or associated impedance) provides an indication of the structure of the object under test, such as the presence of cracks, scratches, voids, pores, or other inhomogeneities. Typically, eddy current (EC) sensors include one or more sensor elements, such as induction coils that can be excited using an alternating current (AC) source. Such coils (or other electromagnetic sensing elements, such as Hall sensors) can be used to receive signals indicating induced eddy currents on or within a structure. As an illustration, an eddy current probe can be inserted into a hole, such as a bolt hole, and the eddy current probe can be rotated within the hole or otherwise excited to provide circumferential inspection coverage around the hole. Summary of the Invention

[0005] Eddy current (EC) testing is a common nondestructive testing technique. As an illustrative example, EC testing can be used to identify corrosion, pitting, cracks, or other defects in conductive structures. In one application, an eddy current probe can be used to examine the circumference of a hole in a conductive structure. Such an examination can be used to identify defects such as burrs, scratches, cracks, or voids located along the circumference of the hole, for example, defects on or within the inner wall of the hole. Such an examination can often be referred to as an EC “bolt hole” inspection. In one approach, a band diagram or impedance plane diagram can be used to visualize the EC inspection results of the hole inspection. Band diagram indications (e.g., “waterfall” charts) or impedance plane indications can reliably indicate the presence of defects. However, the inventors have recognized that such visualizations often lack clues to the user regarding the actual spatial location of such defects.

[0006] In this example, this topic can be used to generate or provide users with one or more graphical markers indicating the results of eddy current (EC) inspections. For example, indications of defect locations or other features can be graphically presented relative to a graphical representation of the inspected area. For instance, a circular (two-dimensional) or cylindrical (three-dimensional) representation can be created, where markers indicating the angular location of the defect or the magnitude of the eddy current signal (e.g., an approximation of the defect depth in the material) or both are shown by indicators aligned with the circular or cylindrical representation. An estimate or measurement of the axial location of the defect can also be indicated. In this way, a user viewing the representation can more easily and accurately determine (e.g., locate) the physical location on or within the inspected object corresponding to the displayed indications.

[0007] In another example, the indication of a defect or other feature may include a classification established or selected based on the defect type, for example, using at least in part phase and amplitude criteria applied to the complex-valued signal representation obtained from an EC inspection probe. As an illustration, such a classification may be indicated by color (or other visual attributes). As mentioned above, the defect indication may be spatially arranged on a representation of the object under test corresponding to the physical location of the feature generating the indication. This presentation providing visualization of the defect location may be combined with a color-coded representation of the defect classification. Color is merely an illustrative example of an attribute that can indicate a defect category, and another attribute of the graphic indication may be adjusted to provide information about the defect classification (e.g., adjusting one or more of the hue, saturation, brightness, symbol, or size of the graphic indication). Attributes indicating other parameters, such as the amplitude of the eddy current measurement signal, may also be provided simultaneously, for example, through modulation attributes (e.g., increasing or decreasing the brightness or saturation of the color-coded defect based on the indication amplitude).

[0008] In an example, a machine-implemented method may include: generating an eddy current excitation signal to excite a sensor of an inspection probe assembly; receiving an eddy current measurement signal from the inspection probe assembly; determining at least one of an amplitude value or a phase value associated with the eddy current measurement signal; and generating a presentation indicating the amplitude or phase value (e.g., for display to a user), the presentation including aligning a marker of the amplitude or phase value with a shape representing the object under test, the marker corresponding to the location on or within the shape where the eddy current measurement signal was obtained. The machine-implemented method may include assigning visual attributes to the marker based on a defect category.

[0009] In an example, a machine-implemented method may include: generating an eddy current excitation signal to excite a sensor of an inspection probe assembly; receiving an eddy current measurement signal from the inspection probe assembly; determining at least one of an amplitude value or a phase value associated with the eddy current measurement signal; and generating a presentation for displaying to a user that indicates the amplitude or phase value, the presentation including visual attributes of markers assigning the amplitude or phase value based on a defect category, wherein the visual attributes include at least one of brightness, hue, saturation, or pattern corresponding to the respective defect category.

[0010] In the example, the following system can be used to perform the machine-implemented methods mentioned above or as described elsewhere herein, the system comprising: transmitter circuitry for generating eddy current excitation signals to excite sensors of an inspection probe assembly; receiver circuitry for receiving eddy current measurement signals from the inspection probe assembly; processor circuitry; and memory circuitry coupled to the processor circuitry, the memory circuitry including instructions that, when executed by the processor circuitry, cause the system to perform the machine-implemented methods mentioned above or as described elsewhere herein.

[0011] The content of this invention is intended to provide an overview of the subject matter of this patent application. It is not intended to provide an exclusive or exhaustive description of the invention. Detailed descriptions are included to provide additional information regarding this patent application. Attached Figure Description

[0012] In drawings that are not necessarily drawn to scale, similar reference numerals may describe similar parts in different views. Similar reference numerals with different letter suffixes may indicate different instances of similar parts. The drawings generally illustrate the various embodiments discussed in this document by way of example rather than limitation.

[0013] Figure 1 Examples of non-destructive testing systems are shown in general, which can be used, for example, to perform at least a portion of one or more techniques as shown and described herein.

[0014] Figure 2The illustration shows, for example, an example of an eddy current inspection probe scanner and associated sensors used for bolt hole inspection.

[0015] Figure 3A and Figure 3B An illustrative example of a graph representing the acquired eddy current measurement signal is shown, in which... Figure 3A The amplitude and time of the signal components are shown, and Figure 3B The amplitudes of the two corresponding signal components are shown in the parametric plot.

[0016] Figure 3C An illustrative example of a series of graphs representing the acquired eddy current measurement signal is shown, which represents the amplitude of the signal components versus time.

[0017] Figure 4A An illustrative example is shown, which includes a two-dimensional representation of the shape of the object being measured and a presentation of associated markers for the eddy current measurement signal.

[0018] Figure 4B An illustrative example is shown, which includes a three-dimensional representation of the shape of the object being measured and a presentation of associated markers for the eddy current measurement signal.

[0019] Figure 5A The diagram shows a parametrically plotted graph representing the acquired eddy current measurement signal, along with illustrative examples of alarm zones corresponding to different defect categories.

[0020] Figure 5B The diagram shows graphs illustrating the acquired eddy current measurement signals and the methods that can be used... Figure 5A The illustration shows an example of the associated markers for the defects identified in the warning area.

[0021] Figure 6 An illustrative example is shown, including a graph showing the acquired eddy current measurement signal and an associated marker for a defect that can be identified, for example, for a measurement application other than bolt hole inspection.

[0022] Figure 7 The invention generally illustrates techniques such as machine-implemented methods, including generating a presentation for displaying to a user an indication of the amplitude or phase value of an eddy current measurement signal, the presentation including aligning markers of the amplitude or phase value with a shape representing the object being measured.

[0023] Figure 8 The present invention generally illustrates techniques such as machine-implemented methods, including generating a presentation for displaying to a user an indication of the amplitude or phase value of an eddy current measurement signal, the presentation including visual attributes of the displayed markers assigned based on defect categories.

[0024] Figure 9 A block diagram is shown illustrating an example of a machine on which any or more of the techniques (e.g., methods) discussed herein can be performed. Detailed Implementation

[0025] The topics described in this document can facilitate eddy current (EC) testing, which, for example, provides a graphical user interface (GUI) and related machine-implemented tools to help users locate or classify defects indicated by EC measurements (or both). For example, this topic can include generating a defect visualization that, for example, provides markers of detected defects superimposed on a visualization of at least a portion of the object under test.

[0026] Figure 1 An example of a non-destructive testing system 100 is generally shown, which can be used, for example, to perform at least a portion of one or more techniques as shown and described herein. The non-destructive testing system 100 may include a test instrument 140, such as a handheld or portable component. The test instrument 140 may be electrically coupled to a probe assembly 150, for example, using a multi-conductor interconnect 130. The probe assembly 150 may include one or more eddy current coil sensors, such as an EC sensor array 152 including corresponding eddy current (EC) sensors 154A to 154N.

[0027] Modular probe assembly 150 can be configured, for example, to enable test instrument 140 to be used with a variety of different probe assemblies. Typically, sensor array 152 includes, for example, EC coils located on or within a substrate. The EC coils are electromagnetically coupled to target 158 ​​(e.g., test sample or "object under test"). Test instrument 140 may include digital and analog circuitry, such as front-end circuitry 122 including one or more transmit signal chains (forming transmitter circuitry), receive signal chains (forming receiver circuitry), or switching circuitry systems (e.g., transmit / receive switching circuitry systems). Transmit signal chains may include amplifier and filter circuitry systems, for example, to provide an AC excitation signal to be transmitted to probe assembly 150 via interconnect 130. Defects 160 associated with target 158 ​​may be detected, for example, by monitoring the impedance or other electrical characteristics associated with the respective sensors 154A to 154N in sensor array 152, or by digitizing eddy current measurement signals induced in response to the excitation signal.

[0028] For example, in response to an overall test plan established from the corresponding test instrument 140 or by another remote system (e.g., computing facility 108 or general-purpose computing devices such as laptop computer 132, tablet computer, smartphone, desktop computer, etc.), the test protocol can be executed using coordination between multiple test instruments 140. As an illustrative example, the test plan can be established based on published standards or regulatory requirements and can be executed at the initial stage or repeated for continuous monitoring. Typically, as described elsewhere herein, the EC check configuration can be established independently, for example, executed by the test instrument 140 in a fully automatic or semi-automatic manner.

[0029] Front-end circuitry 122 may be coupled to and controlled by one or more processor circuits, such as processor circuitry 102 included as part of test instrumentation 140. The processor circuitry may be coupled to memory circuitry 104, for example, to execute instructions that cause test instrumentation 140 to perform data processing or storage related to EC checks, one or more EC checks, or otherwise perform techniques as shown and described herein. Test instrumentation 140 may be communicatively coupled to other parts of system 100, for example, using a wired or wireless communication interface 120.

[0030] For example, the implementation of one or more techniques as shown and described herein can be implemented on the on-board test instrument 140 or using other processing or storage facilities (e.g., using computing facility 108 or general-purpose computing devices such as laptop computer 132, tablet computer, smartphone, desktop computer, etc.). For example, processing tasks that would be undesirably slow or beyond the capabilities of the on-board test instrument 140 if performed on it, for example, in response to a request from the test instrument 140, can be performed remotely (e.g., on a separate system). The test instrument 140 may include, for example, a display 110 for presenting configuration information or results and an input device 112 for receiving operator commands, configuration information, or responses to queries, such as one or more of a keyboard, trackball, function keys or soft keys, mouse interface, touchscreen, stylus, etc.

[0031] In the illustrative example, probe assembly 150 may include, for example, a hole probe sensor configured to be inserted into a hole (e.g., a bolt hole) and rotated manually or using a rotary actuator (e.g., a bolt hole scanner). The position of probe assembly 150 within the hole (e.g., in the axial direction) may be measured manually, for example using a scale or indicator included as part of probe assembly 150, or probe assembly 150 may be coupled to an encoder to, for example, record or indicate axial position values.

[0032] Figure 2An example of an eddy current inspection probe scanner 250, for example, used for bolt hole inspection, is shown. Typically, the eddy current inspection probe scanner 250 is coupled to a probe assembly including a sensor 254 (e.g., a coil). The probe assembly can be rotated from the scanner 250, or for example, detachable from the scanner 250 (e.g., so that multiple different probe assemblies can be used with the scanner 250 depending on the application). A multi-conductor interconnect 230 is used to provide an interface between the eddy current inspection probe scanner 250 and measuring instruments, as described above. Figure 2 In the illustrative example, the eddy current inspection probe scanner 250 may include an actuator, such as a motor, to rotate the sensor 254, thereby providing circumferential coverage of the interior of a hole 258 in the object under test, for example, for performing bolt hole inspection. The probe may translate in the axial direction 262 such that rotating the sensor 254 covers all or the desired portion of the interior of the hole 258. The eddy current inspection probe scanner 250 does not need to include automatic rotation, but may instead carry a probe that is translated and rotated entirely manually. One or more encoders may be used, for example, to correlate the acquired eddy current measurement signal with one or more of the angular position of rotation of the sensor 254 or the axial position of the sensor 254. The examples in this document are generally applicable to bolt hole inspection, but are also applicable to other eddy current inspection applications discussed below.

[0033] Figure 3A and Figure 3B An illustrative example of a graph representing the acquired eddy current measurement signal is shown, in which... Figure 3A The amplitude and time of the signal components are shown, and Figure 3B The amplitudes of the two corresponding signal components are shown in the parametric plot. Figure 3A This can be referred to as a band chart 310A view, where the amplitude corresponds to the imaginary part of the complex-valued eddy current measurement signal (e.g., the imaginary part of an impedance signal). Typically, an indication 311A ​​exceeding a threshold 309A in the positive or negative direction in the band chart 310A indicates the presence of a defect in the object under test. As discussed above, such a band chart 310A view does not provide the operator with intuitive (or even any) spatial guidance regarding the physical location along the object under test corresponding to the feature generating the indication 311A. Figure 3B Another visualization of the eddy current measurement signal is shown, where the impedance plane 310B view displays a parametric graph of the real and imaginary parts of the eddy current measurement signal. Impedance plane 310B can provide additional information related to defects, such as where indication 311B extends beyond the box 309B that defines the alarm or limit boundary. As an illustration, qualitative or semi-quantitative alarm criteria can be applied in bolt hole inspection applications to differentiate between defect categories:

[0034] Examples of defect categories <![CDATA[Relative to the vertical phase shift direction (θ Z )]]> Amplitude (|Z|) fatigue cracks To the right >25% SH fatigue cracks left >75% SH scratches <45° to the left <40%-50% SH Gap / cut 45° to the left <40%-50% SH dent 45° to the left <20% SH corrosion To the left, where there is no clear signal in the scan mode. 30%-40% SH

[0035] Table I. Semi-quantitative classification criteria for impedance plane EC acquisition

[0036] The standards shown in Table I above can correspond to different segments or "sectors" in the impedance plane, and can be called "sectoral" alarms because of the sector-like shape of such alarm areas superimposed on the impedance plane view. Color or other attributes can be associated with the corresponding alarms, as detailed below. Figure 5A The topic under discussion. Return to reference. Figure 3B In the impedance plane view 310B, no indication is provided of the physical location of the feature or defect leading to indication 311A. In another example, a "waterfall" view obtained from a series of continuous eddy current measurements could be shown, for example... Figure 3C As shown.

[0037] Figure 3C An illustrative example of a series of 313 graphs representing the acquired eddy current measurement signal is shown, which represents the amplitude of the signal components versus time. For example, as mentioned above regarding... Figure 2 As discussed, each strip pattern trace shown in Series 313 can correspond to a 360-degree rotation of the sensor around the circumference of a hole in the object under test. Each strip pattern trace can correspond to a different axial position as the eddy current inspection probe moves axially through the hole. Even with this indication of axial position, Series 313 does not visually indicate the physical location of the defect to the user, thus presenting a challenge in interpreting such a view.

[0038] Among other things, the inventors have recognized that band plot time series can be wrapped around a representation of the shape of the object being measured. For example, Figure 4A An illustrative example is shown of a presentation 415A comprising a two-dimensional representation 459A of the circular shape of the object under test and associated markers 417 of the eddy current measurement signal. The eddy current measurement signal may be a continuous banded trace (e.g., interpolated between individual acquired data points) or a series of individual markers such as dots or other symbols. The representation of the signal may be wrapped around the two-dimensional representation 459A to show the relative or absolute angular position of a defect or other detected feature along the circumference of a hole or other structure, the relative or absolute angular position corresponding to the location where the eddy current measurement signal (or a portion thereof) was acquired. To aid in explanation, a “phantom” outline or other marker of the location of the eddy current inspection probe scanner 450 may be superimposed on the presentation 415A. For example, the eddy current inspection probe scanner 450 may be fixed to indicate, for example, other information relative to a zero-degree reference on which it is superimposed.

[0039] With Figure 4A In a similar way, Figure 4BAn illustrative example is shown of a presentation 415B of a three-dimensional representation 459B of the shape of the object under test and an associated marker 417 of the eddy current measurement signal. The three-dimensional representation 459B may represent the inner wall of a bolt hole or other structure, and a series of acquired band-map time-series eddy current measurement signals may be wrapped around the three-dimensional representation 459B to visualize the physical location corresponding to the acquired eddy current measurement signal indication. The axial position indicated by the three-dimensional representation 459B can be established, for example, using data from an encoder that provides depth information in the axial direction. In another method, the axial position of the marker 417 along the three-dimensional representation 459B can be established such that each axial position corresponds to one 360-degree rotation of the scanner, and the count of such rotations corresponds to the axial position of the generated marker 417. In this method, the absolute position of the marker 417 is unknown, but the axial position is approximated by counting. The protrusion depth of the defect corresponding to the marker 417 may be unknown, but the approximate value of the defect penetration into the object under test or the severity of the defect can be indicated, for example, using the length of the marker 417 or other visual representation. For example, the mark can be further radially outward from the three-dimensional representation 459B in proportion to the size of the vertical portion (e.g., imaginary portion) corresponding to the mark represented by the impedance plane.

[0040] The 3D representation 459B can be partially transparent, or it can rotate in response to user input to visualize indicators that might be obscured by the cylindrical representation. Figure 4A and Figure 4B In the examples, as an illustrative example, a strip diagram can represent the envelope of the acquired eddy current measurement signal, the original signal, or a rectified representation of such a signal. For example, a strip diagram encircling a shape can represent the imaginary part of the acquired eddy current measurement signal.

[0041] One or more "alert" criteria can be used to determine whether and how the associated tag 417 is represented on the 3D representation 459B. For example, a threshold or range window can be established as discussed in other examples throughout this document. (See below for details.) Figure 5B The different defect categories discussed can be represented by unique attributes, such as providing markers with different colors (e.g., hue), saturation, brightness, or shadows (e.g., patterns or symbols including shading).

[0042] Figure 5AA parametrically plotted graph representing the acquired eddy current measurement signal 511A from a bolt hole inspection is shown, along with illustrative examples of alarm regions 509A, 509B, and 509C corresponding to different defect categories. Since these regions define areas in the impedance plane in this example, such regions represent combinations of phase and amplitude standards (e.g., range standards defining a combination of amplitude and phase ranges). For example, if the acquired eddy current measurement signal 511A enters alarm region 509A, it may indicate a scratch. If the acquired eddy current measurement signal 511A enters alarm region 509B (e.g., ...), it may indicate a scratch. Figure 5A As shown in the diagram, this may indicate fatigue cracks, and if the acquired eddy current measurement signal 511A enters alarm zone 509C, burrs may be present. Each of alarm zones 509A, 509B, and 509C can be assigned a different color or another attribute, allowing the user to visually indicate the classification of suspected defects using different colors or other display attributes such as different brightness or different visual patterns (e.g., shadows or symbols).

[0043] This defect classification using alarm zones 509A, 509B, and 509C can be visualized in a variety of different ways. For example, Figure 5B An illustrative example of the presentation is shown, illustrating the acquired eddy current measurement signal and how it can be used. Figure 5A The warning area is identified by a marker associated with the defect. This can generate, for example, a marker that looks like... Figure 5B The waterfall-like appearance shown in region 510A includes two defect markers 517A and 517B, which are shown as having defects associated with their entry points. Figure 5A The corresponding eddy trace in region 509B corresponds to the first attribute (e.g., red), and another defect marker 517C is shown as having a different second attribute (e.g., blue) because the corresponding eddy trace enters... Figure 5A Area 509A. Similarly, defect markings 517A, 517B, and 517C can be related to the above regarding... Figure 4B Similar discussions were superimposed on Figure 5B The shape of the measured object in region 510B is represented in a three-dimensional shape representation 559. Multiple attributes can be changed in the presentation in response to a combination of defect classification and other parameters, such as the amplitude of the acquired eddy current measurement signal. For example, color can be used to indicate the defect category, and the brightness (e.g., intensity) or color saturation in the presented markings can indicate the amplitude of the eddy current measurement signal. In the example, the user can adjust one or more of the phase, amplitude, or other criteria, or adjust the classification markings such as color or another attribute.

[0044] In the examples discussed above, the criteria used for defect classification can be related to specific measurement applications and material classifications (e.g., bolt hole inspection in ferrous materials). However, the visualization and defect classification techniques described herein are applicable to other eddy current inspection applications, such as low-frequency eddy current (LFEC) inspection and high-frequency eddy current (HFEC) inspection, such as those using individual EC sensors or eddy current array (ECA) probes. Figure 6 An illustrative example of a presentation chart is shown, illustrating the following: a band plot 310A representing the acquired eddy current measurement signal in region 610A, where an alarm threshold is defined by line 609A; an impedance plane 310B representing the acquired eddy current measurement signal in region 610B, where a defect criterion is defined by alarm region 609B; a C-scan representation shown in region 610C, where defects are categorized by markers 617A and 617B; and a line 621 indicating selected locations corresponding to the band plot representation in region 610A and the impedance plane representation in region 610B. As in the example above, multiple alarm regions can be defined to correspond to different defect categories, and the attributes (e.g., color) of the displayed markers 617A and 617B can be assigned based on defect classification.

[0045] Figure 7 The present invention generally illustrates a technique 700 such as a machine-implemented method, including generating a presentation for displaying to a user an indication of the amplitude or phase value of an eddy current measurement signal, the presentation including aligning markers of the amplitude or phase value with a shape representing the object under test. At 705, an eddy current excitation signal may be generated to, for example, excite a coil or other sensor of an inspection probe assembly. At 710, in response, an eddy current measurement signal may be received from the inspection probe assembly. As an illustrative (but not limiting) example, such a measurement signal may include a rectified signal or other signal representing the envelope of a received AC measurement signal, or other amplitude time series representing, for example, the original signal or the imaginary part of a complex-valued digitized signal. At 715, an amplitude or phase value (or both) associated with the eddy current signal may be determined. For example, as shown and described above, a series of corresponding values ​​may be represented as a time series or parametrically, for example, in an impedance plane. At 725, a presentation can be generated for display to the user, indicating the determined amplitude or phase value (or a series of such values). This presentation, for example, aligns markers of the amplitude or phase value (or a series of such values) with a shape representing the object under test, as discussed above. In this way, defect indications in the acquired eddy current signal can be visualized in a manner that indicates the location of the acquired signal, to help the user physically locate the defect. Optionally, at 730, visual attributes of the markers (e.g., hue, brightness, saturation) can be assigned based on the defect category, as discussed elsewhere in this document.

[0046] Figure 8 The present invention generally illustrates a technique 800 such as a machine-implemented method, including generating a presentation for displaying to a user an indication of amplitude or phase values ​​from an eddy current measurement signal, the presentation including assigning visual attributes of the displayed markers based on defect categories. At 805, an eddy current excitation signal may be generated to, for example, excite a coil or other sensor of an inspection probe assembly. At 810, in response, an eddy current measurement signal may be received from the inspection probe assembly. As an illustrative (but not limiting) example, such a measurement signal may include a rectified signal or other signal representing the envelope of a received AC measurement signal, or other amplitude time series representing, for example, the original signal or the imaginary part of a complex-valued digitized signal. At 815, an amplitude or phase value (or both) associated with the eddy current signal may be determined. For example, as shown and described above, a series of corresponding values ​​may be represented as a time series or parametrically, for example, in an impedance plane. At 830, visual attributes of the markers to be presented to the user may be assigned based on defect categories. For example, such defect classification can be based on the application of range criteria or other criteria to the acquired eddy current measurement signals as shown and described above (e.g., a sector alarm area or one or more numerical ranges defined by amplitude or phase values ​​or a combination of amplitude and phase values). At 825, optionally, the user can provide indications of criteria for defining the visual attributes used to assign markers based on a specified defect classification, or such definitions can be retrieved based on a specified or selected eddy current measurement application (e.g., bolt hole inspection versus other inspections) or the material being measured (e.g., ferrous versus non-ferrous materials).

[0047] Figure 9 A block diagram is shown illustrating an example of a machine 900 on which any or more of the techniques (e.g., methods) discussed herein can be performed. The machine 900 (e.g., a computer system) may include a hardware processor 902 (e.g., a central processing unit (CPU), graphics processing unit (GPU), hardware processor core, or any combination thereof), main memory 904, and static memory 906 connected via interconnection 930 (e.g., a link or bus), as some or all of these components may constitute the hardware for the system or related implementations discussed above.

[0048] Typically, the hardware processor 902 may include at least one of the following: a central processing unit (CPU), a reduced instruction set computing (RISC) processor, a complex instruction set computing (CISC) processor, a graphics processing unit (GPU), a digital signal processor (DSP), a tensor processing unit (TPU), a neural processing unit (NPU), a vision processing unit (VPU), a machine learning accelerator, an artificial intelligence accelerator, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a radio frequency integrated circuit (RFIC), a neuromorphic processor, a quantum processor, or any combination thereof. The processor circuitry may also be a multi-core processor having two or more independent processors (sometimes referred to as "cores") capable of executing instructions simultaneously. A multi-core processor contains multiple computational cores on a single integrated circuit die, each of which can independently execute program instructions in parallel. Parallel processing on a multi-core processor can be implemented via architectures such as superscalar, VLIW, vector processing, or SIMD that enable each core to run a separate instruction stream simultaneously. The processor circuitry can be simulated as a virtual processor or virtual circuit in software running on a physical processor. A virtual processor can behave like an independent processor, but the virtual processor is implemented in software rather than hardware.

[0049] Specific examples of main memory 904 include random access memory (RAM) and semiconductor memory devices such as registers that may include storage locations in semiconductors. Specific examples of static memory 906 include: non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; RAM; or optical media, such as CD-ROM and DVD-ROM discs.

[0050] Machine 900 may also include a display device 910, an input device 912 (e.g., a keyboard), and a user interface (UI) navigation device 914 (e.g., a mouse). In the example, the display device 910, input device 912, and UI navigation device 914 may be a touchscreen display. Machine 900 may include a mass storage device 908 (e.g., a drive unit), a signal generation device 918 (e.g., a speaker), a network interface device 920, and one or more sensors 916, such as a Global Positioning System (GPS) sensor, a compass, an accelerometer, or other sensors. Machine 900 may include an output controller 928, for example, serial (e.g., Universal Serial Bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connections, to communicate with or control one or more peripheral devices (e.g., a printer, a card reader, etc.).

[0051] Mass storage device 908 may include a machine-readable medium 922 on which one or more sets of data structures or instructions 924 (e.g., software) are stored, the data structures or instructions 924 implementing or being utilized by any one or more of the techniques or functions described herein. During execution of instructions 924 by machine 900, instructions 924 may also reside wholly or at least partially within main memory 904, static memory 906, or hardware processor 902. In this example, one or any combination of hardware processor 902, main memory 904, static memory 906, or mass storage device 908 includes a machine-readable medium.

[0052] Specific examples of machine-readable media include one or more of the following: non-volatile memory, such as semiconductor memory devices (e.g., EPROM or EEPROM) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; RAM; or optical media, such as CD-ROM and DVD-ROM discs. Although machine-readable media is shown as a single medium, the term "machine-readable medium" can include a single medium or multiple media configured to store one or more instructions 924 (e.g., a centralized or distributed database, or associated caches and servers).

[0053] The device of machine 900 includes one or more of the following: a hardware processor 902 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), main memory 904 and static memory 906, a sensor 916, a network interface device 920, an antenna, a display device 910, an input device 912, a UI navigation device 914, a mass storage device 908, an instruction set 924, a signal generation device 918, or an output controller 928. The device can be configured to perform one or more of the methods or operations disclosed herein.

[0054] The term "machine-readable medium" includes, for example, any medium capable of storing, encoding, or carrying instructions for use by machine 900 and to cause machine 900 to perform any one or more of the techniques of this disclosure, or to cause another device or system to perform any one or more of the techniques, or any medium capable of storing, encoding, or carrying data structures used by or associated with such instructions. Examples of non-limiting machine-readable media include solid-state memory, optical media, or magnetic media. Specific examples of machine-readable media include: non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; random access memory (RAM); or optical media, such as CD-ROM and DVD-ROM discs. In some examples, machine-readable media includes non-transitory machine-readable media. In some examples, machine-readable media includes machine-readable media that are not transiently propagating signals.

[0055] Commands 924 can be sent or received via a communication network 926 using a transmission medium via a network interface device 920, for example, using any of a variety of transport protocols (e.g., Frame Relay, Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Hypertext Transfer Protocol (HTTP), etc.). Example communication networks include Local Area Networks (LANs), Wide Area Networks (WANs), Packet Data Networks (e.g., the Internet), Mobile Phone Networks (e.g., Cellular Networks), Common Old-Style Telephone (POTS) Networks, and Wireless Data Networks (e.g., the IEEE 802.11 family of standards known as Wi-Fi®), the IEEE 802.15.4 family of standards, Long Term Evolution (LTE) 4G or 5G family of standards, Universal Mobile Telecommunications System (UMTS) family of standards, Peer-to-Peer (P2P) networks, satellite communication networks, etc.

[0056] In the example, network interface device 920 includes one or more physical jacks (e.g., Ethernet jacks, coaxial jacks, or other interconnect jacks) or one or more antennas for accessing communication network 926. In the example, network interface device 920 includes one or more antennas to perform wireless communication using at least one of single-input multiple-output (SIMO), multiple-input multiple-output (MIMO), or multiple-input single-output (MISO) technologies. In some examples, network interface device 920 uses multi-user MIMO technology for wireless communication. The term "transmission medium" should be considered to include any intangible medium capable of storing, encoding, or carrying instructions for execution by machine 900, and includes digital or analog communication signals or other intangible media to facilitate communication of such software.

[0057] Various annotations

[0058] Each of the above non-limiting aspects may exist independently or may be combined in various arrangements or combinations with one or more of the other aspects or other topics described in this document.

[0059] The above detailed description includes reference to the accompanying drawings, which form part of the detailed description. The drawings illustrate, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are generally also referred to as “examples.” Such examples may include elements other than those shown or described. However, the inventors also contemplate examples in which only those elements shown or described are provided. Furthermore, the inventors contemplate examples using any combination or arrangement of those elements (or one or more aspects of those elements) shown or described with respect to a particular example (or one or more aspects of that particular example) or with respect to other examples shown or described herein (or one or more aspects of other examples).

[0060] In the event of any inconsistency between the usage in this document and any other document incorporated by reference, the usage in this document shall prevail.

[0061] In this document, as is common in patent literature, the terms "a" or "an" are used to include one or more, regardless of any other instance or usage of "at least one" or "one or more". In this document, unless otherwise indicated, the term "or" is used to refer to a non-exclusive "or", such that "A or B" includes "A but not B", "B but not A", and "A and B". In this document, the terms "including" and "in which" are used as concise English equivalents to the corresponding terms "comprising" and "wherein". Furthermore, in the appended claims, the terms "including" and "comprising" are open-ended, meaning that a system, apparatus, article, composition, formulation, or process that includes elements other than those listed after such terms in the claims is still considered to fall within the scope of the claims. Additionally, in the appended claims, the terms "first", "second", and "third", etc., are used only as designations and are not intended to impose numerical requirements on their objects.

[0062] The method examples described herein may be implemented, at least in part, by a machine or computer. Some examples may include computer-readable or machine-readable media encoded with instructions operable to configure an electronic device to perform methods as described in the examples above. Implementations of such methods may include code, such as microcode, assembly language code, higher-level language code, etc. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. For example, such instructions may be read and executed by one or more processors to enable the performance of operations including the methods. The instructions may be in any suitable form, such as, but not limited to, source code, compiled code, interpreted code, executable code, static code, dynamic code, etc. Furthermore, in the examples, the code may be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, for example, during execution or at other times. Examples of such tangible computer-readable media may include, but are not limited to, hard disks, removable disks, removable optical discs (e.g., compact discs and digital video discs), magnetic tape cartridges, memory cards or memory sticks, random access memory (RAM), read-only memory (ROM), etc.

[0063] The above description is intended to be illustrative and not restrictive. For example, the above examples (or one or more aspects thereof) may be used in combination with each other. For example, other embodiments may be used by those skilled in the art after consulting the above description. An abstract is provided to enable the reader to quickly determine the nature of the technical disclosure. The abstract is submitted on the understanding that it is not intended to interpret or limit the scope or meaning of the claims. Furthermore, in the detailed embodiments above, various features may be combined to simplify the disclosure. This should not be construed as meaning that any unclaimed disclosed feature is necessary for any claim. Rather, the subject matter of the invention may lie in fewer than all features of a particular disclosed embodiment. Therefore, the appended claims are incorporated herein by way of example or embodiment, wherein each claim exists independently as a separate embodiment, and it is contemplated that such embodiments may be combined with each other in various combinations or arrangements. The scope of the invention should be determined by reference to the appended claims and the full scope of the equivalents to which such claims are entitled.

Claims

1. A machine-implemented method, comprising: Generating eddy current excitation signals to excite the sensors of the inspection probe assembly; Receive eddy current measurement signals from the inspection probe assembly; Determine at least one of the amplitude or phase values ​​associated with the eddy current measurement signal; as well as Generate a presentation for display indicating the amplitude value or the phase value, the presentation including aligning a marker of the amplitude value or the phase value with a shape representing the object under test, the marker corresponding to the location on or within the shape where the eddy current measurement signal is obtained.

2. The machine-implemented method of claim 1, comprising assigning visual attributes of the marker based on a defect category.

3. The machine-implemented method of claim 2, comprising receiving from a user an instruction defining criteria for assigning the visual attributes.

4. The machine-implemented method according to claim 3, wherein, The criteria used to assign the visual attributes include range criteria.

5. The machine-implemented method according to any one of claims 3 or 4, wherein, The standard is indicated or defined graphically.

6. The machine-implemented method according to claim 5, wherein, The standard is graphically indicated or defined on a coordinate system having a real part and an imaginary part corresponding to the impedance plane diagram of the eddy current measurement signal.

7. The machine-implemented method according to any one of claims 4 to 6, wherein, The range criteria are among the different corresponding criteria for different defect categories.

8. The machine-implemented method according to any one of claims 2 to 7, wherein, The visual attributes include at least one of brightness, hue, saturation, or pattern corresponding to the respective defect category.

9. The machine-implemented method according to any one of claims 1 to 8, wherein, The presentation includes a two-dimensional presentation containing a circular shape; and The series of markers indicates amplitude or phase values ​​at different angular positions around the circular shape, and the series of markers corresponds to the eddy current measurement signals obtained at the different angular positions.

10. The machine-implemented method according to any one of claims 1 to 8, wherein, The presentation includes a three-dimensional presentation containing cylindrical shapes; The series of markers indicates amplitude or phase values ​​at different angles and axial positions around the cylindrical shape, and the series of markers corresponds to the eddy current measurement signals obtained at the different angles and axial positions.

11. The machine-implemented method according to claim 10, wherein, The series of values ​​corresponds to at least one axial position measured by the encoder.

12. The machine-implemented method according to any one of claims 9 to 11, wherein, The series of markers, in combination with amplitude or phase values, indicate the angular position of the scanner body or other parts of the inspection probe assembly.

13. The machine-implemented method according to any one of claims 9 to 12, wherein, The series of markers includes the amplitude of the imaginary signal component from the complex-valued eddy current measurement signal; and Among them, the different angular positions around the circumference of the circular or cylindrical shape include the different angular positions of the bolt holes defined by the object being measured.

14. A machine-implemented method, comprising: Generating eddy current excitation signals to excite the sensors of the inspection probe assembly; Receive eddy current measurement signals from the inspection probe assembly; Determine at least one of the amplitude or phase values ​​associated with the eddy current measurement signal; as well as Generate a presentation for display that indicates the amplitude value or the phase value, the presentation including visual attributes that assign markers to the amplitude value or the phase value based on the defect category; The visual attributes include at least one of brightness, hue, saturation, or pattern corresponding to the corresponding defect category.

15. The machine-implemented method of claim 14, comprising receiving from a user an instruction defining criteria for assigning the visual attributes.

16. The machine-implemented method according to claim 15, wherein, The criteria used to assign the visual attributes include range criteria.

17. The machine-implemented method according to any one of claims 15 to 16, wherein, The standard is indicated or defined graphically.

18. The machine-implemented method according to claim 17, wherein, The standard is graphically indicated or defined on a coordinate system having a real part and an imaginary part corresponding to the impedance plane diagram of the eddy current measurement signal.

19. The machine-implemented method according to any one of claims 16 to 18, wherein, The standard is found among different corresponding standards for different defect categories.

20. A system comprising: The transmitter circuit is used to generate an eddy current excitation signal to excite the sensor of the inspection probe assembly; A receiver circuit for receiving eddy current measurement signals from the inspection probe assembly; Processor circuitry; as well as A memory circuit coupled to the processor circuit; The memory circuitry includes instructions that, when executed by the processor circuitry, cause the system to perform a machine-implemented method according to any one of claims 1 to 19.

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