Amino acid modified hexagonal boron nitride / epoxy resin heat-conducting anticorrosive paint and preparation method thereof

Abstract

The invention discloses an amino acid modified hexagonal boron nitride / epoxy resin heat-conducting anticorrosive coating and a preparation method thereof. The heat-conducting anticorrosive coating comprises the following components in parts by mass: 5-50 parts of amino acid modified hexagonal boron nitride, 30-70 parts of epoxy resin, 5-15 parts of a diluent and 5-15 parts of a curing agent. The hexagonal boron nitride is subjected to surface functionalization modification through amino acid, the interface bonding force between h-BN particles and a polymer matrix is effectively improved, heat is promoted to be rapidly transferred along a filler network, and the hexagonal boron nitride subjected to surface functionalization treatment is combined with epoxy resin to prepare the composite heat-conducting anticorrosive coating. The amino acid modified hexagonal boron nitride and the epoxy resin have a synergistic effect, so that the obtained heat-conducting anticorrosive coating is endowed with excellent heat-conducting efficiency and anticorrosive protection capability.

Description

Technical Field

[0001] This invention relates to the field of coating technology, and in particular to an amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating and its preparation method. Background Technology

[0002] With continuous technological advancements and sustained growth in industrial demands, materials are facing increasingly stringent requirements. Especially in fields such as electronic equipment, aerospace, and automotive manufacturing, materials not only need excellent thermal conductivity to ensure efficient heat dissipation but also superior corrosion resistance to extend their service life. Traditional single materials often struggle to achieve both of these properties simultaneously. Therefore, developing novel composite materials that combine thermal conductivity and corrosion resistance has become an effective way to address this challenge.

[0003] Epoxy resin, as an important type of polymer material, has broad application prospects in the coatings field. This material combines excellent mechanical strength, superior adhesion, and good chemical corrosion resistance, making epoxy resin coatings outstanding in terms of protective performance. However, the low thermal conductivity of epoxy resin itself limits its use in certain applications with high thermal management requirements, making it difficult to meet the practical needs of efficient heat dissipation.

[0004] Hexagonal boron nitride (h-BN), as a typical two-dimensional material, has attracted widespread attention due to its unique structural properties. It possesses a graphene-like layered structure with a regular atomic arrangement, giving it excellent electrical insulation, chemical stability, and high thermal conductivity. However, h-BN exhibits poor compatibility with polymer matrices in its pristine state, with limited interfacial bonding capabilities, which to some extent restricts its performance and practical applications in composite materials.

[0005] Patent CN202211252360.1 discloses a friction-modified epoxy resin composite material. It uses polysulfonated dopamine to encapsulate hexagonal boron nitride (h-BN) as a friction modifier, improving the dispersibility and interfacial compatibility of h-BN in epoxy resin. Simultaneously, it constructs a lubricant containing carbon dot-based nanoparticles, synergistically enhancing tribological properties with the modified h-BN. The advantages of this patent are that polysulfonated dopamine modification effectively solves the h-BN agglomeration problem, improving the dispersion stability of the composite material; the carbon dot-based nanofluid synergistically reduces the coefficient of friction and enhances lubrication; and the preparation process is mild and environmentally friendly. However, the disadvantages of this patent are that the amount of friction modifier added needs to be strictly controlled (0.1-0.8%), as excessive amounts may affect the mechanical properties of the composite material; the preparation steps of the carbon dot-based nanoparticles are relatively complicated, dependent on specific equipment, and costly.

[0006] Patent CN202411099608.4 provides a thermally conductive and insulating coating that uses amino acid-modified hexagonal boron nitride nanosheets combined with nano-alumina to construct a thermally conductive network, achieving both high thermal conductivity and insulation, suitable for circuit board heat dissipation. The advantages of this patent are: amino acid modification improves the dispersibility of h-BN in the resin; the synergistic filling of flake-like h-BN and granular alumina results in high thermal conductivity; excellent insulation (breakdown voltage > 25kV / mm); and a simple, environmentally friendly production process with no pollutant emissions. However, the disadvantages of this patent are: the modification process requires concentrated sulfuric acid, posing a risk of corrosion; the addition of nano-alumina may increase the coating viscosity, affecting coating performance; and filler sedimentation may occur during long-term use, requiring optimization of the stabilizer formulation.

[0007] In summary, while epoxy resins offer excellent corrosion resistance, their thermal conductivity is insufficient, and h-BN exhibits good thermal conductivity and insulation but suffers from poor compatibility with the matrix. Existing solutions suffer from drawbacks such as limited functionality (e.g., emphasizing tribological properties or thermal conductivity and insulation while neglecting corrosion resistance), flawed modification processes (e.g., using corrosive reagents or involving cumbersome procedures), and insufficient performance balance (e.g., limited filler addition and potential impact on coating application). These limitations make it difficult to meet the practical needs of electronic equipment, aerospace, and other fields requiring synergistic improvements in both thermal conductivity and corrosion resistance. Summary of the Invention

[0008] Based on the shortcomings of the existing technology, the purpose of this application is to provide an amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating and its preparation method. The aim is to solve the problems of low thermal conductivity and poor corrosion resistance caused by the easy agglomeration of h-BN particles and poor interfacial compatibility with epoxy resin in the existing technology. By mildly modifying h-BN with amino acids to improve its compatibility with epoxy resin, the high thermal conductivity of h-BN is utilized to enhance the coating's heat dissipation capacity, while retaining the excellent corrosion resistance of epoxy resin. This eliminates the need for additional functional fillers, simplifying the process and achieving dual optimization of thermal conductivity and anti-corrosion performance.

[0009] To achieve the above objectives, the present invention adopts the following technical solution: One of the technical solutions of the present invention provides an amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating, comprising the following components in parts by weight: 5-50 parts of amino acid-modified hexagonal boron nitride, 30-70 parts of epoxy resin, 5-15 parts of diluent, and 5-15 parts of curing agent.

[0010] Preferably, the amino acid-modified hexagonal boron nitride is prepared from hexagonal boron nitride and amino acids as raw materials.

[0011] More preferably, the amino acid is at least one of L-alanine, L-tyrosine, or L-phenylalanine; even more preferably, it is L-alanine or L-tyrosine.

[0012] More preferably, the particle size of the hexagonal boron nitride is 0.5~50μm, more preferably 1~20μm, more preferably 5~15μm, and even more preferably 9~11μm.

[0013] Preferably, the epoxy resin is at least one selected from bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenolic epoxy resin, alicyclic epoxy resin, and glycidyl ester epoxy resin. More preferably, it is a bisphenol A type epoxy resin or a bisphenol F type epoxy resin.

[0014] Preferably, the diluent is at least one selected from ethyl acetate, butyl acetate, propylene glycol methyl ether acetate, and dipropylene glycol methyl ether acetate. More preferably, it is ethyl acetate or butyl acetate.

[0015] Preferably, the curing agent is at least one selected from ethylenediamine, diethylenetriamine, triethylenetetramine, and isophorone diamine. More preferably, it is diethylenetriamine or triethylenetetramine.

[0016] Preferably, the mass fraction of the amino acid-modified hexagonal boron nitride in this invention is 15-45 parts, more preferably 22-38 parts, and even more preferably 29-31 parts; the mass fraction of the epoxy resin is preferably 40-60 parts, more preferably 45-55 parts, and even more preferably 49-51 parts; the mass fraction of the diluent is preferably 7-13 parts, more preferably 9-11 parts; and the mass fraction of the curing agent is preferably 7-13 parts, and even more preferably 9-11 parts.

[0017] The second technical solution of the present invention provides a method for preparing an amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating, comprising the following steps: thoroughly mixing amino acid-modified hexagonal boron nitride, epoxy resin, diluent and curing agent to obtain a thermally conductive and anti-corrosion coating.

[0018] Preferably, the preparation method of the amino acid modified hexagonal boron nitride includes the following steps: dissolving amino acids in an alkaline solution by stirring to obtain a dispersion, adding hexagonal boron nitride to the obtained dispersion, reacting, and then vacuum filtering and drying to obtain amino acid modified hexagonal boron nitride.

[0019] More preferably, the alkaline solution is an aqueous sodium hydroxide solution; the mass ratio of hexagonal boron nitride to sodium hydroxide solute in the aqueous sodium hydroxide solution is 4:(1~6), more preferably 4:(2~5), and even more preferably 4:(3~4). The concentration of the aqueous sodium hydroxide solution is 5-15 g / L, more preferably 8 g / L.

[0020] More preferably, the reaction temperature during the preparation process is 40~80℃, more preferably 50~70℃, more preferably 55~65℃, and even more preferably 59~61℃. The reaction time is 6~18h, more preferably 10~12h.

[0021] Preferably, the mixing order is as follows: first, the epoxy resin and diluent are thoroughly mixed; then, amino acid-modified hexagonal boron nitride is added and stirred until evenly dispersed; finally, the curing agent is added.

[0022] The third technical solution of this invention provides an application of the aforementioned amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating. This coating is used to coat substrates requiring both high-efficiency heat dissipation and corrosion resistance. The substrates include, but are not limited to: electronic device housings, aerospace structural components, automotive engine parts, marine engineering steel structures, and the surfaces of chemical equipment.

[0023] Compared with the prior art, this application has at least the following improvements and beneficial effects: (1) Significantly improves thermal conductivity to meet the requirements of high-efficiency heat dissipation. The polar groups such as hydroxyl and carboxyl groups in amino acid molecules (such as L-tyrosine) form chemical bonds or hydrogen bonds with the functional groups on the surface of hexagonal boron nitride (h-BN) and epoxy resin, effectively breaking the aggregation tendency of h-BN, so that it is uniformly dispersed in the matrix and constructs a continuous heat-conducting network. This can efficiently dissipate the heat generated by electronic devices, engine parts, etc., and avoid performance degradation caused by overheating.

[0024] (2) Enhance corrosion resistance and extend the service life of the substrate. The uniform dispersion of modified h-BN can fill the micropores in the epoxy resin matrix, forming a physical barrier to prevent the penetration of corrosive media such as chloride ions. At the same time, the strong interfacial bonding between the amino acid modified layer and the epoxy resin improves the integrity and adhesion of the coating, significantly enhancing corrosion resistance, making it particularly suitable for highly corrosive environments such as marine engineering and chemical equipment.

[0025] (3) Achieve synergistic optimization of "thermal conduction and corrosion prevention" and expand application scenarios. By adjusting the amount of modified h-BN added, the thermal conductivity can be flexibly adjusted while ensuring corrosion resistance. This perfectly adapts to scenarios such as electronic device housings and aerospace structural components that require both heat dissipation and corrosion resistance, solving the technical pain point that traditional materials cannot achieve both simultaneously.

[0026] (4) It simplifies the process and has excellent compatibility, with the potential for large-scale application. The amino acid modification process is mild (reaction at 40-80℃, requiring no strong acid or complex equipment), and the modified h-BN exhibits good compatibility with epoxy resins, diluents (such as ethyl acetate), and curing agents (such as triethylenetetramine). Coatings can be prepared through simple stirring and mixing, resulting in high production efficiency and low cost. Furthermore, the coatings exhibit excellent coatability, and the cured coating is uniform and stable, making it suitable for large-scale industrial application.

[0027] In summary, this invention utilizes an amino acid modification strategy to surface functionalize hexagonal boron nitride (h-BN), successfully achieving interfacial synergy between h-BN and epoxy resin. This effectively improves the interfacial compatibility between h-BN particles and epoxy resin, promotes rapid heat conduction within the filler network, and enhances corrosion protection while improving thermal conductivity. This provides a novel material solution for high-end equipment manufacturing, new energy, and other fields, offering both efficient heat dissipation and long-term protection. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0029] Figure 1 The image shows the surface SEM morphology of the thermally conductive and anti-corrosion coating obtained in Example 1 after coating. Figure 2 The image shows the surface SEM morphology of the coating obtained in Comparative Example 1. Detailed Implementation

[0030] To enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be described in detail below with reference to specific embodiments. It should be noted that the following embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any way. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0031] Unless otherwise specified, the source of all raw materials used in this invention is not particularly limited; they can be purchased commercially or prepared using conventional methods well known to those skilled in the art. Purchase information for the materials used is as follows: Reagents: Hexagonal boron nitride, industrial grade, Liaoning Dandong Rijin Technology Co., Ltd.; Amino acids, analytical grade, Shanghai Aladdin Biochemical Technology Co., Ltd.; Epoxy resin, industrial grade, Jiangsu Wuxi Xihua Chemical Technology Co., Ltd.; Diluent, analytical grade, Shanghai Aladdin Biochemical Technology Co., Ltd.; Curing agent, analytical grade, Shanghai Aladdin Biochemical Technology Co., Ltd.; Sodium hydroxide, analytical grade, Shanghai Aladdin Biochemical Technology Co., Ltd.

[0032] equipment: Analytical balance, AL204-IC, Shanghai Mettler Toledo Instruments Co., Ltd.; Electric thermostatic water bath, ZNCL-GS, Shanghai Hongyi Instruments Co., Ltd.; Ultrasonic cleaner, KQ-300E, Shanghai Chuding Analytical Instruments Co., Ltd.; Planetary mixer / dispersant, KK-250S, KURABO Co., Ltd., Japan; Circulating water vacuum pump, SN-SHZ-D, Shanghai Shangpu Instrument Equipment Co., Ltd.; Electric blast drying oven, HP-3030, Shanghai Jinghong Experimental Equipment Co., Ltd.

[0033] Example 1 Preparation of amino acid-modified hexagonal boron nitride: 0.8 g of sodium hydroxide and L-tyrosine were added to 100 mL of deionized water. The mixture was then stirred and dispersed at 800 rpm in a 60 °C water bath to promote the dissolution of L-tyrosine. 3 g of hexagonal boron nitride was then slowly added to the solution, and stirring was continued for 12 h to ensure complete dispersion of h-BN. Finally, the above mixed solution was vacuum filtered and dried in a 90 °C oven for 12 h to obtain amino acid-modified hexagonal boron nitride.

[0034] Preparation of thermally conductive and anti-corrosion coating: 12g of bisphenol A type epoxy resin and 3g of ethyl acetate were mixed evenly, then 3g of amino acid modified hexagonal boron nitride was added and stirred thoroughly, and finally 3g of triethylenetetramine was added and mixed evenly to obtain the thermally conductive and anti-corrosion coating.

[0035] Example 2 The preparation steps for amino acid-modified hexagonal boron nitride are the same as in Example 1; Preparation of thermally conductive and anti-corrosion coating: 12g of bisphenol A type epoxy resin and 3g of ethyl acetate were mixed evenly, then 5g of amino acid modified hexagonal boron nitride was added and stirred thoroughly, and finally 3g of triethylenetetramine was added and mixed evenly to obtain the thermally conductive and anti-corrosion coating.

[0036] Example 3 The preparation steps for amino acid-modified hexagonal boron nitride are the same as in Example 1; Preparation of thermally conductive and anti-corrosion coating: 12g of bisphenol A type epoxy resin and 3g of ethyl acetate were mixed evenly, then 8g of amino acid modified hexagonal boron nitride was added and stirred thoroughly, and finally 3g of triethylenetetramine was added and mixed evenly to obtain the thermally conductive and anti-corrosion coating.

[0037] Example 4 The preparation steps for amino acid-modified hexagonal boron nitride are the same as in Example 1; Preparation of thermally conductive and anti-corrosion coating: 12g of bisphenol A type epoxy resin and 3g of ethyl acetate were mixed evenly, then 1g of amino acid modified hexagonal boron nitride was added and stirred thoroughly, and finally 3g of triethylenetetramine was added and mixed evenly to obtain the thermally conductive and anti-corrosion coating.

[0038] Comparative Example 1 Compared with Example 1, the addition of amino acid-modified hexagonal boron nitride is omitted, and the other steps are the same as in Example 1.

[0039] Comparative Example 2 Compared with Example 1, "amino acid modified hexagonal boron nitride" was replaced with "hexagonal boron nitride", and the other steps were the same as in Example 1.

[0040] The performance of the thermally conductive and anti-corrosion coatings obtained in Examples 1-4 and the coatings obtained in Comparative Examples 1-2 was tested: The thermally conductive and anti-corrosion coatings obtained in Example 1 and Comparative Example 1 were respectively coated on the surface of carbon steel with a coating thickness of 80 μm. After coating, the coatings were pre-cured at room temperature for 5 h, and then dried at a drying temperature of 60 °C for 3 h to complete the curing. The SEM morphology of the resulting coatings was observed.

[0041] The SEM image of the thermally conductive and anti-corrosion coating obtained in Example 1 is shown below. Figure 1 As shown, the SEM morphology of the coating obtained in Comparative Example 1 is as follows. Figure 2 As shown. By Figure 1 and Figure 2 As can be seen, the surface of the coating obtained in Comparative Example 1 is dense and smooth, while the surface of the coating obtained in Example 1 is relatively rough (a rougher coating indicates a better effect), proving that the amino acid-modified hexagonal boron nitride and epoxy resin were effectively combined in the coating obtained in Example 1.

[0042] The thermally conductive and anti-corrosion coatings obtained in Examples 1-3 and the coatings obtained in Comparative Examples 1-3 were subjected to thermal conductivity tests and neutral salt spray resistance tests. The thermal conductivity was tested according to GB / T 25261-2018 "Reflective Thermal Insulation Coatings for Buildings", and the neutral salt spray resistance was tested according to GB / T 1771-2007 "Determination of Neutral Salt Spray Resistance of Paints and Varnishes". The test results are shown in Table 1.

[0043] Table 1. Performance test results of the thermally conductive and anti-corrosion coatings obtained in Examples 1-4 and the coatings obtained in Comparative Examples 1-2. As shown in Table 1, the thermally conductive and anti-corrosion coatings obtained in Examples 1 and 2 exhibit excellent thermal conductivity and salt spray resistance. The amount of amino acid-modified hexagonal boron nitride (h-BN) added and the modification treatment significantly affect the thermal conductivity and neutral salt spray resistance of the thermally conductive and anti-corrosion coatings.

[0044] Compared to Comparative Example 1 (without h-BN), Example 1 exhibits a significantly higher thermal conductivity (0.87 W / (m·K)) than Comparative Example 1 (0.19 W / (m·K)). This indicates that the addition of amino acid-modified h-BN is crucial for improving the thermal conductivity of the coating. The polar groups (such as hydroxyl and carboxyl groups) in the amino acid molecules can form chemical bonds or hydrogen bonds with the functional groups on the h-BN surface and the epoxy resin, effectively improving the dispersibility of h-BN in the epoxy resin matrix. This allows h-BN to form a continuous thermal conductivity path, significantly enhancing the thermal conductivity of the composite material. Furthermore, Example 1's neutral salt spray resistance time (2400 h) is significantly better than Comparative Example 1 (360 h). Combined with SEM morphology, it is evident that the effective composite of modified h-BN and epoxy resin (rough surface) alters the coating's density, enhancing corrosion resistance through interfacial interactions. Compared with Comparative Example 2 (unmodified h-BN), Example 1 showed better thermal conductivity (0.87 W / (m·K)) and salt spray resistance time (2400 h) than Comparative Example 2 (0.45 W / (m·K), 720 h), demonstrating that L-tyrosine modification can improve the compatibility of h-BN with epoxy resin, reduce interfacial defects, enhance the continuity of thermal conductivity pathways, and strengthen the barrier effect of the coating, highlighting the technical value of the modification treatment.

[0045] In Examples 1-4, the thermal conductivity increased with the increase of amino acid-modified hexagonal boron nitride, indicating that the increase of the addition amount can promote the formation of the thermally conductive network, reflecting the positive correlation between dosage and thermal conductivity. The salt spray resistance time of Examples 1 (3g) and 2 (5g) was 2400h, which is the best performance, indicating that when the addition is moderate, the modified h-BN is uniformly dispersed and forms a stable composite structure with the resin, resulting in the strongest barrier effect. The salt spray resistance time of Example 3 (8g) dropped sharply to 240h, which is speculated to be due to excessive h-BN leading to agglomeration, destroying the continuity of the coating and forming channels for the corrosive medium to penetrate. The salt spray resistance time of Example 4 (1g) was 1200h, which is better than the comparative example, but the barrier effect was weaker than that of Examples 1-2 due to insufficient filler.

[0046] In summary, this invention solves the problem of balancing thermal conductivity and corrosion resistance in traditional fillers by precisely controlling the amino acid-modified h-BN, providing a clear direction for the design of high-performance thermally conductive and corrosion-resistant coatings.

[0047] The above description of the embodiments is provided to enable those skilled in the art to understand and use the invention. It will be apparent to those skilled in the art that various modifications can be made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present invention is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the invention should be within the protection scope of the present invention.

Claims

1. An amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating, characterized in that, The components include the following parts by mass: 5-50 parts of amino acid-modified hexagonal boron nitride, 30-70 parts of epoxy resin, 5-15 parts of diluent, and 5-15 parts of curing agent; The amino acid-modified hexagonal boron nitride is prepared from hexagonal boron nitride and amino acids as raw materials.

2. The amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating according to claim 1, characterized in that, The amino acid is at least one of L-alanine, L-tyrosine, and L-phenylalanine.

3. The amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating according to claim 1, characterized in that, The particle size of the hexagonal boron nitride is 0.5~50μm.

4. The amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating according to claim 1, characterized in that, The epoxy resin is at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenolic type epoxy resin, alicyclic epoxy resin and glycidyl ester epoxy resin.

5. The amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating according to claim 1, characterized in that, The diluent is at least one of ethyl acetate, butyl acetate, propylene glycol methyl ether acetate, and dipropylene glycol methyl ether acetate.

6. The amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating according to claim 1, characterized in that, The curing agent is at least one of ethylenediamine, diethylenetriamine, triethylenetetramine, and isophoronediamine.

7. A method for preparing an amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating as described in any one of claims 1-6, characterized in that, The process includes the following steps: thoroughly mixing amino acid-modified hexagonal boron nitride, epoxy resin, diluent, and curing agent to obtain a thermally conductive and corrosion-resistant coating.

8. The preparation method of the amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating according to claim 7, characterized in that, The preparation of the amino acid-modified hexagonal boron nitride includes the following steps: Amino acids were dissolved in an alkaline solution by stirring to obtain a dispersion. Hexagonal boron nitride was added to the dispersion, and after the reaction, the mixture was vacuum filtered and dried to obtain amino acid-modified hexagonal boron nitride.

9. The preparation method of an amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating according to claim 7, characterized in that, The alkaline solution is an aqueous sodium hydroxide solution; the mass ratio of hexagonal boron nitride to sodium hydroxide solute in the aqueous sodium hydroxide solution is 4:(1~6); the reaction temperature is 40~80℃, and the reaction time is 6~18h.

10. The application of an amino acid-modified hexagonal boron nitride / epoxy resin thermally conductive and anti-corrosion coating as described in any one of claims 1-6, characterized in that, The coating is used to coat a substrate that requires both high-efficiency heat dissipation and corrosion resistance; the substrate includes any one of the following: electronic device housings, aerospace structural components, automotive engine parts, marine engineering steel structures, or chemical equipment.

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