Minimally invasive dilation and drainage kit

Abstract

This application relates to the field of medical device technology, and in particular to a minimally invasive dilation and drainage kit, comprising a sheath body and a dilator. The dilator is fixedly and detachably assembled to the end of the sheath body. An annular groove is provided on the outer peripheral wall of the end of the sheath body near the dilator. A hemostatic ring assembly and a cooling ring assembly are disposed within the annular groove. Both the hemostatic ring assembly and the cooling ring assembly are connected to the control part of a minimally invasive surgical device via wires. The wires are either attached to the outer peripheral wall of the sheath body or pre-embedded inside the sheath body. When energized, the hemostatic ring assembly heats up to warm the bleeding point on the blood vessel wall and promote scab formation. When energized, the cooling ring assembly cools down to cool the bleeding point on the blood vessel wall. This minimally invasive dilation and drainage kit not only conceals the hemostatic ring assembly and the cooling ring assembly within the annular groove, but also integrates the sheath with dual functions of hemostasis and cooling, greatly reducing the frequency of using coagulation forceps and alleviating patient suffering.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and in particular to a minimally invasive dilation and drainage kit. Background Technology

[0002] Current disposable minimally invasive dilation and drainage kits typically include a dilator, sheath, renal puncture guidewire, percutaneous renal puncture needle, and nephrostomy tube. They are suitable for clinical percutaneous renal puncture. The procedure is as follows: under ultrasound guidance, the renal puncture needle is used for puncture; after urine flows from the puncture needle, the renal puncture guidewire or zebra guidewire is left in place, and the puncture needle is withdrawn; under the guidance of the guidewire, different sizes of dilators are used to gradually dilate the soft tissue channel from the skin puncture point to the lesion area, from small to large; after dilation to the predetermined size, the sheath is left in place to establish a channel to the renal cavity.

[0003] For example, U.S. Patent Publication No. US20180317995A1 discloses a system including a renal sheath, one or more electrode pairs in the renal sheath, and a wiring system configured to connect the one or more electrode pairs to an electric current. The one or more electrode pairs can be configured to generate heat sufficient to induce hemostasis in bleeding tissue around the renal sheath, and the wiring system can be configured to connect the one or more electrode pairs to an electric current to generate heat sufficient to achieve hemostasis.

[0004] Regarding the aforementioned technologies, the inventors believe that the following defects exist:

[0005] In percutaneous nephrectomy using a common sheath, although electrodes can be used to heat the bleeding points of the blood vessels to achieve a certain degree of scab formation, this crude method of heating and scab formation causes significant stimulation to the blood vessels and nerves, easily leading to severe pain and even large edema, resulting in a poor surgical experience for the patient. Summary of the Invention

[0006] This application provides a minimally invasive expansion and drainage kit to improve the following technical problems:

[0007] In percutaneous nephrectomy using a common sheath, although electrodes can be used to heat the bleeding points of the blood vessels to achieve a certain degree of scab formation, this crude method of heating and scab formation causes significant stimulation to the blood vessels and nerves, easily leading to severe pain and even large edema, resulting in a poor surgical experience for the patient.

[0008] This application provides a minimally invasive expansion and drainage kit, which adopts the following technical solution:

[0009] A minimally invasive dilation and drainage kit includes a sheath body and a dilator. The dilator is fixedly and detachably mounted to the end of the sheath body. An annular groove is provided on the outer peripheral wall of the end of the sheath body near the dilator. A hemostatic ring group and a cooling ring group are arranged in the annular groove. Both the hemostatic ring group and the cooling ring group are connected to the control part of the minimally invasive surgical device via wires. The wires are attached to the outer peripheral wall of the sheath body or pre-embedded inside the sheath body. When the hemostatic ring group is energized, it heats up to warm the bleeding point of the blood vessel wall and promote scab formation. When the cooling ring group is energized, it cools down to cool the bleeding point of the blood vessel wall.

[0010] In one feasible technical solution of this application, the cooling ring group includes two semiconductor cooling rings, one of which is located at the front end of the hemostasis ring group and there is a first gap between them, and the other of which is located at the rear end of the hemostasis ring group and there is a second gap between them, and the cold end of the semiconductor cooling ring is located on the outer peripheral sidewall.

[0011] In one feasible technical solution of this application, the semiconductor cooling ring includes an outer ceramic ring plate, an inner ceramic ring plate, and multiple sets of N-type elements and P-type elements. When the N-type elements and the P-type elements are connected to form an electrical couple, after the circuit is energized, the current flows from the N-type elements to the junction of the P-type elements to absorb heat and become a cold end. The multiple sets of N-type elements and P-type elements are sandwiched between the outer ceramic ring plate and the inner ceramic ring plate.

[0012] In one feasible technical solution of this application, the width of the semiconductor cooling ring is between 2.5 and 4.5 mm, and the outer peripheral wall of the semiconductor cooling ring is flush with the outer peripheral wall of the sheath body.

[0013] In one feasible technical solution of this application, a plurality of hemispherical protrusions are provided on the outer peripheral wall of the inner ceramic ring plate.

[0014] In one feasible technical solution of this application, the hemostatic ring assembly includes two electrode rings with a third gap between them. After being energized, a high-frequency current flows between the two electrode rings, and the thermal effect of the high-frequency current causes the blood vessel wall to dehydrate and shrink, and the blood in the blood vessel to coagulate, so as to achieve the purpose of scab formation and hemostasis.

[0015] In one feasible technical solution of this application, the width of the electrode ring is between 0.8 and 3.0 mm, and the outer peripheral wall of the electrode ring is flush with the outer peripheral wall of the sheath body.

[0016] In one feasible technical solution of this application, the wires are four in number and the main body of each wire is pre-embedded and fixed inside the sheath body. The four wires are located on the four sides of the sheath body. Two of the wires are used to connect to the hemostatic ring group, and the other two wires are used to connect to the cooling ring group. The welding ends of the wires extend out from the annular groove. The welding points formed by the connection of the four wires with the hemostatic ring group or the cooling ring group are located inside the annular groove.

[0017] In one feasible technical solution of this application, the sheath body is made of polytetrafluoroethylene or Pebax-nylon composite material.

[0018] In one feasible technical solution of this application, a hydrophilic coating with a thickness of 5-10 μm is provided on the outer peripheral wall of the sheath body.

[0019] In summary, this application includes at least one of the following beneficial technical effects:

[0020] Before the hemostasis ring group is energized for heating and scab formation, the cooling ring group can be energized to cool the area near the bleeding point on the blood vessel wall, reducing the sensitivity of nerves near the bleeding point and having a certain sedative effect. After the hemostasis ring group is energized for heating and scab formation, the cooling ring group can be energized to cool the area near the scab again, reducing stimulation and pain, effectively preventing large edema, and improving the patient's surgical experience.

[0021] When the hemostatic ring is energized, it can cause the blood vessels to scab, thereby achieving hemostasis and making hemostasis simpler. When the cooling ring is energized, it can significantly reduce the patient's pain. The hemostatic ring and cooling ring are not only housed in the annular groove, but the sheath also integrates the dual functions of hemostasis and cooling. When used together, they can shorten the operation time and eliminate the need for repeated use of coagulation forceps, greatly reducing the frequency of coagulation forceps use and alleviating the patient's pain. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of the minimally invasive expansion and drainage kit according to an embodiment of this application.

[0024] Figure 2 yes Figure 1 Enlarged view of point A in the middle.

[0025] Figure 3 This is a schematic diagram of the internal structure of the semiconductor cooling ring in an embodiment of this application.

[0026] Figure 4 This is a cross-sectional structural diagram of the sheath body in an embodiment of this application.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Sheath body; 11. Annular groove;

[0029] 2. Expander;

[0030] 3. Wires;

[0031] 4. Electrode rings;

[0032] 5. Semiconductor cooling ring plate; 51. Outer ceramic ring plate; 511. Wiring hole; 512. Hemispherical bump; 52. Inner ceramic ring plate; 53. N-type element; 54. P-type element;

[0033] 6. Hydrophilic coating;

[0034] 7. Solder joints. Detailed Implementation

[0035] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0036] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0037] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0039] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0040] This application discloses a minimally invasive expansion and drainage kit. (Refer to...) Figure 1-4 The minimally invasive dilation and drainage kit includes a sheath body 1 and a dilator 2. The dilator 2 is fixedly and detachably assembled to the end of the sheath body 1. An annular groove 11 is provided on the outer peripheral wall of the end of the sheath body 1 near the dilator 2. A hemostatic ring group and a cooling ring group are provided in the annular groove 11. Both the hemostatic ring group and the cooling ring group are connected to the control part of the minimally invasive surgical device through a wire 3. The wire 3 is attached to the outer peripheral wall of the sheath body 1 or pre-embedded in the interior of the sheath body 1. When the hemostatic ring group is energized, it heats up to heat the bleeding point of the blood vessel wall and promotes scab formation. When the cooling ring group is energized, it cools down to cool the bleeding point of the blood vessel wall.

[0041] In this embodiment, the cooling ring assembly includes two semiconductor cooling rings 5. One semiconductor cooling ring 5 is located at the front end of the hemostasis ring assembly and there is a first gap between them. The other semiconductor cooling ring 5 is located at the rear end of the hemostasis ring assembly and there is a second gap between them. The cold end of the semiconductor cooling ring 5 is located on the outer peripheral sidewall.

[0042] In the aforementioned cooling ring assembly, one semiconductor cooling ring 5 is located at the front end of the hemostasis ring assembly, allowing it to contact the bleeding point before the hemostasis ring assembly heats up. Therefore, this semiconductor cooling ring 5 can perform pre-cooling treatment after being energized. The other semiconductor cooling ring 5 is located at the rear end of the hemostasis ring assembly, allowing it to contact the scab at the bleeding point after the hemostasis ring assembly heats up. Therefore, this semiconductor cooling ring 5 can perform secondary cooling treatment on the scab site after being energized. In the narrow working environment of blood vessels, the two cooling treatments eliminate the need for repeatedly pulling back and forth the sheath body 1, which helps to reduce the pain caused to the patient by repeatedly pulling back and forth the sheath body 1, resulting in better surgical efficiency and a better surgical experience.

[0043] The semiconductor cooling ring 5 includes an outer ceramic ring plate 51, an inner ceramic ring plate 52, and multiple sets of N-type elements 53 and P-type elements 54. When the N-type elements 53 and P-type elements 54 are connected to form an electrical couple, after the circuit is energized, the current flows from the N-type element 53 to the junction of the P-type element 54 to absorb heat and become a cold end. Multiple sets of N-type elements 53 and P-type elements 54 are sandwiched between the outer ceramic ring plate 51 and the inner ceramic ring plate 52. The width of the semiconductor cooling ring 5 is between 2.5 and 4.5 mm, and the outer peripheral wall of the semiconductor cooling ring 5 is flush with the outer peripheral wall of the sheath body 1.

[0044] Both N-type element 53 and P-type element 54 are arc-shaped sheets. Both N-type element 53 and P-type element 54 are fixed by adhesive bonding. Multiple sets of N-type elements 53 form a circle with a larger diameter, and multiple sets of P-type elements 54 form a circle with a smaller diameter. The outer ceramic ring plate 51 has a U-shaped cross-section, and the inner ceramic ring plate 52 is bonded to the U-shaped opening on the inner circumference of the outer ceramic ring plate 51. Both circles are located in the annular mounting cavity between the outer ceramic ring plate 51 and the inner ceramic ring plate 52.

[0045] To facilitate the welding connection between the semiconductor cooling ring 5 and the wire 3, a wiring hole 511 for the protruding terminal is provided on the top of the inner ceramic ring plate 52. The terminal is welded to the end of the wire 3, thereby forming... Figure 2 Solder point 7 will block the wiring hole 511 and will not affect the sealing of the installation chamber between the outer ceramic ring plate 51 and the inner ceramic ring plate 52.

[0046] In order to increase the contact area between the outer wall of the semiconductor cooling ring 5 and the blood vessel, thereby facilitating rapid cooling, multiple hemispherical protrusions 512 are provided on the outer peripheral wall of the inner ceramic ring plate 52.

[0047] In this embodiment, the hemostatic ring assembly includes two electrode rings 4 with a third gap between them. When energized, a high-frequency current flows between the two electrode rings 4. The thermal effect of the high-frequency current causes the blood vessel wall to dehydrate and shrink, and the blood within the vessel to coagulate, thus achieving the purpose of scab formation and hemostasis. The width of the electrode rings 4 is between 0.8 and 3.0 mm, and the outer peripheral wall of the electrode rings 4 is flush with the outer peripheral wall of the sheath body 1. The hemostatic ring assembly designed above has a simple structure, is easy to manufacture and install, has good heating effect, and allows for easy control of the heating power by controlling the magnitude of the energizing current, which is beneficial for achieving precise temperature control to complete the scab formation process.

[0048] In this embodiment, to enable the concealed design of the wires 3, thereby reducing the outer diameter of the sheath body 1 and facilitating its smooth entry and exit from the human body, four wires 3 are pre-embedded and fixed within the sheath body 1. The four wires 3 are located on the four sides of the sheath body 1, ensuring they do not contact each other and preventing short circuits. Two wires 3 are used to connect to the hemostatic ring assembly, and the other two wires 3 are used to connect to the cooling ring assembly. The soldering ends of the wires 3 extend from the annular groove 11, and the solder joints 7 formed by the connection of the four wires 3 to the hemostatic ring assembly or the cooling ring assembly are located inside the annular groove 11.

[0049] In this embodiment, the sheath body 1 serves as the passage for the instrument to enter and exit. The sheath body 1 is an existing mature product and will not be described in detail here. The sheath body 1 is made of polytetrafluoroethylene or Pebax-nylon composite material.

[0050] In this embodiment, in order to improve lubrication and make the sheath body 1 enter and exit the human body more smoothly, a 5-10μm thick hydrophilic coating 6 is provided on the outer peripheral wall of the sheath body 1. The main component of the hydrophilic coating 6 is polyethylene. The hydrophilic coating 6 is activated when it comes into contact with human tissue fluid, which greatly increases the lubrication of the outer surface of the sheath body 1, so that the sheath body 1 can smoothly enter and exit the human body.

[0051] The beneficial technical effects of the minimally invasive expansion and drainage kit in this application are roughly as follows:

[0052] Before the hemostasis ring group is energized for heating and scab formation, the cooling ring group can be energized to cool the area near the bleeding point on the blood vessel wall, reducing the sensitivity of nerves near the bleeding point and having a certain sedative effect. After the hemostasis ring group is energized for heating and scab formation, the cooling ring group can be energized to cool the area near the scab again, reducing stimulation and pain, effectively preventing large edema, and improving the patient's surgical experience.

[0053] When the hemostatic ring group is energized, it can cause the blood vessels to scab, thereby achieving hemostasis and making hemostasis simpler. When the cooling ring group is energized, it can significantly reduce the patient's pain. The hemostatic ring group and the cooling ring group are not only housed in the annular groove 11, but the sheath also has the dual functions of hemostasis and cooling. The combined use can shorten the operation time and eliminate the need for repeated use of coagulation forceps, greatly reducing the frequency of coagulation forceps use and alleviating the patient's pain.

[0054] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A minimally invasive dilation and drainage kit, comprising a sheath body (1) and a dilator (2), wherein the dilator (2) is fixedly and detachably assembled to the end of the sheath body (1), characterized in that, An annular groove (11) is provided on the outer peripheral wall of the end of the sheath body (1) near the dilator (2). A hemostatic ring group and a cooling ring group are provided in the annular groove (11). The hemostatic ring group and the cooling ring group are connected to the control part of the minimally invasive surgical device through a wire (3). The wire (3) is attached to the outer peripheral wall of the sheath body (1) or pre-embedded in the interior of the sheath body (1). The hemostatic ring group heats up when energized to heat the bleeding point of the blood vessel wall and promote scab formation. The cooling ring group cools down when energized to cool the bleeding point of the blood vessel wall. The cooling ring group includes two semiconductor cooling rings (5). One semiconductor cooling ring (5) is located at the front end of the hemostatic ring group and there is a first gap between them. The other semiconductor cooling ring (5) is located at the rear end of the hemostatic ring group and there is a second gap between them. The cold end of the semiconductor cooling ring (5) is located on the outer peripheral sidewall.

2. The minimally invasive dilation and drainage kit according to claim 1, characterized in that, The semiconductor cooling ring (5) includes an outer ceramic ring plate (51), an inner ceramic ring plate (52), and multiple sets of N-type elements (53) and P-type elements (54). When the N-type elements (53) and the P-type elements (54) are connected to form an electrical couple, after the circuit is energized, the current flows from the N-type elements (53) to the junction of the P-type elements (54) to absorb heat and become a cold end. Multiple sets of N-type elements (53) and P-type elements (54) are sandwiched between the outer ceramic ring plate (51) and the inner ceramic ring plate (52).

3. The minimally invasive dilation and drainage kit according to claim 1, characterized in that, The width of the semiconductor cooling ring (5) is between 2.5 and 4.5 mm, and the outer peripheral wall of the semiconductor cooling ring (5) is flush with the outer peripheral wall of the sheath body (1).

4. The minimally invasive dilation and drainage kit according to claim 2, characterized in that, The outer peripheral wall of the inner ceramic ring plate (52) is provided with a plurality of hemispherical protrusions (512).

5. The minimally invasive dilation and drainage kit according to claim 1, characterized in that, The hemostatic ring assembly includes two electrode rings (4), with a third gap between the two electrode rings (4). After being energized, a high-frequency current flows between the two electrode rings (4), and the thermal effect of the high-frequency current causes the blood vessel wall to dehydrate and shrink, and the blood in the blood vessel to coagulate, so as to achieve the purpose of scab formation and hemostasis.

6. The minimally invasive dilation and drainage kit according to claim 5, characterized in that, The width of the electrode ring (4) is between 0.8 and 3.0 mm, and the outer peripheral wall of the electrode ring (4) is flush with the outer peripheral wall of the sheath body (1).

7. The minimally invasive dilation and drainage kit according to claim 1, characterized in that, The wires (3) are four in number and their main parts are pre-embedded and fixed in the sheath body (1). The four wires (3) are located on the four sides of the sheath body (1). Two of the wires (3) are used to connect to the hemostatic ring group, and the other two wires (3) are used to connect to the cooling ring group. The welding end of the wires (3) extends out from the annular groove (11). The welding point (7) formed by the connection of the four wires (3) with the hemostatic ring group or the cooling ring group is located inside the annular groove (11).

8. The minimally invasive dilation and drainage kit according to claim 1, characterized in that, The sheath body (1) is made of polytetrafluoroethylene or Pebax-nylon composite material.

9. The minimally invasive dilation and drainage kit according to claim 1, characterized in that, A 5-10 μm thick hydrophilic coating (6) is provided on the outer peripheral wall of the sheath body (1).

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