Wafer spray etching machine and method of use

Abstract

The application discloses a wafer spray etching machine and a use method thereof, relates to the technical field of semiconductor processing, and optimizes and improves the structure of a wafer carrier of a wafer spray etching machine in the prior art, uses three round rods capable of adjusting the spacing between each other as required to limit the wafer, the side walls of the three round rods are made of soft material, and a row of annular grooves are arranged on the side walls; the three annular grooves on the three round rods jointly position a wafer; the groove bottoms of the annular grooves abut against the edges of the wafer; in a spray etching process, the rotation of the round rods indirectly drives the wafer positioned by the round rods to rotate around the axis of the wafer; and the wafer spray etching machine can effectively avoid spray dead angles, has small frictional damage to the wafer in the etching process, and has strong applicability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a wafer spray etching machine and its usage method. Background Technology

[0002] In the semiconductor manufacturing field, wafer etching is of paramount importance, as its precision and uniformity directly determine the chip's performance and yield. Spray etching equipment is a commonly used device in wafer etching processes.

[0003] In the wafer spray etching process, to ensure that each wafer remains in a stable separated state and to prevent wafers from sticking together and affecting the etching effect, a basket frame (battery frame) is usually used to support the wafers. During the spray etching process, the etching solution is sprayed from top to bottom onto the wafer surface through a nozzle. The chemical reaction between the etching solution and the wafer material removes unwanted parts, completing the wafer etching process. During the spraying process, since the wafers are inserted inside the basket frame, there are contact points between the wafer edges and the basket frame. This inevitably creates spray dead zones at the contact points. The wafers in these dead zone areas cannot fully contact the sprayed solution, resulting in incomplete etching. This leads to uneven etching at the wafer edges, making it difficult to meet the usage requirements after etching, and thus causing waste at the edges.

[0004] To address the aforementioned issues, Chinese invention patent application number 202510340994.X discloses a mixed acid spray etching machine, which drives the wafer to rotate continuously by controlling the rotation of an elastic roller located at the bottom of the wafer and in contact with the edge of the wafer, thereby constantly changing the contact position between the wafer and the slot, achieving spray etching without dead angles, and improving the comprehensiveness and stability of the device during spray processing to a certain extent.

[0005] While the above-mentioned solution can effectively avoid dead corners in spray etching, during the wafer rotation process, it is inevitable that there will be continuous friction between the wafer and the wafer carrier (the wafer carrier in the above solution is the inner basket), which will cause noise and continuous damage to the wafer to be processed, seriously affecting the quality of the finished wafer. In addition, the device disclosed in the above-mentioned solution has poor applicability to wafers of different specifications. Different inner baskets need to be used to process wafers of different specifications, which is cumbersome and costly.

[0006] Therefore, there is a need for a wafer spray etching machine that can effectively avoid spray dead zones, minimize frictional damage to the wafer during the etching process, and has strong applicability. Summary of the Invention

[0007] This application provides a wafer spray etching machine, which solves the technical problems of existing wafer spray etching machines, such as large frictional damage to wafers during the etching process, high noise during the etching process, and poor applicability to wafers of different specifications; it achieves the technical effect of wafer spray etching machine that can effectively avoid spray dead corners, minimize frictional damage to wafers during the etching process, and has strong applicability.

[0008] This application provides a wafer spray etching machine, including a spray system and a wafer positioning carrier;

[0009] The wafer positioning carrier includes a carrier frame, a base carrier frame that is U-shaped and rotatably connected to the carrier frame, a positioning and shifting component, and a wafer positioning component;

[0010] The positioning and shifting component and the wafer positioning component are both positioned on the inner wall of the base frame and are arranged opposite to each other; the positioning and shifting component is used to position the basket frame and drive the basket frame to move so that the basket frame moves closer to or away from the wafer positioning component.

[0011] The wafer positioning assembly is used to carry and position the wafer and rotate it, and includes three slotted positioning rods, rod end positioning assemblies and a support frame.

[0012] The grooved positioning rod is arranged laterally, with its sidewall made of soft material and a row of annular positioning grooves on the sidewall.

[0013] The rod end positioning assembly is used to support three slotted positioning rods, adjust the spacing between the three slotted positioning rods as needed, and drive one of the slotted positioning rods to rotate around its own axis, and position it on the inner wall of the base frame through the support frame;

[0014] When the wafer positioning assembly carries the wafer, the edge of the wafer is embedded in the positioning groove and is restrained by three slotted positioning rods.

[0015] Furthermore, the grooved positioning rod includes a carrier rod and a sleeve;

[0016] The carrier rod is a rigid round rod; the sleeve is a flexible rubber tube, which is sleeved on the carrier rod and fixed to the carrier rod.

[0017] The sleeve is provided with a row of positioning grooves;

[0018] The three slotted positioning rods are always parallel to each other.

[0019] Furthermore, there are two rod end positioning components, which are respectively positioned close to both ends of the slotted positioning rod;

[0020] A rod end positioning assembly includes a base carrier tube, two rotating guide rods, and two sliding blocks;

[0021] The base carrier pipe is a rigid pipe arranged horizontally;

[0022] The rotating guide rod is a rigid straight rod with a straight through groove on it;

[0023] Both rotating guide rods are rotatably connected at one end to the foundation carrier pipe, and the axis of the rotating shaft coincides with the axis of the foundation carrier pipe; the rotating guide rods rotate in a controlled manner.

[0024] The sliding block is slidably positioned on the rotating guide rod and slides in a controlled manner.

[0025] One of the three slotted positioning rods passes through both ends of the two foundation carrier pipes and is rotatably connected to the foundation carrier pipes and rotates around its own axis.

[0026] The other two of the three slotted positioning rods are both connected through and rotatably to the sliding block; the slotted positioning rods positioned on the base pipe are rotated in a controlled manner.

[0027] Furthermore, there are two support frames, each corresponding to one of the two base carrier pipes;

[0028] The support frame includes a base plate and a vertical frame; the base plate is fixed to the inner wall of the foundation frame; the vertical frame is a rod-shaped frame, with one end positioned on the foundation pipe and the other end positioned on the base plate.

[0029] The length of the vertical frame is perpendicular to the base plate, and a guide groove is provided on it;

[0030] The guide groove is provided with two sliding blocks; the two sliding blocks slide in a controlled manner;

[0031] The two sliding blocks drive the rotating guide rod to rotate and the sliding block to slide through the force transmitted by the rod body.

[0032] Furthermore, the positioning and shifting component includes a positioning rod and a positioning clamp;

[0033] The positioning rod is a telescopic rod structure that is controlled by the control unit to extend and retract, and is fixed to the inner wall of the base frame;

[0034] The positioning clamp is an electric or pneumatic clamp controlled by the control unit. It is positioned at the end of the positioning rod away from the inner wall of the base frame and is used to clamp and fix the basket frame in a timely manner.

[0035] When the positioning rod extends, the basket it carries approaches the wafer positioning assembly;

[0036] The length direction of the basket frame carried by the positioning and shifting component is the same as the axial direction of the rotation axis of the base frame.

[0037] Furthermore, the carrier rod is a rigid tube;

[0038] The outer wall of the grooved positioning rod is densely covered with water spray nozzles, which are connected to the internal space of the rod.

[0039] It also includes the liquid supply component;

[0040] The liquid supply assembly is a combination of a pump and piping, connected to one of the support rods.

[0041] Preferably, the positioning and shifting component is eliminated, and the wafer positioning component directly serves as a container for holding the wafer. During use, when the rotation of the rotating guide rod is controlled so that the two rotating guide rods of the same rod end positioning component form a V-shape, the wafer is directly stored in the wafer positioning component. After storage, the angle of the rotating guide rod and the position of the sliding block are adjusted so that the wafer is bound by the three slotted positioning rods.

[0042] Preferably, the basic frame structure is omitted, and the basic frame is a column-shaped, plate-shaped, frame-shaped, or frame structure.

[0043] Preferably, it also includes a spacing adjustment component;

[0044] The grooved positioning rod includes a carrier rod, as well as multiple sleeve units, an elastic body positioned between the sleeve units, an abutment plate, a sliding plate, and an abutment compression spring;

[0045] The sleeve unit is an annular tube with a positioning groove on its side wall;

[0046] The contact plate is an annular plate that is fitted and positioned on the side wall of the carrier rod and near one end of the carrier rod;

[0047] The sliding plate is an annular plate, fixed on the side of the sleeve unit closest to the contact plate, and slides with the sleeve unit; the sleeve unit furthest from the contact plate is fixed on the carrier rod.

[0048] The abutment spring is sleeved on the carrier rod, with its two ends abutting against the abutment plate and the sliding plate, respectively;

[0049] The spacing adjustment component adjusts the spacing between sleeve units by pulling or pushing the sliding plate to compress or relax the contact spring.

[0050] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0051] By optimizing and improving the structure of the wafer carrier in existing wafer spray etching machines, three adjustable rods are used to position the wafer. The sidewalls of the three rods are made of soft material and have a row of annular grooves. The three annular grooves on the rods collectively position a wafer. The bottom of the annular grooves abuts the edge of the wafer. During the spray etching process, the rotation of the rods is controlled, which indirectly drives the wafer positioned by the rods to rotate around its own axis. This effectively solves the technical problems of existing wafer spray etching machines, such as large frictional damage to the wafer during the etching process, high noise during the etching process, and poor applicability to wafers of different specifications. As a result, the wafer spray etching machine can effectively avoid spray dead zones, minimize frictional damage to the wafer during the etching process, and has strong applicability. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the overall structure of the wafer positioning carrier of the wafer spray etching machine of this application;

[0053] Figure 2 This is a schematic diagram showing the rotation state of the wafer positioning carrier of the wafer spray etching machine of this application;

[0054] Figure 3 This is a schematic diagram of the wafer positioning assembly.

[0055] Figure 4 A schematic diagram of the column end positioning assembly;

[0056] Figure 5 This is a schematic diagram of the positioning rod.

[0057] Figure 6 A simplified diagram showing the state of the wafer as it is transferred between the basket and the wafer positioning assembly;

[0058] Figure 7 This is a schematic diagram showing the positional relationship between the wafer and the positioning rod;

[0059] Figure 8 This is a schematic diagram showing the layout relationship between the actuating protrusions and the positioning pins on the connecting rod.

[0060] Figure 9 This is a structural diagram of the spacing adjustment component;

[0061] Figure 10 This is a schematic diagram showing the positional relationship between the sliding telescopic rod and the sliding plate;

[0062] Figure 11 This is a simplified structural diagram of the sleeve unit and the elastomer.

[0063] In the picture:

[0064] Basketball hoop 001, wafer 002, base frame 100, frame body 200, positioning rod 310, positioning clamp 320, slotted positioning rod 410, carrier rod 411, sleeve 412, positioning groove 413, sleeve unit 414, elastic body 415, contact plate 416, sliding plate 417, contact spring 418, rod end positioning assembly 420, base carrier tube 421, rotating guide rod 422, sliding block 423, force guide rod body 424, sliding block 425. Force transmission rod 427, drive column 428, column end clamp 429, support frame 430, base plate 431, vertical frame 432, guide groove 433, connecting rod 434, actuating protrusion 435, positioning pin 436, positioning plate 437, sliding drive assembly 500, drive accessories 510, sliding liquid supply assembly 600, connecting pipe 610, rotating pipe 611, upright frame 710, rotating guide body 720, sliding telescopic rod 730, rod end positioning body 731. Detailed Implementation

[0065] To facilitate understanding of the present invention, a more complete description of this application will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the invention. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to enable a more thorough and complete understanding of the disclosure of the present invention.

[0066] It should be noted that the terms "vertical," "horizontal," "up," "down," "left," "right," and similar expressions used in this article are for illustrative purposes only and do not represent the only possible implementation.

[0067] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to limit the invention; the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0068] Example 1

[0069] like Figures 1 to 5 As shown, the wafer spray etching machine of this application includes a spray system, a wafer positioning carrier for carrying and positioning wafers, a power component, and a control unit.

[0070] The spraying system includes a pump assembly and spray heads, which spray water and etching solution onto the wafers carried by the wafer positioning carrier from the top, bottom, one side and / or both sides of the wafer positioning carrier; the power assembly provides power for the operation of each component of the wafer spraying and etching machine of this application; the control unit controls the coordinated operation of each component of the wafer spraying and etching machine; the spraying system, power assembly and control unit are all prior art and will not be described in detail here.

[0071] Preferably, the control unit is a combination of a programmable logic controller and control buttons.

[0072] The wafer positioning carrier includes a base frame 100, a frame body 200, a positioning and shifting component, and a wafer positioning component.

[0073] The basic frame 100 is a U-shaped rigid frame, which is perpendicular to the horizontal ground in the normal state and serves as a load-bearing support.

[0074] The positioning and shifting component and the wafer positioning component are both positioned on the inner wall of the base frame 100 and are arranged opposite to each other. Before and after spray etching, the positioning and shifting component is located above the wafer positioning component, and during the spray etching process, the positioning and shifting component is located below the wafer positioning component. The surfaces of the base frame 100 that support the positioning and shifting component and the wafer positioning component are symmetrical to each other and are parallel to the ground when the base frame 100 is in a vertical position.

[0075] The carrier frame 200 is a rigid frame, positioned on one or both sides of the base carrier frame 100, with its bottom positioned on the ground, serving to support the base carrier frame 100; the base carrier frame 100 is rotatably connected to the carrier frame 200, and rotates under the coordinated control of the control unit and the power component, with the axis of rotation parallel to the horizontal ground; when the base carrier frame 100 is rotated under control, it can be flipped 180 degrees.

[0076] The positioning and shifting component is used to support and control the movement of the basket frame 001, thereby causing the wafer 002 carried by the basket frame 001 to move closer to or further away from the wafer positioning component.

[0077] The positioning and shifting assembly includes a positioning rod 310 and a positioning clamp 320; the positioning rod 310 is a telescopic rod structure controlled by a control unit to extend and retract, and is fixed on the inner wall of the base frame 100; the positioning clamp 320 is an electric or pneumatic clamp controlled by the control unit, positioned at the end of the positioning rod 310 away from the inner wall of the base frame 100, for timely clamping and fixing of the basket frame 001; when the positioning rod 310 extends, the basket frame 001 it carries approaches the wafer positioning assembly.

[0078] The length direction of the basket frame 001 carried by the positioning and shifting component is the same as the axial direction of the rotation axis of the base frame 100.

[0079] The wafer positioning assembly is used to carry and position the wafer 002 and rotate the wafer 002. It includes three slotted positioning rods 410, rod end positioning assembly 420, and support frame 430 for supporting and fixing the rod end positioning assembly 420.

[0080] The slotted positioning rod 410 is a horizontally placed round rod, including a carrier rod 411 and a sleeve 412; the carrier rod 411 is a rigid round rod; the sleeve 412 is a flexible rubber tube, which is sleeved on and fixed to the carrier rod 411; the sleeve 412 is provided with a row of positioning grooves 413; the positioning grooves 413 are annular grooves, corresponding one-to-one with the wafer storage positions in the basket 001 (one wafer storage position stores one wafer);

[0081] The sleeve 412 is preferably made of fluororubber;

[0082] The three slotted positioning rods 410 are always parallel to each other;

[0083] The rod end positioning component 420 is used to support and position three slotted positioning rods 410. There are two of them. The two rod end positioning components 420 are symmetrically arranged and are respectively located close to the two ends of the slotted positioning rods 410.

[0084] A rod end positioning assembly 420 includes a base carrier tube 421, two rotating guide rods 422, and two sliding blocks 423; the two rod end positioning assemblies 420 operate synchronously, driving the three slotted positioning rods 410 to move closer to or further away from each other;

[0085] The base carrier pipe 421 is a rigid pipe body arranged laterally;

[0086] There are two rotating guide rods 422, which are rigid straight rods with straight grooves for guiding the movement of the sliding block 423. The overall shape is an elongated ring. One end of each rotating guide rod 422 is rotatably connected to the base carrier tube 421, and the axis of rotation of each rod coincides with the axis of the base carrier tube 421. The rotating guide rods 422 rotate under the coordinated control of the control unit and the power component. The length direction of the rotating guide rods 422 is perpendicular to the length direction of the grooved positioning rod 410.

[0087] The sliding block 423 is a rigid block that is slidably positioned on the rotating guide rod 422 and corresponds one-to-one with the rotating guide rod 422. Under the coordinated control of the control unit and the power component, it slides to move closer to or away from the base carrier tube 421.

[0088] One of the three slotted positioning rods 410 has its two ends passing through the two base carrier pipes 421 (of the two rod end positioning assembly 420), and is rotatably connected to the base carrier pipe 421 and rotates around its own axis. The axis of rotation of the slotted positioning rod 410 coincides with the axis of the base carrier pipe 421.

[0089] The other two of the three grooved positioning rods 410 have both ends that pass through and are rotatably connected to the sliding block 423, and the axis of rotation of each rod coincides with its own axis. The two grooved positioning rods 410 move closer to or further away from the grooved positioning rod 410 positioned on the base tube 421 as the sliding block 423 slides.

[0090] The support frame 430 is a rigid bracket, which is fixed to the base pipe 421 and the inner wall of the base frame 100, and plays a role in bearing and supporting.

[0091] The slotted positioning rod 410, positioned on the base carrier tube 421, rotates around its own axis under the coordinated control of the control unit and the power component.

[0092] Preferably, the components that drive the rotating guide rod 422 and the sliding block 423 to run are ball screw structures or gear rack structures driven by motors; the power components that drive the grooved positioning rod 410 on the base carrier pipe 421 to rotate are motors positioned on the base carrier pipe 421 or support frame 430.

[0093] Preferably, there are two support frames 430, each corresponding to one of the two foundation carrier pipes 421. Each support frame 430 includes a base plate 431 and a vertical frame 432. The base plate 431 is a rigid plate fixed to the inner wall of the foundation carrier frame 100. The vertical frame 432 is a rod-shaped frame, with one end positioned on the foundation carrier pipe 421 and the other end positioned on the base plate 431. The length direction of the vertical frame 432 is perpendicular to the base plate 431. A guide groove 433 is provided on the vertical frame 432. The guide groove 433 is a straight groove, with its length direction the same as that of the vertical frame 432. Two sliding blocks 425 are provided on the guide groove 433. The two sliding blocks 425 slide under the coordinated control of the control unit and the power component. Two guide rods are positioned on the sliding block 425 closest to the foundation carrier pipe 421. The rod body 424; two force transmission rods 427 are positioned on the sliding block 425 away from the base pipe 421; both the force transmission rods 427 and the force guide rods 424 are rigid rods; one end of the force guide rod 424 is rotatably connected to one of the rotating guide rods 422, and the other end is rotatably connected to the sliding block 425 near the base pipe 421. The axial direction of the rotation axis is the same as the axial direction of the base pipe 421. When the sliding block 425 near the base pipe 421 slides, it drives the two rotating guide rods 422 to rotate simultaneously; one end of each of the two force transmission rods 427 is rotatably connected to one of the sliding blocks 423, and the other end is rotatably connected to the sliding block 425 away from the base pipe 421. The axial direction of the rotation axis is the same as the axial direction of the base pipe 421. When the sliding block 425 away from the base pipe 421 slides, it drives the sliding block 423 to slide.

[0094] Preferably, the component that drives the sliding block 425 to slide is a ball screw structure, a gear and rack structure, an electric telescopic rod, a telescopic hydraulic cylinder, or a telescopic pneumatic cylinder.

[0095] Preferably, the carrier rod 411 is a rigid tube; the outer wall of the grooved positioning rod 410 is densely covered with water spray nozzles, which are connected to the internal space of the carrier rod 411; the wafer spray etching machine also includes a liquid supply assembly; the liquid supply assembly is a combination of a pump and a pipe, connected to one of the carrier rods 411, and controlled by a control unit to pump etching liquid into the grooved positioning rod 410 positioned on the base carrier tube 421; during the spray etching process, the grooved positioning rod 410 positioned on the base carrier tube 421 sprays liquid onto the wafer 002 while driving the wafer 002 to rotate; during the spraying process, the spraying force, range and angle can be changed by changing the liquid inlet per unit time.

[0096] Preferably, the pipe connecting the liquid supply component to the carrier rod 411 is a flexible hose, and the grooved positioning rod 410 rotates alternately in both forward and reverse directions (to avoid the pipe connecting the liquid supply component to the carrier rod 411 becoming too twisted).

[0097] Preferably, the pipe connecting the liquid supply assembly to the carrier rod 411 is a connecting pipe 610; the connecting pipe 610 is a rigid pipe, and a rotary sealing assembly is positioned at the connection point between it and the carrier rod 411.

[0098] Furthermore, the sleeve 412 is detachably fixed to the carrier rod 411 and can be replaced as needed.

[0099] like Figure 1 , Figure 2 , Figure 6 and Figure 7 As shown, the wafer spray etching machine of this application embodiment is used as follows:

[0100] 1. First, control the base frame 100 to rotate so that the wafer positioning assembly moves directly above the positioning and shifting assembly;

[0101] 2. Fix the basket frame 001 containing wafer 002 with its top facing upward onto the positioning clamp 320;

[0102] 3. Control the extension of the positioning rod 310 so that the slotted positioning rod 410 abuts against the edge of the wafer 002 in the basket frame 001, and so that all wafers are embedded in the positioning groove 413;

[0103] 4. Then, control the base frame to rotate 100 degrees by 180 degrees.

[0104] 5. Control the rotation of the rotating guide rod 422 and the sliding block 423 to slide, while controlling the positioning rod 310 to gradually retract, using the wafer positioning assembly to bind the wafer 002 to be processed;

[0105] 6. Perform spray etching, and at the same time control the grooved positioning rod 410 positioned on the base carrier tube 421 to rotate, thereby driving the wafer 002 to rotate, thereby eliminating etching dead corners;

[0106] 7. After the spray etching is completed, reinstall wafer 002 back into basket 001 and reset all components.

[0107] Preferably, during the operation of the wafer spray etching machine, the base frame 100 is oscillating in a controlled manner.

[0108] Preferably, a wafer spray etching machine includes multiple sets of positioning and shifting components and multiple wafer positioning components.

[0109] The technical solutions described in the embodiments of this application have at least the following technical effects or advantages:

[0110] This invention solves the technical problems of existing wafer spray etching machines, such as significant frictional damage to wafers during the etching process, high noise levels during the etching process, and poor applicability to wafers of different specifications. It achieves the technical effect of effectively avoiding spray dead zones, minimizing frictional damage to wafers during the etching process, and having strong applicability.

[0111] Example 2

[0112] The difference between this embodiment and the above embodiments is that:

[0113] The positioning and shifting component is removed, and the wafer positioning component directly serves as the container for holding the wafer 002. During use, when the rotation of the rotating guide rod 422 is controlled so that the two rotating guide rods 422 of the same rod end positioning component 420 form a V-shape, the wafer is directly stored in the wafer positioning component. After storage, the angle of the rotating guide rod 422 and the position of the sliding block 423 are adjusted so that the wafer 002 is bound by the three slotted positioning rods 410.

[0114] Furthermore, the support frame 430 is detachably fixed to the base frame 100, and the wafer positioning assembly can be directly removed and used as a wafer container; the liquid supply assembly's pipe is detachably positioned at the end of the carrier rod 411.

[0115] Preferably, the basic frame 100 is omitted, and the basic frame 100 is a column-shaped, plate-shaped, frame-shaped or frame structure.

[0116] Preferably, the component that drives the sliding block 425 to move is a clamping drive component;

[0117] Two connecting rods 434 are positioned between the two rod-end positioning components 420. Both connecting rods 434 are horizontally arranged rigid straight rods, one above the other. The two ends of the connecting rod 434 near the grooved positioning rod 410 are respectively fixed to two sliding blocks 425 near the base support pipe 421; the two ends of the connecting rod 434 away from the grooved positioning rod 410 are respectively fixed to two sliding blocks 425 away from the base support pipe 421. A pin positioning component is positioned inside the connecting rod 434, and a positioning plate 437 is provided on one side of the connecting rod 434. The positioning plate 437 is a vertically arranged rigid plate, with its bottom end fixed to the base plate 431. A row of pin holes adapted to the pin positioning component is provided on the side near the connecting rod 434. Figure 8As shown, the pin positioning assembly includes an actuating protrusion 435, a linkage component, and a positioning pin 436. The actuating protrusion 435 is positioned on the top of the connecting rod 434. The positioning pin 436 is located on the side of the connecting rod 434 near the positioning plate 437. The linkage component is used to link the movement of the actuating protrusion 435 and the positioning pin 436. Preferably, it is a combination of a lever structure and a spring, which is existing technology and only serves to transmit force. Under normal conditions, the positioning pin 436 protrudes from one side of the connecting rod 434 and is embedded in the pin hole of the positioning plate 437 to achieve positioning. When the actuating protrusion 435 is pressed, the force is transmitted to the positioning pin 436 through the linkage component, causing it to retract.

[0118] There are two clamping drive components, each corresponding to one of the connecting rods 434, which are used to drive the two connecting rods 434 to move; each clamping drive component includes a drive column 428 and a column end clamp 429.

[0119] The drive column 428 is a vertically arranged rigid telescopic column, with its bottom end fixed to the base frame 100. It extends and retracts under the coordinated control of the control unit and the power component. The column end clamp 429 is an electric or pneumatic clamp with its opening facing one side and is fixed to the top of the drive column 428. During the process of the column end clamp 429 clamping the connecting rod 434, it will trigger the actuation protrusion 435 to retract the positioning pin 436. After clamping the connecting rod 434, the extension and retraction of the drive column 428 will drive the sliding block 425 to move.

[0120] Preferably, the slotted positioning rod 410 positioned on the base carrier tube 421 rotates around its own axis under the drive of the sliding drive assembly 500; a drive accessory 510 is positioned at one end of the slotted positioning rod 410 positioned on the base carrier tube 421; the drive accessory 510 is a hard block with polygonal holes; the sliding drive assembly 500 is a motor slidably positioned on the base carrier frame 100, and the motor slides under the coordinated control of the control unit and the power assembly to move closer to or away from the slotted positioning rod 410; the output end of the motor is positioned with an axis corresponding to the drive accessory 510; when the wafer positioning assembly needs to be removed, the sliding drive assembly 500 is controlled to move away from the slotted positioning rod 410; when the slotted positioning rod 410 needs to be driven to rotate, the sliding drive assembly 500 is controlled to move closer to and insert into the drive accessory 510 on the slotted positioning rod 410 and drive it to rotate.

[0121] Preferably, the liquid supply assembly includes a sliding liquid supply assembly 600, a connecting pipe 610, and a rotating pipe 611; the sliding liquid supply assembly 600 is a water pump slidably positioned on the base frame 100, with one end near the grooved positioning rod 410 and away from the sliding drive assembly 500, sliding under the coordinated control of the control unit and the power assembly to move closer to or away from the grooved positioning rod 410; the connecting pipe 610 is positioned on the sliding liquid supply assembly 600; the rotating pipe 611 is a straight pipe, with one end connected to... The connecting pipe 610 is connected; a rotary sealing assembly is positioned between the connecting pipe 610 and the rotating pipe body 611; a rubber pad is provided at the end of the rotating pipe body 611 away from the connecting pipe 610; when the wafer positioning assembly needs to be removed, the sliding liquid supply assembly 600 is controlled to move away from the grooved positioning rod 410; when liquid needs to be supplied to the driving grooved positioning rod 410, the sliding liquid supply assembly 600 is controlled to move closer to the grooved positioning rod 410 and make the rotating pipe body 611 abut against the end of the grooved positioning rod 410, thereby connecting the liquid path.

[0122] Example 3

[0123] To further improve the practicality of this application and increase wafer processing efficiency, this application embodiment optimizes and improves the structure of the slotted positioning rod 410 based on the above embodiment and adds a spacing adjustment component, so that the wafer carried by the wafer positioning component can adjust the spacing as needed and in a timely manner, specifically:

[0124] like Figures 9 to 11 As shown, the grooved positioning rod 410 includes a carrier rod 411, and also includes multiple sleeve units 414, an elastic body 415 positioned between the sleeve units 414, an abutment plate 416, a sliding plate 417, and an abutment compression spring 418.

[0125] The sleeve unit 414 includes a sliding ring and an outer sleeve;

[0126] The sliding ring is a tubular ring body, which is sleeved and slidably positioned on the carrier rod 411;

[0127] The outer sleeve is a rubber tube body, which is sleeved and fixed on the sliding ring; each outer sleeve is provided with a positioning groove 413;

[0128] The elastic body 415 is a metal or non-metal spring, positioned between sleeve units 414, and its number is one less than that of sleeve units 414; the elastic body 415 is sleeved on the carrier rod 411, and its two ends simultaneously abut against the two adjacent sleeve units 414.

[0129] The total length of all sleeve units 414 on a single rod 411 is less than two-thirds of the length of the rod 411.

[0130] The contact plate 416 is an annular plate, which is sleeved and positioned on the side wall of the carrier rod 411 and is located near one end of the carrier rod 411.

[0131] The sliding plate 417 is an annular plate, fixed on the side of the sleeve unit 414 closest to the contact plate 416, and slides as the sleeve unit 414 slides.

[0132] The sleeve unit 414 furthest from the contact plate 416 is fixed to the carrier rod 411;

[0133] The abutment spring 418 is sleeved on the carrier rod 411, with its two ends abutting against the abutment plate 416 and the sliding plate 417 respectively. When the sliding plate 417 is subjected to force, the abutment spring 418 is compressed or extended, thereby adjusting the distance between the sleeve units 414.

[0134] The spacing adjustment component is used to apply force to the sliding plate 417 in a timely manner to make it slide and thus adjust the spacing between the sleeve units 414. It is provided at one end near the carrier rod 411 where the contact plate 416 is fixed.

[0135] The spacing adjustment assembly includes a stand 710, a rotating guide 720, and a sliding telescopic rod 730;

[0136] The upright frame 710 is a vertically arranged rigid frame, positioned on the base frame 100 or the sliding drive assembly 500, and serves as a load-bearing and supporting element.

[0137] The rotating guide 720 is a straight rod, and there are two of them. One end of each rod is rotatably connected to the upright 710 near the top. It rotates under the coordinated control of the control unit and the power component. The axial direction of the rotating shaft is the same as the axial direction of the slotted positioning rod 410.

[0138] The sliding telescopic rods 730 are electric or pneumatic telescopic rods, and there are three of them. Their axial direction is the same as that of the slotted positioning rod 410. They are all slidably positioned on the rotating guide body 720 and slide along the length direction of the rotating guide body 720 under the coordinated control of the control unit and the power component. Two of the sliding telescopic rods 730 are positioned on the same rotating guide body 720.

[0139] One end of the sliding telescopic rod 730 is positioned with a rod end positioning body 731; the rod end positioning body 731 is a cylindrical block rod body, coaxial with the sliding telescopic rod 730 and rotatably connected to the end of the sliding telescopic rod 730 around its own axis, and is arranged laterally, with an annular groove positioned on its side wall.

[0140] During the spray etching process, the sliding telescopic rod 730 is controlled to extend and slide, so that the edge of the sliding plate 417 is embedded in the annular groove of the rod end positioning body 731. Then, the sliding telescopic rod 730 is controlled to extend and extend to adjust the spacing between wafers 002.

[0141] Preferably, during spraying, the spacing between wafers 002 changes continuously or intermittently.

[0142] Preferably, the carrier rod 411 is provided with multiple spray nozzles. When the sleeve unit 414 moves, it blocks or exposes part of the spray nozzles, thereby changing the spray direction.

[0143] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A wafer spray etching machine, comprising a spray system and a wafer positioning carrier; characterized in that: The wafer positioning carrier includes a carrier frame (200), a base carrier frame (100) that is U-shaped and rotatably connected to the carrier frame (200), a positioning and shifting component, and a wafer positioning component; The positioning and shifting component and the wafer positioning component are both positioned on the inner wall of the base frame (100) and are arranged opposite to each other; the positioning and shifting component is used to position the basket frame (001) and drive the basket frame (001) to move so that the basket frame (001) moves closer to or further away from the wafer positioning component. The wafer positioning assembly is used to carry and position the wafer (002) and rotate the wafer (002), including three slotted positioning rods (410), rod end positioning assembly (420) and support frame (430); The grooved positioning rod (410) is arranged laterally, with its sidewall made of soft material and a row of annular positioning grooves (413) on the sidewall. The rod end positioning assembly (420) is used to support three slotted positioning rods (410), adjust the spacing between the three slotted positioning rods (410) as needed, and drive one of the slotted positioning rods (410) to rotate around its own axis, and be positioned on the inner wall of the base frame (100) through the support frame (430); When the wafer positioning assembly carries the wafer (002), the edge of the wafer (002) is embedded in the positioning groove (413) and is bound by three slotted positioning rods (410); The grooved positioning rod (410) includes a carrier rod (411) and a sleeve (412); The carrier rod (411) is a rigid round rod; the sleeve (412) is a rubber hose, which is sleeved on the carrier rod (411) and fixed on the carrier rod (411); The sleeve (412) is provided with a row of positioning grooves (413); The three slotted positioning rods (410) are always parallel to each other; It also includes a spacing adjustment component; The grooved positioning rod (410) includes a carrier rod (411), and also includes multiple sleeve units (414), an elastic body (415) positioned between the sleeve units (414), an abutment plate (416), a sliding plate (417) and an abutment compression spring (418). The sleeve unit (414) is an annular tube with a positioning groove (413) on its side wall; The contact plate (416) is an annular plate, which is sleeved and positioned on the side wall of the carrier rod (411) and located near one end of the carrier rod (411); The sliding plate (417) is an annular plate, fixed on the side of the sleeve unit (414) closest to the contact plate (416), and slides as the sleeve unit (414) slides; the sleeve unit (414) furthest from the contact plate (416) is fixed on the carrier rod (411); The abutment spring (418) is sleeved on the carrier rod (411), with its two ends abutting against the abutment plate (416) and the sliding plate (417) respectively; The spacing adjustment assembly adjusts the spacing between the sleeve units (414) by pulling or pushing the sliding plate (417) to compress or extend the contact spring (418).

2. The wafer spray etcher of claim 1 wherein: The number of rod end positioning components (420) is two, and the two rod end positioning components (420) are respectively set close to the two ends of the slotted positioning rod (410); A rod end positioning assembly (420) includes a base carrier tube (421), two rotating guide rods (422), and two sliding blocks (423); The base carrier pipe (421) is a rigid pipe body arranged laterally; The rotating guide rod (422) is a rigid straight rod with a straight through groove on it; Both rotating guide rods (422) are rotatably connected at one end to the base carrier pipe (421), and the axis of the rotating shaft coincides with the axis of the base carrier pipe (421); the rotating guide rods (422) are rotated in a controlled manner; The sliding block (423) is slidably positioned on the rotating guide rod (422) and slides in a controlled manner; One of the three slotted positioning rods (410) has its two ends passing through the two foundation carrier pipes (421) respectively, and is rotatably connected to the foundation carrier pipes (421) and rotates around its own axis; The other two of the three slotted positioning rods (410) are connected to the sliding block (423) at both ends; the slotted positioning rods (410) positioned on the base tube (421) are rotated in a controlled manner.

3. The wafer spray etching machine as described in claim 2, characterized in that: The number of the support frame (430) is two, each corresponding to one of the two base carrier pipes (421); The support frame (430) includes a base plate (431) and a vertical frame (432); the base plate (431) is fixed on the inner wall of the foundation frame (100); the vertical frame (432) is a rod-shaped frame, with one end positioned on the foundation pipe (421) and the other end positioned on the base plate (431); The length direction of the vertical frame (432) is perpendicular to the base plate (431), and a guide groove (433) is provided on it; The guide groove (433) is provided with two sliding blocks (425); the two sliding blocks (425) slide in a controlled manner; The two sliding blocks (425) drive the rotating guide rod (422) to rotate and the sliding block (423) to slide through the force transmitted by the rod body.

4. The wafer spray etching machine as described in claim 1, characterized in that: The positioning and shifting assembly includes a positioning rod (310) and a positioning clamp (320); The positioning rod (310) is a telescopic rod structure that is controlled by the control unit to extend and retract, and is fixed on the inner wall of the base frame (100); The positioning clamp (320) is an electric or pneumatic clamp controlled by the control unit. It is positioned at the end of the positioning rod (310) away from the inner wall of the base frame (100) and is used to clamp and fix the basket frame (001) in a timely manner. When the positioning rod (310) extends, the basket (001) it carries approaches the wafer positioning assembly; The length direction of the basket frame (001) carried by the positioning and shifting component is the same as the axial direction of the rotation axis of the base frame (100).

5. The wafer spray etching machine as described in claim 1, characterized in that: The carrier rod (411) is a rigid tube; The outer wall of the grooved positioning rod (410) is densely covered with water spray nozzles, which are connected to the internal space of the carrier rod (411). It also includes the liquid supply component; The liquid supply assembly is a combination of a pump and a pipeline, connected to one of the support rods (411).

6. The wafer spray etching machine as described in any one of claims 1 to 5, characterized in that: The positioning and shifting component is removed, and the wafer positioning component directly serves as a container for the wafer (002). During use, when the rotating guide rod (422) is rotated so that the two rotating guide rods (422) of the same rod end positioning component (420) form a V shape, the wafer is directly stored in the wafer positioning component. After storage, the angle of the rotating guide rod (422) and the position of the sliding block (423) are adjusted so that the wafer (002) is bound by the three slotted positioning rods (410).

7. The wafer spray etching machine as described in claim 6, characterized in that: The basic frame (100) is canceled. The basic frame (100) is column-shaped, plate-shaped, frame-shaped or frame structure.

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