Method for rapid testing of cleaning effect of laser drilling machine optical lens

Abstract

The application discloses a kind of laser drilling machine optical lens cleaning effect rapid inspection method, it belongs to laser drilling machine lens dirt detection field, it uses the way of processing annulus, lens foreign matter detection can be detected comprehensively by three ways, detection mode is simple and efficient, reduce equipment downtime waiting time, greatly improve the detection efficiency.It mainly includes the following steps selecting the test substrate greater than the effective scanning work area size of laser scanning electron microscope, test substrate includes substrate top copper foil, substrate middle resin and substrate bottom copper foil;Substrate top copper foil is used as processing surface and is fixed in the processing station of laser drilling machine, laser drilling machine is carried out laser annular drilling on substrate top copper foil, and the energy of laser drilling machine is controlled to destroy substrate top copper foil;Laser drilling machine is reciprocated on test substrate and processed into annulus.The application is mainly used for laser drilling machine optical lens cleaning effect rapid inspection.

Description

Technical Field

[0001] This invention relates to the field of dirt detection in laser drilling machine lenses, and more specifically, to a rapid testing method for the cleaning effect of optical lenses in laser drilling machines. Background Technology

[0002] Flexible packaging substrates often use laser drilling machines for micro-hole processing. The laser beam pulse emitted from the laser oscillator needs to go through multiple optical lenses for beam expansion, collimation, reflection and focusing before finally illuminating the substrate on the drilling machine table. Therefore, the optical lenses in the laser drilling machine's optical path need to be cleaned and maintained regularly to ensure the normal transmission of the laser beam.

[0003] Currently, the industry mainly divides the cleaning of optical lenses in laser drilling machines into daily external lens protection cleaning and monthly or quarterly internal cleaning of laser beam expanders, collimating lenses, scanning electron microscopes, and focusing lenses. The effect of optical lens cleaning is usually confirmed by using a test substrate with the same size as the product being processed (513mm*623mm) to perform full-plate laser drilling of blind holes, followed by plasma descaling and copper surface micro-etching to remove oxidation. Then, an automatic optical blind hole inspection machine is used to check the test substrate for abnormalities such as missed blind holes or residual adhesive at the bottom of the blind holes to determine whether the cleaning effect is qualified. This method of test substrate production process is relatively long and takes 2-4 hours / unit / day. Before the cleaning effect is confirmed to be qualified, the machine can only be stopped and waited, which affects the equipment's uptime. Summary of the Invention

[0004] The purpose of this invention is to provide a rapid inspection method for the cleaning effect of optical lenses in laser drilling machines. This method employs a ring-processing approach. Foreign matter detection on the lens is achieved through a copper foil connection between the central copper cap and the outer copper surface, covering the underlying resin. A small portion of the copper foil on the central copper cap and another small portion on the outer copper surface are not completely cut clean. These three methods allow for comprehensive detection, making the inspection simple and efficient, reducing equipment downtime and significantly improving inspection efficiency. The second set of rings on the bottom copper foil of the substrate is tangent to the outer diameter of the first set of rings, ensuring that unprocessed areas between the first set of rings can be processed a second time, guaranteeing the comprehensiveness and accuracy of the test.

[0005] This invention is achieved through the following technical solution:

[0006] A rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine includes the following steps:

[0007] S1. Select a test substrate that is larger than the effective scanning working area of ​​the laser drilling machine scanning electron microscope. The test substrate includes the top copper foil, the middle resin and the bottom copper foil.

[0008] S2. The top copper foil of the substrate is used as the processing surface and fixed to the processing station of the laser drilling machine. The laser drilling machine performs laser circular drilling on the top copper foil of the substrate. The energy of the laser drilling machine is controlled to destroy the top copper foil of the substrate.

[0009] S3. The laser drilling machine performs reciprocating circular processing on the test substrate until the circular rings cover the entire front side of the test substrate.

[0010] S4. The bottom copper foil of the substrate is used as the processing surface and fixed at the processing station of the laser drilling machine. The laser drilling machine performs laser circular drilling on the bottom copper foil of the substrate. The circular holes of the bottom copper foil are all located between the four adjacent circular holes of the top copper foil of the substrate. The energy of the laser drilling machine is controlled to destroy the bottom copper foil of the substrate.

[0011] S5. Remove the processed test substrate, adjust the magnification until the entire annular matrix can be seen on the microscope screen, and perform a visual inspection.

[0012] S6. Determination of foreign object coverage on optical lenses:

[0013] 1) There is a break in the copper ring: there is a copper foil connecting the middle copper cover and the outer copper surface to cover the middle resin of the substrate below;

[0014] 2) Copper foil residue inside the copper ring: A small amount of copper foil on the middle copper cap was not completely cut off;

[0015] 3) Copper foil residue on the outside of the copper ring: A small amount of copper foil on the outer copper surface was not completely cut off.

[0016] Furthermore, during laser drilling, fluctuations in laser energy, focal length, and copper thickness of the test substrate cause fluctuations in the outer diameter of the hole ring, with a tolerance of a. The position scanning accuracy of the scanning electron microscope of the laser drilling machine is b. To ensure that there is no interference between the processed rings, the hole wall distance between the two rings must be greater than or equal to 2a+2b. The effective spot diameter of the laser drilling is c. The outer diameter of the laser drilling ring is 0.09mm, and the inner diameter of the laser drilling ring is 0.09-2c.

[0017] Furthermore, a = ±0.005mm, b = ±0.01mm, c = 0.015mm, the distance between the hole walls of the two rings must be greater than or equal to 2a + 2b = 2 * 0.005 + 2 * 0.01 = 0.03mm; the inner diameter of the laser-drilled ring is 0.09 - 2c = 0.09 - 0.015 * 2 = 0.06mm.

[0018] Furthermore, the effective scanning working area of ​​the laser drilling machine scanning electron microscope is 45mm*45mm. The center of the laser-processed ring and the center of the hole are evenly distributed in an array with a distance of 0.12mm between them. The number of holes that can be distributed in each row or column is N. From 0.09*N+0.03*(N-1)=45, we get N=375.25. Rounding N to 375, the number of holes that can be distributed within the effective scanning working area of ​​the laser drilling machine scanning electron microscope is 375*375=140625. Finally, the entire array rectangle... A rectangular cutting groove is distributed around the array periphery; the laser drill only needs to automatically adjust the scanning angle of the scanning electron microscope to focus the laser beam pulse emitted from the laser oscillator through different positions of the focusing lens, and then irradiate the area of ​​the hole to be processed within the range of 45mm*45mm through the lens protection mirror. At this time, the table surface of the laser drill that can move along the Y-axis and the focusing lens and lens protection mirror that can move along the X-axis will be fixed until all the holes to be processed within the range of 45mm*45mm are scanned and processed, and the equipment is reset.

[0019] Furthermore, the thickness of the top copper foil and the bottom copper foil of the substrate is 12um, and the thickness of the resin in the middle of the substrate is 25um.

[0020] Furthermore, the laser drilling parameters for the top copper foil of the substrate are set as follows: energy 8μJ-12μJ; processing mode: circular cutting; cutting speed 150mm / s-250mm / s; number of circular cuts 1.01-2.01 times; circular diameter 0.09mm; compensation spot diameter 0.015mm.

[0021] Furthermore, let the rings processed by the copper foil on the top layer of the substrate be the first group of rings, and the rings processed by the copper foil on the bottom layer of the substrate be the second group of rings, with the outer diameter of the second group of rings being tangent to the outer diameter of the first group of rings.

[0022] Furthermore, the center of the second set of rings lies at the intersection of the lines connecting the four circular rings in the first set, which are arranged in a rectangular pattern. Simultaneously, the outer diameter of the second set of rings is tangent to the outer diameter of the first set of rings. D is set to 0.08 mm.

[0023] Furthermore, the laser drilling parameters for the bottom copper foil of the substrate are set as follows: energy 8μJ-12μJ; processing mode: circular cutting; cutting speed 150mm / s-250mm / s; number of circular cuts 1.01-2.01 times; circular diameter 0.08mm; compensation spot diameter 0.015mm.

[0024] Furthermore, the test substrate has through holes at its four corners, with a diameter of 1.5mm-2.0mm. These through holes are used for scanning and processing the first set of rings after the alignment target is identified and positioned. After processing the rings of the top copper foil of the substrate, the test substrate is flipped left and right along the Y-axis and placed on the laser drilling machine table. At the same time, the center coordinates of the second set of rings are mirrored along the Y-axis and the laser processing data is output. The four through holes are identified to scan and process the second set of rings after the alignment target is identified and positioned.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] 1. By processing laser rings of a certain specification on both sides of the top copper foil and the bottom copper foil of the substrate, and assuming that the first group of rings on the top copper foil of the substrate has the largest number, the second group of rings on the bottom copper foil of the substrate is tangent to the outer diameter of the first group of rings. This ensures that the unprocessed area between the first group of rings can be processed in the second time, thus ensuring the comprehensiveness and accuracy of the test.

[0027] 2. After laser cutting the circular matrix, visual inspection under a microscope can quickly confirm whether the rings are abnormal and determine whether the cleaning effect is qualified. The inspection process time has been reduced from 2-4 hours / time to 20-25 minutes / time, and the average machine uptime has been increased by about 15%.

[0028] 3. By using a circular processing method, foreign matter detection on the lens is achieved through a copper foil connection between the central copper cover and the outer copper surface, which covers the resin underneath. A small portion of the copper foil on the central copper cover is not completely cut off; a small portion of the copper foil on the outer copper surface is not completely cut off. These three methods can comprehensively detect foreign objects. The detection method is simple and efficient, reduces equipment downtime, and greatly improves detection efficiency. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the circular machining path of the laser drilling machine of the present invention;

[0030] Figure 2 This is a schematic diagram of the ring after processing by the laser drilling machine of the present invention;

[0031] Figure 3 This is a schematic diagram of the structure of the test substrate after the ring processing of the present invention;

[0032] Figure 4 This is a schematic diagram showing a defect in the copper ring after the circular ring of the present invention has a broken part;

[0033] Figure 5 This is a schematic diagram illustrating the defect of copper foil residue remaining on the inner side of the copper ring after the ring processing of the present invention;

[0034] Figure 6 This is a schematic diagram illustrating the defect of copper foil residue on the outer side of the copper ring after processing according to the present invention.

[0035] Figure 7 This is a schematic diagram showing the positional relationship of the two circular rings on the test substrate of the present invention. Detailed Implementation

[0036] The present invention will now be further described in conjunction with the accompanying drawings.

[0037] Example: A rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine, comprising the following steps:

[0038] S1. Select a test substrate larger than the effective scanning working area of ​​the laser drilling machine's scanning electron microscope (at this time, the laser drilling machine's table that can move along the Y-axis and the focusing lens and lens protection mirror that can move along the X-axis will be fixed. The laser drilling machine only needs to automatically adjust the scanning angle of the scanning electron microscope to focus the laser beam pulse emitted from the laser generator through different positions of the focusing lens and then irradiate the effective processing area through the lens protection mirror). The test substrate includes the top copper foil of the substrate, the middle resin of the substrate, and the bottom copper foil of the substrate.

[0039] S2. The top copper foil of the substrate is used as the processing surface and fixed to the processing station of the laser drilling machine. The laser drilling machine performs laser circular drilling on the top copper foil of the substrate. The energy of the laser drilling machine is controlled to damage the top copper foil of the substrate (the resin in the middle of the substrate can be slightly damaged, but the bottom copper foil of the substrate cannot be penetrated). Figures 2-3 As shown;

[0040] S3, the laser drilling machine performs reciprocating circular drilling on the test substrate, such as... Figure 1 As shown, continue until the rings cover the entire front side of the test substrate;

[0041] S4. The bottom copper foil of the substrate is used as the processing surface and fixed to the processing station of the laser drilling machine. The laser drilling machine performs laser circular drilling on the bottom copper foil of the substrate. The laser-drilled circles on the bottom copper foil of the substrate are all located between the four adjacent circles on the top copper foil of the substrate. The energy of the laser drilling machine is controlled to destroy the bottom copper foil of the substrate (the resin in the middle of the substrate can be slightly damaged, but the top copper foil of the substrate cannot be penetrated).

[0042] S5. Remove the processed test substrate, adjust the magnification (20-30 times) until the entire annular matrix can be seen on the microscope screen, and perform visual inspection.

[0043] S6. Foreign matter coverage determination for optical lenses (laser beam expanders, scanning electron microscopes, focusing lenses, lens protection lenses) (the following three situations may occur where the copper ring is not completely cut):

[0044] 1) There is a break in the copper ring: the middle copper cap and the outer copper surface are connected by copper foil, covering the underlying substrate and the intermediate resin, such as... Figure 4As shown;

[0045] 2) Copper foil residue inside the copper ring: A small amount of copper foil on the middle copper cap was not completely cut off, such as... Figure 5 As shown;

[0046] 3) Copper foil residue on the outer side of the copper ring: A small portion of copper foil on the outer copper surface was not completely cut off, such as... Figure 6 As shown.

[0047] In this embodiment, during laser drilling, fluctuations in laser energy, focal length, and the copper thickness of the test substrate cause variations in the outer diameter of the hole ring, with a tolerance of 'a'. The scanning accuracy of the scanning electron microscope (SEM) on the laser drilling machine is 'b', ensuring no interference occurs between the processed rings. The distance between the hole walls of the two rings must be greater than or equal to 2a + 2b. The effective laser spot diameter is 'c', the outer diameter of the laser drilling ring is 0.09 mm, and the inner diameter is 0.09 - 2c. 'a' = ±0.005 mm, 'b' = ±0.01 mm, 'c' = 0.015 mm, and the distance between the hole walls of the two rings must be greater than or equal to 2a + 2b = 2 * 0.005 + 2 * 0.01 = 0.03 mm. The inner diameter of the circular hole is 0.09-2c=0.09-0.015*2=0.06mm; the effective scanning working area of ​​the laser drilling machine scanning electron microscope is 45mm*45mm. The center of the laser-processed circular hole and the center of the hole are 0.12mm apart (the distance between the hole walls is 0.03mm) and they are evenly distributed in an array. The number of holes that can be distributed in each row or column is N. From 0.09*N+0.03*(N-1)=45, we get N=375.25. Rounding N to 375, the number of holes that can be distributed within the effective scanning working area of ​​the laser drilling machine scanning electron microscope is 375*375=140625. Finally, a rectangular cutting groove is distributed around the entire array matrix.

[0048] Specifically, the laser drilling machine only needs to automatically adjust the scanning angle of the scanning electron microscope to focus the laser beam pulse emitted from the laser generator through different positions of the focusing lens, and then irradiate the area of ​​the hole to be processed within the range of 45mm*45mm through the lens protection mirror. At this time, the table surface of the laser drilling machine that can move along the Y-axis and the focusing lens and lens protection mirror that can move along the X-axis will be fixed until all the holes to be processed within the range of 45mm*45mm are scanned and processed, and the equipment resets.

[0049] In this embodiment, the thickness of the top copper foil and the bottom copper foil of the substrate is 12um, and the thickness of the resin in the middle of the substrate is 25um.

[0050] In this embodiment, the laser drilling parameters for the top copper foil of the substrate are set as follows: energy 8μJ-12μJ; processing mode: circular cutting; cutting speed 150mm / s-250mm / s; number of circular cuts 1.01-2.01 times; circular diameter 0.09mm; compensation spot diameter 0.015mm.

[0051] Specifically, these processing parameters will process a ring on the test substrate, with the copper foil completely cut through. The ring width is 15μm-20μm, the outer diameter is 90μm, and the inner diameter (i.e., the diameter of the middle copper cap) is 50μm-60μm. The resin layer in the middle of the test substrate will be cut to a depth of 1 / 4-1 / 3 of the total thickness of the resin layer, i.e., 6μm-8μm. The energy setting must be able to cut a complete ring within a fluctuation range of ±5% based on the set energy to avoid interference from the energy fluctuation of the laser drilling machine itself on the test results.

[0052] like Figure 7 As shown, in this embodiment, the rings processed by the copper foil on the top layer of the substrate are designated as the first group of rings, and the rings processed by the copper foil on the bottom layer of the substrate are designated as the second group of rings (the second group of rings is created by laser drilling at the center of the area not covered between every four rings in the first group). The outer diameter of the second group of rings is tangent to the outer diameter of the first group of rings. The center of the second group of rings is located at the intersection of the lines connecting the four circular rings in the first group, which are arranged in a rectangular shape. Simultaneously, the outer diameter of the second group of rings is tangent to the outer diameter of the first group of rings (the outer diameter of the first group of rings is 0.09 mm, and the distance between the centers of the first group of rings is 0.12 mm). D is set to 0.08mm; the laser drilling parameters for the bottom copper foil of the substrate are set as follows: energy 8μJ-12μJ; processing mode: circular cutting; cutting speed 150mm / s-250mm / s; number of circular cuts 1.01-2.01 times; circular diameter 0.08mm; compensation spot diameter 0.015mm.

[0053] Specifically, these processing parameters will process a ring on the test substrate. The bottom copper foil of the test substrate will be completely cut through, with a ring width of 15μm-20μm, an outer diameter of 80μm, and an inner diameter (i.e., the diameter of the middle copper cap) of 40μm-50μm. The middle resin layer of the test substrate will be cut to a depth of 1 / 4-1 / 3 of the total thickness of the resin layer, i.e., 6μm-8μm. The judgment criteria for the appearance of the two sets of rings are consistent.

[0054] In this embodiment, the test substrate has through holes at its four corners, with a diameter of 1.5mm-2.0mm. These through holes are used for scanning and processing the first set of rings after the alignment target is identified and positioned. After processing the rings of the top copper foil of the substrate, the test substrate is flipped left and right along the Y-axis and placed on the laser drilling machine table. At the same time, the center coordinates of the second set of rings are mirrored along the Y-axis and the laser processing data is output. The four through holes are identified to scan and process the second set of rings after the alignment target is identified and positioned.

[0055] When a single or multiple foreign objects or a large area of ​​foreign objects cover the scanning electron microscope, focusing lens, or lens protection lens of a laser drilling rig (the foreign objects may originate from dust generated during drilling, water mist condensed on the optical lenses due to excessive humidity in the workshop, etc.), the obstruction of foreign objects will affect the energy attenuation of the laser beam pulse transmission irradiating the test substrate on the drilling rig platform, and will eventually result in drilling defects at the corresponding positions within the effective scanning working area of ​​45mm*45mm.

[0056] When machining round holes, repeated scanning around circumferences of varying radii is required. Defects caused by optical lens contamination ultimately manifest as resin residue at the bottom of the round hole. This resin residue is less easily identifiable than surface copper residue and is therefore not used. Furthermore, the density of simple straight-line grooves is too high compared to circular rings, leading to visual clutter and difficulty in quickly identifying copper residue defects under a microscope. Therefore, a circular ring is designed and machined for testing purposes instead of round holes or straight-line grooves.

[0057] This application reduces the original solution's requirement of processing a 500mm*600mm test substrate to only two 45mm*45mm test substrates. The original solution involved laser drilling the test substrates, followed by plasma descaling and copper surface micro-etching to remove oxidation, and then using an automated optical blind hole inspection machine to check for any missing blind holes, residual holes at the bottom, or other abnormalities to determine if the cleaning effect was satisfactory. This invention, however, allows for rapid visual inspection under a microscope after laser cutting the circular matrix, quickly confirming the rings' absence and determining the cleaning effect. The inspection process time is reduced from 2-4 hours per cycle to 20-25 minutes per cycle, increasing the average machine uptime by approximately 15%.

Claims

1. A rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine, characterized in that: Includes the following steps: S1. Select a test substrate that is larger than the effective scanning working area of ​​the laser drilling machine scanning electron microscope. The test substrate includes the top copper foil, the middle resin and the bottom copper foil. S2. The top copper foil of the substrate is used as the processing surface and fixed to the processing station of the laser drilling machine. The laser drilling machine performs laser circular drilling on the top copper foil of the substrate. The energy of the laser drilling machine is controlled to destroy the top copper foil of the substrate. S3. The laser drilling machine performs reciprocating circular processing on the test substrate until the circular rings cover the entire front side of the test substrate. S4. The bottom copper foil of the substrate is used as the processing surface and fixed at the processing station of the laser drilling machine. The laser drilling machine performs laser circular drilling on the bottom copper foil of the substrate. The circular holes of the bottom copper foil are all located between the four adjacent circular holes of the top copper foil of the substrate. The energy of the laser drilling machine is controlled to destroy the bottom copper foil of the substrate. S5. Remove the processed test substrate, adjust the magnification until the entire annular matrix can be seen on the microscope screen, and perform a visual inspection. S6. Determination of foreign object coverage on optical lenses: 1) There is a break in the copper ring: there is a copper foil connecting the middle copper cover and the outer copper surface to cover the resin in the middle of the substrate below; 2) Copper foil residue inside the copper ring: A small amount of copper foil on the middle copper cap was not completely cut off; 3) Copper foil residue on the outside of the copper ring: A small amount of copper foil on the outer copper surface was not completely cut off.

2. The rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine according to claim 1, characterized in that: During laser drilling, fluctuations in laser energy, focal length, and copper thickness of the test substrate cause variations in the outer diameter of the hole ring, with a tolerance of 'a'. The scanning accuracy of the scanning electron microscope in the laser drilling machine is 'b'. To ensure that there is no interference between the processed rings, the hole wall spacing between the two rings must be greater than or equal to 2a+2b. The effective laser spot diameter is 'c'. The outer diameter of the laser drilling ring is 0.09 mm, and the inner diameter is 0.09-2c.

3. The rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine according to claim 2, characterized in that: a = ±0.005mm, b = ±0.01mm, c = 0.015mm, the distance between the hole walls of the two rings must be greater than or equal to 2a + 2b = 2 * 0.005 + 2 * 0.01 = 0.03mm; the inner diameter of the laser-drilled ring is 0.09 - 2c = 0.09 - 0.015 * 2 = 0.06mm.

4. The rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine according to claim 3, characterized in that: The effective scanning working area of ​​the laser drilling machine scanning electron microscope is 45mm*45mm. The center of the laser-processed ring and the center of the hole are evenly distributed in an array with a distance of 0.12mm between them. The number of holes that can be distributed in each row or column is N. From 0.09*N+0.03*(N-1)=45, we get N=375.

25. Rounding N to 375, the number of holes that can be distributed within the effective scanning working area of ​​the laser drilling machine scanning electron microscope is 375*375=140625. Finally, a rectangular cutting groove is distributed around the entire array matrix.

5. The rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine according to claim 1, characterized in that: The thickness of the top copper foil and the bottom copper foil of the substrate is 12um, and the thickness of the resin in the middle of the substrate is 25um.

6. The rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine according to claim 1, characterized in that: Set the laser drilling parameters for the top copper foil of the substrate: energy 8μJ-12μJ; processing mode: circular cutting; cutting speed 150mm / s-250mm / s; number of circular cuts 1.01-2.01; circular diameter 0.09mm; compensation spot diameter 0.015mm.

7. The rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine according to claim 4, characterized in that: Let the rings processed by the top copper foil of the substrate be the first group of rings, and the rings processed by the bottom copper foil of the substrate be the second group of rings. The outer diameter of the second group of rings is tangent to the outer diameter of the first group of rings.

8. The rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine according to claim 7, characterized in that: The center of the second group of rings lies at the intersection of the lines connecting the four circular rings in the first group, which are arranged in a rectangular pattern. Simultaneously, the outer diameter of the second group of rings is tangent to the outer diameter of the first group of rings. D is set to 0.08 mm.

9. The rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine according to claim 8, characterized in that: The laser drilling parameters for the bottom copper foil of the substrate are set as follows: energy 8μJ-12μJ; processing mode: circular cutting; cutting speed 150mm / s-250mm / s; number of circular cuts 1.01-2.01 times; circular diameter 0.08mm; compensation spot diameter 0.015mm.

10. The rapid inspection method for the cleaning effect of optical lenses in a laser drilling machine according to claim 4, characterized in that: The test substrate has through holes at its four corners, with a diameter of 1.5mm-2.0mm. These through holes are used for the first set of rings to be scanned and processed after the alignment target is identified and positioned. After the rings of the top copper foil of the substrate are processed, the test substrate is flipped left and right along the Y-axis and placed on the laser drilling machine table. At the same time, the center coordinates of the second set of rings are mirrored along the Y-axis and the laser processing data is output. The four through holes are identified to scan and process the second set of rings after the alignment target is identified and positioned.

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