Handheld ultrasonic degumming shovel and degumming method

Abstract

The invention provides a handheld ultrasonic degumming shovel and a degumming method.The handheld ultrasonic degumming shovel comprises an ultrasonic generator, a handle and a shovel head, the ultrasonic generator is installed at the rear end of the handle, vibration generated when the ultrasonic generator works is conducted to the shovel head through a chuck, and the front end of the shovel head extends forwards to form a tooth shape; the shovel head is of a plate-shaped structure, and a flow guide groove is formed in the surface of one side of the plate-shaped structure from back to front in a concave mode. According to the invention, the structural design is reasonable, the cooperative design of ultrasonic vibration and the shovel head is utilized, a degumming agent can be effectively conveyed to the position of a slit, permeation and diffusion of the degumming agent in the slit are promoted, and cured epoxy resin in the slit can be effectively softened and removed. When the glue removing method is adopted for glue removing, especially for the slit position, the glue removing effect can be effectively improved, and the glue removing efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of adhesive removal equipment technology, and in particular to a handheld ultrasonic adhesive removal shovel and adhesive removal method. Background Technology

[0002] Epoxy resin (and other types of adhesives) are commonly used to bond two components together. After bonding, the gap between the two components is filled with adhesive, which cures to form a strong connection. In many cases, it is necessary to disassemble the bonded components, such as for chip rework, sensor mounting, or component disassembly.

[0003] Existing adhesive removers can soften and remove cured adhesive by dissolving it to a certain extent. However, once the adhesive in a slit has cured, its dissolution and diffusion with the outside environment can only occur through the very small area exposed in the slit. The adhesive remover needs to penetrate to a relatively deep area to loosen the cured adhesive, a process that often takes a long time and is often unsuccessful. For example, many structures use epoxy resin bonding, but the molecular structure of cured epoxy resin is very complex, with tightly entangled carbon chains, making it difficult to dissolve and remove using adhesive removers. Especially for epoxy resin present in slit structures, solvent molecules have difficulty diffusing into the interior of the slit, resulting in a very limited depth of softening effect.

[0004] Existing technologies, using strong acids and alkalis to prepare epoxy resin solvents, have limited application conditions, are not environmentally friendly, and pose certain dangers (Zou Yongjin, Cai Chenglong, Xiang Cuili, et al. A curing epoxy resin solvent and its application method: 201710274180[P][2025-05-06]. Wang Wei, Wang Jianping, Huang Hongwen. Epoxy resin dissolved and its preparation method. 2011[2025-05-06]. DOI:CN101649068 B.)

[0005] In some cases, parts can be heated to 200-400 degrees Celsius, causing the epoxy resin to crack and carbonize, thereby loosening the bonded structure. However, this method can cause thermal damage and is therefore difficult to use widely.

[0006] To address the aforementioned issues, it is necessary to continuously remove the softened, cured epoxy resin from the slit during the adhesive removal process, allowing the adhesive remover to continuously penetrate into the slit and gradually remove all the epoxy resin. Current rework processes use tweezers or blades to remove the softened epoxy resin. However, this method is inefficient and difficult to use for narrow slits.

[0007] In summary, there is currently a lack of safe, environmentally friendly, and effective methods for removing cured epoxy resin from slits. Summary of the Invention

[0008] The technical problem to be solved by the present invention is: in order to overcome the shortcomings of the prior art, the present invention provides a handheld ultrasonic adhesive removal spatula and adhesive removal method, which can promote the penetration and diffusion of adhesive removal agent in the slit, effectively perform soft and smooth adhesive removal operation on epoxy resin in the slit, and improve adhesive removal efficiency.

[0009] The technical solution adopted by the present invention to solve its technical problem is: a handheld ultrasonic adhesive removal spatula, including an ultrasonic generator, a handle and a spatula head. The front end of the handle is provided with a clamp that can extend and vibrate relative to the handle. The spatula head is fixed to the front end of the clamp. The ultrasonic generator is installed at the rear end of the handle. The vibration generated by the ultrasonic generator when it is working is transmitted to the spatula head through the clamp. The front end of the spatula head extends forward and has a toothed shape. The spatula head is a plate-shaped structure. A guide groove is recessed from back to front on one side surface of the plate-shaped structure.

[0010] In the above solution, a handheld ultrasonic adhesive removal spatula was designed to address the problem that the cured epoxy resin in the original slit is not easy to dissolve and remove. When removing adhesive, the spatula head can be inserted into the slit, and with the adhesive removal agent, the ultrasonic generator drives the spatula head to vibrate, which can effectively deliver the adhesive removal agent into the slit and promote the dissolution of the cured epoxy resin, effectively improving the adhesive removal efficiency and ensuring the adhesive removal effect.

[0011] Furthermore, the spatula head is equipped with a heating current lead solder joint and a thermocouple temperature sensing solder joint. The heating current lead solder joint is connected to a DC power supply, and the thermocouple temperature sensing solder joint is equipped with a thermocouple temperature sensor. The DC power supply can be used to heat the spatula head, further promoting the debonding process through temperature increase. The thermocouple temperature sensor provides a temperature control signal for the electric heating.

[0012] Furthermore, the plate-like structure of the shovel head is designed to be thicker at the rear and thinner at the front. This tapering design makes the front of the shovel head thinner, which is more conducive to its insertion into narrow slits for adhesive removal.

[0013] Preferably, the guide channel is a straight channel. The straight channel design allows the adhesive remover to be effectively guided when it is sprayed onto the shovel head, and the adhesive remover at the rear end of the guide channel is guided forward by the action of the ultrasonic generator.

[0014] Preferably, the guide channel is a serrated channel, which is formed by sequentially connecting several serrated cavities. The cross-section of each cavity along the plane of the plate-like structure is an isosceles trapezoid, with the upper base of the trapezoid located at the front end. The serrated channel design creates an imbalance in the liquid within the channel when the ultrasonic generator drives the shovel head to vibrate. When the shovel head vibrates backward, the liquid in the channel experiences a greater forward thrust; when the shovel head vibrates forward, the liquid in the channel experiences a smaller backward thrust. Overall, the serrated channel creates an effect of propelling the liquid forward.

[0015] Furthermore, since the guide channel itself has a thickness, while the shovel head is designed to be gradually thinner with the edge thickness approaching zero, if the guide channel is opened to the front end, it will cause the front tooth shape to be missing. Therefore, there is a gap between the channel wall at the front end of the guide channel and the tooth shape on the side edge of the front end of the shovel head.

[0016] Furthermore, the projected shape of the plate-like structure of the shovel head is rectangular, trapezoidal, or elliptical.

[0017] A method for removing adhesive using the aforementioned handheld ultrasonic adhesive remover has the following usage method: Step A: Insert the spatula into the narrow crevice where the adhesive needs to be removed; Step B: Apply adhesive remover to the slot and the shovel head; Step C: Turn on the handheld ultrasonic adhesive remover. The ultrasonic vibration drives the remover head to vibrate, moving the front edge of the remover head into the slit. The adhesive remover dissolves and cures the epoxy resin, which is then removed by the vibration of the remover head.

[0018] Furthermore, in the above-mentioned adhesive removal method, the shovel head is provided with a heating current wire solder joint and a thermocouple temperature measuring solder joint. The heating current wire solder joint is connected to a DC power supply, and the thermocouple temperature measuring solder joint is provided with a thermocouple temperature sensor. During the operation of steps B and C, the DC power supply powers and heats the shovel head, and the thermocouple temperature sensor is connected to the DC power supply signal. When the measured temperature is lower than the preset temperature, the DC power supply is controlled to heat the shovel head; when the measured temperature is greater than or equal to the preset temperature, the DC power supply is controlled to stop heating.

[0019] Preferably, in step B, the adhesive remover can be provided by spraying the adhesive remover onto the shovel head, or by directly immersing the slit to be removed into a container containing the adhesive remover.

[0020] The beneficial effects of this invention are that the handheld ultrasonic adhesive removal spatula provided by this invention has a reasonable structural design. Utilizing the coordinated design of ultrasonic vibration and the spatula head, it can effectively deliver the adhesive remover to the slit location, promoting the penetration and diffusion of the adhesive remover within the slit, facilitating the effective softening and removal of the cured epoxy resin within the slit. Using this adhesive removal method, especially for removing adhesive from slit locations, can effectively improve the adhesive removal effect and increase the adhesive removal efficiency. Attached Figure Description

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Figure 1 This is a schematic diagram of the structure of the handheld ultrasonic adhesive removal spatula (the casing is not shown) in this invention.

[0023] Figure 2 This is a schematic diagram of the structure of the handheld ultrasonic adhesive removal spatula (display housing) in this invention.

[0024] Figure 3 This is a perspective view of the shovel head with a straight channel in the handheld ultrasonic adhesive removal shovel of the present invention.

[0025] Figure 4 This is a perspective view of the shovel head with a serrated groove in the handheld ultrasonic adhesive removal shovel of the present invention.

[0026] Figure 5 This is a schematic diagram of different shaped shovel heads in the handheld ultrasonic adhesive removal shovel of the present invention.

[0027] Figure 6 This is a schematic diagram of the working state of the present invention when the adhesive is provided by spraying (the chassis is not shown).

[0028] Figure 7 This is a schematic diagram of the working state of the present invention when the container holds the adhesive remover (the chassis is not shown).

[0029] In the diagram: 1. Handle; 2. Clamp; 3. Shovel head; 4. Chassis; 5. Straight groove; 6. Toothed shape; 7. Serrated groove; 8. Heating current wire solder joint; 9. Thermocouple temperature measuring solder joint; 10. Spray nozzle; 11. Cured epoxy resin; 12. Adhesive remover. Detailed Implementation

[0030] The invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention in a schematic manner. Therefore, they only show the components relevant to the invention, and the orientations and references (e.g., up, down, left, right, etc.) are only used to aid in the description of the features in the drawings. Therefore, the following specific embodiments are not intended to be limiting, and the scope of the claimed subject matter is defined solely by the appended claims and their equivalents.

[0031] like Figure 1 and Figure 2 The handheld ultrasonic adhesive remover shown is an embodiment of the adhesive remover in this invention.

[0032] like Figure 1As shown, the handheld ultrasonic adhesive remover scraper includes an ultrasonic generator, a handle 1, and a scraper head 3. The handle 1 is the main structure of the adhesive remover scraper, and its front end is equipped with a clamp 2 that can extend and vibrate relative to the handle 1. The scraper head 3 is fixed to the front end of the clamp 2. The ultrasonic generator is installed at the rear end of the handle 1. The vibration generated by the ultrasonic generator when it is working is transmitted to the scraper head 3 through the clamp 2.

[0033] like Figure 2 As shown, in actual production, a chassis 4 is also required. The chassis 4 houses the ultrasonic control system, heating control system, and power supply system. The surface of the chassis 4 is equipped with an ultrasonic control panel and a heating control panel. The power supply system is connected to the ultrasonic generator circuitry. In the assembly of the ultrasonic generator, handle 1, and chuck 2, the ultrasonic generator is fixed to the rear end of the handle 1. The front end of the handle 1 and the chuck 2 can be positioned and assembled using a sleeve structure, ensuring that the chuck 2 can vibrate (telescopically displace) at high frequency relative to the front end of the handle 1 under the drive of the ultrasonic generator. The front end of the chuck 2 clamps the shovel head 3 and locks it in place using pins or bolts, thereby transmitting the high-frequency vibration to the position of the shovel head 3. This structure is based on an existing ultrasonic generator design and will not be described in detail.

[0034] like Figure 4 As shown, the shovel head 3 is equipped with a heating current lead wire solder joint 8 and a thermocouple temperature measuring solder joint 9. The heating current lead wire solder joint 8 is connected to a DC power supply, which is connected to the power system circuit inside the chassis 4 and controlled by the heating control system. To ensure safe use, the DC power supply must be selected with a voltage of 24V or below.

[0035] Thermocouple temperature sensing solder joint 9 is located at the rear end of the shovel head 3. A thermocouple temperature sensor is installed on thermocouple temperature sensing solder joint 9 to measure the temperature of the shovel head 3. The thermocouple temperature sensor is connected to the heating control system. The thermocouple temperature sensor senses the temperature of the shovel head 3 and transmits this temperature to the heating control system. The heating control system determines whether heating is needed based on the preset temperature, thereby providing a control signal for the DC power supply connected to the heating current wire solder joint 8 to turn the circuit on and off. The heating process uses PID control; that is, if the measured temperature is lower than the preset temperature, the current is turned on for heating; if the measured temperature is greater than or equal to the preset temperature, heating is stopped.

[0036] Based on the aforementioned main structure, the shovel head 3 is a component that operates in a narrow slit and requires further design improvements. In this embodiment, the shovel head 3 has a plate-like structure, with a toothed shape 6 extending forward from the front end. A guide groove is recessed from back to front on one side surface of the plate-like structure.

[0037] like Figure 5As shown, in actual design, the plate-like structure of the shovel head 3 can be designed according to needs. The projected shape of the plate-like structure can be rectangular, trapezoidal, elliptical, or other shapes. Different projected shapes of the shovel head 3 can be selected according to the different shapes of the slits and the positions where glue is to be applied.

[0038] like Figure 3 and Figure 4 As shown, in the thickness design of the shovel head 3, the thicknesses at both ends of the shovel head 3 can be equal or unequal. In this embodiment, it is preferable to adopt a plate-like structure of the shovel head 3 with a gradually thinning design, thicker at the rear end and thinner at the front end, with a thickness between 0.01mm and 0.9mm. The gradually thinning design makes the front end of the shovel head 3 thinner, which is more conducive to its insertion into the slit for adhesive removal. The material of the shovel head 3 should be a metal with both high strength and high toughness. Such materials can be, but are not limited to, stainless steel, nickel-based high-temperature alloys, hard alloys, constant elasticity precision alloys, bainitic steel, composite materials, etc. In this way, since the front end of the shovel head 3 gradually thins, and even the edge thickness gradually approaches zero, the front end of such a shovel head 3 can have sufficient elasticity, bendability, and recovery characteristics. When inserted into the slit, it can conform to the deformation of the small gap of the slit to effectively insert itself, and undergo slight deformation and repositioning actions with ultrasonic vibration, thereby further promoting the dissolution of the cured epoxy resin in the slit. The shovel head 3 is driven by ultrasonic waves to vibrate at a high frequency. The amplitude of this high-frequency vibration is very small and will not cause macroscopic damage to the parts.

[0039] In the design of the flow channel, the flow channel is designed to provide effective guidance for the adhesive remover on the surface of the shovel head 3.

[0040] like Figure 3 As shown, the guide channel can be designed as a straight channel 5. The design of the straight channel 5 can effectively guide the adhesive remover when it is sprayed on the shovel head 3, and guide the adhesive remover at the rear end of the guide channel forward under the action of the ultrasonic generator.

[0041] like Figure 4 As shown, the guide channel can also be designed as a serrated channel 7. The serrated channel 7 is formed by sequentially connecting several serrated cavities 6. The cross-section of each cavity along the plane of the plate-like structure is an isosceles trapezoid, with the upper base of the trapezoid located at the front end. The design of the serrated channel 7 creates an imbalance in the liquid within the channel when the ultrasonic generator drives the shovel head 3 to vibrate. When the shovel head 3 vibrates backward, the liquid in the channel experiences a greater forward thrust; when the shovel head 3 vibrates forward, the liquid in the channel experiences a smaller backward thrust. Overall, the serrated channel 7 creates a forward-propelling effect on the liquid flow. Compared to the straight channel 5, the serrated channel 7 has a better effect on propelling the adhesive remover towards the front end.

[0042] In the design of the guide channel and the shovel head 3, since the guide channel itself has a thickness (channel depth) and the shovel head 3 is a gradually thinning design with the edge thickness gradually approaching zero, if the guide channel is opened to the front end, the tooth shape 6 at the front end will be missing. Therefore, there is a gap between the channel wall at the front end of the guide channel and the tooth shape 6 at the front side edge of the shovel head 3.

[0043] Based on the aforementioned handheld ultrasonic adhesive removal spatula, this embodiment also provides an adhesive removal method: Step A: Insert the spatula 3 into the narrow slit where the adhesive needs to be removed.

[0044] Step B: Apply adhesive remover to the slot and scraper head 3. In this step, the adhesive remover can be applied by direct spraying or by using a container to hold the remover. For example... Figure 6 As shown, when the overall part is large and the narrow slit is inconvenient to move, a method of spraying adhesive remover onto the scraper head 3 can be used. For example... Figure 7 As shown, when the part is small and the slit position is movable, the slit to be degummed is directly immersed in a container containing the degumming agent.

[0045] Step C: Turn on the handheld ultrasonic adhesive remover scraper. The ultrasonic vibration drives the scraper head 3 to vibrate, moving the front edge of the scraper head 3 into the slit. The adhesive remover dissolves and cures the epoxy resin, which is then removed by the vibration of the scraper head 3.

[0046] In the process of removing adhesive using the above method, the adhesive removal methods can be further optimized according to the adhesive removal requirements. That is, during the operation of steps B and C, the adhesive removal spatula can be heated to improve the adhesive removal efficiency. Since step B involves immersing the narrow slit of the workpiece to be removed into a container containing adhesive remover, a heating device can be further used to heat the container containing adhesive remover or the adhesive remover inside the container during this adhesive removal process. This raises the overall temperature of the adhesive remover, which is more conducive to meeting the adhesive removal requirements and improving the adhesive removal effect.

[0047] This handheld ultrasonic adhesive removal spatula features a rationally designed structure. Addressing the problem of difficult-to-dissolve and remove cured epoxy resin in narrow slits, it utilizes the combined design of ultrasonic vibration and the spatula head 3. The ultrasonic generator drives the spatula head 3 to vibrate, effectively delivering the adhesive remover to the slit location, promoting its penetration and diffusion within the slit, facilitating the effective softening and removal of the cured epoxy resin. Furthermore, the toothed tip 6 of the spatula head 3, driven by ultrasonic vibration, more effectively loosens the cured resin than vibrating and piercing it within the slit, allowing for rapid removal of the softened epoxy resin. Using this adhesive removal method, especially for removing adhesive from narrow slits, can effectively improve the adhesive removal effect and efficiency.

[0048] It should be noted that the adhesive removal spatula and method in this embodiment are not only applicable to the removal of adhesives from cured epoxy resins, but also applicable to the removal of other types of adhesives, by simply replacing the adhesive with the appropriate adhesive remover for the type of adhesive.

[0049] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A hand-held ultrasonic glue removal spatula, characterized by: The utility model provides an ultrasonic wave degumming shovel, which comprises an ultrasonic wave generator, a handle and a shovel head, the front end of the handle is provided with a chuck capable of stretching and contracting vibration relative to the handle, the shovel head is fixed at the front end of the chuck, the rear end of the handle is provided with the ultrasonic wave generator, the chuck transmits the vibration generated by the ultrasonic wave generator to the shovel head, the front end of the shovel head extends forward and has a tooth shape, the shovel head has a plate structure, and a flow guide groove is formed on one side surface of the plate structure from the rear to the front.

2. The hand-held ultrasonic glue removal tool of claim 1, wherein: The shovel head is provided with a heating current wire welding point and a thermocouple temperature measurement welding point, the heating current wire welding point is connected with a direct current power supply, and the thermocouple temperature measurement welding point is provided with a thermocouple temperature measurement sensor.

3. The hand-held ultrasonic glue removal tool of claim 1, wherein: The plate structure of the shovel head is gradually thin from the rear end to the front end.

4. The hand-held ultrasonic adhesive removal tool of claim 1, wherein: The flow guide groove is a straight groove.

5. The hand-held ultrasonic gel removal probe of claim 1, wherein: The flow guide groove is a sawtooth groove, the sawtooth groove is formed by a plurality of sawtooth-shaped cavities connected in sequence, the cross section of the cavities along the plane of the plate structure is isosceles trapezoidal, and the upper base of the isosceles trapezoid is located at the front end.

6. The hand-held ultrasonic gel removal probe of claim 2, wherein: The gap between the groove wall at the front end of the flow guide groove and the tooth shape of the side edge at the front end of the shovel head.

7. The hand-held ultrasonic adhesive removal tool of claim 1, wherein: The projection shape of the plate structure of the shovel head is rectangular, trapezoidal or elliptical.

8. A method of removing glue, characterized by: The hand-held ultrasonic wave degumming shovel has the following use method: Step A, inserting the shovel head into a gap to be degummed; Step B, providing a degumming agent for the gap and the shovel head; Step C, turning on the hand-held ultrasonic wave degumming shovel, ultrasonic vibration, driving the shovel head to vibrate, moving the front end edge of the shovel head to the inside of the gap, dissolving the hardened epoxy resin with the degumming agent, and scraping off the degumming agent with the shovel head.

9. A method of removing glue as claimed in claim 8, wherein: The shovel head is provided with a heating current wire welding point and a thermocouple temperature measurement welding point, the heating current wire welding point is connected with a direct current power supply, and the thermocouple temperature measurement welding point is provided with a thermocouple temperature measurement sensor; during the working process of steps B and C, the direct current power supply supplies power to the shovel head and heats the shovel head, the thermocouple temperature measurement sensor is connected with the direct current power supply signal, the direct current power supply is controlled to heat the shovel head when the measured temperature is lower than the preset temperature, and the direct current power supply is controlled to stop heating when the measured temperature is greater than or equal to the preset temperature.

10. The method of claim 8, wherein: In step B, the degumming agent can be sprayed on the shovel head, or the gap to be degummed can be directly immersed in a container containing the degumming agent.

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