Apparatus and method for lifting a surface mass of a hemispherical resonator

Abstract

The application relates to a device and method for improving the surface quality of a hemispherical resonator, which comprises a hemispherical resonator and a support assembly for fixing the hemispherical resonator, and further comprises a grinding tool and a polishing ring for polishing the surface of the hemispherical resonator; the support assembly comprises a circular ring support and at least one set of positioning frames, the positioning frames are arranged on the circular ring support and are arranged on the side facing the grinding tool, the axis extension line of the grinding tool coincides with the axis of the circular ring support, the hemispherical resonator can be fixedly sleeved on the positioning frame, the inner polishing surface of the polishing ring is an arc surface which is matched with the outer surface of the hemispherical resonator, and the polishing ring is further connected with a driving assembly for driving the polishing ring to move along the polishing ring axis. The application ensures the uniformity and symmetry of material removal, significantly improves the surface shape precision and dynamic balance performance of the hemispherical resonator, and solves the problems of local uneven pressure, residual particles and uneven wear caused by the fact that the fixed grinding tool and the curved surface cannot be matched.

Description

Technical Field

[0001] This invention relates to the field of gyroscope technology, and in particular to a device and method for improving the surface quality of a hemispherical harmonic oscillator. Background Technology

[0002] The hemispherical resonator is a core component widely used in high-precision inertial navigation systems, optical devices, and aerospace fields. Its surface quality directly determines the overall performance and reliability of the device. To achieve an ultra-smooth, defect-free surface morphology, the hemispherical resonator typically requires precision polishing. Currently, common polishing methods mainly rely on the relative motion between a fixed grinding wheel and a fixedly clamped hemispherical resonator. By gradually bringing the grinding wheel closer to the workpiece surface and applying force, point-by-point or area-by-area grinding and polishing is performed on localized areas. Although this method can improve surface roughness to some extent, it is difficult to achieve dynamic fit between the grinding wheel shape and the hemispherical curvature. In actual processing, problems such as uneven polishing and inconsistent material removal rates are prone to occur, thus affecting the uniformity and accuracy of the final surface quality.

[0003] Existing polishing technologies have several shortcomings when dealing with precision workpieces like hemispherical resonators, which require high curvature and symmetry. First, fixed abrasive tools struggle to achieve adaptive fit across the entire curvature range of the hemispherical surface, leading to uneven contact pressure distribution during polishing. This can result in over- or under-polishing in localized areas and potentially cause micro-defects due to abrasive residue. Second, when the resonator itself has initial asymmetric morphology or uneven surface roughness distribution, fixed-path or fixed-parameter polishing processes cannot compensate for morphological deviations in real time; instead, they may amplify the asymmetry, affecting the dynamic balance performance of the hemispherical resonator. Furthermore, traditional unilateral or asynchronous polishing methods cannot guarantee the symmetry of the polishing force relative to the workpiece axis, easily introducing additional geometric errors and hindering uniform material removal centered on the axis. This restricts further improvements in the overall surface accuracy and consistency of the hemispherical resonator. Therefore, a polishing device capable of adapting to curvature changes and synchronously controlling the polishing path and force distribution is urgently needed to overcome these limitations. Summary of the Invention

[0004] In order to solve the above-mentioned technical problems, the present invention provides an apparatus and method for improving the surface quality of a hemispherical harmonic oscillator.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] An apparatus for improving the surface quality of a hemispherical resonator includes a hemispherical resonator and a support assembly for fixing the hemispherical resonator. It also includes an abrasive tool and a polishing ring for polishing the surface of the hemispherical resonator. The support assembly includes a circular support and at least one set of positioning frames. The positioning frames are disposed on the circular support and face the abrasive tool. The extended axis of the abrasive tool coincides with the axis of the circular support. The positioning frames are rotatably mounted on the circular support. The hemispherical resonator is fixedly sleeved on the positioning frames and rotates around its own axis. The inner polishing surface of the polishing ring is an arc surface that conforms to the outer surface of the hemispherical resonator. A drive assembly for driving the polishing ring to move axially along the polishing ring is also connected to the polishing ring.

[0007] Furthermore, the annular support has a frustum on the side facing the grinding mold, and the positioning frame is disposed on the inclined surface of the frustum. The positioning frame is also provided with a clamping component for holding the hemispherical resonator. The inclined surface of the frustum ensures that the axis of the hemispherical resonator fixed on the positioning frame forms a pre-alignment angle with the main axis of the annular support, simplifying the assembly and adjustment process. The clamping component ensures radial clamping force, ensuring that no displacement or vibration occurs during subsequent high-speed rotation and stress polishing.

[0008] Furthermore, the positioning frame is provided in three sets, with the three sets of positioning frames arranged at equal intervals along the inclined surface of the frustum. Each hemispherical resonator mounted on any of the positioning frames is in contact with the inner polishing surface of the polishing ring. Simultaneous clamping of three hemispherical resonators for parallel processing can greatly improve production capacity. In addition, the three workpieces, while rotating, are symmetrically distributed at 120 degrees around the same axis, forming a dynamic balance system. This layout can mutually cancel and absorb the periodic radial forces or minor vibrations that may be generated by a single workpiece during polishing, providing a more stable processing environment for each workpiece than a single-station process. By using the mechanical balance of the system to suppress and reduce the impact of individual workpiece differences on the processing process, the consistency of accuracy during batch processing is improved.

[0009] Furthermore, the hemispherical resonator includes a central shaft disposed on its axis, and the positioning frame is provided with positioning mounting holes for inserting and fixing the central shaft. The hemispherical resonator includes a hemispherical shell and a central shaft disposed on its inner arc surface. The axis of the hemispherical shell coincides with the axis of the central shaft. A polishing ring is used to adhere to the outer surface of the hemispherical shell and perform circumferential axial polishing. The grinding wheel contacts the periphery of the hemispherical shell and performs rotational grinding, while also serving a limiting function to prevent the axis of the hemispherical shell from shifting due to grinding by the polishing surface. The polishing and grinding steps do not interfere with each other and are performed synchronously. Through synchronous and coordinated material removal from the outer surface, the overall wall thickness uniformity and symmetry of the hemispherical resonator can be better maintained and corrected.

[0010] Furthermore, a positioning rod is connected to the back of the annular support, and a first drive mechanism for controlling the rotation of the positioning frame is provided inside the annular support. The first drive mechanism is connected to a power supply unit via the positioning rod. By driving the rotation of the positioning frame, one or more hemispherical resonators fixed on it rotate synchronously. The hemispherical resonators move at a constant speed and rotation around their own main axis, so that the entire spherical surface of the hemispherical resonator can be evenly exposed in the action area of ​​the polishing ring and the abrasive, ensuring that the polishing force can cover the entire surface of the workpiece, rather than just a local area. Continuous rotation not only breaks the limitations of fixed-point polishing, but also achieves global uniform material removal, eliminates local over- or under-polishing, and ultimately obtains a highly symmetrical spherical morphology.

[0011] Furthermore, the drive assembly includes at least one set of slide grooves and slide blocks. The channel of the slide groove is parallel to the axis of the polishing ring, and the slide block is fixedly connected to the bottom of the polishing ring. A reciprocating screw is provided on the slide groove to control the movement of the slide block along the channel. The cooperation between the slide groove and the slide block ensures that the polishing ring has no radial wobble during movement, only a preset axial degree of freedom. The reciprocating screw converts the rotational motion of the second drive mechanism into linear reciprocating motion, enabling the inner polishing surface of the polishing ring to reciprocate along the generatrix direction of the outer surface of the hemispherical harmonic oscillator. The axial scanning motion combined with the rotational motion of the workpiece forms a two-dimensional relative motion trajectory, allowing the polishing ring to dynamically conform to the entire outer curved surface of the hemispherical surface, achieving uniform and continuous polishing coverage of the outer surface.

[0012] Furthermore, the slide is equipped with a second drive mechanism connected to a reciprocating screw. This second drive mechanism controls the reciprocating motion of the slide by rotating the motor forward and backward. By controlling the forward and reverse rotation of the motor, the reciprocating screw can be driven to move the polishing ring in a stable reciprocating motion within a preset stroke. The operator can flexibly adjust the reciprocating motion parameters according to the material of the hemispherical harmonic oscillator, the initial surface condition, and the final quality requirements to optimize polishing efficiency and effect. The controllable axial motion enables the polishing process to be dynamically adaptable, better handling the minute undulations on the workpiece surface, achieving fine and controllable material removal, thereby improving polishing accuracy and surface quality uniformity.

[0013] Furthermore, the grinding wheel is connected to an external third drive mechanism via a connecting shaft. This third drive mechanism drives the grinding wheel to grind the circumferential surface of the hemispherical resonator. The force exerted by the grinding wheel on the hemispherical resonator and the force exerted by the polishing ring on the hemispherical resonator are located on opposite sides of the hemispherical resonator's own axis, thus balancing part of the force exerted by the polishing ring. The grinding wheel continuously grinds the circumference of the hemispherical resonator, transforming traditional static or single-point contact polishing into dynamic contact polishing, improving polishing efficiency and surface uniformity. The combination of the rotating grinding wheel and the rotating workpiece helps to break up debris generated during the polishing process, preventing particle residue from scratching the surface.

[0014] A method for operating a device for improving the surface quality of a hemispherical harmonic oscillator includes the following steps:

[0015] S1: Fix the hemispherical resonator to the positioning frame of the support assembly and hold it in place. Adjust the position of the polishing ring so that its inner polishing surface is in close contact with the outer surface of the hemispherical resonator.

[0016] S2: Start the drive assembly and grinding wheel, so that the polishing ring begins to reciprocate along its axial direction under the drive of the drive assembly, while the grinding wheel rotates at the same time;

[0017] S3: The drive component drives the polishing ring to perform stable axial reciprocating motion along a preset trajectory to uniformly polish the outer surface of the hemispherical harmonic oscillator.

[0018] S4: The positioning frame rotates to drive the hemispherical harmonic oscillator to rotate synchronously and uniformly. At the same time, it keeps the grinding tool rotating and makes its grinding surface contact the circumferential surface of the hemispherical harmonic oscillator, so as to grind the circumferential surface of the hemispherical harmonic oscillator and play a role in balancing part of the polishing ring force.

[0019] S5: When the polishing reaches the preset time or surface quality requirements, stop the grinding wheel, positioning frame and drive assembly in sequence, remove the polishing ring and grinding wheel, loosen the clamping parts, and remove the finished hemispherical resonator from the positioning frame.

[0020] Furthermore, in step S1 above, the three hemispherical resonators are placed on three positioning frames simultaneously. Synchronous grinding improves production efficiency, and the balanced structure formed by the three hemispherical resonators can further improve the grinding accuracy of each independent hemispherical resonator, avoiding the bias force acting on a single hemispherical resonator during the grinding process.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. This invention achieves a symmetrical polishing force distribution and effectively avoids local over-grinding or uneven material removal caused by asymmetrical initial shape or unilateral force application by setting a double-sided synchronous polishing structure with the workpiece axis as the center of symmetry, namely an inner rotating grinding wheel and an outer axially movable polishing ring. It addresses the accuracy deviation problem caused by the asymmetry of the resonator itself and unilateral polishing by synchronous processing around the axis, ensuring the uniformity and symmetry of material removal, and significantly improving the surface accuracy and dynamic balance performance of the hemispherical resonator.

[0023] 2. This invention solves the problems of uneven local pressure, residual particles and uneven wear caused by the inability of the fixed abrasive and the curved surface to fit perfectly together by setting a polishing ring and its driving components that can reciprocate stably along its own axis.

[0024] 3. By setting up a rotating multi-station support assembly that can simultaneously clamp multiple hemispherical resonators, this invention can simultaneously polish multiple workpieces and improve the processing stability of a single workpiece by utilizing the mechanical balance formed by the multiple workpieces surrounding each other. This not only greatly improves production efficiency, but also the symmetrical distribution and synchronous rotation of multiple workpieces form a stable processing system that can effectively suppress and disperse vibration and deflection forces during the polishing process, providing a more stable polishing environment for each independent workpiece and further ensuring the consistency of processing accuracy. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the present invention;

[0026] Figure 2 This is a three-dimensional schematic diagram of the present invention;

[0027] Figure 3 This is a schematic diagram of the polishing ring in Example 4;

[0028] Attached diagram labels: 1-Hemispherical resonator, 2-Grinding tool, 3-Polishing ring, 4-Circular ring support, 5-Positioning frame, 6-Frustum, 7-Securing component, 8-Positioning rod, 9-Slide groove, 10-Slide seat, 11-Reciprocating lead screw, 12-Connecting shaft, 13-Raised grinding component. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0030] Example 1, as Figure 1 , 2 As shown, the present invention discloses a device for improving the surface quality of a hemispherical resonator, comprising a hemispherical resonator 1 and a support assembly for fixing the hemispherical resonator 1, and further comprising an abrasive 2 and a polishing ring 3 for polishing the surface of the hemispherical resonator 1. The support assembly includes a circular support 4 and at least one set of positioning frames 5. The positioning frames 5 are disposed on the circular support 4 and are disposed on the side facing the abrasive 2. The extended line of the axis of the abrasive 2 coincides with the axis of the circular support 4. The positioning frames 5 are rotatably disposed on the circular support 4. The hemispherical resonator 1 is fixedly sleeved on the positioning frames 5 and rotates around its own axis. The inner polishing surface of the polishing ring 3 is an arc surface that fits against the outer surface of the hemispherical resonator 1. The polishing ring 3 is also connected to a drive assembly for driving it to move along the axial direction of the polishing ring 3.

[0031] The annular support 4 has a frustum 6 on the side facing the grinding mold 2. The positioning frame 5 is disposed on the inclined surface of the frustum 6, and the positioning frame 5 is also provided with a clamping member 7 for holding the hemispherical resonator 1. Specifically, the inclined surface of the frustum 6 makes the axis of the hemispherical resonator 1 fixed on the positioning frame 5 form a pre-alignment angle with the main axis of the annular support 4, simplifying the assembly and adjustment. The clamping member 7 ensures radial clamping force, ensuring that no displacement or vibration occurs during subsequent high-speed rotation and force polishing. Preferably, the angle between the axis of the positioning frame 5 and the circular support 4, and the angle between the positioning frame 5 and the polishing ring 3, are pre-adjusted to a suitable fixed angle according to the structural shape of the hemispherical resonator 1. That is, after the hemispherical resonator 1 is installed on the positioning frame 5, the two end faces of the hemispherical resonator 1 are tangent (fitting) to the inner polishing surface of the polishing ring 3 and the grinding surface of the grinding tool 2, respectively, to ensure that when the hemispherical resonator 1 is between the grinding tool 2 and the polishing ring 3, the two end faces of the hemispherical resonator 1 are polished and ground synchronously.

[0032] The positioning frame 5 is provided in three sets, with the three sets of positioning frames 5 arranged at equal intervals along the inclined surface of the frustum 6. Each hemispherical resonator 1 mounted on any of the positioning frames 5 is in contact with the inner polishing surface of the polishing ring 3. Specifically, simultaneously clamping three hemispherical resonators 1 for parallel processing can greatly improve production capacity. Furthermore, the three workpieces, in a rotating state, are symmetrically distributed at 120 degrees around the same axis, forming a dynamic balance system. This layout can mutually cancel and absorb the periodic radial forces or minor vibrations that may be generated by a single workpiece during polishing, providing each workpiece with a more stable and less disruptive processing environment than a single-station process. By using the mechanical balance of the system to suppress and reduce the impact of individual workpiece differences on the processing process, the consistency of accuracy during batch processing is improved.

[0033] The hemispherical resonator 1 includes a central shaft disposed on its axis, and the positioning frame 5 is provided with positioning mounting holes for inserting and fixing the central shaft. Specifically, the hemispherical resonator 1 includes a hemispherical shell and a central shaft disposed on its inner arc surface. The axis of the hemispherical shell coincides with the axis of the central shaft. The polishing ring 3 is used to adhere to the outer surface of the hemispherical shell and perform circumferential axial polishing. The grinding wheel 2 contacts the periphery of the hemispherical shell and performs rotational grinding, while also serving a limiting function to prevent the axis of the hemispherical shell from shifting due to the polishing surface grinding. The polishing and grinding steps do not interfere with each other and are performed synchronously. Through synchronous and coordinated material removal from the outer surface, the overall wall thickness uniformity and symmetry of the hemispherical resonator 1 can be better maintained and corrected.

[0034] The back of the annular support 4 is connected to a positioning rod 8. A first drive mechanism for controlling the rotation of the positioning frame 5 is installed inside the annular support 4. The first drive mechanism is externally connected to a power supply unit via the positioning rod 8. Specifically, by driving the positioning frame 5 to rotate, one or more hemispherical resonators 1 fixed on it rotate synchronously. The hemispherical resonators 1 move at a constant speed and rotate around their own main axis, ensuring that the entire spherical surface of the hemispherical resonator 1 is evenly exposed within the working area of ​​the polishing ring 3 and the abrasive tool 2. This ensures that the polishing force covers the entire surface of the workpiece, not just a localized area. Continuous rotation not only breaks the limitations of fixed-point polishing but also achieves globally uniform material removal, eliminates localized over- or under-polishing, and ultimately obtains a highly symmetrical spherical surface morphology.

[0035] The driving assembly includes at least one set of slide grooves 9 and slide blocks 10. The channel of the slide groove 9 is parallel to the axis of the polishing ring 3. The slide block 10 is fixedly connected to the bottom of the polishing ring 3. A reciprocating screw 11 is provided on the slide groove 9 to control the movement of the slide block 10 along the channel. Specifically, the cooperation between the slide groove 9 and the slide block 10 ensures that the polishing ring 3 has no radial wobble during movement, only a preset axial degree of freedom. The reciprocating screw 11 converts the rotational motion of the second driving mechanism into linear reciprocating motion, enabling the inner polishing surface of the polishing ring 3 to reciprocate along the generatrix direction of the outer surface of the hemispherical harmonic oscillator 1. The axial scanning motion combined with the rotational motion of the workpiece forms a two-dimensional relative motion trajectory, allowing the polishing ring 3 to dynamically conform to the entire outer curved surface of the hemispherical surface, achieving uniform and continuous polishing coverage of the outer surface. Preferably, both the upper and lower end faces of the polishing ring 3 are connected to control slide blocks 10, making the movement more stable.

[0036] The slide block 10 is equipped with a second drive mechanism connected to the reciprocating screw 11. The second drive mechanism controls the reciprocating motion of the slide block 10 by forward and reverse rotation. Specifically, by controlling the forward and reverse rotation of the motor, the reciprocating screw 11 can be driven to drive the polishing ring 3 to reciprocate stably within a preset stroke. The operator can flexibly adjust the reciprocating motion parameters according to the material of the hemispherical harmonic oscillator 1, the initial surface condition, and the final quality requirements to optimize polishing efficiency and effect. The controllable axial motion makes the polishing process dynamically adaptable, better able to cope with the small undulations on the workpiece surface, achieve fine and controllable material removal, and thus improve polishing accuracy and surface quality uniformity.

[0037] The grinding wheel 2 is connected to an external third drive mechanism via a connecting shaft 12. The third drive mechanism drives the grinding wheel 2 to grind the circumferential surface of the hemispherical resonator 1. The force exerted by the grinding wheel 2 on the hemispherical resonator 1 and the force exerted by the polishing ring 3 on the hemispherical resonator 1 are located on opposite sides of the axis of the hemispherical resonator 1, thus balancing part of the force exerted by the polishing ring 3. Specifically, the grinding wheel 2 continuously grinds the circumference of the hemispherical resonator 1, transforming traditional static or single-point contact polishing into dynamic contact polishing, improving polishing efficiency and surface uniformity. The combination of the rotating grinding wheel 2 and the rotating workpiece helps to break up debris generated during the polishing process, preventing particle residue from scratching the surface.

[0038] Example 2, based on Example 1, proposes an operating method for a device used to improve the surface quality of a hemispherical harmonic oscillator, including the following steps:

[0039] S1: Fix the hemispherical resonator 1 onto the positioning frame 5 of the support assembly and hold it in place. Adjust the position of the polishing ring 3 so that its inner polishing surface is in close contact with the outer surface of the hemispherical resonator.

[0040] S2: Start the drive assembly and grinding wheel 2, so that the polishing ring 3 begins to reciprocate along its axial direction under the drive of the drive assembly, while the grinding wheel 2 rotates.

[0041] S3: The drive component drives the polishing ring 3 to perform stable axial reciprocating motion along a preset trajectory to uniformly polish the outer surface of the hemispherical harmonic oscillator 1.

[0042] S4: The positioning frame 5 rotates to drive the hemispherical harmonic oscillator 1 to rotate synchronously and uniformly. At the same time, the grinding tool 2 is kept rotating and its grinding surface is in contact with the circumferential surface of the hemispherical harmonic oscillator 1, so as to grind the circumferential surface of the hemispherical harmonic oscillator 1 and balance part of the force of the polishing ring 3.

[0043] S5: When the polishing reaches the preset time or surface quality requirements, stop the grinding wheel 2, the positioning frame 5 and the drive assembly in sequence, remove the polishing ring 3 from the grinding wheel 2, loosen the clamping part 7, and remove the finished hemispherical resonator 1 from the positioning frame 5.

[0044] In step S1 above, three hemispherical resonators 1 are placed on three positioning frames 5 at the same time. Synchronous grinding improves production efficiency. At the same time, the balanced structure formed by the three hemispherical resonators 1 can further improve the grinding accuracy of each independent hemispherical resonator 1 and avoid the single hemispherical resonator 1 being subjected to bias force during the grinding process.

[0045] Example 3, based on Example 2, proposes specific steps for operating a device for improving the surface quality of a hemispherical harmonic oscillator.

[0046] S1: The hemispherical resonator 1 is fitted onto the positioning frame 5 and radially secured by the clamping member 7. This ensures that the hemispherical resonator 1 will not shift or vibrate during subsequent high-speed rotation and force-driven polishing. Then, the position of the polishing ring 3 is adjusted so that its inner polishing surface is in close contact with the outer surface of the hemispherical resonator 1. Preferably, three hemispherical resonators 1 can be simultaneously mounted on three equally spaced positioning frames 5. The three hemispherical resonators 1 are symmetrically distributed around the main axis at 120 degrees, forming a dynamically stable structure. During subsequent rotary polishing, this structure effectively cancels out and absorbs the periodic radial interference forces generated by surface unevenness or instantaneous differences in material removal, providing a more stable and interference-resistant processing environment for each independent hemispherical resonator 1, thereby improving the consistency of overall polishing accuracy at the system level.

[0047] S2: After clamping and alignment, the third drive mechanism is activated to rotate the grinding wheel 2, and simultaneously the second drive mechanism is activated to drive the polishing ring 3 to reciprocate along its own axis. This allows the two main polishing components (the rotating grinding wheel 2 and the axially reciprocating polishing ring 3) to rotate and enter a stable working state before the workpiece. This ensures that when the workpiece begins to rotate, its outer and circumferential surfaces are subjected to uniform and continuous dynamic polishing and grinding, avoiding the impact of moving from a stationary position to contact, making the polishing process more stable and controllable. At this stage, the operator can preset and fine-tune key process parameters such as the rotational speed of the grinding wheel 2 and the reciprocating stroke and frequency of the polishing ring 3 according to the workpiece material characteristics and initial surface roughness.

[0048] S3: The drive component, according to preset parameters, drives the polishing ring 3 to perform a stable linear reciprocating motion along the slide groove 9. The polishing surface of the polishing ring 3 can dynamically adapt to the contour changes of the hemispherical surface, making the pressure distribution in the polishing contact area more uniform. The axial scanning motion realizes traversal polishing of the entire outer surface, effectively avoiding local over-grinding or under-grinding, and promotes the uniform distribution and operation of the polishing medium (such as polishing paste), thereby significantly improving the surface shape accuracy and surface finish uniformity of the outer surface.

[0049] S4: The first drive mechanism is activated, and the positioning frame 5 drives the hemispherical resonator 1, which is already clamped on it, to rotate at a constant speed around its own main axis. At this time, the system enters a fully dynamic working state. The workpiece rotates at a constant speed, and the rotation of the grinding wheel 2 continuously grinds the end face of the workpiece. At the same time, the polishing ring 3 steadily reciprocates along the axial direction to scan and polish the outer surface of the workpiece. This breaks through the limitations of traditional local and fixed-path polishing, and can not only efficiently eliminate surface micro-irregularities, but also actively correct any initial wall thickness unevenness or asymmetric morphology that may exist in the workpiece through synchronous and coordinated processing of the inner and outer surfaces, ensuring the dynamic balance of the hemispherical resonator 1.

[0050] S5: After polishing reaches the preset process time or meets the surface quality requirements (such as achieving the target roughness Ra value and surface accuracy PV value) through online detection, first stop the third drive mechanism driving the abrasive 2 and the first drive mechanism driving the workpiece rotation, then stop the second drive mechanism driving the reciprocating motion of the polishing ring 3. After all movements have completely stopped, remove the polishing ring 3 and the abrasive 2 from the workpiece surface. Finally, loosen the clamping parts 7 on each positioning frame 5 and remove the finished hemispherical resonator 1 from the device. The entire process is completed, then reset and prepare for the next round of processing.

[0051] Example 4: Based on Example 2, this example proposes an optimized structure for the polishing ring of a device for improving the surface quality of a hemispherical harmonic oscillator.

[0052] like Figure 3 As shown, the inner circumferential surface of the polishing ring 3 is provided with an opening groove communicating with the inner cavity. A raised grinding element 13, connected by a control component, is provided on the opening groove. Under the control of the control component, the raised grinding element 13 periodically extends and retracts to adaptively grind the polishing surface of the hemispherical resonator 1. Specifically, during the horizontal movement of the polishing ring 3, the position of the raised grinding element 13 acting on the surface of the hemispherical resonator 1 changes. At this time, the extension and retraction of the raised grinding element 13 can adaptively adjust and abut against the surface of the hemispherical resonator 1, ensuring contact and grinding function at different positions. The raised grinding element 13 includes several raised grinding elements 13 continuously arranged along the opening groove. Under the action of the driving device, these raised grinding elements 13 periodically move towards and away from the axis of the polishing ring 3, realizing the shrinking and expanding of the ring surface, thereby achieving the polishing function. Preferably, the extension and retraction of the raised grinding element 13 correspond to the horizontal movement cycle of the polishing ring 3. That is, when the polishing ring 3 moves towards the grinding tool 2, the raised grinding element 13 gradually changes from a retracted state to an extended state. When the polishing ring 3 is closest to the grinding tool 2, the protrusion distance of the raised grinding element 13 reaches its maximum value. This ensures that the force exerted by the raised grinding element 13 and the hemispherical harmonic oscillator 1 is equal at different contact positions, avoiding uneven polishing and grinding caused by changes in contact pressure, which would affect the grinding effect.

[0053] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A device for improving the surface quality of a hemispherical resonator, comprising a hemispherical resonator (1) and a support assembly for fixing the hemispherical resonator (1), characterized in that: It also includes an abrasive (2) and a polishing ring (3) for polishing the surface of the hemispherical resonator (1). The support assembly includes a circular support (4) and at least one set of positioning frames (5). The positioning frames (5) are set on the circular support (4) and facing the side of the abrasive (2). The extension line of the axis of the abrasive (2) coincides with the axis of the circular support (4). The positioning frames (5) are rotatably set on the circular support (4). The hemispherical resonator (1) is fixedly sleeved on the positioning frames (5) and rotates around its own axis. The inner polishing surface of the polishing ring (3) is an arc surface that fits against the outer surface of the hemispherical resonator (1). The polishing ring (3) is also connected to a drive assembly for driving it to move along the axial direction of the polishing ring (3). The circular support (4) has a frustum (6) on the side facing the grinding tool (2). The positioning frame (5) is set on the inclined surface of the frustum (6). The positioning frame (5) is also provided with a clamping member (7) for holding the hemispherical resonator (1). There are three sets of positioning frames (5). The three sets of positioning frames (5) are arranged at equal intervals along the inclined surface of the frustum (6). The hemispherical resonator (1) assembled on any positioning frame (5) is in contact with the inner polishing surface of the polishing ring (3). The hemispherical resonator (1) includes a central shaft set on its axis. The positioning frame (5) is provided with a positioning mounting hole for inserting and fixing the central shaft. The circular support (4) is provided with a first drive mechanism for controlling the rotation of the positioning frame (5). The drive assembly includes at least one set of slide grooves (9) and slide blocks (10). The channel of the slide groove (9) is parallel to the axis of the polishing ring (3). The slide block (10) is fixedly connected to the bottom of the polishing ring (3). The slide groove (9) is provided with a reciprocating screw (11) for controlling the slide block (10) to move along the channel. The grinding wheel (2) is connected to the external third drive mechanism through the connecting shaft (12). The third drive mechanism drives the grinding wheel (2) to rotate and polish the circumferential surface of the hemispherical resonator (1). The force of the grinding wheel (2) on the hemispherical resonator (1) and the force of the polishing ring (3) on the hemispherical resonator (1) are located on both sides of the axis of the hemispherical resonator (1), which plays a role in balancing part of the force of the polishing ring (3).

2. The device for improving the surface quality of a hemispherical harmonic oscillator according to claim 1, characterized in that: The back of the circular support (4) is connected to a positioning rod (8), and the first drive mechanism is connected to a power supply unit via the positioning rod (8).

3. The device for improving the surface quality of a hemispherical harmonic oscillator according to claim 1, characterized in that: The slide (10) is provided with a second drive mechanism connected to the reciprocating screw (11). The second drive mechanism controls the reciprocating motion of the slide (10) by forward and reverse rotation.

4. A method of operating the apparatus for improving the surface quality of a hemispherical harmonic oscillator according to any one of claims 1-3, characterized in that, Includes the following steps: S1: Fix the hemispherical resonator (1) on the positioning frame (5) of the support assembly and hold it in place. Adjust the position of the polishing ring (3) so that its inner polishing surface is in close contact with the outer surface of the hemispherical resonator. S2: Start the drive assembly and the grinding wheel (2) so that the polishing ring (3) starts to reciprocate along its axis under the drive of the drive assembly, while the grinding wheel (2) rotates. S3: The drive component drives the polishing ring (3) to perform stable axial reciprocating motion along the preset trajectory to uniformly polish the outer surface of the hemispherical harmonic oscillator (1); S4: The positioning frame (5) rotates to drive the hemispherical harmonic oscillator (1) to rotate synchronously and uniformly. At the same time, the grinding tool (2) is kept rotating and its grinding surface is in contact with the circumferential surface of the hemispherical harmonic oscillator (1), so as to grind the circumferential surface of the hemispherical harmonic oscillator (1) and balance the force of the polishing ring (3). S5: When the polishing reaches the preset time or surface quality requirements, stop the grinding wheel (2), positioning frame (5) and drive assembly in sequence, remove the polishing ring (3) and grinding wheel (2), loosen the clamping part (7), and remove the finished hemispherical resonator (1) from the positioning frame (5).

5. The operating method according to claim 4, characterized in that, In step S1 above, three hemispherical resonators (1) are placed on three positioning frames (5) at the same time. The production efficiency is improved by synchronous grinding. At the same time, the balanced structure formed by the three hemispherical resonators (1) can further improve the grinding accuracy of each independent hemispherical resonator (1) and avoid the single hemispherical resonator (1) being subjected to bias force during the grinding process.

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