Hole-filling slurry as well as preparation method and application thereof

Abstract

The invention provides a pore-filling slurry and a preparation method and application thereof, and relates to the technical field of electronic packaging, the pore-filling slurry comprises the following components by mass: 13-25 parts of an organic carrier; 73 to 86 parts of inorganic powder; the inorganic powder is composed of oxide ceramic and non-oxide ceramic; the mass of the non-oxide ceramic accounts for 1%-3% of the mass of the inorganic powder; the oxide ceramics are aluminum oxide and zirconium oxide; the non-oxide ceramic is selected from one or more of silicon carbide, boron nitride and boron carbide. The pore-filling slurry provided by the invention is not sintered at annealing and sintering temperatures, for example, after the pore-filling slurry is filled into a glass substrate and a green ceramic through hole, the deformation of the substrate through hole and the shrinkage of the green ceramic through hole can be prevented in the annealing / sintering process. Moreover, the non-oxide ceramic powder can generate gas under a high-temperature condition, so that the slurry is fluffy and easy to remove after annealing / sintering.

Description

Technical Field

[0001] This invention relates to the field of electronic packaging technology, and in particular to a hole-filling paste, its preparation method, and its application. Background Technology

[0002] Glass substrates are used as circuit board carriers and for 3D chip packaging, making them a hot research topic in the field of electronic packaging. Since the 1990s, organic packaging has occupied a significant market share. Epoxy molding compounds, commonly used in semiconductor chip packaging, require multiple high-temperature treatments during manufacturing, significantly impacting the yield and lifespan of packaged products. Furthermore, as chip circuits become more complex and power consumption increases, organic substrates are reaching their capacity limits. Through-silicon vias (TSVs) allow for the vertical packaging of multiple chips, interconnecting them vertically, thus greatly improving integration. However, silicon, being a semiconductor, exhibits high crosstalk and signal loss in high-frequency applications, reducing system reliability. Using glass substrates as carriers, through-glass via (TGV) technology has been developed. Its application is similar to TSV, while offering advantages such as good stability and low signal transmission loss, making it one of the main research directions in the current packaging materials field. However, TGV also suffers from problems such as high brittleness, inability to achieve multi-layer high-density interconnection, and difficulties in via fabrication.

[0003] Currently, commonly used methods for creating through-holes in glass substrates include sandblasting, ultrasonic drilling, wet etching, plasma etching, focused discharge machining, electrochemical discharge machining, laser-induced etching, and laser ablation. Most of these methods suffer from low efficiency, large through-hole roughness, poor perpendicularity, and high cost. Laser ablation is simple and low-cost, and can produce high-density through-holes, but the edges of the holes are prone to microcracks, and the holes are easily deformed after annealing. The difficulty in through-hole fabrication is one of the main problems limiting the application of TGV (Transient Voltage Vaporizer). Furthermore, LTCC (Low Temperature Co-fired Ceramic) materials also require through-hole structures. However, due to the typically high shrinkage rate of LTCC (8%-15%), not only are the through-hole sizes inconsistent before and after sintering, but the fabrication of ultra-high density ceramic multi-chip modules, thick-film hybrid multi-chip modules, and precision microwave transmission lines becomes extremely difficult, and it has a very negative impact on chip alignment and the reliability of electronic products. Therefore, ensuring that the through-hole structure does not deform or shrink after substrate annealing and sintering is of significant practical value. Summary of the Invention

[0004] This invention provides a hole-filling slurry, its preparation method, and its application, to solve the defects of easy deformation and shrinkage of through-hole structures after substrate annealing and sintering in the prior art, so as to ensure that the through-hole structure does not deform or shrink after substrate annealing and sintering.

[0005] This invention provides a pore-filling slurry, which, by weight, comprises the following components: 13-25 parts of organic carrier; 73-86 parts of inorganic powder; The inorganic powder is composed of oxide ceramics and non-oxide ceramics; The non-oxide ceramic accounts for 1% to 3% of the mass of the inorganic powder; The oxide ceramic is alumina and zirconium oxide; The non-oxide ceramic is selected from one or more of silicon carbide, boron nitride, and boron carbide.

[0006] The pore-filling slurry provided by this invention comprises an organic carrier and inorganic powder. The inorganic powder is composed of oxide ceramics (alumina and zirconium oxide) and non-oxide ceramics (selected from one or more of silicon carbide, boron nitride, and boron carbide), and is prepared in a specific ratio of 13-25 parts organic carrier, 73-86 parts inorganic powder, and 1%-3% by mass of the non-oxide ceramics compared to the inorganic powder. This pore-filling slurry does not sinter at annealing and sintering temperatures. For example, when this slurry is filled into the through-holes of a glass substrate and green ceramic, it can prevent deformation of the substrate through-holes and shrinkage of the green ceramic through-holes during annealing / sintering. Furthermore, the non-oxide ceramic powder generates gas under high-temperature conditions, ensuring that the slurry is loose and easily removed after annealing / sintering.

[0007] In the pore-filling slurry provided by the present invention, the organic carrier is 13 to 25 parts by weight, for example, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, or 25 parts, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0008] In the pore-filling slurry provided by the present invention, the inorganic powder comprises 73 to 86 parts by mass, for example, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, or 86 parts, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0009] In the pore-filling slurry provided by the present invention, the mass of the non-oxide ceramic accounts for 1% to 3% of the mass of the inorganic powder, for example, it can be 1%, 1.5%, 2%, 2.5%, 3%, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0010] Preferably, the mass ratio of alumina to zirconium oxide is (8.5:1.5) to (9.5:0.5), for example, it can be 8.5:1.5, 8.6:1.4, 8.7:1.3, 8.8:1.2, 8.9:1.1, 9:1, 9.1:0.9, 9.2:0.8, 9.3:0.7, 9.4:0.6, 9.5:0.5, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable. More preferably, it is (8.8:1.2) to (9.2:0.8).

[0011] This scheme controls the mass ratio of alumina to zirconium oxide to be (8.5:1.5) to (9.5:0.5). This ratio ensures that the powder is densely packed in the slurry, which can further prevent the deformation and shrinkage of the through holes in the substrate.

[0012] Preferably, the alumina has a particle size of 1~3µm, for example, 1µm, 1.5µm, 2µm, 2.5µm, 3µm, but is not limited to the listed values; other unlisted values ​​within the range are also applicable. The zirconium oxide has a particle size of 500~600nm, for example, 500nm, 520nm, 540nm, 560nm, 580nm, 600nm, but is not limited to the listed values; other unlisted values ​​within the range are also applicable. And / or, the non-oxide ceramic has a particle size of 1-2µm, for example, 1µm, 1.2µm, 1.4µm, 1.6µm, 1.8µm, 2.0µm, but is not limited to the listed values; other unlisted values ​​within the range are also applicable.

[0013] This method controls the particle size of alumina to be 1~3µm, the particle size of zirconium oxide to be 500~600nm, and the particle size of non-oxide ceramics to be 1-2µm. Within this particle size range, the powder compaction effect is optimal, and the micron-sized alumina and non-oxide ceramic powders are easy to disperse, reducing the preparation difficulty.

[0014] Preferably, the pore-filling slurry further includes 0.5 to 1 part of organic dispersant and / or 0.5 to 1 part of organic leveling agent by weight. More preferably, the organic dispersant is selected from one or more of sorbitol sorbate, sodium dodecyl sulfate, and triethanolamine; More preferably, the organic leveling agent is one or more of Tween-80 and polydimethylsiloxane.

[0015] This solution, by weight, includes 0.5 to 1 part organic dispersant and / or 0.5 to 1 part organic leveling agent in the pore-filling slurry. On the one hand, this ensures sufficient dispersant for good dispersion of the pore-filling slurry and sufficient leveling agent for subsequent pore-filling leveling. On the other hand, it avoids excessive dispersant leading to a significant decrease in the surface tension of the slurry, which can easily generate a large number of fine bubbles during the preparation process. These bubbles are difficult to eliminate in subsequent processes, and the presence of bubbles increases the roughness of the pore walls. Excessive leveling agent can also cause the slurry to collapse, resulting in the slurry failing to fill the through-holes and weakening the slurry's inhibitory effect on the deformation of the through-holes.

[0016] According to the mass fraction, the pore-filling slurry also includes 0.5 to 1 part of organic dispersant, for example, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, or 1 part, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0017] According to the mass percentage, the pore-filling slurry also includes 0.5 to 1 part of organic leveling agent, for example, 0.5, 0.6, 0.7, 0.8, 0.9, or 1 part, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0018] Preferably, the organic carrier includes an organic solvent and a binder, wherein the organic solvent is selected from at least two of terpineol, alcohol ester-12, dimethyl glutarate, ethylene glycol butyl ether acetate, and triethylene glycol monobutyl ether, and / or the binder is an epoxy resin.

[0019] The binder in this solution is epoxy resin, which forms a three-dimensional cross-linked, very strong and stable polymer network at high temperatures. This facilitates the molding of the oxide ceramic powder used in this invention and enhances its ability to suppress deformation of through-holes.

[0020] Preferably, the organic carrier comprises an organic solvent and a binder, wherein the mass ratio of the organic solvent to the binder is (8:2) to (9:1), for example, it can be 8:2, 8.1:1.9, 8.2:1.8, 8.3:1.7, 8.4:1.6, 8.5:1.5, 8.6:1.4, 8.7:1.3, 8.8:1.2, 8.9:1.1, 9:1, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable, and it is further preferred to be (8:2) to (8.5:1.5).

[0021] The organic carrier in this solution includes an organic solvent and a binder. The mass ratio of the organic solvent to the binder is controlled to be (8:2) to (9:1). On the one hand, this ensures that the functional powders (oxide ceramics and non-oxide ceramics) in the pore-filling slurry are uniformly dispersed to form a stable slurry. On the other hand, it gives the pore-filling slurry precise viscosity and flow characteristics to meet the requirements of the filling process.

[0022] This invention provides a method for preparing the aforementioned pore-filling slurry, comprising the following steps: S1. Configure the organic carrier; S2. The organic carrier, the inorganic powder, the organic dispersant and the organic leveling agent are homogenized and mixed to prepare a pore-filling slurry.

[0023] The present invention provides a substrate with through holes, wherein the materials required to prepare the substrate with through holes include the through hole filling paste.

[0024] The present invention provides a method for preparing the substrate with through holes, comprising the following steps: S1. The filling slurry is filled into the through holes of a glass substrate, green ceramic or ceramic substrate, leveled and dried, and then the glass substrate is annealed, or the green ceramic or ceramic substrate is sintered. S2. After annealing the glass substrate, or after sintering the green ceramic or ceramic substrate, the substrate is cleaned to obtain the substrate with through holes.

[0025] This invention provides a method for preparing a substrate with through holes. The substrate prepared by this method has smooth through holes with no change in hole diameter and no defects such as microcracks or hole deformation.

[0026] In the method for preparing a substrate with through holes provided by the present invention, the glass substrate is not annealed before the through hole filling paste is filled into the glass substrate.

[0027] Preferably, in step S1, the drying temperature is 110~130°C; and / or; In S2, the annealing temperature is 450~550℃, and the sintering temperature is 850~900℃.

[0028] In S1 of this scheme, the drying temperature is 110~130℃, for example, it can be 110℃, 115℃, 120℃, 125℃, 130℃, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0029] In S2 of this solution, the annealing temperature is 450~550℃, for example, it can be 450℃, 480℃, 500℃, 520℃, 550℃, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0030] In S2 of this scheme, the sintering temperature is 850~900℃, for example, it can be 850℃, 860℃, 870℃, 880℃, 890℃, 900℃, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0031] Preferably, in step S1, the drying temperature is 120°C; Preferably, in step S1, the drying time is 8 to 15 minutes, for example, 8 minutes, 9 minutes, 10 minutes, 11 minutes, 12 minutes, 13 minutes, 14 minutes, or 15 minutes, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable, and 10 minutes is more preferred.

[0032] Preferably, in S1, the leveling time is 10 to 20 minutes, for example, 10 minutes, 11 minutes, 12 minutes, 13 minutes, 14 minutes, 15 minutes, 16 minutes, 17 minutes, 18 minutes, 19 minutes, or 20 minutes, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0033] Preferably, in S2, the cleaning is ultrasonic cleaning.

[0034] More preferably, the ultrasonic frequency of the ultrasonic cleaning is 40kKHz to 60kKHz, for example, 40kHz, 45kHz, 50kHz, 55kHz, or 60kHz, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with this invention. Obviously, the described embodiments are only some embodiments of this invention, not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0036] Example 1 1. This embodiment provides a pore-filling slurry, which, by weight, comprises the following components: 20 portions of organic carrier; The organic carrier is composed of terpineol, ester-12 (2,2,4-trimethyl-1,3-pentanediol monoisobutyrate), triethylene glycol monobutyl ether, and bisphenol A type epoxy resin (the bisphenol A type epoxy resin was purchased from Tiantai Chemical (Hangzhou) Co., Ltd., model BE188EL). The total mass of terpineol, ester-12, and triethylene glycol monobutyl ether is a, and the mass of the bisphenol A type epoxy resin is b, with a:b=8:2. 79 parts of inorganic powder; The inorganic powder consists of oxide ceramics and non-oxide ceramics. The oxide ceramics are alumina (particle size 2 μm) and zirconium oxide (particle size 500 nm), and the non-oxide is boron carbide (particle size 1 μm). Non-oxide ceramics account for 1% of the mass of inorganic powder. The mass ratio of alumina to zirconium oxide is 8.9:1.

[0037] 2. The preparation method of the pore-filling slurry in this embodiment includes the following steps: S1. Preparation of organic carrier: Weigh 16 parts by weight of organic solvent (60 parts by weight of terpineol, 15 parts by weight of alcohol ester-12 and 25 parts by weight of triethylene glycol monobutyl ether) and 4 parts by weight of bisphenol A epoxy resin and place them in an HDPE (high-density polyethylene) tank. Stir the mixture under a 90°C water bath to prepare the organic carrier. S2. Prepare the pore-filling slurry. Weigh 20 parts by weight of the above-mentioned organic carrier, 79 parts by weight of inorganic powder (the inorganic powder consists of alumina powder with a particle size of 2μm, zirconium oxide powder (particle size of 500nm) and boron carbide powder; in the inorganic powder, the mass percentage of alumina powder is 89wt%, the mass percentage of zirconium oxide powder is 10wt%, and the mass percentage of boron carbide powder is 1wt%), 0.5 parts by weight of sorbitol oleate as a dispersant and 0.5 parts by weight of Tween-80 as a leveling agent. After preliminary mixing in a homogenizer (speed of 1000r / min, 10min), roll it in a three-roll mill (rolled 3 times at 25℃ water bath conditions with roller spacing of 80μm / 40μm, 40μm / 20μm, and 20μm / 15μm, respectively, at a speed of 300r / min) to obtain the pore-filling slurry.

[0038] 3. This embodiment provides a method for preparing a substrate with through holes, including the following steps: S1. Through holes are fabricated on a glass substrate using laser ablation, with a hole diameter of 100 μm and a hole spacing of 50 μm; S2. Fill the through holes of the glass substrate with the hole-filling slurry provided in this embodiment, let it level for 15 minutes, then place it in an oven at 120°C for 10 minutes, and then anneal the glass substrate at 520°C for 20 minutes. S3. After annealing, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as B1.

[0039] Example 2 1. The grouting material provided in this embodiment is the same as the grouting material provided in Embodiment 1.

[0040] 2. The preparation method of the pore-filling slurry in this embodiment is the same as that of the pore-filling slurry in Example 1.

[0041] 3. This embodiment provides a method for preparing a substrate with through holes, including the following steps: S1. Use a punching machine to punch holes in the green ceramic, with a hole diameter of 100μm and a hole spacing of 50μm; S2. Fill the through holes of the green ceramic with the slurry provided in this embodiment, let it level for 15 minutes, then place it in an oven at 120°C for 10 minutes, and then sinter the green ceramic at 850°C for 20 minutes. S3. After sintering, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as L1.

[0042] Example 3 1. The difference between the pore-filling slurry provided in this embodiment and the pore-filling slurry provided in Example 1 is that the non-oxide is silicon carbide (particle size of 1μm).

[0043] 2. The difference between the preparation method of the pore-filling slurry in this embodiment and the preparation method of the pore-filling slurry in Example 1 is that the inorganic powder is composed of alumina powder, zirconium oxide powder and silicon carbide powder (particle size of 1μm).

[0044] 3. The difference between the method for preparing a substrate with through holes provided in this embodiment and the method for preparing a substrate with through holes provided in Embodiment 1 is that the hole-filling paste provided in this embodiment is filled into the through holes of the glass substrate, and the sample number of the final substrate product with through holes is recorded as B2.

[0045] Example 4 1. The grout provided in this embodiment is the same as the grout provided in embodiment 3.

[0046] 2. The preparation method of the pore-filling slurry in this embodiment is the same as that in Example 3.

[0047] 3. This embodiment provides a method for preparing a substrate with through holes, including the following steps: S1. Use a punching machine to punch holes in the green ceramic, with a hole diameter of 100μm and a hole spacing of 50μm; S2. Fill the through holes of the green ceramic with the slurry provided in this embodiment, let it level for 15 minutes, then place it in an oven at 120°C for 10 minutes, and then sinter the green ceramic at a temperature of 850°C for 20 minutes. S3. After sintering, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as L2.

[0048] Example 5 1. The difference between the pore-filling slurry provided in this embodiment and the pore-filling slurry provided in Example 1 is that the non-oxide is boron nitride (particle size of 1μm).

[0049] 2. The difference between the preparation method of the pore-filling slurry in this embodiment and the preparation method of the pore-filling slurry in Example 1 is that the inorganic powder is composed of alumina powder, zirconium oxide powder and boron nitride powder (particle size of 1μm).

[0050] 3. The difference between the method for preparing a substrate with through holes provided in this embodiment and the method for preparing a substrate with through holes provided in Embodiment 1 is that the hole-filling paste provided in this embodiment is filled into the through holes of the glass substrate, and the sample number of the final substrate product with through holes is recorded as B3.

[0051] Example 6 1. The grout provided in this embodiment is the same as the grout provided in embodiment 5.

[0052] 2. The preparation method of the pore-filling slurry in this embodiment is the same as that in Example 5.

[0053] 3. This embodiment provides a method for preparing a substrate with through holes, including the following steps: S1. Use a punching machine to punch holes in the green ceramic, with a hole diameter of 100μm and a hole spacing of 50μm; S2. Fill the through holes of the green ceramic with the slurry provided in this embodiment, let it level for 15 minutes, then place it in an oven at 120°C for 10 minutes, and then sinter the green ceramic at a temperature of 850°C for 20 minutes. S3. After sintering, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as L3.

[0054] Example 7 1. This embodiment provides a pore-filling slurry, which, by weight, comprises the following components: 13 organic carriers; The organic carrier is composed of terpineol, alcohol ester-12, triethylene glycol monobutyl ether and bisphenol A type epoxy resin. The total mass of terpineol, alcohol ester-12 and triethylene glycol monobutyl ether is a, and the mass of bisphenol A type epoxy resin is b. The ratio of a to b is 8:2. 86 parts of inorganic powder; The inorganic powder consists of oxide ceramics and non-oxide ceramics. The oxide ceramics are alumina (particle size 2 μm) and zirconium oxide (particle size 500 nm), and the non-oxide is boron carbide (particle size 1 μm). Non-oxide ceramics account for 2% of the mass of inorganic powder. The mass ratio of alumina to zirconium oxide is 8.9:0.9.

[0055] 2. The preparation method of the pore-filling slurry in this embodiment includes the following steps: S1. Preparation of organic carrier: Weigh 16 parts by weight of organic solvent (60 parts by weight of terpineol, 15 parts by weight of alcohol ester-12 and 25 parts by weight of triethylene glycol monobutyl ether) and 4 parts by weight of bisphenol A epoxy resin and place them in an HDPE tank. Stir the mixture under a 90°C water bath to prepare the organic carrier. S2. Prepare a pore-filling ceramic slurry. Weigh 13 parts by weight of the above-mentioned organic carrier, 86 parts by weight of inorganic powder (the inorganic powder consists of alumina powder with a particle size of 2μm, zirconium oxide powder (particle size of 500nm) and boron carbide powder; in the inorganic powder, the mass percentage of alumina powder is 89wt%, the mass percentage of zirconium oxide powder is 9wt%, and the mass percentage of boron carbide powder is 2wt%), 0.5 parts by weight of sorbitol oleate as a dispersant and 0.5 parts by weight of Tween-80 as a leveling agent. After preliminary mixing in a homogenizer (speed of 1000r / min, 10min), roll it in a three-roll mill (rolled 3 times at 25℃ water bath conditions with roller spacing of 80μm / 40μm, 40μm / 20μm, and 20μm / 15μm, respectively, at a speed of 300r / min) to obtain the pore-filling slurry.

[0056] 3. This embodiment provides a method for preparing a substrate with through holes, including the following steps: S1. Through holes are fabricated on a glass substrate using laser ablation, with a hole diameter of 100 μm and a hole spacing of 50 μm; S2. Fill the through holes of the glass substrate with the hole-filling slurry provided in this embodiment, let it level for 15 minutes, then place it in an oven at 120°C for 10 minutes, and then anneal the glass substrate at 520°C for 20 minutes. S3. After annealing, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as B4.

[0057] Example 8 1. This embodiment provides a pore-filling slurry, which, by weight, comprises the following components: 25 portions of organic carrier; The organic carrier is composed of terpineol, alcohol ester-12, triethylene glycol monobutyl ether and bisphenol A type epoxy resin. The total mass of terpineol, alcohol ester-12 and triethylene glycol monobutyl ether is a, and the mass of bisphenol A type epoxy resin is b. The ratio of a to b is 8:2. 73 parts of inorganic powder; The inorganic powder consists of oxide ceramics and non-oxide ceramics. The oxide ceramics are alumina (particle size 2 μm) and zirconium oxide (particle size 500 nm), and the non-oxide is boron carbide (particle size 1 μm). Non-oxide ceramics account for 3% of the mass of inorganic powder. The mass ratio of alumina to zirconium oxide is 8.9:0.8.

[0058] 2. The preparation method of the pore-filling slurry in this embodiment includes the following steps: S1. Preparation of organic carrier: Weigh 16 parts by weight of organic solvent (60 parts by weight of terpineol, 15 parts by weight of alcohol ester-12 and 25 parts by weight of triethylene glycol monobutyl ether) and 4 parts by weight of bisphenol A epoxy resin and place them in an HDPE tank. Stir the mixture under a 90°C water bath to prepare the organic carrier. S2. Prepare a pore-filling ceramic slurry. Weigh 25 parts by weight of the above-mentioned organic carrier, 73 parts by weight of inorganic powder (the inorganic powder consists of alumina powder with a particle size of 2μm, zirconium oxide powder (particle size of 500nm) and boron carbide powder; in the inorganic powder, the mass percentage of alumina powder is 89wt%, the mass percentage of zirconium oxide powder is 8wt%, and the mass percentage of boron carbide powder is 3wt%), 1 part by weight of sorbitol oleate as a dispersant and 1 part by weight of Tween-80 as a leveling agent. After preliminary mixing in a homogenizer (speed of 1000r / min, 10min), roll it in a three-roll mill (rolled 3 times at 25℃ water bath conditions with roller spacing of 80μm / 40μm, 40μm / 20μm, and 20μm / 15μm, respectively, at a speed of 300r / min) to obtain the pore-filling slurry.

[0059] 3. This embodiment provides a method for preparing a substrate with through holes, including the following steps: S1. Through holes are fabricated on a glass substrate using laser ablation, with a hole diameter of 100 μm and a hole spacing of 50 μm; S2. Fill the through holes of the glass substrate with the hole-filling slurry provided in this embodiment, let it level for 15 minutes, then place it in an oven at 120°C for 10 minutes, and then anneal the glass substrate at 520°C for 20 minutes. S3. After annealing, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as L4.

[0060] Comparative Example 1 1. The difference between the pore-filling slurry provided in this comparative example and the pore-filling slurry provided in Example 1 is that the inorganic powder is an oxide ceramic, the oxide ceramic is alumina and zirconium oxide, and the mass ratio of alumina to zirconium oxide is 8.9:1.1.

[0061] 2. The difference between the preparation method of the comparative example pore-filling slurry and the preparation method of the pore-filling slurry in Example 1 is that the inorganic powder is composed of alumina powder and zirconium oxide powder; in the inorganic powder, the mass ratio of alumina powder is 89 wt% and the mass ratio of zirconium oxide powder is 11 wt%.

[0062] 3. The method for fabricating a substrate with through-holes provided in this comparative example includes the following steps: The via filling slurry provided in this comparative example is filled into the through holes of a glass substrate, including the following steps: S1. Through holes are prepared on the glass substrate by laser ablation, with a hole diameter of 100 μm and a hole spacing of 50 μm; S2. Fill the through holes of the glass substrate with the hole-filling slurry provided in this comparative example, and anneal the glass substrate at a temperature of 520°C for 20 minutes. S3. After annealing, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as D1.

[0063] Comparative Example 2 1. The grout provided in this comparative example is the same as the grout provided in Comparative Example 1.

[0064] 2. The preparation method of the hole-filling slurry in this comparative example is the same as that of the hole-filling slurry in Comparative Example 1.

[0065] 3. This comparative example provides a method for fabricating a substrate with through holes, comprising the following steps: S1. Use a punching machine to punch holes in the green ceramic, with a hole diameter of 100μm and a hole spacing of 50μm; S2. Fill the through holes of the green ceramic with the slurry provided in this comparative example, let it level for 15 minutes, then place it in an oven at 120℃ for 10 minutes, and then sinter the green ceramic at a temperature of 850℃ for 20 minutes. S3. After sintering, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as T1.

[0066] Comparative Example 3 1. This comparative example provides a hole-filling slurry, which, by mass parts, comprises the following components: 30 portions of organic carrier; The organic carrier is composed of terpineol, alcohol ester-12, triethylene glycol monobutyl ether and bisphenol A type epoxy resin. The total mass of terpineol, alcohol ester-12 and triethylene glycol monobutyl ether is a, and the mass of bisphenol A type epoxy resin is b. The ratio of a to b is 8:2. 69 parts of inorganic powder; The inorganic powder consists of oxide ceramics and non-oxide ceramics. The oxide ceramics are alumina (particle size 2 μm) and zirconium oxide (particle size 500 nm), and the non-oxide is boron carbide (particle size 1 μm). Non-oxide ceramics account for 1% of the mass of inorganic powder. The mass ratio of alumina to zirconium oxide is 8.9:1.

[0067] 2. The preparation method of the comparative example pore-filling slurry includes the following steps: S1. Preparation of organic carrier: Weigh 16 parts by weight of organic solvent (60 parts by weight of terpineol, 15 parts by weight of alcohol ester-12 and 25 parts by weight of triethylene glycol monobutyl ether) and 4 parts by weight of bisphenol A epoxy resin and place them in an HDPE tank. Stir the mixture under a 90°C water bath to prepare the organic carrier. S2. Prepare the pore-filling ceramic slurry. Weigh 30 parts by weight of the above-mentioned organic carrier, 69 parts by weight of inorganic powder (the inorganic powder consists of alumina powder with a particle size of 2μm, zirconium oxide powder (particle size of 500nm) and boron carbide powder; in the inorganic powder, the mass percentage of alumina powder is 89wt%, the mass percentage of zirconium oxide powder is 10wt%, and the mass percentage of boron carbide powder is 1wt%), 0.5 parts by weight of sorbitol oleate as a dispersant and 0.5 parts by weight of Tween-80 as a leveling agent. After preliminary mixing in a homogenizer (speed of 1000r / min, 10min), roll it in a three-roll mill (rolled 3 times at 25℃ water bath conditions, with roller spacing of 80μm / 40μm, 40μm / 20μm, and 20μm / 15μm, respectively, at a speed of 300r / min) to obtain the pore-filling slurry.

[0068] 3. This comparative example provides a method for fabricating a substrate with through holes, comprising the following steps: S1. Through holes are fabricated on a glass substrate using laser ablation, with a hole diameter of 100 μm and a hole spacing of 50 μm; S2. Fill the through holes of the glass substrate with the hole-filling slurry provided in this comparative example, let it level for 15 minutes, then place it in an oven at 120°C for 10 minutes, and then anneal the glass substrate at 520°C for 20 minutes. S3. After annealing, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as D2.

[0069] Comparative Example 4 1. The grouting material provided in this comparative example is the same as that provided in Comparative Example 3.

[0070] 2. The preparation method of the hole-filling slurry in this comparative example is the same as that of the hole-filling slurry in comparative example 3.

[0071] 3. This comparative example provides a method for fabricating a substrate with through holes, comprising the following steps: S1. Use a punching machine to punch holes in the green ceramic, with a hole diameter of 100μm and a hole spacing of 50μm; S2. Fill the through holes of the green ceramic with the slurry provided in this comparative example, let it level for 15 minutes, then place it in an oven at 120℃ for 10 minutes, and then sinter the green ceramic at a temperature of 850℃ for 20 minutes. S3. After sintering, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as T2.

[0072] Comparative Example 5 1. This comparative example provides a hole-filling slurry, which, by mass parts, comprises the following components: 10 portions of organic carrier; The organic carrier is composed of terpineol, alcohol ester-12, triethylene glycol monobutyl ether and bisphenol A type epoxy resin. The total mass of terpineol, alcohol ester-12 and triethylene glycol monobutyl ether is a, and the mass of bisphenol A type epoxy resin is b. The ratio of a to b is 8:2. 89 parts of inorganic powder; The inorganic powder consists of oxide ceramics and non-oxide ceramics. The oxide ceramics are alumina (particle size 2 μm) and zirconium oxide (particle size 500 nm), and the non-oxide is boron carbide (particle size 1 μm). Non-oxide ceramics account for 1% of the mass of inorganic powder. The mass ratio of alumina to zirconium oxide is 8.9:1.

[0073] 2. The preparation method of the comparative example pore-filling slurry includes the following steps: S1. Preparation of organic carrier: Weigh 16 parts by weight of organic solvent (60 parts by weight of terpineol, 15 parts by weight of alcohol ester-12 and 25 parts by weight of triethylene glycol monobutyl ether) and 4 parts by weight of bisphenol A epoxy resin and place them in an HDPE tank. Stir the mixture under a 90°C water bath to prepare the organic carrier. S2. Prepare the pore-filling ceramic slurry. Weigh 10 parts by weight of the above-mentioned organic carrier, 89 parts by weight of inorganic powder (the inorganic powder consists of alumina powder with a particle size of 2μm, zirconium oxide powder (particle size of 500nm) and boron carbide powder; in the inorganic powder, the mass percentage of alumina powder is 89wt%, the mass percentage of zirconium oxide powder is 10wt%, and the mass percentage of boron carbide powder is 1wt%), 0.5 parts by weight of sorbitol oleate as a dispersant and 0.5 parts by weight of Tween-80 as a leveling agent. After preliminary mixing in a homogenizer (speed of 1000r / min, 10min), roll it in a three-roll mill (rolled 3 times at 25℃ water bath conditions with roller spacing of 80μm / 40μm, 40μm / 20μm, and 20μm / 15μm, respectively, at a speed of 300r / min) to obtain the pore-filling slurry.

[0074] 3. This comparative example provides a method for fabricating a substrate with through holes, comprising the following steps: S1. Through holes are fabricated on a glass substrate using laser ablation, with a hole diameter of 100 μm and a hole spacing of 50 μm; S2. Fill the through holes of the glass substrate with the hole-filling slurry provided in this comparative example, let it level for 15 minutes, then place it in an oven at 120°C for 10 minutes, and then anneal the glass substrate at 520°C for 20 minutes. S3. After annealing, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as D3.

[0075] Comparative Example 6 1. The grout provided in this comparative example is the same as the grout provided in Comparative Example 5.

[0076] 2. The preparation method of the hole-filling slurry in this comparative example is the same as that of the hole-filling slurry in Comparative Example 5.

[0077] 3. This comparative example provides a method for fabricating a substrate with through holes, comprising the following steps: S1. Use a punching machine to punch holes in the green ceramic, with a hole diameter of 100μm and a hole spacing of 50μm; S2. Fill the through holes of the green ceramic with the slurry provided in this comparative example, let it level for 15 minutes, then place it in an oven at 120℃ for 10 minutes, and then sinter the green ceramic at a temperature of 850℃ for 20 minutes. S3. After sintering, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as T3.

[0078] Comparative Example 7 1. This comparative example provides a hole-filling slurry, which, by mass parts, comprises the following components: 20 portions of organic carrier; The organic carrier is composed of terpineol, alcohol ester-12, triethylene glycol monobutyl ether and bisphenol A type epoxy resin. The total mass of terpineol, alcohol ester-12 and triethylene glycol monobutyl ether is a, and the mass of bisphenol A type epoxy resin is b. The ratio of a to b is 8:2. 79 parts of inorganic powder; The inorganic powder consists of oxide ceramics and non-oxide ceramics. The oxide ceramics are alumina (particle size 2 μm) and zirconium oxide (particle size 500 nm), and the non-oxide is boron carbide (particle size 1 μm). The mass of non-oxide ceramics accounts for 0.5% of the mass of inorganic powder. The mass ratio of alumina to zirconium oxide is 8.9:1.05.

[0079] 2. The preparation method of the comparative example pore-filling slurry includes the following steps: S1. Preparation of organic carrier: Weigh 16 parts by weight of organic solvent (60 parts by weight of terpineol, 15 parts by weight of alcohol ester-12 and 25 parts by weight of triethylene glycol monobutyl ether) and 4 parts by weight of bisphenol A epoxy resin and place them in an HDPE tank. Stir the mixture under a 90°C water bath to prepare the organic carrier. S2. Prepare the pore-filling slurry. Weigh 20 parts by weight of the above-mentioned organic carrier, 79 parts by weight of inorganic powder (the inorganic powder consists of alumina powder with a particle size of 2μm, zirconium oxide powder (particle size of 500nm) and boron carbide powder; in the inorganic powder, the mass percentage of alumina powder is 89wt%, the mass percentage of zirconium oxide powder is 10.5wt%, and the mass percentage of boron carbide powder is 0.5wt%), 0.5 parts by weight of sorbitol oleate as a dispersant and 0.5 parts by weight of Tween-80 as a leveling agent. After preliminary mixing in a homogenizer (speed of 1000r / min, 10min), roll it in a three-roll mill (rolled 3 times at 25℃ water bath conditions with roller spacing of 80μm / 40μm, 40μm / 20μm, and 20μm / 15μm, respectively, at a speed of 300r / min) to obtain the pore-filling slurry.

[0080] 3. This comparative example provides a method for fabricating a substrate with through holes, comprising the following steps: S1. Through holes are fabricated on a glass substrate using laser ablation, with a hole diameter of 100 μm and a hole spacing of 50 μm; S2. Fill the through holes of the glass substrate with the hole-filling slurry provided in this comparative example, let it level for 15 minutes, then place it in an oven at 120°C for 10 minutes, and then anneal the glass substrate at 520°C for 20 minutes. S3. After annealing, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as D4.

[0081] Comparative Example 8 1. The grout provided in this comparative example is the same as the grout provided in Comparative Example 7.

[0082] 2. The preparation method of the hole-filling slurry in this comparative example is the same as that of the hole-filling slurry in Comparative Example 7.

[0083] 3. This comparative example provides a method for fabricating a substrate with through holes, comprising the following steps: S1. Use a punching machine to punch holes in the green ceramic, with a hole diameter of 100μm and a hole spacing of 50μm; S2. Fill the through holes of the green ceramic with the slurry provided in this comparative example, let it level for 15 minutes, then place it in an oven at 120℃ for 10 minutes, and then sinter the green ceramic at a temperature of 850℃ for 20 minutes. S3. After sintering, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as T4.

[0084] Comparative Example 9 1. This comparative example provides a hole-filling slurry, which, by mass parts, comprises the following components: 20 portions of organic carrier; The organic carrier is composed of terpineol, alcohol ester-12, triethylene glycol monobutyl ether and bisphenol A type epoxy resin. The total mass of terpineol, alcohol ester-12 and triethylene glycol monobutyl ether is a, and the mass of bisphenol A type epoxy resin is b. The ratio of a to b is 8:2. 79 parts of inorganic powder; The inorganic powder consists of oxide ceramics and non-oxide ceramics. The oxide ceramics are alumina (particle size 2 μm) and zirconium oxide (particle size 500 nm), and the non-oxide is boron carbide (particle size 1 μm). Non-oxide ceramics account for 4% of the mass of inorganic powder. The mass ratio of alumina to zirconium oxide is 8.9:0.7.

[0085] 2. The preparation method of the comparative example pore-filling slurry includes the following steps: S1. Preparation of organic carrier: Weigh 16 parts by weight of organic solvent (60 parts by weight of terpineol, 15 parts by weight of alcohol ester-12 and 25 parts by weight of triethylene glycol monobutyl ether) and 4 parts by weight of bisphenol A epoxy resin and place them in an HDPE tank. Stir the mixture under a 90°C water bath to prepare the organic carrier. S2. Prepare the pore-filling slurry. Weigh 20 parts by weight of the above-mentioned organic carrier, 79 parts by weight of inorganic powder (the inorganic powder consists of alumina powder with a particle size of 2μm, zirconium oxide powder (particle size of 500nm) and boron carbide powder; in the inorganic powder, the mass percentage of alumina powder is 89wt%, the mass percentage of zirconium oxide powder is 7wt%, and the mass percentage of boron carbide powder is 4wt%), 0.5 parts by weight of sorbitol oleate as a dispersant and 0.5 parts by weight of Tween-80 as a leveling agent. After preliminary mixing in a homogenizer (speed of 1000r / min, 10min), roll it in a three-roll mill (rolled 3 times at 25℃ water bath conditions with roller spacing of 80μm / 40μm, 40μm / 20μm, and 20μm / 15μm, respectively, at a speed of 300r / min) to obtain the pore-filling slurry.

[0086] 3. This comparative example provides a method for fabricating a substrate with through holes, comprising the following steps: S1. Through holes are fabricated on a glass substrate using laser ablation, with a hole diameter of 100 μm and a hole spacing of 50 μm; S2. Fill the through holes of the glass substrate with the hole-filling slurry provided in this comparative example, let it level for 15 minutes, then place it in an oven at 120°C for 10 minutes, and then anneal the glass substrate at 520°C for 20 minutes. S3. After annealing, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as D5.

[0087] Comparative Example 10 1. The grout provided in this comparative example is the same as the grout provided in Comparative Example 9.

[0088] 2. The preparation method of the hole-filling slurry in this comparative example is the same as that of the hole-filling slurry in Comparative Example 9.

[0089] 3. This comparative example provides a method for fabricating a substrate with through holes, comprising the following steps: S1. Use a punching machine to punch holes in the green ceramic, with a hole diameter of 100μm and a hole spacing of 50μm; S2. Fill the through holes of the green ceramic with the slurry provided in this comparative example, let it level for 15 minutes, then place it in an oven at 120℃ for 10 minutes, and then sinter the green ceramic at a temperature of 850℃ for 20 minutes. S3. After sintering, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as T5.

[0090] Comparative Example 11 This comparative example provides a method for fabricating a substrate with through holes, comprising the following steps: S1. Through holes are fabricated on a glass substrate using laser ablation, with a hole diameter of 100 μm and a hole spacing of 50 μm; S2. Anneal the glass substrate at a temperature of 520°C for 20 minutes. S3. After annealing, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as D6.

[0091] Comparative Example 12 S1. Use a punching machine to punch holes in the green ceramic, with a hole diameter of 100μm and a hole spacing of 50μm; S2. Sinter the raw ceramic at a temperature of 850℃ for 20 minutes. S3. After sintering, the substrate is ultrasonically cleaned (ultrasonic frequency of 40kHz) to remove the filling paste, and the state of the through holes is observed. The sample number is recorded as T6.

[0092] Table 1. Sample through-hole status Sample number Through hole status B1 The through-holes are smooth, without cracks, and show no significant structural changes; the pore size is 100 μm. L1 The through-holes are smooth, without cracks, and show no significant structural changes; the pore size is 100 μm. B2 The through-holes are smooth, without cracks, and show no significant structural changes; the pore size is 100 μm. L2 The through-holes are smooth, without cracks, and show no significant structural changes; the pore size is 100 μm. B3 The through-holes are smooth, without cracks, and show no significant structural changes; the pore size is 100 μm. L3 The through-holes are smooth, without cracks, and show no significant structural changes; the pore size is 100 μm. B4 The through-holes are smooth, without cracks, and show no significant structural changes; the pore size is 100 μm. L4 The through-holes are smooth, without cracks, and show no significant structural changes; the pore size is 100 μm. D1 The slurry could not be completely removed; the pores were rough and crack-free with no significant structural changes; the pore size was 100 μm. T1 The slurry could not be completely removed; the pores were rough and crack-free with no significant structural changes; the pore size was 100 μm. D2 The slurry collapsed, the edges of the through holes deformed, and cracks appeared. T2 The slurry collapsed, and cracks appeared at the edge of the through-hole. D3 Slurry filling is difficult, the pore walls are rough, and there are no cracks. T3 Slurry filling is difficult, the pore walls are rough, and there are no cracks. D4 The slurry could not be completely removed; the pores were rough and without cracks, and the structure showed no significant changes. T4 The slurry could not be completely removed; the pores were rough and without cracks, and the structure showed no significant changes. D5 The slurry is loose, the through holes are deformed, and there are cracks. T5 The slurry is loose, without cracks, and exhibits shrinkage in the pores, with a pore size of 94μm. D6 The through-hole is rough, cracked, and deformed. T6 The through-hole is smooth and crack-free, with shrinkage and a diameter of 91μm. As shown in Table 1, the filling slurry of the present invention can effectively suppress the deformation of through-holes in glass substrates and the shrinkage of through-holes in green ceramic. Comparing the experimental results of Examples 1, 3, 5 and Comparative Example 1, or comparing the experimental results of Examples 2, 4, 6 and Comparative Example 2, it can be seen that the presence of non-oxide ceramic powder ensures complete removal of the slurry and reduces the roughness of the through-holes. Comparing the experimental results of Examples 1, Comparative Example 1 and Comparative Example 11, it can be seen that the through-hole structure of glass substrates without slurry filling is prone to deformation after annealing. Comparing the experimental results of Examples 2, Comparative Example 2 and Comparative Example 12, it can be seen that the preparation method of the substrate with through-holes of the present invention can suppress the shrinkage of through-holes in green ceramic and improve the alignment accuracy of the substrate. Comparing the experimental results of Examples 7, 8 and Comparative Examples 3, 4, 5, 6, 7, 8, 9, 10, the slurry ratio range can be determined.

[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A pore-filling slurry, characterized in that, The pore-filling slurry comprises the following components by weight: 13-25 parts of organic carrier; 73-86 parts of inorganic powder; The inorganic powder is composed of oxide ceramics and non-oxide ceramics; The non-oxide ceramic accounts for 1% to 3% of the mass of the inorganic powder; The oxide ceramic is alumina and zirconium oxide; The non-oxide ceramic is selected from one or more of silicon carbide, boron nitride, and boron carbide.

2. The pore-filling slurry according to claim 1, characterized in that, The mass ratio of alumina to zirconium oxide is (8.5:1.5) to (9.5:0.5), preferably (8.8:1.2) to (9.2:0.8).

3. The pore-filling slurry according to claim 1 or 2, characterized in that, The alumina has a particle size of 1~3µm, and the zirconium oxide has a particle size of 500~600nm. And / or, The particle size of the non-oxide ceramic is 1-2µm.

4. The pore-filling slurry according to claim 1 or 3, characterized in that, The pore-filling slurry further includes 0.5 to 1 part organic dispersant and / or 0.5 to 1 part organic leveling agent by weight; Preferably, the organic dispersant is selected from one or more of sorbitol sorbate, sodium dodecyl sulfate, and triethanolamine; Preferably, the organic leveling agent is one or more of Tween-80 and polydimethylsiloxane.

5. The pore-filling slurry according to claim 1 or 4, characterized in that, The organic carrier includes an organic solvent and a binder, wherein the organic solvent is selected from at least two of terpineol, alcohol ester-12, dimethyl glutarate, ethylene glycol butyl ether acetate, and triethylene glycol monobutyl ether, and / or the binder is an epoxy resin.

6. The grouting material according to claim 1 or 5, characterized in that, The organic carrier includes an organic solvent and a binder, wherein the mass ratio of the organic solvent to the binder is (8:2) to (9:1), preferably (8:2) to (8.5:1.5).

7. A method for preparing a pore-filling slurry as described in any one of claims 1 to 6, characterized in that, Includes the following steps: S1. Configure the organic carrier; S2. The organic carrier, the inorganic powder, the organic dispersant and the organic leveling agent are homogenized and mixed to prepare a pore-filling slurry.

8. A substrate with through holes, characterized in that, The materials required for preparing the substrate with through holes include the hole-filling paste as described in any one of claims 1 to 6.

9. A method for preparing a substrate with through holes as described in claim 8, characterized in that, Includes the following steps: S1. The filling slurry is filled into the through holes of a glass substrate, green ceramic or ceramic substrate, leveled and dried, and then the glass substrate is annealed, or the green ceramic or ceramic substrate is sintered. S2. After annealing the glass substrate, or after sintering the green ceramic or ceramic substrate, the substrate is cleaned to obtain the substrate with through holes.

10. The method for preparing a substrate with through holes according to claim 9, characterized in that, In step S1, the drying temperature is 110~130℃; and / or; In S2, the annealing temperature is 450~550℃, and the sintering temperature is 850~900℃.