Modular chip and optical gyroscope chip

Abstract

The invention provides a modular chip and an optical gyroscope chip. The modular chip comprises a plurality of branch optical paths; each branch optical path comprises a branch optical waveguide, a first evanescent wave coupler, a phase modulator, a second evanescent wave coupler and a first optical port coupler; the first end of the branch optical waveguide is divided into a plurality of waveguide branches, and each waveguide branch is connected with one branch optical path; the first end of the first evanescent wave coupler is connected with the first end of the waveguide branch, and the second end of the first evanescent wave coupler is connected with the first end of the phase modulator; the second end of the phase modulator is connected with the first end of the second evanescent wave coupler, and the second end of the second evanescent wave coupler is connected with the first end of the first optical port coupler; the second end of the branch optical waveguide is configured to be connected with an active or passive device, and the second end of the first optical port coupler is configured to be connected with an external element. According to the invention, a plurality of elements in the chip are integrated in the modular chip and are used for being connected with a plurality of elements, so that the universality of the chip is improved, and the cost is reduced.

Description

Technical Field

[0001] This application relates to the field of gyroscope technology, and more specifically, to a modular chip and an optical gyroscope chip. Background Technology

[0002] In the current semiconductor technology field, with the rapid development of information technology, the demand for chips from various electronic devices is becoming increasingly diversified. Traditional chip design and manufacturing processes often follow a "one-to-one" model, that is, designing and manufacturing corresponding chips separately for the functional requirements of specific devices or applications.

[0003] However, while the manufacturing approach of designing and optimizing each chip for a specific application can provide optimal performance in certain situations, it suffers from drawbacks such as poor versatility and high manufacturing costs. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a modular chip and an optical gyroscope chip, which can increase the versatility of the chip and reduce the chip manufacturing cost.

[0005] In a first aspect, embodiments of this application provide a modular chip, comprising: a branch optical waveguide and multiple branch optical paths; a first end of the branch optical waveguide is divided into multiple waveguide branches, each waveguide branch being connected to one of the branch optical paths; at least one of the branch optical paths includes a first evanescent wave coupler, a phase modulator, a second evanescent wave coupler, and a first optical port coupler; a first end of the first evanescent wave coupler is connected to the first end of the waveguide branch, and a second end of the first evanescent wave coupler is connected to the first end of the phase modulator; a second end of the phase modulator is connected to the first end of the second evanescent wave coupler, and a second end of the second evanescent wave coupler is connected to the first end of the first optical port coupler; wherein, the second end of the branch optical waveguide is configured to be connected to an active or passive device, and the second end of the first optical port coupler is configured to be connected to an external component.

[0006] In the above implementation process, by integrating components such as branch optical waveguide, first evanescent wave coupler, phase modulator, second evanescent wave coupler and first optical port coupler into a modular chip, the modular chip can be used to connect with one or more components to achieve different functions, thereby increasing the versatility of the modular chip and reducing the chip manufacturing cost.

[0007] In one embodiment, it further includes: a polarizer and a multimode interference coupler; the second end of the branch waveguide is connected to the first end of the polarizer, and the second end of the polarizer is connected to the first end of the multimode interference coupler; the second end of the multimode interference coupler is connected to one or more optoelectronic devices.

[0008] In the above implementation process, by incorporating a polarizer and a multi-module interference coupler into the modular chip, the polarizer can convert optical signals with multiple vibration directions into optical signals with vibration in a set direction, thereby enhancing the optical signal and improving the accuracy of optical signal processing. Furthermore, the multi-module interference coupler can split the optical signal into multiple beams or combine multiple beams, enabling the modular chip to be connected to one or more optoelectronic devices to achieve one or more functions, thus expanding the application scenarios of the modular chip.

[0009] In one embodiment, the multimode interference coupler includes a DC coupler, or a one-to-two multimode interference coupler, or a two-to-two multimode interference coupler.

[0010] In the above implementation process, the multimode interference coupler is set as a DC coupler, a 1x2 multimode interferometer, or a 2x2 multimode interferometer, etc., optical devices. On the one hand, this improves the flexibility of the multimode interference coupler setup. On the other hand, it reduces the loss of optical signals in the multimode interference coupler, increasing its fault tolerance.

[0011] In one embodiment, the device further includes: a second optical port coupler and a photodetector; a first end of the second optical port coupler and a first end of the photodetector are both connected to a second end of the multimode interference coupler; wherein the second optical port coupler is configured to couple external light into the modular chip and / or couple light in the modular chip to the outside of the modular chip; the photodetector is configured to process the light in the modular chip.

[0012] In the above implementation process, a second optical port coupler and a photodetector are incorporated into the modular chip. The second optical port coupler transmits optical signals to the outside of the modular chip, and the photodetector performs detection, measurement, transmission, and processing operations based on the acquired optical signals. In other words, this modular chip allows for multi-faceted signal processing, enhancing its functionality and expanding its application scenarios.

[0013] In one embodiment, it further includes: a laser; the second end of the second optical port coupler is connected to the laser.

[0014] In the above implementation process, by setting a laser in the modular chip, a light source can be emitted through the laser, so that the modular chip does not need to be connected to an external power source, reducing the modular chip's demand for an external power source and improving the flexibility of the modular chip.

[0015] In one embodiment, the phase modulator is fabricated using thin-film lithium niobate.

[0016] In the above implementation process, since thin-film lithium niobate has a wide transparent window and a high refractive index, by setting the fabrication material of the phase modulator to include thin-film lithium niobate, the modulation efficiency can be improved and the loss of optical signal in the phase modulator can be reduced.

[0017] Secondly, embodiments of this application also provide an optical gyroscope chip, comprising: a modular chip and an optical fiber ring as described in the first aspect or any embodiment of the first aspect; the second end of a first optical port coupler of the modular chip is connected to the optical fiber ring; wherein the optical fiber ring is configured to perform bidirectional optical transmission along the circumferential direction.

[0018] In the above implementation process, by connecting an optical fiber ring to the modular chip, inertial measurement can be achieved through the cooperation between the modular chip and the optical fiber ring, thereby replacing the rotating gyroscope or the microelectromechanical vibration gyroscope. Compared with the rotating gyroscope or the microelectromechanical vibration gyroscope, the gyroscope chip structure of this application is simpler and smaller, reducing the size of the gyroscope and achieving miniaturization. In addition, it has significant improvements over traditional gyroscopes in terms of suppressing signal offset caused by vibration and temperature, noise, bandwidth, lifespan, and cost.

[0019] In one embodiment, the fiber optic loop is formed by wrapping an optical fiber around itself; or, the fiber optic loop is formed by an optical waveguide coil integrated on a chip.

[0020] In the above implementation process, due to the low cost and extremely low transmission loss of optical fiber, forming an optical fiber ring by wrapping the fiber can reduce the cost of the optical fiber ring while reducing the loss of optical signals within the optical fiber ring. Furthermore, forming the optical fiber ring by integrating optical waveguides on a chip allows for a reduction in overall size, achieving miniaturization of the optical fiber ring and improving its sensitivity.

[0021] In one embodiment, the optical gyroscope chip is a heterogeneous integrated chip; the optical gyroscope chip includes: a first photonic chip and a second photonic chip; the second photonic chip is integrated on the first photonic chip; wherein, the first photonic chip includes: an insulating layer, a first optical waveguide and a second optical waveguide; both the first optical waveguide and the second optical waveguide are disposed inside the insulating layer; the first optical waveguide is disposed on the side of the second optical waveguide away from the second photonic chip; a first electrode pair is disposed on the side of the first optical waveguide close to the second photonic chip; wherein, the first optical waveguide and the second optical waveguide form a second optical port coupler in the insulating layer.

[0022] In the above implementation process, by setting the optical gyroscope chip to be formed by heterogeneous integration of a first photonic chip and a second photonic chip, the diversity of the optical gyroscope can be increased, thereby increasing the application scenarios of the optical gyroscope.

[0023] In one embodiment, the second photonic chip includes: a third optical waveguide; a second electrode pair is disposed on the side of the third optical waveguide away from the first photonic chip; wherein the third optical waveguide and the second optical waveguide form a second evanescent wave coupler.

[0024] In the above implementation process, by setting a second electrode pair on the third optical waveguide, the second electrode pair can be used to form a photodetector, thereby monitoring the optical signal, increasing the function of the optical gyroscope chip, and thus increasing the application scenarios of the optical gyroscope.

[0025] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of a modular chip provided in an embodiment of this application;

[0028] Figure 2 A schematic diagram of a modular chip equipped with a polarizer and a multimode interference coupler is provided for an embodiment of this application;

[0029] Figure 3 This is a schematic diagram of a modular chip equipped with a laser, provided in an embodiment of this application.

[0030] Figure 4 This is a schematic diagram of an optical gyroscope chip provided in an embodiment of this application;

[0031] Figure 5 A cross-sectional view of an optical gyroscope chip provided in an embodiment of this application;

[0032] Figure 6 A cross-sectional view of an optical gyroscope chip equipped with a laser, provided for an embodiment of this application.

[0033] Figure description: 100-Modular chip, 110-Branch optical waveguide, 120-First evanescent wave coupler, 130-Phase modulator, 140-Second evanescent wave coupler, 150-First optical port coupler, 160-Polarizer, 170-Multimode interference coupler, 180-Second optical port coupler, 191-Photodetector, 192-Laser, 200-Fiber optic ring, 210-Insulating layer, 220-First optical waveguide, 230-Second optical waveguide, 240-First electrode pair, 250-Third optical waveguide, 260-Second electrode pair, 270-Substrate. Detailed Implementation

[0034] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0035] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0036] Against the backdrop of rapid advancements in semiconductor technology, the versatility and manufacturing cost of chips, as core components of information technology, are becoming increasingly prominent issues. Traditional chip design often involves highly customized development for specific applications or devices. While this ensures optimal chip performance in specific scenarios, it also presents significant challenges in terms of versatility. Because each chip is optimized for specific functions, their compatibility and interchangeability are severely limited, making it difficult to flexibly apply chips across different devices or systems. This limitation not only increases inventory and supply chain management costs for device manufacturers but also restricts consumers' flexibility in selecting and using devices.

[0037] In view of this, this application proposes a modular chip, which integrates components such as branch optical waveguides, first evanescent wave couplers, phase modulators, second evanescent wave couplers, and first optical port couplers into a single modular chip. This modular chip can be used to connect with one or more components to achieve different functions, thereby increasing the versatility of the modular chip and reducing chip manufacturing costs.

[0038] To facilitate understanding of this embodiment, the modular chip disclosed in this application embodiment will first be described in detail.

[0039] like Figure 1 The diagram shown is a schematic of a modular chip 100 provided in an embodiment of this application, including: a branch optical waveguide 110 and multiple branch optical paths.

[0040] The first end of the branch optical waveguide 110 is divided into multiple waveguide branches, and each waveguide branch is connected to a branch optical path.

[0041] At least one branch optical path includes a branch optical waveguide 110, a first evanescent wave coupler 120, a phase modulator 130, a second evanescent wave coupler 140, and a first optical port coupler 150.

[0042] The first end of the first evanescent wave coupler 120 is connected to the first end of the waveguide branch, and the second end of the first evanescent wave coupler 120 is connected to the first end of the phase modulator 130; the second end of the phase modulator 130 is connected to the first end of the second evanescent wave coupler 140, and the second end of the second evanescent wave coupler 140 is connected to the first end of the first optical port coupler 150.

[0043] The second ends of the multiple branch optical waveguides 110 are interconnected to form a total optical waveguide. The second ends of the branch optical waveguides 110 are configured to connect to active or passive devices.

[0044] Optionally, the active or passive device can be a polarizer 160, a coupler, a photodetector 191, a light source, or other devices, and the active or passive device can be selected according to the actual situation.

[0045] When the second end of the branch optical waveguide 110 is connected to different active or passive devices, it can form different chips and realize different functions.

[0046] Optionally, the material of the passive device may include silicon, silicon nitride, etc., and the material of the passive device can be selected according to the actual situation.

[0047] It should be understood that when fabricating an optical waveguide, by processing the structure of the optical waveguide, one end of the optical waveguide can be processed into multiple independent branches, and these independent branches form branched optical waveguides 110.

[0048] The components in the various branch optical paths may be the same or different. For example, some branch optical paths include a first evanescent coupler 120, a phase modulator 130, a second evanescent coupler 140, and a first optical port coupler 150; other branch optical paths include a first evanescent coupler 120, other components (active or passive components other than the phase modulator), a second evanescent coupler 140, and a first optical port coupler 150; yet another example is that each branch optical path includes a first evanescent coupler 120 and a phase modulator. 130, second evanescent coupler 140 and first optical port coupler 150; or, for example, a branch optical path includes a first evanescent coupler 120, a phase modulator 130, a second evanescent coupler 140 and a first optical port coupler 150, and all other branch optical paths include a first evanescent coupler 120, other devices (active or passive devices other than the phase modulator), a second evanescent coupler 140 and a first optical port coupler 150, etc.

[0049] The phase modulator 130 described above is capable of changing the phase in an optical signal, and the phase modulator 130 is configured to modulate the optical signal.

[0050] In one embodiment, the second end of the first optical port coupler 150 is configured to connect to an external component.

[0051] Optionally, the external component can be an optical fiber coil, an on-chip optical waveguide coil, etc., and the external component can be selected according to the actual situation.

[0052] Understandably, if the second end of the first optical port coupler 150 is connected to the optical fiber coil or the on-chip optical waveguide coil, then the modular chip 100 and the optical fiber coil, or the modular chip 100 and the on-chip optical waveguide coil, can realize the function of a gyroscope, thereby forming a gyroscope chip, which can be used to replace traditional rotating gyroscopes, microelectromechanical vibration gyroscopes, etc.

[0053] In the above implementation process, by integrating components such as the branch optical waveguide 110, the first evanescent wave coupler 120, the phase modulator 130, the second evanescent wave coupler 140, and the first optical port coupler 150 into a modular chip 100, the modular chip 100 can be used to connect with one or more components to achieve different functions, thereby increasing the versatility of the modular chip 100 and reducing the chip manufacturing cost.

[0054] In one possible implementation, such as Figure 2 As shown, the modular chip 100 also includes a polarizer 160 and a multimode interference coupler 170.

[0055] The second end of the branch waveguide 110 is connected to the first end of the polarizer 160, and the second end of the polarizer 160 is connected to the first end of the multimode interference coupler 170; the second end of the multimode interference coupler 170 is connected to one or more optoelectronic devices.

[0056] The polarizer 160 here can convert light waves vibrating in multiple directions into light vibrating in a specific direction. That is, the polarizer 160 refers to a device used to obtain polarized light from natural light.

[0057] The aforementioned multimode interference coupler 170 refers to an integrated optical device that operates based on the principle of multimode interference. The multimode interference coupler 170 is configured to split and / or combine optical signals.

[0058] It should be understood that the modular chip 100 can process optical signals in the following two ways:

[0059] Method 1: Multiple optoelectronic devices transmit optical signals to a multimode interference coupler 170. The multimode interference coupler 170 couples multiple optical signals from the optoelectronic devices and then transmits them to a polarizer 160. The polarizer 160 acquires the polarized light from the coupled optical signal and transmits the polarized light to a branch waveguide 110. The branch waveguide 110 splits the polarized light into multiple paths, which are then transmitted to their respective branch optical paths. The optical signal in each branch optical path is transmitted to a phase modulator 130 through a first evanescent wave coupler 120 in that branch optical path. After processing the corresponding optical signal, the phase modulator 130 transmits the processed optical signal through a second evanescent wave coupler 140 to a first optical port coupler 150. The first optical port coupler 150 then transmits the optical signal to the outside of the modular chip 100.

[0060] Method 2: The first optical coupler 150 transmits the optical signal to the phase modulator 130 through the second evanescent wave coupler 140. After processing the corresponding optical signal, the phase modulator 130 transmits the processed optical signal to the second end of the branch optical waveguide 110 through the first evanescent wave coupler 120. The branch optical waveguide 110 transmits the optical signal to the polarizer 160. The polarizer 160 acquires the polarized light in the coupled optical signal and transmits the polarized light to the multimode interference coupler 170. The multimode interference coupler 170 splits the polarized light into multiple beams and transmits each beam to the corresponding optoelectronic device.

[0061] The optical signal processing method of the modular chip 100 described above is merely exemplary, and the optical signal processing method of the modular optical chip can be selected according to the actual situation.

[0062] In the above implementation process, by setting a polarizer 160 and a multi-module interference coupler in the modular chip 100, the polarizer 160 can convert optical signals with multiple vibration directions into optical signals with vibration in a set direction, thereby enhancing the optical signal and improving the accuracy of optical signal processing. Furthermore, the multi-module interference coupler can split the optical signal into multiple beams or combine multiple beams, enabling the modular chip 100 to be connected to one or more optoelectronic devices to achieve one or more functions, thus expanding the application scenarios of the modular chip 100.

[0063] In one possible implementation, the multimode interference coupler 170 includes a DC coupler, or a one-to-two multimode interferometer, or a two-to-two multimode interferometer.

[0064] A DC coupler is an electronic component that transmits signals between circuits through a specific mechanism. This DC coupler can transmit an optical signal from one optical path to another, or distribute an optical signal from one optical path to multiple optical paths.

[0065] The one-to-two multimode interferometer mentioned here is an integrated optical device based on the principle of multimode interference, used to split one optical signal into two optical signals.

[0066] A typical 1x2 multimode interferometer consists of three parts: an input waveguide, a multimode waveguide region, and two output waveguides. The multimode waveguide region is wide enough to support multiple higher-order waveguide modes. Specifically, when light travels from the input waveguide into the multimode waveguide region, multiple guided modes are excited within this region, allowing them to propagate in the multimode waveguide. After propagating a certain distance, these modes accumulate phase between different modes, generating one or more images of the input optical field at specific locations, thus achieving power distribution. The structural design of this 1x2 multimode interferometer gives it advantages such as low loss, large bandwidth, and good fault tolerance.

[0067] The aforementioned 2x2 multimode interferometer is an integrated optical device based on the principle of multimode interference, used to split and / or combine two optical signals.

[0068] A typical 2x2 multimode interferometer consists of two input waveguides, a multimode waveguide region, and two output waveguides. When two optical signals enter the multimode interference region from the two input waveguides, multiple higher-order guided modes are excited in this region. These modes, due to their different propagation constants, generate a phase difference during propagation. At specific locations, these modes resynthesize an optical field distribution that is the same as or similar to the input optical field through constructive interference, thereby achieving the distribution or merging of optical power. The structural design of this 2x2 multimode interferometer not only makes it compact and easy to manufacture, but also achieves excellent performance such as low loss, good tolerance, and low polarization dependence.

[0069] In the above implementation process, the multimode interference coupler 170 is configured as a DC coupler, a one-to-two multimode interferometer, or a two-to-two multimode interferometer, etc., optical devices. On the one hand, this improves the flexibility of the multimode interference coupler 170 configuration. On the other hand, it reduces the loss of optical signals in the multimode interference coupler 170, thereby increasing its fault tolerance.

[0070] In one possible implementation, the modular chip 100 further includes a second optical port coupler 180 and a photodetector 191; the first end of the second optical port coupler 180 and the first end of the photodetector 191 are both connected to the second end of the multimode interference coupler 170.

[0071] The second optical port coupler 180 is configured to couple external light into the modular chip 100 and / or couple light from the modular chip 100 to the outside of the modular chip 100.

[0072] The aforementioned photodetector 191 can be a germanium photodetector 191 obtained through epitaxy, or an indium phosphide photodetector 191 obtained through heterogeneous integration, etc. The photodetector 191 can be selected according to the actual situation.

[0073] In one embodiment, photodetector 191 is configured to process light in modular chip 100.

[0074] Specifically, the photodetector 191 can convert optical signals into electrical signals. This conversion process is based on the photoelectric effect, which states that when light interacts with matter, the electronic state inside the matter changes, thereby generating an electrical signal. In other words, the photodetector 191 can receive optical signals from a light source and convert them into electrical signals in the form of current or voltage, thereby enabling the detection, measurement, transmission, and processing of optical signals.

[0075] Understandably, the transmission process of the optical signal in the modular chip 100 is as follows: the first optical port coupler 150 transmits the optical signal to the phase modulator 130 through the second evanescent wave coupler 140. After processing the corresponding optical signal, the phase modulator 130 transmits the processed optical signal to the second end of the branch optical waveguide 110 through the first evanescent wave coupler 120. The branch optical waveguide 110 transmits the optical signal to the polarizer 160. The polarizer 160 acquires the polarized light in the coupled optical signal and transmits the polarized light to the multimode interference coupler 170. The multimode interference coupler 170 splits the polarized light into two beams, transmitting one beam to the photodetector 191. The photodetector 191 performs detection, measurement, transmission, and processing based on the acquired optical signal. The other beam is transmitted to the second optical port coupler 180, which transmits the acquired optical signal to the outside of the modular chip 100.

[0076] In the above implementation process, a second optical port coupler 180 and a photodetector 191 are set in the modular chip 100. The second optical port coupler 180 can transmit optical signals to the outside of the modular chip 100, and the photodetector 191 performs detection, measurement, transmission, and processing operations based on the acquired optical signals. That is, the modular chip 100 can perform multi-faceted signal processing, improving the functionality of the modular chip 100 and expanding its application scenarios.

[0077] In one possible implementation, such as Figure 3 As shown, the modular chip 100 also includes a laser 192.

[0078] The second end of the second optical port coupler 180 is connected to the laser 192.

[0079] The laser 192 here is configured to generate a light source.

[0080] It should be understood that the light source generated by laser 192 enters multimode interference coupler 170 through second optical port coupler 180. After the multimode interference coupler 170 combines the optical signals transmitted from the light source and other devices, the combined optical signal is transmitted to polarizer 160. Polarizer 160 acquires the polarized light in the coupled optical signal and transmits the polarized light to branch optical waveguide 110. Branch optical waveguide 110 splits the polarized light into multiple paths and transmits them to the corresponding branch optical paths. The optical signal in each branch optical path is transmitted to phase modulator 130 through first evanescent wave coupler 120 in that branch optical path. After the phase modulator 130 processes the corresponding optical signal, the processed optical signal is transmitted to first optical port coupler 150 through second evanescent wave coupler 140. First optical port coupler 150 transmits the optical signal to the outside of modular chip 100.

[0081] In the above implementation process, by setting a laser 192 in the modular chip 100, a light source can be emitted through the laser 192, so that the modular chip 100 does not need to be connected to an external power source, reducing the demand of the modular chip 100 for an external power source and improving the flexibility of the modular chip 100.

[0082] In one possible implementation, the phase modulator 130 is fabricated using thin-film lithium niobate.

[0083] Among them, thin-film lithium niobate is a crystal structure composed of niobium and lithium. This thin-film lithium niobate has a wide transparent window and a high refractive index, giving it excellent light transmittance in the optical communication band.

[0084] In the above implementation process, since thin-film lithium niobate has a wide transparent window and a high refractive index, by setting the material of the phase modulator 130 to include thin-film lithium niobate, the modulation efficiency can be improved and the loss of optical signal in the phase modulator 130 can be reduced.

[0085] like Figure 4 The diagram shown is a schematic of an optical gyroscope chip provided in an embodiment of this application, including: the modular chip 100 and the fiber optic ring 200 in the above embodiment.

[0086] In this design, the second end of the first optical port coupler 150 of the modular chip 100 is connected to the optical fiber ring 200.

[0087] The fiber optic ring 200 described here is an optical device made by winding special optical fiber materials into a ring structure according to specific volume, optical, and vibration requirements using specialized fiber optic ring winding equipment (such as a ring winding machine), through special winding methods, curing processes, and adhesives. The fiber length in the fiber optic ring 200 can range from tens of meters to tens of kilometers, while the inner diameter of the ring varies from a few millimeters to several thousand millimeters, and is mostly circular, although a small number of elliptical and other irregular shapes exist. This fiber optic ring 200 is configured for bidirectional optical transmission along the circumference.

[0088] The specific working process of this optical gyroscope chip is as follows: The second optical port coupler 180 transmits the optical signal to the multimode interference coupler 170, which then transmits the coupled optical signal to the polarizer 160. The polarizer 160 acquires the polarized light in the coupled optical signal and transmits it to the branch optical waveguide 110. The branch optical waveguide 110 splits the polarized light into multiple paths, which are then transmitted to their respective branch optical paths. The optical signal in each branch optical path is transmitted to the phase modulator 130 through the first evanescent wave coupler 120. The phase modulator 130 processes the corresponding optical signal and then transmits the processed optical signal to the first optical port coupler 150 through the second evanescent wave coupler 140. The first optical port coupler 150 transmits the optical signal to the fiber optic ring 200. The optical signal is transmitted bidirectionally on the fiber optic ring 200, generating a phase difference, which is then modulated by the phase modulator 130. The modulated light beam is then transmitted to polarizer 160, and from polarizer 160 to multimode interference coupler 170. Multimode interference coupler 170 then transmits the optical signal to second optical port coupler 180 and / or other optoelectronic devices. Finally, the inertia is determined by a detection element based on the acquired beam, thereby achieving inertial measurement.

[0089] In one embodiment, if the laser 192 is connected to the second optical port coupler 180, the laser 192 can provide a light source for the optical gyroscope chip. The light source provided by the laser 192 is processed by the phase modulator 130, multimode interference coupler 170, etc., before entering the fiber optic ring 200. After exiting the fiber optic ring 200, it is processed again by the phase modulator 130, multimode interference coupler 170, etc., before entering the optoelectronic device. The optoelectronic device determines the inertia based on the acquired optical signal. That is, inertial measurement is directly achieved through the optical signal inside the optical gyroscope chip, without relying on an external light source.

[0090] In the above implementation process, by connecting the fiber optic ring 200 to the modular chip 100, inertial measurement can be achieved through the cooperation between the modular chip 100 and the fiber optic ring 200, thereby replacing the rotating gyroscope or the microelectromechanical vibration gyroscope. Compared with the rotating gyroscope or the microelectromechanical vibration gyroscope, the gyroscope chip structure of this application is simpler and smaller, reducing the size of the gyroscope and achieving miniaturization. In addition, it has significant improvements over traditional gyroscopes in terms of suppressing signal offset caused by vibration and temperature, noise, bandwidth, lifespan, and cost.

[0091] In one possible implementation, the fiber optic loop 200 is formed by winding the fiber optic loop 200; or, the fiber optic loop 200 is formed by an optical waveguide coil integrated on a chip.

[0092] The "200-loop fiber optic ring" mentioned here refers to the practice of forming a ring structure by using a specific device with specific optical fibers. Because optical fibers are inexpensive and have extremely low transmission loss (down to a few tenths of a dB per meter), this method is highly effective.

[0093] The aforementioned method of integrating optical waveguide coils on a chip refers to using on-chip integrated optical waveguides, which can achieve a reduction in overall size. However, with the development of materials and process technology, the transmission loss of on-chip optical waveguides is becoming increasingly lower, simultaneously achieving miniaturization and high sensitivity.

[0094] In the above implementation process, due to the low cost and extremely low transmission loss of optical fiber, the method of forming the optical fiber ring 200 by winding the optical fiber ring 200 can reduce the cost of the optical fiber ring 200 while reducing the loss of optical signals in the optical fiber ring 200. In addition, forming the optical fiber ring 200 by integrating optical waveguides on a chip can reduce the overall size, realize the miniaturization of the optical fiber ring 200, and improve the sensitivity of the optical fiber ring 200.

[0095] In one possible implementation, such as Figure 5 As shown, the optical gyroscope chip is a heterogeneous integrated chip; the optical gyroscope chip includes: a first photonic chip and a second photonic chip; the second photonic chip is integrated on the first photonic chip.

[0096] The first photonic chip includes an insulating layer 210, a first optical waveguide 220, and a second optical waveguide 230. Both the first optical waveguide 220 and the second optical waveguide 230 are disposed inside the insulating layer 210. The first optical waveguide 220 is disposed on the side of the second optical waveguide 230 away from the second photonic chip. A first electrode pair 240 is disposed on the side of the first optical waveguide 220 close to the second photonic chip.

[0097] Here, the first optical waveguide 220 and the second optical waveguide 230 form a second optical port coupler 180 in the insulating layer 210.

[0098] In one embodiment, the first optical waveguide 220 is made of silicon or germanium; the second optical waveguide 230 is made of a low-loss material, such as silicon nitride.

[0099] The first and second photonic chips mentioned above are integrated together by bonding.

[0100] In one embodiment, the first photonic chip further includes a substrate 270; the substrate 270 is disposed on the side of the insulating layer 210 away from the second optical waveguide 230.

[0101] Optionally, such as Figure 6 As shown, a laser 192 light source can be disposed on the side of the insulating layer 210 away from the substrate 270.

[0102] In the above implementation process, by setting the optical gyroscope chip to be formed by heterogeneous integration of a first photonic chip and a second photonic chip, the diversity of the optical gyroscope can be increased, thereby increasing the application scenarios of the optical gyroscope.

[0103] In one possible implementation, the second photonic chip includes a third optical waveguide 250.

[0104] The third optical waveguide 250 has a second electrode pair 260 disposed on the side away from the first photonic chip.

[0105] The third optical waveguide 250 and the second optical waveguide 230 here form the second evanescent wave coupler 140.

[0106] The material of the third optical waveguide 250 is lithium niobate.

[0107] In one embodiment, the second photonic chip is disposed on the side of the first photonic chip insulating layer 210 away from the substrate 270.

[0108] Optionally, the second photonic chip also includes a substrate 270 and an insulating layer 210, with the substrate 270 of the second photonic chip located on the side of the third optical waveguide 250 away from the first photonic chip.

[0109] The specific working principle of the aforementioned optical gyroscope chip is as follows:

[0110] The light source emitted by the laser 192 enters the second optical waveguide 230 through the second optical port coupler 180 of the first photonic chip and propagates. After passing through the multimode interference coupler 170, it is split into two optical signals by the polarizer 160 and the branch optical waveguide 110. These two optical signals enter the third optical waveguide 250 of the second photonic chip through the second evanescent wave coupler 140 and then enter the phase modulator 130. The light in the phase modulator 130 then passes through the fiber optic ring 200 and returns along the same path.

[0111] In this process, under the influence of changes in velocity and angle, the two optical beams in the fiber optic ring 200 will generate a phase difference. When the two optical beams with this phase difference return from the waveguide coil, they will pass through the phase modulator 130. The phase modulator 130 modulates the optical beams with this phase difference, ultimately converting the phase difference information into light intensity information, and then returns to the multimode interference coupler 170 through the original optical path. One of the optical beams after passing through the multimode interference coupler 170 will pass through the second optical port coupler 180 from the second optical waveguide 230 into the first optical waveguide 220, and then enter the photodetector 191 integrated in the first optical waveguide 220 to demodulate the light intensity information and finally output an electrical signal.

[0112] In the above implementation process, by setting a second electrode pair 260 on the third optical waveguide 250, the second electrode pair 260 can be used to form a photodetector, thereby monitoring the optical signal, increasing the function of the optical gyroscope chip, and thus increasing the application scenarios of the optical gyroscope.

[0113] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0114] In addition, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0115] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks. It should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0116] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0117] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A modular chip, characterized in that, include: Branched optical waveguide and branched optical path; the first end of the branched optical waveguide is divided into multiple waveguide branches, and each waveguide branch is connected to one of the branched optical paths; At least one of the branch optical paths includes a first evanescent wave coupler, a phase modulator, a second evanescent wave coupler, and a first optical port coupler; The first end of the first evanescent wave coupler is connected to the first end of the waveguide branch, and the second end of the first evanescent wave coupler is connected to the first end of the phase modulator. The second end of the phase modulator is connected to the first end of the second evanescent wave coupler, and the second end of the second evanescent wave coupler is connected to the first end of the first optical port coupler. The second end of the branch optical waveguide is configured to be connected to an active or passive device, and the second end of the first optical port coupler is configured to be connected to an external component.

2. The modular chip according to claim 1, characterized in that, Also includes: Polarizer and multimode interference coupler; The second end of the branch optical waveguide is connected to the first end of the polarizer, and the second end of the polarizer is connected to the first end of the multimode interference coupler. The second end of the multimode interference coupler is connected to one or more optoelectronic devices.

3. The modular chip according to claim 2, characterized in that, The multimode interference coupler includes a DC coupler, or a one-to-two multimode interference coupler, or a two-to-two multimode interference coupler.

4. The modular chip according to claim 2, characterized in that, Also includes: Second optical port coupler and photodetector; The first end of the second optical port coupler and the first end of the photodetector are both connected to the second end of the multimode interference coupler; The second optical port coupler is configured to couple external light into the modular chip and / or couple light from the modular chip to the outside of the modular chip. The photodetector is configured to process light in the modular chip.

5. The modular chip according to claim 4, characterized in that, Also includes: Laser; The second end of the second optical port coupler is connected to the laser.

6. The modular chip according to claim 1, characterized in that, The phase modulator is made of thin-film lithium niobate.

7. An optical gyroscope chip, characterized in that, include: The modular chip and fiber optic ring as described in any one of claims 1-6; The second end of the first optical port coupler of the modular chip is connected to the optical fiber ring; The fiber optic ring is configured to transmit light bidirectionally along the circumferential direction.

8. The optical gyroscope chip according to claim 7, characterized in that, in, The fiber optic ring is formed by wrapping optical fibers around it; or... The fiber optic ring is formed by an optical waveguide coil integrated on the chip.

9. The optical gyroscope chip according to claim 7, characterized in that, The optical gyroscope chip is a heterogeneous integrated chip; the optical gyroscope chip includes: a first photonic chip and a second photonic chip; The second photonic chip is integrated on the first photonic chip; The first photonic chip includes: an insulating layer, a first optical waveguide, and a second optical waveguide; Both the first optical waveguide and the second optical waveguide are disposed inside the insulating layer; The first optical waveguide is disposed on the side of the second optical waveguide away from the second photonic chip; A first electrode pair is provided on the side of the first optical waveguide close to the second photonic chip; The first optical waveguide and the second optical waveguide form a second optical port coupler in the insulating layer.

10. The optical gyroscope chip according to claim 9, characterized in that, The second photonic chip includes: a third optical waveguide; A second electrode pair is provided on the side of the third optical waveguide away from the first photonic chip; The third optical waveguide and the second optical waveguide form a second evanescent wave coupler.

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