Voice processing module and electronic equipment

Abstract

The invention discloses a voice processing module and electronic equipment. The voice processing module comprises a substrate, a first microphone, a second microphone and a phase processing module, wherein the first microphone, the second microphone and the phase processing module are arranged on the substrate; a main controller is arranged on the substrate; the hole distance between the center point of the first sound hole in the first microphone and the center point of the second sound hole in the second microphone ranges from 2mm to 6mm. The phase processing module is in signal connection with the main controller and comprises a phase shifting module and a phase comparison module, and the phase shifting module is arranged on a signal output channel of one of the first microphone and the second microphone and used for delaying the phase of an audio signal on the corresponding signal output channel; the phase comparison module is used for acquiring a phase difference signal of an audio signal acquired by the first microphone and an audio signal acquired by the second microphone, and the main controller controls an output signal of the voice processing module according to the phase difference signal. The voice processing module and the electronic equipment aim at reducing the size of the voice processing module and the electronic equipment while achieving the effects of directional pickup, voice enhancement, noise reduction and the like.

Description

Technical Field

[0001] This invention relates to the field of acoustics, and in particular to a voice processing module and electronic device. Background Technology

[0002] Voice input is a crucial way for users to interact with smart devices; therefore, smart devices typically include a voice processing module. In related technologies, this module usually houses two acoustic sensors at different locations. To achieve directional sound pickup, voice enhancement, and noise reduction, two common processing schemes are employed: one is a primary and secondary microphone collaboration scheme, where the primary microphone is closer to the target sound source, and the secondary microphone is further away. Since the microphone closer to the target sound source receives a larger amplitude voice signal, adaptive filtering is performed by comparing the two signals to eliminate noise. The other scheme utilizes the phase difference between the signals collected by the two microphones for beamforming. By weighted superposition of the signals from the two microphones, an "acoustic beam" pointing towards the target sound source is formed, enhancing the voice signal within the beam and suppressing noise outside the beam. However, both of these schemes require a minimum distance of 30mm between the microphone apertures, resulting in a larger voice processing module and consequently, a larger electronic device. Summary of the Invention

[0003] The main objective of this invention is to provide a voice processing module and an electronic device that achieves effects such as directional sound pickup, voice enhancement, and noise reduction while reducing the size of the voice processing module, thereby reducing the size of the electronic device.

[0004] To achieve the above objectives, the present invention proposes a voice processing module comprising:

[0005] A substrate on which a main controller is mounted; A first microphone is disposed on the substrate, and the first microphone has a first sound hole; A second microphone is disposed on the substrate. The second microphone has a second sound hole. The distance between the center points of the first sound hole and the second sound hole is between 2 mm and 6 mm. A phase processing module is connected to the main controller. The phase processing module includes a phase shifting module and a phase comparison module. The phase shifting module is located on the signal output path of one of the first microphone and the second microphone to delay the phase of the audio signal on the corresponding signal output path. The phase comparison module is used to acquire the phase difference signal between the audio signal acquired by the first microphone and the audio signal acquired by the second microphone. The main controller controls the output signal of the voice processing module according to the phase difference signal.

[0006] In one embodiment of the present invention, the first microphone includes a first housing and a first MEMS chip, the first housing and the substrate enclose a first receiving cavity, the first sound hole communicates with the first receiving cavity, and the first MEMS chip is electrically connected to the substrate. The second microphone includes a second housing and a second MEMS chip. The second housing and the substrate enclose a second receiving cavity. The second sound hole communicates with the second receiving cavity. The second MEMS chip is electrically connected to the substrate.

[0007] In one embodiment of the present invention, the voice processing module further includes an ASIC chip, which is disposed in the first accommodating cavity and / or the second accommodating cavity, and the ASIC chip is signal-connected to the first MEMS chip, the second MEMS chip and the main controller.

[0008] In one embodiment of the present invention, the first receiving cavity is located inside the second receiving cavity; Alternatively, the first receiving cavity and the second receiving cavity may be arranged side by side.

[0009] In one embodiment of the present invention, the first sound hole and the second sound hole are both disposed on the substrate, the first MEMS chip is disposed corresponding to the first sound hole, and the second MEMS chip is disposed corresponding to the second sound hole.

[0010] In one embodiment of the present invention, at least a portion of the first acoustic hole and the second acoustic hole extend along the width direction of the substrate.

[0011] In one embodiment of the present invention, the first acoustic hole is disposed in the first housing, and the substrate is further provided with a first rear acoustic cavity communicating with the first receiving cavity, and the first MEMS chip is disposed corresponding to the first rear acoustic cavity. The second acoustic hole is disposed in the second housing, and the substrate also has a second rear acoustic cavity that communicates with the second receiving cavity. The second MEMS chip is disposed correspondingly to the second rear acoustic cavity.

[0012] In one embodiment of the present invention, both the first rear acoustic cavity and the second rear acoustic cavity extend toward the width direction of the substrate.

[0013] In one embodiment of the present invention, both the first housing and the second housing are made of conductive materials.

[0014] The present invention also provides an electronic device, which includes the above-described voice processing module.

[0015] The voice processing module of this invention includes a substrate, a first microphone, a second microphone, and a phase processing module disposed on the substrate. The first microphone has a first sound hole, and the second microphone has a second sound hole. The first and second microphones convert sound vibrations into electrical signals for output. Since the distance between the center points of the first and second sound holes is between 2mm and 6mm, which is much smaller than the 30mm in the traditional solution, in order to compensate for the problems caused by insufficient spatial sampling distance due to the small distance between the sound holes of the two microphones, resulting in weak phase / amplitude differences, loss of directionality, and collapse of noise reduction capabilities, a phase processing module is set in the voice processing module. The phase comparison module includes a phase shifting module and a phase comparison module. The phase shifting module is located on the signal output path of one of the first and second microphones to delay the phase of the audio signal on the corresponding signal output path, thereby increasing the phase difference between the audio signals collected by the first and second microphones. The phase comparison module obtains the phase difference signal between the audio signals collected by the first and second microphones. The main controller controls the output signal of the voice processing module according to the phase difference signal, thereby achieving directional sound pickup, voice enhancement, and noise reduction effects with a small distance between the sound holes of the two microphones in the voice processing module, thus reducing the size of the voice processing module and consequently reducing the size of the electronic device. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a structural schematic diagram of an embodiment of the voice processing module of the present invention; Figure 2 This is a structural schematic diagram of another embodiment of the voice processing module of the present invention. Figure 3 This is a schematic diagram of the structure of an embodiment of the voice processing module of the present invention; Figure 4 This is a schematic diagram of another embodiment of the voice processing module of the present invention; Figure 5 This is a schematic diagram of another embodiment of the voice processing module of the present invention; Figure 6 This is a schematic diagram of another embodiment of the voice processing module of the present invention; Figure 7 This is a schematic diagram of another embodiment of the speech processing of the present invention.

[0018] Explanation of icon numbers: 10. Substrate; 11. Main controller; 20. First microphone; 21. First housing; 22. First sound hole; 23. First MEMS chip; 25. First receiving cavity; 26. First rear sound cavity; 27. Second rear sound cavity; 30. Second microphone; 31. Second housing; 32. Second sound hole; 33. Second MEMS chip; 34. ASIC chip; 35. Second receiving cavity; 41. Phase shifting module; 43. Phase comparison module; 100. Voice processing module.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0022] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; taking "A and / or B" as an example, it includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0024] Voice input is a crucial way for users to interact with smart devices; therefore, smart devices typically include a voice processing module. In related technologies, this module usually houses two acoustic sensors at different locations. To achieve directional sound pickup, voice enhancement, and noise reduction, two common processing schemes are employed: one is a primary and secondary microphone collaboration scheme, where the primary microphone is closer to the target sound source, and the secondary microphone is further away. Since the microphone closer to the target sound source receives a larger amplitude voice signal, adaptive filtering is performed by comparing the two signals to eliminate noise. The other scheme utilizes the phase difference between the signals collected by the two microphones for beamforming. By weighted superposition of the signals from the two microphones, an "acoustic beam" pointing towards the target sound source is formed, enhancing the voice signal within the beam and suppressing noise outside the beam. However, both of these schemes require a minimum distance of 30mm between the microphone apertures, resulting in a larger voice processing module and consequently, a larger electronic device.

[0025] To address the aforementioned technical problems, this invention proposes a voice processing module 100.

[0026] Reference Figure 1 and Figure 3In one embodiment of the present invention, the voice processing module 100 includes a substrate 10 and a first microphone 20, a second microphone 30, and a phase processing module disposed on the substrate 10. A main controller 11 is disposed on the substrate 10. The first microphone 20 is provided with a first sound hole 22; the second microphone 30 is provided with a second sound hole 32. The distance between the center points of the first sound hole 22 and the second sound hole 32 is between 2 mm and 6 mm. The phase processing module is signal-connected to the main controller 11. The phase processing module includes a phase shifting module 41 and a phase comparison module 43. The phase shifting module 41 is disposed on the signal output path of one of the first microphone 20 and the second microphone 30 to delay the phase of the audio signal on the corresponding signal output path. The phase comparison module 43 is used to obtain the phase difference signal between the audio signal collected by the first microphone 20 and the audio signal collected by the second microphone 30. The main controller 11 controls the output signal of the voice processing module 100 according to the phase difference signal.

[0027] The main function of the voice processing module 100 is to acquire, process, and output voice signals to achieve applications such as voice recognition, voice enhancement, noise reduction, or directional sound pickup. The voice processing module 100 can be used in various smart electronic devices such as smartphones, smartwatches, and smart glasses as a voice input interface for human-computer interaction.

[0028] The substrate 10 serves as the physical support and electrical connection platform for the voice processing module 100. The substrate 10 can adopt a multilayer printed circuit board (PCB) structure. On the substrate 10, the main controller 11 can be a microcontroller unit (MCU) or a digital signal processor (DSP) responsible for the overall control and signal processing tasks of the module. The main controller 11 is fixed on it by surface mount technology (SMT).

[0029] The first microphone 20 and the second microphone 30 are used to collect sound wave signals from the environment and convert them into electrical signals. The first microphone 20 and the second microphone 30 can be traditional electret condenser microphones or MEMS microphones. The first microphone 20 and the second microphone 30 can be directly soldered to designated positions on the substrate 10. Each microphone has a corresponding sound hole. For example, the first microphone 20 has a first sound hole 22, and the second microphone 30 has a second sound hole 32. Sound waves from the environment enter the interior of the first microphone 20 and the second microphone 30 through the first sound hole 22 and the second sound hole 32, respectively. Therefore, the position and size of the first sound hole 22 and the second sound hole 32 have an impact on the acoustic characteristics of the microphone.

[0030] The phase processing module includes a phase shifting module 41 and a phase comparison module 43. These modules can be circuit units or digital signal processing units. The phase shifting module 41 adjusts the phase of the input audio signal, which can be done by delaying the phase by an amplitude within 180°. Understandably, the phase shifting module 41 can be located on the output path of either the first microphone 20 or the second microphone 30. That is, the phase shifting module 41 can delay the phase of either the audio signal acquired by the first microphone 20 or the audio signal acquired by the second microphone 30, as long as it increases the phase difference between the audio signals acquired by the first microphone 20 and the second microphone 30; no limitation is imposed here.

[0031] In one specific embodiment, the phase shifting module 41 can be an analog RC phase shifting circuit connected in series in the signal output path of the first microphone 20 / second microphone 30 to provide a fixed phase delay; or, the phase shifting module 41 can be a digital filter that achieves an adjustable phase delay through an algorithm after the signal is digitized.

[0032] The phase comparison module 43 is used to receive audio signals collected by the first microphone 20 and the second microphone 30, calculate the phase difference of these signals at a specific frequency or time point, and output a phase difference signal. The phase difference signal reflects the phase difference between two audio signals. The phase difference signal carries spatial information such as the direction of the sound source and the distance of the sound source, which can provide a signal basis for the decision-making or control of the main controller 11.

[0033] In one specific embodiment, the phase comparison module 43 can be an analog phase detector that directly compares the phases of the analog signals output by the two microphones and outputs a voltage signal representing the phase difference; or, the phase comparison module 43 can also be a digital signal processing unit that performs Fast Fourier Transform (FFT) and other processing on the digital audio signals of the first microphone 20 and the second microphone 30 to calculate accurate phase difference data.

[0034] The main controller 11 controls the output signal of the speech processing module 100 based on the phase difference signal. For example, the main controller 11 can determine the direction of the sound source based on the phase difference signal and adjust the pickup directivity of the module accordingly to enhance the speech signal from the target direction while suppressing noise from other directions. Specifically, when the phase difference signal indicates that the sound source is located in front of the speech processing module 100, the main controller 11 can weight and superimpose the two signals to form a directional beam.

[0035] The speech processing module 100 of this invention includes a substrate 10, a first microphone 20, a second microphone 30 disposed on the substrate 10, and a phase processing module. The first microphone 20 has a first sound hole 22, and the second microphone 30 has a second sound hole 32. The first microphone 20 and the second microphone 30 convert sound vibrations into electrical signals for output. Since the distance between the center points of the first sound hole 22 and the second sound hole 32 is between 2mm and 6mm, which is much smaller than the 30mm spacing in traditional solutions, to compensate for the problems of weak phase / amplitude differences, loss of directionality, and collapse of noise reduction capabilities caused by insufficient spatial sampling distance due to the small distance between the sound holes of the two microphones, a phase processing module is provided in the speech processing module 100. The phase comparison module 43 includes an image shifting module and a phase comparison module 43. The phase shifting module 41 is disposed on the signal output path of one of the first microphone 20 and the second microphone 30 to delay the corresponding signal output. The phase difference of the audio signal on the output path increases the phase difference between the audio signals collected by the first microphone 20 and the second microphone 30. The phase comparison module 43 obtains the phase difference signal between the audio signals collected by the first microphone 20 and the second microphone 30. The main controller 11 controls the output signal of the voice processing module 100 according to the phase difference signal, thereby achieving directional sound pickup, voice enhancement, noise reduction and other effects when the distance between the sound holes of the two microphones in the voice processing module 100 is small, thereby reducing the size of the voice processing module 100 and thus reducing the size of the electronic device.

[0036] By setting a phase processing module on the voice processing module 100, the distance between the sound holes in the first microphone 20 and the second microphone 30 can be much smaller than the 30mm distance in the traditional solution, achieving effects such as directional sound pickup, voice enhancement, and noise reduction. This reduces the distance between the sound holes in the first microphone 20 and the second microphone 30 to 2 to 6mm, thereby greatly reducing the size of the voice processing module 100 and thus reducing the size of the electronic device.

[0037] In traditional electronic device development, the voice processing module is developed independently. However, the different positions of the two acoustic sensors, the cavity structure, and the performance of the acoustic sensors all affect the final processing effect of the algorithm. This necessitates spending a significant amount of time debugging the algorithm based on the actual arrangement of the two acoustic sensors, leading to algorithm complexity, long system development cycles, and high costs. In the technical solution of this application, by incorporating a phase processing module into the voice processing module 100, the distance between the sound holes of the two microphones can be compressed to 2-6mm while ensuring sound quality. This significantly reduces the size of the voice processing module 100, while ensuring stable acoustic performance and a compact structure. This allows the voice processing module 100 to be applied in mobile phones and smart wearable devices, expanding its application range and shortening the development cycle of electronic devices.

[0038] Reference Figures 3 to 7 In one embodiment of the present invention, the first microphone 20 includes a first housing 21 and a first MEMS chip 23. The first housing 21 and the substrate 10 surround to form a first receiving cavity 25. The first sound hole 22 communicates with the first receiving cavity 25. The first MEMS chip 23 is electrically connected to the substrate 10. The second microphone 30 includes a second housing 31 and a second MEMS chip 33. The second housing 31 and the substrate 10 enclose a second receiving cavity 35. The second sound hole 32 communicates with the second receiving cavity 35. The second MEMS chip 33 is electrically connected to the substrate 10.

[0039] In one embodiment of this application, the first housing 21 and the substrate 10 enclose a first receiving cavity 25, providing physical protection and structural support for the first MEMS chip 23, and also forming a specific acoustic space. It is understood that the first housing 21 and the second housing 31 can also be formed by a circuit board, which is not limited here. The first MEMS chip 23, as a core acoustic sensor, is used to efficiently and accurately convert received sound wave signals into electrical signals. The first receiving cavity 25 can be a semi-enclosed or fully enclosed space to optimize acoustic performance and protect the first MEMS chip 23 from external environmental influences. Sound waves from the environment enter the first receiving cavity 25 through the first sound hole 22 and reach the channel of the first MEMS chip 23. The first sound hole 22 directly affects the coupling efficiency of sound waves and the directivity of the microphone. The first MEMS chip 23 transmits signals and supplies power to the circuitry on the substrate 10 via electrical connections. These electrical connections can typically be achieved through welding, conductive adhesive, or flexible circuit boards, ensuring that the audio signals collected by the first microphone 20 can be stably and reliably transmitted to the main controller 11 for subsequent processing.

[0040] The structure of the second microphone 30 is similar to that of the first microphone 20. The second housing 31 and the substrate 10 enclose a second receiving cavity 35, providing physical protection and structural support for the second MEMS chip 33. The second MEMS chip 33 is used to convert the received acoustic wave signal into an electrical signal. The second receiving cavity 35 can be a semi-enclosed or fully enclosed space to optimize acoustic performance and protect the second MEMS chip 33 from external environmental influences. Acoustic waves from the environment enter the second receiving cavity 35 through the second sound hole 32 and reach the channel of the second MEMS chip 33. The second sound hole 32 directly affects the coupling efficiency of the acoustic wave and the directivity of the microphone. The second MEMS chip 33 transmits signals and supplies power to the circuit on the substrate 10 through electrical connections. Electrical connections can typically be achieved through soldering, conductive adhesive, or flexible circuit boards, ensuring that the audio signals collected by the second microphone 30 can be stably and reliably transmitted to the main controller 11 for subsequent processing.

[0041] Reference Figures 4 to 7 In one embodiment, the first microphone 20 and the second microphone 30 may be arranged symmetrically. This symmetrical structural design helps to ensure that the two microphones have a high degree of consistency when acquiring audio signals, thereby providing accurate and reliable raw data for subsequent phase comparison.

[0042] Reference Figure 3 In another embodiment, the first microphone 20 may be disposed inside the second microphone 30. By disposing of the first microphone 20 inside the second microphone 30, this nested structural design helps to make the voice processing module 100 more compact, thereby reducing the overall size.

[0043] Reference Figures 3 to 7 In one embodiment of the present invention, the voice processing module 100 further includes an ASIC chip 34, which is disposed in the first receiving cavity 25 and / or the second receiving cavity 35, and is signal-connected to the first MEMS chip 23, the second MEMS chip 33 and the main controller 11.

[0044] In one embodiment of this application, the ASIC chip 34 integrates multiple functions, such as analog-to-digital conversion (ADC), digital signal processing (DSP), noise suppression, echo cancellation, gain control, and interface management with the first MEMS chip 23, the second MEMS chip 33, and the main controller 11. The ASIC chip 34 can preprocess and optimize the raw analog or digital signals output by the first MEMS chip 23 and the second MEMS chip 33, reducing the burden on the main controller 11 and improving signal quality. The ASIC chip 34 is connected to the main controller 11 via a signal connection, specifically by soldering the ASIC chip 34 to the substrate 10, allowing the substrate 10 to provide signal transmission and power supply to the ASIC chip 34. The ASIC chip 34 undertakes front-end tasks such as analog-to-digital conversion and preliminary digital signal processing, reducing the computational burden on the main controller 11 and enabling the main controller 11 to focus on more complex speech recognition or application-layer tasks, thereby improving the response speed and processing efficiency of the entire speech processing module 100. In addition, this highly integrated design makes full use of the internal space of the microphone module, reduces the overall module size, optimizes space utilization, simplifies the wiring complexity on the substrate 10, and reduces design difficulty and manufacturing costs.

[0045] In one embodiment, there may be only one ASIC chip 34. When there is only one ASIC chip 34, the ASIC chip 34 may be disposed in the first receiving cavity 25 or the second receiving cavity 35. The ASIC chip 34 is connected to the first MEMS chip 23 and the second MEMS chip 33 through signal lines, and the ASIC chip 34 is connected to the main controller via signals.

[0046] In another embodiment, there may be two ASIC chips 34, which are respectively disposed in the first receiving cavity 25 and the second receiving cavity 35. The ASIC chip 34 located in the first receiving cavity 25 is connected to the first MEMS chip 23 via a signal line, and the ASIC chip 34 located in the second receiving cavity 35 is connected to the second MEMS chip 33 via a signal line. Both ASIC chips 34 are electrically connected to the substrate 10 by soldering. The ASIC chip 34 is signal-connected to the first MEMS chip 23, the second MEMS chip 33, and the main controller 11. The ASIC chip 34 receives the raw analog signals from the first MEMS chip 23 and the second MEMS chip 33 and performs analog-to-digital conversion (ADC) to convert them into digital signals. The ASIC chip 34 receives the digital signals output by the first MEMS chip 23 and the second MEMS chip 33 and performs further digital signal processing. The processed audio data of the ASIC chip 34, such as a digital audio stream that has undergone noise reduction, echo cancellation, gain control, or beamforming preprocessing, will be transmitted to the main controller 11 through a digital interface to ensure efficient signal preprocessing and data transmission.

[0047] Reference Figures 3 to 7 In one embodiment of the present invention, the first receiving cavity 25 is located inside the second receiving cavity 35; or, the first receiving cavity 25 and the second receiving cavity 35 are arranged side by side.

[0048] Reference Figure 3 In one embodiment, when the first receiving cavity 25 is located inside the second receiving cavity 35, it means that the first housing 21 and the second housing 31 are disposed on the same surface of the substrate 10, and the size of the first housing 21 is smaller and the size of the second housing 31 is larger. The first housing 21 is surrounded by the second housing 31, so that the first receiving cavity 25 is located inside the second receiving cavity 35. This structural design helps to make the voice processing module 100 structurally compact, thereby reducing the overall volume. In addition, this structural layout may also form specific coupling or isolation effects acoustically, which helps to improve the audio acquisition quality in specific scenarios.

[0049] Reference Figures 4 to 7In another embodiment, the first receiving cavity 25 formed by the first housing and the substrate 10, and the second receiving cavity 35 formed by the second housing and the substrate 10, can be arranged side by side on the substrate 10. They can be linearly arranged along the length or width direction of the substrate 10, or arranged in other adjacent but non-overlapping ways. This structural design provides greater flexibility in the packaging of the first microphone 20 and the second microphone 30, and also facilitates adjusting the aperture spacing between the first sound hole 22 and the second sound hole 32 according to actual needs to optimize the acquisition accuracy of the phase difference signal, thereby improving the effect of the main controller 11 in controlling the output signal of the voice processing module 100 based on the phase difference signal. Furthermore, the side-by-side arrangement of the first receiving cavity 25 and the second receiving cavity 35 also helps to simplify the manufacturing and assembly process and reduce production costs.

[0050] Reference Figure 3 , Figure 4 , Figure 6 as well as Figure 7 In one embodiment of the present invention, the first sound hole 22 and the second sound hole 32 are both disposed on the substrate 10, the first MEMS chip 23 is disposed corresponding to the first sound hole 22, and the second MEMS chip 33 is disposed corresponding to the second sound hole 32.

[0051] In one embodiment of this application, sound waves from the external environment enter the interiors of the first receiving cavity 25 and the second receiving cavity 35 through the first acoustic hole 22 and the second acoustic hole 32, respectively, so that the first MEMS chip 23 and the second MEMS chip 33 can acquire audio signals. The first acoustic hole 22 and the second acoustic hole 32 can be directly formed on the substrate 10, and can be achieved by drilling, laser drilling, or molding on the substrate 10. Directly placing the first acoustic hole 22 and the second acoustic hole 32 on the substrate 10 helps simplify the structure of the voice processing module 100, reduces additional acoustic channel components, and thus reduces manufacturing complexity and cost. The first MEMS chip 23 is configured to correspond with the first sound hole 22, meaning that the diaphragm of the first MEMS chip 23 is positioned opposite to the first sound hole 22, and the diaphragm of the second MEMS chip 33 is configured to correspond with the second sound hole 32. This ensures that sound waves entering from the external environment through the first sound hole 22 and the second sound hole 32 can be efficiently and directly transmitted to the first MEMS chip 23 and the second MEMS chip 33, thereby minimizing acoustic loss and distortion, effectively reducing the attenuation and reflection of sound waves during transmission, and improving the acoustic sensitivity and signal integrity of the microphone.

[0052] Understandably, the first acoustic hole 22 and the second acoustic hole 32 can be two opposite surfaces that directly penetrate the thickness direction of the substrate 10. That is, the channel paths of the first acoustic hole 22 and the second acoustic hole 32 on the substrate 10 are relatively short. Such a structural design can simplify the processing of the first acoustic hole 22 and the second acoustic hole 32, thereby reducing manufacturing complexity and cost.

[0053] In another embodiment, the first acoustic hole 22 and the second acoustic hole 32 may also form a bend inside the substrate 10, that is, one end of the first acoustic hole 22 and the second acoustic hole 32 penetrates a surface in the thickness direction of the substrate 10, and the other end penetrates a surface in the width direction of the substrate 10, that is, penetrates the side of the substrate 10, so that at least part of the first acoustic hole 22 and the second acoustic hole 32 extends along the width direction of the substrate 10, and the path of the first acoustic hole 22 and the second acoustic hole 32 forms an "L" shape. This design can increase the spacing between the first acoustic hole 22 and the second acoustic hole 32, and can effectively receive acoustic area in a specific direction, thereby optimizing the sound capture efficiency and directionality.

[0054] Reference Figure 5 In one embodiment of the present invention, the first acoustic hole 22 is disposed in the first housing 21, and the substrate 10 is further provided with a first rear acoustic cavity 26 communicating with the first receiving cavity 25. The first MEMS chip 23 is disposed correspondingly to the first rear acoustic cavity 26. The second acoustic hole 32 is provided on the second housing 31, and the substrate 10 also has a second rear acoustic cavity 27 that communicates with the second receiving cavity 35. The second MEMS chip 33 is correspondingly provided with the second rear acoustic cavity 27.

[0055] In one embodiment of this application, the first sound hole 22 and the second sound hole 32 can be disposed not only on the substrate 10, but also on the first housing 21 and the second housing 31. The first housing 21 and the second housing 31 are independent components, fixed to the substrate 10 by welding, bonding, or snap-fitting. The shapes of the first housing 21 and the second housing 31 can be set according to actual needs. This design allows for a more flexible path for sound waves to enter the microphone. For example, the sound wave introduction can be optimized by adjusting the shape of the housing, the position and size of the sound hole, thereby better adapting to different acoustic environments and sound pickup needs.

[0056] By providing a first acoustic hole 22 on the first housing 21 and a second acoustic hole 32 on the second housing 31, and correspondingly providing a first rear acoustic cavity 26 communicating with the first receiving cavity 25 and a second rear acoustic cavity 27 communicating with the second receiving cavity 35 on the substrate 10, the first MEMS chip 23 corresponds to the first rear acoustic cavity 26, and the second MEMS chip 33 corresponds to the second rear acoustic cavity 27. By providing the first rear acoustic cavity 26 and the second rear acoustic cavity 27, the frequency response, sensitivity, and noise characteristics of the microphone can be effectively tuned, optimizing the microphone's low-frequency response, avoiding acoustic short-circuit effects, and improving the pickup efficiency of sound waves at specific frequencies. (Refer to...) Figure 5 In one embodiment of the present invention, the first rear acoustic cavity 26 and the second rear acoustic cavity 27 are both extended toward the width direction of the substrate 10.

[0057] In one embodiment of the technical solution of this application, by respectively setting the first sound hole 22 and the second sound hole 32 on the first housing 21 and the second housing 31, and respectively configuring the first MEMS chip 23 and the second MEMS chip 33 with the first rear sound cavity 26 and the second rear sound cavity 27 communicating with the first receiving cavity 25 and the second receiving cavity 35, the first rear sound cavity 26 and the second rear sound cavity 27 provide precise acoustic load on the back of the diaphragm of the first MEMS chip 23 and the second MEMS chip 33, effectively avoiding acoustic short circuits, significantly improving the frequency response flatness, sensitivity and signal-to-noise ratio of the microphone, especially the performance in the low frequency band.

[0058] In one embodiment of the present invention, both the first housing 21 and the second housing 31 are made of conductive materials.

[0059] In one embodiment of the technical solution of this application, the materials of the first housing 21 and the second housing 31 can be stainless steel, aluminum alloy, copper alloy, etc., or specially treated conductive plastic. The first housing 21 and the second housing 31 are guiding materials, which can provide an effective electromagnetic shielding layer for the sensitive electronic components inside the first microphone 20 and the second microphone 30. The shielding layer can form a Faraday cage effect, blocking external electromagnetic waves from entering the microphone, thereby protecting the first MEMS chip 23 and the second MEMS chip 33 and their signal paths from electromagnetic interference, thereby improving the purity and signal-to-noise ratio of the signal, ensuring that the phase comparison module 43 can obtain a more accurate and stable phase difference signal, and thus enabling the main controller 11 to control the output signal of the voice processing module 100 more accurately based on the high-quality phase difference signal, such as achieving more accurate sound source localization or more effective noise suppression, thereby significantly improving the performance and reliability of the voice processing module 100 in complex electromagnetic environments.

[0060] This invention also proposes an electronic device with a voice processing module 100. The specific structure of the voice processing module 100 is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here. It is understood that the electronic device can be a mobile phone, smartwatch, smart bracelet, AR glasses, VR glasses, etc.

[0061] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A voice processing module, characterized in that, include: A substrate on which a main controller is mounted; A first microphone is disposed on the substrate, and the first microphone has a first sound hole; A second microphone is disposed on the substrate. The second microphone has a second sound hole. The distance between the center points of the first sound hole and the second sound hole is between 2 mm and 6 mm. A phase processing module is connected to the main controller. The phase processing module includes a phase shifting module and a phase comparison module. The phase shifting module is located on the signal output path of one of the first microphone and the second microphone to delay the phase of the audio signal on the corresponding signal output path. The phase comparison module is used to obtain the phase difference signal between the audio signal collected by the first microphone and the audio signal collected by the second microphone. The main controller controls the output signal of the voice processing module according to the phase difference signal.

2. The voice processing module as described in claim 1, characterized in that, The first microphone includes a first housing and a first MEMS chip. The first housing and the substrate enclose a first receiving cavity. The first sound hole communicates with the first receiving cavity. The first MEMS chip is electrically connected to the substrate. The second microphone includes a second housing and a second MEMS chip. The second housing and the substrate enclose a second receiving cavity. The second sound hole communicates with the second receiving cavity. The second MEMS chip is electrically connected to the substrate.

3. The voice processing module as described in claim 2, characterized in that, The voice processing module further includes an ASIC chip, which is disposed in the first accommodating cavity and / or the second accommodating cavity, and is signal-connected to the first MEMS chip, the second MEMS chip, and the main controller.

4. The voice processing module as described in claim 2, characterized in that, The first receiving cavity is located inside the second receiving cavity; Alternatively, the first receiving cavity and the second receiving cavity may be arranged side by side.

5. The voice processing module as described in claim 2, characterized in that, Both the first acoustic hole and the second acoustic hole are disposed on the substrate, the first MEMS chip is disposed corresponding to the first acoustic hole, and the second MEMS chip is disposed corresponding to the second acoustic hole.

6. The voice processing module as described in claim 5, characterized in that, At least a portion of the first acoustic hole and the second acoustic hole extend along the width direction of the substrate.

7. The voice processing module as described in claim 2, characterized in that, The first acoustic hole is disposed in the first housing, and the substrate also has a first rear acoustic cavity that communicates with the first receiving cavity. The first MEMS chip is disposed corresponding to the first rear acoustic cavity. The second acoustic hole is disposed in the second housing, and the substrate also has a second rear acoustic cavity that communicates with the second receiving cavity. The second MEMS chip is disposed correspondingly to the second rear acoustic cavity.

8. The voice processing module as described in claim 7, characterized in that, Both the first rear acoustic cavity and the second rear acoustic cavity extend toward the width direction of the substrate.

9. The voice processing module as described in any one of claims 2 to 8, characterized in that, Both the first housing and the second housing are made of conductive materials.

10. An electronic device, characterized in that, Includes the voice processing module as described in any one of claims 1 to 9.

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