Connector module, electronic assembly and electronic equipment

Abstract

The embodiment of the invention provides a connector module, an electronic assembly and electronic equipment, the connector module is used for being connected to a circuit board, and the connector module comprises an elastic contact piece, a fixing device and a cable; the elastic contact piece is used for being in elastic contact with the circuit board; the fixing device is used for being fixed to the circuit board and limiting the elastic contact part to the circuit board. The fixing device is fixedly connected with the cable, and enables the cable to be in elastic contact with the elastic contact piece. According to the embodiment of the invention, miniaturization, high density and high bandwidth of the connector module can be realized, and design requirements are met.

Description

Technical Field

[0001] This application relates to the field of communication equipment, and more particularly to a connector module, electronic components, and electronic devices. Background Technology

[0002] With the development of information and communication technology, the demand for communication capacity and bandwidth is increasing. This necessitates placing connector modules for signal transmission close to chips to minimize trace length on the board and reduce trace losses. Furthermore, it requires arranging a sufficient number of communication channels within the limited space near the chip module to achieve high-capacity, high-speed information transmission between chips. To meet these requirements, connector modules must be miniaturized, high-density, and high-bandwidth.

[0003] However, traditional connector modules use cantilever beam terminals as contacts, which need to be soldered to the substrate. To meet soldering requirements, the connector module needs to be relatively large, making it difficult to meet miniaturization and high-density requirements. Moreover, the cantilever beam terminal structure can cause resonance, limiting bandwidth improvement and making it difficult to meet high bandwidth requirements. Summary of the Invention

[0004] This application provides a connector module, electronic component, and electronic device, which can achieve miniaturization, high density, and high bandwidth of the connector module to meet design requirements.

[0005] In a first aspect, embodiments of this application provide a connector module for connecting to a circuit board. The connector module includes an elastic contact, a fixing device, and a cable. The elastic contact is used for elastic contact with the circuit board. The fixing device is used for fixing to the circuit board and limiting the elastic contact within the circuit board. The fixing device is fixedly connected to the cable and makes the cable elastically contact the elastic contact.

[0006] In this embodiment, the connector is provided with multiple elastic contacts that can be arrayed on the circuit board. The cable assembly directly contacts the elastic contacts, and the fixing device ensures reliable contact between the cable assembly and the elastic contacts, thereby realizing the electrical connection between the connector and the circuit board. Since this embodiment does not use cantilever beam structure terminals, nor does it solder the cantilever beam structure terminals to the circuit board, it can improve or avoid the resonance and bandwidth limitations caused by the cantilever structure in traditional solutions, allowing the connector to meet high-bandwidth communication requirements. Furthermore, it is not limited by the soldering process, allowing the connector to have a smaller size, which is beneficial for miniaturization and high-density layout of the connector. This allows the space on the circuit board to accommodate a sufficient number of communication channels, enabling high-capacity, high-speed information transmission between chips.

[0007] In addition, since the cable assembly can reliably contact the elastic contact through the fixing device, there is no need to use screws to fix the connector, and there is no need to make the connector larger to make room for screw installation. This is conducive to the miniaturization of the connector, and thus facilitates the high-density layout of the connector.

[0008] In one implementation of the first aspect, the fixing device includes a first frame surrounding the outer periphery of the cable and the resilient contact. The first frame may, for example, be a frame surrounded by multiple sidewalls. By providing the first frame in the fixing device, a detachable connection between the wire end portion and the board end portion of the connector is facilitated.

[0009] In one implementation of the first aspect, the fixing device further includes a second frame and a latch; the second frame is used to fix to the circuit board and surrounds the outer periphery of the resilient contact; the latch is used to detachably connect the first frame and the second frame, and the latch is also used to elastically deform to release the connection between the first frame and the second frame. The second frame may be, for example, a frame surrounded by multiple sidewalls. The second frame is used to limit the position of the resilient contact. The latch can detachably connect the first frame and the second frame, facilitating the detachable connection between the wire end portion and the board end portion of the connector. Using the latch for assembly avoids fixing the wire end portion to the circuit board with screws, which helps to reduce the area occupied by the circuit board.

[0010] In one implementation of the first aspect, a first portion of the first frame is located inside the second frame, and a latch is located between the first portion and the second frame. By placing a portion of the first frame inside the second frame and inserting the latch between the first and second frames, a compact assembly of the first frame, the second frame, and the latch can be achieved, which helps to reduce the size of the connector.

[0011] In one implementation of the first aspect, the latch includes a mounting portion, an elastic portion, and a snap-fit. The mounting portion is connected to the elastic portion, and the snap-fit ​​is connected to the elastic portion. The mounting portion is used to fix it to the first frame; the snap-fit ​​is used to detachably engage with the second frame; the elastic portion is used to undergo elastic deformation and drive the snap-fit ​​to move relative to the first frame, so as to separate the snap-fit ​​from the second frame. The latch with the above structure is simple in structure and reliable in assembly, and can effectively achieve the detachable assembly of the first frame and the second frame through its own elastic deformation.

[0012] In one implementation of the first aspect, the second frame has a through hole; the surface of the buckle facing the second frame is inclined, and the buckle is used to engage with the through hole, with at least a portion of the inclined surface located within the through hole. By providing a buckle with an inclined surface, the buckle and the second frame can be engaged through the movement of the second frame and the buckle, thereby achieving a detachable connection between the first frame and the second frame, or in other words, a detachable connection between the wire end portion and the board end portion. The assembly method of this implementation is simple and reliable.

[0013] In one implementation of the first aspect, one of the first frame and the second frame includes a plug-in portion, and the other has a first slot, with the plug-in portion located within the first slot. The plug-in portion and the slot can form a mating guide structure, which facilitates accurate and reliable positioning of the wire end portion and the board end portion, thereby ensuring accurate mating of the cable assembly and the elastic contact.

[0014] In one implementation of the first aspect, there are multiple resilient contacts; the connector module also includes a shield, which is located between the fixing device and the cable. The shield surrounds the outer periphery of the cable facing the resilient contacts, and is connected to the shielding layer in the cable. The shield and the cable respectively make elastic contact with different resilient contacts. The shield and the shielding layer can participate in forming the shielding structure of the connector. Since this shielding structure can wrap around the outer periphery of the cable core wire 360°, it is beneficial to significantly improve the signal integrity (SI) performance of the connector, enabling the connector to have high-bandwidth communication capabilities. In addition, by setting this shielding structure, the cable does not need to have an additional ground wire, nor does it need to be soldered to the circuit board, which is beneficial to the miniaturization and high-density layout of the connector, and further enhances the high-bandwidth communication capabilities of the connector.

[0015] In one implementation of the first aspect, the connector module further includes a package that covers a portion of the shield and a portion of the cable. The package can increase the structural integrity and strength of the cable end portion, facilitating subsequent assembly processes. Exemplarily, the package can be manufactured using an injection molding process.

[0016] In one implementation of the first aspect, the fixing device includes a first frame and a pin. The first frame surrounds the outer periphery of the cable, and the encapsulation body is located inside the first frame. The pin is inserted into the first frame and the encapsulation body, detachably connecting the first frame and the encapsulation body. The pin detachably secures the cable to the first frame. When the pin is installed, it exerts a force on each encapsulation body, causing the cable to reach the designed position, which helps ensure accurate contact between the cable and the elastic contact. Furthermore, the connection formed by the pin has good reliability and is not prone to failure after repeated assembly and disassembly.

[0017] In one implementation of the first aspect, the first frame is provided with a second slot, which penetrates the wall of the first frame; a third slot is formed by a partial recess on the surface of the package; and a pin is inserted into the second and third slots. Through the above-described assembly method of the first frame, package, and pin, the detachable assembly of the first frame, package, and pin can be reliably achieved using a simple and mature structure.

[0018] In one implementation of the first aspect, a first mating groove is provided on the inner side of the first frame, and each first mating groove includes two connected sub-matting grooves forming an included angle; the encapsulation body includes a mating part, which includes two connected parts forming an included angle, and the two parts respectively mate with the two sub-matting grooves of the first mating groove. The first mating groove and the mating part can form a mutual matching guide structure, which facilitates accurate and reliable positioning of the wire end part and the board end part, so as to ensure accurate docking of the cable assembly and the elastic contact.

[0019] In one implementation of the first aspect, the fixing device includes a second frame for fixing to the circuit board. The second frame surrounds the outer periphery of the elastic contact and is connected to the first frame. A second mating groove is provided on the inner side of the second frame, with a portion of one of the two sub-mating grooves protruding from one of them and located within the second mating groove. Through the aforementioned mating method between the mating part and the second frame, the second frame can guide and limit the assembly of the package.

[0020] In one implementation of the first aspect, there are multiple cables and multiple elastic contacts, with each core wire of each cable making elastic contact with one elastic contact. Each cable may have one or more core wires, and each core wire in each cable makes elastic contact with one elastic contact. This implementation is applicable to high-density connectors, enabling miniaturization and high bandwidth of high-density connector modules to meet design requirements.

[0021] Secondly, embodiments of this application provide an electronic component, including a circuit board and a connector module as described above. The electronic component of this application is used to implement various electrical functions of an electronic device. The connector module in this electronic component has advantages such as miniaturization, high density, and high bandwidth, and can meet design requirements.

[0022] In one implementation of the second aspect, the electronic component also includes a chip mounted on a circuit board. This implementation allows for a sufficient number of communication channels to be arranged within the space occupied by connectors near the chip, which is beneficial for achieving high-capacity, high-speed information transmission between chips.

[0023] Thirdly, embodiments of this application provide an electronic device, including a housing and any of the electronic components mentioned above, wherein the electronic components are located within the housing. The connector module in this electronic device has advantages such as miniaturization, high density, and high bandwidth, and can meet design requirements. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application;

[0025] Figure 2 This is a top view of the electronic component according to an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the three-dimensional assembly structure of the connector module in the embodiments of this application;

[0027] Figure 4 for Figure 3 An exploded view of the connector module in the diagram;

[0028] Figure 5 for Figure 4 An exploded view of the connector module in the diagram;

[0029] Figure 6 yes Figure 5 A three-dimensional structural diagram of the second frame in the diagram;

[0030] Figure 7 yes Figure 4 A three-dimensional structural diagram of the contact components arranged on the circuit board;

[0031] Figure 8 yes Figure 7 A three-dimensional structural diagram of the contact components in the diagram;

[0032] Figure 9 This is a schematic diagram of the three-dimensional assembly structure of the second frame, contact components, and circuit board;

[0033] Figure 10 This is a top view of the assembly structure of the second frame, contact components, and circuit board;

[0034] Figure 11 yes Figure 10 A magnified schematic diagram of the local structure at point X;

[0035] Figure 12 This is a three-dimensional structural diagram of a cable unit from one perspective;

[0036] Figure 13 yes Figure 12 A magnified view of a portion of point A in the middle;

[0037] Figure 14 for Figure 12 A schematic diagram of the exploded structure of the cable unit in the diagram;

[0038] Figure 15 This is a three-dimensional structural diagram of the cable unit from another perspective;

[0039] Figure 16 yes Figure 14 A three-dimensional structural diagram of the shielding component in the image;

[0040] Figure 17 This is a schematic diagram of a partial assembly structure of multiple cable units;

[0041] Figure 18 It is a schematic diagram of the assembly structure of multiple cable units, multiple flexible contacts and circuit boards;

[0042] Figure 19 yes Figure 14 A three-dimensional structural diagram of the encapsulation in the image;

[0043] Figure 20 This is a three-dimensional structural diagram of the first frame from one perspective;

[0044] Figure 21 yes Figure 20 A schematic diagram of the BB cross-sectional structure of the first frame;

[0045] Figure 22 This is a three-dimensional structural diagram of the first frame from another perspective;

[0046] Figure 23 This is a three-dimensional structural diagram of the latch;

[0047] Figure 24 This is a schematic diagram of the three-dimensional assembly structure of the cable assembly and the first frame;

[0048] Figure 25 yes Figure 24 The diagram shows a CC cross-sectional view.

[0049] Figure 26 This is a 3D structural diagram of the latch;

[0050] Figure 27 This is a schematic diagram of the three-dimensional assembly structure of the latch and the first frame;

[0051] Figure 28 This is an assembly diagram of the connector's wire end portion and board end portion;

[0052] Figure 29 This is a schematic diagram of the three-dimensional assembly structure of the first frame, the second frame, and the latch.

[0053] Figure 30This is a schematic diagram of the mating structure between the cantilever beam structure terminals and the circuit board of a traditional connector.

[0054] Figure 31 Impedance simulation curves for conventional schemes;

[0055] Figure 32 These are the crosstalk simulation curves for a conventional solution;

[0056] Figure 33 This is the impedance simulation curve for this embodiment;

[0057] Figure 34 This is the crosstalk simulation curve of this embodiment;

[0058] Figure 35 This is a process diagram of a cable unit in one embodiment. Detailed Implementation

[0059] This application provides an electronic device, which includes, but is not limited to, servers, network devices (such as switches, routers, etc.), communication devices (such as base stations, data centers, etc.), electric vehicle charging facilities, intelligent driving systems (such as mobile data centers, and various sensors such as lidar, millimeter-wave radar, cameras, and ultrasonic radar), mobile phones (candybar phones or foldable phones), tablet computers, laptops, in-vehicle devices, wearable devices, augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses, VR helmets, etc.

[0060] Figure 1 The diagram illustrates the structure of an electronic device 1000 in one embodiment. For example... Figure 1 As shown, the electronic device 1000 may include a housing 20. The housing 20 may be assembled from several sub-housings, or it may be a single housing. Electronic components are housed within the housing 20, and these electronic components are used to implement the various electrical functions of the electronic device 1000. It is understood that... Figure 1 The external structure of the electronic device 1000 is merely illustrative; in fact, the embodiments of this application do not limit the structure of the electronic device 1000.

[0061] like Figure 2As shown, in this embodiment, the electronic component 10 may include a circuit board 11, a chip 12, and a connector module 13, etc. The circuit board 11 may be, for example, a printed circuit board (PCB). The circuit board 11 may be a substrate (a circuit board specifically designed to provide electrical connections, protection, support, heat dissipation, and assembly functions for devices such as the chip 12) or a motherboard (responsible for connecting and coordinating various hardware components, ensuring smooth data transmission, and power management, etc.) in the electronic device 1000. Both the chip 12 and the connector module 13 are disposed on the circuit board 11. For example, multiple connector modules 13 may be arranged around the chip 12. The connector module 13 is used to enable communication between the chip 12 and other devices. These other devices may be devices arranged on the circuit board 11 or devices not arranged on the circuit board 11.

[0062] Figure 2 The electronic component 10 described above is merely an example. In fact, the embodiments of this application do not limit whether the circuit board 11 is equipped with a chip 12. For example, in another embodiment, the circuit board 11 may be equipped with a connector module 13, but without a chip 12.

[0063] The connector module 13 of the present application embodiment will be described in detail below.

[0064] Figure 3 This illustration shows a three-dimensional assembly structure of the connector module 13 and the circuit board 11 in one embodiment. Figure 4 for Figure 3 The exploded view of the assembly structure shown. Figure 5 for Figure 4 An exploded view of the connector module 13.

[0065] like Figure 3 As shown, for ease of description, the width direction of connector module 13 can be defined along the X-axis, the length direction along the Y-axis, and the height direction along the Z-axis. It is understood that the coordinate system of connector module 13 can be flexibly set according to specific practical needs and is not limited to what is described above.

[0066] Combination Figures 3-5As shown, the connector module 13 may include a cable assembly 13a, a fixing device 13b, and a contact assembly 13c. The contact assembly 13c is disposed on the circuit board 11 and makes elastic contact with the circuit board 11. Elastic contact means that the contact assembly 13c can contact the circuit board 11, forming a detachable but not non-detachable connection; and the contact assembly 13c can undergo elastic deformation, so that the contact between the contact assembly 13c and the circuit board 11 is not a rigid contact, but a contact with a certain degree of elasticity. The fixing device 13b may be disposed around the outer periphery of the cable assembly 13a and the contact assembly 13c, connecting the cable assembly 13a to the circuit board 11 and ensuring elastic contact between the cable assembly 13a and the contact assembly 13c. The cable assembly 13a and the contact assembly 13c form a detachable connection, not a non-detachable connection.

[0067] like Figure 3 As shown, one end of the cable assembly 13a has a fixing device 13b and is connected to the circuit board 11, while the other end does not have a fixing device 13b. This is merely an illustration and not a limitation on the embodiments of this application. In practice, depending on the needs, both ends of the cable assembly 13a can have fixing devices 13b, with one end connected to the circuit board 11 and the other end connected to a corresponding device. Alternatively, one end of the cable assembly 13a may have a fixing device 13b and be connected to the circuit board 11, while the other end may be connected to a corresponding device through other means, the structure of which differs from that of the fixing device 13b. The following will... Figure 3 Using the example shown, we will continue with the explanation.

[0068] like Figure 4 As shown, the connector module 13 can be divided into a wire end portion 13x and a board end portion 13y. The wire end portion 13x includes a cable assembly 13a and a first frame 134, a latch 136, etc., in a fixing device 13b pre-assembled with the cable assembly 13a (described below). The board end portion 13y is the portion pre-assembled with the circuit board 11, which includes a contact assembly 13c and a second frame 137 in the fixing device 13b (described below). The wire end portion 13x and the board end portion 13y can be pre-assembled separately, and then the wire end portion 13x and the board end portion 13y can be assembled to obtain a complete connector module 13, which can then be connected to the circuit board 11.

[0069] The following will first explain the board end portion 13y, then the line end portion 13x, and finally the assembly of the line end portion 13x and the board end portion 13y.

[0070] As described above, a portion of the fixing device 13b belongs to the plate end portion 13y, and another portion belongs to the wire end portion 13x.

[0071] like Figure 4 and Figure 5 As shown, exemplarily, the fixing device 13b may include a first frame 134, a latch 136, a second frame 137, and a pin 135. The first frame 134, latch 136, and pin 135 may belong to the wire end portion 13x, while the second frame 137 and contact assembly 13c may both belong to the board end portion 13y. The first frame 134 may surround the outer periphery of the cable assembly 13a. The pin 135 is used to insert into the first frame 134 and connect the first frame 134 to the cable assembly 13a. The first frame 134 and the second frame 137 can be detachably connected via the latch 136. The second frame 137 can be fixed to the circuit board 11. These will be described separately below.

[0072] Figure 6 The diagram illustrates the three-dimensional structure of the second frame 137. For example... Figure 6 As shown, the second frame 137 can be a frame structure formed by multiple sidewalls, open at both ends along the Z-direction. For example, the second frame 137 can generally include four sidewalls, namely sidewall 1371, sidewall 1372, sidewall 1373, and sidewall 1374. The projection of the second frame 137 onto the XY plane can be approximately square. It is understood that... Figure 6 The shape of the second frame 137 described above is only illustrative, and this embodiment does not limit the specific shape of the second frame 137.

[0073] like Figure 6 As shown, the sidewall of the second frame 137 may be provided with through holes 137a. Exemplarily, both the opposite sidewalls 1371 and 1373 of the second frame 137 may be provided with multiple through holes 137a, and the number of through holes 137a on the two sidewalls may be the same. The shape of the through holes 137a may be approximately square. The through holes 137a can be used for assembly with the latch 136, which will be described in detail later. It is understood that... Figure 6 The shape, position, number, and size of the through hole 137a described above are merely illustrative examples, and this embodiment does not limit them.

[0074] like Figure 6 As shown, the inner side of the second frame 137 may be provided with a plurality of mating grooves 137b. To distinguish them from the mating groove 134c mentioned below, the mating groove 134c may be referred to as the first mating groove 134c, and the mating groove 137b may be referred to as the second mating groove 137b. For example, the second mating groove 137b may be provided on the inner side of the sidewalls 1372 and 1374 of the second frame 137. The second mating groove 137b may be generally elongated, and may extend along the Z-direction from one end of the sidewall to the other. The second mating groove 137b may be used to mate with the cable assembly 13a. It is understood that... Figure 6The shape, position and number of the second mating groove 137b described above are merely illustrative examples, and this embodiment does not limit the specific shape, position and number of the second mating groove 137b.

[0075] like Figure 6 As shown, a first slot 137c may be provided on the outer side of the second frame 137. Exemplarily, the first slot 137c may be located on the outer side of sidewalls 1372 and 1374, and several first slots 137c may be provided on each sidewall. The shape of the first slot 137c may be approximately square. It is understood that... Figure 6 The shape, position, and number of the first slot 137c described above are merely illustrative examples, and this embodiment does not limit the specific shape, position, and number of the second mating slot.

[0076] Figure 7 This is a three-dimensional structural diagram of the contact component 13c arranged on the circuit board 11. Figure 7 As shown, the circuit board 11 has a conductive pattern 11a, which is used to transmit electrical signals. The contact component 13c makes elastic contact with the conductive pattern 11a.

[0077] Figure 8 This is a three-dimensional structural diagram of contact component 13c. For example, as shown... Figure 8 As shown, the contact assembly 13c may include a support plate 138 and a plurality of elastic contact elements 139, wherein the support plate 138 is used to fix and support the elastic contact elements 139.

[0078] like Figure 8 As shown, the support plate 138 can be approximately a square plate structure, for example. Exemplarily, the edge of the support plate 138 may be provided with a plurality of positioning structures 138a. As will be explained below, the positioning structures 138a are used to mate with the second mating groove 137b of the second frame 137 to achieve accurate assembly of the contact component 13c with the second frame 137. In another embodiment, the support plate 138 may not have positioning structures 138a. Alternatively, in another embodiment, the contact component 13c may not include the support plate 138.

[0079] like Figure 8 As shown, elastic contacts 139 are disposed on a support plate 138. The elastic contacts 139 on the support plate 138 can be arranged in a certain manner, such as in a matrix direction. For example, some elastic contacts 139 can be used to transmit signals, and other elastic contacts 139 can be used to transmit ground current. The elastic contacts 139 can be generally conical or cylindrical, with both ends exposed relative to the surface of the support plate 138. The elastic contacts 139 can undergo elastic deformation when compressed, and the deformation direction can be, for example, along the Z-direction, or perpendicular to the circuit board 11.

[0080] Figure 9 This is a schematic diagram of the three-dimensional assembly structure of the second frame 137, contact component 13c, and circuit board 11. Figure 10 for Figure 9 The diagram shows a top view of the structure.

[0081] like Figure 9 and Figure 10 As shown, the contact component 13c can be positioned in the area where the conductive pattern 11a is located on the circuit board 11, and each elastic contact 139 can elastically contact the conductive pattern 11a. The second frame 137 can be fixed to the circuit board 11, for example, the second frame 137 can be fixed to the circuit board 11 by surface mount technology (SMT). The second frame 137 can surround the outer periphery of the contact component 13c, and each positioning structure 138a can be located in a second mating groove 137b of the second frame 137. The positioning structure 138a can mate with the second mating groove 137b, so that the second frame 137 limits the contact component 13c to facilitate reliable contact between the contact component 13c and the conductive pattern 11a. Thus, the assembly of the board end portion 13y and the circuit board 11 can be completed.

[0082] Figure 11 for Figure 10 A magnified schematic diagram of the structure at point X in the middle. Figure 11 This is used to represent the distribution of multiple elastic contacts 139 with different functions.

[0083] like Figure 11 As shown, the elastic contact 139 within the dashed box is used to transmit signals, denoted by signal S. As will be explained below, the two elastic contacts 139 within each dashed box respectively contact the two core wires 131a in a cable 131 to transmit a positive signal (P) and a negative signal (N). Figure 11 The other resilient contacts 139, excluding those within the dashed box, are used to transmit ground current. These resilient contacts 139 are marked with ground G. As will be explained below, the resilient contacts 139 transmitting ground current contact the shield 133 of the cable assembly 13a. Figure 11 As shown, the elastic contact 139 for transmitting signals can be surrounded by the elastic contact 139 for transmitting ground current; two adjacent sets of elastic contacts 139 for transmitting signals can be separated by the elastic contact 139 for transmitting ground current.

[0084] like Figure 4 and Figure 5As shown, exemplarily, the cable assembly 13a in the line end portion 13x may include multiple cables 131, multiple shields 133, and multiple enclosures 132. These cables 131 may be arranged in multiple groups along the X-axis, each group having multiple cables 131 arranged along the Y-axis. For example, the cables 131 may be arranged in 8 groups along the X-axis, each group having 8 cables 131 arranged along the Y-axis. All cables 131 in each group may be connected to a shield 133 and an enclosure 132.

[0085] For ease of description, a structure consisting of a set of cables 131, a shield 133, and an enclosure 132 can be referred to as a cable unit. For example... Figure 5 As shown, multiple cable units can be arranged sequentially along the X direction.

[0086] Figure 12 This is a three-dimensional structural diagram of a cable unit from one perspective. Figure 13 yes Figure 12 A magnified view of a portion of point A in the diagram. Figure 14 yes Figure 12 An exploded view of the cable unit. Figure 15 This is a three-dimensional structural diagram of the cable unit from another perspective.

[0087] like Figure 12 and Figure 13 As shown, for example, cable 131 may include core wire 131a, insulation layer 131b, shielding layer 131c, and protective layer 131d. From the outside to the inside, protective layer 131d, shielding layer 131c, insulation layer 131b, and core wire 131a are nested and wrapped in sequence.

[0088] The core wire 131a is conductive and can be made of, for example, copper or aluminum wire. Exemplarily, each cable 131 can be used to transmit differential signals, and each cable 131 may have two core wires 131a, with the two core wires 131a transmitting a positive signal (P) and a negative signal (N) respectively. In another embodiment, each cable 131 is not limited to transmitting differential signals, and each cable 131 may have only one core wire 131a.

[0089] like Figure 12 and Figure 13 As shown, the insulation layer 131b covers the core wire 131a and provides electrical isolation and insulation. The shielding layer 131c protects the cable 131 from external electromagnetic interference. The protective layer 131d is located on the outermost layer of the cable 131, ensuring the reliability of the cable 131 and also providing protection. The protective layer 131d can be made of, for example, Myla material.

[0090] Understandable Figure 12 and Figure 13 The structure of cable 131 described above is merely illustrative, and the embodiments of this application do not actually limit the structure of cable 131.

[0091] Figure 12 refer to Figure 14 and Figure 15 As shown, in a cable unit, the shield 133 can be connected to the same end of multiple cables 131 (e.g., Figure 14 (Lower end of the cable). At this end of these cables 131, the protective layer 131d can be removed, exposing the shielding layer 131c. The shielding element 133 can wrap around the outer periphery of these shielding layers 131c and connect to the shielding layer 131c. For example... Figure 15 As shown, the shield 133 may be flush or substantially flush with this end of these cables 131.

[0092] like Figure 16 As shown, for example, the shielding member 133 can be generally elongated, with its length direction being the Y direction. The shielding member 133 can be provided with multiple first holes 133a extending along the Z direction and corresponding one-to-one with the cable 131. For example... Figure 14 and Figure 16 As shown, each cable 131 can be inserted into a first hole 133a of the shielding component 133, and the shielding layer 131c of each cable 131 is connected to the inner wall of the first hole 133a, and each cable 131 is isolated from the others.

[0093] like Figure 16 As shown, the shielding member 133 may also include a guide portion 133b, which may be, for example, triangular or trapezoidal. As will be explained below, the guide portion 133b is used for mating and guiding with the fixing device 13b.

[0094] Understandable Figure 15 and Figure 16 The structure of the shielding component 133 described above is merely illustrative, and this embodiment does not limit the specific structure of the shielding component 133.

[0095] The shielding element 133 can be made of conductive material, such as aluminum, copper, or stainless steel. Both the shielding element 133 and the shielding layer 131c it encloses serve as the ground of the connector module 13, such as shielding ground or return ground. In this embodiment, since the shielding element 133 can cover the cable 131, it can effectively prevent external electromagnetic interference and signal crosstalk, eliminating the need for an additional ground wire on the cable 131. In another embodiment, the connector module 13 may not include the shielding element 133.

[0096] Combination Figure 5As shown, in this embodiment, each shield 133 can surround the outer periphery of the end of the cable 131 facing the contact assembly 13c, so that the shield 133 can make elastic contact with the elastic contact 139 for transmitting ground current.

[0097] Figure 17 The diagram illustrates a partial structure at one end of multiple cable units equipped with a shield 133. Figure 18 A partial side view illustrating that one end of a shield 133 of multiple cable units is in contact with an elastic contact 139 is shown. Three shields 133 belonging to three cable units are marked. The area between two dashed lines in each shield 133 represents a core wire 131a. The shielding layer 131c is not shown.

[0098] like Figure 17 As shown, in each cable unit, the core wire 131a in each cable 131 is used to transmit signals (indicated by signal S), for example, two core wires 131a transmit a positive signal (P) and a negative signal (N) respectively. The shield 133 and the shielding layer 131c it wraps around can both serve as ground (indicated by ground G).

[0099] like Figure 18 As shown, after the cable assembly 13a and the contact assembly 13c are assembled, each elastic contact 139 used for signal transmission can contact the end face of a core wire 131a, and each elastic contact 139 used for ground current transmission can contact the shield 133. For example, some of the elastic contacts 139 can contact two adjacent shields 133. If needed, two elastic contacts 139 can also be arranged in the adjacent area of ​​two adjacent shields 133, with each of the two elastic contacts 139 contacting one shield 133. Figure 18 , Figure 17 and Figure 11 As shown, when the cable assembly 13a and the contact assembly 13c are assembled, the core wire 131a (or the elastic contact 139 for transmitting signals) in each cable 131 is surrounded by the elastic contact 139 for transmitting ground current, thereby forming good shielding and reducing or avoiding crosstalk.

[0100] Thus, the cable assembly 13a can be connected to the circuit board 11 via the contact assembly 13c to achieve transmission performance.

[0101] like Figure 12 , Figure 14 and Figure 15 As shown, in a cable unit, the encapsulation 132 can cover a portion of the shield 133 and a portion of each cable 131. For example... Figure 15As shown, another portion of the shield 133 is exposed relative to the package 132, so that this other portion and its internal core wire 131a contact the resilient contact 139. The package 132 is used to securely encapsulate the shield 133 and each cable 131 to form a cable unit. Exemplarily, the package 132 can be integrally formed on the outer circumference of the shield 133 and each cable 131 using an integrated process, including but not limited to injection molding. Alternatively, the package 132 can be manufactured separately and assembled with the shield 133 and cables 131 using an assembly process. Encapsulating the assembly structure of the cables 131 and shield 133 with the package 132 enhances structural integrity and strength, facilitating subsequent installation. In another embodiment, the connector module 13 may not include the package 132.

[0102] Figure 19 This is a schematic diagram of the three-dimensional structure of package 132. Figure 19 As shown, the surface of each package 132 may be partially recessed to form a third slot 132d. For example, each package 132 may have two third slots 132d, located on opposite sides of the package 132 along the Y direction. Each third slot 132d may span a portion 132c and divide the portion 132c into different areas.

[0103] The third slot 132d can be used for the assembly of the package 132 with the first frame 134 and the pin 135, which will be described in detail later.

[0104] like Figure 19 As shown, each package 132 may further include a mating portion 132a. Each mating portion 132a may include a portion 132b and a portion 132c that are connected and form an included angle. For example, this included angle may be approximately 90°. For example, the mating portions 132a may be located on opposite sides of the package 132 along the Y-axis. The mating portions 132a can be used for the mating of the package 132 and the first frame 134, which will be described in detail later.

[0105] It is understood that the structure of the package 132 described above is merely illustrative, and this embodiment does not limit the specific structure of the package 132.

[0106] like Figure 20 As shown, the first frame 134 can be, for example, a frame surrounded by multiple sidewalls, with openings at both ends along the Z-direction. For example, as... Figure 20 As shown, the first frame 134 may include four sidewalls, the projection of which on the XY plane may be approximately square.

[0107] like Figure 20As shown, multiple first mating grooves 134c can be provided on the inner side of the first frame 134. For example, multiple first mating grooves 134c can be provided on the inner sides of both sidewalls of the first frame 134 along the Y-axis direction. Each first mating groove 134c can extend approximately along the Z-axis direction. Each first mating groove 134c can include a sub-matting groove 134d and a sub-matting groove 134g, which are connected and form an included angle. For example, the included angle can be about 90°, that is, the two sub-matting grooves can be connected approximately perpendicularly to form a 7-shaped structure. The first mating grooves 134c can be used for the mating of the package body 132 and the first frame 134, which will be described in detail later.

[0108] Figure 21 yes Figure 20 A schematic diagram of the BB cross-sectional structure of the first frame 134 in the diagram. Combined with... Figure 20 and Figure 21 As shown, the sidewall of the first frame 134 may be provided with a second slot 134a. For example, both opposite sidewalls of the first frame 134 may be provided with a second slot 134a, and the second slot 134a may be located on the same sidewall as the first mating groove 134c. The second slot 134a may be generally elongated, with its length direction being the X-direction. The second slot 134a may penetrate the sidewall of the first frame 134 along the Y-direction, and the second slot 134a may communicate with each of the first mating grooves 134c to form a plurality of second holes 134b penetrating the sidewall. These second holes 134b are arranged sequentially along the X-direction. In another embodiment, the position of the second slot 134a is not limited to that described above, but can be set as needed, for example, on different sidewalls from the first mating grooves 134c.

[0109] like Figure 21 and Figure 22 As shown, the first frame 134 may further include slots 134e. Exemplarily, there may be two slots 134e, located on the outer sides of two opposite sidewalls of the first frame 134 along the X-axis. Slots 134e may not be on the same sidewall as the first mating groove 134c. For example, slots 134e may extend through opposite ends of the first frame 134 along the Z-axis. Figure 22 As shown, by way of example, the lower end of the slot 134e may penetrate only a partial area of ​​the first frame 134, and the area not penetrated by the slot 134e is shown in shaded areas. The slot 134e can be used for the latch 136 to be inserted and secured to the first frame 134. The assembly structure of the slot 134e, the latch 136 and the first frame 134 will be described in detail later.

[0110] like Figure 21 and Figure 22As shown, the first frame 134 may further include a connector 134f. Exemplarily, the connector 134f is connected to two opposite sidewalls of the first frame 134 along the Y direction, and the connector 134f may protrude approximately along the Z direction relative to the sidewall. The number of connectors 134f can be set as needed; for example, each sidewall may be connected to two connectors 134f. As will be explained below, the connector 134f can be used to mate with the second frame 137.

[0111] The structure of the first frame 134 described above is merely an example, and the embodiments of this application are not actually limited to this. For example, in one embodiment, the first frame 134 may not include one or more of the first mating groove 134c, the second slot 134a, the slot 134e, and the insertion part 134f. The structure of the first mating groove 134c is not limited to a 7-shape, and the relative positions of the various structural features in the first frame 134 are not limited, etc.

[0112] Figure 23 This is a three-dimensional structural diagram of pin 135. (Example) Figure 23 As shown, the pin 135 can be generally elongated, with its length direction in the X direction and its width direction in the Y direction. The pin 135 may include a main body portion 135a and a plurality of teeth 135b protruding from the main body portion 135a and arranged sequentially at intervals along the main body portion 135a. For example, two pins 135 may be provided.

[0113] The following describes the assembly and mating of the cable assembly 13a, the first frame 134, and the pin 135.

[0114] Figure 24 This is a schematic diagram of the three-dimensional assembly structure of the cable assembly 13a, the first frame 134, and the pin 135. Figure 25 for Figure 24 A schematic diagram of the CC cross-sectional structure, in which, Figure 25 For clarity and to highlight key information, cable 131 in cable assembly 13a is not shown.

[0115] Combination Figure 5 and Figure 24 As shown, the cable assembly 13a can be inserted into the first frame 134, such that the first frame 134 surrounds the outer periphery of the cable assembly 13a. Combined with... Figure 19 and Figure 20As shown, the mating portion 132a of each package 132 can mate with the first mating groove 134c, wherein a portion 132b can be located within the sub-matting groove 134d, and at least a portion of the portion 132c can be located within the sub-matting groove 134g. Since both the first mating groove 134c and the mating portion 132a have a 7-shaped structure, the first frame 134 can guide and limit the assembly of the package 132, so that the package 132 is reliably positioned within the first frame 134.

[0116] For example, such as Figure 24 As shown, each shielding element 133 can be exposed outside the first frame 134.

[0117] Combination Figure 23 , Figure 21 and Figure 25 As shown, the pin 135 can be inserted into the second slot 134a of the first frame 134, wherein each tooth 135b of the pin 135 can pass through a second hole 134b and be inserted into a third slot 132d on a package 132, so that each package 132 can be detachably and fixedly connected to the first frame 134 by means of the pin 135. For example, two pins 135 can be inserted into opposite sides of the first frame 134 and the package 132 along the Y direction, respectively.

[0118] In this embodiment, the pin 135 can detachably fix the cable assembly 13a to the first frame 134. When the pin 135 is installed, it exerts a force on each package 132, ensuring that each cable unit reaches the designed position, which helps to ensure accurate contact between each cable unit and the elastic contact 139. In addition, the connection formed by the pin 135 has good reliability and is not prone to failure after repeated assembly and disassembly.

[0119] It is understood that the assembly structure of the cable assembly 13a, the first frame 134, and the pin 135 described above is only an illustrative example, and this embodiment does not limit the assembly method of the cable assembly 13a and the first frame 134. The cable assembly 13a and the first frame 134 can be connected in any other suitable way, either detachably or non-detachably, for example, by means of a snap-fit.

[0120] Figure 26 The diagram illustrates the three-dimensional structure of latch 136. Figure 27 The diagram illustrates the three-dimensional assembly structure of the latch 136 and the first frame 134.

[0121] like Figure 26As shown, for example, the latch 136 may include a mounting portion 136a, a resilient portion 136c, and a snap fastener 136b, wherein the mounting portion 136a is connected to the resilient portion 136c, and the snap fastener 136b is connected to the resilient portion 136c. Figure 26 For clarity, the mounting portion 136a and the elastic portion 136c are selected with a dashed box, but this is only for illustration and is not intended to define the boundaries between the two. In fact, the two are connected as one.

[0122] like Figure 26 As shown, exemplarily, the mounting portion 136a may include one or more protrusions 1361a for securing to the first frame 134. The elastic portion 136c may be curved, allowing it to move along the X-axis and undergo elastic deformation. During movement, the elastic portion 136c can move the latch 136b.

[0123] like Figure 26 As shown, the snap fastener 136b can be bent relative to the elastic portion 136c, and the two can be approximately perpendicular. There can be one or more snap fasteners 136b, for example, there can be four snap fasteners 136b on each latch 136. The snap fastener 136b can be approximately triangular, with its surface away from the elastic portion 136c being a bevel 136d. The snap fastener 136b can be used to detachably engage with the second frame 137.

[0124] Combination Figure 26 and Figure 22 and Figure 27 As shown, the mounting portion 136a of the latch 136 can be inserted into the slot 134e of the first frame 134, the snap fastener 136b can face outwards from the first frame 134, and the elastic portion 136c has a gap with the first frame 134. Thus, the latch 136 can be fixedly connected to the first frame 134.

[0125] like Figure 27 As shown, for example, there can be two latches 136, which can be installed at opposite ends of the first frame 134 along the X-axis.

[0126] The following description continues to explain the assembly structure in which the first frame 134 and the second frame 137 are detachably connected by the latch 136, so that the wire end portion 13x and the board end portion 13y are assembled together.

[0127] Figure 28 This is an assembly diagram of the wire end portion 13x and the board end portion 13y of the connector module 13, which focuses on the assembly of the shield 133 and the package 132 with the second frame 137, as well as the assembly of the first frame 134, the latch 136 and the second frame 137. Figure 29This is a schematic diagram of the three-dimensional assembly structure of the first frame 134, the second frame 137, and the latch 136.

[0128] like Figure 28 and Figure 29 As shown, the wire end portion 13x can be installed into the second frame 137, so that the guide portion 133b of the shield 133 and the portion 132c of the encapsulation body 132 can both move to the designed position within the second mating groove 137b, so that the lower end face of the shield 133 elastically contacts the corresponding elastic contact 139, or in other words, so that the lower end face of the cable assembly 13a elastically contacts each elastic contact 139. The second mating groove 137b can guide and limit the shield 133 and the encapsulation body 132, which can be called the primary mating guide structure between the wire end portion 13x and the board end portion 13y. Simultaneously, the insertion portion 134f of the first frame 134 can be inserted into the first slot 137c of the second frame 137, so that the first frame 134 and the second frame 137 are positioned, and the second frame 137 limits the first frame 134. The fit between the insertion portion 134f of the first frame 134 and the first slot 137c of the second frame 137 can be referred to as a two-stage mating guide structure between the wire end portion 13x and the board end portion 13y. Through this two-stage mating guide structure, the positioning of the wire end portion 13x and the board end portion 13y can be accurately and reliably achieved, thereby ensuring accurate docking between the cable assembly 13a and the elastic contact 139.

[0129] For example, such as Figure 29 As shown, when the first frame 134 is connected to the second frame 137, a portion 134h (which can be referred to as the first portion 134h) of the latch 136 installed on the first frame 134 can be located inside the second frame 137, and the latch 136 can be located between the first portion 134h and the second frame 137. Furthermore, the insertion portion 134f of the first frame 134 is inserted into the first slot 137c of the second frame 137, and the outer surface of the first frame 134 can be flush with the outer surface of the second frame 137. This assembly structure formed by the first frame 134 and the second frame 137 has good assembly strength.

[0130] As can be understood from the above, the positions of the plug-in part and the first slot can be interchanged. That is, the first slot can be set on the first frame 134, and the plug-in part can be set on the second frame 137. The plug-in positioning of the first frame 134 and the second frame 137 can be achieved in the same way.

[0131] like Figure 28 and Figure 29 As shown, during assembly, each latch 136 can enter the inner side of the second frame 137, and each snap fastener 136b can move towards the corresponding through hole 137a. Combined Figure 26 and Figure 29 As shown, during this process, the sidewall of the second frame 137 pushes the inclined surface 136d of the latch mating guide, causing the latch 136b to move the elastic part 136c towards the first frame 134. When the latch 136b reaches the corresponding through hole 137a, due to the reduced thrust, the latch 136b moves towards the second frame 137 and engages in the through hole 137a, thus forming a latch connection between the latch 136b and the through hole 137a. After the latch 136b engages in the through hole 137a, at least a portion of the inclined surface 136d can be located within the through hole 137a, and the first frame 134 and the second frame 137 are detachably connected by the latch 136.

[0132] refer to Figure 28 and Figure 29 As shown, when the cable assembly 13a elastically contacts the elastic contact 139, the elastic contact 139 will press upward against the end face of the cable assembly 13a, causing the cable assembly 13a to tend to move upward. Since the cable assembly 13a is assembled with the first frame 134 via the pin 135, the first frame 134 also tends to move upward. However, the inner wall of the through hole 137a abuts against the upper surface of the latch 136b, keeping the latch 136 in the latched position and preventing it from moving upward. Therefore, the latch 136 limits the first frame 134, preventing it from separating from the second frame 137. Thus, a reliable connection between the cable end portion 13x and the board end portion 13y can be achieved, thereby establishing a reliable electrical connection channel between the cable assembly 13a and the circuit board 11.

[0133] refer to Figure 28 and Figure 29 As shown, when it is necessary to detach the wire end portion 13x from the board end portion 13y, the elastic portion 136c of the latch 136 can be pressed to deform it toward the first frame 134. The elastic portion 136c can drive the latch 136b away from the through hole 137a and release the latch 136b from the through hole 137a. After the latch is released, the first frame 134 can drive the cable assembly 13a to separate from the second frame 137, thereby realizing the detachment of the wire end portion 13x from the board end portion 13y.

[0134] In this embodiment, by providing a buckle 136b with an inclined surface 136d, the buckle 136b and the second frame 137 can be engaged through the movement of the second frame 137 and the buckle 136b, thereby achieving a detachable connection between the first frame 134 and the second frame 137, or in other words, a detachable connection between the wire end portion 13x and the plate end portion 13y. This assembly method is simple and reliable. In another embodiment, the structure of the buckle 136b can be designed as needed, as long as it can achieve the engagement between the buckle 136b and the through hole 137a, without the need to design an inclined surface 136d. Alternatively, it is not limited to connecting the first frame 134 and the second frame 137 through a latch 136.

[0135] As described above, the fixing device 13b can fix the cable assembly 13a to the circuit board 11 and maintain elastic contact between the cable assembly 13a and the elastic contact 139. Each core wire 131a of the cable 131 can contact a single elastic contact 139 for signal transmission. The shielding layer 131c and shielding member 133 covering the outer periphery of the core wire 131a can contact the elastic contact 139 for transmitting ground current, providing electromagnetic shielding and signal return. Additionally, the first frame 134 and the second frame 137 also provide shielding. Therefore, the shielding member 133, shielding layer 131c, first frame 134, and second frame 137 together constitute the shielding structure of the connector module 13. Since this shielding structure can wrap 360° around the outer periphery of the core wire 131a, it significantly improves the connector's signal integrity (SI) performance, enabling the connector module 13 to have high-bandwidth communication capabilities. In addition, by setting this shielding structure, the cable 131 does not need to be grounded, nor does it need to be soldered to the circuit board 11. This is conducive to the miniaturization and high-density layout of the connector module 13, and to improving the high-bandwidth communication capability of the connector module 13.

[0136] For example, the shielding component 133, the first frame 134 and the second frame 137 can all be manufactured using metal powder injection molding (MIM), plastic electroplating or die casting processes.

[0137] Figure 30 This illustration shows a mating structure between a cantilever beam terminal 200 of a conventional connector and a circuit board 300. The cantilever beam terminal 200 is soldered to the circuit board 300, and a portion of the cantilever beam terminal 200 (e.g.) Figure 30 The lower part of the connector is suspended relative to the circuit board 300 to form a cantilever (or stub structure). This cantilever can cause resonance, which limits the improvement of the connector bandwidth and makes it difficult for the connector to meet the requirements of high bandwidth communication.

[0138] Unlike traditional solutions, the connector module 13 in this embodiment is provided with multiple elastic contacts 139 that can be arrayed on the circuit board 11. The cable assembly 13a is in direct contact with the elastic contacts 139, and the fixing device 13b ensures that the cable assembly 13a and the elastic contacts 139 reliably abut against each other, thereby realizing the electrical connection between the connector module 13 and the circuit board 11. Since this embodiment does not use the cantilever beam structure terminal 200, nor does it solder the cantilever beam structure terminal 200 to the circuit board 11, it can improve or avoid the resonance and bandwidth limitation problems caused by the stub structure in traditional solutions. This allows the connector module 13 to meet the requirements of high-bandwidth communication. Furthermore, it is not limited by the soldering process, allowing the connector module 13 to have a smaller size. This facilitates the miniaturization and high-density layout of the connector module 13, allowing sufficient communication channels to be arranged in the space on the circuit board 11 where the connector module 13 is located, enabling high-capacity, high-speed information transmission between chips.

[0139] In addition, since the cable assembly 13a can reliably contact the elastic contact 139 through the fixing device 13b, there is no need to use screws to fix the connector, and there is no need to make the connector larger to reserve screw installation positions. This is conducive to the miniaturization of the connector, and thus facilitates the realization of high-density connector layout.

[0140] In another embodiment, the second frame 137 and the latch 136 may be removed as needed, and the first frame 134 may be fixed to the circuit board 11 with screws.

[0141] The following is combined Figures 31-34 The simulation data shown illustrates the effectiveness of this embodiment in reducing crosstalk and impedance fluctuations and improving bandwidth compared to the traditional solution (which requires soldered terminals).

[0142] Figure 31 This is the time-domain impedance curve for a traditional solution requiring soldered terminals. The horizontal axis represents time (in picoseconds per second, ps), and the vertical axis represents dB values. Each curve represents the time-domain impedance of a differential pair, and two curves correspond to two different differential pairs. For example... Figure 31 As shown, within the time domain segment selected by the dashed box, the impedance of the two differential pairs fluctuates significantly, for example, changing from 80dB to 100dB. This large impedance fluctuation results in high losses.

[0143] Figure 32 This is a frequency-dB curve for a traditional solution that requires soldered terminals. The horizontal axis represents frequency, and the vertical axis represents dB value. Figure 32Three curves are illustrated, each indicating crosstalk between two difference pairs. Each curve corresponds to a different difference pair. For example, one curve indicates crosstalk between difference pair 1 and difference pair 3, the second curve indicates crosstalk between difference pair 3 and difference pair 5, and the third curve indicates crosstalk between difference pair 3 and difference pair 9. Figure 32 As shown, the curve has many peak points (where resonance occurs), and the peak values ​​are relatively large, indicating that there is significant crosstalk between different difference pairs.

[0144] Figure 33 This is the time-domain impedance curve of the scheme in this embodiment, which includes four curves, each corresponding to one of four different differential pairs. For example... Figure 33 As shown, the impedance ripple of each differential pair is small, for example, varying from 90dB to 93dB. Because of the small impedance ripple, the loss is small.

[0145] Figure 34 The frequency-dB curve of the scheme in this embodiment includes three curves. For example, one curve indicates the crosstalk between differential pair 1 and differential pair 3, the second curve indicates the crosstalk between differential pair 1 and differential pair 5, and the third curve indicates the crosstalk between differential pair 1 and differential pair 7. Figure 34 As shown, the curve has fewer peak points and smaller peak values, which indicates that there is less crosstalk between different difference pairs.

[0146] In summary, the solution in this embodiment, through its "0Stub" terminal structure and 360° full shielding design, can significantly optimize crosstalk and impedance fluctuations, which is beneficial for improving the bandwidth of the connector module.

[0147] The manufacturing process of the cable unit in this embodiment is relatively simple. For example... Figure 35 This diagram illustrates a manufacturing process for a cable unit, including the following steps:

[0148] Cutting: Cut the original length of cable 131 to the designed length;

[0149] Remove protective layer: Remove part of the protective layer 131d of cable 131 to expose the shielding layer 131c;

[0150] Assemble the shielding component: Assemble the shielding component 133 with multiple cables 131, so that the shielding component 133 surrounds the outer periphery of the shielding layer 131c of each cable 131, and the end of each cable 131 (containing the shielding layer 131c) is exposed outside the shielding component 133, to obtain the first prefabricated component.

[0151] In-mold injection molding: The first preform is in-mold injection molded to integrally form the encapsulation body 132 on the preform, thus obtaining the second preform;

[0152] Cutting: Cut the ends of each cable 131 in the second prefabricated component that are exposed outside the shield 133 to obtain cable units.

[0153] The standard process includes cable cutting, removal of protective layer, shielding layer cutting, shielding layer removal, insulation layer cutting, insulation layer removal, core wire shaping, core wire welding, solder joint inspection, UV encapsulation, primary injection molding, shielding structure assembly, and secondary injection molding.

[0154] Compared to conventional solutions, this embodiment eliminates the need for shielding layer cutting, shielding layer removal, insulation layer cutting, insulation layer removal, core wire shaping, core wire soldering, solder joint inspection, and UV encapsulation, requiring only one injection molding process. Therefore, this embodiment, through its solderless core wire terminals, simplifies the process flow, addresses process complexity, and reduces assembly costs.

[0155] For ease of understanding, the relevant technical terms involved in the embodiments of this application will be explained and described below.

[0156] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more.

[0157] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0158] The term "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Similarly, "fixation" should also be interpreted broadly. For example, "fixation" can be direct fixation or indirect fixation through an intermediate medium.

[0159] The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," "top," and "bottom," are only for reference to the directions in the accompanying drawings. These directional terms are used to better and more clearly explain and understand the embodiments of this application, and are not intended to explicitly or implicitly suggest that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, etc., and therefore should not be construed as limiting the embodiments of this application.

[0160] In the description of the embodiments in this application, unless otherwise stated, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.

[0161] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A connector module, characterized in that, The connector module is used to connect to the circuit board, and the connector module includes elastic contacts, fixing devices, and cables; The elastic contact element is used to make elastic contact with the circuit board; The fixing device is used to fix the device to the circuit board and to limit the elastic contact element to the circuit board. The fixing device is fixedly connected to the cable, and the cable makes elastic contact with the elastic contact element.

2. The connector module according to claim 1, characterized in that, The fixing device includes a first frame that surrounds the outer periphery of the cable and the elastic contact.

3. The connector module according to claim 2, characterized in that, The fixing device also includes a second frame and a latch; The second frame is used to fix it to the circuit board, and the second frame surrounds the outer periphery of the elastic contact. The latch is used to detachably connect the first frame and the second frame, and the latch is also used to undergo elastic deformation to release the connection between the first frame and the second frame.

4. The connector module according to claim 3, characterized in that, The first part of the first frame is located inside the second frame, and the latch is located between the first part and the second frame.

5. The connector module according to claim 3 or 4, characterized in that, The latch includes a mounting part, an elastic part, and a snap fastener; the mounting part is connected to the elastic part, and the snap fastener is connected to the elastic part. The mounting portion is used to fix it to the first frame; the buckle is used to detachably engage with the second frame; the elastic portion is used to undergo elastic deformation and drive the buckle to move relative to the first frame, so that the buckle separates from the second frame.

6. The connector module according to claim 5, characterized in that, The second frame has a through hole; the surface of the buckle facing the second frame is inclined, the buckle is used to engage with the through hole, and at least a portion of the inclined surface is located inside the through hole.

7. The connector module according to any one of claims 3-6, characterized in that, One of the first frame and the second frame includes a plug-in portion, and the other is provided with a first slot, wherein the plug-in portion is located within the first slot.

8. The connector module according to any one of claims 1-7, characterized in that, The elastic contact element is multiple; The connector module also includes a shielding component located between the fixing device and the cable. The shielding component surrounds the outer periphery of the cable facing the elastic contact. The shielding component is connected to the shielding layer in the cable. The shielding component and the cable respectively make elastic contact with different elastic contacts.

9. The connector module according to claim 8, characterized in that, The connector module also includes a package that covers a portion of the shield and a portion of the cable.

10. The connector module according to claim 9, characterized in that, The fixing device includes a first frame and a pin. The first frame surrounds the outer periphery of the cable, and the encapsulation body is located inside the first frame. The pin is inserted into the first frame and the encapsulation body, and detachably connects the first frame and the encapsulation body.

11. The connector module according to claim 10, characterized in that, The first frame is provided with a second slot, which penetrates the wall of the first frame; the surface of the package is partially recessed to form a third slot; the pin is inserted into the second slot and the third slot.

12. The connector module according to claim 10 or 11, characterized in that, The inner side of the first frame is provided with a first mating groove, and each of the first mating grooves includes two connected sub-matting grooves that form an included angle; The package includes a mating part, which comprises two connected parts forming an included angle, and the two parts respectively mate with the two sub-mating grooves of the first mating groove.

13. The connector module according to claim 12, characterized in that, The fixing device includes a second frame for fixing to the circuit board. The second frame surrounds the outer periphery of the elastic contact and is connected to the first frame. The inner side of the second frame is provided with a second mating groove. A portion of the two parts protrudes from one of the two sub-matting grooves and is located in the second mating groove.

14. The connector module according to any one of claims 1-13, characterized in that, There are multiple cables and multiple elastic contacts, and each core wire of each cable is in elastic contact with one of the elastic contacts.

15. An electronic component, characterized in that, Includes a circuit board and a connector module as described in any one of claims 1-14.

16. The electronic component according to claim 15, characterized in that, The electronic component also includes a chip disposed on the circuit board.

17. An electronic device, characterized in that, It includes a housing and the electronic components as described in claim 15 or 16, the electronic components being located within the housing.

Images