Protective clothing with temperature regulation function and its temperature regulation method

Abstract

This invention relates to the field of temperature-controlled clothing technology, solving the problem in existing technologies where the lack of an effective linkage control mechanism between thermoelectric elements and cooling fans affects the overall cooling effect. It provides a protective suit with temperature regulation function and its temperature control method. The protective suit includes: a garment body comprising an inner layer facing the body and an outer layer away from the body; a semiconductor refrigeration component disposed on the garment body; a power module electrically connected to and supplying power to the semiconductor refrigeration component; a cooling fan disposed on the outer layer of the garment body and electrically connected to the power module; and a control module for controlling the start / stop and power adjustment of the semiconductor refrigeration component and the cooling fan to achieve an adjustable cooling effect on the body.

Description

Technical Field

[0001] This invention relates to the field of temperature-controlled clothing technology, and in particular to a protective garment with temperature regulation function and a method for temperature control. Background Technology

[0002] In today's world, where high-temperature environments are frequent, users in special scenarios such as outdoor operations, military patrols, high-temperature workshops, disaster relief, and outdoor sports are often exposed to enclosed, stuffy, or high-radiation environments for extended periods, frequently facing physiological risks such as heatstroke, decreased concentration, fatigue, and overheating. Therefore, providing a wearable, readily available active cooling device has become a key technology for improving operational efficiency and safety.

[0003] Thermoelectric cooling technology, with its advantages of no moving mechanical parts, compact structure, and fast start-up response, is widely used in portable electronic devices and laboratory thermal control units. In recent years, some research has also integrated thermoelectric modules into wearable devices to achieve cooling functions, such as cooling the chest or back by attaching sheet-like thermoelectric components to the lining of clothing.

[0004] For example, patent CN108552644A discloses a method and device for controlling the temperature of adjustable clothing. This method uses a temperature control component to heat or cool the clothing and a temperature sensor to collect the internal temperature of the clothing. When the detected temperature exceeds a preset threshold, the temperature control component is shut off, thus preventing overheating or overcooling from harming the human body. While this type of solution can achieve basic temperature regulation and safety protection, its control logic is mainly based on simple start-stop control of the temperature control component or the real-time temperature inside the clothing, lacking refined control over the relationship between the operating power of the semiconductor cooling component and the heat dissipation state of the hot end.

[0005] In practical applications, during operation, the cold end of a semiconductor cooling component transfers cooling energy to the human body, while the hot end continuously generates heat, leading to heat accumulation in localized areas. If the cooling fan's operation is controlled solely based on whether the temperature exceeds a threshold, the following problems can easily occur: Firstly, starting the cooling fan before a significant temperature rise at the hot end results in unnecessary energy consumption; secondly, starting cooling only after significant heat accumulation can lead to delayed cooling, affecting cooling efficiency and even causing localized overheating at the hot end, reducing the reliability and lifespan of the semiconductor cooling component.

[0006] Therefore, existing temperature-controlled clothing still suffers from problems such as crude timing of heat dissipation activation, low energy efficiency, and insufficient regional adaptability in terms of heat dissipation control. Summary of the Invention

[0007] In view of this, embodiments of the present invention provide protective clothing with temperature regulation function and temperature regulation method thereof, in order to solve the problem that the lack of effective linkage control mechanism between thermoelectric elements and cooling fans in the prior art leads to limited heat dissipation efficiency, which in turn affects the overall cooling effect and system energy consumption management.

[0008] In a first aspect, embodiments of the present invention provide a protective suit with temperature regulation function, comprising: The garment body includes an inner layer area facing the human body and an outer layer area away from the human body; A semiconductor cooling component is disposed on the garment body. The semiconductor cooling component includes a semiconductor cooling chip and a cold end cooling structure and a hot end heat dissipation structure respectively disposed at the cold end and the hot end of the semiconductor cooling chip. The cold end cooling structure is used to transfer the cold energy at the cold end to the human body contact area, and the hot end heat dissipation structure is used to transfer the heat at the hot end to the outer layer area. A cooling fan is disposed in the outer layer area of ​​the garment body, and the cooling fan is used to perform convection cooling on the heat dissipation structure at the hot end. The sensor module is used to detect human body surface temperature and ambient temperature; The power control module includes a control unit and a power supply unit, which are electrically connected to the cooling fan and the thermoelectric cooler assembly, respectively. The control unit is used to control the start and stop of the thermoelectric cooler assembly and the cooling fan and to adjust their power, so as to achieve an adjustable cooling effect on the human body.

[0009] Preferably, the semiconductor cooling component is disposed in the back area and / or chest area of ​​the garment body, the cold end cooling structure is located in the inner layer area and in contact with the human body, and the hot end heat dissipation structure is located in the outer layer area; the semiconductor cooling components in the back area and chest area can be adjusted independently, and the cooling fan is disposed in the outer area of ​​the garment body corresponding to the position of the hot end heat dissipation structure.

[0010] Preferably, the sensor module includes sensor units disposed in the back region and / or the chest region, and the control module automatically adjusts the operating current of the semiconductor cooling component and / or the speed of the fan according to the detection results of the sensor module.

[0011] Preferably, the cold-end cooling structure includes a thermal pad sandwiched between the cold end of the thermoelectric cooler and the thermal pad; the hot-end heat dissipation structure includes a heat sink attached to the hot end of the thermoelectric cooler; the thermoelectric cooler is sandwiched between the thermal pad and the heat sink.

[0012] Preferably, the power supply unit is a detachable battery pack, the outer layer includes at least two layers of anti-static and flame-retardant fabric, and a channel for wires to pass through is provided between the two layers of anti-static and flame-retardant fabric. The power supply interface of the detachable battery is electrically connected to the semiconductor cooling component and the cooling fan respectively through the wires.

[0013] In a second aspect, embodiments of the present invention provide a temperature control method for a protective suit with temperature regulation function, used in the protective suit with temperature regulation function described in the first aspect, comprising: In response to the temperature control start command issued by the control unit, the currently set cooling level and the corresponding target temperature difference range are obtained; The target driving power of the semiconductor cooling component is obtained based on the target temperature difference range and the temperature difference between the human body surface temperature and the ambient temperature. Based on the target driving power, control the semiconductor cooling chip in the designated area to operate; The start-up time of the cooling fan is obtained based on the actual operating power of the semiconductor cooling component; Based on the startup time and the actual operating power, the cooling fan is controlled to dissipate heat from the hot end heat dissipation structure of the semiconductor cooling component.

[0014] Preferably, the target driving power of the semiconductor cooling component is obtained based on the target temperature difference range and the temperature difference between the human body surface temperature and the ambient temperature, including: Based on the current cooling level, obtain the target temperature difference range and power parameter set corresponding to the cooling level. The power parameter set includes at least the base power, maximum power and minimum power. The temperature of the human body surface and the ambient temperature are obtained, and the current temperature difference is calculated. Within the first preset sliding time window, multiple sets of human body surface temperature and ambient temperature are acquired according to the preset sampling period, and human body surface temperature sequence and ambient temperature sequence are obtained respectively. A temperature difference sequence is calculated based on the human body surface temperature sequence and the ambient temperature sequence. The rate of temperature change is calculated based on the temperature difference sequence, and the trend of temperature change is determined based on the direction of change of the temperature difference sequence within the first sliding time window. The power adjustment amount is determined based on the deviation of the current temperature difference value from the target temperature difference range, the rate of temperature difference change, and the trend of temperature difference change. The base power is corrected based on the power adjustment amount between the maximum power and the minimum power to obtain the target driving power of the semiconductor cooling component.

[0015] Preferably, the designated area includes a back area and a chest area, and controlling the semiconductor cooling chip in the designated area to operate according to the target driving power includes: The target driving power is used as the reference power for the semiconductor cooling components corresponding to the back region and the chest region, and the semiconductor cooling sheets in the back region and the chest region are controlled to work. Within the second preset sliding time window, the actual operating power of the semiconductor cooling components in the back region and chest region is monitored respectively to obtain the back power sequence and the chest power sequence. Calculate the rate of change of back power and the rate of change of chest power based on the back power sequence and the chest power sequence, respectively. Based on the difference between the rate of change of power in the back and the rate of change of power in the chest, the regional response deviation is obtained; The reference power is differentially corrected based on the regional response deviation to obtain the back region correction power and the chest region correction power, and the back power correction amount and the chest power correction amount are obtained, wherein the back power correction amount and the chest power correction amount have opposite signs or different amplitudes. The semiconductor cooling chips in the back region and the chest region are controlled to operate according to the corrected power in the back region and the corrected power in the chest region, respectively, and the corrected power in the back region and the corrected power in the chest region are limited to the maximum power and minimum power limits corresponding to the cooling level.

[0016] Preferably, obtaining the start-up time of the cooling fan based on the actual operating power of the semiconductor cooling component includes: The actual operating power of the semiconductor cooling components in the back and chest regions was monitored within a preset time period to obtain the back power fluctuation sequence and the chest power fluctuation sequence. The average heat generation per unit time in the back region and the chest region is calculated based on the back power fluctuation sequence and the chest power fluctuation sequence, respectively. Combined with their respective thermal resistance parameters, the heat accumulation rate in the back region and the heat accumulation rate in the chest region are obtained. The rate of change of heat accumulation rate in the back region and the rate of change of heat accumulation rate in the chest region were obtained respectively within the preset time period. Based on the heat accumulation rate and its rate of change in the back region, the heat accumulation rate and its rate of change in the chest region, and the preset heat dissipation activation threshold, the remaining time for the heat accumulation rate in the back region and the chest region to reach the heat dissipation activation threshold is obtained, and recorded as the remaining time for the back region and the remaining time for the chest region. The remaining time for the back is compared with the remaining time for the chest, and the side with the smaller remaining time is determined as the priority side to open. The safety lead time is determined based on the rate of change of thermal accumulation rate corresponding to the priority opening side. The start time of the cooling fan is obtained based on the difference between the remaining time corresponding to the priority start side and the safety lead time.

[0017] Preferably, controlling the cooling fan to dissipate heat from the hot end of the semiconductor cooling component based on the startup time and the actual operating power includes: After the start-up time is reached, the thermal accumulation rate of the semiconductor cooling components in the back region and chest region is obtained respectively. The heat dissipation mode is determined based on the heat accumulation rate in the back region and the heat accumulation rate in the chest region. When both the heat accumulation rate in the back region and the heat accumulation rate in the chest region are greater than a preset heat dissipation threshold, the heat dissipation mode is a simultaneous heat dissipation mode. When the heat accumulation rate on at least one side is less than or equal to the preset heat dissipation threshold, the heat dissipation mode is an alternating heat dissipation mode. In the simultaneous heat dissipation mode, the cooling fan is turned on to simultaneously dissipate heat from the heat dissipation structures corresponding to the back and chest regions, and the heat accumulation rate of the back and chest regions is updated according to a preset update cycle. The speed of the cooling fan is adjusted according to the speed level corresponding to the larger updated heat accumulation rate. In the alternating heat dissipation mode, an initial heat dissipation priority area is determined based on the difference between the heat accumulation rate in the back region and the heat accumulation rate in the chest region, and the heat dissipation structure at the hot end corresponding to the initial heat dissipation priority area is used as the current heat dissipation target to control the cooling fan to enter the first heat dissipation stage. During the first heat dissipation phase, the heat accumulation rate of the back and chest areas is updated according to a preset monitoring cycle. When the heat accumulation rate corresponding to the current heat dissipation object drops below the preset switching threshold, the heat dissipation structure of the hot end corresponding to the other side area is determined as the new heat dissipation object, and the cooling fan is controlled to enter the next heat dissipation stage. When the heat accumulation rate in both the back and chest areas is less than the preset end threshold and continues for a preset duration, the heat dissipation control ends and the cooling fan is controlled to enter a low-speed operation state or stop running.

[0018] In summary, the beneficial effects of the present invention are as follows: This invention integrates a semiconductor cooling component into the garment itself, dividing the garment into an inner layer facing the body and an outer layer away from the body. This structurally creates a clear division of labor between cold transfer and heat dissipation. The cold-end cooling structure guides the cold energy generated by the semiconductor cooling chip to the area in contact with the body, reducing ineffective diffusion of cold energy between fabric layers and making the cooling effect more concentrated and direct. The hot-end heat dissipation structure directs the heat from the hot end to the outer layer, reducing the possibility of heat returning to the body and helping to maintain the effective temperature difference of the semiconductor cooling chip. This improves cooling efficiency and stability, while also enhancing the comfort of wearing the garment.

[0019] The cooling fan is positioned in the outer area and provides convective cooling to the hot-end heat dissipation structure. This significantly enhances the heat exchange capacity of the hot end without increasing the complexity of additional heat dissipation components, reducing the drag on cooling performance caused by heat buildup at the hot end. The spatially corresponding arrangement of the fan and the hot-end heat dissipation structure makes it easier for airflow to cover the heat exchange surface of the heat dissipation structure, resulting in a shorter and more efficient heat dissipation path. This is beneficial for maintaining stable operation of the cooling chip under high loads and for reducing unnecessary energy consumption and noise by lowering fan power consumption under low loads.

[0020] The sensor module collects human surface temperature and ambient temperature, providing the control unit with adjustment data related to the actual thermal environment. The power control module integrates the semiconductor cooling chip assembly and the cooling fan into start / stop and power regulation, achieving coordinated control of cooling and heat dissipation. Compared to coarse on / off control based on a single temperature point, this solution can dynamically match cooling intensity and heat dissipation capacity under different ambient temperatures and human thermal sensations, avoiding over- or under-cooling. Furthermore, adjustable power control balances comfort and battery life, improving the practicality and reliability of the entire device in continuous wear scenarios. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments of the present invention will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, and these are all within the protection scope of the present invention.

[0022] Figure 1 This is a schematic diagram of the structure of a protective suit with temperature regulation function according to an embodiment of the present invention.

[0023] Figure 2 This is a schematic flowchart of a temperature control method for a protective suit with temperature regulation function according to an embodiment of the present invention.

[0024] Figure label: 1. Garment body; 11. Inner layer area; 12. Outer layer area; 111. Semiconductor cooling component; 121. Cooling fan; 112. Power control module; Detailed Implementation

[0025] The features and exemplary embodiments of various aspects of the present invention will now be described in detail. To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the invention.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0027] Example 1 Please see Figure 1 This invention provides a protective suit with temperature regulation function, comprising: The garment body 1 includes an inner layer region 11 facing the human body and an outer layer region 12 away from the human body; A semiconductor cooling component 111 is placed on the garment body 1. The semiconductor cooling component includes a semiconductor cooling chip and a cold end cooling structure and a hot end heat dissipation structure respectively disposed at the cold end and the hot end of the semiconductor cooling chip. The cold end cooling structure is used to transfer the cold energy at the cold end to the human body contact area, and the hot end heat dissipation structure is used to transfer the heat at the hot end to the outer layer area 12. A cooling fan 121 is disposed in the outer layer area 12 of the garment body, and the cooling fan is used to perform convection cooling on the heat dissipation structure at the hot end. The sensor module is used to detect human body surface temperature and ambient temperature; The power control module includes a control unit and a power supply unit, which are electrically connected to the cooling fan and the thermoelectric cooler assembly, respectively. The control unit is used to control the start and stop of the thermoelectric cooler assembly and the cooling fan and to adjust their power, so as to achieve an adjustable cooling effect on the human body.

[0028] In this embodiment, the garment body 1 is a wearable protective suit structure, which includes an inner layer region 11 facing the human body and an outer layer region 12 away from the human body. The inner layer region 11 is used to contact the human skin or close-fitting clothing and undertakes the function of transferring cold energy, while the outer layer region 12 is used to arrange heat dissipation components and power supply and control related structures, thereby achieving a partitioned setting of the cold end and the hot end in the structure, and preventing heat from being transferred back to the human body.

[0029] The semiconductor cooling component 111 is disposed on the garment body 1, and includes a semiconductor cooling chip and a cold-end cooling structure and a hot-end heat dissipation structure respectively disposed at the cold end and hot end of the semiconductor cooling chip. The semiconductor cooling chip is a solid-state cooling device based on the Peltier effect. After being energized, one side forms a cold end and the other side forms a hot end. The cold-end cooling structure is disposed on the cold end side to increase the contact area of ​​the cold end and improve the efficiency of cold energy transfer towards the human body. It can be made of thermally conductive materials such as thermally conductive sheets or thermally conductive pads, so that the cold energy generated by the cold end can be stably conducted to the human body contact area. The hot-end heat dissipation structure is disposed on the hot end side to collect and diffuse the heat generated by the semiconductor cooling chip, so that the heat is transferred towards the outer layer region 12, thereby achieving a heat separation layout with the cold end facing the human body and the hot end facing outwards.

[0030] The cooling fan 121 is disposed in the outer layer region 12 of the garment body and located outside the heat dissipation structure at the hot end, for convective heat dissipation of the heat dissipation structure at the hot end. When the semiconductor cooling component is working, the heat generated at the hot end is first conducted to the outer layer region through the heat dissipation structure at the hot end, and then accelerated to exchange heat with the outside air under the action of the airflow generated by the cooling fan, thereby avoiding heat accumulation inside the garment and ensuring that the semiconductor cooling chip maintains an effective temperature difference.

[0031] The sensor module is used to detect human body surface temperature and ambient temperature. Human body surface temperature reflects the wearer's current thermal state, while ambient temperature reflects the external heat load level. By simultaneously acquiring these two types of temperature information, input parameters can be provided for subsequent cooling power adjustment, enabling cooling control to rely not only on the wearer's own condition but also on a comprehensive judgment based on environmental changes.

[0032] The power control module includes a control unit and a power supply unit. The power supply unit provides operating power to the semiconductor cooling component 111 and the cooling fan 121, and can be implemented using a removable battery pack or a rechargeable power supply structure. The control unit is electrically connected to the sensor module to receive human body surface temperature and ambient temperature signals, and outputs corresponding drive control signals according to preset control logic. The control unit is electrically connected to both the semiconductor cooling component and the cooling fan, controlling their start / stop status and operating power to match the cooling intensity of the semiconductor cooling component with the heat dissipation capacity of the cooling fan.

[0033] During operation, when the control unit receives a temperature control activation command, it determines the corresponding cooling state based on the human body surface temperature and ambient temperature detected by the sensor module, and outputs a drive current to the semiconductor cooling component, causing the semiconductor cooling chip to generate a cold end and a hot end. The cooling energy generated at the cold end is transferred to the inner layer region 11 through the cold end cooling structure, thereby cooling the area in contact with the human body; at the same time, the heat generated at the hot end is transferred to the outer layer region 12 through the hot end heat dissipation structure, and is dissipated to the outside air by the cooling fan 121. Through the above coordinated operation, the garment body can achieve localized active cooling without relying on refrigerant and piping, and can adjust the cooling intensity according to changes in human body and ambient temperature.

[0034] By placing the semiconductor cooling component in the inner layer and the cooling fan in the outer layer, and using a cold-end cooling structure and a hot-end heat dissipation structure to separate heat flow, this embodiment effectively prevents heat from being transferred back to the human body, improving cooling efficiency and wearing comfort. Simultaneously, through the cooperation of the sensor module and the power control module, coordinated control of the cooling component and the cooling fan is achieved, enabling the clothing to provide stable and adjustable cooling effects under different environmental conditions, making it suitable for applications such as high-temperature work and outdoor protection.

[0035] As an optional embodiment of the present invention, the semiconductor cooling component is disposed in the back area and / or chest area of ​​the inner layer of the garment body, the cold end cooling structure is located in the inner layer area and in contact with the human body, and the hot end heat dissipation structure is located in the outer layer area; the semiconductor cooling components in the back area and chest area can be adjusted independently, and the cooling fan is disposed in the outer area of ​​the garment body corresponding to the position of the hot end heat dissipation structure.

[0036] As an optional embodiment of the present invention, the semiconductor cooling component is disposed in the back region and / or chest region of the inner layer of the garment body. The back region and chest region are the main heat dissipation areas of the human torso. Arranging the semiconductor cooling component in these regions helps to reduce the number of cooling components while ensuring the cooling effect, thereby reducing overall energy consumption and structural complexity.

[0037] In this embodiment, the cold-end cooling structure is located in the inner layer region and in contact with the human body. It is used to stably conduct the cold energy generated by the cold end of the thermoelectric cooler to the human body contact area, allowing the cold energy to directly act on the human body surface. The hot-end heat dissipation structure is located in the outer layer region, allowing the heat generated by the thermoelectric cooler during operation to be transferred to the outer space in a direction away from the human body. This creates a heat flow distribution path within the clothing structure where the cold end faces the human body and the hot end faces outward, preventing heat from flowing back to the human body.

[0038] The semiconductor cooling components in the back and chest areas are independently adjustable, meaning that the semiconductor cooling components in the two areas are electrically controlled separately by control units, and their drive current and operating power can be adjusted independently. This independent adjustment allows for different cooling intensities to be applied to the back and chest areas based on the heat dissipation conditions and comfort needs of different parts of the body. For example, the cooling power of the back area can be increased when there is more heat accumulation, while the cooling power of the chest area can be reduced when the body is more tightly fitted or the ambient temperature is low, thus achieving regionalized and differentiated cooling control.

[0039] The cooling fan is positioned on the outer side of the garment body, corresponding to the position of the heat dissipation structure at the hot end, allowing the airflow generated by the fan to directly act on the surface of the heat dissipation structure. When the semiconductor cooling component is operating, the heat generated at the hot end is collected to the outer region via the heat dissipation structure and exchanged with the outside air under the convective airflow generated by the cooling fan, thereby accelerating the heat dissipation rate and ensuring that the semiconductor cooling chip maintains an effective temperature difference.

[0040] Through the above structural arrangement, this embodiment can form a clear cold end and hot end partition inside the garment, so that the heat in the cooling process is preferentially discharged to the outside; at the same time, with the independent adjustment mechanism of the semiconductor cooling components in the back area and chest area, differentiated cooling control for different parts of the human body can be achieved, which is conducive to improving cooling efficiency, reducing the risk of local overcooling and improving wearing comfort.

[0041] As an optional embodiment of the present invention, the sensor module includes sensor units disposed in the back region and / or the chest region, and the control module automatically adjusts the operating current of the semiconductor cooling component and / or the speed of the fan according to the detection results of the sensor module.

[0042] As an optional embodiment of the present invention, the sensor module includes a sensor unit disposed in the back region and / or chest region for real-time detection of the human body surface temperature at the corresponding location. By arranging the sensor unit in the back region and / or chest region, the temperature changes of the main heat dissipation areas of the human body can be directly obtained, thereby making the temperature acquisition results more reflective of the wearer's actual thermal sensation.

[0043] The control module is electrically connected to the sensor module and receives the temperature detection signal output by the sensor unit, using the detection result as the basis for cooling regulation. When the human body surface temperature is detected to rise or deviate from the target temperature range, the control module increases the operating current of the semiconductor cooling component to improve the cooling intensity; when the human body surface temperature is detected to drop or approach the target temperature range, the control module decreases the operating current of the semiconductor cooling component to reduce the cooling intensity, thereby achieving automatic adjustment of the cooling capacity.

[0044] Simultaneously, the control module can also adjust the fan speed based on the detection results from the sensor module. When the semiconductor cooling component has a high operating power and generates a lot of heat at its hot end, the control module increases the fan speed to enhance heat dissipation. When the cooling power is low or the temperature tends to stabilize, the control module decreases the fan speed to reduce energy consumption and operating noise. Through this method, the sensor module and control module work together to achieve coordinated adjustment of the semiconductor cooling component and the cooling fan, enabling the cooling effect to automatically adjust according to changes in body temperature. This improves the timeliness of cooling response and wearing comfort, while reducing unnecessary energy consumption.

[0045] As an optional embodiment of the present invention, the cold end cooling structure includes a thermal pad sandwiched between the cold end of the thermoelectric cooler and the thermal pad; the hot end heat dissipation structure includes a heat sink attached to the hot end of the thermoelectric cooler; the thermoelectric cooler is sandwiched between the thermal pad and the heat sink.

[0046] As an optional embodiment of the present invention, the cold-end cooling structure includes a thermal pad sandwiched between the cold end of the thermoelectric cooler and the thermally conductive sheet. The thermal pad and the thermally conductive sheet together form the cooling path on the cold end side. The thermal pad fills the microscopic gap between the cold end of the thermoelectric cooler and the thermally conductive sheet, enabling them to form a more stable bonding interface. The thermally conductive sheet provides a larger thermally conductive contact area and acts as a cold energy diffusion component, allowing the cold energy generated at the cold end to be more evenly transferred to the inner layer region and the human body contact surface.

[0047] The hot-end heat dissipation structure includes a heat sink attached to the hot end of the thermoelectric cooler. The heat sink and the hot end of the thermoelectric cooler form a thermally conductive connection, rapidly dissipating and spreading the heat generated at the hot end to the surface of the heat sink, thereby providing a larger heat dissipation area for convective heat transfer in the outer region. The heat sink can be arranged to match the airflow direction of the cooling fan, allowing the airflow generated by the cooling fan to directly sweep across the surface of the heat sink, thus enhancing the convective heat transfer effect.

[0048] In the above structural relationship, the thermoelectric cooler is sandwiched between the heat-conducting pad and the heat sink, forming a clamped stacked structure with the cold end facing the heat-conducting pad and the hot end facing the heat sink. This stacked structure allows the cold-end cooling structure and the hot-end heat dissipation structure to be spatially partitioned. Cold energy is transferred towards the human body through the heat-conducting pad and the heat-conducting pad, while heat is transferred to the outer area through the heat sink. This reduces heat backflow between the cold and hot ends, improves the effective temperature difference maintenance capability of the thermoelectric cooler, and helps to improve cooling efficiency and wearing comfort.

[0049] As an optional embodiment of the present invention, the power supply unit is a detachable battery pack, the outer layer includes at least two layers of anti-static and flame-retardant fabric, and a channel for wires to pass through is provided between the two layers of anti-static and flame-retardant fabric. The power supply interface of the detachable battery is electrically connected to the semiconductor cooling component and the cooling fan respectively through the wires.

[0050] Example 2 Please see Figure 2 This invention provides a method for temperature control of protective clothing, used in the protective clothing with temperature regulation function of Embodiment 1, comprising: S1. In response to the temperature control start command issued by the control unit, obtain the currently set cooling level and the corresponding target temperature difference range; Specifically, the temperature control activation command in S1 can be understood as a trigger signal for the control unit to enter the temperature adjustment mode. The cooling level is used to characterize the desired cooling intensity, and the target temperature difference range is used to limit the appropriate temperature difference range between the human body surface temperature and the ambient temperature. In implementation, after receiving an activation command triggered by a button, APP command, or preset strategy, the control unit reads the current level parameter from the locally stored level configuration table and simultaneously obtains the target temperature difference range bound to that level. If the system allows the user to select the level before activation, the control unit directly reads the most recently confirmed level status. If level switching is allowed during operation, a level lock is completed at the same time as receiving the activation command, avoiding control jitter caused by frequent level changes during subsequent calculations. By clearly defining the level and target temperature difference range before entering the control closed loop, subsequent power calculations and fan linkage have a unified basis, ensuring a consistent cooling experience across different usage scenarios and facilitating the embedding of energy consumption and comfort constraints into the level configuration.

[0051] S2. Based on the target temperature difference range and the temperature difference between the human body surface temperature and the ambient temperature, obtain the target driving power of the semiconductor cooling component. Specifically, in this step, the temperature difference is the difference between the human body surface temperature and the ambient temperature, reflecting the relative heat load on the human body compared to the environment. The target temperature difference range provides the expected range for this cooling setting. In implementation, the control unit first reads the human body surface temperature and ambient temperature from the sensor module, calculates the current temperature difference value, and compares this value with the target temperature difference range to obtain the deviation, which characterizes whether the current cooling demand is strengthened, maintained, or weakened. To avoid misjudgment caused by noise from a single measurement, multiple temperature sets can be acquired within a preset sliding time window at sampling periods to form a temperature difference sequence. The rate of temperature difference change is further calculated, and the trend is determined. The deviation, rate of change, and trend are then combined to determine the power adjustment amount. The target driving power is usually generated within the power parameter set bound to the cooling setting. For example, starting with the base power, it is corrected under the constraints of the maximum and minimum power to obtain a driving power that both meets the cooling setting intensity and follows temperature difference changes. This approach allows the cooling output to have interpretable adaptability to changes in the human body and the environment. It avoids the energy consumption and overcooling caused by long-term high-power operation when the temperature difference is close to the target range, and also avoids the discomfort caused by sluggish cooling response when the temperature difference continues to deviate.

[0052] S3. Control the semiconductor cooling chip in the designated area to operate according to the target driving power; Specifically, the designated area typically corresponds to the location of the thermoelectric cooling components in the back and / or chest areas. The target drive power is the direct input to control the thermoelectric cooling chip to generate the required cooling intensity. In implementation, the control unit converts the target drive power into a drive current or equivalent drive duty cycle for the thermoelectric cooling chip and outputs it to the corresponding area's thermoelectric cooling component through the power supply unit, putting the thermoelectric cooling chip into operation. To ensure a stable cooling experience between the cold-end cooling structure and the human body contact surface, a power ramp can be used to gradually increase the power to the target level, avoiding rapid heat accumulation at the hot end due to instantaneous high current, and also reducing sudden changes in body sensation. If the back and chest areas support independent adjustment, differential correction can be made based on the total target power combined with regional differences, and then distributed to the thermoelectric cooling chips in each area separately, so that areas with different levels of contact and heat dissipation conditions can still obtain a more balanced body sensation. By implementing the target power as an executable regional drive control, the cold-end cooling capacity can be stably transferred to the human body contact area through the cold-end cooling structure, ensuring that the set cooling intensity is truly achieved, and providing an input basis consistent with the actual power for subsequent hot-end heat dissipation control.

[0053] S4. Obtain the start time of the cooling fan based on the actual operating power of the semiconductor cooling component; The actual operating power of the semiconductor refrigeration component is used as the basis for the fan start-up decision. The actual operating power reflects the real energy input level of the semiconductor refrigeration chip at the current moment, and its fluctuation can characterize the changing trend of heat generation at the hot end.

[0054] The control unit monitors the actual power of the back and chest areas within a preset time period to obtain a power fluctuation sequence. The average heat generation per unit time is then calculated from the power fluctuation sequence, and the hot end heat accumulation rate is obtained by combining the corresponding thermal resistance parameters. Furthermore, the rate of change of the thermal accumulation rate can be calculated within this time period to predict the evolution speed of the thermal accumulation state. Based on the preset heat dissipation start-up threshold, the control unit predicts the remaining time for the thermal accumulation rate of the back and chest to reach the threshold, and determines the priority start-up side accordingly. At the same time, the rate of change of the priority start-up side is combined to determine the safety lead time. The remaining time is subtracted from the lead time to obtain the fan start-up time, so that the fan can intervene in advance before the hot end is close to the accumulation, rather than passively starting after the threshold is exceeded.

[0055] The startup timing obtained in this way takes into account the differences between the two regions and the dynamic changes in power, which can significantly reduce the risk of decreased cooling efficiency caused by excessively rapid temperature rise at the hot end, and also reduce the problems of false startup and delayed startup caused by relying solely on fixed delay or single threshold triggering.

[0056] S5. Based on the startup time and the actual operating power, control the cooling fan to dissipate heat from the hot end heat dissipation structure of the semiconductor cooling component.

[0057] The startup time is used to define the point at which the fan intervenes. The heat dissipation structure at the hot end is usually a heat-conducting extension component such as a heat sink. Its convective heat dissipation capacity is closely related to the fan speed, running time, and the selection of the heat dissipation object. In implementation, after the startup time is reached, the control unit first switches the cooling fan from the off state to the preset speed level, and then adjusts the fan speed in stages according to the heat accumulation rate corresponding to the actual working power of the back and chest areas, so that the heat dissipation capacity matches the heat generation level at the hot end. To adapt to the two-zone structure, it can be first determined whether the heat accumulation rate in both zones is at a high level. If both are high, a simultaneous cooling mode is used to maintain a high speed output. If only one side has a more prominent heat accumulation, an alternating cooling schedule is adopted, prioritizing the cooling of the hot end corresponding to the side that is activated first. The system then switches to the other side only after the heat accumulation rate drops to the switching threshold, avoiding the fan capacity being evenly distributed and resulting in insufficient cooling in critical areas. During operation, the heat accumulation rate and change rate are reassessed according to the update cycle. If necessary, the speed level is adjusted or the running time is extended until the heat accumulation state in both zones falls below the maintenance threshold before the speed is reduced or stopped. This ensures that the semiconductor cooling chip maintains an effective temperature difference while controlling noise and energy consumption. By linking the start-up time with the actual power and introducing a two-zone cooling mode determination and dynamic adjustment mechanism, the hot end cooling is more timely and better matches the actual load changes, stabilizing the cooling effect and improving the overall energy efficiency and wearability comfort.

[0058] As an optional embodiment of the present invention, obtaining the target driving power of the semiconductor cooling component based on the target temperature difference range and the temperature difference between the human body surface temperature and the ambient temperature includes: S21. Based on the current cooling level, obtain the target temperature difference range and power parameter set corresponding to the cooling level. The power parameter set includes at least the base power, maximum power, and minimum power. The cooling level is used to characterize the cooling intensity level currently selected by the user or system. The power parameter set consists of constraints and benchmark parameters that can be directly used for power calculation at that level. The base power serves as the default output level for that level, while the maximum and minimum power limit the adjustment range to prevent power calculation results from exceeding the usable range of the semiconductor cooling components. In implementation, before entering power calculation, the control unit reads the target temperature difference range bound to the cooling level from the level configuration table or preset mapping rules, and simultaneously reads the corresponding power parameter set. The power parameter set can be preset according to different environmental levels, fabric structures, or regions, ensuring a consistent feel across different clothing styles at the same cooling level. By clearly defining the target temperature difference range and power constraint boundaries beforehand, subsequent temperature deviation analysis and power correction have a unified reference, reducing discomfort caused by sudden power changes after level switching and improving control repeatability.

[0059] S22. Obtain the human body surface temperature and ambient temperature, and calculate the current temperature difference. Human body surface temperature reflects the wearer's actual thermal sensation under the influence of clothing, while ambient temperature reflects the level of external heat load. The current temperature difference is calculated from both and is used to characterize the heat dissipation pressure of the human body relative to the environment. In implementation, the control unit reads temperature data from the sensor module and performs necessary validity processing, such as range verification of sampled values, removal of obvious outliers, or simple filtering, to avoid instantaneous fluctuations directly affecting power decisions. It then calculates the current temperature difference and uses it as input for subsequent deviation and trend judgments. By introducing this intermediate value of the current temperature difference, the control strategy can be adjusted based on the relative relationship between the human body and the environment, without relying on absolute temperature thresholds, thus better adapting to different seasons and operating environments.

[0060] S23. Within the first preset sliding time window, acquire multiple sets of human body surface temperature and ambient temperature according to the preset sampling period, and obtain human body surface temperature sequence and ambient temperature sequence respectively. Specifically, the first preset sliding time window is used to observe the temperature change process over a continuous period of time, the preset sampling period is used to specify the time interval for sampling within the window, and the human body surface temperature sequence and ambient temperature sequence provide the data basis for subsequent temperature difference sequence and rate of change calculations. In implementation, the control unit reads the human body surface temperature and ambient temperature multiple times within the sliding time window according to the sampling period, and writes each sampled value into the corresponding sequence in chronological order. The sliding time window can use a rolling update method; each time the window slides forward, the earliest sample is discarded and the latest sample is added, ensuring that the control is always based on data from the most recent period. By using sequences instead of single-point temperatures, the interference of short-term noise or instantaneous temperature fluctuations caused by human movement on power calculation can be reduced, making power adjustment smoother and more in line with the real rhythm of perceived temperature changes.

[0061] S24. Calculate the temperature difference sequence based on the human body surface temperature sequence and the ambient temperature sequence; The temperature difference sequence is calculated point-by-point from the human body surface temperature sequence and the ambient temperature sequence. It unifies the two temperature information streams into a single index, facilitating subsequent calculations of rate and trend. In implementation, the control unit subtracts the human body surface temperature from the ambient temperature at each sampling moment within the sliding time window to obtain the corresponding temperature difference value and form the temperature difference sequence. When there are missing or abnormal samples, interpolation between adjacent moments or removal of outliers can be used to recalculate, ensuring the temperature difference sequence is temporally continuous and usable. By converting temperature information into a temperature difference sequence, the control unit only needs to perform dynamic analysis around a single sequence, which helps reduce control logic complexity and improve real-time performance.

[0062] S25. Calculate the rate of temperature change based on the temperature difference sequence, and determine the trend of temperature change based on the direction of change of the temperature difference sequence within the first sliding time window; The rate of temperature change describes how quickly the temperature difference changes over time, while the trend of temperature change describes whether the temperature difference increases or decreases overall within the window. Together, they determine whether the system is approaching or deviating from the target temperature range. In implementation, the rate of temperature change can be calculated based on the difference between adjacent sampling points in the temperature difference sequence, and converted to a change per unit time using the sampling period. Alternatively, a smoother rate result can be obtained based on the difference between the beginning and end of the window or a weighted difference. The trend of temperature change can be obtained by comparing the overall direction of the temperature difference sequence within the window. For example, the relationship between the temperature difference at the end of the window and the temperature difference at the beginning of the window can be used as the directional basis, or the proportion of the signs of continuous differences within the window can be used as the directional basis. By simultaneously introducing both rate and trend, the control unit can distinguish between different states such as slow drift and rapid change, avoiding over-adjustment based solely on the current temperature difference value, thereby improving control stability.

[0063] S26. Determine the power adjustment amount based on the deviation of the current temperature difference value from the target temperature difference range, the rate of temperature difference change, and the trend of temperature difference change; Specifically, the deviation reflects the relationship between the current temperature difference and the target temperature difference range. A deviation outside the range indicates the degree to which the temperature exceeds the range, while a deviation within the range indicates the degree to which the temperature approaches the upper or lower boundaries of the range. The power adjustment is a control quantity used to correct the base power. In implementation, the control unit first determines the adjustment direction based on which side of the target temperature difference range the current temperature difference falls on. Then, it determines the adjustment range based on the magnitude of the deviation and incorporates the rate and trend of temperature difference change to dynamically correct the adjustment. For example, when the temperature difference is rapidly converging towards the target range, the adjustment range is reduced to prevent overshoot; when the temperature difference continues to move away from the target range, the adjustment range is increased to enhance response. By incorporating deviation, rate, and trend into the determination process of the power adjustment, the control strategy not only matches the cooling intensity to the current demand but also predicts changes, resulting in more stable cooling output and a more continuous user experience.

[0064] S27. Based on the power adjustment amount, between the maximum power and the minimum power, the base power is corrected to obtain the target driving power of the semiconductor cooling component.

[0065] Specifically, adjusting the base power means adjusting the power level upwards or downwards based on the base power corresponding to the gear level. The maximum and minimum power are used to limit the adjustment result, ensuring that the final target drive power is within the usable range. In implementation, the control unit adds the power adjustment to the base power to obtain a candidate power, and then trims the candidate power to ensure it does not exceed the maximum power or fall below the minimum power. To avoid power fluctuations near the limiting boundaries, a smoothing process can be added to the adjusted target drive power, such as using segmented increments or decrements or limiting the power change per unit time, making the power output more stable. By completing the power adjustment within the gear level's power boundaries and outputting the target drive power, it ensures that the semiconductor cooling component has sufficient capacity to handle high heat load scenarios while avoiding over-cooling and unnecessary energy consumption in low-demand scenarios, thus improving overall energy efficiency and wearability comfort.

[0066] Preferably, the designated area includes a back area and a chest area, and controlling the semiconductor cooling chip in the designated area to operate according to the target driving power includes: S31. Using the target driving power as the reference power for the semiconductor cooling components corresponding to the back region and the chest region, control the semiconductor cooling sheets in the back region and the chest region to work. The reference power can be understood as an initial power reference value uniformly applied to the back and chest areas at the same cooling level. The target drive power is first used as the reference power and then distributed to the semiconductor cooling components in the back and chest areas, allowing both cooling elements to enter working state synchronously and establish a comparable initial response. In practice, the control unit can convert the target drive power into the current setpoint or duty cycle setpoint of the two drive outputs. Simultaneously, it performs start-up ramp or rate-of-change control on the back and chest channels, ensuring a smooth transition of power from zero or the previous state to the reference power. This avoids a sudden surge in current that could cause rapid heat buildup at the hot end or a sudden feeling of coldness for the wearer. By starting with a unified reference power, both areas enter a steady or quasi-steady state under the same control reference, providing a consistent comparison starting point for subsequent differential corrections based on differences, and reducing misjudgments caused by different initial values.

[0067] S32. Monitor the actual operating power of the semiconductor cooling components in the back region and chest region respectively within the second preset sliding time window to obtain the back power sequence and the chest power sequence. The second preset sliding time window is used to capture the actual power changes of the back and chest over a continuous period of time. The back power sequence and the chest power sequence reflect the actual output performance of the two semiconductor cooling components under the same control command. In implementation, the control unit reads the actual operating power of the back and chest at a preset sampling period within the sliding time window. It can directly read the power estimation results from the power supply unit or obtain them by conversion from voltage and current sampling, and write each sampled value into its respective sequence in chronological order. The sliding window can be updated in a rolling manner to ensure that the sequence always corresponds to the operating state of the most recent period. By using the sequence instead of single-point power judgment, short-term fluctuations caused by fit changes, differences in heat conduction paths, and external airflow disturbances can be reflected on a time scale, making differential regulation more stable and avoiding frequent corrections based solely on instantaneous power deviations.

[0068] S33. Calculate the rate of change of back power and the rate of change of chest power based on the back power sequence and the chest power sequence, respectively. The power change rate describes how quickly the power in the back or chest area changes over time, reflecting the dynamic characteristics of the channel response better than the power magnitude alone. In implementation, the control unit can perform differential calculations on the back and chest power sequences to obtain the power change at adjacent sampling times, then combine this with the sampling period to convert it into the change per unit time. A weighted average within a window can be used to obtain a smoother rate of change result. When there are obvious outliers in the sequence, outlier removal or amplitude limiting can be performed before calculating the rate to avoid amplifying rate judgments by individual abrupt changes. By introducing the power change rate, the response speed of the two regions under the same control input can be quantified, and subsequent regional response deviations are no longer static comparisons but rather alignment and compensation for dynamic behavior.

[0069] S34. Obtain the regional response deviation based on the difference between the power change rate of the back and the power change rate of the chest. Regional response deviation characterizes the difference in response speed or amplitude between the back and chest areas. Its origins are often related to the degree of contact between different parts of the body, the tightness of the thermal pad, the difference in contact area between the thermal pad and the body, and differences in the outer layer's heat dissipation conditions. In implementation, the control unit uses the difference between the power change rate of the back and the power change rate of the chest as the primary input. It can further combine the direction of the difference to determine which side responds slower or faster, and can also normalize the difference to make it comparable across different power levels. When the difference remains in the same direction for a long period, a stable structural response difference between the two areas can be considered. When the difference fluctuates repeatedly within a window, the difference can be considered to mainly originate from posture changes or transient disturbances. By abstracting the response difference as regional response deviation, the control strategy can specifically correct the two outputs, rather than simply increasing the overall power, thus better aligning with the goal of regionalized cooling.

[0070] S35. Perform differential correction on the reference power according to the regional response deviation to obtain the back region correction power and the chest region correction power, and obtain the back power correction amount and the chest power correction amount, wherein the back power correction amount and the chest power correction amount have opposite signs or different amplitudes. The design utilizes regional response deviation to adjust the baseline power in a distributed manner. The back power correction and chest power correction have opposite signs or different amplitudes. Essentially, with the total power baseline unchanged or under controlled variation, more power is preferentially allocated to the side with a weaker response or greater need for compensation, while the other side is correspondingly suppressed or its increase reduced. In implementation, the control unit maps the regional response deviation into two correction values ​​in opposite directions. For example, when the back response is slower than the chest response, a positive correction is applied to the back power and a negative correction to the chest power, ensuring the back reaches the expected cooling intensity faster. When the difference between the two sides is mainly in amplitude rather than rate, a correction strategy with different amplitudes can be used, making one side larger and the other smaller, thus avoiding fluctuations in perceived comfort caused by simultaneous large adjustments on both sides. These opposite signs or different amplitudes are not intentionally set, but rather to achieve a more balanced perceived output even when the heat conduction and dissipation conditions of the two regions are inconsistent, while avoiding excessive cooling on one side or ineffective increases in total power that would lead to increased energy consumption.

[0071] S36. Control the operation of the semiconductor cooling chips in the back region and the chest region respectively according to the back region correction power and the chest region correction power, and limit the back region correction power and the chest region correction power to the maximum power and minimum power limits corresponding to the cooling level.

[0072] The corrected power is distributed separately to the back and chest channels, allowing the two semiconductor cooling chips to enter a new operating state after differential correction. The corrected power is limited by maximum and minimum power levels to ensure the output meets the level constraints and device safety boundaries. In implementation, the control unit can separately trim the corrected power for the back and chest areas, ensuring it does not exceed the maximum allowable power for that level and is not lower than the minimum power. It can also incorporate unit-time variation limits or ramp updates to ensure a smooth power delivery after correction, avoiding frequent switching that could disrupt the fan linkage strategy or cause sudden cooling sensations for the wearer. If the independent adjustment of the back and chest is in a continuous closed-loop state, monitoring and correction can be repeated in each update cycle until the regional response deviation converges to a preset range. By implementing differential correction under limiting constraints, the two areas can achieve a more consistent cooling sensation output at the same level, improving the controllability and stability of regional cooling and reducing uneven cooling efficiency and energy waste caused by structural differences.

[0073] Preferably, obtaining the start-up time of the cooling fan based on the actual operating power of the semiconductor cooling component includes: S41. Monitor the actual operating power of the semiconductor cooling components in the back region and chest region respectively within a preset time period to obtain the back power fluctuation sequence and the chest power fluctuation sequence. The power fluctuation sequence is used to characterize the actual power changes of the semiconductor cooling components in the back and chest regions over a period of time. The actual operating power reflects the current energy input level of the semiconductor cooling chip and indirectly reflects the heat load generated at the hot end. In implementation, the control unit reads the actual power data of the back and chest channels according to a sampling period within a preset time period. The power data can be obtained by converting the voltage and current samples from the power supply unit side, or estimated from the output of the drive side and device characteristics. Each sampling point is written into the back power fluctuation sequence and the chest power fluctuation sequence in chronological order. To ensure the availability of the sequences, range verification and outlier suppression can be performed on the sampled values ​​to avoid isolated spikes caused by short-term contact jitter or power supply fluctuations affecting subsequent judgments. By establishing two power fluctuation sequences, subsequent thermal accumulation analysis no longer relies on single-point power but is based on the actual load changes over a period of time, which can better reflect the dynamic working conditions caused by changes in wearing posture and regional fit differences.

[0074] S42. Calculate the average heat generation per unit time in the back region and the chest region based on the back power fluctuation sequence and the chest power fluctuation sequence respectively, and obtain the heat accumulation rate in the back region and the heat accumulation rate in the chest region respectively by combining their corresponding thermal resistance parameters. Average heat output refers to the equivalent heat level that the hot end needs to dissipate within a unit of time. Thermal resistance parameters characterize the ease of heat conduction and diffusion along the heat dissipation path at the hot end, while the heat accumulation rate characterizes the speed at which heat accumulates at the hot end. In implementation, the control unit first statistically processes the power fluctuation sequences of the back and chest areas to obtain the average power level per unit time and convert it into the corresponding average heat output. Then, combined with the preset or calibrated thermal resistance parameters for each area, the heat accumulation rate for the back and chest areas is obtained. The thermal resistance parameters reflect the differences in heat dissipation capacity caused by the tightness of the heat sink installation, the ventilation conditions of the outer fabric, and the difference in fan airflow coverage in different areas, allowing the same power input to correspond to different heat accumulation states in different areas. This transforms power fluctuations into quantitative indicators that more closely reflect the state of the hot end, shifting the fan start-up decision from simply looking at power output to focusing on whether heat will accumulate at the hot end, thus making it easier to balance cooling efficiency and hot end safety margin.

[0075] S43. During the preset time period, the rate of change of heat accumulation rate in the back region and the rate of heat accumulation rate in the chest region are obtained respectively. The rate of change reflects how quickly the heat accumulation rate changes over time, revealing whether the heat load at the hot end is accelerating or stabilizing. In implementation, the control unit continuously samples the heat accumulation rates at the back and chest within the same preset time period, forming corresponding heat accumulation rate sequences. These sequences are then differentially or weightedly analyzed to obtain the rate of change. To reduce the amplification effect of noise on the rate of change, the rate sequences can be smoothed or the amplitude of individual changes can be limited, making the rate of change more reflective of the true trend rather than instantaneous fluctuations. By introducing the rate of change, the system not only knows the level of heat accumulation but also its rate of approach to the threshold. This provides the necessary conditions for subsequent prediction of remaining time, allowing fan startup to be planned in advance rather than passively triggered.

[0076] S44. Based on the heat accumulation rate and its rate of change in the back region, the heat accumulation rate and its rate of change in the chest region, and the preset heat dissipation start threshold, obtain the remaining time for the heat accumulation rate in the back region and the chest region to reach the heat dissipation start threshold, and record them as the remaining time for the back region and the remaining time for the chest region. The remaining time characterizes how long it is expected that the heat accumulation rate will reach the heat dissipation initiation threshold, which is a critical condition used to determine when forced intervention in heat dissipation is required at the hot end. In implementation, the control unit extrapolates the evolution of the heat accumulation rate over a short period based on the heat accumulation rate and its rate of change at the back and chest, obtaining the remaining time for the back and chest. The extrapolation process can employ linear prediction when the rate of change is approximately stable, or short-window weighted prediction when the rate of change fluctuates, making the prediction more sensitive to sudden power increases without being overly affected by single-point anomalies. By unifying the heat accumulation state of the two regions into the remaining time index, the urgency of the two regions can be directly compared, providing a more intuitive and actionable time benchmark for initiation decisions and avoiding delayed initiation caused by relying solely on threshold comparisons.

[0077] S45. Compare the remaining time of the back with the remaining time of the chest, and determine the side with the smaller remaining time as the priority opening side; Comparing the remaining time for the back and chest sides and determining the priority activation side essentially focuses the heat dissipation control decision on the side that approaches the threshold earlier. In practice, the control unit determines the priority activation side based on the relationship between the two remaining times, and can maintain the priority activation side from the previous cycle when the remaining times are very close, reducing control jitter caused by frequent switching of the priority side in critical states. This priority activation strategy ensures that fan startup and subsequent heat dissipation prioritize the hot end of the side that needs cooling more, avoiding excessively rapid temperature rise in critical areas due to average processing on both sides, thus maintaining an effective temperature difference for the thermoelectric cooler and stabilizing cooling output.

[0078] S46. Determine the safety lead time based on the rate of change of thermal accumulation rate corresponding to the priority opening side. The safety lead time is used to reserve a startup margin based on prediction, avoiding prediction errors or lag caused by sudden power surges that occur when the fan intervenes just before reaching the threshold. In implementation, the control unit determines the safety lead time based on the rate of change of the heat accumulation rate on the priority-to-start side. A larger rate of change indicates that the heat accumulation approaches the threshold faster, and the lead time can be increased accordingly to ensure more timely intervention. Conversely, a smaller rate of change allows for a smaller lead time, thus avoiding premature startup that causes unnecessary energy consumption and noise. By establishing a correlation between the safety lead time and the rate of change, the startup strategy can automatically adjust according to changes in heat load, maintaining good adaptability under different wearing postures and environmental ventilation conditions.

[0079] S47. Obtain the start time of the cooling fan based on the difference between the remaining time corresponding to the priority start side and the safety advance.

[0080] The start-up time is determined by the remaining time on the priority start-up side and a safety lead time; the difference reflects the early intervention control concept. In implementation, the control unit subtracts the safety lead time from the remaining time corresponding to the priority start-up side to obtain a candidate start-up time. Boundary processing can be performed on the subtraction result to avoid abnormal situations where the start-up time is earlier than the current time. Once the candidate start-up time is reached, the fan control process begins, and then the fan speed or cooling mode is updated based on the actual operating power and heat accumulation status. This method of obtaining a start-up time utilizes the predictive information from both regions and uses the safety lead time to mitigate prediction errors and sudden load changes, allowing for a smoother fan start-up and preventing excessive heat accumulation at the hot end. This improves the stability of cooling efficiency and reduces the impact of overheating at the hot end on wearable comfort and system reliability.

[0081] Preferably, controlling the cooling fan to dissipate heat from the hot end of the semiconductor cooling component based on the startup time and the actual operating power includes: S51. After the start-up time is reached, the thermal accumulation rate of the semiconductor cooling components in the back region and chest region is obtained respectively. Acquiring the heat accumulation rate in both regions upon startup ensures that fan control decisions are based not only on the startup action itself, but also on the current heat load level at the hot end. The heat accumulation rate, previously derived from power fluctuations and thermal resistance parameters, can be refreshed at startup or updated and corrected using the previous cycle's calculated value, ensuring the back and chest areas are in comparable states under the same time reference. In practice, the control unit reads the latest actual power data from the back and chest channels, updates the heat accumulation rate based on the corresponding thermal resistance parameters, and uses this as input for determining the cooling mode and adjusting the fan speed. This avoids a fixed operating strategy upon fan startup, ensuring that cooling actions are synchronized with the actual state of the hot end, and reducing temperature attenuation caused by heat stagnation in the outer region.

[0082] S52. Determine a heat dissipation mode based on the heat accumulation rate in the back region and the heat accumulation rate in the chest region, wherein when both the heat accumulation rate in the back region and the heat accumulation rate in the chest region are greater than a preset heat dissipation threshold, the heat dissipation mode is a simultaneous heat dissipation mode; when the heat accumulation rate on at least one side is less than or equal to the preset heat dissipation threshold, the heat dissipation mode is an alternating heat dissipation mode. The heat dissipation mode is determined by the combined heat accumulation rates of the back and chest areas, structuring the resource allocation problem of a single fan with limited heat dissipation capacity into two operating conditions. A preset heat dissipation threshold is used to determine whether strong heat dissipation needs to be applied to both areas simultaneously. When both sides exceed the threshold, it indicates that heat is rapidly accumulating at both locations. If alternating heat dissipation is still used in this case, the side not prioritized may continue to heat up, dragging down cooling efficiency. When at least one side does not exceed the threshold, it indicates that the heat load on both sides is asymmetrical or the overall heat load is not extreme. In this case, alternating heat dissipation concentrates airflow to cover the more pressing side, allowing the heat dissipation benefits to be used on the more needed area without increasing fan energy consumption. This determination transforms simultaneous heat dissipation and alternating heat dissipation from a fixed choice to an adaptive switching based on operating conditions, enabling fan control to cover both high-heat-load scenarios and avoid unnecessary continuous high-speed operation in non-extreme scenarios.

[0083] S53. In the simultaneous heat dissipation mode, the cooling fan is turned on to simultaneously dissipate heat from the heat dissipation structures corresponding to the back area and the chest area, and the heat accumulation rate of the back area and the chest area is updated according to a preset update cycle. The speed of the cooling fan is adjusted according to the speed level corresponding to the larger heat accumulation rate after the update. In simultaneous cooling mode, emphasizing continuous updates to the heat accumulation rate and adjusting the fan speed according to the larger value is to prioritize the worst-case scenario of the system when both areas are experiencing high heat accumulation. In practice, the control unit refreshes the heat accumulation rates of the back and chest areas according to a preset update cycle after the fan is turned on, mapping the larger rate to a preset speed level table or graded range. This controls the fan speed to increase with rising heat load and decrease with falling heat load. To reduce noise and abrupt changes, hysteresis can be added to speed level switching or the number of speed changes per unit time can be limited, resulting in smoother fan adjustment. Using the larger heat accumulation rate as the basis for speed adjustment is equivalent to using the more unfavorable side as a constraint, preventing excessive temperature rise at the hot end due to insufficient heat dissipation on one side, thereby maintaining the effective temperature difference of the thermoelectric cooler and stabilizing the cooling output at the cold end.

[0084] S54. In the alternating heat dissipation mode, an initial heat dissipation priority area is determined based on the difference between the heat accumulation rate of the back region and the heat accumulation rate of the chest region, and the heat dissipation structure corresponding to the initial heat dissipation priority area is used as the current heat dissipation target to control the cooling fan to enter the first heat dissipation stage. In alternating cooling mode, an initial priority cooling area is first determined, and then its corresponding hot-end cooling structure is used as the current cooling target in the first cooling stage. The goal is to concentrate the limited fan airflow on the area that needs cooling more effectively in a short period of time. The difference here can be measured directly by the difference in heat accumulation rate, or by combining the direction of the difference to determine which side of the hot end is more prone to heat accumulation, with the priority area pointing to that side. In implementation, after the control unit determines the initial priority cooling area, it associates this area with the current cooling target in the control logic and sets the initial fan speed or initial runtime according to the strategy corresponding to that target, giving the cooling action a clear direction from the start of the stage. This phased scheduling, compared to always dissipating heat evenly, is more effective at quickly suppressing the temperature rise on the side with higher heat accumulation when the heat load is asymmetrical, reducing the drag effect of the hot end.

[0085] S55. During the first heat dissipation stage, update the heat accumulation rate of the back area and chest area according to a preset monitoring cycle. Continuously updating the heat accumulation rate in both areas during the first heat dissipation phase ensures that the alternating heat dissipation is not a one-time decision, but rather a continuous monitoring of changes in the state of both sides during the heat dissipation process. In practice, the control unit refreshes the heat accumulation rate of the back and chest according to a preset monitoring cycle, and synchronously updates the direction of change when necessary. This allows the control system to promptly detect which side's heat load is increasing and which side is decreasing, even if changes in the wearer's posture alter the fit and heat dissipation conditions. Through dynamic updates within each phase, alternating heat dissipation can be transformed from a static rotation to a rolling scheduling based on real-time thermal status, reducing insufficient heat dissipation caused by switching too early and reducing heat accumulation on the other side caused by switching too late.

[0086] S56. When the heat accumulation rate corresponding to the current heat dissipation object drops below the preset switching threshold, the heat dissipation structure of the hot end corresponding to the other side area is determined as the new heat dissipation object, and the cooling fan is controlled to enter the next heat dissipation stage. Using a threshold drop in the heat accumulation rate of the current heat dissipation object to signal a switch is designed to directly link the switching timing to the cooling effect, rather than relying solely on a fixed duration. The preset switch threshold can be understood as the current object having been effectively suppressed to an acceptable level of heat accumulation. At this point, the marginal benefit of continuing concentrated cooling decreases, and addressing the other side improves the overall temperature difference maintenance capability. In implementation, the control unit determines whether the heat accumulation rate of the current heat dissipation object is below the switch threshold within the monitoring cycle. If it is, the heat dissipation structure on the other side is designated as the new heat dissipation object, entering the next cooling phase. The switching action can be accompanied by a reselection of the fan speed level, ensuring that the airflow distribution after the switch matches the new object's thermal load. Threshold-triggered switching allows both sides to receive a more reasonable share of heat dissipation over time, preventing one side from being over-treated while the other continues to heat up, thus improving the stability and interpretability of alternating cooling.

[0087] S57. When the heat accumulation rate in both the back and chest areas is less than the preset end threshold and continues to reach the preset holding time, the heat dissipation control is terminated and the cooling fan is controlled to enter a low-speed operation state or stop operation.

[0088] By using both an end threshold and a hold duration to determine the end of heat dissipation, the system balances heat accumulation levels and state stability, preventing heat rebound caused by immediately stopping the fan after a brief decrease in the heat accumulation rate. The preset end threshold indicates that both hot ends have returned to a controllable level, while the preset hold duration confirms the sustainability of this state. In implementation, the control unit checks in each update cycle whether the heat accumulation rates on the back and chest are simultaneously below the end threshold. After continuously meeting the hold duration, it executes an exit strategy, switching the fan to low speed to maintain light convection or stopping it entirely to reduce noise and energy consumption. When heat accumulation subsequently increases again, it can re-enter the corresponding heat dissipation mode. Through this exit mechanism with hold conditions, fan control can reduce energy consumption promptly after the hot end pressure is relieved, while avoiding the decrease in comfort and control jitter caused by frequent start-stop cycles, creating a more stable and coordinated closed loop between the entire heat dissipation process and the operating state of the semiconductor cooling components.

[0089] In summary, this invention organically combines the power adjustment of the semiconductor cooling component, differential control of the back and chest areas, and predictive start / stop and mode switching of the cooling fan to construct a closed-loop control mechanism that regulates the actual heat load of the human body. On one hand, by using the target temperature difference range as the control objective and introducing the rate and trend of temperature difference change to dynamically correct the cooling power, the output of the semiconductor cooling component no longer depends solely on a fixed setting but can adaptively change according to the temperature relationship between the human body and the environment, thereby avoiding energy waste and localized overcooling caused by long-term high-power operation. On the other hand, by monitoring the actual power response of the back and chest areas separately and implementing differential correction, the inconsistencies in response caused by differences in fit, heat conduction conditions, or heat dissipation environment in different areas can be compensated in real time, ensuring a more balanced cooling experience in both areas at the same setting, improving wearing comfort and stability.

[0090] Meanwhile, in terms of heat dissipation control, this invention no longer employs a simple fixed threshold triggering method. Instead, it predicts the remaining time to reach the threshold based on the heat accumulation rate and its rate of change, thereby determining the fan start-up time in advance. This transforms the heat dissipation action from a passive response to proactive control, reducing the weakening of cooling efficiency due to hot-end temperature rise. Furthermore, by distinguishing between simultaneous and alternating heat dissipation modes and dynamically switching the heat dissipation target and speed in conjunction with the heat accumulation state, the limited fan cooling capacity can be prioritized for areas requiring more heat dissipation. This ensures that the hot-end temperature in critical areas is controlled while avoiding increased noise and power consumption caused by the fan maintaining high speed for extended periods. Through the above multi-level control coordination, this invention achieves stable cooling effects while improving energy efficiency, reducing the risk of hot-end overheating, and enhancing adaptability to different human postures and environmental conditions. Overall, it contributes to improving the reliability, comfort, and practicality of cooling clothing.

[0091] It should be clarified that the present invention is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of the present invention.

[0092] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0093] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0094] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0095] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0096] It should also be noted that the exemplary embodiments mentioned in this invention describe methods or systems based on a series of steps or apparatus. However, this invention is not limited to the order of the steps described above; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0097] The above description is merely a specific embodiment of the present invention. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the protection scope of the present invention.

Claims

1. A protective garment having a temperature regulating function, characterized by, The application relates to a protective garment with a temperature regulation function. The protective garment comprises a garment body, a semiconductor refrigeration assembly, a heat dissipation fan, a sensor module and a power control module. The garment body comprises an inner layer region close to a human body and an outer layer region away from the human body. The semiconductor refrigeration assembly is arranged on the garment body and comprises a semiconductor refrigeration sheet and a cold end heat conduction structure and a hot end heat dissipation structure arranged on the cold end and the hot end of the semiconductor refrigeration sheet respectively. The cold end heat conduction structure is used for transferring cold end cold energy to a human body contact region. The hot end heat dissipation structure is used for transferring hot end heat to the outer layer region.

2. The protective clothing with temperature adjustment function according to claim 1, characterized in that, The heat dissipation fan is arranged on the outer layer region of the garment body and is used for conducting heat dissipation on the hot end heat dissipation structure.

3. The protective clothing with temperature adjustment function according to claim 2, characterized in that, The sensor module is used for detecting a human body surface temperature and an ambient temperature.

4. The protective clothing with temperature adjustment function according to claim 3, characterized in that, The power control module comprises a control unit and a power unit. The power unit is electrically connected with the heat dissipation fan and the semiconductor refrigeration assembly.

5. The protective garment with temperature regulating function according to any one of claims 1-4, characterized in that, The control unit is used for controlling the start-stop and power adjustment of the semiconductor refrigeration assembly and the heat dissipation fan.

6. A method of temperature regulation for a protective garment, the method comprising: The semiconductor refrigeration assembly is arranged on a back region and / or a chest region of the garment body. The cold end heat conduction structure is arranged on the inner layer region and contacts the human body. The hot end heat dissipation structure is arranged on the outer layer region. The semiconductor refrigeration assemblies on the back region and the chest region can be independently adjusted. The heat dissipation fan is arranged on the outer side region of the garment body corresponding to the hot end heat dissipation structure. The sensor module comprises a sensor unit arranged on the back region and / or the chest region. The control module automatically adjusts the working current of the semiconductor refrigeration assembly and / or the rotating speed of the fan according to the detection result of the sensor module. The cold end heat conduction structure comprises a heat conduction pad arranged between the cold end of the semiconductor refrigeration sheet and the heat conduction sheet. The hot end heat dissipation structure comprises a heat dissipation sheet arranged on the hot end of the semiconductor refrigeration sheet. The semiconductor refrigeration sheet is arranged between the heat conduction sheet and the heat dissipation sheet. The power unit is a detachable battery pack. The outer layer region comprises at least two layers of anti-static and flame-retardant fabric. Channels for wires are arranged between the two layers of anti-static and flame-retardant fabric. The power supply interface of the detachable battery pack is electrically connected with the semiconductor refrigeration assembly and the heat dissipation fan through the wires. The protective garment with a temperature regulation function comprises: In response to a temperature control start instruction sent by the control unit, a current set refrigeration gear and a corresponding target temperature difference interval are obtained. According to the target temperature difference interval and the temperature difference value between the human body surface temperature and the ambient temperature, a target driving power of the semiconductor refrigeration assembly is obtained. According to the target driving power, the semiconductor refrigeration sheet in a specified region is controlled to work. According to the actual working power of the semiconductor refrigeration assembly, a starting time of the heat dissipation fan is obtained. According to the starting time and the actual working power, the heat dissipation fan is controlled to dissipate heat from the hot end heat dissipation structure of the semiconductor refrigeration assembly.

7. The method of temperature regulation of a protective garment of claim 6, wherein, Based on the target temperature difference range and the temperature difference between the human body surface temperature and the ambient temperature, the target driving power of the semiconductor cooling component is obtained, including: Based on the current cooling level, obtain the target temperature difference range and power parameter set corresponding to the cooling level. The power parameter set includes at least the base power, maximum power and minimum power. The temperature of the human body surface and the ambient temperature are obtained, and the current temperature difference is calculated. Within the first preset sliding time window, multiple sets of human body surface temperature and ambient temperature are acquired according to the preset sampling period, and human body surface temperature sequence and ambient temperature sequence are obtained respectively. A temperature difference sequence is calculated based on the human body surface temperature sequence and the ambient temperature sequence. The rate of temperature change is calculated based on the temperature difference sequence, and the trend of temperature change is determined based on the direction of change of the temperature difference sequence within the first sliding time window. The power adjustment amount is determined based on the deviation of the current temperature difference value from the target temperature difference range, the rate of temperature difference change, and the trend of temperature difference change. The base power is corrected based on the power adjustment amount between the maximum power and the minimum power to obtain the target driving power of the semiconductor cooling component.

8. The method of temperature regulation of a protective garment of claim 7, wherein, The designated area includes a back area and a chest area. Controlling the semiconductor cooling chip in the designated area to operate according to the target driving power includes: The target driving power is used as the reference power for the semiconductor cooling components corresponding to the back region and the chest region, and the semiconductor cooling sheets in the back region and the chest region are controlled to work. Within the second preset sliding time window, the actual operating power of the semiconductor cooling components in the back region and chest region is monitored respectively to obtain the back power sequence and the chest power sequence. Calculate the rate of change of back power and the rate of change of chest power based on the back power sequence and the chest power sequence, respectively. Based on the difference between the rate of change of power in the back and the rate of change of power in the chest, the regional response deviation is obtained; The reference power is differentially corrected based on the regional response deviation to obtain the back region correction power and the chest region correction power, and the back power correction amount and the chest power correction amount are obtained, wherein the back power correction amount and the chest power correction amount have opposite signs or different amplitudes. The semiconductor cooling chips in the back region and the chest region are controlled to operate according to the corrected power in the back region and the corrected power in the chest region, respectively, and the corrected power in the back region and the corrected power in the chest region are limited to the maximum power and minimum power limits corresponding to the cooling level.

9. The method of temperature regulation of a protective garment of claim 8, wherein, The step of obtaining the start-up time of the cooling fan based on the actual operating power of the semiconductor cooling component includes: The actual operating power of the semiconductor cooling components in the back and chest regions was monitored within a preset time period to obtain the back power fluctuation sequence and the chest power fluctuation sequence. The average heat generation per unit time in the back region and the chest region is calculated based on the back power fluctuation sequence and the chest power fluctuation sequence, respectively. Combined with their respective thermal resistance parameters, the heat accumulation rate in the back region and the heat accumulation rate in the chest region are obtained. The rate of change of heat accumulation rate in the back region and the rate of change of heat accumulation rate in the chest region were obtained respectively within the preset time period. Based on the heat accumulation rate and its rate of change in the back region, the heat accumulation rate and its rate of change in the chest region, and the preset heat dissipation activation threshold, the remaining time for the heat accumulation rate in the back region and the chest region to reach the heat dissipation activation threshold is obtained, and recorded as the remaining time for the back region and the remaining time for the chest region. The remaining time for the back is compared with the remaining time for the chest, and the side with the smaller remaining time is determined as the priority side to open. The safety lead time is determined based on the rate of change of thermal accumulation rate corresponding to the priority opening side. The start time of the cooling fan is obtained based on the difference between the remaining time corresponding to the priority start side and the safety lead time.

10. The method of temperature regulation of a protective garment of claim 8, wherein, The step of controlling the cooling fan to dissipate heat from the hot end of the semiconductor cooling component based on the startup time and the actual operating power includes: After the start-up time is reached, the thermal accumulation rate of the semiconductor cooling components in the back region and chest region is obtained respectively. The heat dissipation mode is determined based on the heat accumulation rate in the back region and the heat accumulation rate in the chest region. When both the heat accumulation rate in the back region and the heat accumulation rate in the chest region are greater than a preset heat dissipation threshold, the heat dissipation mode is a simultaneous heat dissipation mode. When the heat accumulation rate on at least one side is less than or equal to the preset heat dissipation threshold, the heat dissipation mode is an alternating heat dissipation mode. In the simultaneous heat dissipation mode, the cooling fan is turned on to simultaneously dissipate heat from the heat dissipation structures corresponding to the back and chest regions, and the heat accumulation rate of the back and chest regions is updated according to a preset update cycle. The speed of the cooling fan is adjusted according to the speed level corresponding to the larger updated heat accumulation rate. In the alternating heat dissipation mode, an initial heat dissipation priority area is determined based on the difference between the heat accumulation rate in the back region and the heat accumulation rate in the chest region, and the heat dissipation structure at the hot end corresponding to the initial heat dissipation priority area is used as the current heat dissipation target to control the cooling fan to enter the first heat dissipation stage. During the first heat dissipation phase, the heat accumulation rate of the back and chest areas is updated according to a preset monitoring cycle. When the heat accumulation rate corresponding to the current heat dissipation object drops below the preset switching threshold, the heat dissipation structure of the hot end corresponding to the other side area is determined as the new heat dissipation object, and the cooling fan is controlled to enter the next heat dissipation stage. When the heat accumulation rate in both the back and chest areas is less than the preset end threshold and continues for a preset duration, the heat dissipation control ends and the cooling fan is controlled to enter a low-speed operation state or stop running.

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