Plasma processing apparatus, power supply system and control method
By periodically modulating the high-frequency electrical power and frequency in the plasma processing device and adjusting the frequency using a feedback mechanism, the problem of high-frequency electrical power reflection was solved, thereby improving the efficiency and energy utilization of plasma processing.
CN122095748APending Publication Date: 2026-05-26TOKYO ELECTRON LTD
Patent Information
- Application Number
- CN202480069307.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-11-10
- Filing Date
- 2024-11-05
- Publication Date
- 2026-05-26
AI Technical Summary
Technical Problem
In existing technologies, high-frequency electrical power is easily reflected in plasma processing devices, leading to decreased efficiency and energy loss.
Method used
By introducing a power control unit into the plasma processing device, the power level and frequency of high-frequency electric power are periodically modulated, and the frequency is adjusted using a feedback mechanism to suppress the reflection of high-frequency electric power, including frequency adjustment during multiple sub-periods and feedback periods.
Benefits of technology
It effectively suppressed the reflection of high-frequency electrical power, improving the efficiency and energy utilization of plasma processing.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122095748A_ABST
Abstract
The power supply system of the plasma processing apparatus of the present invention includes a high-frequency power supply, a bias power supply, and a power control unit. The high-frequency power supply is capable of generating high-frequency electrical power for plasma generation. The bias power supply is capable of supplying electrical bias to the substrate support. The power control unit is capable of periodically modulating the power level of the high-frequency electrical power during repetitions of a modulation cycle comprising at least two sub-periods. The power control unit is capable of adjusting the frequency of the high-frequency electrical power used in the nth phase period within the modulation cycle included in the feedback period continuing from the start time of each of the at least two sub-periods, based on changes in the frequency of the high-frequency electrical power in the nth phase period during repetitions of the preceding modulation cycle and changes in the degree of reflection of the high-frequency electrical power.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Plasma processing apparatus, plasma processing method, and computer readable storage medium
JP2009246091A