A motor, a lens module, a camera module and an electronic device

Abstract

The application provides a motor, a lens module, a camera module and an electronic device, and belongs to the technical field of electronic devices. The motor comprises a driving chip, a first shape memory alloy coil and a first filter circuit. The first end of the first shape memory alloy coil is coupled to the first end of the driving chip through the first filter circuit, and the second end of the first shape memory alloy coil is coupled to the second end of the driving chip. The driving chip is used for controlling the first shape memory alloy coil to deform. The first filter circuit is used for inhibiting the transmission of noise signals output by the first end of the driving chip to the first shape memory alloy coil, so that the electromagnetic wave radiation caused by the transmission of the noise signals to the first shape memory alloy coil is improved or avoided, the influence of the noise signals on the radio frequency antenna is reduced, the sensitivity of the radio frequency antenna is ensured, and the communication effect and user experience are improved.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to a motor, a lens module, a camera module, and an electronic device. Background Technology

[0002] To improve the quality of images captured by electronic devices, camera modules can use motors (e.g., shape memory alloy (SMA) motors) to drive lens groups to move or rotate, thereby achieving autofocus and optical image stabilization (OIS), respectively. When the motor is operating, noise signals output by the drive chip are radiated through the SMA coils, affecting the communication performance and user experience of the electronic device. Summary of the Invention

[0003] This application provides a motor, lens module, camera module, and electronic device to reduce the noise signal output by the driver chip radiated through the shape memory alloy coil, thereby improving the communication effect and user experience of the electronic device.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, a motor is provided. The motor includes a driver chip, a first shape memory alloy coil, and a first filter circuit. A first end of the first shape memory alloy coil is coupled to a first end of the driver chip via the first filter circuit, and a second end of the first shape memory alloy coil is coupled to a second end of the driver chip. The driver chip is used to control the deformation of the first shape memory alloy coil.

[0006] The embodiments of this application use a first filtering circuit to suppress the transmission of noise signals output from the first terminal of the driver chip to the first shape memory alloy coil, thereby improving or even avoiding the generation of electromagnetic wave radiation caused by the transmission of noise signals to the first shape memory alloy coil, thereby reducing the impact of noise signals on the radio frequency antenna, ensuring the sensitivity of the radio frequency antenna, and improving communication performance and user experience.

[0007] In some possible implementations, the motor further includes a second filtering circuit, through which the second end of the first shape memory alloy coil is coupled to the second end of the driver chip. The second filtering circuit can suppress the transmission of noise signals output from the second end of the driver chip to the first shape memory alloy coil, thereby improving or even preventing the electromagnetic radiation generated by noise signals transmitted to the first shape memory alloy coil. This reduces the impact of noise signals on the radio frequency antenna, ensures the sensitivity of the radio frequency antenna, and improves communication performance and user experience.

[0008] In some possible implementations, the motor further includes a second shape memory alloy coil and a third filter circuit. The second end of the second shape memory alloy coil is coupled to the third end of the driver chip via the third filter circuit. The third filter circuit can suppress the transmission of noise signals output from the third end of the driver chip to the second shape memory alloy coil, thereby improving or even preventing the electromagnetic radiation generated by noise signals transmitted to the second shape memory alloy coil. This reduces the impact of noise signals on the radio frequency antenna, ensures the sensitivity of the radio frequency antenna, and improves communication performance and user experience.

[0009] In some possible implementations, the first end of the second shape memory alloy coil is coupled to the first end of the driver chip via a first filter circuit. The first filter circuit can also suppress the transmission of noise signals output from the first end of the driver chip to the second shape memory alloy coil, thereby improving or even avoiding the electromagnetic radiation generated by noise signals transmitted to the second shape memory alloy coil, thus reducing the impact of noise signals on the radio frequency antenna, ensuring the sensitivity of the radio frequency antenna, and improving communication performance and user experience.

[0010] In some possible implementations, the motor includes a first operating mode and a second operating mode. During the first operating mode, the driver chip can control the first and second shape memory alloy coils to deform synchronously, and a noise signal is output from a first terminal of the driver chip. During the second operating mode, the driver chip can control the first and second shape memory alloy coils to deform to different degrees, and a noise signal is output from a second terminal or a third terminal of the driver chip. The time periods of the first and second operating modes do not overlap.

[0011] In some possible implementations, the first filtering circuit can be a low-pass filter circuit, the passband of which can be lower than the frequency band of the radio frequency signal; the first filtering circuit can also be a band-stop filter circuit, the stopband of which can include the frequency band of the radio frequency signal; the first filtering circuit can also be a band-pass filter circuit, the passband of which can be lower than the frequency band of the radio frequency signal, thereby suppressing the transmission of noise signals within the frequency band of the radio frequency signal, reducing the electromagnetic radiation generated by the noise signal, and thus reducing the impact of the noise signal on the radio frequency antenna.

[0012] In some possible implementations, the first filter circuit can take various circuit forms. In some examples, the first filter circuit includes a first capacitor and a first inductor, which can form a series-connected, stop-current filter circuit. That is, the first terminal of the first capacitor is coupled to the first terminal of the first shape memory alloy coil and the first terminal of the driver chip, the second terminal of the first capacitor is coupled to the first terminal of the first inductor, and the second terminal of the first inductor is grounded. Alternatively, in some examples, the first filter circuit includes a second capacitor and a second inductor, which can form a parallel-connected, stop-current filter circuit. That is, the first terminal of the second capacitor and the first terminal of the second inductor are both coupled to the first terminal of the first shape memory alloy coil, and the second terminals of the second capacitor and the second inductor are both coupled to the first terminal of the driver chip. Alternatively, in some examples, the first filter circuit includes a third capacitor, the first terminal of which is coupled to the first terminal of the first shape memory alloy coil and the first terminal of the driver chip, and the second terminal of the third capacitor is grounded. Alternatively, in some examples, the first filter circuit includes a third inductor, a first end of which is coupled to a first end of a first shape memory alloy coil, and a second end of which is coupled to a first end of a driver chip.

[0013] Secondly, a lens module is provided. The lens module includes a lens assembly and the motor mentioned in the first aspect above, the motor being used to drive the lens assembly to move.

[0014] Thirdly, a camera module is provided. The camera module includes a camera housing, an image sensor, and the lens module mentioned in the second aspect above, with the image sensor and lens module disposed within the camera housing.

[0015] In some possible implementations, the camera module further includes a printed circuit board, and the lens module includes a motor. The image sensor, as well as the drive chip, first filter circuit, second filter circuit, and third filter circuit in the motor, are all disposed on the printed circuit board, and the first shape memory alloy coil and the second shape memory alloy coil in the motor are both connected to the printed circuit board.

[0016] Fourthly, an electronic device is provided. This electronic device includes a processor and the camera module described in the third aspect above, the processor being coupled to the camera module.

[0017] It should be understood that the technical effects of the second and fourth aspects can be referred to the technical effects of the first aspect and any of its embodiments, and will not be repeated here. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0019] Figure 2 This is a schematic diagram of a first structure of a motor provided in an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of a second structure of a motor provided in an embodiment of this application;

[0021] Figure 4 A schematic diagram of the first filter circuit suppressing noise signal transmission in the first operating mode of the motor provided in the embodiments of this application;

[0022] Figure 5 This is a schematic diagram of a third structure of a motor provided in an embodiment of this application;

[0023] Figure 6 This is a schematic diagram of the second and third filter circuits for suppressing noise signal transmission in the second operating mode of the motor provided in the embodiments of this application.

[0024] Reference numerals: 100, Electronic device; 110, Processor; 120, Communication module; 130, External memory interface; 140, Internal memory; 150, USB interface; 160, Power management module; 161, Battery; 162, Wireless charging coil; 170, Audio module; 180, Sensor module; 191, Button; 192, Indicator; 193, Camera module; 194, Display screen; 195, SIM card interface; 200, Motor; 210, Driver chip; 220, Shape memory alloy coil; 221, First shape memory alloy coil; 222, Second shape memory alloy coil; 230, First filter circuit; 240, Second filter circuit; 250, Third filter circuit. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0026] The terms "first" and "second" used in the embodiments of this application are only used to distinguish features of the same type and should not be construed as indicating relative importance, quantity, order, etc.

[0027] The terms "exemplary" or "for example" used in the embodiments of this application are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0028] The terms "coupling" and "connection" used in the embodiments of this application should be interpreted broadly. For example, they can refer to a physical direct connection or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0029] This application provides an electronic device, which can be fixed or mobile. Additionally, this electronic device may also be referred to as user equipment (UE), terminal, terminal device, mobile station (MS), mobile terminal (MT), access terminal device, vehicle-mounted terminal device, industrial control terminal device, mobile station, remote station, remote terminal device, mobile device, wireless communication device, terminal agent, or terminal device, etc. For example, the electronic device may be a mobile phone, tablet, desktop computer, laptop computer, all-in-one computer, vehicle terminal, virtual reality (VR) terminal device, augmented reality (AR) terminal device, wireless terminal in industrial control, wireless terminal in self-driving, wireless terminal in remote medical surgery, wireless terminal in smart grid, wireless terminal in transportation safety, wireless terminal in smart city, wireless terminal in smart home, cellular phone, cordless phone, session initiation protocol (SIP) phone, wireless local loop (WLL) station, personal digital assistant (PDA), handheld device with wireless communication capabilities, computing device or other processing device connected to a wireless modem, wearable device, terminal device in future mobile communication networks, or terminal device in future evolved public land mobile network (PLMN), etc.

[0030] Taking mobile phones as an example, Figure 1This diagram illustrates a possible structure for an electronic device. The electronic device 100 may include a processor 110, an external memory interface 130, an internal memory 140, a universal serial bus (USB) interface (hereinafter referred to as USB interface 150), a power management module 160, a battery 161, a wireless charging coil 162, a communication module 120, an audio module 170, a sensor module 180, buttons 191, an indicator 192, a camera module 193, a display screen 194, and a subscriber identification module (SIM) card interface (hereinafter referred to as SIM card interface 195), etc.

[0031] The sensor module 180 may include pressure sensors, gyroscope sensors, barometric pressure sensors, magnetic sensors, accelerometers, distance sensors, proximity sensors, fingerprint sensors, temperature sensors, touch sensors, ambient light sensors, bone conduction sensors, etc.

[0032] It is understood that the interface connection relationships between the modules illustrated in the embodiments of this application are merely illustrative and do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0033] In some examples, processor 110 may include one or more processing units; wherein, processing units may include field-programmable gate arrays (FPGAs), central processing units (CPUs), application processors (APs), network processors (NPs), digital signal processors (DSPs), microcontroller units (MCUs), programmable logic devices (PLDs), graphics processing units (GPUs), image signal processors (ISPs), controllers, video codecs, baseband processors, and neural-network processing units (NPUs), etc. In some examples, different processing units may be independent devices; for example, processor 110 may be a baseband processor. In some examples, processor 110 may also be a system-on-a-chip (SoC) integrating multiple processing units.

[0034] The processor 110 may also include a memory for storing computer instructions and data. In some embodiments, the memory in the processor 110 is a cache. This memory can store computer instructions or data that the processor 110 has just used or that are used repeatedly. If the processor 110 needs to use the same computer instructions or data again, it can retrieve them directly from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0035] The external storage interface 130 can be used to connect an external memory card, such as a micro SanDisk (Micro SD) card, to expand the storage capacity of the electronic device 100. The external memory card communicates with the processor 110 through the external storage interface 130 to perform data storage functions. For example, music, video, and other files can be saved on the external memory card.

[0036] Internal memory 140 can be used to store computer executable program code, which includes computer instructions. Processor 110 executes various functional applications and data processing of electronic device 100 by running the computer instructions stored in internal memory 140. In addition, internal memory 140 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, universal flash storage (UFS), etc.

[0037] The memory involved in the embodiments of this application can be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. The non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory can be random access memory (RAM), which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct memory bus RAM (DR RAM). It should be noted that the memory used in the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0038] The audio module 170 may include a speaker, receiver, microphone, and headphone jack. The electronic device 100 can implement audio functions, such as music playback and recording, through the audio module 170 and processor 110.

[0039] Audio module 170 is used to convert digital audio information into analog audio signal output, and also to convert analog audio input into digital audio signal. In some embodiments, audio module 170 may be located in processor 110, or some functional modules of audio module 170 may be located in processor 110. A speaker, also called a "loudspeaker," is used to convert audio electrical signals into sound signals. A receiver, also called a "handpiece," is used to convert audio electrical signals into sound signals. A microphone, also called a "microphone" or "voice transducer," is used to convert sound signals into electrical signals. Electronic device 100 may be equipped with at least one microphone. A headphone jack is used to connect wired headphones. The headphone jack may be a USB interface 150, or a 3.5mm Open Mobile Terminal Platform (OMTP) standard interface, or a Cellular Telecommunications Industry Association of the USA (CTIA) standard interface.

[0040] Buttons 191 include a power button, volume buttons, etc. Buttons 191 can be mechanical buttons or touch buttons. Electronic device 100 can receive input from buttons 191 and generate key signal inputs related to user settings and function control of electronic device 100. Indicator 192 can be an indicator light, used to indicate charging status, battery level changes, messages, missed calls, notifications, etc. SIM card interface 195 is used to connect a SIM card. The SIM card can be inserted into or removed from the SIM card interface 195 to achieve contact and separation with electronic device 100. Electronic device 100 can support one or N SIM card interfaces 195, where N is a positive integer greater than 1. SIM card interface 195 can support Nano SIM cards, Micro SIM cards, SIM cards, etc. In some embodiments, electronic device 100 uses an embedded SIM (eSIM) card, which can be embedded in electronic device 100 and cannot be separated from it.

[0041] Electronic device 100 can implement display functions through a GPU, a display screen 194, and a processor 110. The GPU is a microprocessor 110 for image processing, connected to the display screen 194 and the processor 110. The GPU is used to perform mathematical and geometric calculations and for graphics rendering. The processor 110 may include one or more GPUs, which execute computer instructions to generate or modify display information.

[0042] Display screen 194 is used to display images, videos, etc. Display screen 194 includes a display panel. In some embodiments, electronic device 100 may include one or more displays screens 194. In other embodiments, the touch screen in display screen 194 may be a foldable screen.

[0043] Battery 161 may include one or more cells, and multiple cells may be connected in series, parallel or other ways to supply power to the load.

[0044] The power management module 160 receives charging input from a charger. The charger can be a wireless charger, such as a wireless charging dock or other electronic devices with reverse wireless charging capabilities. The power management module 160 can receive wireless charging input via the wireless charging coil 162 of the electronic device 100. The charger can also be a wired charger; for example, the power management module 160 can receive charging input from a wired charger via a USB interface 150.

[0045] The processor 110 is coupled to the communication module 120 to realize the 2G / 3G / 4G / 5G mobile communication and wireless communication functions of the electronic device 100. The wireless communication may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Wireless Local Area Networks (WLAN), Bluetooth (BT), Global Navigation Satellite System (GNSS), Frequency Modulation (FM), Infrared (IR), Near Field Communication (NFC), etc.

[0046] The electronic device 100 can perform shooting functions through an ISP, a camera module 193, a video codec, a GPU, a display screen 194, and a processor 110. The ISP is used to process the data fed back by the camera module 193. In some embodiments, the ISP can be located in the camera module 193. The camera module 193 is used to capture still images or videos. In some embodiments, the electronic device 100 may include one or N camera modules 193, where N is a positive integer greater than 1.

[0047] This application also provides a camera module, which may include a camera housing, an image sensor, and a lens module, both of which are housed within the camera module housing. An image sensor is a device that converts light signals into electronic signals, allowing external light to be focused onto the photosensitive surface of the image sensor via the lens module. Specifically, the lens module may include one or more transparent optical lenses (i.e., a lens group). The refraction of the lens group alters the path of light from the outside world, ensuring that the light is ultimately focused onto the photosensitive surface of the image sensor. The photosensitive element on the photosensitive surface of the image sensor collects and records information such as the light intensity, thereby forming an image.

[0048] When shooting handheld, for example, the camera module may shake due to unstable hand grip, causing the lens module inside the camera module to shake as well, resulting in image jitter. To address this, this application also provides a lens module including a motor and a lens assembly. When the lens module shakes, the motor can drive the lens assembly to move in the opposite direction to the shaking of the electronic device, thereby counteracting the image shift and jitter caused by the shaking, achieving optical image stabilization.

[0049] like Figure 2 As shown, in some embodiments, the motor 200 may include a driver chip 210 and a shape memory alloy coil 220, with the shape memory alloy coil 220 coupled to the driver chip 210. When the driver chip 210 inputs an electrical signal to the shape memory alloy coil 220, the temperature changes compared to the state without an electrical signal, and the length of the shape memory alloy coil 220 changes accordingly, thereby driving the lens assembly to move. For example, some shape memory alloy coils 220 may be shorter when energized than when not energized; that is, the shape memory alloy coil 220 may be in a contracted state when energized. In some embodiments, the camera module 193 may also include a printed circuit board, and the image sensor and the driver chip 210 in the motor 200 may be disposed on the printed circuit board, with the shape memory alloy coil 220 in the motor 200 connected to the printed circuit board.

[0050] In some implementations, the driver chip 210 can input a pulse width modulation (PWM) signal to the shape memory alloy coil 220 by controlling the on and off states of its internal transistors. Since the PWM signal is a high-frequency pulse signal, the transistors need to switch frequently between on and off, resulting in higher-frequency (higher frequency than the PWM signal) noise signals. In scenarios where the isolation between the motor 200 and the RF antenna is low, the electromagnetic radiation generated by the noise signal through the shape memory alloy coil 220 can affect the RF antenna, reducing its sensitivity and impacting communication performance and user experience.

[0051] like Figure 3 As shown, this application provides a motor 200, which includes a driver chip 210, a first shape memory alloy coil 221, a second shape memory alloy coil 222, and a first filter circuit 230. The first ends of the first shape memory alloy coil 221 and the second shape memory alloy coil 222 are both coupled to the first pin 1 of the driver chip 210 via the first filter circuit 230. The second end of the first shape memory alloy coil 221 is coupled to the second pin 2 of the driver chip 210, and the second end of the second shape memory alloy coil 222 is coupled to the third pin 3 of the driver chip 210. In some embodiments, the first filter circuit 230 is a low-pass filter circuit, a band-stop filter circuit, or a band-pass filter circuit.

[0052] Please continue to refer to Figure 3 The fourth pin 4 of the driver chip 210 is used to input the power supply voltage VDD, and the fifth pin 5 of the driver chip 210 is used to ground GND. During the first operating mode of the motor 200, the driver chip 210 controls the internal transistors to make the relationship between the second pin 2 and the fifth pin 5, and between the third pin 3 and the fifth pin 5, low resistance or on; and to make the relationship between the first pin 1 and the fourth pin 4 switch frequently between on and off states, so that the driver chip 210 can control the first shape memory alloy coil 221 and the second shape memory alloy coil 222 to deform synchronously. At this time, the noise signal generated by the switching of the transistor connected to the first pin 1 inside the driver chip 210 will be output from the first pin 1.

[0053] like Figure 4As shown, the embodiment of this application uses a first filter circuit 230 to suppress the transmission of noise signals output from the first pin 1 of the driver chip 210 to the first shape memory alloy coil 221 and the second shape memory alloy coil 222. This improves or even avoids the generation of electromagnetic wave radiation caused by noise signals transmitted to the first shape memory alloy coil 221 and the second shape memory alloy coil 222, thereby reducing the impact of noise signals on the radio frequency antenna, ensuring the sensitivity of the radio frequency antenna, and improving communication performance and user experience. Please continue to refer to... Figure 4 In some examples, the first filter circuit 230 may include a first capacitor C1 and a first inductor L1, which can form a series-connected band-stop filter circuit. That is, the first terminal of the first capacitor C1 is coupled to the first terminal of the first shape memory alloy coil 221 and the first terminal pin1 of the driver chip 210, the second terminal of the first capacitor C1 is coupled to the first terminal of the first inductor L1, and the second terminal of the first inductor L1 is grounded. Figure 4 The circuit structure of the first filter circuit 230 shown can transmit noise signals with frequencies higher than the PWM signal to ground, thereby suppressing the transmission of noise signals output from the first pin 1 of the driver chip 210 to the first shape memory alloy coil 221 and the second shape memory alloy coil 222.

[0054] like Figure 5 As shown, in some embodiments, the motor 200 further includes a second filter circuit 240 and a third filter circuit 250. The second end of the first shape memory alloy coil 221 is coupled to the second pin 2 of the driver chip 210 through the second filter circuit 240, and the second end of the second shape memory alloy coil 222 is coupled to the third pin 3 of the driver chip 210 through the third filter circuit 250. In some embodiments, both the second filter circuit 240 and the third filter circuit 250 are low-pass filters, band-stop filters, or band-pass filters.

[0055] Please continue to refer to Figure 5During the second operating mode of the motor 200, the driver chip 210 controls the internal transistors to maintain a low-resistance or on state between the first pin 1 and the fourth pin 4; and to frequently switch between on and off states between the second pin 2 and the fifth pin 5, and / or between the third pin 3 and the fifth pin 5. The time period of the second operating mode does not overlap with the time period of the first operating mode. At this time, the noise signal generated by the switching of the transistor connected to the second pin 2 inside the driver chip 210 will be output from the second pin 2, and the noise signal generated by the switching of the transistor connected to the third pin 3 inside the driver chip 210 will also be output from the second pin 2. In some embodiments, the switching frequency between the second pin 2 and the fifth pin 5 can be different from the switching frequency between the third pin 3 and the fifth pin 5, so that the driver chip 210 can control the first shape memory alloy coil 221 and the second shape memory alloy coil 222 to undergo different degrees of deformation.

[0056] like Figure 6 As shown, in this embodiment, the second filter circuit 240 suppresses the transmission of noise signals output from the second pin 2 of the driver chip 210 to the first shape memory alloy coil 221, and the third filter circuit 250 suppresses the transmission of noise signals output from the third pin 3 of the driver chip 210 to the second shape memory alloy coil 222. This improves or even avoids the transmission of noise signals to the first shape memory alloy coil 221 and the second shape memory alloy coil 222, thereby reducing the impact of noise signals on the radio frequency antenna, ensuring the sensitivity of the radio frequency antenna, and improving communication performance and user experience.

[0057] Please continue to refer to Figure 6 In some examples, the second filter circuit 240 may include a second capacitor C2 and a second inductor L2, which can form a band-stop filter circuit with an inductor and capacitor connected in parallel. That is, the first terminal of the second capacitor C2 and the first terminal of the second inductor L2 are both coupled to the second terminal of the first shape memory alloy coil 221, and the second terminal of the second capacitor C2 and the second terminal of the second inductor L2 are both coupled to the second terminal pin2 of the driver chip 210. Figure 6 In the circuit structure of the second filter circuit 240 shown, the inductor branch causes the signal phase of the noise signal to lag, and the capacitor branch causes the signal phase of the noise signal to lead. Finally, at the coupling point between the second filter circuit 240 and the first shape memory alloy coil 221, the noise signal is canceled, thereby suppressing the transmission of the noise signal output from the second pin 2 of the driver chip 210 to the first shape memory alloy coil 221.

[0058] Please continue to refer to Figure 6 In some examples, the third filter circuit 250 may include a third capacitor C3, the first end of which is coupled to the second end of the second shape memory alloy coil 222 and the third end pin3 of the driver chip 210, respectively, and the second end of the third capacitor C3 is grounded. Figure 6 The circuit structure of the third filter circuit 250 shown can transmit noise signals with frequencies higher than the PWM signal to ground, thereby suppressing the transmission of noise signals output from the third pin 3 of the driver chip 210 to the second shape memory alloy coil 222.

[0059] It should be understood that the first filter circuit 230, the second filter circuit 240, and the third filter circuit 250 can each have multiple circuit structures. For example, the first filter circuit 230 can also be the circuit structure of the second filter circuit 240 or the third filter circuit 250 in section 6. The second filter circuit 240 can also be... Figure 4 The circuit structure of the first filter circuit 230, or Figure 6 The circuit structure of the third filter circuit 250. The third filter circuit 250 can also be... Figure 4 The circuit structure of the first filter circuit 230, or Figure 6 The circuit structure of the second filter circuit 240.

[0060] In addition, the first filter circuit 230, the second filter circuit 240 and the third filter circuit 250 may also adopt other circuit structures not shown; for example, the first filter circuit 230 includes a third inductor (not shown), the first end of the third inductor is coupled to the first end of the first shape memory alloy coil 221, and the second end of the third inductor is coupled to the first end of the driver chip 210. This application does not impose any restrictions on the specific circuit structures adopted by the first filter circuit 230, the second filter circuit 240 and the third filter circuit 250.

[0061] In this embodiment, the filtering circuit can suppress the transmission of noise signals output by the driver chip 210 to the shape memory alloy coil 220, thereby improving or even avoiding the transmission of noise signals to the shape memory alloy coil 220 and generating electromagnetic wave radiation, thereby reducing the impact of noise signals on the radio frequency antenna, ensuring the sensitivity of the radio frequency antenna, and improving communication performance and user experience.

[0062] In the several embodiments provided in this application, it should be understood that the disclosed motor, lens module, camera module, and electronic device can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual coupling or direct coupling or communication connection may be through some interfaces; the indirect coupling or communication connection between devices or modules may be electrical, mechanical, or other forms.

[0063] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A motor, characterized in that, It includes a driver chip, a first shape memory alloy coil, and a first filter circuit; wherein, The first end of the first shape memory alloy coil is coupled to the first end of the driving chip through the first filter circuit, and the second end of the first shape memory alloy coil is coupled to the second end of the driving chip. The driving chip is used to control the deformation of the first shape memory alloy coil.

2. The motor according to claim 1, characterized in that, The motor also includes a second filter circuit, and the second end of the first shape memory alloy coil is coupled to the second end of the driver chip through the second filter circuit.

3. The motor according to claim 1 or 2, characterized in that, The motor also includes a second shape memory alloy coil and a third filter circuit, wherein the second end of the second shape memory alloy coil is coupled to the third end of the driver chip through the third filter circuit.

4. The motor according to claim 3, characterized in that, The first end of the second shape memory alloy coil is coupled to the first end of the driver chip through the first filter circuit.

5. The motor according to any one of claims 1-4, characterized in that, The motor includes a first operating mode and a second operating mode; During the first operating mode, the first terminal of the driver chip outputs a noise signal; during the second operating mode, the second terminal or the third terminal of the driver chip outputs a noise signal. The time periods of the first working mode do not overlap with the time periods of the second working mode.

6. The motor according to any one of claims 1-5, characterized in that, The first filtering circuit is a low-pass filter circuit, a band-stop filter circuit, or a band-pass filter circuit.

7. The motor according to claim 6, characterized in that, The first filter circuit includes a first capacitor and a first inductor. The first end of the first capacitor is coupled to the first end of the first shape memory alloy coil and the first end of the driving chip. The second end of the first capacitor is coupled to the first end of the first inductor. The second end of the first inductor is grounded. or, The first filter circuit includes a second capacitor and a second inductor. The first end of the second capacitor and the first end of the second inductor are both coupled to the first end of the first shape memory alloy coil, and the second end of the second capacitor and the second end of the second inductor are both coupled to the first end of the driver chip. or, The first filter circuit includes a third capacitor, the first end of which is coupled to the first end of the first shape memory alloy coil and the first end of the driving chip, and the second end of the third capacitor is grounded. or, The first filter circuit includes a third inductor, the first end of which is coupled to the first end of the first shape memory alloy coil, and the second end of which is coupled to the first end of the driver chip.

8. A lens module, characterized in that, It includes a lens assembly and a motor as described in any one of claims 1-7, the motor being used to drive the lens assembly to move.

9. A camera module, characterized in that, It includes a camera housing, an image sensor, and a lens module as described in claim 8, wherein the image sensor and the lens module are disposed within the camera housing.

10. The camera module according to claim 9, characterized in that, It also includes a printed circuit board, and the lens module includes a motor; the image sensor and the driving chip, first filter circuit, second filter circuit and third filter circuit in the motor are all disposed on the printed circuit board, and the first shape memory alloy coil and the second shape memory alloy coil in the motor are both connected to the printed circuit board.

11. An electronic device, characterized in that, It includes a processor and the camera module as described in claim 9 or 10, wherein the processor is coupled to the camera module.

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