A lead bismuth high heat flux heat transfer device with rough elements arranged in a rectangular channel

Abstract

This invention discloses a lead-bismuth high-heat transfer heat transfer device with rough elements arranged in a rectangular channel in the field of nuclear reaction heat transfer. From the desert side to the oasis side, it includes: a heating component with a rectangular flow channel structure inside, allowing liquid lead-bismuth alloy to pass through and heating the liquid lead-bismuth alloy inside; rough elements are arranged in the rectangular flow channel structure to simulate the actual flow channel environment; a feeding component connected to the feeding end of the heating component; and a discharging component connected to the discharging end of the heating component. The beneficial effects of this invention are: by setting rough elements on the inner wall of the flow channel plate to simulate the flow channel environment where liquid lead-bismuth alloy causes erosion and corrosion in the actual environment, the influence of flow channel roughness on the flow heat transfer characteristics of lead-bismuth alloy can be more accurately assessed. Furthermore, the modular design makes component replacement faster and the experimental efficiency higher.

Description

Technical Field

[0001] This invention relates to the field of nuclear reaction heat transfer, and specifically to a lead-bismuth high heat transfer heat transfer device with roughness elements arranged in a rectangular channel. Background Technology

[0002] Fast breeder reactors using liquid lead-bismuth as a coolant are the preferred reactor type for fourth-generation advanced nuclear energy systems. Their fuel assemblies face extremely high local surface heat flux densities (typically reaching the MW / m² level) during operation. Ensuring the integrity and temperature controllability of the fuel cladding under these extreme conditions is central to reactor safety design. Improving the heat transfer capacity on the coolant side is a key approach to reducing wall temperature and expanding safety margins. Furthermore, in lead-bismuth fast reactors, the fuel cladding and other structural materials are constantly exposed to high-temperature, high-speed flowing liquid lead-bismuth alloy. The scouring and corrosive effects of liquid lead-bismuth create rough walls, significantly affecting the flow and heat transfer characteristics within the flow channels.

[0003] Current experimental studies on the flow and heat transfer of liquid lead-bismuth alloys mostly use rectangular flow channels with smooth inner walls, which cannot assess the influence of rough surfaces on the heat transfer and flow characteristics of liquid lead-bismuth.

[0004] To address this, we propose a lead-bismuth high-heat transfer heat transfer device with roughness elements arranged in a rectangular channel. Summary of the Invention

[0005] To address the aforementioned shortcomings of the prior art, the present invention provides a lead-bismuth high heat transfer heat exchange device with roughness elements arranged in a rectangular channel.

[0006] To achieve the above-mentioned objectives, the technical solution adopted by this invention is as follows: A high-heat transfer heat exchange device for lead-bismuth alloy with roughness elements arranged in a rectangular channel includes: a heating component with a rectangular flow channel structure inside for passing through and heating the liquid lead-bismuth alloy inside; the rectangular flow channel structure has roughness elements arranged inside to simulate the actual flow channel environment; a feeding component connected to the feeding end of the heating component; and a discharging component connected to the discharging end of the heating component.

[0007] By setting rough elements on the inner wall of the rectangular flow channel structure of the heating component, the originally smooth flow channel wall becomes rough, which is more in line with the flow channel environment in which liquid lead-bismuth alloy causes erosion and corrosion to the flow channel wall. This allows for a more accurate study of the flow and heat transfer characteristics of liquid lead-bismuth alloy in the flow channel. Furthermore, the rough elements can significantly reduce the temperature of the flow channel wall. This means that under the same coolant temperature and flow rate, the device of this application can withstand a higher heat flux density without overheating, thereby improving the ability of the experimental device to simulate more extreme working conditions.

[0008] Further defining the heating assembly, it includes a flow channel plate, an insulating plate, a heating plate, a heat insulation plate, a heat-resistant shell, and a heating copper busbar. The flow channel plate includes an upper flow channel plate and a lower flow channel plate, both with U-shaped cross-sections and openings that interlock to form a rectangular flow channel structure. Roughness elements are provided on the inner walls of the upper and lower flow channel plates. The insulating plate is attached to the outer walls of the lower and upper flow channel plates. The heating plate is attached to the insulating plate. The heat insulation plate includes an upper and a lower heat insulation plate, with recessed features on their opposing surfaces. The first mounting groove mates with the overall outline of the flow channel plate, the insulation plate, and the heating plate. The upper and lower heat insulation plates cover the heating plate. The heat-resistant shell includes an upper heat-resistant shell and a lower heat-resistant shell. The opposite surfaces of the upper and lower heat-resistant shells are recessed with a second mounting groove that mates with the outline of the heat insulation plate. The heat insulation plate is fixedly installed in the second mounting groove. The upper and lower heat-resistant shells are tightened and fixed by fixing bolts on both sides of the second mounting groove. The heating copper busbar is horizontally inserted into the upper and lower heat-resistant shells and is in thermal contact with the heating plate.

[0009] This heating assembly setup uses an energized copper busbar to heat the heating plate, which then transfers heat to the flow channel plate via an insulating plate, thus heating the flow channel plate. Furthermore, this more modular design facilitates component replacement for repeated experiments, improving experimental efficiency.

[0010] Further specified, the left and right side walls at both ends of the length direction of the heat-resistant upper shell and the heat-resistant lower shell are provided with insertion slots. The heating copper busbars are inserted into the heat-resistant shell from the insertion slots on both sides, and the internal ends are recessed with steps. The heating copper busbars and the insertion slots are tightly fitted. The steps of the heating copper busbars on the left and right sides are opened in opposite directions. The internal end of the heating copper busbar is recessed with a third mounting slot. The length of the heat insulation plate matches the spacing between the two heating copper busbars on the same side. The heating plates on the upper and lower sides are respectively embedded in the third mounting slots of the left and right heating copper busbars. The heating copper busbars are provided with through holes for fixing bolts to pass through.

[0011] This design of the heating copper busbars eliminates the need to integrate the left and right sides into a single unit, making the assembly and disassembly of the heating copper busbars much easier.

[0012] Further defining the rough element, it includes several rough columns, which are cylindrical and arranged in a rectangular array on the inner walls of the upper and lower plates of the flow channel. Due to their aggregate symmetry, the cylindrical rough columns can generate stable and periodically shedding vortices behind the flow direction. This regular vortex disturbance can more effectively destroy the thermal boundary layer, enhance the mass and energy exchange between the fluid bulk and the near-wall region, and its flow resistance characteristics are relatively easier to predict and control.

[0013] Further defining the rough element, it includes several rough grooves, which are V-shaped grooves arranged in a rectangular array on the inner walls of the upper and lower plates of the flow channel. By setting the rough element in the shape of a rough groove and distributing it in a rectangular array, the rough groove can guide the flow to generate stable longitudinal vortices, entraining the cold fluid in the center of gravity region to the near-wall region, while carrying the hot fluid away from the wall surface, which can significantly enhance lateral mixing and heat transfer.

[0014] Further defining the rough element, it includes several rough blocks, which are semi-elliptical in shape and arranged in a plum blossom pattern on the inner walls of the upper and lower plates of the flow channel. This arrangement of rough blocks can generate stable vortices and smoothly detach with the flow, forming periodic disturbances. At the same time, due to the streamlined profile, the pressure drop is smaller.

[0015] Furthermore, both ends of the flow channel plate extend out of the heat-resistant shell and are fixedly installed in the flow channels of the feeding assembly and the discharging assembly, respectively.

[0016] The beneficial effects of this invention are as follows: by setting rough elements on the inner wall of the flow channel plate to simulate the flow channel environment in which liquid lead-bismuth alloy causes erosion and corrosion in the actual environment, the influence of the roughness of the flow channel on the flow and heat transfer characteristics of the lead-bismuth alloy can be more accurately assessed. Furthermore, the modular design makes component replacement faster and the experimental efficiency higher. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the cross-section of the heating section at the heating copper busbar; Figure 3 for Figure 2 An enlarged schematic diagram of part A in the middle; Figure 4 This is a schematic diagram of the cross-section of the heating section in the middle section; Figure 5 This is a schematic diagram of the rough element in Example 1; Figure 6 This is a schematic diagram of the rough element in Example 2; Figure 7 This is a rough element diagram of Example 3.

[0018] The symbols for each component are as follows: Heating assembly 1, flow channel plate 11, roughened column 111, roughened groove 112, roughened block 113, insulating plate 12, heating plate 13, heat insulation plate 14, first mounting groove 141, heat resistant shell 15, second mounting groove 151, heating copper busbar 16, third mounting groove 161, fixing bolt 17, feeding assembly 2, discharging assembly 3. Detailed Implementation

[0019] The specific embodiments of the present invention are described below to enable those skilled in the art to understand the present invention. However, it should be understood that the present invention is not limited to the scope of the specific embodiments. For those skilled in the art, various changes are obvious as long as they are within the spirit and scope of the present invention as defined and determined by the appended claims. All inventions utilizing the concept of the present invention are protected.

[0020] Example 1: like Figures 1-5 As shown, a high-heat transfer heat exchange device for lead-bismuth with rough elements arranged in a rectangular channel includes a heating component 1, a feeding component 2, and a discharging component 3. The heating component 1 has a rectangular flow channel structure inside, through which liquid lead-bismuth alloy passes and is heated. Rough elements are arranged inside the rectangular flow channel structure to simulate the actual flow channel environment. The heating component 1 includes a flow channel plate 11, an insulating plate 12, a heating plate 13, a heat insulation plate 14, a heat-resistant shell 15, and a heating copper busbar 16. The flow channel plate 11 includes an upper flow channel plate and a lower flow channel plate. The cross-section of the upper flow channel plate and the lower flow channel plate is U-shaped, and the openings are interlocked to form a rectangular flow channel structure. Rough elements are arranged on the inner walls of the upper flow channel plate and the lower flow channel plate. The rough elements include several rough columns 111. The rough columns 111 are cylindrical and arranged in a rectangular array on the inner walls of the upper flow channel plate and the lower flow channel plate. The rough columns 111 have a height of 0.2 mm and a diameter of 0 mm. The insulation plate 12 is attached to the outer wall of the lower and upper flow channels, and the heating plate 13 is attached to the insulation plate 12. The heat insulation plate 14 includes an upper heat insulation plate and a lower heat insulation plate. The opposite surfaces of the upper and lower heat insulation plates are recessed with a first mounting groove 141 that matches the overall outline of the flow channel plate 11, the insulation plate 12, and the heating plate 13. The upper and lower heat insulation plates cover the heating plate 13. The heat-resistant shell 15 includes a heat-resistant upper shell and a heat-resistant lower shell. The opposite surfaces of the heat-resistant upper shell and the heat-resistant lower shell are recessed with a second mounting groove 151 that matches the outline of the heat insulation plate 14. The heat insulation plate 14 is fixedly installed in the second mounting groove 151. The heat-resistant upper shell and the heat-resistant lower shell are tightened and fixed by fixing bolts 17 on both sides of the second mounting groove 151. The heating copper busbar 16 is horizontally inserted into the heat-resistant upper shell and the heat-resistant lower shell and is in thermal contact with the heating plate 13. Insertion slots are provided on the left and right side walls at both ends of the heat-resistant upper shell and the heat-resistant lower shell along their length. Heating copper busbars 16 are inserted into the heat-resistant shell 15 from the insertion slots on both sides, and the inner ends are recessed with steps. The heating copper busbars 16 and the insertion slots are tightly fitted. The steps of the heating copper busbars 16 on the left and right sides are opened in opposite directions. The inner end of the heating copper busbar 16 is recessed with a third mounting groove 161. The length of the heat insulation plate 14 matches the spacing between the two heating copper busbars 16 on the same side. The heating plates 13 on the upper and lower sides are respectively embedded in the third mounting grooves 161 of the left and right heating copper busbars 16. The heating copper busbars 16 are provided with through holes for the fixing bolts 17 to pass through. The two ends of the flow channel plate 11 extend out of the heat-resistant shell 15 and are respectively fixed in the flow channels of the feeding assembly 2 and the discharging assembly 3.

[0021] By setting rough elements on the inner wall of the rectangular flow channel structure of heating component 1, the originally smooth flow channel wall becomes rough, which better matches the flow channel environment where liquid lead-bismuth alloy causes erosion and corrosion to the flow channel wall. This allows for more accurate study of the flow and heat transfer characteristics of liquid lead-bismuth alloy in the flow channel. Furthermore, the rough elements can significantly reduce the temperature of the flow channel wall. This means that under the same coolant temperature and flow rate, the device of this application can withstand higher heat flux density without overheating, thereby improving the ability of the experimental device to simulate more extreme working conditions. With this configuration of heating component 1, the heating plate 13 is heated by energizing the heating copper busbar 16. The heating plate 13 then transfers heat through the insulating... The edge plate 12 transmits heat to the flow channel plate 11, thereby achieving the heating of the flow channel plate 11. This more modular design makes it easier to replace components for multiple experiments, improving experimental efficiency. This design of the heating copper busbar 16 eliminates the need to set the left and right heating copper busbars 16 as a whole, making the assembly and disassembly of the heating copper busbar 16 more convenient. Due to its aggregate symmetry, the cylindrical rough column 111 can generate stable and periodically falling vortices behind its flow direction. This regular vortex disturbance can more effectively destroy the thermal boundary layer, enhance the mass and energy exchange between the fluid bulk and the near-wall region, and its flow resistance characteristics are relatively easier to predict and control.

[0022] Example 2: like Figures 1-4 and Figure 6 As shown, the difference between Embodiment 2 and Embodiment 1 is that the rough element includes several rough grooves 112. The rough grooves 112 are V-shaped grooves arranged in a rectangular array on the inner wall of the upper plate and the lower plate of the flow channel. The groove depth of the rough groove 112 is 0.2 mm, the groove width is 0.5 mm, the center distance between adjacent groove ridges is 6 mm, and the V-shaped opening angle of the rough groove 112 is 60°.

[0023] By setting the rough elements into rough grooves 112 and distributing them in a rectangular array, the rough grooves 112 can guide the flow to generate stable longitudinal vortices, entraining the cold fluid in the center of gravity region to the near-wall region, while carrying the hot fluid away from the wall surface, which can significantly enhance lateral mixing and heat transfer.

[0024] Example 3: like Figures 1-4 and Figure 7 As shown, the difference between Embodiment 3 and Embodiment 1 is that the rough element includes several rough blocks 113. The rough blocks 113 are semi-elliptical in shape and arranged in a plum blossom pattern on the inner wall of the upper plate and the lower plate of the flow channel. The protrusion of the rough block 113 is 0.15 mm high, the major axis of the ellipse is 1 mm, the minor axis is 0.6 mm, the spacing between adjacent rough blocks is 6 mm, and the direction of the major axis of the rough block 113 is the direction of fluid flow.

[0025] This arrangement of the rough block 113 can generate stable vortices, which smoothly detach with the flow, forming periodic disturbances. At the same time, due to its streamlined profile, the resulting pressure drop is smaller.

Claims

1. A lead-bismuth high-temperature heat transfer device with roughness elements arranged in a rectangular channel, characterized in that, include: Heating component (1) has a rectangular flow channel structure inside, through which liquid lead-bismuth alloy passes and heats the liquid lead-bismuth alloy inside. Rough elements are provided inside the rectangular flow channel structure to simulate the actual flow channel environment. Feeding assembly (2) is connected to the feeding end of the heating assembly (1); The discharge assembly (3) is connected to the discharge end of the heating assembly (1).

2. The lead-bismuth high-temperature heat transfer device with roughness elements arranged in a rectangular channel according to claim 1, characterized in that, The heating assembly (1) includes a flow channel plate (11), an insulating plate (12), a heating plate (13), a heat insulation plate (14), a heat-resistant shell (15), and a heating copper busbar (16). The flow channel plate (11) includes an upper flow channel plate and a lower flow channel plate. The cross-sections of the upper flow channel plate and the lower flow channel plate are both U-shaped, and their openings are interlocked to form a rectangular flow channel structure. The roughness element is disposed on the inner wall of the upper flow channel plate and the lower flow channel plate. The insulating plate (12) is attached to the outer wall of the lower flow channel plate and the upper flow channel plate. The heating plate (13) is attached to the insulating plate (12). The heat insulation plate (14) includes a heat insulation upper plate and a heat insulation lower plate. The opposing surfaces of the heat insulation upper plate and the heat insulation lower plate are recessed with a groove corresponding to the flow channel plate (11). The insulation plate (12) and the heating plate (13) are fitted with a first mounting groove (141). The upper and lower heat insulation plates cover the heating plate (13) respectively. The heat-resistant shell (15) includes a heat-resistant upper shell and a heat-resistant lower shell. The opposite surfaces of the heat-resistant upper shell and the heat-resistant lower shell are recessed with a second mounting groove (151) that fits the outline of the insulation plate (14). The insulation plate (14) is fixedly installed in the second mounting groove (151). The heat-resistant upper shell and the heat-resistant lower shell are tightened and fixed by fixing bolts (17) passing through both sides of the second mounting groove (151). The heating copper busbar (16) is horizontally inserted into the heat-resistant upper shell and the heat-resistant lower shell and is in thermal contact with the heating plate (13).

3. The lead-bismuth high-temperature heat transfer device with roughness elements arranged in a rectangular channel according to claim 2, characterized in that, Insertion slots are provided on the left and right side walls at both ends of the length direction of the heat-resistant upper shell and the heat-resistant lower shell. The heating copper busbar (16) is inserted into the heat-resistant shell (15) from the insertion slots on both sides, and the internal end is recessed with a step. The heating copper busbar (16) and the insertion slot are tightly fitted. The steps of the heating copper busbar (16) on the left and right sides are opened in opposite directions. The third mounting slot (161) is recessed on the stepped surface of the internal end of the heating copper busbar (16). The length of the heat insulation plate (14) matches the spacing between the two heating copper busbars (16) on the same side. The heating plates (13) on the upper and lower sides are respectively embedded in the third mounting slot (161) of the left and right heating copper busbars (16). The heating copper busbar (16) is provided with a through hole for the fixing bolt (17) to pass through.

4. The lead-bismuth high-temperature heat transfer device with roughness elements arranged in a rectangular channel according to claim 3, characterized in that, The roughness element includes a plurality of roughness columns (111), which are cylindrical and arranged in a rectangular array on the inner walls of the upper plate and the lower plate of the flow channel.

5. The lead-bismuth high-temperature heat transfer device with roughness elements arranged in a rectangular channel according to claim 3, characterized in that, The roughness element includes a plurality of roughness grooves (112), which are V-shaped grooves arranged in a rectangular array on the inner walls of the upper plate and the lower plate of the flow channel.

6. The lead-bismuth high-temperature heat transfer device with roughness elements arranged in a rectangular channel according to claim 3, characterized in that, The roughness element includes a number of roughness blocks (113), which are semi-elliptical in shape and arranged in a plum blossom pattern on the inner walls of the upper plate and the lower plate of the flow channel.

7. A lead-bismuth high-temperature heat transfer device with roughness elements arranged in a rectangular channel according to any one of claims 4-6, characterized in that, Both ends of the flow channel plate (11) extend out of the heat-resistant shell (15) and are fixedly installed in the flow channels of the feeding assembly (2) and the discharging assembly (3), respectively.

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