Resin composition, adhesive, sealing material, cured product, semiconductor device and electronic component
By using a resin composition containing carbon-carbon double bond polymerizable compounds, polythiol compounds, and polymerization initiators, leakage is suppressed, improving the reliability of semiconductor modules and the adhesion strength of cured products, making it suitable for fixing and protecting optical sensor modules.
CN122180728APending Publication Date: 2026-06-09NAMICS CORPORATION
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Patent Information
- Application Number
- CN202480071291.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-15
- Filing Date
- 2024-11-27
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
During the assembly of semiconductor modules, overflow can reduce the reliability of the semiconductor modules, especially in miniaturized or highly integrated electronic components, where the risk of overflow contact with wiring is increased.
Method used
A resin composition comprising a polymerizable compound with carbon-carbon double bonds, a polythiol compound, a polymerization initiator, and a modified polydimethylsiloxane is used to cure the resin through free radical polymerization or anionic polymerization to suppress seepage.
Benefits of technology
It effectively suppresses leakage and improves the reliability of semiconductor modules, especially in optical sensor modules, enhancing the adhesion strength and stability of the cured material.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention addresses the problem of providing a resin composition and an adhesive which are at least thermosetting and which are capable of suppressing an overflow phenomenon. Provided is a resin composition comprising (A) a polymerizable compound having a carbon-carbon double bond, (B) a polythiol compound, (C) a polymerization initiator, and (D) a modified polydimethylsiloxane satisfying at least one of the following characteristics (a) and (b): (a) an organic substituent group containing a COOH group or OH group is directly bonded to the polydimethylsiloxane; or is bonded with polydimethylsiloxane through a linking group; (b) In a 1H NMR spectrum measured in deuterated chloroform, there is a signal in the range of 0.3-0.3 ppm and 4.4-3.2 ppm, and there is a signal that disappears due to the addition of D2O in the range of 13-0 ppm.
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