A gilding printing composite process for filling hollow outer copper-coated paper

Abstract

This invention relates to the field of composite packaging materials and surface decoration processing, and discloses a hot stamping and printing composite process for a hollow board filled with coated paper, comprising the following steps: S1, local filling reinforcement; S2, surface microstructure forming; S3, surface activation pretreatment; S4, setting a layered adhesive structure; S5, lamination; S6, curing and leveling; S7, hot stamping printing. This invention achieves a sequential division of labor between positioning during lamination and buffering during hot stamping by utilizing the softening point difference and temperature window of the layered adhesive. It balances positioning accuracy during lamination and stress buffering during hot stamping within the same adhesive system. The co-positioning of local filling and surface microstructure further improves pressure uniformity and displacement limitation. These three elements construct a synergistic protection system of rigid support, physical interlocking, and thermal stress buffering, enabling the composite structure to simultaneously possess interfacial bonding strength, pressure uniformity, and positional stability.

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