High-efficiency chip liquid cooling heat dissipation device

Abstract

The application provides a high-efficiency chip liquid cooling heat dissipation device, and relates to the field of heat dissipation devices.The device comprises a heat dissipation substrate, a liquid inlet and a liquid outlet which are in communication with external pipelines, and further comprises a liquid distribution system arranged downstream of the liquid inlet, a vortex heat dissipation module arranged downstream of the liquid distribution system, a liquid collecting system arranged between the vortex heat dissipation module and the liquid outlet, and a buffer plate arranged in the liquid collecting cavity.The liquid distribution system comprises a distribution cavity and a flow guide plate, and the vortex heat dissipation module comprises a main heat dissipation flow channel, a vortex generator and a flow channel division structure.The flow channel division structure divides the main heat dissipation flow channel into multiple parallel sub-flow channels, and the vortex generator is arranged in the parallel sub-flow channels.The vortex generator comprises helically arranged vortex blades.The buffer plate is arranged in the liquid collecting cavity, and the flow guide plate is arranged in the distribution cavity.The application realizes the unity of high-efficiency heat dissipation, uniform temperature control, stable operation and convenient maintenance in a limited space through fluid dynamics design and modular layout, and is suitable for the heat dissipation requirements of high-power density electronic equipment.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation devices, and more particularly to a high-efficiency liquid cooling heat dissipation device for chips. Background Technology

[0002] Liquid cooling technology is a key solution to the thermal management problems of high-power-density electronic devices, and its heat dissipation efficiency directly determines the chip's operational stability and lifespan. In fields such as data centers, high-performance computing, and high-end graphics processing, liquid cooling devices need to possess continuous and efficient heat exchange capabilities and precise fluid control. Due to the continuously increasing heat flux density and uneven temperature distribution of chips, the cooling system must achieve uniform heat dissipation and dynamic fluid balance.

[0003] Traditional liquid cooling devices for chips often suffer from uneven flow field distribution and limited heat dissipation efficiency. Their flow channel design typically employs a parallel straight-channel structure, where the liquid flows smoothly in a laminar state, lacking effective turbulent disturbance. This results in a thick boundary layer, making it difficult to further improve heat exchange efficiency. Simultaneously, the liquid distribution system exhibits poor flow uniformity across multiple channels, easily creating localized hot spots. Furthermore, traditional cooling devices are inadequate in fluid resistance control and contaminant deposition prevention, and maintenance often requires disassembly of major components, making operation inconvenient. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a high-efficiency liquid cooling heat dissipation device for chips, addressing the aforementioned deficiencies in the prior art.

[0005] The present invention adopts the following technical solution: A high-efficiency liquid cooling device for chips includes a heat dissipation substrate, an inlet and an outlet connected to an external pipeline, and further includes: A liquid distribution system, located downstream of the liquid inlet, includes a distribution chamber and a guide plate; A vortex cooling module is located downstream of the liquid distribution system and includes a main cooling channel, a vortex generator, and a channel partitioning structure. The channel partitioning structure divides the main cooling channel into multiple parallel sub-channels. The vortex generator is located within the parallel sub-channels and includes spirally arranged vortex blades. A liquid collection system is provided between the vortex heat dissipation module and the liquid outlet, including a liquid collection chamber and a buffer plate; The guide plate is located inside the distribution cavity, and the buffer plate is located inside the collection cavity.

[0006] Preferably, the vortex generator further includes a support shaft, the vortex blades extend continuously around the support shaft at a preset helical angle, the two ends of the support shaft are respectively fixed to the inlet end wall and the outlet end wall of the parallel sub-channel, and the outer edge of the vortex blades is set with a gap from the inner wall of the parallel sub-channel.

[0007] Preferably, the flow channel partitioning structure includes multiple parallel flow channel baffles. The flow channel baffles extend longitudinally along the main heat dissipation flow channel and divide the main heat dissipation flow channel into multiple parallel sub-flow channels. The inlet end of the flow channel baffle is provided with a guide arc surface facing the direction of liquid flow. The guide arc surface is smoothly connected to the inlet section wall of the main heat dissipation flow channel.

[0008] Preferably, the vortex blades in adjacent parallel sub-channels have opposite helical directions, and the two side walls of the channel baffle are provided with grooves extending along the length direction. The depth of the grooves decreases in a stepped or linear manner from the inlet end to the outlet end of the channel baffle, and the root of the vortex blades extends into the grooves.

[0009] Preferably, the liquid distribution system further includes a plurality of distribution holes, the distribution holes being disposed at the bottom of the distribution cavity, and the guide plate being disposed within the distribution cavity and located between the liquid inlet and the distribution holes.

[0010] Preferably, the liquid collection system further includes a collection hole, which is disposed at the top of the liquid collection chamber, and the buffer plate is disposed in the liquid collection chamber and located between the collection hole and the liquid outlet.

[0011] Preferably, the heat dissipation substrate includes a substrate body, a bump array, and a support pillar. The bump array is disposed on the bottom surface of the substrate body, and the support pillar is disposed within the main heat dissipation channel.

[0012] Preferably, the inlet and outlet are provided with quick connectors. The quick connector includes a connector body, a sealing ring and a locking ring. The sealing ring is disposed at the interface of the connector body, and the locking ring is sleeved on the outer periphery of the connector body.

[0013] Preferably, the heat dissipation substrate is further provided with a fixing bracket, which includes a bracket body, a buckle and a fastener. The buckle is disposed on the edge of the bracket body, and the fastener passes through the bracket body and is connected to the heat dissipation substrate.

[0014] Preferably, a filter is provided at the inlet of the main heat dissipation channel. The filter includes a filter screen, a support frame, and a pull ring. The filter screen is fixed inside the support frame, and the pull ring is disposed in the support frame.

[0015] The present invention adopts the above technical solution and has the following technical effects compared with the prior art: 1. High-efficiency heat dissipation: The eddy current generator produces rotating flow, which disrupts the thermal boundary layer and significantly improves heat exchange efficiency.

[0016] 2. Uniform distribution: The liquid distribution system ensures uniform flow in each channel and avoids local overheating.

[0017] 3. Stable structure: Support columns and convex point arrays enhance structural strength and ensure long-term operational reliability.

[0018] 4. Easy maintenance: Quick connectors and removable filters simplify the installation and cleaning process.

[0019] 5. Stable operation: The liquid collection system effectively eliminates air bubbles and pressure fluctuations, ensuring stable system operation. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the heat dissipation substrate and fixing bracket of a high-efficiency chip liquid cooling heat dissipation device according to the present invention; Figure 2 This is a schematic diagram showing the positional relationship between the heat dissipation substrate, the liquid distribution system, and the liquid collection system of a high-efficiency chip liquid cooling heat dissipation device according to the present invention; Figure 3 This is a schematic diagram of the heat dissipation substrate and eddy current heat dissipation module of a high-efficiency chip liquid cooling heat dissipation device according to the present invention; Figure 4 This is a schematic diagram of the filter and eddy current heat dissipation module of a high-efficiency chip liquid cooling heat dissipation device according to the present invention; Figure 5 This is a schematic diagram of the main heat dissipation channel of a high-efficiency chip liquid cooling heat dissipation device according to the present invention; Figure 6 This is a schematic diagram of the eddy current heat dissipation module of a high-efficiency chip liquid cooling heat dissipation device according to the present invention; Figure 7 This is a schematic diagram of the heat dissipation substrate and quick connector of a high-efficiency chip liquid cooling heat dissipation device according to the present invention; Figure 8 This is a schematic diagram of the bottom of the heat dissipation substrate of the high-efficiency chip liquid cooling heat dissipation device of the present invention; Figure 9 This is a schematic diagram of an eddy current generator for a high-efficiency chip liquid cooling heat dissipation device according to the present invention.

[0021] The reference numerals in the attached figures are as follows: 1. Heat dissipation substrate; 101. Substrate body; 102. Bump array; 103. Support column; 2. Liquid inlet; 3. Liquid outlet; 4. Vortex heat dissipation module; 401. Main heat dissipation channel; 402. Vortex generator; 403. Channel partitioning structure; 404. Parallel sub-channels; 405. Vortex blades; 406. Support shaft; 407. Channel baffle; 408. Guide arc surface; 409. Groove; 5. Liquid 501. Distribution system; 502. Distribution cavity; 503. Flow guide plate; 6. Liquid collection system; 601. Liquid collection cavity; 602. Collection hole; 603. Buffer plate; 7. Quick connector; 701. Connector body; 702. Sealing ring; 703. Locking ring; 8. Fixed bracket; 801. Bracket body; 802. Buckle; 803. Fastener; 9. Filter; 901. Filter screen; 902. Bracket frame; 903. Pull ring. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0023] Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Example 1

[0025] As attached Figures 1 to 9 The diagram illustrates a high-efficiency liquid cooling device for chips. A heat dissipation substrate 1 is connected to an external structure via a substrate body 101. A bump array 102 is disposed on the bottom surface of the substrate body 101 and contacts the chip surface. When the chip generates heat, the heat is conducted to the substrate body 101 through the bump array 102. The substrate body 101 then evenly distributes the heat. Support pillars 103 extend from the substrate body 101 into the main heat dissipation channel 401. When pressure fluctuations occur due to fluid flow, the support pillars 103 provide rigid support to prevent channel deformation. The bump array 102 allows for slight displacement during thermal expansion, avoiding stress concentration. The distribution of the support pillars 103 is parallel to the fluid direction within the channel, ensuring the heat dissipation substrate 1 maintains structural integrity at high temperatures.

[0026] The inlet 2 is connected to the external pipeline and is located at the beginning of the device. The outlet 3 is located at the end of the device and is connected to the liquid collection system 6. When the coolant flows in from the inlet 2, the change in flow rate directly affects the fluid distribution of the downstream distribution system. When the fluid is discharged, the change in back pressure at the outlet 3 may affect the collection efficiency. The axes of the inlet 2 and the outlet 3 are aligned with the direction of the main heat dissipation channel 401 to ensure smooth fluid flow and reduce energy loss.

[0027] The vortex cooling module 4 contains coolant through the main cooling channel 401. The channel dividing structure 403 divides the main cooling channel 401 into multiple parallel sub-channels 404. When fluid enters, the guide arc surface 408 of the channel baffle 407 guides the liquid flow to smoothly change direction, reducing impact loss. The vortex generator 402 is installed in the parallel sub-channels 404. The vortex blades 405 extend spirally around the support shaft 406. When the fluid flows through, the vortex blades 405 force the liquid to rotate. The two ends of the support shaft 406 are fixed to the wall of the parallel sub-channels 404 to resist hydrodynamics. The grooves 409 on the channel baffle 407 have a gradually changing depth. The roots of the vortex blades 405 are embedded in the grooves 409. Under the impact of the fluid, the roots of the blades move slightly in the grooves 409 to prevent jamming. The vortex blades 405 in adjacent sub-channels have opposite spiral directions, generating staggered vortices to enhance fluid mixing and heat exchange.

[0028] Specifically, the groove 409 on the flow channel baffle 407 has a gradually changing depth, providing a space for the root of the vortex blade 405, with a small gap between them. When subjected to fluid impact, this gap allows the blade root to generate a small adaptive displacement within the groove 409 to absorb vibration and thermal expansion, avoiding stress concentration or jamming caused by rigid fixation.

[0029] The liquid distribution system 5 receives the flow from the inlet 2 through the distribution cavity 501. The guide plate 503 is disposed in the distribution cavity 501 and guides the fluid to the surrounding area. The distribution holes 502 are distributed at the bottom of the distribution cavity 501. When the fluid pressure changes, the inclined surface of the guide plate 503 causes the liquid flow to diffuse radially. The distribution holes 502 automatically adjust the flow rate to ensure that each parallel sub-channel 404 is uniformly distributed. The guide plate 503 maintains a gap with the inner wall of the distribution cavity 501 to form an annular flow channel. Some of the fluid enters the edge area through the annular flow channel to optimize the distribution effect. Preferably, the guide plate 503 is disposed in the distribution cavity 501 to guide the fluid from the inlet 2 to the surrounding side walls of the distribution cavity 501.

[0030] The liquid collection system 6 receives liquid flowing out of the parallel sub-channel 404 through the collection holes 602. The collection holes 602 at the top of the liquid collection chamber 601 are evenly distributed. The buffer plate 603 is set inside the liquid collection chamber 601 and above the collection holes 602. When the fluid rises vertically through the collection holes 602, the arc-shaped surface of the buffer plate 603 guides the liquid flow to the wall of the liquid collection chamber 601. The fluid descends along the wall, avoiding direct impact on the outlet 3. The buffer plate 603 and the side wall of the liquid collection chamber 601 form an annular channel. Some of the fluid is smoothly collected through the channel, reducing bubbles and pressure pulsations.

[0031] The quick connector 7 is connected to the inlet 2 and outlet 3 via the connector body 701. The sealing ring 702 is embedded in the interface groove of the connector body 701, and the locking ring 703 is fitted on the outside of the connector body 701. When the locking ring 703 rotates, the inner conical surface of the locking ring 703 engages with the outer conical surface of the connector body 701, generating axial pressure, compressing the sealing ring 702 and forming a sealing interface. When an external pipeline is inserted, the sealing ring 702 expands to fill the gap and prevent leakage. When disassembling, the locking ring 703 is rotated in the opposite direction to release the pressure, and the sealing ring 702 returns to its original shape, facilitating quick separation.

[0032] The fixed bracket 8 covers the heat dissipation substrate 1 through the bracket body 801. The buckle 802 is set on the edge of the bracket body 801 and extends downward. The fastener 803 connects the bracket body 801 and the heat dissipation substrate 1. Specifically, the fastener 803 passes through the bracket body 801 and connects to the heat dissipation substrate 1. When installed, the elastic claw of the buckle 802 engages with the edge of the heat dissipation substrate 1 to provide initial fixation. Then, the fastener 803 is tightened to press the bracket body 801 and the substrate to ensure a stable connection. During thermal cycling, the buckle 802 is allowed to deform slightly to avoid excessive stress. When disassembling, the fastener 803 is loosened first, and then the buckle 802 is pulled to release it.

[0033] The filter 9 is embedded in the inlet of the main heat dissipation channel 401 through the bracket frame 902. The filter screen 901 is fixed inside the bracket frame 902, and the pull ring 903 is hinged to the bracket frame 902. When the fluid flows through, the filter screen 901 intercepts impurities. The sealing structure of the bracket frame 902 fits against the channel wall to prevent the fluid from bypassing without being filtered by the filter screen 901. When impurities accumulate, the pressure drop of the filter screen 901 increases. The filter 9 can be removed for cleaning by pulling the pull ring 903. When it is reinserted, the sealing structure automatically resets to ensure filtration efficiency.

[0034] Example 2

[0035] Based on Embodiment 1, the solution in Embodiment 1 will be further described in detail below with reference to the specific working method, such as... Figures 1 to 9 As shown below, see details: Furthermore, the support shaft 406 is arranged along the central axis of the parallel sub-channel 404, and the vortex blades 405 extend outward from the surface of the support shaft 406 in a spiral form. The spiral direction of the vortex blades 405 is set to guide the liquid to generate a rotating flow. When the liquid flows through the parallel sub-channel 404, the vortex blades 405 force the liquid to form a vortex motion, thereby enhancing the heat exchange effect. The two ends of the support shaft 406 are connected to the inlet end wall and the outlet end wall of the parallel sub-channel 404 through a fixed structure to provide rigid support. The gap between the outer edge of the vortex blades 405 and the inner wall of the parallel sub-channel 404 allows the liquid to pass through smoothly, reducing flow resistance. The support shaft 406 bears the heat transmitted by the vortex blades 405 during the liquid flow process. The fluid dynamics ensure stable operation of the vortex generator 402. The spiral extension of the vortex blades 405 ensures thorough mixing of the liquid within the flow channel, preventing hot spots from forming. The support shaft 406 is fixed by means of threaded connection or welding to ensure secure installation. The gap between the wall of the parallel sub-flow channel 404 and the vortex blades 405 is designed to minimize flow energy loss while maintaining efficient vortex generation. When the liquid impacts the vortex blades 405, the blades transform linear flow into rotational flow, increasing the contact frequency and area between the liquid and the flow channel wall, thus improving heat dissipation performance. The support shaft 406, as the core support element, resists vibration and bending caused by the fluid, ensuring that the vortex blades 405 maintain positional and shape stability during long-term operation.

[0036] Furthermore, the flow channel baffles 407 are arranged at equal intervals within the main heat dissipation flow channel 401 to form multiple parallel sub-flow channels 404. A guide arc surface 408 is disposed at the inlet end of the flow channel baffles 407. When liquid flows in from the inlet of the main heat dissipation flow channel 401, the guide arc surface 408 evenly distributes the liquid flow into each parallel sub-flow channel 404. The extension direction of the flow channel baffles 407 is parallel to the axis of the main heat dissipation flow channel 401. The curved shape of the guide arc surface 408 forms a continuous transition surface with the inlet section wall of the main heat dissipation flow channel 401. When the liquid flow impacts the guide arc surface 408, the flow direction changes smoothly. To effectively reduce flow resistance loss, the cross-sectional area of ​​each parallel sub-channel 404 is kept consistent to ensure uniform flow distribution. The thickness of the flow channel baffle 407 is kept consistent along the flow direction. The end of the flow channel baffle 407 is flush with the outlet section of the main heat dissipation flow channel 401. The curvature of the guide arc surface 408 is optimized according to the incoming flow direction, so that the liquid flow can smoothly turn into the parallel sub-channel 404 and avoid flow separation. When multiple flow channel baffles 407 work at the same time, they form a stable flow channel separation system to ensure that the heat dissipation fluid is evenly distributed in the parallel sub-channel 404 and improve the overall heat dissipation performance.

[0037] Furthermore, the vortex blades 405 in adjacent parallel sub-channels 404 are configured with opposite spiral directions, causing the liquid to form vortices with opposite rotation directions in adjacent channels, enhancing fluid mixing and heat exchange efficiency. The grooves 409 on both sides of the channel baffle 407 extend along the length of the channel baffle 407. The depth of the grooves 409 decreases in a stepped or linear manner from the inlet end to the outlet end of the channel baffle 407, forming a wedge-shaped space. The roots of the vortex blades 405 are inserted into the grooves 409 and maintain contact with the walls of the grooves 409. When the liquid flows through the parallel sub-channels 404, the roots of the vortex blades 405 are supported in the grooves 409, preventing the vortex blades 405 from vibrating due to fluid impact. The depth variation of the groove 409, whether moving or displaced, guides the liquid to transition smoothly near the flow channel baffle 407, reducing flow separation and pressure loss. Conversely, when the spiral-shaped vortex blades 405 work in adjacent parallel sub-flow channels 404, they generate mutually interfering vortex fields, promoting energy exchange within the liquid and improving overall heat dissipation uniformity. The cooperation between the root of the vortex blades 405 and the groove 409 ensures that the vortex generator 402 maintains structural stability in the high-speed flow field, while allowing for minor deformations caused by thermal expansion. The groove 409 structure of the flow channel baffle 407 also forms a guiding path with the root of the vortex blades 405, enabling the liquid to form auxiliary flow in the flow channel baffle 407 region, further optimizing heat dissipation performance.

[0038] Furthermore, a guide plate 503 is disposed inside the distribution cavity 501 and located directly below the inlet 2. The guide plate 503 has an inclined guiding surface. When the coolant enters the distribution cavity 501 from the inlet 2, the guide plate 503 guides the liquid flow to the surrounding edge area of ​​the distribution cavity 501. Multiple distribution holes 502 are evenly distributed at the bottom of the distribution cavity 501 in an array arrangement. The inclined angle of the guide plate 503 allows the liquid flow to be evenly diffused throughout the cross-section of the distribution cavity 501. When the liquid flow impacts the guide plate 503, the flow direction changes from vertically downward to radial diffusion, effectively reducing the fluid kinetic energy. The aperture and spacing of the distribution holes 502 are optimized to ensure that each parallel sub-channel 404 obtains a uniform flow distribution. The guide plate 503 is fixedly connected to the inner wall of the distribution cavity 501 through a support structure. The outer edge of the guide plate 503 and the inner wall of the distribution cavity 501 maintain a gap to form an annular flow channel. Part of the liquid flow enters the edge area of ​​the distribution cavity 501 through the annular flow channel. A chamfered structure is provided at the inlet of the distribution hole 502 to reduce flow resistance. The curved shape of the guide plate 503 is designed according to the principle of fluid dynamics to make the liquid flow smoothly transition to the distribution hole 502 and avoid the generation of eddies and dead zones. When the system is working, the guide plate 503 first buffers and diffuses the high-speed liquid flow from the inlet 2, and then distributes the liquid flow evenly to the downstream parallel sub-channels 404 through multiple distribution holes 502 to achieve a balanced distribution of flow.

[0039] Furthermore, a buffer plate 603 is disposed inside the liquid collection cavity 601 and above the collection holes 602. The buffer plate 603 has an arc-shaped guiding surface. When the cooled liquid enters the liquid collection cavity 601 through the collection holes 602, the buffer plate 603 guides the liquid flow to the surrounding walls of the liquid collection cavity 601. Multiple collection holes 602 are evenly distributed on the top of the liquid collection cavity 601, forming a grid-like arrangement. The arc-shaped surface of the buffer plate 603 allows the liquid flow to diffuse evenly along the curved surface. When the liquid flow impacts the buffer plate 603, the flow direction changes from vertically upward to radial diffusion, effectively reducing the fluid velocity and eliminating eddies. The distribution density of the collection holes 602 is determined based on flow field analysis to ensure that each parallel sub-channel 40 The return liquid from 4 is evenly collected. The buffer plate 603 is fixed to the top of the liquid collection chamber 601 by the connector. The edge of the buffer plate 603 and the side wall of the liquid collection chamber 601 are kept at an appropriate distance to form an annular channel. Part of the liquid flow enters the lower area of ​​the liquid collection chamber 601 through the annular channel. The lower surface of the buffer plate 603 is provided with flow guide ribs to enhance the structural rigidity and guide the flow field distribution. When the system is working, the liquid flowing out from each parallel sub-channel 404 enters the liquid collection chamber 601 through the collection hole 602. It first impacts the buffer plate 603 to dissipate kinetic energy and homogenize the flow field. Then it flows downward along the wall of the liquid collection chamber 601 and finally smoothly collects at the outlet 3 for discharge, avoiding bubble accumulation and flow oscillation.

[0040] Furthermore, the substrate body 101 is made of a high thermal conductivity material. A bump array 102 is uniformly distributed on the bottom surface of the substrate body 101, forming a densely arranged protruding structure. Support pillars 103 are disposed within the main heat dissipation channel 401 and are vertically connected to the bottom surface of the substrate body 101. When the heat dissipation substrate 1 is mounted above the chip, the bump array 102 directly contacts the chip surface, increasing the heat dissipation contact area. The support pillars 103 form a support structure between the substrate body 101 and the bottom of the main heat dissipation channel 401, enhancing the overall rigidity of the heat dissipation substrate 1. The height and spacing of the bump array 102 are optimized to ensure a stable heat conduction path with the chip surface. The distribution density of the support pillars 103 is [not specified in the original text]. Based on the pressure distribution within the flow channel, sufficient support is provided while minimizing obstruction to the coolant flow. When the chip is operating, the heat generated is conducted to the substrate body 101 through the bump array 102. The substrate body 101 then transfers the heat to the coolant within the flow channel. While bearing the pressure of the substrate body 101, the support pillar 103 also participates in the heat dissipation process, increasing the additional heat exchange area. The top of the bump array 102 adopts a planar design to ensure full contact with the chip surface. The cross-sectional shape of the support pillar 103 is optimized according to fluid dynamics to reduce flow resistance. The entire heat dissipation substrate 1 achieves efficient heat transfer and structural stability through the coordinated work of the bump array 102 and the support pillar 103.

[0041] Furthermore, the connector body 701 is fixed to the inlet 2 and outlet 3 of the heat dissipation device by threaded connection. The sealing ring 702 is embedded in the annular groove of the connector body 701 to form a sealing structure. The locking ring 703 is threadedly fitted onto the outer conical surface of the connector body 701. When connecting to an external pipeline, the locking ring 703 moves axially along the connector body 701, compressing the sealing ring 702 and causing radial deformation. The inner conical surface of the locking ring 703 and the outer conical surface of the connector body 701 form a mating relationship. During tightening, a radial clamping force is generated. Under the action of the clamping force, the sealing ring 702 undergoes elastic deformation to fill the gap between the connector body 701 and the external pipeline. The gap between the locking ring 703 and the locking ring 703 is provided with an anti-loosening structure to prevent the joint from loosening under vibration. The internal flow channel of the joint body 701 adopts a gradually narrowing and expanding design to reduce flow loss. When disassembly is required, the locking ring 703 can be rotated in the opposite direction to release the pressure on the sealing ring 702 and achieve quick separation. The cross-sectional shape of the sealing ring 702 is designed with a special geometry according to the sealing requirements to enhance the sealing effect. The outer surface of the locking ring 703 is machined with anti-slip texture to facilitate manual operation. The entire quick connector 7 controls the compression of the sealing ring 702 by the axial movement of the locking ring 703, so as to achieve reliable sealing connection and quick disassembly and assembly.

[0042] Furthermore, the bracket body 801 is made of a rigid material and covers the heat dissipation substrate 1. Buckles 802 are distributed along the edge of the bracket body 801 and extend downwards to form elastic claws. Fasteners 803 penetrate the bracket body 801 and engage with threaded holes on the heat dissipation substrate 1. When installing and fixing the bracket 8, first align the buckles 802 with the snap-fit ​​positions on the edge of the heat dissipation substrate 1 and press them down, so that the elastic claws of the buckles 802 form a snap-fit ​​connection with the side of the heat dissipation substrate 1. Then, tighten the fasteners 803 to press and fix the bracket body 801 and the heat dissipation substrate 1 tightly. The fastening part is designed with a beveled structure to facilitate guidance and positioning during installation. The fastener 803 uses a threaded connection to generate pre-tightening force to ensure that the bracket body 801 and the heat sink 1 are tightly fitted. When the buckle 802 is fastened to the heat sink 1, the elastic claw deforms to generate continuous pressure. The middle part of the bracket body 801 is provided with reinforcing ribs to improve structural rigidity. Under vibration, the buckle 802 and the fastener 803 form a double fixation to ensure the stable installation of the heat sink 1. When disassembling, first loosen the fastener 803 and then turn the release part of the buckle 802 to release the fixation.

[0043] Furthermore, the support frame 902 is embedded in the mounting groove at the inlet of the main heat dissipation channel 401 to form a detachable connection. The filter screen 901 is fixed in the internal cavity of the support frame 902 by a clamping structure. The pull ring 903 is hinged to the top edge of the support frame 902. When it is necessary to clean or replace the filter 9, the entire filter 9 can be removed from the main heat dissipation channel 401 by pulling the pull ring 903. The filter screen 901 adopts a multi-layer mesh structure, which can effectively intercept particulate impurities in the liquid. The edge of the support frame 902 is provided with a sealing structure to prevent liquid from bypassing and directly entering the main heat dissipation channel 401 without being filtered by the filter screen 901. When the liquid flows through the filter 9, the filter screen 901 filters the fluid, and impurities are blocked. On the surface of filter screen 901, cleaning liquid enters the main heat dissipation channel 401 through filter screen 901. The guiding structure of the support frame 902 and the matching structure of the inlet of the main heat dissipation channel 401 ensure accurate positioning of filter 9. When not in use, pull ring 903 can be attached to the surface of support frame 902 to avoid affecting fluid flow. The installation direction of filter 9 is perpendicular to the liquid flow direction to ensure maximum filtration area. That is, the plane of filter screen 901 of filter 9 is perpendicular to the liquid flow direction, ensuring that the fluid can pass through the filter screen directly to achieve the maximum effective filtration area. When impurities accumulate on the surface of filter screen 901, filter 9 can be removed for cleaning and maintenance by pulling pull ring 903, and then reinstalled for continued use.

[0044] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change. Secondly, the accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this invention can be combined with each other. Finally, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-efficiency liquid cooling heat dissipation device for chips, comprising a heat dissipation substrate (1), a liquid inlet (2) connected to an external pipeline, and a liquid outlet (3), characterized in that, Also includes: A liquid distribution system (5) is located downstream of the liquid inlet (2) and includes a distribution chamber (501) and a guide plate (503). The vortex heat dissipation module (4) is located downstream of the liquid distribution system (5) and includes a main heat dissipation channel (401), a vortex generator (402) and a channel partitioning structure (403). The channel partitioning structure (403) divides the main heat dissipation channel (401) into multiple parallel sub-channels (404). The vortex generator (402) is located in the parallel sub-channels (404) and includes spirally arranged vortex blades (405). The liquid collection system (6) is located between the vortex heat dissipation module (4) and the liquid outlet (3), and includes a liquid collection chamber (601) and a buffer plate (603). The guide plate (503) is located in the distribution cavity (501), and the buffer plate (603) is located in the collection cavity (601).

2. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that: The vortex generator (402) also includes a support shaft (406), and the vortex blades (405) extend continuously around the support shaft (406) at a preset helical angle. The two ends of the support shaft (406) are respectively fixed to the inlet end wall and the outlet end wall of the parallel sub-channel (404). The outer edge of the vortex blades (405) is kept at a gap with the inner wall of the parallel sub-channel (404).

3. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that: The flow channel partitioning structure (403) includes multiple parallel flow channel baffles (407). The flow channel baffles (407) extend longitudinally along the main heat dissipation flow channel (401) and divide the main heat dissipation flow channel (401) into multiple parallel sub-flow channels (404). The inlet end of the flow channel baffle (407) is provided with a flow guiding arc surface (408) facing the direction of liquid flow. The flow guiding arc surface (408) is smoothly connected to the inlet section wall of the main heat dissipation flow channel (401).

4. The high-efficiency chip liquid cooling heat dissipation device according to claim 3, characterized in that: The vortex blades (405) in the adjacent parallel sub-channels (404) have opposite helical directions. The two side walls of the channel baffle (407) are provided with grooves (409) extending along the length direction. The depth of the grooves (409) decreases in a stepped or linear manner from the inlet end to the outlet end of the channel baffle (407). The root of the vortex blades (405) extends into the grooves (409).

5. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that: The liquid distribution system (5) further includes a plurality of distribution holes (502), the distribution holes (502) being disposed at the bottom of the distribution cavity (501), and the guide plate (503) being disposed in the distribution cavity (501) and located between the liquid inlet (2) and the distribution holes (502).

6. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that: The liquid collection system (6) further includes a collection hole (602), which is located at the top of the liquid collection chamber (601). The buffer plate (603) is located in the liquid collection chamber (601) and between the collection hole (602) and the liquid outlet (3).

7. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that: The heat dissipation substrate (1) includes a substrate body (101), a bump array (102), and a support column (103). The bump array (102) is disposed on the bottom surface of the substrate body (101), and the support column (103) is disposed in the main heat dissipation channel (401).

8. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that: The inlet (2) and the outlet (3) are provided with quick connectors (7). The quick connector (7) includes a connector body (701), a sealing ring (702) and a locking ring (703). The sealing ring (702) is located at the interface of the connector body (701), and the locking ring (703) is sleeved on the outer periphery of the connector body (701).

9. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that: The heat dissipation substrate (1) is also provided with a fixing bracket (8), which includes a bracket body (801), a buckle (802) and a fastener (803). The buckle (802) is located on the edge of the bracket body (801), and the fastener (803) passes through the bracket body (801) and is connected to the heat dissipation substrate (1).

10. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that: A filter (9) is provided at the inlet of the main heat dissipation channel (401). The filter (9) includes a filter screen (901), a support frame (902), and a pull ring (903). The filter screen (901) is fixed inside the support frame (902), and the pull ring (903) is provided in the support frame (902).

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